Journal articles: 'Cu-based Intermetallics'

1

Hanim, M. A. Azmah, A. Ourdjini, I. Siti Rabiatul Aisha, and O. Saliza Azlina. "Effect of Isothermal Aging 2000 Hours on Intermetallics Formed between Ni-Pd-Au with Sn-4Ag-0.5Cu Solders." Advanced Materials Research 650 (January 2013): 194–99. http://dx.doi.org/10.4028/www.scientific.net/amr.650.194.

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The present study investigated the effect of isothermal aging up to 2000 hours on the intermetallics formed between Sn-4Ag-0.5Cu lead free solder on electroless nickel electroless palladium immersion gold surface finish (Ni-Pd-Au). For all parameters, aging have an effect of changing the intermetallic morphology to coarser and dense structure. The intermetallic compound formed for the interconnection of the lead free solder changes with increased aging time from (Cu,Ni)6Sn5 compound to (Ni,Cu)3Sn4. At the end of the 2000 hours aging time, it changes to Ni3Sn4. This is the effect of Cu element availability during the intermetallics growth process. Starting from as reflow process, (Pd, Ni)Sn4 intermetallics formed near the interface of the solder joint. The formation of the (Pd, Ni)Sn4 intermetallics act like a diffusion barrier to slow down the growth of interface intermetallics. Lastly, Au element was detected in the Pd-Sn based intermetallic after aging more than 1000 hours.

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Mayappan, Ramani, Nur Nadiah Zainal Abidin, Noor Asikin Ab Ghani, Iziana Yahya, and Norlin Shuhaime. "Intermetallic Study on the Modified Sn-3.5Ag-1.0Cu-1.0Zn Lead Free Solder." Materials Science Forum 857 (May 2016): 3–7. http://dx.doi.org/10.4028/www.scientific.net/msf.857.3.

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Due to environmental concerns, lead-free solders were introduced to replace the lead-based solders in microelectronics devices technology. Although there are many lead-free solders available, the Sn-Ag-Cu solders are considered the best replacement due to their good wettability and joint strength. Although the Sn-Ag-Cu solders are accepted widely, but there are still some room for improvement. In this study, 1wt% Zn, which can be considered high percentage for a dopant, was added into the solder via powder metallurgy route. The effects of adding this dopant into the Sn-3.5Ag-1.0Cu solder on the interface intermetallic and thickness were investigated. The intermetallics phases formed were observed under Scanning Electron Microscope (SEM) and their thicknesses were measured. The SEM results showed the presence of Cu6Sn5, Cu3Sn and (Cu,Zn)6Sn5 intermetallics. It can be concluded that Zn behaved as retarding agent and significantly retarded the growth of Cu-Sn intermetallics.

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Alba-Galvín, Juan, Leandro González-Rovira, Manuel Bethencourt, Francisco Botana, and José Sánchez-Amaya. "Influence of Aerospace Standard Surface Pretreatment on the Intermetallic Phases and CeCC of 2024-T3 Al-Cu Alloy." Metals 9, no. 3 (March 12, 2019): 320. http://dx.doi.org/10.3390/met9030320.

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A standard three-step surface pretreatment employed in the aerospace sector for Al alloys have been investigated prior to the generation of cerium conversion coatings (CeCC) on aluminium-copper alloy 2024. Two pretreatments were analysed, one without final acid etching (Pretreatment 1) and another with this step (Pretreatment 2). Both pretreatments affect the alloy intermetallic phases, playing a key role in the development of the CeCC, and also in the susceptibility to localised corrosion in NaCl medium. Scanning electron microscopy coupled with energy-dispersive X-ray analysis (SEM-EDX) revealed that after Pretreatment 2, Al(Cu,Mg) phases were partially or totally removed through dealloying with their subsequent copper enrichment. Conversely, none of these intermetallic phases were affected when the final acid step was not employed (Pretreatment 1). Meanwhile, Al-Cu-Fe-Mn-(Si) phases, the other major Al–Cu alloys intermetallics, suffers minor changes through the whole pretreatments chain. The protective efficiency of CeCC was evaluated using electrochemical techniques based on linear polarisation (LP) and electrochemical impedance spectroscopy (EIS). Samples with CeCC deposited after the Pretreatment 1 gave higher polarisation resistance and impedance module than CeCC deposited after Pretreatment 2. SEM-EDX and X-ray photoelectron spectroscopy analysis (XPS) indicate that the main factors explaining the corrosion resistance of the coatings is the existence of Al(Cu,Mg) intermetallics in the surface of the alloy, which promote the deposition of a cerium-based coating rich in Ce4+ compounds. These Al(Cu,Mg) intermetallics were kept in the 2024 alloy when acid etching was not employed (Pretreatment 1).

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Lee, Dong Suk, Taek Kyun Jung, Mok Soon Kim, and Won Yong Kim. "Effect of Cu and Mg on Forging Property and Mechanical Behavior of Powder Forged Al-Si-Fe Based Alloy." Materials Science Forum 534-536 (January 2007): 389–92. http://dx.doi.org/10.4028/www.scientific.net/msf.534-536.389.

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Two atomized alloy powders, those chemical compositions are Al-10Si-5Fe-1Zr and Al- 10Si-5Fe-4Cu-2Mg-1Zr, were pre-compacted by cold pressing with 350MPa and subsequently hot forged at temperatures ranging from 653K to 845K and at an initial strain rate of 10-2/s in order to produce bulk cylindrical type alloys with the diameter of 10 mm. The addition of Cu and Mg into the present alloy causes a decrease in the eutectic reaction temperature of Al-10Si-5Fe-1Zr alloy from 841K to 786K and results in a decrease of flow stress at the given forging temperature. TEM observation revealed that in addition to Al-Fe based intermetallics, Al2Cu and Al2CuMg intermetallics appeared to display the alloying effect additionally. The volume fraction of intermetallic dispersiods increased by the addition of Cu and Mg. Compressive strength of the present alloys was closely related to the volume fraction of intermetallic dispersoids.

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Ma, Y., T. Arnesen, J. Gj⊘nnes, and J. Taft⊘. "Laser processed Al3Ti-based intermetallics: Al5±XTi2±Y(Fe, Ni, or Cu)1±z." Journal of Materials Research 7, no. 7 (July 1992): 1722–34. http://dx.doi.org/10.1557/jmr.1992.1722.

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A new processing route for intermetallics starting from elemental metal powders and using laser beam heating has been investigated, by which three Al3Ti-based ternary intermetallic systems alloyed with Fe, Ni, or Cu, respectively, have been produced. Structures and compositions of five phases found in the three systems have been analyzed using optical metallography, transmission electron diffraction and microscopy, and thin foil energy dispersive x-ray spectrometry. The structure of three matrix phases in the three systems was identified as L12 type, which is consistent with previous work. The space group of the second phases in the two systems alloyed with Fe or Ni was reconfirmed or newly determined as Fm3m, using convergent beam electron diffraction. The lattice parameter measurements of these five found phases indicated atomic size-effect on the formation of intermetallics.

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Thirunavukarasu, Gopinath, Sukumar Kundu, Tapas Laha, Deb Roy, and Subrata Chatterjee. "Exhibition of veiled features in diffusion bonding of titanium alloy and stainless steel via copper." Metallurgical Research & Technology 115, no. 1 (November 27, 2017): 115. http://dx.doi.org/10.1051/metal/2017080.

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An investigation was carried out to know the extent of influence of bonding-time on the interface structure and mechanical properties of diffusion bonding (DB) of TiA|Cu|SS. DB of Ti6Al4V (TiA) and 304 stainless steel (SS) using pure copper (Cu) of 200-μm thickness were processed in vacuum using 4-MPa bonding-pressure at 1123 K from 15 to 120 min in steps of 15 min. Preparation of DB was not possible when bonding-time was less than 60 min as the bonding at Cu|SS interface was unsuccessful in spite of effective bonding at TiA|Cu interface; however, successful DB were produced when the bonding-time was 60 min and beyond. DB processed for 60 and 75 min (classified as shorter bonding-time interval) showed distinctive characteristics (structural, mechanical, and fractural) as compared to the DB processed for 90, 105, and 120 min (classified as longer bonding-time interval). DB processed for 60 and 75 min exhibited layer-wise Cu–Ti-based intermetallics at TiA|Cu interface, whereas Cu|SS interface was completely free from reaction products. The layer-wise structure of Cu–Ti-based intermetallics were not observed at TiA|Cu interface in the DB processed for longer bonding-time; however, the Cu|SS interface had layer-wise ternary intermetallic compounds (T1, T2, and T3) of Cu–Fe–Ti-based along with σ phase depending upon the bonding-time chosen. Diffusivity of Ti-atoms in Cu-layer (DTi in Cu-layer) was much greater than the diffusivity of Fe-atoms in Cu-layer (DFe in Cu-layer). Ti-atoms reached Cu|SS interface but Fe-atoms were unable to reach TiA|Cu interface. It was observed that DB fractured at Cu|SS interface when processed for shorter bonding-time interval, whereas the DB processed for longer bonding-time interval fractured apparently at the middle of Cu-foil region predominantly due to the existence of brittle Cu–Fe–Ti-based intermetallics.

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Mayappan, Ramani, and Zainal Arifin Ahmad. "Cu6Sn5 and Cu3Sn lntermetallics Study in the Sn-40Pb/Cu System during Long-term Aging." Scientific Research Journal 7, no. 2 (December 31, 2010): 1. http://dx.doi.org/10.24191/srj.v7i2.9416.

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Replacing Sn-Pb solder with lead-free solder is a great challenge in the electronics industry. The presented lead-free solder is Sn based and forms two intermetallic species upon reaction with the Cu substrate, namely Cu6Sn5 and Cu3Sn. The growth of Cu6Sn5 and Cu3Sn intermetallics have been investigated with respect to Sn-40Pb/Cu solder joints. The joints were aged under long-term thermal exposure using single shear lap joints and the intermetallics were observed using scanning electron microscopy. As-soldered solder joints exhibit a single Cu6Sn5 phase, however after aging a Cu3Sn layer below the Cu6Sn5 is observed to manifest. The Cu6Sn5 layer develops with a scalloped morphology, whereas the Cu in layer always develops an undulating planar shape in phase with the Cu6Sn5. The Cu6Sn5 layer begins to transform from a scalloped- to a planar-shape as aging progresses in order to minimize the interfacial energy. The intermetallic layers exhibit a linear dependence on the square root of aging time, which corresponds to diffusion-controlled growth. The activation energy for the growth of the Cu6Sn5 intermetallic layer has been determined to be 56.16 kJ/mol.

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8

Mayappan, Ramani, and Zainal Arifin Ahmad. "Cu6Sn5 and Cu3Sn Intermetallics Study in the Sn-40Pb/Cu System during Long-term Aging." Scientific Research Journal 7, no. 2 (December 31, 2010): 1. http://dx.doi.org/10.24191/srj.v7i2.5016.

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Replacing Sn-Pb solder with lead-free solder is a great challenge in the electronics industry. The presented lead-free solder is Sn based and forms two intermetallic species upon reaction with the Cu substrate, namely Cu6Sn5 and Cu3Sn. The growth of Cu6Sn5 and Cu3Sn intermetallics have been investigated with respect to Sn-40Pb/Cu solderjoints. The joints were aged under long-term thermal exposure using single shear lap joints and the intermetallics were observed using scanning electron microscopy. As-soldered solder joints exhibit a single Cu6Sn5 phase, however after aging a Cu3Sn layer below the Cu6Sn5 is observed to manifest. The Cu6Sn5 layer develops with a scalloped morphology, whereas the Cu3Sn layer always develops an undulating planar shape in phase with the Cu6Sn5. The Cu6Sn5 layer begins to transform from a scalloped- to a planar-shape as aging progresses in order to minimize the interfacial energy. The intermetallic layers exhibit a linear dependence on the square root ofaging time, which corresponds to diffusion-controlled growth. The activation energy for the growth of the Cu6Sn5, intermetallic layer has been determined to be 56.16 kJ/mol.

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9

Liu, Wen, Chi Zhang, Chunge Wang, Xiang Yan, Xiaoxiong Hu, Pingjun Xu, Xinyu Ye, Zhongzhu Zhuang, Pengfei Liu, and Shuyu Lei. "Theoretical investigations on correlations between elastic behavior of Al-based alloys and their electronic structures." International Journal of Materials Research 112, no. 8 (August 1, 2021): 636–41. http://dx.doi.org/10.1515/ijmr-2021-8235.

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Abstract In this work, using the first-principles method, the alloying stability, electronic structure, and elastic properties of Al-based intermetallics were investigated. It was found that these alloys have a strong alloying ability and structural stability due to the negative formation energies and the cohesive energies. The valence bonds of these intermetallic compounds are attributed to the valence electrons of Cu 3δ states for AlCu3, Cu 3δ and Zr 4δ states for AlCu2Zr, and Al 3s, Zr 5s and 4δ states for AlZr3, respectively. Furthermore, the correlation between elastic properties of these intermetallic compounds and their electronic structures was revealed. The results show that structural parameters and elastic properties such as bulk modulus, shear modulus, Young’s modulus, Poisson’s ratio and anisotropy agreed well with experimental results.

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Mayappan, Ramani, Amirah Salleh, Nurul Atiqah Tokiran, and N. A. Awang. "Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solder." Soldering & Surface Mount Technology 32, no. 2 (November 1, 2019): 65–72. http://dx.doi.org/10.1108/ssmt-07-2019-0025.

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Purpose The purpose of this study is to investigate the addition of 0.05 Wt.% carbon nanotube (CNT) into the Sn-1.0Ag-0.5Cu (SAC) solder on the intermetallic (IMC) growth. Lead-based solders play an important role in a variety of applications in electronic industries. Due to the toxicity of the lead in the solder, lead-free solders were proposed to replace the lead-based solders. Sn-Ag-Cu solder family is one of the lead-free solders, which are proposed and considered as a potential replacement. Unfortunately, the Sn-Ag-Cu solder faces some reliability problems because of the formation of the thick intermetallic compounds. So the retardation of intermetallic growth is prime important. Design/methodology/approach The solder joint was aged under liquid state aging with soldering time from 1 to 60 min. Findings Two types of intermetallics, which are Cu6Sn5 and Cu3Sn were observed under a scanning electron microscope. The morphology of Cu6Sn5 intermetallic transformed from scallop to planar type as the soldering time increases. The addition of carbon nanotube into the SAC solder has retarded the Cu6Sn5 intermetallic growth rate by increasing its activation energy from 97.86 to 101.45 kJ/mol. Furthermore, the activation energy for the Cu3Sn growth has increased from 102.10 to 104.23 kJ/mol. Originality/value The increase in the activation energy indicates that the growth of the intermetallics was slower. This implies that the addition of carbon nanotube increases the reliability of the solder joint and are suitable for microelectronics applications.

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Sainis, Salil, and Caterina Zanella. "A Study of the Localized Ceria Coating Deposition on Fe-Rich Intermetallics in an AlSiFe Cast Alloy." Materials 14, no. 11 (June 3, 2021): 3058. http://dx.doi.org/10.3390/ma14113058.

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Corrosion inhibiting conversion coating formation is triggered by the activity of micro-galvanic couples in the microstructure and subsequent local increase in pH at cathodic sites, which in the case of aluminium alloys are usually intermetallics. Ceria coatings are formed spontaneously upon immersion of aluminium alloys in a cerium conversion coating solution, the high pH gradient in the vicinity of intermetallics drives the local precipitation of ceria conversion compounds. Cu-rich intermetallics demonstrate a highly cathodic nature and have shown the local precipitation reaction to occur readily. Fe-rich intermetallics are, however, weaker cathodes and have shown varied extents of localized deposits and are in focus in the current work. Model cast Al-7wt.%Si alloys have been designed with 1 wt.% Fe, solidified at different cooling rates to achieve two different microstructures, with big and small intermetallics, respectively. Upon subjecting the two microstructures to the same conversion coating treatment (immersion in a 0.1 M CeCl3 solution) for a short period of 2 h, preferential heavy deposition on the boundaries of the big intermetallics and light deposition on the small intermetallics was observed. Based on these observations, a mechanism of localized coating initiation at these Fe-rich intermetallic particles (IM) is proposed.

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Kim, Yong Keun, Pyung Woo Shin, and Sun Ig Hong. "Effect of Heat Treatment on the Mechanical Properties and Interface Structure of 3-ply Ti/Cu/Ti Clad Composite." Advanced Materials Research 1102 (May 2015): 51–54. http://dx.doi.org/10.4028/www.scientific.net/amr.1102.51.

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The effect of heat treatment on the mechanical properties and interface structure of 3-ply Ti/Cu/Ti clad composite was investigated. Strength decreased and the ductility increased with increase of heat treatment temperature. The gradual increase of hardness at 700°C and 800°C indicates the growth of intermetallic compounds at the interface. No visible intermetallic compound formation was observed up to 400°C. The intermetallic layer grew very rapidly above 600°C and its thickness reached ~10μm after heat treatment at 800°C. The absence of cracks emanating from the corners of the indentation mark indicates that intermetallics in Ti/Cu/Ti clad are ductile enough to accommodate the micro-plastic flow from indentation. Four intermetallic layers at the interface were confirmed to be Cu4Ti, Cu3Ti2, CuTi and CuTi2 based on the EDS spectra, XRD and phase diagram analyses.

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13

Zhang, Jie, and Yan Ming He. "Effect of Ti Content on Microstructure and Mechanical Properties of Si₃N₄/Si₃N₄ Joints Brazed with Ag-Cu-Ti+Mo Composite Filler." Materials Science Forum 654-656 (June 2010): 2018–21. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.2018.

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Mo particles have been introduced into Ag-Cu-Ti brazing alloy for the joining of Si3N4 ceramic. Effects of Ti content on microstructure and mechanical properties of the joints were investigated. The results present that a compact reaction layer which is composed of TiN and Ti5Si3 was formed at the Si3N4/solder interface. The central part of the joint was composed of Ag based solid solution, Cu based solid solution, Mo particles and Cu-Ti intermetallics. By increasing Ti content in the composite filler, both the thickness of reaction layer and the amount of Cu-Ti intermetallics in the joint increased, which is beneficial for the joint strength. However, the reaction between Ti and Si3N4 proceeded more excessively. Simultaneously, more Cu-Ti intermetallics were precipitated while elevating Ti content to 6wt.%, leading to deterioration of the bonding strength. The maximum bending strength (429.4MPa) was obtained when Ti content is 4wt.% in the composite filler.

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Yahya, Iziana, Noor Asikin Ab Ghani, Nur Nadiah Zainal Abiddin, Hamidi Abd Hamid, and Ramani Mayappan. "Intermetallic Evolution of Sn-3.5Ag-1.0Cu-0.1Zn/Cu Interface under Thermal Aging." Advanced Materials Research 620 (December 2012): 142–46. http://dx.doi.org/10.4028/www.scientific.net/amr.620.142.

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Due to environmental concerns, lead-free solders were introduced in replacing the lead-based solders in microelectronics devices technology. Although there are many lead-free solder available, the Sn-Ag-Cu is considered the best choice. But the solder has its draw backs in terms of melting temperature and intermetallic formations. To improve the solder, a fourth element Zn was added into the solder. The new composite solders were synthesized via powder metallurgy route. This research studies the effect of 0.1wt% Zn addition on the hardness and intermetallic formation on Cu substrate. For the hardness results, the micro Vickers values were reported. For intermetallic, the solders were melted at 250°C and aged at 150°C until 400 hours. The microhardness value for Zn based composites solder shows higher micro Vickers hardness compared to un-doped counterparts. The phases formed and its growth was studied under SEM and by energy dispensive x-ray (EDX). The SEM results show the presence of Cu6Sn5and Cu3Sn intermetallics and the Cu5Zn8intermetallic was not detected. The addition of 0.1wt% Zn has retarded the growth of the Cu3Sn intermetallic but not the total intermetallic thickness.

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Moffat, Thomas P., Yihua Liu, Dincer Gokcen, Liang Yueh Ou Yang, Sun Mi Hwang, Carlos M. Hangarter, Stephen Ambrozik, Nikolay Dimitrov, and Ugo Bertocci. "(Invited) Investigations into the Role of Adsorption Processes in Alloy Deposition." ECS Meeting Abstracts MA2022-01, no. 22 (July 7, 2022): 1108. http://dx.doi.org/10.1149/ma2022-01221108mtgabs.

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The interplay between adsorption, underpotential deposition and excess bond enthalpy in the deposition of alloys and intermetallic will be discussed based on selections from recent work. Examples of limiting behavior will be presented that range from the deposition of solid-solutions, e.g. Pt-Cu and Pt-Fe group alloys, to intermetallics, e.g. Pt-Pb, to immiscible, e.g. Cu-Pb, systems. In addition, the impact of “parasitic” reactions, such as electrolyte breakdown, on the deposition of elements and alloys will be briefly discussed. The utility of a close coupling between electroanalytical, gravimetric, metallurgical and surface science measurements to reveal the underlying thermodynamic and kinetic influences on co-deposition process will be highlighted.

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Lee, Min Ku, Jung G. Lee, Jong Keuk Lee, Jin Ju Park, Young Rang Uhm, and Chang Kyu Rhee. "The Effect of Ag Diffusion Barrier on the Microstructure of a Titanium Dissimilar Joining." Solid State Phenomena 135 (February 2008): 135–38. http://dx.doi.org/10.4028/www.scientific.net/ssp.135.135.

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In this study, joining characteristics of dissimilar Ti and Cu metals have been investigated, when using both an Ag-based eutectic alloy as a filler and an Ag layer present on Ti base metal as a diffusion barrier. The observed microstructures were classified into three characteristic types, depending on the presence of a Ag layer at the Ti interface, e.g. first, the sample retaining thick continuous intermetallic layers, e.g. Ti2Cu, TiCu, Ti3Cu4, Ti2Cu3, and TiCu4 by a significant dissolution of the Ti atoms into the molten filler, in the absence of a Ag coating layer onto the Ti base metal, second, the sample with relatively thin Ti-Cu intermetallic layers by the reduced reaction of Ti with Cu due to a prominent decrease in the Ti dissolution, owing to the role of the Ag coating layer as a diffusion barrier, and finally, the sample without any brittle Ti-Cu intermetallics in the joint by a complete suppression of both the dissolution of the Ti atoms and its reaction with the Cu elements in the molten filler due to the presence of a Ag layer.

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Ab Ghani, Noor Asikin, Iziana Yahya, Mohd Arif Anuar Mohd Salleh, Shamsuddin Saidatulakmar, Zainal Arifin Ahmad, and Ramani Mayappan. "Microstructure Evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu System Lead Free Solder under Long Term Thermal Aging." Advanced Materials Research 620 (December 2012): 263–67. http://dx.doi.org/10.4028/www.scientific.net/amr.620.263.

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Due to environmental concerns, lead-free solders were introduced in replacing the lead-based solders in microelectronics devices technology. Although there are many lead-free solder available, the Sn-Ag-Cu solder was considered the best choice. But the solder has its draw backs in terms of melting temperature and intermetallic formations. In this study, the effect of 0.5wt% Ni addition on the microstructure of the Sn-3.5Ag-1.0Cu solder was investigated. The solder was synthesized via powder metallurgy route which includes blending, compacting and sintering. The solders were characterized for its densities and melting temperatures. SEM was used to observe the microstructure of intermetallic phases. The solders were melted on copper substrate at 250°C for one minute and aged at 150°C from 0 to 400 hours. The phases formed were studied under SEM. The SEM results showed the presence of Cu6Sn5, Cu3Sn, Ag3Sn and (Cu,Ni)6Sn5 intermetallics.

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Tsukamoto, Hideaki, Zhi Gang Dong, Han Huang, Tetsura Nishimura, and Kazuhiro Nogita. "Nanoindentation Characterization of Intermetallics Formed at the Lead-Free Solder/Cu Substrate Interface." Materials Science Forum 654-656 (June 2010): 2446–49. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.2446.

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The intermetallics of Cu6Sn5 that are formed at the Sn-based solder/ Cu substrate interface play a significant role in solder joint reliability. The characterization of the mechanical properties of the interface Cu6Sn5 is essential to understand the mechanical performance and structural integrity of the solder joints. In this study, the interface Cu6Sn5 and (Cu,Ni)6Sn5 formed in Sn-Cu and Sn-Cu-Ni ball grid array (BGA) joints were investigated using nanoindentation. The results demonstrated that the strain rate sensitivity and the activation volume of these intermetallics were affected by the reflow times and load conditions. The strain rate sensitivity of Cu6Sn5 and (Cu,Ni)6Sn5 were estimated from 0.023 to 0.105, and the activation volume of Cu6Sn5 and (Cu,Ni)6Sn5 were estimated from 0.128 b3 to 0.624 b3 (b=4.2062x10-9 m) for 1, 2 and 4-reflowed Sn-Cu (-Ni) samples.

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Boyarchenko, O. D., S. G. Vadchenko, N. V. Sachkova, and A. E. Sytschev. "SHS Joining Via Combustion of Ti-Containing Systems." Eurasian Chemico-Technological Journal 15, no. 2 (February 20, 2013): 95. http://dx.doi.org/10.18321/ectj145.

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The joining of intermetallic parts to the metals (Ti, Al, Cu, Ni) or different intermetallics (e.g. NiAl, TiAl) is important for high-temperature applications. Traditional fusion welding is difficult to apply due to the large thermal expansion mismatch between the intermetallics to be joined and the filler material. Brazing and diffusion bonding are also inefficient, energy-consuming, and must be carried out in vacuum or protective atmosphere. Meanwhile, Self-propagating High-temperature Synthesis (SHS) that is widely used for production of powders, compact materials and parts holds considerable promise as a method of joining various component parts. We report on a new SHS-based approach to joining TiAl and NiAl intermetallics with metal substrates Ti and Ni. The adiabatic combustion temperatures for the systems under study and stoichiometric ratios of green mixtures were determined by thermodynamic calculations. Experiments were performed in the modes of pressure-assisted thermal explosion and combustion wave propagation, with the samples placed between the punches of experimental set up. Investigated were the processes taking place in thermally treated Ti or Ni plates mechanically impregnated (by Mechanically Activation or Vibration Milling) with a mixture of metallic particles. Vibratory treatment of an Al and Ti surfaces in a powder mixture of metals was found to result in destruction of the surface oxide film and formation of extensive physical contacts between the Ni or Ti matrix and the metallic particles mechanically impregnated into the near surface layer of Ni or Ti. Subsequent thermal treatment was then used to launch chemical reaction yielding intermetallides within the impregnated layer. Performing SHS reactions yielding melted intermetallides in the coatings (or pellets) deposited (or placed) onto the surface of thus treated Ti or Ni plates, one can obtain strong weld joining between solidified SHS products and substrates. This approach can also be used for deposition of coatings with a desired composition onto substrates.

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Zhu, Yandan, Mufu Yan, and Quanli Zhang. "Microstructure Formation and Mechanical Properties of Multi-Phase Coating by Thermos Plasma Nitriding of Gradient Cu-Ti Films on C61900 Cu Alloy." Applied Sciences 11, no. 22 (November 17, 2021): 10843. http://dx.doi.org/10.3390/app112210843.

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To improve the processing efficiency and the surface properties of C61900 Cu alloy, a gradient Cu-Ti film with a Ti/Cu atom ratio of 7:1, 7:4, and 1:2 was pre-fabricated by the unbalanced magnetron sputtering process and then nitrided by thermos plasma nitriding. The phase structure, elemental composition, and morphology of the modified surface were characterized, and the mechanical properties, including the wear resistance and adhesion properties, were examined. Combining calculation by the first principle method with thermodynamic analysis, the microstructural formation and phase composition of the Cu-Ti-N system were investigated to reveal the mechanism of improved wear resistance, which indicated the possible formation of various Cu-Ti intermetallics and Ti-N compounds. The Al in the C61900 Cu substrate also participated in the generation of the AlCu2Ti compound, which is a ductile phase with good hardness and elastic modulus. Based on the results of a mechanical properties test, it was concluded that an optimized layer structure for the multi-phase coating should include Ti-N compounds as the surface layer and Cu-Ti intermetallics as the intermediate layer.

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Osório, Wislei R., Celia M. Freire, Rubens Caram, and Amauri Garcia. "The role of Cu-based intermetallics on the pitting corrosion behavior of Sn–Cu, Ti–Cu and Al–Cu alloys." Electrochimica Acta 77 (August 2012): 189–97. http://dx.doi.org/10.1016/j.electacta.2012.05.106.

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Hernandez-Sandoval, J., A. M. Samuel, S. Valtierra, and F. H. Samuel. "Ni- and Zr-Based Intermetallics in Al–Si–Cu–Mg Cast Alloys." Metallography, Microstructure, and Analysis 3, no. 5 (October 2014): 408–20. http://dx.doi.org/10.1007/s13632-014-0164-2.

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Martin, S., A. Winkelmann, and A. Leineweber. "Revisiting the phase transformations involving Cu₆Sn₅ intermetallic: resolving local domain structures induced by ordering." IOP Conference Series: Materials Science and Engineering 1249, no. 1 (July 1, 2022): 012014. http://dx.doi.org/10.1088/1757-899x/1249/1/012014.

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Abstract Cu6Sn5 is one of the most important intermetallics present in solder joints based on Cu and Sn. Due to still uncertain reasons for failure of these joints, detailed microstructural research can help to figure out the underlying mechanisms. For Cu- and as well for Sn-rich environments of the Cu6Sn5 the microstructural occurrence of the phase transformations are investigated. During the formation of stable η′ from the disordered high temperature η phase the formation of metastable modulated incommensurately ordered η′′ takes place. For the copper rich samples long-range ordering and twin-related domain formation within η′′ was observed. Although conventional Hough-based EBSD analysis was not able to identify the correct domain orientation, Kikuchi pattern matching using simulated patterns was able to resolve the correct microstructure. As ordered intermetallics tend to be brittle in nature, the current microstructure research provides a basis to investigate unresolved problems in the initiation of failure.

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Simões, Sónia, Carlos Tavares, and Aníbal Guedes. "Joining of γ-TiAl Alloy to Ni-Based Superalloy Using Ag-Cu Sputtered Coated Ti Brazing Filler Foil." Metals 8, no. 9 (September 14, 2018): 723. http://dx.doi.org/10.3390/met8090723.

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Joining γ-TiAl alloy to Ni-based superalloy Hastelloy using Ag-Cu sputtered coated Ti foil as brazing filler was investigated in this study. Brazing experiments were performed at 900, 950, and 980 °C with a dwelling stage of 10 min in vacuum. The microstructure and the chemical composition of the resulting interfaces were analyzed by scanning electron microscopy (SEM) and by energy dispersive X-ray spectroscopy (EDS), respectively. Sound joints were produced after brazing at 980 °C, presenting a multilayered interface, consisting mainly of Ti-Al and Ti-Ni-Al intermetallics close to the γ-TiAl alloy, and of Ti-rich, Ti-Ni, and Cr-Ni-Mo rich phases near Hastelloy. The hardness of the interface, ranging from around 300 to 1100 HV0.01, is higher than both base materials, but no segregation of either Ag solid solution or coarse intermetallic particles was observed. Therefore, the developed brazing filler also avoids the need to perform post-brazing heat treatments that aim to eliminate detrimental extensive segregation of either soft phases or of hard and brittle compounds.

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Pandya, Shailesh N., and Jyoti Menghani. "A preliminary investigation on microstructure and mechanical properties of dissimilar Al to Cu friction stir welds prepared using silver interlayer." Metallurgical and Materials Engineering 24, no. 1 (April 2, 2018): 45–57. http://dx.doi.org/10.30544/294.

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Due to its solid-state nature, friction stir welding (FSW) process can be considered a better alternative for dissimilar welding metals. However, like fusion welding techniques, in friction stir welding growth of thick layers of brittle intermetallics - Cu9Al4 and CuAl2 is a significant issue. One solution to this problem is the use of the suitable interlayer material. Use of interlayer material modifies the joint microstructure with the replacement of thick, brittle intermetallics by more ductile intermetallics in a thin layer or particle form. The present study is a preliminary investigation about joining of AA6082-O to pure copper joints with and without silver (Ag) wire interlayer. Friction stir welded joints were characterized regarding optical microscopy, X-Ray Diffraction (XRD) analysis, microhardness measurement, tensile testing and Scanning Electron Microscopy (SEM) based fractography. The Al-Cu weld prepared using silver interlayer was stronger than without it. The higher strength of the weld with silver interlayer is attributed to the formation of a composite type of structure with intercalation of more ductile Ag2Al intermetallics along with dispersion of Ag particles in stir zone.

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Nascimento, Maurício Silva, Givanildo Alves dos Santos, Rogério Teram, Vinícius Torres dos Santos, Márcio Rodrigues da Silva, and Antonio Augusto Couto. "Effects of Thermal Variables of Solidification on the Microstructure, Hardness, and Microhardness of Cu-Al-Ni-Fe Alloys." Materials 12, no. 8 (April 18, 2019): 1267. http://dx.doi.org/10.3390/ma12081267.

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Aluminum bronze is a complex group of copper-based alloys that may include up to 14% aluminum, but lower amounts of nickel and iron are also added, as they differently affect alloy characteristics such as strength, ductility, and corrosion resistance. The phase transformations of nickel aluminum–bronze alloys have been the subject of many studies due to the formations of intermetallics promoted by slow cooling. In the present investigation, quaternary systems of aluminum bronze alloys, specifically Cu–10wt%Al–5wt%Ni–5wt%Fe (hypoeutectoid bronze) and Cu–14wt%Al–5wt%Ni–5wi%Fe (hypereutectoid bronze), were directionally solidified upward under transient heat flow conditions. The experimental parameters measured included solidification thermal parameters such as the tip growth rate (VL) and cooling rate (TR), optical microscopy, scanning electron microscopy (SEM) analysis, hardness, and microhardness. We observed that the hardness and microhardness values vary according to the thermal parameters and solidification. We also observed that the Cu–14wt%Al–5wt%Ni–5wi%Fe alloy presented higher hardness values and a more refined structure than the Cu–10wt%Al–5wt%Ni–5wt%Fe alloy. SEM analysis proved the presence of specific intermetallics for each alloy.

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Kaiser, Samiul, and Mohammad Salim Kaiser. "IMPACT OF COLD PLASTIC DEFORMATION AND THERMAL POST-TREATMENT ON THE PHYSICAL PROPERTIES OF COPPER BASED ALLOYS Al-BRONZE AND α-BRASS." Acta Metallurgica Slovaca 27, no. 3 (September 13, 2021): 114–21. http://dx.doi.org/10.36547/ams.27.3.951.

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The copper based alloys Al-bronze and α-brass containing each of 10wt% aluminum and zinc were prepared by casting. Afterwards, the specimens were cold-rolled with various percentages of deformation and the cold-rolled samples were aged subsequently at the varied time for four hours and temperatures ranging up to 500°C. Samples underwent characterizations by microhardness testing, electrical resistivity, optical properties, differential scanning calorimetry as well as microstructure analysis using an optical microscope. The results showed that the hardening of Cu-based alloys was taken place due to solid-solution hardening. Al addition accelerated the hardness through ageing due to the formation of various intermetallic copper aluminites into the aged alloy which was hard and brittle in nature. The resistivity decreased marginally through heat treatment due to the stage of stress relieving, recovery, precipitation coarsening as well as recrystallization and increased for arranging different intermetallics into the alloys. The microstructural study revealed that the cold rolled alloys content the different phases of elongated grain at the rolling direction. Meanwhile higher ageing temperatures at 500°C for one hour led to recrystallization and grain growth especially in pure copper and Cu-10Zn alloys.

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Lee, Unhae, and Jae Wung Bae. "Microstructural Changes and Mechanical Properties of Precipitation-Strengthened Medium-Entropy Fe71.25(CoCrMnNi)23.75Cu3Al2 Maraging Alloy." Materials 16, no. 9 (May 7, 2023): 3589. http://dx.doi.org/10.3390/ma16093589.

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Metal alloys with enhanced mechanical properties are in considerable demand in various industries. Thus, this study focused on the development of nanosized precipitates in Fe71.25(CoCrMnNi)23.75Cu3Al2 maraging medium-entropy alloy (MEA). The Fe-based alloying design in the MEA samples initially formed a body-centered cubic (BCC) lath martensite structure. After a subsequent annealing process at 450 °C for varying durations (1, 3, 5, and 7 h), nanosized precipitates (B2 intermetallic) enriched with Cu and with a diameter of approximately 5 nm formed, significantly increasing the hardness of the alloy. The highest Vickers microhardness of 597 HV, along with compressive yield strength and ultimate compressive strength of 2079 MPa and 2843 MPa, respectively, was achieved for the Aged_7h sample. Therefore, the BCC lath martensite structure with B2 intermetallics leads to remarkable mechanical properties.

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Belin-Ferré, Esther, and Jean Marie Dubois. "Wetting of aluminium-based complex metallic alloys." International Journal of Materials Research 97, no. 7 (July 1, 2006): 985–95. http://dx.doi.org/10.1515/ijmr-2006-0156.

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Abstract Many complex metallic alloys are known to form in aluminium-based systems containing transition metals like Cu, Pd, Fe or Cr, the most famous one being the stable icosahedral quasicrystal discovered in the Al –Cu –Fe system. Although covered by a thin native oxide layer, adhesion of water onto the complex compounds is very different from that onto the oxide or onto oxidised aluminium. We show here how this atypical behaviour is related to the structural complexity of the compound. We then produce data that allows us to estimate the actual surface energy of the same compounds, a property that is also a fingerprint of structural complexity in Al-based intermetallics.

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Mali, Vjacheslav I., Iuliia N. Maliutina, and K. A. Skorokhod. "Microstructure and Strength of Explosively Welded Titanium/Ni-Based Alloy Composite with Cu/Ta as Interlayer." Applied Mechanics and Materials 682 (October 2014): 21–24. http://dx.doi.org/10.4028/www.scientific.net/amm.682.21.

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In current research composite copper/tantalum were used as interlayer for explosive welding of titanium and Ni-based alloy sheets. Defects such as cracks coupled with brittle intermetallics compounds were not detected at the interface of dissimilar materials by metallographic analysis. Strength test of obtained composite material reveals growth of yield strength in 2 times in comparison with Ni-based alloy.

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SINGH, R. P., R. K. SINGH, SHALU, and M. RAJAGOPALAN. "FIRST-PRINCIPLE STUDY ON STRUCTURAL, ELASTIC AND ELECTRONIC PROPERTIES OF BINARY RARE EARTH INTERMETALLIC COMPOUNDS: GdCu AND GdZn." International Journal of Computational Materials Science and Engineering 01, no. 01 (March 2012): 1250005. http://dx.doi.org/10.1142/s2047684112500054.

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First principle study on structural, elastic and electronic properties of binary copper and zinc based rare earth intermetallics have been carried out using the full-potential augmented plane waves plus local orbital (APW+ lo) within density functional theory (DFT). Results on elastic properties are obtained using generalized gradient approximation (GGA) for exchange correlation potentials. The equilibrium lattice parameter, bulk modulus and its pressure derivative have been obtained using optimization method. Young's modulus, shear modulus, Poisson ratio, sound velocities for longitudinal and shear waves, Debye average velocity, Debye temperature and Grüneisen parameters have been calculated. From electronic calculations, it has been found that electronic conduction in copper and zinc based rare earth intermetallics is mainly attributed to 3d-orbital electrons of Cu and Zn .

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Vuksanovic, D., V. Asanovic, J. Scepanovic, and D. Radonjic. "Effect of chemical composition and T6 heat treatment on the mechanical properties and fracture behaviour of Al-Si alloys for IC engine components." Journal of Mining and Metallurgy, Section B: Metallurgy 57, no. 2 (2021): 195–207. http://dx.doi.org/10.2298/jmmb190510014v.

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The microstructural examinations of Al-Si alloys intended to manufacture IC engine components revealed a complex phase composition in all the samples. The polyhedral crystals of primary silicon were detected in the Al-12.5Si alloy, besides the ?-Al phase, eutectic silicon, and several intermetallic phases, identified in the cast samples of both alloys. Better tensile properties were found for the samples of Al-11Si. A predominantly intercrystalline fracture with features of ductile failure was observed in both alloys. In as-cast specimens of the Al-11Si alloy, the cracks were formed by the decohesion mechanism between the particles of the intermetallic phase AlCuFeNi and the ?-Al phase. The microcracks initiated on the interface were spread along the branches of the ?-Al15(Fe,Mn,Cu)3Si2 particles. After T6 treatment of the Al-11Si alloy, almost half of the intermetallics quantity presented the Al3Ni phase, while the iron-based phases were observed in a small amount. Spheroidized eutectic silicon, a smaller portion of Al5Cu2Mg8Si6, and a more considerable quantity of Al3(Fe,Mn,Cu,Ni,Co) were detected for T6 specimens of the Al-12.5Si alloy. The rounded crystals of eutectic silicon contributed to the improvement of their tensile properties. Larger and deeper dimples of mostly polygonal shapes were observed in the samples of the Al-11Si alloy after T6 treatment. The microcracks occurred at the boundary of the intermetallic phase/?-Al solid solution.

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Zhu, Yandan, Zecheng Li, Hongchao Bi, Qilong Shi, Yujun Han, and Quanli Zhang. "Cross-Sectional Profile Evolution of Cu-Ti Gradient Films on C17200 Cu by Vacuum Thermal Diffusion." Materials 15, no. 22 (November 12, 2022): 8002. http://dx.doi.org/10.3390/ma15228002.

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To improve the wear resistance and fatigue life of Cu alloys, surface modification by combining the magnetron sputtering of Ti film followed by vacuum thermal diffusion is always applied, where the structure and composition of the fabricated film play a determinant role on the mechanical properties. In the present work, the evolution of the layered structure and the element distribution of the formed multi-phases coating on C17200 Cu alloy are investigated by mathematical calculation based on Fick’s law, and the experimental verification by the thermal diffusion of the gradient Cu-Ti film was undertaken under different temperatures and durations. The results show that the layered structure of the fabricated coating is dependent on the Cu-Ti atom concentration, the increasing time and the temperature, where a single or stratified layer is formed due to the generated Cu-Ti intermetallics for the inter-diffusion between the Cu and Ti atoms. The atom distribution by the proposed simulation method based on Fick’s law corresponds to the experimental results, which can be applied to designing the structure of the modification layer.

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Xu, Hongyan, Yaochun Shen, Yihua Hu, Jianqiang Li, and Ju Xu. "Fabrication of highly reliable joint based on Cu@Ni@Sn double-layer powder for high temperature application." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (July 1, 2019): 000075–84. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000075.

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Abstract A highly reliable three-dimensional network structure joint was fabricated based on Cu@Ni@Sn core-shell powder and transient liquid phase bonding (TLPB) technology for high temperature application. Cu@Ni@Sn joint is characterized by Cu metal particles embedded in the matrix of (Cu,Ni)6Sn5/Ni3Sn4 intermetallics (IMCs), low level of voiding is achieved, they can be reflowed at a low temperatures (<260°C), but reliably working at high temperature up to 415°C. Cu@Ni@Sn double-layer microparticles with different Sn layer and Ni layer thickness were fabricated and compressed as preform used for TLPB joint bonding, the microstructure and phase composition evolution for Cu@Sn and Cu@Ni@Sn system were comparatively studied during reflowing and aging process. Different kinds of interfacial structure designs were made, interfacial microscopic morphology was analyzed and compared under once and twice reflowing soldering process. Results indicated that Sn coating layer was completely consumed to form (Cu,Ni)6Sn5/Ni3Sn4 IMCs, Cu@Ni@Sn bondline have lower void rate and higher shear strength than that of Cu@Sn. The mechanism of Ni coating layer inhibit Cu atom diffusing towards Cu6Sn5 to form Cu3Sn was studied. The high reliable three-dimensional network structure joint based on Cu@Ni@Sn double-layer powder was fabricated for high temperature application.

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Mohamed, Adel M. A., Ehab Samuel, Yasser Zedan, Agnes M. Samuel, Herbert W. Doty, and Fawzy H. Samuel. "Intermetallics Formation during Solidification of Al-Si-Cu-Mg Cast Alloys." Materials 15, no. 4 (February 11, 2022): 1335. http://dx.doi.org/10.3390/ma15041335.

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The present study was undertaken to examine the effect of iron, manganese, copper and magnesium on the microstructural characteristics of Al-11%Si-2%Cu-Mg-based alloy referred to as 396 under different working conditions. The results show that strontium (Sr) has high affinity to react with magnesium (Mg), resulting in reduced effectiveness as eutectic silicon modifier or age hardening agent. In addition, Sr alters the sequence of the precipitation of the α-AlFeMnSi phase from post-eutectic to pro-eutectic which would harden the soft α-Aluminum matrix. The mechanism is still under investigation. The interactions between iron (Fe) and Mg and Sr-Mg result in the formation of serval dissolvable intermetallics during the solutionizing treatment such as β-AlFeSi, π-AlFeMgSi and Q-AlMgSiCu phases. The study also emphasizes the role of modification and grain refining as well as intermetallics in porosity formation and hardness of samples aged in the temperature range 155–240 °C.

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Chu, Qiaoling, Min Zhang, Jihong Li, Qingyang Fan, Weiwei Xie, and Zongyue Bi. "Intermetallics in CP-Ti/X65 bimetallic sheets filled with Cu-based flux-cored wires." Materials & Design 90 (January 2016): 299–306. http://dx.doi.org/10.1016/j.matdes.2015.10.136.

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Liu, Qianli, Hao Zhang, Peng Jiang, and Yifan Lv. "The Alloying Strategy to Tailor the Mechanical Properties of θ-Al13Fe4 Phase in Al-Mg-Fe Alloy by First-Principles Calculations." Metals 12, no. 12 (November 22, 2022): 1999. http://dx.doi.org/10.3390/met12121999.

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As an important strengthening phase in Al-Mg-Fe alloy, the elastic and ductile–brittle characteristics of Al13Fe4 intermetallics hold prime significance in ascertaining the mechanical properties and potential application of Al-Mg-Fe alloys. In this study, multialloying of Co, Cu, Cr, Mn, and Ni has been adopted for tuning the mechanical characteristics of the Al13Fe4 phase; their effects on mechanical features and electronic structure of the Al13Fe4 phase have been scrutinized systematically by first-principles calculations employing the density functional theory. The replacement of Fe with M (M = Co, Cu, Cr, Mn, and Ni) is energetically advantageous at 0 K, as evidenced by the negative cohesive energy and mixing enthalpy of all Al13(Fe,M)4 phases. Cu and Ni, on the contrary, have a detrimental impact on Al13Fe4′s modulus and hardness due to the evolution of chemical bonding strength. Co, Cr, and Mn are thus, interesting candidate elements. In the light of B/G and Poisson’s ratio (σ) criteria, Al13Fe4, Al13(Fe,Cu)4, and Al13(Fe,Ni)4 have superior ductility; however, Al13(Fe,Co), Al13(Fe,Mn), and Al13(Fe,Cr)4 tend to be brittle materials. Calculation-based findings show that Co, Cr, and Mn are appropriate alloying elements for enhancing fracture toughness, whereas Mn reduces Al13Fe4′s elastic anisotropy. The electronic structure assessment found that the mechanical properties of the intermetallics are predominantly influenced by the Al-M bonds when the alloying element M replaced Fe.

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Samuel, A. M., E. M. Elgallad, M. G. Mahmoud, H. W. Doty, S. Valtierra, and F. H. Samuel. "Rare Earth Metal-Based Intermetallics Formation in Al–Cu–Mg and Al–Si–Cu–Mg Alloys: A Metallographic Study." Advances in Materials Science and Engineering 2018 (2018): 1–15. http://dx.doi.org/10.1155/2018/7607465.

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This study was conducted on Al–Cu–Mg and Al–Si–Cu–Mg alloys containing either 5%La or 5%Ce. Two levels of Ti addition were examined, i.e., 0.05% and 0.15%. Thermal analysis was the only technique used to obtain castings, from which samples were then sectioned for metallographic examination. Based on the results obtained, the following points may be highlighted. Addition of a fairly large amount of RE metals (La or Ce) leads to the appearance of several peaks in the solidification curve between the precipitation of the primary α-Al phase and the (Al–Al2Cu) eutectic reaction. Although a significant drop in the eutectic temperature is caused by the addition of 5%La or Ce, the corresponding modification of the eutectic Si is marginal. Two main types of intermetallics were documented: a gray phase in the form of sludge with a fixed composition and a white phase in the shape of thin platelets. Due to the high affinity of RE to react with Si, Fe, and Cu, several compositions were obtained explaining the observed multiple peaks in the solidification curve. Judging by the morphology of the gray phase, it is assumed that this phase is precipitated in the liquid state and acts as a nucleation site for the white phase. Lanthanum and Ce can substitute each other.

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Shcheretskyi, O. A., A. M. Verkhovliuk, and D. S. Kanibolotsky. "Thermodynamic analysis of aluminium-based sacrificial anode alloys phase composition." Metaloznavstvo ta obrobka metalìv 101, no. 1 (March 30, 2022): 3–14. http://dx.doi.org/10.15407/mom2022.01.003.

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Literature review on magnesium, zinc and aluminum-based sacrificial anode alloys chemical and phase compositions have been performed. Technological phase diagrams of aluminum-based sacrificial anode alloys with different content of harmful additives, such as iron, silicon and copper, have been calculated and constructed. It is determined that the harmful effect of iron is in faster dissolution of the anode due to large inclusions of iron intermetallic. This iron negative effect can be eliminated in several ways: a) maximization of the melt cooling rate, which will lead to significant grinding of the intermetallics and thus reduce their negative impact; b) high-temperature homogenization of the alloy with subsequent rapid cooling, which will reduce the size of the iron intermetallic inclusions; c) doping the alloy with additional manganese to bind iron in ternary compound, which has a different shape and size than the binary intermetallic and has less negative effect on the sacrificial anode alloy. To eliminate the negative effects of silicon, the alloy has to be additionally doped with magnesium in an amount that will ensure the silicon complete binding. In this case, the phase composition of the alloy will correspond the AP4 alloy (% wt.%: (4.0-6.0) Zn), (0.5-1.0) Mg, (0.05-1.00) Sn , ˂ 0.10 Si, ˂ 0.10 Fe, ˂ 0.01 Cu). Long-term heat treatment of the alloy at a temperature of 120 ° C is proposed to reduce the copper harmful effect on the aluminum-based sacrificial anode alloys. Almost all copper can pass from the solid aluminum solution into the Al2Cu compound during this processing. Keywords: sacrificial anode alloys, aluminum alloys, impurities, technological phase diagrams.

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Gao, Feng, Hiroshi Nishikawa, and Tadashi Takemoto. "Intermetallics Evolution in Sn-3.5Ag Based Lead-Free Solder Matrix on an OSP Cu Finish." Journal of Electronic Materials 36, no. 12 (September 19, 2007): 1630–34. http://dx.doi.org/10.1007/s11664-007-0243-0.

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Yang, Li, and Na Zhang. "Effect of Metal Particles on Spreading Properties of Sn0.7Cu Based Composite Solder." Advanced Materials Research 152-153 (October 2010): 1759–62. http://dx.doi.org/10.4028/www.scientific.net/amr.152-153.1759.

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The particle-reinforced composite solder is prepared by adding 1 μm Ag, 1 μm Ni and 8 μm Cu into Sn0.7Cu eutectic solder which serve as the base material in current research. The formation of a thin layer of intermetallics around the particle-reinforced will promote the closer integration between base-solder and particle-reinforced, and thus form the particle-reinforced composite solder. The appropriate reinforcement particles were selected and the effects of reinforcement particles on physical properties, mechanical properties and solderability of the composite solder were studied. The spreading property of Ni (3 vol %) particle-reinforced Sn0.7Cu based composite solder was the worst among Sn0.7Cu based composite solders. The spreading property of the Cu particle-reinforced Sn0.7Cu based composite solder was worse than those of Ag particle-reinforced Sn0.7Cu based composite solders. So the conclusion is drawn that Ag particles are considered as the most appropriate reinforced particles for Sn0.7Cu based composite solders.

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42

Morozov, A., A. B. Freidin, V. A. Klinkov, A. V. Semencha, W. H. Müller, and T. Hauck. "Experimental and Theoretical Studies of Cu-Sn Intermetallic Phase Growth During High-Temperature Storage of Eutectic SnAg Interconnects." Journal of Electronic Materials 49, no. 12 (September 18, 2020): 7194–210. http://dx.doi.org/10.1007/s11664-020-08433-y.

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AbstractIn this paper, the growth of intermetallic compound (IMC) layers is considered. After soldering, an IMC layer appears and establishes a mechanical contact between eutectic tin-silver solder bumps and Cu interconnects in microelectronic components. Intermetallics are relatively brittle in comparison with copper and tin. In addition, IMC formation is typically based on multi-component diffusion, which may include vacancy migration leading to Kirkendall voiding. Consequently, the rate of IMC growth has a strong implication on solder joint reliability. Experiments show that the intermetallic layers grow considerably when the structure is exposed to heat. Mechanical stresses may also affect intermetallic growth behavior. These stresses arise not only from external loadings but also from thermal mismatch of the materials constituting the joint, and from the mismatch produced by the change in shape and volume due to the chemical reactions of IMC formation. This explains why in this paper special attention is being paid to the influence of stresses on the kinetics of the IMC growth. We develop an approach that couples mechanics with the chemical reactions leading to the formation of IMC, based on the thermodynamically sound concept of the chemical affinity tensor, which was recently used in general statements and solutions of mechanochemistry problems. We start with a report of experimental findings regarding the IMC growth at the interface between copper pads and tin based solder alloys in different microchips during a high temperature storage test. Then we analyze the growth kinetics by means of a continuum model. By combining experiment, theory, and a comparison of experimental data and theoretical predictions we finally find the values of the diffusion coefficient and an estimate for the chemical reaction constant. A comparison with literature data is also performed.

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Tupaj, Mirosław, Antoni Władysław Orłowicz, Marek Mróz, Andrzej Trytek, Anna Janina Dolata, and Andrzej Dziedzic. "A Study on Material Properties of Intermetallic Phases in a Multicomponent Hypereutectic Al-Si Alloy with the Use of Nanoindentation Testing." Materials 13, no. 24 (December 9, 2020): 5612. http://dx.doi.org/10.3390/ma13245612.

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The paper concerns modeling the microstructure of a hypereutectic aluminum-silicon alloy developed by the authors with the purpose of application for automobile cylinder liners showing high resistance to abrasive wear at least equal to that of cast-iron liners. With the use of the nanoindentation method, material properties of intermetallic phases and matrix in a hypereutectic Al-Si alloy containing Mn, Cu, Cr, Ni, V, Fe, and Mg as additives were examined. The scanning electron microscope equipped with an adapter for chemical composition microanalysis was used to determine the chemical composition of intermetallics and of the alloy matrix. Intermetallic phases, such as Al(Fe,Mn,M)Si, Al(Cr,V,M)Si, AlFeSi, AlFeNiM, AlCuNi, Al2Cu, and Mg2Si, including those supersaturated with various alloying elements (M), were identified based on results of X-ray diffraction (XRD) tests and microanalysis of chemical composition carried out with the use of X-ray energy dispersive spectroscopy (EDS). Shapes of the phases included regular, irregular, or elongated polygons. On the disclosed intermetallic phases, silicon precipitations, the matrix, values of the indentation hardness (HIT), and the indentation modulus (EIT) were determined by performing nanoindentation tests with the use of a Nanoindentation Tester NHT (CSM Instruments) equipped with a Berkovich B-L 32 diamond indenter. The adopted maximum load value was 20 mN.

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Lee, Han-Young. "The Effect of Ball-milling Energy on Combustion Synthesis Coating of Cu-Al-Ni Based Intermetallics." Journal of the Korean Society of Tribologists and Lubrication Engineers 27, no. 1 (February 28, 2011): 1–6. http://dx.doi.org/10.9725/kstle.2011.27.1.001.

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Al-Shammary, A. F. Y., I. T. Caga, A. Y. Tata, J. M. Winterbottom, and I. R. Harris. "Zirconium-based intermetallics as heterogeneous catalysts for the fischer-tropsch reaction: II. Zr-Ni-Cu catalysts." Journal of Chemical Technology & Biotechnology 55, no. 4 (April 24, 2007): 369–74. http://dx.doi.org/10.1002/jctb.280550411.

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Li, Xiaoqiang, Li Li, Ke Hu, and Shengguan Qu. "Vacuum brazing of TiAl-based intermetallics with Ti–Zr–Cu–Ni–Co amorphous alloy as filler metal." Intermetallics 57 (February 2015): 7–16. http://dx.doi.org/10.1016/j.intermet.2014.09.010.

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Wu, Z. Y., T. Y. Yeh, and R. K. Shiue. "Infrared Heating Applied in Titanium Brazing." Advanced Materials Research 79-82 (August 2009): 1379–82. http://dx.doi.org/10.4028/www.scientific.net/amr.79-82.1379.

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Infrared heating is featured with a high heating rate up to 50oC/s. It is a very powerful tool applied in brazing application, so infrared heating has been used to study the kinetics of brazing process in recent years. The importance of brazing Ti alloys has been increased in past twenty years due to the strong demand from chemical and aerospace industry. Based on the previous studies, the use of Ti-based brazes alloyed with Cu and Ni contents is considered as one of the best alloys in brazing Ti and its alloys due to their high bonding strength. However, the presence of Ti-Cu-Ni intermetallics in the brazed joint has a strong effect on the joint strength, and the reaction kinetics of the joint is still unclear. The purpose of this investigation is concentrated on transmission electron microscopy (TEM) study of the infrared brazed CP-Ti using Ti-15Cu-15Ni filler, and microstructural evolution of the infrared brazed joint is unveiled. It is helpful for industrial applications of Ti-based alloys.

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Paul, H., M. M. Miszczyk, M. Prażmowski, R. Chulist, P. Petrzak, N. Schell, and M. Fatemi. "Effect of impact loading on structural properties of multi-layered Ta/Cu, Nb/Cu and Fe/Cu plates fabricated by single-shot explosive welding." IOP Conference Series: Materials Science and Engineering 1270, no. 1 (December 1, 2022): 012068. http://dx.doi.org/10.1088/1757-899x/1270/1/012068.

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Abstract:

In this work, three eleven-layered composite plates based on Cu (six layers) and one of the reactive metals such as Ta, Nb or Fe (five layers) fabricated using a single-shot explosive welding process were studied. The morphology and phase composition of the interfacial layers were thoroughly investigated using scanning (SEM) and transmission (TEM) electron microscopy. The microstructural and chemical composition analyses were then correlated with micro-hardness measurements to evaluate the mechanical properties of the interfacial layers. It was found that layers near the interfaces exhibited a complex and hierarchical microstructure on various levels. Optical microscopy characterization confirmed the high quality of the composites, without voids or layers delamination. SEM analyses showed that the solidified melt regions unveiled different morphologies but always consisted of a mixture of pure Cu and Ta, Nb or Fe elements. Quantitative nano-scale analysis using TEM revealed that nanoparticles and small dendrites dominated the reaction regions. Although no brittle intermetallics were observed near all interfaces of all composites, the microhardness of the solidified melts was 2-3 times higher than those of the sheets in the annealed state.

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Mokhtari, Omid, and Hiroshi Nishikawa. "Effects of minor alloying additive on the shear strength of Sn-58Bi solder joint." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000100–000103. http://dx.doi.org/10.4071/isom-2013-ta41.

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Abstract:

The use of Pb has been limited in the electronic industry because of the toxicity of lead. As the result, the research and development activities in developing lead-free solders have been accelerated and some lead-free solders were introduced as alternative. Sn-Bi-based alloys are an alternative to replace Pb-based solders in the low temperature ranges. However, Sn-Bi-based solders show brittle behavior in both the bulk and the interface. Generally, the addition of impurity elements to the solders can improve the ductility of the solder joint in both the bulk and the interface by refining the solder microstructure and suppressing the intermetallics at the interface, respectively. In this study, the effect of third elements, i.e., Ni and In (1 and 0.5wt.%) on the microstructure of the Sn-58Bi solder and thickness of the interface between Sn-58Bi solder and Cu substrate were investigated. Solid state IMC compound layer growth was also examined following the thermal aging of the solder joint. Results after aging show that minor added elements were effective in suppressing the intermetallics at the interface during solid state growth. The results also show that the added In was highly effective in limiting the Bi phase coarsening. Mechanical properties of solder joints, before and after heat treatment, were also investigated by shear and micro-vickers tests.

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Zhang, Ruihong, Fu Guo, Jianping Liu, Hao Shen, and Feng Tai. "Morphology and Growth of Intermetallics at the Interface of Sn-based Solders and Cu with Different Surface Finishes." Journal of Electronic Materials 38, no. 2 (October 30, 2008): 241–51. http://dx.doi.org/10.1007/s11664-008-0582-5.

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Journal articles on the topic 'Cu-based Intermetallics'

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