Relevant bibliographies by topics / Cu-based Intermetallics

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  1. Journal articles
  2. Dissertations / Theses
  3. Book chapters
  4. Conference papers

Academic literature on the topic 'Cu-based Intermetallics'

Author: Grafiati
Published: 6 September 2023
Last updated: 31 July 2025

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Journal articles on the topic "Cu-based Intermetallics"

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Hanim, M. A. Azmah, A. Ourdjini, I. Siti Rabiatul Aisha, and O. Saliza Azlina. "Effect of Isothermal Aging 2000 Hours on Intermetallics Formed between Ni-Pd-Au with Sn-4Ag-0.5Cu Solders." Advanced Materials Research 650 (January 2013): 194–99. http://dx.doi.org/10.4028/www.scientific.net/amr.650.194.

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The present study investigated the effect of isothermal aging up to 2000 hours on the intermetallics formed between Sn-4Ag-0.5Cu lead free solder on electroless nickel electroless palladium immersion gold surface finish (Ni-Pd-Au). For all parameters, aging have an effect of changing the intermetallic morphology to coarser and dense structure. The intermetallic compound formed for the interconnection of the lead free solder changes with increased aging time from (Cu,Ni)6Sn5 compound to (Ni,Cu)3Sn4. At the end of the 2000 hours aging time, it changes to Ni3Sn4. This is the effect of Cu element
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Mayappan, Ramani, Nur Nadiah Zainal Abidin, Noor Asikin Ab Ghani, Iziana Yahya, and Norlin Shuhaime. "Intermetallic Study on the Modified Sn-3.5Ag-1.0Cu-1.0Zn Lead Free Solder." Materials Science Forum 857 (May 2016): 3–7. http://dx.doi.org/10.4028/www.scientific.net/msf.857.3.

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Due to environmental concerns, lead-free solders were introduced to replace the lead-based solders in microelectronics devices technology. Although there are many lead-free solders available, the Sn-Ag-Cu solders are considered the best replacement due to their good wettability and joint strength. Although the Sn-Ag-Cu solders are accepted widely, but there are still some room for improvement. In this study, 1wt% Zn, which can be considered high percentage for a dopant, was added into the solder via powder metallurgy route. The effects of adding this dopant into the Sn-3.5Ag-1.0Cu solder on th
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Alba-Galvín, Juan Jesús, Leandro González-Rovira, Manuel Bethencourt, Francisco Javier Botana, and José María Sánchez-Amaya. "Influence of Aerospace Standard Surface Pretreatment on the Intermetallic Phases and CeCC of 2024-T3 Al-Cu Alloy." Metals 9, no. 3 (2019): 320. https://doi.org/10.3390/met9030320.

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Published version of the open acces manuscript "Influence of Aerospace Standard Surface Pretreatment on the Intermetallic Phases and CeCC of 2024-T3 Al-Cu Alloy". Abstract: A standard three-step surface pretreatment employed in the aerospace sector for Al alloys have been investigated prior to the generation of cerium conversion coatings (CeCC) on aluminium-copper alloy 2024. Two pretreatments were analysed, one without final acid etching (Pretreatment 1) and another with this step (Pretreatment 2). Both pretreatments affect the alloy intermetallic phases, playing a key role in the develo
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Alba-Galvín, Juan, Leandro González-Rovira, Manuel Bethencourt, Francisco Botana, and José Sánchez-Amaya. "Influence of Aerospace Standard Surface Pretreatment on the Intermetallic Phases and CeCC of 2024-T3 Al-Cu Alloy." Metals 9, no. 3 (2019): 320. http://dx.doi.org/10.3390/met9030320.

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A standard three-step surface pretreatment employed in the aerospace sector for Al alloys have been investigated prior to the generation of cerium conversion coatings (CeCC) on aluminium-copper alloy 2024. Two pretreatments were analysed, one without final acid etching (Pretreatment 1) and another with this step (Pretreatment 2). Both pretreatments affect the alloy intermetallic phases, playing a key role in the development of the CeCC, and also in the susceptibility to localised corrosion in NaCl medium. Scanning electron microscopy coupled with energy-dispersive X-ray analysis (SEM-EDX) reve
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Lee, Dong Suk, Taek Kyun Jung, Mok Soon Kim, and Won Yong Kim. "Effect of Cu and Mg on Forging Property and Mechanical Behavior of Powder Forged Al-Si-Fe Based Alloy." Materials Science Forum 534-536 (January 2007): 389–92. http://dx.doi.org/10.4028/www.scientific.net/msf.534-536.389.

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Two atomized alloy powders, those chemical compositions are Al-10Si-5Fe-1Zr and Al- 10Si-5Fe-4Cu-2Mg-1Zr, were pre-compacted by cold pressing with 350MPa and subsequently hot forged at temperatures ranging from 653K to 845K and at an initial strain rate of 10-2/s in order to produce bulk cylindrical type alloys with the diameter of 10 mm. The addition of Cu and Mg into the present alloy causes a decrease in the eutectic reaction temperature of Al-10Si-5Fe-1Zr alloy from 841K to 786K and results in a decrease of flow stress at the given forging temperature. TEM observation revealed that in addi
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Thirunavukarasu, Gopinath, Sukumar Kundu, Tapas Laha, Deb Roy, and Subrata Chatterjee. "Exhibition of veiled features in diffusion bonding of titanium alloy and stainless steel via copper." Metallurgical Research & Technology 115, no. 1 (2017): 115. http://dx.doi.org/10.1051/metal/2017080.

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An investigation was carried out to know the extent of influence of bonding-time on the interface structure and mechanical properties of diffusion bonding (DB) of TiA|Cu|SS. DB of Ti6Al4V (TiA) and 304 stainless steel (SS) using pure copper (Cu) of 200-μm thickness were processed in vacuum using 4-MPa bonding-pressure at 1123 K from 15 to 120 min in steps of 15 min. Preparation of DB was not possible when bonding-time was less than 60 min as the bonding at Cu|SS interface was unsuccessful in spite of effective bonding at TiA|Cu interface; however, successful DB were produced when the bonding-t
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Mayappan, Ramani, and Zainal Arifin Ahmad. "Cu6Sn5 and Cu3Sn lntermetallics Study in the Sn-40Pb/Cu System during Long-term Aging." Scientific Research Journal 7, no. 2 (2010): 1. http://dx.doi.org/10.24191/srj.v7i2.9416.

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Replacing Sn-Pb solder with lead-free solder is a great challenge in the electronics industry. The presented lead-free solder is Sn based and forms two intermetallic species upon reaction with the Cu substrate, namely Cu6Sn5 and Cu3Sn. The growth of Cu6Sn5 and Cu3Sn intermetallics have been investigated with respect to Sn-40Pb/Cu solder joints. The joints were aged under long-term thermal exposure using single shear lap joints and the intermetallics were observed using scanning electron microscopy. As-soldered solder joints exhibit a single Cu6Sn5 phase, however after aging a Cu3Sn layer below
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Ma, Y., T. Arnesen, J. Gj⊘nnes, and J. Taft⊘. "Laser processed Al3Ti-based intermetallics: Al5±XTi2±Y(Fe, Ni, or Cu)1±z." Journal of Materials Research 7, no. 7 (1992): 1722–34. http://dx.doi.org/10.1557/jmr.1992.1722.

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A new processing route for intermetallics starting from elemental metal powders and using laser beam heating has been investigated, by which three Al3Ti-based ternary intermetallic systems alloyed with Fe, Ni, or Cu, respectively, have been produced. Structures and compositions of five phases found in the three systems have been analyzed using optical metallography, transmission electron diffraction and microscopy, and thin foil energy dispersive x-ray spectrometry. The structure of three matrix phases in the three systems was identified as L12 type, which is consistent with previous work. The
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Mayappan, Ramani, and Zainal Arifin Ahmad. "Cu6Sn5 and Cu3Sn Intermetallics Study in the Sn-40Pb/Cu System during Long-term Aging." Scientific Research Journal 7, no. 2 (2010): 1. http://dx.doi.org/10.24191/srj.v7i2.5016.

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Replacing Sn-Pb solder with lead-free solder is a great challenge in the electronics industry. The presented lead-free solder is Sn based and forms two intermetallic species upon reaction with the Cu substrate, namely Cu6Sn5 and Cu3Sn. The growth of Cu6Sn5 and Cu3Sn intermetallics have been investigated with respect to Sn-40Pb/Cu solderjoints. The joints were aged under long-term thermal exposure using single shear lap joints and the intermetallics were observed using scanning electron microscopy. As-soldered solder joints exhibit a single Cu6Sn5 phase, however after aging a Cu3Sn layer below
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Liu, Wen, Chi Zhang, Chunge Wang, et al. "Theoretical investigations on correlations between elastic behavior of Al-based alloys and their electronic structures." International Journal of Materials Research 112, no. 8 (2021): 636–41. http://dx.doi.org/10.1515/ijmr-2021-8235.

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Abstract In this work, using the first-principles method, the alloying stability, electronic structure, and elastic properties of Al-based intermetallics were investigated. It was found that these alloys have a strong alloying ability and structural stability due to the negative formation energies and the cohesive energies. The valence bonds of these intermetallic compounds are attributed to the valence electrons of Cu 3δ states for AlCu3, Cu 3δ and Zr 4δ states for AlCu2Zr, and Al 3s, Zr 5s and 4δ states for AlZr3, respectively. Furthermore, the correlation between elastic properties of these
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Dissertations / Theses on the topic "Cu-based Intermetallics"

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Rakhmonov, Jovid. "Development and characterization of a new generation of transition elements based secondary Al-Si-Cu-Mg foundry alloys." Doctoral thesis, Università degli studi di Padova, 2018. http://hdl.handle.net/11577/3425241.

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Secondary Al-Si-Cu-Mg based foundry alloys are widely used in automotive industry to particularly produce powertrain cast components mainly due to their good ratio between weight and mechanical properties, and excellent casting characteristics. Presence of impurity elements, such as Fe, Mn, Cr, Ti, V and Zr, in secondary Al-Si alloys is one of the critical issues since these elements tend to reduce alloy mechanical properties. There is an ongoing effort to control the formation of intermetallic phases containing transition metals, during alloy solidification. Although phases formation involvi
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Mishra, Manas Kumar. "A Study of Intermetallics in Cu-Sn system and Development of Sn-Zn Based Lead Free Solders." Thesis, 2013. http://ethesis.nitrkl.ac.in/4630/1/211MM1201.pdf.

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In the electronic industry Pb-Sn solder is a very important material but Pb is toxic and has adverse effects on the environment and human beings. Due to the harmful effects of the Pb the use of the Pb-Sn solder alloys are being avoided and new Pb-free solder alloys are being used for electronic applications. This study is mainly based on the intermetallics that are formed in the Cu-Sn system and development of Sn-Zn based lead free solders. The aim was to understand the solidification of Cu-Sn alloys, the various intermetallics formed and their morphology. Thermal analysis of Sn-Zn based lead
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Alex, Sherine. "Development of Cu-based Intermetallic Reflector Materials for Concentrated Solar Power Application." Thesis, 2017. https://etd.iisc.ac.in/handle/2005/4277.

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The growing demand for energy is an important issue for the existence and development of humankind. In order to reduce the impact of conventional energy sources on the environment, attention should be paid to the development of new and renewable energy resources. Solar energy is a major environment friendly, renewable and sustainable energy source. Subsequently, with increasing drying up of the terrestrial fossil fuel, solar energy will potentially become an important part of the future energy structure. Concentrated solar power (CSP) technology is a productive way to make effective utilizatio
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Li, I.-Hung, and 李怡鴻. "Infrared Vacuum Brazing Fe3Al Intermetallics Using Au-based Filler Metals and Studies on the Development of Novel Cu-based Braze Alloys." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/08229176766827581730.

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碩士<br>國立臺灣大學<br>機械工程學研究所<br>98<br>Microstructural evolution and bonding strength of infrared brazed Fe3Al and stainless steels(SS) using Au-based and CuMn-based fillers, respectively, are studied. Firstly the wetting experiments using these braze alloys are conducted to make sure the suitable brazing temperature. Al2FeNi, Fe3Al and AlAu2 intermetallics are found in the joint of AuPdNi (Au-8wt.%Pd-22wt.%Ni) braze alloy brazed at 980℃ and all specimens are fractured in brittle. For AuCu(Au-20wt.%Cu) braze alloy, the brazed joint is fractured along the central β-phase in which the fracture exhibi
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Li, Yao, and 李垚. "Infrared Vacuum Brazing Fe3Al Intermetallics Using Ag/Cu Filler Metals and Studies on The Development of Novel Low-temperature Ag-based Braze Alloys." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/52793226811972258103.

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碩士<br>國立臺灣大學<br>材料科學與工程學研究所<br>97<br>Microstructural evolution and bonding strength of infrared brazed Fe3Al using Ag, Cu, and BAg-8 braze alloys have been studied. The joint of the Ag-brazed specimen only contains Ag-rich phase alloyed with Al. The shear strength isn’t affected by the brazing time and reaches 127MPa for specimens brazed at 980oC×300s with the ductile fracture of Ag-rich phase. The microstructure and shear strength of infrared brazed Fe3Al using pure Cu at 1100oC are strongly dependent upon the brazing time in which the brazed joint changes from Cu-rich phase into β1’ (N18R
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Chao, Huang-Lin. "Electromigration enhanced kinetics of Cu-Sn intermetallic compounds in Pb free solder joints and Cu low-k dual damascene processing using step and flash imprint lithography." 2009. http://hdl.handle.net/2152/7607.

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This dissertation constitutes two major sections. In the first major section, a kinetic analysis was established to investigate the electromigration (EM), enhanced intermetallic compound (IMC) growth and void formation for Sn-based Pb-free solder joints to Cu under bump metallization (UBM). The model takes into account the interfacial intermetallic reaction, Cu-Sn interdiffusion, and current stressing. A new approach was developed to derive atomic diffusivities and effective charge numbers based on Simulated Annealing (SA) in conjunction with the kinetic model. The finite difference (FD) kinet
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Book chapters on the topic "Cu-based Intermetallics"

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Moriarty, John A. "Alloys and Intermetallic Compounds." In Theory and Application of Quantum-Based Interatomic Potentials in Metals and Alloys. Oxford University PressOxford, 2023. http://dx.doi.org/10.1093/oso/9780198822172.003.0010.

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Abstract In this chapter, the quantum-based interatomic potentials (QBIPs) developed in Chapters 3–5 for elemental metals are extended to the much larger domain of alloys and intermetallic compounds. The main focus here is on binary systems, but applications to multi-component systems are also considered. Generalized pseudopotential theory (GPT) has been used to develop QBIPs and investigate the trends in cohesion and structure for Mg-Al and transition-metal aluminide (TM-Al) compounds. In this regard, first-principles GPT potentials have been calculated across the entire 3d TM-Al series as a
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Conference papers on the topic "Cu-based Intermetallics"

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Chatterjee, Abhijit. "First-principles Investigation of the Structural and Electronic Properties of Cu Based Intermetallics." In 2008 10th Electronics Packaging Technology Conference (EPTC 2008). IEEE, 2008. http://dx.doi.org/10.1109/eptc.2008.4763423.

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Qin, Wentao, Tom Anderson, George Chang, Harold Anderson, and Denise Barrientos. "Mechanism to Improve the Reliability of Cu Wire Bonding by Pd-Coating of the Wire." In ISTFA 2016. ASM International, 2016. http://dx.doi.org/10.31399/asm.cp.istfa2016p0619.

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Abstract Coating of the Cu bond wire with Pd has been a rather widely accepted method in semiconductor packaging to improve the wire bonding reliability. Based on comparison of a Cu bond wire and a Pd-coated Cu bond wire on AlCu pads that had passed HAST, new insight into the mechanism of the reliability improvement is gained. Our analysis showed the dominant Cu-rich intermetallics (IMC) were Cu3Al2 for the Cu wire, and (CuPdx)Al for the Pd-coated wire. The results have verified the Cu-rich IMC being suppressed by the Pd-coating, which has been extensively reported in literature. Binary phase
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Renta, Lorraine M., Ricky Valentin, Pedro Quintero, David Ma, and Alan Hovland. "Study of the Thermomechanical Inelastic Energy Response of Backward Compatible Solder Joints Made With Sn-3.8Ag-0.7Cu versus Reballed Sn37.0Pb Components." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52036.

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Conflicting results in reliability tests for backward compatible and Pb-free soldered assemblies has motivated RoHS-exempted industries to practice reballing. Reballing is the name given to the process of removing Pb-free solder balls from the copper (Cu) pads of the Ball Grid Array (BGA) components received through the supply chain and replacing them with SnPb solder balls. Recent studies on the subject of reballing have shown the possibility that the removed Pb-free solder ball leaves behind some intermetallic remnants of the Pb-free solder alloy and the Cu from the pads. A modeling approach
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Barradas, S., R. Molins, M. Jeandin, et al. "Laser Shock Flier Impact Simulation of Particle-Substrate Interactions in Cold Spray." In ITSC2005, edited by E. Lugscheider. Verlag für Schweißen und verwandte Verfahren DVS-Verlag GmbH, 2005. http://dx.doi.org/10.31399/asm.cp.itsc2005p0343.

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Abstract Coating-substrate adhesion in cold spray is a paramount property, the mechanisms of which are not yet well elucidated. These mechanisms are governed by metallurgical and morphological phenomena occuring when cold-sprayed particles impinge on the substrate. To go into these mechanisms, due to the intrinsic characteristics of the cold spray process, i.e. the low-temperature and high velocity of the particles, direct observation and control of inflight particles and related phenomena (especially when impinging) cannot be done easily. For this reason, an experimental simulation of the par
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Maziasz, Philip J., John P. Shingledecker, Neal D. Evans, and Michael J. Pollard. "Developing New Cast Austenitic Stainless Steels With Improved High-Temperature Creep Resistance." In ASME 2007 Pressure Vessels and Piping Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/creep2007-26840.

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Oak Ridge National Laboratory (ORNL) and Caterpillar have recently developed a new cast austenitic stainless steel, CF8C-Plus, for a wide range of high-temperature applications, including diesel exhaust components and turbine casings. The creep-rupture life of the new CF8C-Plus is over ten times greater than that of the standard cast CF8C stainless steel, and the creep-strength is about double. Another variant, CF8C-Plus Cu/W has been developed with even more creep strength at 750–850°C. The creep-strength of these new cast austenitic stainless steels is close to that of Ni-based superalloys l
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Meng, Dongmei, Laura Buck, and James Cargo. "An Overview of Cu Wire Intermetallic Compound Formation and a Corrosion Failure Mechanism." In ISTFA 2012. ASM International, 2012. http://dx.doi.org/10.31399/asm.cp.istfa2012p0310.

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Abstract Cu needs a higher level of ultrasound combined with bonding force to be bonded to the Al pad properly, not just because Cu is harder than Au, but it is also harder to initiate intermetallic compounds (IMC) formation during bonding. This increases the chances of damaging the metal/low k stack under the bondpad. This paper presents a fundamental study of IMC as well as one example of a failure mode of Cu/Al bonded devices, all based on detailed analysis using scanning electron microscopy, scanning transmission electron microscopy, energy dispersive spectrometers, and transmission electr
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Luu, Thi-Thuy, Ani Duan, Kaiying Wang, Knut E. Aasmundtveit, and Nils Hoivik. "Optimization of Cu/Sn wafer-level bonding based upon intermetallic characterization." In 2012 4th Electronic System-Integration Technology Conference (ESTC). IEEE, 2012. http://dx.doi.org/10.1109/estc.2012.6542151.

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Faizan, M., R. A. McCoy, D. C. Lin, T. S. Srivatsan, and G. X. Wang. "An Investigation of Copper Dissolution and the Formation of Intermetallic Compounds in Molten Tin and Tin-Silver Solders." In ASME 2003 Heat Transfer Summer Conference. ASMEDC, 2003. http://dx.doi.org/10.1115/ht2003-47477.

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This paper presents an experimental study of copper dissolution in molten tin and tin-silver (Sn-Ag) solders and the formation and presence of the Cu-Sn intermetallic compound at solder/copper interfaces. During the experiments, copper (99.9% pure) samples, coated with a RMA flux, were dipped vertically in a molten solder for different time periods ranging from 5 seconds to 10 minutes. The molten solder was maintained at temperatures of 232°C, 250°C and 300°C for pure tin and 221°C, 250°C, and 300°C for Sn-3.5%Ag respectively. The samples were then cut, cleaned and cold mounted in epoxy at amb
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Alazzam, A., M. Obaidat, E. Perfecto, et al. "Design and Process Development Concerns for the Assembly of Very Small Solder Joints." In ASME 2012 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/imece2012-89562.

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This work reports a systematic study that addresses the evolution of the solder and intermetallic bond layer microstructure and resulting properties in microbump based assemblies during reflow and subsequent aging. So far, pure Sn as well as alloys with two different initial concentrations of Ag were considered. Thicknesses down to 5μm were deposited and reflowed on Cu, Ni, and Ni/Au pads of different thicknesses and diameters ranging from 150μm to 11μm. Flip chips with these structures were finally assembled onto different substrate pads using a fine pitch bonder and aged at different elevate
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Gao, Feng, and Jianmin Qu. "Elastic Properties of (Cu,Ni)6Sn5 Ternary Crystal Structure Using First-Principle Approach." In ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-11130.

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The Cu6Sn5 intermetallic compound (IMC) is an important interfacial reactive product in electronic packaging. The properties of Cu6Sn5 have been demonstrated to be crucial to the interface reliability at the solder interconnections. Due to the element inter-diffusion between the packaging side and PCB (printed circuit board) side during soldering process, a ternary Cu6Sn5-based Cu-Ni-Sn intermetallic compound is often generated. This ternary phase exhibits a similar crystal structure as Cu6Sn5 phase, in which the Ni atoms are regarded as the solubility by replacing the Cu atoms. Therefore, thi
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