Relevant bibliographies by topics / Cu

Academic literature on the topic 'Cu'

Author: Grafiati
Published: 4 June 2021
Last updated: 4 May 2024

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Journal articles on the topic "Cu"

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Song, Inhyeop, Minjae Lee, Sungdong Kim, and Sarah Eunkyung Kim. "Development of Cu CMP process for Cu-to-Cu wafer stacking." Journal of the Microelectronics and Packaging Society 20, no. 4 (December 30, 2013): 81–85. http://dx.doi.org/10.6117/kmeps.2013.20.4.081.

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Nakamura, Keishi, Yasunori Sakagami, and Shiomi Kikuchi. "Resistivity of Cu-Ni/Cu/Cu-Ni Multilayer Materials." Journal of the Japan Institute of Metals 71, no. 2 (2007): 270–74. http://dx.doi.org/10.2320/jinstmet.71.270.

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Shuttleworth, I. G. "Investigation of the H–Cu and Cu–Cu bonds in hydrogenated Cu." Journal of Physics and Chemistry of Solids 74, no. 1 (January 2013): 128–34. http://dx.doi.org/10.1016/j.jpcs.2012.08.014.

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Grigorenko, G. M., M. A. Poleshchuk, L. I. Adeeva, A. Yu Tunik, E. V. Zelenin, and S. N. Stepanyuk. "Peculiarities of structure of Cu–Cu, Ni–Cu and Steel–Cu joints produced by overlap friction stir welding method." Автоматическая сварка 2016, no. 6 (June 28, 2016): 82–87. http://dx.doi.org/10.15407/as2016.06.13.

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Park, Jong-Myeong, Yeong-Rae Kim, Sung-Dong Kim, Jae-Won Kim, and Young-Bae Park. "Wet Etching Characteristics of Cu Surface for Cu-Cu Pattern Direct Bonds." Journal of the Microelectronics and Packaging Society 19, no. 1 (March 31, 2012): 39–45. http://dx.doi.org/10.6117/kmeps.2012.19.1.039.

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Sommer, Ferdinand, Joachim Schott, and Bruno Predel. "Thermodynamic investigations of Cu-Dy, Cu-Er, Cu-Gd and Cu-La alloys." Journal of the Less Common Metals 125 (November 1986): 175–81. http://dx.doi.org/10.1016/0022-5088(86)90092-5.

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Jhan, Jhih-Jhu, Kazutoshi Wataya, Hiroshi Nishikawa, and Chih-Ming Chen. "Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding." Journal of the Taiwan Institute of Chemical Engineers 132 (March 2022): 104127. http://dx.doi.org/10.1016/j.jtice.2021.10.027.

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Gungor, A., K. Barmak, A. D. Rollett, C. Cabral, and J. M. E. Harper. "Texture and resistivity of dilute binary Cu(Al), Cu(In), Cu(Ti), Cu(Nb), Cu(Ir), and Cu(W) alloy thin films." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 20, no. 6 (2002): 2314. http://dx.doi.org/10.1116/1.1520549.

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Shih, D. ‐Y, C. ‐A Chang, J. Paraszczak, S. Nunes, and J. Cataldo. "Thin‐film interdiffusions in Cu/Pd, Cu/Pt, Cu/Ni, Cu/NiB, Cu/Co, Cu/Cr, Cu/Ti, and Cu/TiN bilayer films: Correlations of sheet resistance with Rutherford backscattering spectrometries." Journal of Applied Physics 70, no. 6 (September 15, 1991): 3052–60. http://dx.doi.org/10.1063/1.349337.

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Grigorenko, G. M., M. A. Poleshchuk, L. I. Adeeva, A. Yu Tunik, E. V. Zelenin, and S. N. Stepanyuk. "Peculiarities of structure of Cu–Cu, Ni–Cu and Steel–Cu joints produced by overlap friction stir welding method." Paton Welding Journal 2016, no. 6 (June 28, 2016): 75–80. http://dx.doi.org/10.15407/tpwj2016.06.13.

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Dissertations / Theses on the topic "Cu"

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McGivern, Cu-Hullan Tsuyoshi. "Comparing the medium-term effects of exercise or dietary restriction on appetite regulation and compensatory responses." Thesis, Queensland University of Technology, 2011. https://eprints.qut.edu.au/47164/1/Cu-Hullan_McGivern_Thesis.pdf.

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Previous studies have shown that exercise (Ex) interventions create a stronger coupling between energy intake (EI) and energy expenditure (EE) leading to increased homeostasis of the energy-balance (EB) regulatory system compared to a diet intervention where an un-coupling between EI and EE occurs. The benefits of weight loss from Ex and diet interventions greatly depend on compensatory responses. The present study investigated an 8-week medium-term Ex and diet intervention program (Ex intervention comprised of 500kcal EE five days per week over four weeks at 65-75% maximal heart rate, whereas the diet intervention comprised of a 500kcal decrease in EI five days per week over four weeks) and its effects on compensatory responses and appetite regulation among healthy individuals using a between- and within-subjects design. Effects of an acute dietary manipulation on appetite and compensatory behaviours and whether a diet and/or Ex intervention pre-disposes individuals to disturbances in EB homeostasis were tested. Energy intake at an ad libitum lunch test meal after a breakfast high- and low-energy pre-load (the high energy pre-load contained 556kcal and the low energy pre-load contained 239kcal) were measured at the Baseline (Weeks -4 to 0) and Intervention (Weeks 0 to 4) phases in 13 healthy volunteers (three males and ten females; mean age 35 years [sd + 9] and mean BMI 25 kg/m2 [sd + 3.8]) [participants in each group included Ex=7, diet=5 (one female in the diet group dropped out midway), thus, 12 participants completed the study]. At Weeks -4, 0 and 4, visual analogue scales (VAS) were used to assess hunger and satiety and liking and wanting (L&W) for nutrient and taste preferences using a computer-based system (E-Prime v1.1.4). Ad libitum test meal EI was consistently lower after the HE pre-load compared to the LE pre-load. However, this was not consistent during the diet intervention however. A pre-load x group interaction on ad libitum test meal EI revealed that during the intervention phase the Ex group showed an improved sensitivity to detect the energy content between the two pre-loads and improved compensation for the ad libitum test meal whereas the diet group’s ability to differentiate between the two pre-loads decreased and showed poorer compensation (F[1,10]=2.88, p-value not significant). This study supports previous findings of the effect Ex and diet interventions have on appetite and compensatory responses; Ex increases and diet decreases energy balance sensitivity.
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Sommadossi, Silvana Andrea. "Investigation on diffusion soldering in Cu-In-Cu and Cu-In-48Sn-Cu systems." Stuttgart : Max-Planck-Inst. für Metallforschung, 2002. http://deposit.d-nb.de/cgi-bin/dokserv?idn=965684601.

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Uljanionok, Julija. "Cu(I) Kompleksų vaidmuo glicinatinių ir maleatinių Cu(II) kompleksų elektrocheminės redukcijos procesuose." Doctoral thesis, Lithuanian Academic Libraries Network (LABT), 2010. http://vddb.laba.lt/obj/LT-eLABa-0001:E.02~2010~D_20100204_100342-68643.

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Atliktas palyginamasis dviejų kompleksinių sistemų - Cu|Cu(II), glicinas ir Cu|Cu(II), maleino rūgštis - elektrocheminių charakteristikų tyrimas. Nustatytos maleino rūgšties tirpalų pusiausvyrinės charakteristikos. Kiekybiniam titravimo kreivių aprašymui išvestos lygtys, kuriose įvertinti medžiagų bei krūvių balansai bei atsižvelgta į praskiedimo efektus. Jų taikymas pH-metrinių duomenų analizei davė tokias maleato anijonų protonizacijos konstantų reikšmes: log = 6,05, log = 7,48. Nustatyta, kad tirpaluose su 0,3 M K2SO4 priedu protonizuotų ligando formų stabilumas sumažėja (log = 5,75, log = 7,30). Cu(II) maleatinių kompleksų stabilumui nustatyti panaudotas spektrofotometrijos metodas ir pasiūlyta duomenų analizės procedūra. Ji remiasi kiekybiniu absorbcijos spektrų aprašymu, taikant lygtis, išplaukiančias iš valdomo harmoninio osciliatoriaus teorijos. Išanalizavus įvairių sudėčių tirpalų absorbcijos maksimumo dydžius, prieita išvados, kad rūgščiose terpėse vyrauja monoligandinis kompleksas, kurio koncentracinė stabilumo konstanta log b1 = 2,2. Atlikta sistemos Cu|Cu(II), maleino rūgštis pusiausvyrų termodinaminė analizė. Nustatyta, kad esant metalinio vario ir tirpalų sąlyčiui, sistemoje galimi gilūs virsmai, kurių metu iki 90 % Cu(II) transformuojasi į Cu(I). Teorines išvadas patvirtina eksperimentiniai duomenys, gauti spektrofotometrijos ir elektrocheminės kvarco kristalo mikrogravimetrijos metodais. Įvertinti Cu korozijos bei fazinių Cu2O sluoksnių susidarymo... [toliau žr. visą tekstą]
A comparative investigation of electrochemical characteristics of two complex systems, viz. Cu|Cu(II), glycine and Cu|Cu(II), maleic acid, was carried out. The equations were obtained for quantitative description of pH-metric and spectrophotometric data, which were used for determination of equilibrium characteristics in Cu(II)-maleic acid solutions. Thermodynamic analysis shows that deep changes are possible in this system resulting in 90 % transform of Cu(II) into Cu(I). The rates of Cu corrosion and Cu2O formation are estimated to be of the same order (nmol cm-2 s-1). Regularities of formal electrochemical kinetics, which account for the mass transport of chemically interacting particles and for step-wise charge transfer process, are suitable for interpretation of voltammetric data of the Cu|Cu(II), glycine system. Kinetic parameters Cu(II) glycinate complex depend on the nature of the supporting electrolyte: the exchange current density decreases and the cathodic charge transfer coefficient increases in the sequence: Li+ - Na+ - K+ - Cs+. To enhance the Cu(I) generation in maleic acid system, the pre-electrolysis procedure was applied. It was found that its effect depends on solution pH. Applied theoretical model describes satisfactorily the steady-state voltammetric characteristics of Cu|Cu(II), maleic acid system, but some contradictory results were obtained in the case of time-dependent processes. Theoretical and experimental problems to be solved are discussed.
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Uljanionok, Julija. "Role of Cu(I) complexes in the electrochemical reduction of glycinate and maleate Cu(II) complexes." Doctoral thesis, Lithuanian Academic Libraries Network (LABT), 2010. http://vddb.laba.lt/obj/LT-eLABa-0001:E.02~2010~D_20100204_100357-81350.

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A comparative investigation of electrochemical characteristics of two complex systems, viz. Cu|Cu(II), glycine and Cu|Cu(II), maleic acid, was carried out. The equations were obtained for quantitative description of pH-metric and spectrophotometric data, which were used for determination of equilibrium characteristics in Cu(II)-maleic acid solutions. Thermodynamic analysis shows that deep changes are possible in this system resulting in 90 % transform of Cu(II) into Cu(I). The rates of Cu corrosion and Cu2O formation are estimated to be of the same order (nmol cm-2 s-1). Regularities of formal electrochemical kinetics, which account for the mass transport of chemically interacting particles and for step-wise charge transfer process, are suitable for interpretation of voltammetric data of the Cu|Cu(II), glycine system. Kinetic parameters Cu(II) glycinate complex depend on the nature of the supporting electrolyte: the exchange current density decreases and the cathodic charge transfer coefficient increases in the sequence: Li+ - Na+ - K+ - Cs+. To enhance the Cu(I) generation in maleic acid system, the pre-electrolysis procedure was applied. It was found that its effect depends on solution pH. Applied theoretical model describes satisfactorily the steady-state voltammetric characteristics of Cu|Cu(II), maleic acid system, but some contradictory results were obtained in the case of time-dependent processes. Theoretical and experimental problems to be solved are discussed.
Atliktas palyginamasis dviejų kompleksinių sistemų - Cu|Cu(II), glicinas ir Cu|Cu(II), maleino rūgštis - elektrocheminių charakteristikų tyrimas. Nustatytos maleino rūgšties tirpalų pusiausvyrinės charakteristikos. Kiekybiniam titravimo kreivių aprašymui išvestos lygtys, kuriose įvertinti medžiagų bei krūvių balansai bei atsižvelgta į praskiedimo efektus. Jų taikymas pH-metrinių duomenų analizei davė tokias maleato anijonų protonizacijos konstantų reikšmes: log = 6,05, log = 7,48. Nustatyta, kad tirpaluose su 0,3 M K2SO4 priedu protonizuotų ligando formų stabilumas sumažėja (log = 5,75, log = 7,30). Cu(II) maleatinių kompleksų stabilumui nustatyti panaudotas spektrofotometrijos metodas ir pasiūlyta duomenų analizės procedūra. Ji remiasi kiekybiniu absorbcijos spektrų aprašymu, taikant lygtis, išplaukiančias iš valdomo harmoninio osciliatoriaus teorijos. Išanalizavus įvairių sudėčių tirpalų absorbcijos maksimumo dydžius, prieita išvados, kad rūgščiose terpėse vyrauja monoligandinis kompleksas, kurio koncentracinė stabilumo konstanta log b1 = 2,2. Atlikta sistemos Cu|Cu(II), maleino rūgštis pusiausvyrų termodinaminė analizė. Nustatyta, kad esant metalinio vario ir tirpalų sąlyčiui, sistemoje galimi gilūs virsmai, kurių metu iki 90 % Cu(II) transformuojasi į Cu(I). Teorines išvadas patvirtina eksperimentiniai duomenys, gauti spektrofotometrijos ir elektrocheminės kvarco kristalo mikrogravimetrijos metodais. Įvertinti Cu korozijos bei fazinių Cu2O sluoksnių susidarymo... [toliau žr. visą tekstą]
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Molina, Gonzalez Sonia. "Analyse du couplage des fonctions de filtration des suies et de réduction des NOx pour moteur diesel." Thesis, Lyon, 2017. http://www.theses.fr/2017LYSE1290.

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Les systèmes de post-traitement qui combinent diverses fonctionnalités dans un même dispositif catalytique sont considérées comme une solution efficace pour réussir l’objectif définie par les restrictives futures normes qui régulent les émissions de l'industrie automobile. Ils permettent non seulement de réduire les coûts intrinsèques dus à l’encombrement mais aussi, dans certains cas, de favoriser les réactions catalytiques par des effets thermiques ou synergiques. Ce concept est particulièrement étudié pour les moteurs Diesel dont la ligne d'échappement peut comprendre jusqu'à quatre éléments. La réduction des NOx peut être réalisée par réduction catalytique sélective de l'ammoniac sur filtre (NH3-SCRF) en utilisant des catalyseurs à base de zéolite échangée par Cu ou Fe. Ce filtre à suie catalysé assume simultanément deux fonctions: l'élimination des particules et la réduction des espèces de NOx vers N2 et de l’eau. En ce qui concerne les catalyseurs SCR, la couche active est classiquement déposée sur les parois d'un substrat de grande porosité dont les canaux sont bloqués à des extrémités alternatives. Une porosité accrue du substrat du filtre (tel que la cordiérite ou SiC) est nécessaire pour permettre le dépôt de la quantité de phase de catalyseur nécessaire pour le traitement des émissions gazeuses en assurant une filtration efficace et sans produire un effet de contre-pression du system. En plus, il est nécessaire de remarquer que des nouvelles réactions se produiront dans ce système puisque la suie Diesel, le NOx et l'agent réducteur sont présents dans la même unité pour la première fois. Selon la littérature actuellement disponible, les polluants et la suie peuvent interagir de trois manières principales: 1) la suie bloque l'accessibilité du flux gazeux aux sites actifs «classiques» du catalyseur; 2) possibilité de réduction des NOx sur les particules de suie; et enfin, 3) la présence de suie affecte les performances des réactions SCR ou, au contraire, les réactions SCR affectent le processus d'oxydation des particules jusqu'à ce que la compétition pour le NO2 soit produite
Aftertreatment systems that combine various functionalities into the same catalytic device are considered to be an efficient solution to reach the target defined by the restrictive future emission standards that regulate the automotive industry emissions. They are able not only to reduce the intrinsic costs due to the packaging but also, in some cases, to promote catalytic reactions by thermal or synergistic effects. This concept is being particularly explored for Diesel engines whose exhaust line may comprise up to four separate elements. NOx abatement can be accomplished by ammonia selective catalytic reduction on filter (NH3-SCRF) using Cu or Fe-exchanged zeolite-based as catalysts. This catalysed soot filter assumes two functions, simultaneously: removal of particles and reduction of NOx species towards N2. Regarding the SCR catalysts, the active layer is conventionally deposited onto the walls of a high porosity substrate whose channels are blocked at alternative ends. An increased porosity of the filter (such as cordierite or SiC) substrate is required to allow the deposition of the amount of catalyst phase needed for the treatment of gaseous emissions while efficient filtration and without producing a backpressure effect. Furthermore, it is necessary to remark that new reactions will occur in this system as Diesel soot, NOx and the reductant agent are present in the same unit for the first time. Accordingly to the literature currently available, there are three main ways that NOx pollutants and soot may interact: 1) soot blocking the accessibility of gas flow to “classic” active sites of the catalyst; 2) possibility of NOx reduction takes place over the soot particles; and finally, 3) soot presence affects SCR reactions performance or, contrarily, SCR reactions affects PM oxidation process as far as competition for NO2 will be produced
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Ruggiero, Lígia de Oliveira. "Estudo da presença de pares de Cu+ - OCN- e Cu+ - CN- no cristal de KCl." Universidade de São Paulo, 1989. http://www.teses.usp.br/teses/disponiveis/54/54131/tde-06022014-101453/.

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O presente trabalho mostra um estudo sobre a presença de pares de íons de CN- - Cu+ e OCN- -Cu+, em cristais de KCl, usando técnicas de medidas de corrente de despolarização termoestimulada (I.T.C.) e Absorção óptica. A detecção destes pares foi feita através de um estudo sistemática de correlação entre as diferentes amostras aqui usadas: KCl + 1% KCN; KCl + 1% CuCl; KCl + 1% KOCN; KCl + 1% KOCN + 1% CuCl e KCl + 1% KCN + 1% CuCl. Deve ser ressaltado que a última amostra apresenta um tipo de impureza não intencional OCN- , cuja associação com o íon Cu+ também é observada. Na absorção ótica observamos bandas à temperatura ambiente em 210, 228, 242, 252, 260 e 290 nm para o cristal de KCl + 1% CuCl + 1% KCN, sendo que para o cristal de KCl + 1% KOCN + 1% CuCl não foi observado o último pico. As diferentes bandas são atribuídas às possíveis interações entre Cu+ e CN-, bem como Cu+ e OCN-. Quanto à técnica de ITC, as curvas obtidas por esta, para os três últimos cirstais citados acima, foram melhor ajustadas pela somatória de duas curvas singulares de ITC, cujas temperaturas de pico estão nas posições de 53 e 55 K; 54,3 e 56,6 K; 53,3 e 56,1 K, respectivamente. Em KCl + 1% KOCN a curva de mais baixa temperatura (curva 1) de ITC é atribuída à molécula (16O12C14N-) e a curva de mais alta temperatura (curva 2) é atribuída à molécula isotrópica (18O12C14N-). Para as amostras de KCl + 1% KOCN + 1% CuCl a curva 1 foi atribuída ao OCN- isolado e a curva 2 ao Cu+ perturbado pela presença do OCN-. Quanto ao cristal de KCl + 1% KCN + 1% CuCl, as duas técnicas propostas não foram suficientes para identificar a presença de pares Cu+ - CN-, necessitando, desta maneira, da utilização de outra técnica experimental, como por exemplo a da luminescência. A correlação dos resultados experimentais foi feita através dos parâmetros determinados do momento de dipolo (p), energia de ativação (Ea∗) e a temperatura de pico (Tm∗)
The present work gives a study on CN- - Cu+ and OCN- -Cu+ coupled pairs doped KCl single crystal, by using Ionic Thermal Current (I.T.C.) and Optical absorption techniques. These pairs were detected through a systematic correlation study between different samples: KCl + 1% KCN; KCl + 1% CuCl; KCl + 1% KOCN; KCl + 1% KOCN + 1% CuCl and KCl + 1% KCN + 1% CuCl, were the last sample shows unporposely doping OCN-, compled with Cu+. The observed optical absorption bands, at room temperature, were in 210, 228, 242, 252, 260 and 290 nm for KCl + 1% CuCl + 1% KCN crystal. Only the last absorption band was not seen in KCl + 1% KOCN + 1% CuCl samples. Diferent bands are associated with possible interactions between Cu+ and CN-, as also Cu+ with OCN-. The ITC curves for the last three crystals were better fitted with two single ITC´s curves, whose temperature peaks are at 53 and 55 K; 54,3 and 56,6 K; 53,3 and 56,1 K, respectively. The lowest temperature ITC band (curve 1) in KCl + 1% KOCN is attributed to the (16O12C14N-) molecule and the highest temperature ITC band (curve 2) is due to the (18O12C14N-) isotropic molecule. For KCl + 1% KOCN + 1% CuCl samples curve 1 was associated with isolated OCN- and curve 2 with Cu+ perturbed with OCN-. With KCl + 1% KCN + 1% CuCl, the two techniques were not good enough to identify Cu+ - CN-, compling, it should be necessary to apply another type of techniques, like luminescence. The correlations of the experimental results were done through the determination electric dipole moment (p), activation energy (Ea∗) and temperature peak (Tm∗) parameters
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Майзеліс, Антоніна Олександрівна, Борис Іванович Байрачний, and Лариса Валентинівна Трубнікова. "Електроосадження композиційно-модульованих покрить (Cu-Ni)/(Ni-Cu)." Thesis, НТУ "ХПІ", 2011. http://repository.kpi.kharkov.ua/handle/KhPI-Press/20771.

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Kozlova, Olga. "Brasage réactif Cu/acier inoxydable et Cu/alumine." Grenoble INPG, 2008. http://www.theses.fr/2008INPG0072.

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Dans ce travail nous étudions les aspects physicochimiques et mécaniques des joints brasés cuivre/acier inoxydable et cuivre/alumine. Dans la partie physicochimique nous étudions la mouillabilité, la réactivité aux interfaces et la microstructure des joints brasés. La partie mécanique porte sur les joints cuivre/alumine obtenus par brasage réactif et comprend des tests de traction et des essais de décollement par poinçon. A partir de résultats obtenus nous proposons des solutions optimales d'assemblage en terme de température, de durée de brasage et de composition des alliages de brasure
In this work we study the physico-chemical and mechanical aspects of the copper/stainless steel and copper/alumina brazed joints. In the physico-chemical part we study the wettability, the reactivity at the interfaces and the microstructure of the brazed joints. The mechanical part relates to the copper/alumina joints obtained by reactive brazing and includes tensile tests and shaft loaded blister tests. From the results we propose optimal solutions of assemblies in term of temperature, brazing time and composition of the braze
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Badamikar, Anupam Shirish. "Effect of conditioners on Cu-Cu and Al-Cu high current density sliding electrical contacts." Thesis, Wichita State University, 2009. http://hdl.handle.net/10057/2524.

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This study was aimed at evaluating the performance of contact conditioners in sliding electrical contacts. Cu-Cu and Al-Cu sliding contacts have been tested at current densities up to 933 A/mm2 and 733 A/mm2 respectively. A pin on disc type test setup was developed around a high speed lathe. The setup comprises of a mechanical loading system, test circuit carrying high current, customized electronics and a data acquisition system. The mechanical system consists of a mechanism for loading the pin at a constant pressure independent of wear and a three component piezoelectric force dynamometer. The high current circuit consists of power switch arrangement, a shunt resistance for measuring the current and current control resistances for setting the peak current. The electronics includes circuitry for triggering, and controlling the width of the current pulse. A four terminal contact voltage measurement was performed during sliding. The contact voltage, shunt voltage, normal and frictional force components were recorded using an A/D card continuously at a rate of 5 kHz. The average pin wear rate was obtained by measuring the weight and length of the pin before and after the test. Two different contact conditioners, a solid lubricant interface conditioner (SLIC) and Uniflor8511® a PTFE thickened lubricant from Nye Lubricants were used. Test results for the copper-copper (C110) sliding with SLIC shows tremendous improvement in contact life. Contacts pre-conditioned with SLIC, loaded to 10 MPa normal contact pressure and subjected to 3.6 ms long current pulses of nominal current density 933A/mm2, survived for more than 4000 revolutions or passes (single pulse/rev) prior to the galling and failure. Sliding under current occurred at an average friction coefficient of 0.24. In comparison, testing without any conditioner shows an average friction coefficient above 0.6 and that the pin fails in less than 9 revolutions. Similar tests were carried out for Al 7075-T6 pin sliding on copper (C110) plate. Testing was carried out in three stages, namely, preliminary testing to evaluate performance of SLIC and Uniflor under high speed sliding, interrupted testing to identify test track condition in the initial stage of sliding and further additional circular testing. Preliminary test results showed that Al transfers from the pin to the copper plate under high current. Testing with SLIC it was found that that the conditioner is less effective in this sliding system considering the amount of Al transfer to the copper plate. Further additional testing has been performed using Uniflor8511. Additional circular testing shows that the average wear rate for sliding without current is much smaller as compared to sliding with current. A new mode of wear, namely, cutting of the transfer layers by the pin in subsequent passes, has been observed to increase the wear rate significantly once galling begins. Results also show that the thickness of the lubricant layer has an effect, with a thin layer of lubricant showing considerably increased friction coefficient and increased Al transfer to the test plate. Repeat pass testing with re-lubrication of pin between two passes provides some improvement in the average pin wear rate obtained. SLIC is a promising conditioner for high current density Cu-Cu sliding contacts but needs to be tested at higher sliding speeds. For Al-Cu sliding contacts, Uniflor8511 delayed the onset of galling to about 30-40 passes (up to 3 pulses/rev), but could not reduce transfer of Al from the pin to the Cu plate.
Thesis (M.S.)--Wichita State University, College of Engineering, Dept. of Industrial & Manufacturing Engineering
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Bochi, Gabriel 1969. "Magnetic anisotropy in epitaxial Ni/Cu (001) thin films and Cu/Ni/Cu (001) sandwiches." Thesis, Massachusetts Institute of Technology, 1995. http://hdl.handle.net/1721.1/11514.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995.
Vita.
Includes bibliographical references (leaves 156-161).
by Gabriel Bochi.
Ph.D.
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Books on the topic "Cu"

1

Caroly, Felix. Cu dragoste, cu patima, cu ura. Tel Aviv: Comitetul pentru Activitate Culturala-Judaica in Rândurile Evreimii Romane, 1995.

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Cu cu mei nü. Taibei Shi: Yao yue wen hua shi ye gu fen you xian gong si, 1998.

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Caṇmukatās, A. Pērāciriyar Cu. Vittiyān̲antan̲: Peraasiriyar Cu. Vithiyananthan. Kol̲umpu: Kumaran̲ Puttaka Illam, 2013.

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Zamfirescu, Ion. Întîlniri cu oameni, întîlniri cu viața. București: Editura Eminescu, 1990.

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Cu yin cha: Cu yin cha. Shenyang Shi: Chun feng wen yi chu ban she, 2003.

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Inc, White Pine Software, ed. Enhanced CU-SeeMe. New York: MIS:Press, 1996.

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Conversații cu--. [București]: Editura Universal Dalsi, 2004.

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Dumitriu, Petru. Pactul cu diavolul: Șase zile cu Petru Dumitriu. [Bucharest]: Editura Albatros, 1995.

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Hoàng, Nguyen Xuan. Bat cu lúc nào, bat cu o dâu. Midway City, CA: Nhà Xuat Ban Van, 1992.

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Ciulei, Liviu. Cu gândiri și cu imagini: With thoughts and images. București: Igloo Media, 2009.

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Book chapters on the topic "Cu"

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Lau, John H. "Cu-Cu Hybrid Bonding." In Chiplet Design and Heterogeneous Integration Packaging, 431–517. Singapore: Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-19-9917-8_6.

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Gooch, Jan W. "Cu." In Encyclopedic Dictionary of Polymers, 185. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_3167.

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Leung, Chi-Hung. "Arcing Contact Materials, Cu, Cu Alloy, and Cu-Refractory Composites." In Encyclopedia of Tribology, 95–97. Boston, MA: Springer US, 2013. http://dx.doi.org/10.1007/978-0-387-92897-5_395.

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Moritz, W. "5.8.8 Cu." In Physics of Solid Surfaces, 183–91. Berlin, Heidelberg: Springer Berlin Heidelberg, 2015. http://dx.doi.org/10.1007/978-3-662-47736-6_63.

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Macintyre, J. E. "Cu Copper." In Dictionary of Organometallic Compounds, 119–23. Boston, MA: Springer US, 1986. http://dx.doi.org/10.1007/978-1-4615-6847-6_14.

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Ross, Robert B. "Copper Cu." In Metallic Materials Specification Handbook, 94–170. Boston, MA: Springer US, 1992. http://dx.doi.org/10.1007/978-1-4615-3482-2_14.

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MacIntyre, Jane E. "Cu Copper." In Dictionary of Organometallic Compounds, 76–77. Boston, MA: Springer US, 1996. http://dx.doi.org/10.1007/978-1-4899-6848-7_15.

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Villars, P., K. Cenzual, J. Daams, R. Gladyshevskii, O. Shcherban, V. Dubenskyy, N. Melnichenko-Koblyuk, et al. "Cu[SCN]." In Landolt-Börnstein - Group III Condensed Matter, 665. Berlin, Heidelberg: Springer Berlin Heidelberg, 2008. http://dx.doi.org/10.1007/978-3-540-44752-8_556.

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Nagy, Zoltán. "Cu—Copper." In Electrochemical Synthesis of Inorganic Compounds, 97–107. Boston, MA: Springer US, 1985. http://dx.doi.org/10.1007/978-1-4899-0545-1_20.

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Macintyre, J. E., F. M. Daniel, D. J. Cardin, S. A. Cotton, R. J. Cross, A. G. Davies, R. S. Edmundson, et al. "Cu Copper." In Dictionary of Organometallic Compounds, 57–58. Boston, MA: Springer US, 1990. http://dx.doi.org/10.1007/978-1-4757-4966-3_15.

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Conference papers on the topic "Cu"

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Kagawa, Yoshihisa, Takumi Kamibayashi, Nobutoshi Fujii, Shunsuke Furuse, Taichi Yamada, Tomoyuki Hirano, and Hayato Iwamoto. "Cu-Cu Wiring: The Novel Structure of Cu-Cu Hybrid Bonding." In 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC). IEEE, 2023. http://dx.doi.org/10.1109/ectc51909.2023.00026.

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Song, Jenn-Ming, Chih-Hsun Chang, Jia-Shin Wu, Chih-Hang Tsai, and Shih-Yun Chen. "Cu to Cu bonding with Cu@Ag core-shell nanoparticles." In 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2012. http://dx.doi.org/10.1109/ltb-3d.2012.6238053.

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Jiang, Han, Stuart Robertson, Zhaoxia Zhou, and Changqing Liu. "Cu-Cu Bonding with Cu Nanowire Arrays for Electronics Integration." In 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE, 2020. http://dx.doi.org/10.1109/estc48849.2020.9229670.

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Liu, Hung-Che, A. M. Gusak, K. N. Tu, and Chih Chen. "Void ripening in Cu-Cu bonds." In 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2021. http://dx.doi.org/10.1109/ltb-3d53950.2021.9598384.

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Liu, Ziyu, Jian Cai, Qian Wang, Hai Jin, and Lin Tan. "Room temperature direct Cu-Cu bonding with ultrafine pitch Cu pads." In 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC). IEEE, 2015. http://dx.doi.org/10.1109/eptc.2015.7412312.

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Du, Li, Tielin Shi, Zirong Tang, and Guanglan Liao. "Reliable Cu-Cu Thermocompression Bonding by Low Temperature Sintered Cu Nanowires." In 2017 IEEE 67th Electronic Components and Technology Conference (ECTC). IEEE, 2017. http://dx.doi.org/10.1109/ectc.2017.33.

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Jourdan, N., O. Varela Pedreira, M. Vander Veen, C. Adelmann, S. Van Elshocht, and Z. Tokei. "Cu-Resistivity and Intrinsic EM-Reliability Study in Ta/Cu, Co/Cu and Ru/Cu Systems for Advanced BEOL Cu-Interconnections." In 2018 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2018. http://dx.doi.org/10.7567/ssdm.2018.g-6-03.

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Ratchev, Petar, Laureen Carbonell, Hong Meng Ho, Hugo Bender, Ingrid De Wolf, and Bert Verlinden. "Orientation Imaging Microscopy Applications in Cu- Interconnects and Cu-Cu Wire Bonding." In ISTFA 2002. ASM International, 2002. http://dx.doi.org/10.31399/asm.cp.istfa2002p0061.

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Abstract:
Abstract In this paper we described a technique which is not commonly used for failure analysis: Orientation Imaging Microscopy (OIM). We demonstrated that it offers unique opportunity for failure analysis of Cu bonding and interconnects. Additionally to its main application: texture analysis, it can also reveal early stages of oxidation of Cu bond pads and interconnects. A link has been made between oxidation and bondability. OIM can also show areas of the wire bond where the deformation concentrates due to the bonding process.
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Park, Hae-Sung, Han Kyeol Seo, and Sarah Eunkyung Kim. "Characterization of Nitride Passivated Cu Surface for Low-Temperature Cu-Cu Bonding." In 2019 International 3D Systems Integration Conference (3DIC). IEEE, 2019. http://dx.doi.org/10.1109/3dic48104.2019.9058774.

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Li, Junjie, Qi Liang, Chen Chen, Tielin Shi, Guanglan Liao, and Zirong Tang. "Cu-Cu Bonding by Low-Temperature Sintering of Self-Healable Cu Nanoparticles." In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE, 2019. http://dx.doi.org/10.1109/ectc.2019.00105.

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Reports on the topic "Cu"

1

Zhang S. Y. Estimate of Cu-Cu Run Experimental Background at Phobos. Office of Scientific and Technical Information (OSTI), February 2005. http://dx.doi.org/10.2172/1061777.

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Safta, Cosmin, Gianluca Geraci, Michael S. Eldred, Habib N. Najm, David Riegner, and Wolfgang Windl. Interatomic Potentials Models for Cu-Ni and Cu-Zr Alloys. Office of Scientific and Technical Information (OSTI), September 2018. http://dx.doi.org/10.2172/1475252.

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FEIBELMAN, PETER J. Formation and Diffusion of S-Decorated Cu Cluster on Cu(111). Office of Scientific and Technical Information (OSTI), November 2000. http://dx.doi.org/10.2172/767889.

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Reid, J. S., M. A. Nicolet, M. S. Angyal, D. Lilienfeld, Y. Shacham-Diamand, and P. M. Smith. Barrier/Cu contact resistivity. Office of Scientific and Technical Information (OSTI), October 1995. http://dx.doi.org/10.2172/119996.

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Need, Ryan F. Cu-Cr Literature Review. Office of Scientific and Technical Information (OSTI), August 2012. http://dx.doi.org/10.2172/1048824.

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Webb, Edmund Blackburn, III, and Xiao Wang Zhou. Atomically engineering Cu/Ta interfaces. Office of Scientific and Technical Information (OSTI), September 2007. http://dx.doi.org/10.2172/920464.

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Li, D., J. Pearson, J. E. Mattson, S. D. Bader, and P. D. Johnson. Photoemission study of quantum confinement by a finite barrier: Cu/Co(wedge)/Cu(100). Office of Scientific and Technical Information (OSTI), July 1994. http://dx.doi.org/10.2172/10194820.

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Maggard, Paul A. Photoelectrochemistry, Electronic Structure, and Bandgap Sizes of Semiconducting Cu(I)-Niobates and Cu(I)-Tantalates. Office of Scientific and Technical Information (OSTI), November 2013. http://dx.doi.org/10.2172/1105011.

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Verdier, M., M. Hawley, M. Nastasi, H. Kung, M. Niewczas, and J. D. Embury. Plastic behavior of Cu/Ni multilayers. Office of Scientific and Technical Information (OSTI), December 1998. http://dx.doi.org/10.2172/319824.

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Green, A., and D. Maceachern. Komatiite - Associated Ni - Cu - Pge Mineralization. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1991. http://dx.doi.org/10.4095/132296.

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