Log in

Relevant bibliographies by topics / Copper / Journal articles

To see the other types of publications on this topic, follow the link: Copper.

Journal articles on the topic 'Copper'

Author: Grafiati

Published: 4 June 2021

Last updated: 8 October 2024

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the top 50 journal articles for your research on the topic 'Copper.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Browse journal articles on a wide variety of disciplines and organise your bibliography correctly.

1

Honkanen, Mari, Minnamari Vippola, and Toivo Lepistö. "Oxidation of copper alloys studied by analytical transmission electron microscopy cross-sectional specimens." Journal of Materials Research 23, no. 5 (May 2008): 1350–57. http://dx.doi.org/10.1557/jmr.2008.0160.

Full text

Abstract:

In this work, the oxide structures of three polycrystalline copper grades, unalloyed oxygen-free (OF) copper and alloyed CuAg and deoxidized high-phosphor (DHP) copper, were studied using cross-sectional analytical transmission electron microscopy (AEM) samples. The oxidation treatments were carried out in air at 200 and 350 °C for different exposure times. The detailed oxide layer structures were characterized by AEM. At 200 °C, a nano-sized Cu2O layer formed on the all copper grades. At 350 °C, a nano-sized Cu2O layer formed first on the all copper grades. After longer exposure time at 350 °C, a crystalline CuO layer grew on the Cu2O layer of the unalloyed OF-copper. In the case of the alloyed CuAg- and DHP-copper, a crystalline and columnar shaped layer, consisting of Cu2O and CuO grains, formed on the nanocrystalline Cu2O layer. At 350 °C, the unalloyed copper oxidized notably slower than the alloyed coppers, and its oxide structures were different than those of the alloyed coppers.

APA, Harvard, Vancouver, ISO, and other styles

2

Xu, Xiaowei, Jing Hua, Houhu Zhang, Zehua Zhao, Yi Wang, Dapeng Zhang, Jun Zhang, and Xiaoxi Chen. "Environmental Risk Assessment of Recycled Products of Spent Coppery Etchant in Jiangsu Province, China." International Journal of Environmental Research and Public Health 18, no. 15 (July 26, 2021): 7881. http://dx.doi.org/10.3390/ijerph18157881.

Full text

Abstract:

With the vigorous development of the 5G industry, the characteristic hazardous waste, spent coppery etchant, was also produced in large quantities. In recent years, there are many companies that have begun to collect spent coppery etchant for the purpose of producing recycled products, such as copper sulfate, copper oxide, basic copper chloride, and copper powder, which often contain large amounts of heavy metals. However, due to the lack of relevant standards and applicable regulatory measures, some of the recycled products flow to the feed processing industry and even to the food processing industry. This study investigated the pollution status of heavy metals in recycled products of spent coppery etchant and evaluated the impact of recycled products exposure on human health. The results showed that the content of Zn was the highest, which was 21 times higher than the corresponding standard limit. Human health risk assessment indicated that the hazard quotients of As account for 87.5% of the entire HI value, while the average carcinogenic risk values of As for copper sulfate, copper oxide, basic copper chloride, and copper powder are 1.09 × 10−5, 3.19 × 10−5, 1.29 × 10−5, 7.94 × 10−6, respectively. Meanwhile, suggestions on the supervision of recycled products and the concentration limits of heavy metals in recycled products were put forward.

APA, Harvard, Vancouver, ISO, and other styles

3

Lalancette, N., and K. A. McFarland. "Phytotoxicity of Copper-Based Bactericides to Peach and Nectarine." Plant Disease 91, no. 9 (September 2007): 1122–30. http://dx.doi.org/10.1094/pdis-91-9-1122.

Full text

Abstract:

Organometallic copper, consisting of a mixture of copper abietate, copper linoleate, and copper oleate (CuALO), is important for postbloom management of bacterial spot in New Jersey peach and nectarine orchards. Rotation of CuALO with oxytetracycline reduces cost and helps prevent (or delay) resistant organisms. However, because copper is also phytotoxic, higher rates and inorganic coppers have not been utilized. A study was conducted on ‘Encore’ peach and ‘Redgold’ nectarine to determine the quantitative relationship between copper concentration (metallic equivalent) and phytotoxicity. Different rates of CuALO and copper hydroxide (CuOH) were applied seven times postbloom. Foliar injury and defoliation increased with number of applications and copper concentration. Maximum ‘Encore’ defoliation was 10 to 17%, while ‘Redgold’ sustained 30 to 35% leaf loss. CuOH caused similar or less leaf injury and defoliation than CuALO. No injury was observed on fruit, even at three times the labeled metallic copper rate of CuALO. Fruit size and soluble solids were not influenced by copper. Estimates of foliar density and tree volume indicated that sufficient photosynthetic capacity existed to allow acceptable leaf damage and loss from copper applications. These results showed that inorganic coppers may be viable alternatives to organometallic copper for postbloom bacterial spot control; nectarine may be more sensitive to copper injury than peach; and higher rates of metallic copper, above the current commercial rate, can be applied to peach. In the latter case, greater amounts of copper may provide longer residual activity and improved bacterial spot control on highly susceptible cultivars.

APA, Harvard, Vancouver, ISO, and other styles

4

Carrillo, F., J. Martínez, R. Barrios, and A. Roselló. "Kinetics of the conversion of copper sulfide to blister copper." Revista de Metalurgia 38, no. 5 (October 30, 2002): 334–38. http://dx.doi.org/10.3989/revmetalm.2002.v38.i5.416.

Full text

APA, Harvard, Vancouver, ISO, and other styles

5

Cooper, H. Kory, Garett Hunt, Nicholas Waber, and Carey Gray. "Precontact Native Copper Innovation in British Columbia." Canadian Journal of Archaeology 44, no. 2 (2020): 185–22. http://dx.doi.org/10.51270/44.2.185.

Full text

Abstract:

Copper has figured prominently in discussions of social complexity among Northwest Coast Cultures. Coppers, shield-like sheets of copper variable in size, were a form of lineage wealth displayed, gifted, or ritually destroyed at potlatches; and copper artifacts have been recovered from human burials. The former use of copper is well-documented ethnographically and historically while the latter phenomenon is less well understood. This paper provides an overview of the occurrence of copper in precontact archaeological contexts in British Columbia using published and unpublished literature. Our investigation is framed within a Behavioral Archaeology approach that elicits ideas on copper innovation and all that it entailed. We find that copper is rare in precontact contexts from a province-wide perspective; there was likely more than one instance of native copper innovation; and contrary to previous suggestions, the copper-rich Dene region of south-central Alaska and southwestern Yukon cannot account for most of the precontact examples of copper use in the province. We offer some hypotheses to explain the precontact distribution of copper in BC, including both local invention and diffusion, not in an attempt to deliver the final verdict on this topic, but rather, to stimulate additional research.

APA, Harvard, Vancouver, ISO, and other styles

6

Zhang, Jing, Jie Wang, Yong Gao, Yaocheng Hu, Yupeng Xie, Zhiming You, and Sheng Wang. "Influence of Film Coating Thickness on Secondary Electron Emission Characteristics of Non-Evaporable Getter Ti-Hf-V-Zr Coated Open-Cell Copper Foam Substrates." Materials 15, no. 6 (March 16, 2022): 2185. http://dx.doi.org/10.3390/ma15062185.

Full text

Abstract:

The application of vacuum materials with low secondary electron yield (SEY) is one of the effective methods to mitigate the electron cloud (EC). In this study, the Ti-Hf-V-Zr non-evaporable getter (NEG) film was deposited on open-cell copper foams with different pore sizes for the suppression of electron multipacting effects. Besides, the influence of the film thickness on the secondary electron emission (SEE) characteristics of Ti-Hf-V-Zr NEG film-coated open-cell copper foam substrates was investigated for the first time. The results highlighted that all uncoated and NEG-coated foamed porous copper substrates achieved a low SEY (<1.2), which reduced at least 40% compared to the traditional copper plates, and the foamed porous coppers with 1.34-μm-thick NEG coating had the lowest SEY. Moreover, the surface chemistry and the morphological and structural properties of foamed porous coppers of different pore sizes with and without Ti-Hf-V-Zr NEG films were systematically analyzed.

APA, Harvard, Vancouver, ISO, and other styles

7

Chang, Chao Cheng, and Teng Chiao Wang. "Effects of Grain Size on Micro Backward Extrusion of Copper." Advanced Materials Research 83-86 (December 2009): 1092–98. http://dx.doi.org/10.4028/www.scientific.net/amr.83-86.1092.

Full text

Abstract:

This study investigates the effects of grain size on the micro backward extrusion of copper cups. An equal channel angular extrusion (ECAE) technique was applied to refine the grain size in copper. Commercial available copper was annealed, deformed by six-pass ECAE at room temperature and then heat treated to obtain a microstructure with a grain size of about 4μm. Microstructure was examined and mechanical properties including hardness and stress-strain relationship were also investigated. The processed copper was then used in a micro backward extrusion of cups with the diameter of 3 mm and the wall thickness of 0.1 mm. The extruded cups were compared with those resulting from the coppers with larger grain size prepared by different heat treated processes. This study shows that the quality of the micro extruded cup increases as the grain size decreases. By using the refine-grained coppers for the micro backward extrusion, the cups with even rim height and uniform wall thickness can be easily produced.

APA, Harvard, Vancouver, ISO, and other styles

8

Ilca, Dacian, Tiberiu Manescu, Gilbert-Rainer Gillich, Zeno-Iosif Praisach, and Cristian Tufisi. "Determination of proper parameters for ultrasonic welding of copper plate with copper wire strands." Vibroengineering Procedia 51 (October 20, 2023): 167–72. http://dx.doi.org/10.21595/vp.2023.23680.

Full text

Abstract:

Ultrasonic welding parameters originally provided by the components supplier caused negative pull/peel tension results. In this paper, we present a method to find the optimal parameters for the ultrasonic welding of copper elements. These elements represent components inside an electrical harness from automotive industry: coper plate and copper wire strands. The design of experiments (DoE) was used as a method within the Six Sigma approach. We succeeded in obtaining welding parameters that ensure successfully passing the pull/peel tension test.

APA, Harvard, Vancouver, ISO, and other styles

9

Lee, Hyun-Ju, Chang-Wook Ji, Sung-Min Woo, Man-Ho Choi, Yoon-Hwae Hwang, Jae-Ho Lee, and Yang-Do Kim. "Formation of Copper Seed Layers and Copper Via Filling with Various Additives." Korean Journal of Materials Research 22, no. 7 (July 27, 2012): 335–41. http://dx.doi.org/10.3740/mrsk.2012.22.7.335.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Chen, Hao, Jin Hui Li, and Mi Song Chen. "Effect of Rare Earth on Microstructure and Property of Refining Impure-Copper." Advanced Materials Research 189-193 (February 2011): 3982–85. http://dx.doi.org/10.4028/www.scientific.net/amr.189-193.3982.

Full text

Abstract:

The self-prepared Cu-RE refining agents were used to refine impure-copper. The influences of RE elements on refinements and structures were studied and the mechanism of RE was discussed. The results show that by adding proper amounts of Cu-RE refining agents into impure-coppers, the refinements of RE on impure-coppers are perfect. Furthermore, the dendrites of the RE-refined ingot are refined and the structure becomes more homogeneous, leading that the electric conduction function and mechanics function of impure-copper have been improved.

APA, Harvard, Vancouver, ISO, and other styles

11

Sakurai, T. "Anaerobic reactions of Rhus vernicifera laccase and its type-2 copper-depleted derivatives with hexacyanoferrate(II)." Biochemical Journal 284, no. 3 (June 15, 1992): 681–85. http://dx.doi.org/10.1042/bj2840681.

Full text

Abstract:

Anaerobic reactions of Rhus vernicifera laccase and its type-2 copper-depleted derivatives with hexacyanoferrate(II) were investigated by absorption and e.s.r. spectroscopy. When native laccase was treated with excess hexacyanoferrate(II), the type-1 and type-2 coppers were immediately reduced and the e.s.r. signal due to type-3 copper was transiently observed. After incubation, a novel e.s.r. signal (g parallel = 2.31, g perpendicular = 2.08) developed together with the type-1 copper signal. Only the novel e.s.r. signal was left after the sample had been treated with ascorbate. In the corresponding absorption spectrum, a new band was observed at around 490 nm. A similar new e.s.r. signal did not appear for the type-2-copper-depleted (T2D) laccase, in which the type-3 copper had been reduced during the procedure to deplete the type-2 copper. On the other hand, the novel e.s.r. signal emerged when the type-3 copper in T2D laccase had been previously reoxidized with H2O2. The novel e.s.r. signal was not significantly saturated even by 200 mV microwave power at 4 K. Quantitative estimations and a small molecule study for CuII-FeII(CN)6 and CuII-FeIII(CN)6 systems suggested that the novel e.s.r. signal corresponds to some sort of adduct involving the type-3 copper and hexacyanoferrate(II).

APA, Harvard, Vancouver, ISO, and other styles

12

Lau, J., R. Subrahmanyan, D. Rice, S. Erasmus, and C. Li. "Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy Substrate." Journal of Electronic Packaging 113, no. 2 (June 1, 1991): 138–48. http://dx.doi.org/10.1115/1.2905379.

Full text

Abstract:

Thermal stresses and strains in the solder joints and plated-through-hole (PTH) copper pads/barrels of a pin-grid array (PGA) assembly under thermal cycling conditions have been determined in the present study. There are two major systems of thermal stresses/strains acting at the solder joint and copper. One is the transverse shear and vertical normal stress/strain due to the local thermal expansion mismatch between the pin, solder, copper, and FR-4. The other is the horizontal normal stress/strain due to the global thermal expansion mismatch between the ceramic PGA and the FR-4 printed circuit board (PCB). The effects of the local thermal expansion mismatch on the reliability of solder joint and PTH copper have been determined using a 3-D orthotropic-elastoplastic finite element method. The effects of the global thermal expansion mismatch on the reliability of solder joint and PTH copper have been determined by fatigue experiments. Fatigue life of the solder joint and PTH copper was then estimated based on the calculated strains and the fatigue data on solders and coppers.

APA, Harvard, Vancouver, ISO, and other styles

13

Dong, Caihong, Wei Feng, Wenwen Xu, Luodan Yu, Huiijng Xiang, Yu Chen, and Jianqiao Zhou. "The Coppery Age: Copper (Cu)‐Involved Nanotheranostics." Advanced Science 7, no. 21 (August 16, 2020): 2001549. http://dx.doi.org/10.1002/advs.202001549.

Full text

APA, Harvard, Vancouver, ISO, and other styles

14

Prekrasna, Ie P. "Copper resistant strain Candida tropicalis RomCu5 interaction with soluble and insoluble copper compounds." Biotechnologia acta 8, no. 5 (2015): 93–102. http://dx.doi.org/10.15407/biotech8.05.093.

Full text

APA, Harvard, Vancouver, ISO, and other styles

15

Hofer, Ursula. "Good copper, bad copper." Nature Reviews Microbiology 11, no. 5 (March 25, 2013): 299. http://dx.doi.org/10.1038/nrmicro3013.

Full text

APA, Harvard, Vancouver, ISO, and other styles

16

Murphy, Michael. "Copper and copper alloys." Metal Finishing 95, no. 2 (February 1997): 24. http://dx.doi.org/10.1016/s0026-0576(97)94205-7.

Full text

APA, Harvard, Vancouver, ISO, and other styles

17

Rak, P., and R. Bureš. "Copper and copper patina." Koroze a ochrana materialu 61, no. 3 (July 26, 2017): 118–22. http://dx.doi.org/10.1515/kom-2017-0014.

Full text

Abstract:

AbstractThis article is aimed at summarizing knowledge about copper and patina that is formed on the surface of copper. The article describes chemical processes in patina formation and explains the difference between natural and artificial patina, as well as some methods used in the investigation of patina such as XRD analysis, EIS analysis, Raman spectroscopy

APA, Harvard, Vancouver, ISO, and other styles

18

Jiang, Yao, Jing Tao Wang, Yue Wang, and Jian Yin. "Investigation on Grain Size Effect of Rolling Texture in Copper." Materials Science Forum 850 (March 2016): 857–63. http://dx.doi.org/10.4028/www.scientific.net/msf.850.857.

Full text

Abstract:

Cold rolling (CR) was conducted on coarse grained (CG) and ultrafine-grained (UFG) coppers, obtained by 1 and 8 passes in the equal channel angel pressing (ECAP), to investigate the effect of grain size on rolling texture. The microstructure was refined to UFG (~420 nm) with the ECAP pass increased to 8, while only band-like CG microstructure was observed in the 1 pass processed copper. The influence of the texture before CR could be excluded as the crystallographic texture kept similar for different ECAP pass. Pole figures (PFs) showed that the shear texture introduced by ECAP was replaced by rolling texture after CR. Furthermore, the rolling texture was a kind of classical copper-type for the CG copper, while a brass-type rolling texture was observed in the UFG copper. TEM results confirmed that the deformation nanotwins were only observed in the UFG copper, while the microstructure of CG copper was further compressed and subdivided. It indicated that the observed differences in rolling texture component and density might be contributed to the grain size effect which resulted in different deformation mechanism and grain subdivision behavior.

APA, Harvard, Vancouver, ISO, and other styles

19

Li, Yang, Hua Qing Xie, Ji Feng Wang, and Wei Yu. "Study on the Preparation and Properties of Copper Nanoparticles and their Nanofluids." Advanced Materials Research 399-401 (November 2011): 606–9. http://dx.doi.org/10.4028/www.scientific.net/amr.399-401.606.

Full text

Abstract:

Nanoscale copper particles were synthesized by chemical reduction with polyvinyl pyrrolidone as dispersant, ascorbic acid as reduction agent, copper sulfate pentahydrate and ammonia as reagent. X-ray diffraction (XRD) analysis revealed that as-prepared copper nanoparticle was well crystallized without other impurities. Transmission electron microscopy (TEM) displayed that nanoscale coppers had homogenous distribution and the particle size was about 30~50 nm. Uniform and stable Cu-nanofluids were prepared by general stirring, high speed shear stirring and ultrasonic, with water/ethylene glycol as base fluid and as-synthesized copper nanoparticles as additives. The thermal conductivity of Cu-nanofluid was measured by a short-hot wire method. The results showed that the thermal conductivity of Cu-nanofluid was increased 8~9% compared to base fluid and the temperature had little effect on the enhancement of the thermal conductivity.

APA, Harvard, Vancouver, ISO, and other styles

20

Liu, Huan Chao, Xin Ying Teng, Wei Bing Wu, Zhen Xiao, Xiang Wei Wu, and Jin Feng Leng. "Effects of Rare Earth Y Addition on Microstructural and Properties of Pure Copper." Materials Science Forum 913 (February 2018): 862–69. http://dx.doi.org/10.4028/www.scientific.net/msf.913.862.

Full text

Abstract:

The effects of rare earth Y addition on microstructure and properties of pure copper were investigated. Mechanical test, electrical test, oxidation resistance test, metalloscope, scanning electronic microscope (SEM) and X-ray difffraction (XRD) were performed to study the properties, microstructure and constitution. The results showed that both the hardness and antioxidant properties obviously increased with the increase of Y, confirmed the successful refinement role of Y. A small amount of Y (less than 0.5 wt.%) could improve the electrical conductivity of pure copper. When the Y content reached 0.2 wt.%, pure coppers obtained optimum electrical conductivity which is 96.8% IACS. However, over-added Y (>0.5 wt.%) resulted in second phase of Cu7Y coarsening and non-homogeneous microstructures forming, which reduces the conductivity of copper. In addition, Y can effectively purify the organization of molten copper.

APA, Harvard, Vancouver, ISO, and other styles

21

Farquhar, R. M., R. G. V. Hancock, and L. A. Pavlish. "Lead isotope ratios in 16th century copperware traded to North America: the Swedish connection." Canadian Journal of Physics 96, no. 4 (April 2018): 438–44. http://dx.doi.org/10.1139/cjp-2017-0117.

Full text

Abstract:

Isotope analyses have been made on the trace amounts of lead in a small set of late 16th century pure copper trade kettles and kettle debris from Indigenous sites in eastern Canada. The isotope ratios are highly correlated. We interpret these correlations as the mixing of copper from Precambrian Swedish ores with metal from one or more of the Palaeozoic deposits occurring in central Europe and the British Isles. The data enable us to identify samples of pure Swedish copper, metal consisting of mixtures of Swedish and central European – British copper, and with less certainty, samples derived entirely from the latter deposits. Although most of the trace element concentrations in the coppers are quite variable, it appears that nickel values may be less so (∼100 ppm in pure Swedish samples, and ∼1100 ppm in the central European – British sources). Based on these values, two-component mixing relations provide estimates of the fractions of Swedish end members in mixed samples. These results suggest that more than half of the copper used in forming the kettles originated in Sweden.

APA, Harvard, Vancouver, ISO, and other styles

22

Amarnath, Veeraswamy, Palaniswamy Karuppusamy, and Chinnasamy Rajendran. "Tensile and microstructural behavior of gas tungsten arc welded electrolytic tough pitch copper joints." Emerging Materials Research 12, no. 3 (September 1, 2023): 1–8. http://dx.doi.org/10.1680/jemmr.23.00012.

Full text

Abstract:

Electrolytic Tough Pitch (ETP) copper is extensively used in the manufacturing of electrical machines and automobiles. Compared to other pure coppers, ETP copper has lower weldability. Therefore, this study analyzes the weldability of ETP copper using the Gas Tungsten Arc Welding (GTAW) process. GTAW can be performed using Constant Current (CC) and Pulsed Current (PC) modes. Consequently, the properties of the joints fabricated using both modes are compared and analyzed in this study. The results show that the joint efficiencies of GTAW-CC and GTAW-PC joints are 81% and 89%, respectively. The optimal heat input and pulsating action in pulsed current mode produce refined grains in the weld zone and heat-affected zone, resulting in higher joint efficiency.

APA, Harvard, Vancouver, ISO, and other styles

23

Rubilar, Olga, Mahendra Rai, Gonzalo Tortella, Maria Cristina Diez, Amedea B. Seabra, and Nelson Durán. "Biogenic nanoparticles: copper, copper oxides, copper sulphides, complex copper nanostructures and their applications." Biotechnology Letters 35, no. 9 (May 21, 2013): 1365–75. http://dx.doi.org/10.1007/s10529-013-1239-x.

Full text

APA, Harvard, Vancouver, ISO, and other styles

24

García, V. G., Jose María Cabrera, and Jose Manuel Prado. "Effects of Precipitation during Dynamic Recrystallization of Copper with Different Oxygen Levels." Materials Science Forum 558-559 (October 2007): 511–16. http://dx.doi.org/10.4028/www.scientific.net/msf.558-559.511.

Full text

Abstract:

Previous research works assert that the observed increase in hot flow stress of commercially pure copper is attributed to the interactions between solute atoms and dislocations, specifically by interstitial oxygen. This work shows TEM images of the formation of Cu2O precipitates after warm working temperatures that in part help explain the increase of stress during hot compression of 99.9% pure copper. Three commercially pure large-grained coppers with 26, 46 and 62ppm of oxygen were tested at different temperatures (600°C-950°C) and strain rates (0.3s-1- 0.001s-1). At temperatures below 850°C, the stress differences between coppers, tested at same the strain rate, became increasingly higher. A correlation between stress increase and oxygen content was found. Precipitation of nanometric Cu2O did not show any difference in dynamically recrystallized grain size; however hardness tests showed that the final properties were modified. This work discusses the effect precipitation of Cu2O has on the hot flow curve and the final microstructure of hot formed 99.9% pure copper with different oxygen levels.

APA, Harvard, Vancouver, ISO, and other styles

25

Ma, Shi De, Xia Zhao, Hong Ren Wang, and Ji Zhou Duan. "Research on the Antifouling Mechanisms of Copper and its Alloys." Advanced Materials Research 79-82 (August 2009): 2179–82. http://dx.doi.org/10.4028/www.scientific.net/amr.79-82.2179.

Full text

Abstract:

In this paper, the in-situ exposure tests of 15 kinds of copper and its alloys were carried out in seawater at Zhanjiang Harbor for 12 months in order to study their anti-fouling abilities and anti-corrosion properties. In the same way, the in-situ anti-fouling tests of copper and bronze were performed in Qingdao for 8 years. Successively, the anti-fouling properties were analyzed combining with the electrochemical process of copper alloy corrosion and biology process of the adhesion. The chemical, physical and biological factors influencing the fouling properties of copper alloys were also investigated. The results showed that the coppers can equip themselves with antifouling performance by producing some toxic substances during the processes of chemical and electrochemical reaction. In addition, the antifouling ability was proved to relate to the exfoliation effect, which was the result of interaction between stain layer adhesion and spalling force of the attachments.

APA, Harvard, Vancouver, ISO, and other styles

26

Crisan, Michaela Corina, Mocan Teodora, and Mocan Lucian. "Copper Nanoparticles: Synthesis and Characterization, Physiology, Toxicity and Antimicrobial Applications." Applied Sciences 12, no. 1 (December 24, 2021): 141. http://dx.doi.org/10.3390/app12010141.

Full text

Abstract:

Metallic nanoparticles are a new class of materials with applications in medicine, pharmaceutical and agriculture. Using biological, chemical and physical approaches, nanoparticles with amazing properties are obtained. Copper is one of the most-found elements and plays an important part in the normal functioning of organisms. Coper nanoparticles have superior antibacterial properties when comparing them to present day antibiotics. Moreover, apart from their antibacterial role, antifungal, antiviral and anticancer properties have been described. Although the mechanism of actions is not completely understood, copper nanoparticles can become a viable alternative in fighting multi-resistant bacteria strains. We hereby review the already existing data on copper nanoparticle synthesis, effects and mechanisms of action as well as toxicity.

APA, Harvard, Vancouver, ISO, and other styles

27

Kim, Su Jae, Seonghoon Kim, Jegon Lee, Yongjae Jo, Yu‐Seong Seo, Myounghoon Lee, Yousil Lee, et al. "Color of Copper/Copper Oxide." Advanced Materials 33, no. 15 (March 9, 2021): 2007345. http://dx.doi.org/10.1002/adma.202007345.

Full text

APA, Harvard, Vancouver, ISO, and other styles

28

Dixon, S. N. "Copper prestrip to copper cyanide." CIM Journal 8, no. 1 (January 15, 2017): 19–24. http://dx.doi.org/10.15834/cimj.2017.7.

Full text

APA, Harvard, Vancouver, ISO, and other styles

29

Camurri, C., M. Lopez, R. Fernandez, and V. Osorio. "Copper welding with copper filler." Welding International 10, no. 5 (January 1996): 387–89. http://dx.doi.org/10.1080/09507119609549014.

Full text

APA, Harvard, Vancouver, ISO, and other styles

30

Li, S., X. Miao, D. Zhu, L. Ni, C. Sun, and L. Wang. "Copper Release from Copper Tableware." Bulletin of Environmental Contamination and Toxicology 70, no. 5 (May 1, 2003): 905–12. http://dx.doi.org/10.1007/s00128-003-0068-3.

Full text

APA, Harvard, Vancouver, ISO, and other styles

31

Babinets, A. A., I. O. Ryabtsev, I. P. Lentyugov, I. I. Ryabtsev, Yu V. Demchenko, and A. I. Panfilov. "Problems and prospects of surfacing of copper and copper parts by wear-resistant layers (Review)." Paton Welding Journal 2020, no. 5 (May 28, 2020): 15–23. http://dx.doi.org/10.37434/tpwj2020.05.03.

Full text

APA, Harvard, Vancouver, ISO, and other styles

32

Frost, Ray L., Peter A. Williams, J. Theo Kloprogge, and Wayde Martens. "Raman spectroscopy of the copper chloride minerals nantokite, eriochalcite and claringbullite - implications for copper corrosion." Neues Jahrbuch für Mineralogie - Monatshefte 2003, no. 10 (September 15, 2003): 433–45. http://dx.doi.org/10.1127/0028-3649/2003/2003-0433.

Full text

APA, Harvard, Vancouver, ISO, and other styles

33

Yarykin, N. A., and J. Weber. "Identification of copper-copper and copper-hydrogen complexes in silicon." Semiconductors 47, no. 2 (February 2013): 275–78. http://dx.doi.org/10.1134/s1063782613020231.

Full text

APA, Harvard, Vancouver, ISO, and other styles

34

Haendler, H. M. "Copper quinaldinate monohydrate [aquabis(2-quinolinecarboxylato)copper(II)]; pentacoordinate copper." Acta Crystallographica Section C Crystal Structure Communications 42, no. 2 (February 15, 1986): 147–49. http://dx.doi.org/10.1107/s0108270186096981.

Full text

APA, Harvard, Vancouver, ISO, and other styles

35

Nugmanov, Mazilkin, Hahn, and Ivanisenko. "Structure and Tensile Strength of Pure Cu after High Pressure Torsion Extrusion." Metals 9, no. 10 (October 7, 2019): 1081. http://dx.doi.org/10.3390/met9101081.

Full text

Abstract:

The microstructure and mechanical properties of rod-shaped samples (measuring 11.8 mm in diameter and 35 mm in length) of commercially pure (CP) copper were characterized after they were processed by high pressure torsion extrusion (HPTE). During HPTE, CP copper was subjected to extremely high strains, ranging from 5.2 at central area of the sample to 22.4 at its edge. This high but varying strain across the sample section resulted in HPTE copper displaying a gradient structure, consisting of fine grains in the central area and of ultrafine grains both in the middle-radius area and at the sample edge. A detailed analysis of the tensile characteristics showed that the strength of HPTE copper with its gradient structure is similar to that of copper after severe plastic deformation (SPD) techniques, typically displaying a homogeneous structure. Detailed analysis of the contributions of various strengthening mechanisms to the overall strength of HPTE coper revealed the following: The main contribution comes from Hall–Petch strengthening due to the presence of high and low angle grain boundaries in gradient structure, which act as effective obstacles to dislocation motion. Therefore, both types of boundaries should be taken into account in the Hall–Petch equation. This study on CP copper demonstrated the potential of using the HPTE method for producing high-strength metallic materials in bulk form for industrial use.

APA, Harvard, Vancouver, ISO, and other styles

36

Eckert, G. E., L. W. Greene, G. E. Carstens, and W. S. Ramsey. "Copper status of ewes fed increasing amounts of copper from copper sulfate or copper proteinate." Journal of Animal Science 77, no. 1 (1999): 244. http://dx.doi.org/10.2527/1999.771244x.

Full text

APA, Harvard, Vancouver, ISO, and other styles

37

Chang, Chao Cheng, and Wu Lu Kuo. "Effects of Temperature and Grain Refinement on Micro Simple Upsetting of Copper." Key Engineering Materials 450 (November 2010): 149–52. http://dx.doi.org/10.4028/www.scientific.net/kem.450.149.

Full text

Abstract:

This study uses simple upsetting processes of copper to investigate the effects of temperature and grain refinement on stress-strain behaviour. The equal channel angular extrusion (ECAE) and heat treatment techniques were applied to refine and control the grain size of copper in a range between 4 m and 46 m. The coppers were then machined to prepare the billets with 2 mm diameter and 3 mm height. To conduct the upsetting processes at elevated temperature, a forming system equipped with a heating device was also developed. The experimental results show that the copper billets with refined grains have higher strength than those with coarse grains prepared by annealing treatments. The grain refinement and the increase in forming temperature can improve material flow behaviors and thus lead to a better edge quality of the deformed workpiece.

APA, Harvard, Vancouver, ISO, and other styles

38

Collins, James F., and Leslie M. Klevay. "Copper." Advances in Nutrition 2, no. 6 (November 1, 2011): 520–22. http://dx.doi.org/10.3945/an.111.001222.

Full text

APA, Harvard, Vancouver, ISO, and other styles

39

Coles, Martyn P. "Copper." Annual Reports Section "A" (Inorganic Chemistry) 108 (2012): 220. http://dx.doi.org/10.1039/c2ic90022j.

Full text

APA, Harvard, Vancouver, ISO, and other styles

40

Escarzaga, E. "Copper." IEEE Potentials 17, no. 1 (1998): 19–22. http://dx.doi.org/10.1109/45.652852.

Full text

APA, Harvard, Vancouver, ISO, and other styles

41

Smith, Derek W. "Copper." Annual Reports Section "A" (Inorganic Chemistry) 102 (2006): 253. http://dx.doi.org/10.1039/b514789c.

Full text

APA, Harvard, Vancouver, ISO, and other styles

42

JOHNSON, MARY ANN, and SANDRA E. KAYS. "Copper." Nutrition Today 25, no. 1 (January 1990): 6–14. http://dx.doi.org/10.1097/00017285-199001000-00003.

Full text

APA, Harvard, Vancouver, ISO, and other styles

43

Bradberry, Sally. "Copper." Medicine 35, no. 11 (November 2007): 608. http://dx.doi.org/10.1016/j.mpmed.2007.08.018.

Full text

APA, Harvard, Vancouver, ISO, and other styles

44

Young, Jay A. "Copper." Journal of Chemical Education 83, no. 10 (October 2006): 1460. http://dx.doi.org/10.1021/ed083p1460.

Full text

APA, Harvard, Vancouver, ISO, and other styles

45

Duncan, Adam. "Copper." In Practice 19, no. 9 (October 1997): 503. http://dx.doi.org/10.1136/inpract.19.9.503.

Full text

APA, Harvard, Vancouver, ISO, and other styles

46

Murphy, Michael. "Copper." Metal Finishing 94, no. 2 (February 1996): 32–35. http://dx.doi.org/10.1016/s0026-0576(96)93846-5.

Full text

APA, Harvard, Vancouver, ISO, and other styles

47

WHITESIDES, GEORGE M. "COPPER." Chemical & Engineering News 81, no. 36 (September 8, 2003): 84. http://dx.doi.org/10.1021/cen-v081n036.p084.

Full text

APA, Harvard, Vancouver, ISO, and other styles

48

Murphy, Michael. "Copper." Metal Finishing 95, no. 2 (February 1997): 36. http://dx.doi.org/10.1016/s0026-0576(97)94215-x.

Full text

APA, Harvard, Vancouver, ISO, and other styles

49

Jacobs, Peter, and Lucille Wood. "Copper." Disease-a-Month 49, no. 10 (October 2003): 589–600. http://dx.doi.org/10.1016/j.disamonth.2003.08.002.

Full text

APA, Harvard, Vancouver, ISO, and other styles

50

Kompoliti, K. "Copper." Journal of the Neurological Sciences 357 (October 2015): e478. http://dx.doi.org/10.1016/j.jns.2015.09.221.

Full text

APA, Harvard, Vancouver, ISO, and other styles

We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!