Journal articles: 'Copper-plate'

1

Jiang, Weiyu, Lili Sun, Jijin Mao, Donghui Zhang, and A. Levtsev. "Study on Heat Transfer Performance of Non-integral Capillary Core Sintered Uniform Plate." Bulletin of Science and Practice 7, no. 5 (May 15, 2021): 292–301. http://dx.doi.org/10.33619/2414-2948/66/28.

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This paper mainly introduces the sintering process of the monolithic capillary wick and analyzes the influence of different copper powder particle size, filling rate, copper powder shape and heat source size on the heat transfer performance of the isothermal plate. The experimental results show that: (1) For the isothermal plate sintered with spherical copper powder, the capillary force of large particle size copper powder is small, but the flow resistance is also small, and the performance of the isothermal plate sintered with large particle size copper powder is better. (2) In the case of low filling rate, the isothermal plate is dried due to insufficient return fluid. In the case of high filling rate, on the one hand, the thickness of the liquid film at the evaporation end of the isothermal plate is large, resulting in additional thermal resistance. On the other hand, the thin film evaporation mode will be transformed into pool boiling mode, which will reduce the heat transfer performance. (3) Spherical copper powder sintered plate with regular shape has the best performance, while dendritic copper powder sintered plate has relatively high thermal resistance. (4) The heat source area has a great influence on the thermal resistance of the plate. Under the same heating power, the thermal resistance of the small area heat source is much higher than that of the large area heat source; The thermal resistance of sintered copper plate is lower than that of pure copper plate under two heat source areas.

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Chen, Qiang, Shan Li, Ying Luo, and Wen Long Lu. "Parameters Research of Precise Straightening Process in Roll Straightener." Advanced Materials Research 1095 (March 2015): 800–803. http://dx.doi.org/10.4028/www.scientific.net/amr.1095.800.

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Refined copper to obtain high quality can use the electrolytic method; the copper cathode plate is applied to the electrochemical machining. In order to make copper cathode plate has high flatness, assuring electrolytic cell cathode and anode plate spacing, so that the purity of copper electrolysis precipitation is higher, so change the straightening plate method has become the urgent task of the enterprise. Through the computer simulation, the ANSYS/LS-DYNA computer optimization, analysis precise straightening device parameters, in ensuring the copper starting sheet straightening can meet basic factories requirements, improve the machining precise straightening machine and copper starting sheet straightening efficiency.

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HANASAKA, Takao, Kowashi WATANABE, Shigeru YOKOUCHI, Yuuzo NIIOKA, and Suck Hee BE. "Outgassing Rate of Beryllium-copper Plate and Alumina Plate." SHINKU 36, no. 3 (1993): 230–33. http://dx.doi.org/10.3131/jvsj.36.230.

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Andriy Borysovych Grigorov, Kyryl Volodymyrovych Shevchenko, and Irina Valeriivna Sinkevich. "INVESTIGATION OF CORROSIVE EFFECT ON METAL OF A BROAD FUEL FRACTION OBTAINED FROM SECONDARY POLYMER RAW MATERIAL." Bulletin of the National Technical University "KhPI". Series: Chemistry, Chemical Technology and Ecology, no. 2 (4) (July 28, 2022): 75–79. http://dx.doi.org/10.20998/2079-0821.2020.02.10.

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A research of the corrosion effect on the metal (copper plate) of a broad fuel fraction (FPF) - a liquid product of thermal destruction of secondary raw materials made of low pressure polyethylene (LDPE) at temperatures up to 380 ° C and a pressure of 0,12-0,15 MPa. is conducted. Determination of the corrosion effect on the copper FFT plate was carried out in accordance with the standard ASTM D 130-10 at a temperature of 50 ° C for 120 minutes for both the dehydrated FFT sample and in the presence of 1% water. It was found that the copper plates, which were in the FFT and FFT + 1% water in the visual evaluation, had a light orange color, close to the color of the original plate. This, in turn, indicates that the investigated FFT samples have withstood the test, and the corrosive effect on the copper plate can be attributed to a slight fading, class 1.a. Also, together with the study under standard conditions, the corrosion effect on the copper plate of the products of combustion of FFT at different temperatures at which it was found that in the temperature range 180-230 ° C the surface of the copper plate becomes pale purple, and the corrosion effect on the copper plate can be attributed to moderate dimming, class 2.b; at temperatures of 230-290 ° the surface of the copper plate already has a silver color, and the corrosive effect on the copper plate corresponds to a moderate blackout, class 2.d. Therefore, when the combustion products of the FFT on the copper plate only oxygen corrosion occurs, which is due to the presence of oxygen in the area of the copper plate and the temperature of the combustion products. Thus, it was concluded that there is no corrosive elements in the FFT, which makes it suitable for use as a cheap component of motor, furnace and boiler fuels, improving their performance (e.g., reducing sulfur content).

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Li, Xin Cheng, Jie Liu, Wei Xing Zhu, Yong Chun Tang, and Xiao Li Wang. "Research on Preventing Copper-Brittleness Process for Hot Rolling Copper-Containing of Atmospheric Corrosion-Resisting Steel Used in Vehicles." Advanced Materials Research 1049-1050 (October 2014): 27–30. http://dx.doi.org/10.4028/www.scientific.net/amr.1049-1050.27.

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Copper in hot rolling copper-containing steel plate can passivate the cathode-anode of corrosion reaction on plate surface and form a dense anti-rusting layer, so the rusting reaction is postponed and prevented, and the corrosion resistance is enhanced. However, copper enrichment around grain boundaries in copper-containing steel plate leads to the formation of net-like surface cracking called copper-brittleness. In this paper, through researching the technologies of smelting, and adding rare earth and heating, a reasonable and feasible production technology is found, which effectively prevents the defect of copper-brittleness.

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Billy, Anak Sup, Tanti Zanariah Shamshir Ali, Mohd Farid Zainudin, and Abu Bakar Rosli. "Experimental Study of Water Heating Efficiency between Aluminium and Copper Absorber Plate in Solar Flat Plate Collector." Applied Mechanics and Materials 660 (October 2014): 709–13. http://dx.doi.org/10.4028/www.scientific.net/amm.660.709.

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Solar water heating using flat plate collector (FPC) is the widest application that had been used in residential and commercial area. The material for the absorber plate in FPC should have good thermal conductivity to ensure a high value for the heat removal yet able to store heat slightly high during minimum solar radiation period. An experimental of FPC water heating is conducted using copper and aluminium as absorber plate. The plates were exposed under intense sun radiation more than 800w/m2. The analysis is performed on the relationship between the material and the temperature difference of water. The results represented the heat gain and water heating efficiency between aluminium and copper. Aluminium had heat gain of 1100.69W. Copper had the heat gain of 1025.36W. The water heating efficiency calculated for aluminum is 0.97 while copper is 0.93. The paper finally justified that aluminium is better as the absorber plate in this flat plate solar collector compare to copper plate.

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7

Shi, Xueting, Libin Zhao, Jing Wang, and Libang Feng. "Toward Easily Enlarged Superhydrophobic Copper Surfaces with Enhanced Corrosion Resistance, Excellent Self-Cleaning and Anti-Icing Performance by a Facile Method." Journal of Nanoscience and Nanotechnology 20, no. 10 (October 1, 2020): 6317–25. http://dx.doi.org/10.1166/jnn.2020.17891.

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This work reports a facile method for fabricating superhydrophobic surface on copper plate by AgNO3 treatment and dodecyl mercaptan modification. The as-prepared superhydrophobic copper plate presents hierarchical and rough morphology composed of nanosheets and nanoparticleformed matrix. Meanwhile, long alkyl chains are assembled onto the rough surface successfully. Consequently, the copper plate is endowed with excellent superhydrophobic performance with a water contact angle of 156.8° and a rolling angle of ca. 3°. Moreover, the superhydrophobicity has long-term durability and excellent stability. Grounded on the strong water repellence, the resultant superhydrophobic copper plate surface exhibits multi-functions. The excellent performance can be well explained by “Cushion effect” and Capillary phenomena. As a result, water and corrosive species can be prevented from contacting with the copper plate surface, and contaminants can be taken away easily by the rolling water droplets. Meanwhile, the icing process of water is delayed on the superhydrophobic surface. Therefore, the superhydrophobic copper is endued with enhanced corrosion resistance, excellent self-cleaning and anti-icing performance. We believe that this facile method provides a simple and cost-effective process to improve the properties of copper plate, and which may see practical application of the superhydrophobic materials.

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8

Fan, Shuai, Jing Song Wang, Qing Wei Guo, Wei Ming Zhang, and Ping Sun. "Recovery of Copper by Electrodeposition Method from Electroplating Wastewater." Applied Mechanics and Materials 662 (October 2014): 141–46. http://dx.doi.org/10.4028/www.scientific.net/amm.662.141.

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Electrodeposition method was applied to recover copper from the simulation of copper-containing electroplating wastewater. Stainless steel plate is used as the cathode and the anode is made of titanium plate coated with RnO2+IrO2, titanium mesh coated with RnO2+IrO2 or stainless steel plate. The electrode potential of copper in electrolyte was calculated, and the effect of initial concentration of copper ions, temperature of electrolyte, voltage, electrode spacing, initial pH value and additive concentration on the recovery of copper was studied in detail. The experimental results showed that the proper anode is titanium plate coated with RnO2+IrO2.Under the condition ofinitial concentration of copper ions 25g/L, temperature of electrolyte 40°C, voltage 3.8V, electrode spacing 25mm, initial pH value 3.60, additive concentration 7.1g/L,the recovery rate of copper can achieve 99.4% and the current efficiency can achieve 88.5%.

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9

Subasri, Raghavan, and Tadashi Shinohara. "Investigations on the Photoprotection Ability of TiO₂ Coated on Copper." Materials Science Forum 475-479 (January 2005): 297–300. http://dx.doi.org/10.4028/www.scientific.net/msf.475-479.297.

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A TiO2 coating when directly applied on copper plate showed an instantaneous ptype behavior, i.e. ennoblement of electrode potential on ultraviolet (UV) illumination though a copper plate when galvanically coupled to an ITO glass coated with TiO2 showed immediate lowering of electrode potential (‘n’-type effect) on illumination under deaerated conditions. The instantaneous p-type effect in the former case was attributed to the presence of a copper oxide layer present between the copper plate and the TiO2 coating. However, a prolonged exposure of the TiO2 coated copper plate showed an n-type effect under illumination after nearly 24 h, following which the electrode potential appeared stable and highly negative. This observation indicated that the photogenerated electrons in TiO2 are capable of reducing the copper oxide layer to ultimately realize the n-type effect of TiO2. The n-type effect could not be observed in aerated electrolyte solutions. The effect of different conditions in the ambience on the photoeffect of copper coated TiO2 will be discussed.

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10

R., Indra Gandhi. "Pre-processing and Feature Extraction for a Copper Plate Character Recognition System." Journal of Advanced Research in Dynamical and Control Systems 12, SP3 (February 28, 2020): 1071–77. http://dx.doi.org/10.5373/jardcs/v12sp3/20201353.

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11

Zhang, Xing Zhong, Zheng Yi Jiang, Chun Xia Dou, and Qiang Zhang. "Investigation of Temperature and Deformation of Mold Copper Plate in Slab Continuous Casting." Advanced Materials Research 146-147 (October 2010): 1642–45. http://dx.doi.org/10.4028/www.scientific.net/amr.146-147.1642.

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Based on the cooling parameters of the mold copper plate for slab continuous casting in a steelmaking plant, the three-dimensional calculating model of the copper plate was established, and three-dimensional distributions of temperature, thermal stress and strain were simulated numerically by using finite element method (FEM). The maximum deformation of the mold copper plate, the highest temperature and thermal stress were obtained. This research is useful for the structure design of the mold.

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12

Yeon, Jaebong, Michiru Yamamoto, Peiyuan Ni, Masashi Nakamoto, and Toshihiro Tanaka. "Joining of Metal to Ceramic Plate Using Super-Spread Wetting." Metals 10, no. 10 (October 15, 2020): 1377. http://dx.doi.org/10.3390/met10101377.

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Ceramic-metal composites with novel performance are desirable materials; however, differences in their properties result in difficulties in joining. In this study, the joining of metal to ceramic is investigated. We recently succeeded in causing super-spread wetting on the surface fine crevice structures of metal surfaces produced by both laser irradiation and reduction-sintering of oxide powders. In this work, joining copper onto an Al2O3 plate was achieved by taking advantage of super-spread wetting. Fe2O3 powder was first sintered under reducing conditions to produce a microstructure which can cause super-spread wetting of liquid metal on an Al2O3 plate. A powder-based surface fine crevice structure of metallic iron with high porosity was well-formed due to the bonding of the reduced metallic iron particles. This structure was joined on an Al2O3 plate with no cracking by the formation of an FeAl2O4 layer buffering the mismatch gap between the thermal expansion coefficients of iron and Al2O3. We successfully achieved metalizing of the Al2O3 surface with copper without interfacial cracks using super-spread wetting of liquid copper through the sintered metallic iron layer on the Al2O3 plate. Then, laser irradiation was conducted on the surface of the copper-metalized Al2O3 plate. A laser-irradiated surface fine crevice structure was successfully created on the copper-metalized Al2O3 plate. Moreover, it was confirmed that the super-spread wetting of liquid tin occurred on the laser-irradiated surface fine crevice structure, finally accomplishing the joining of a copper block and the copper-metalized Al2O3.

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13

Andal, V., and G. Buvaneswari. "Synthesis of Nano CuO by Polymeric Precursor Method and its Low Temperature Reduction to Stable Copper Nanoparticles." Journal of Nano Research 15 (September 2011): 11–20. http://dx.doi.org/10.4028/www.scientific.net/jnanor.15.11.

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CuO nanoparticles showing different morphologies were prepared by polymeric precursor method using three different copper sources: basic copper carbonate, copper nitrate and copper hydroxide. The decomposition temperature of the precursors varies from 200 C to 400 C. The effect of the concentration of the polymeric additive was studied. The CuO nanopowder was reduced to metallic copper at low temperature using hydrazine hydrate as a reducing agent. The oxide was treated with the reducing agent in two forms: (1) as dispersion in 0.1% PVA (dispersion method) (2) as slurry with 0.1% PVA applied on a glass plate (plate method). The maroon copper metal nanofluid achieved in dispersion method was stable for six months and the copper nanopowder obtained from the plate method showed stability for more than six months. The precursor, CuO and Cu nanomaterials were characterized by powder XRD, FT-IR, TGA, SEM and TEM techniques.

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14

Piasecka, Magdalena, Sylwia Hożejowska, Anna Pawińska, and Dariusz Strąk. "Heat Transfer Analysis of a Co-Current Heat Exchanger with Two Rectangular Mini-Channels." Energies 15, no. 4 (February 12, 2022): 1340. http://dx.doi.org/10.3390/en15041340.

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This paper presents the results of research on heat transfer during fluid flow in a heat exchanger with two rectangular mini-channels. There was Fluorinert FC-72 flow, heated by the plate in the hot mini-channel, and co-current flow of distilled water in the cold mini-channel. Both fluids were separated by the copper plate. A thermal imaging camera was used to measure the temperature distribution of the outer surface of the heated plate. The purpose of the calculations was to determine the heat transfer coefficients at the contact surfaces: the heated plate—FC-72 and FC-72—the copper plate. Two mathematical models have been proposed to describe the heat flow. In the 1D approach, only the heat flow direction perpendicular to the fluid flow direction was assumed. In the 2D model, it was assumed that the temperature of the heated plate and FC-72 and the copper plate meet the appropriate energy equation, supplemented by the boundary conditions system. In this case, the Trefftz functions were used in numerical calculations. In the 1D model, the heat transfer coefficient at the interface between FC-72 and the copper plate was determined by theoretical correlations. The analysis of the results showed that the values and distributions of the heat transfer coefficient determined using both models were similar.

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15

Li, Qiannan, Yifan Zhang, Yulin Cheng, Xiaojiao Zuo, Yinxiao Wang, Xiaoguang Yuan, and Hongjun Huang. "Effect of Temperature on the Corrosion Behavior and Corrosion Resistance of Copper–Aluminum Laminated Composite Plate." Materials 15, no. 4 (February 21, 2022): 1621. http://dx.doi.org/10.3390/ma15041621.

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In this paper, the effect of temperature on the corrosion behavior and corrosion resistance of the copper–aluminum laminated composite plates were investigated by salt-spray corrosion, potential polarization curve and electrochemical impedance spectroscopy. Moreover, the microstructure of the copper–aluminum laminated composite plate after salt-spray corrosion was observed by scanning electron microscope, and X-ray photoelectron spectroscopy was used to study the composition of corrosion product. The results revealed that the corrosion products of the copper–aluminum laminated composite plate were Al2O3 and AlOOH. Due to the galvanic corrosion of the copper–aluminum laminated composite plate, the cathode underwent oxygen absorption corrosion during the corrosion process; therefore, the presence of moisture and the amount of dissolved oxygen in the corrosive environment had a great influence on the corrosion process. The increasing temperature would evaporate a large amount of moisture, resulting in the corrosion product—aluminum oxide dehydrated and covered the surface of the material in the process of salt-spray corrosion, which played a role in protecting the material. Therefore, the corrosion resistance of the copper–aluminum laminated composite plate first decreased and then increased. In the salt-spray corrosion environment, the corrosion resistance of the copper–aluminum laminated composite plate reached the lowest at 45 °C, and its corrosion rate was the fastest, at 0.728 g/m2·h. The electrochemical corrosion occurred in the solution, and the impact was small; however, in addition to the protective corrosion products, the ion mobility in the solution also had a certain influence on the corrosion rate, and the ionic activity increased with the increase of temperature. Therefore, the corrosion resistance of the copper–aluminum laminated composite plate gradually decreased as the temperature increased, and its corrosion resistance was the worst at 50 °C.

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Wei, Qiang, Li Xin Xu, Hui Juan Shi, Li Feng Shao, and Xiang Zhong Hao. "Study on Network Structure C-Cu Composites of Pantograph Slide Plates." Advanced Materials Research 150-151 (October 2010): 941–46. http://dx.doi.org/10.4028/www.scientific.net/amr.150-151.941.

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novel pantograph sliding plate, the network of carbon-copper composites, composed of carbon fiber cloth, copper powder, graphite powder, et al. The physical and mechanical properties of the new samples were tested. Compared with the commonly used pantograph sliding plate, the novel one has lower resistivity, higher bending strength, enhanced impact toughness and better mechanical properties. The new material is suitable for producing the pantograph sliding plate of the electric locomotive.

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Hou, Li Juan, and Fu Xin Mao. "Coordinate Measurement System for Copper-Clad Plate." Applied Mechanics and Materials 734 (February 2015): 75–78. http://dx.doi.org/10.4028/www.scientific.net/amm.734.75.

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For getting the coordinate of contactor on CCL, the measurement system transformed resistance into voltage by providing constant current on CCL. The system includes MCU, 3A constant current source, MOSFET switch circuit, signal amplifier circuit and A/D converter. By the curve-fitting method, the equipotent lines of CCL were simulated with MATLAB according to the discrete data. The equations of equipotent lines were obtained with second-order polynomial fitting method. The two curves which the contactor located in were acquired with local linearization method, and the coordinate was gained by calculating solving equation groups.

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Wang, Huimin, Anupam Vivek, Yuliang Wang, Gopal Viswanathan, and Glenn Daehn. "High strain rate embossing with copper plate." International Journal of Material Forming 10, no. 5 (August 11, 2016): 697–705. http://dx.doi.org/10.1007/s12289-016-1312-9.

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19

Dai, Kaida, Han Liu, Pengwan Chen, Baoqiao Guo, Dalin Xiang, and Jili Rong. "Dynamic Response of Copper Plates Subjected to Underwater Impulsive Loading." Applied Sciences 9, no. 9 (May 10, 2019): 1927. http://dx.doi.org/10.3390/app9091927.

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Understanding the mechanical response and failure behaviors of thin plates under impact loading is helpful for the design and improvement of thin plate structures in practical applications. The response of a copper plate subjected to underwater impulsive loading has been studied in fluid-structure interaction (FSI) experiments. Three typical copper plates, (a) without a pre-notch, (b) with a cross-shaped pre-notch (+), and (c) with a ring-shaped pre-notch (○) were selected. A high-speed photography system recorded the full-field shape and displacement profiles of the specimens in real time. The 3D transient deformation fields’ measurements were obtained using a 3D digital image correlation (DIC) technique. Strain results from DIC and the strain gauges technique were in good agreement. A dimensionless deflection was used to analyze the effect of plate thickness and loading intensity on the deformation of the copper plates. The typical failure modes of different copper plates were identified. The test plates exhibited large ductile deformation (mode I ) for copper plates without a pre-notch, and large ductile deformation with local necking (mode I c ), splitting (mode II ), splitting and tearing (mode II c ), and fragment (mode III ) for the copper plate with a pre-notch.

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20

Abdul Hussein, Sarmad A., and Mohammed A. Nima. "Experimental Analysis of Air Inlet Height Variation in a Solar Tower system Using Plate and Metal Foam Absorber." Al-Nahrain Journal for Engineering Sciences 25, no. 3 (November 20, 2022): 120–29. http://dx.doi.org/10.29194/njes.25030120.

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The experimental analysis is conducted under the Iraqi climate conditions to investigate the performance enhancement of a solar updraft tower system (SUTS) using the porous copper foam as an absorber plate and conventional absorber plate with absorber inclination angle of 18°. In the present work, a semicircular collector is divided into two identical quarter thermal collectors to become two identical SUTS. One of the quarter circular thermal collectors contains on the metal foam as an absorber plate, while the other quarter collector on the conventional flat copper absorber plate. In this study the air inlet height is changed of (3, 5, and 8) cm. The experimental tests carried out in Baghdad city (latitude 33.3° N). Results showed that the air inlet height variation caused to enhance the solar updraft tower performance. The highest values was recorded when the air inlet height is 3 cm using porous absorber compared to flat absorber plate. Copper material foam as an endothermic surface causes a marked decrease in average surface temperature of the plate. The maximum hourly thermal efficiency of solar collector was increased to about 41.6 % and the maximum enhancement of the power output to about 45.2 % compared with flat absorber plate.

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Marynowski, Krzysztof. "Vibration analysis of an axially moving multiscale composite plate subjected to thermal loading." MATEC Web of Conferences 148 (2018): 06003. http://dx.doi.org/10.1051/matecconf/201814806003.

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This study investigated the effects of temperature on free vibrations and critical transport speeds of an axially moving multiscale composite plate. On the basis of the frequency-temperature equivalence principle, a linear mathematical model of the moving multiscale composite plate is derived in the complex frequency domain. Fractional standard rheological model of the plate material as the function of reduced frequency depended on the temperature is determined. In numerical investigations carbon nanotubes- and graphene-reinforced copper plate was taken into account.. To describe thermomechanical properties of the plate material, the investigation results obtained from the molecular dynamics studies and the experimental characteristic of beryllium copper in low temperatures presented in literature is taken into account.. The effects of temperature, transport speed, and internal damping on natural frequencies and critical transport speed are analyzed. The critical transport speeds of the graphene-reinforced multiscale composite are higher than both carbon nanotubes-reinforced composite as well as the comparable copper alloy.

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Sun, Li Gen, Hui Rong Li, and Jia Quan Zhang. "Research on Thermocouple Embedded Position for CC Mould Copper Plate with Different Cooing Water Temperature." Advanced Materials Research 421 (December 2011): 281–86. http://dx.doi.org/10.4028/www.scientific.net/amr.421.281.

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Cooling water temperature is one of the key parameters for continuous casting, and it has great influence to the thermal state of the mould copper plate. The coupled visco-elasto-plastic FEM models have been presented for thermal process analysis of steel the mould copper plates. With the understanding to the mould thermal state for different heat transfer coefficient, the characters of mould copper plate thermal state is obtained. It is shown that, when the cooling water temperature increasing, the surface temperature of the mould plate would be higher, but the temperature distribution trend is steady, and at same time, the cooling water temperature has little influence to the equivalent strain distribution, especially for the nodes nearer to the meniscus. Lower cooling water temperature would cause bigger mould copper plate equivalent strain, and induce more surface crack of the strand. For breakout signal catching of this mould, the thermocouple is better to embedded lower than 350mm to the meniscus by vertical, and less than 30mm to the mould cold side by level.

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Amjadian, Mohsen, and Anil K. Agrawal. "Planar arrangement of permanent magnets in design of a magneto-solid damper by finite element method." Journal of Intelligent Material Systems and Structures 31, no. 7 (February 27, 2020): 998–1014. http://dx.doi.org/10.1177/1045389x20905968.

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This article studies the energy dissipation mechanism of a proposed magneto-solid damper using a three-dimensional finite element model developed in COMSOL Multiphysics software. The energy dissipation mechanism of the magneto-solid damper dissipates energy through combined actions of friction and eddy current damping. The key components of the magneto-solid damper are a steel plate, two copper plates placed on two sides of the steel plate in parallel, and two planar arrays of permanent magnets each one placed between the steel plate and one of the copper plates. These arrays are kept away from the steel and copper plates through narrow gaps; the gaps between them and the steel plate are filled with thin friction pads made of non-magnetic materials. The attractive magnetic interaction between the permanent magnet arrays and the steel plate provides the normal force for the friction developed between the friction pads and the steel plate when the permanent magnet arrays move relative to the steel plate. The motion of the permanent magnet arrays relative to the copper plates, on the other hand, provides the eddy current damping. The main contribution of this article is to optimize the pole arrangement of the permanent magnets and demonstrate that how the optimum pole arrangement can affect the energy dissipation capacity of the magneto-solid damper. The analysis results show that, for a given number and size of the permanent magnets, alternate arrangement of the poles of permanent magnets along the direction of their motion is the most optimal case resulting in large and smooth hysteresis force–displacement loops. This pole arrangement has also been used to find the optimum size of the steel and copper plates by addressing edge and skin effects in the design of the damper.

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López, Sonia, Jesús Manuel García-Vargas, María Teresa García, Juan Francisco Rodríguez, Ignacio Gracia, and María Jesús Ramos. "Copper-Containing Catalysts for Azide–Alkyne Cycloaddition in Supercritical CO2." Catalysts 12, no. 2 (February 4, 2022): 194. http://dx.doi.org/10.3390/catal12020194.

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Background: Chemical industry has increased the investment into and innovation capacity to supply chemicals from safe and sustainable sources, which will be essential to offering new solutions and supporting the green transition of the global economy and society. In this sense, the use of green solvents and reusable heterogeneous catalysts has emerged as a promising sustainable process strategy for engineering, chemistry and the environment. In this work, different homogeneous (copper bromide, CuBr and copper(II) acetate, Cu (CH3COO)2·H2O) and heterogeneous (Cu Wire, Cu Plate, Cu/β-SiC, pre-treated Cu Wire and pre-treated Cu Plate) copper catalysts were tested for the copper(I)-catalyzed alkyne–azide cycloaddition (CuAAC) reaction. In addition, the influence of different reaction media was analyzed, comparing the use of an organic solvent such as toluene and a green solvent such as supercritical CO2 (scCO2). Methods: Characterization of the catalysts includes by X-ray diffraction (XRD), Scan Electron Microscopy (SEM), Atomic absorption spectrophotometry (AA) and Temperature Programmed Reduction (TPR). Parameters such as catalyst loading, reaction time, reusability and leaching of the catalysts were studied to obtain more information on the CuAAC reaction in scCO2. Results: The pre-treated copper plate achieved a 57% increase in reaction yield compared to the non pre-treated copper plate. However, the recovery and reuse of the pre-treated copper plate showed a severe deterioration and a considerable change in its surface. Cu Wire (without pre-treatment) achieved yields of up to 94.2% after reusing it for five cycles. Conclusions: These results suggest the possibility to exploit the combination of heterogeneous catalysts and scCO2 and justify further research to highlight green solvents and simultaneously address the challenges of reaction, purification and recycling.

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Wang, Mei Fen, Guo Jun Du, and Dong Yu Xia. "Molecular Dynamics Simulation of Microcrack Healing in Copper Nano-Plate." Key Engineering Materials 531-532 (December 2012): 454–57. http://dx.doi.org/10.4028/www.scientific.net/kem.531-532.454.

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The molecular dynamics method is used to simulate microcrack healing in copper nano-plate during heating. During microcrack healing, the tip of microcrack is blunted and deforms to round shape, the microcrack becomes smaller and smaller until it is healed through slip bands emitting from the pre-crack tip and expanding to the top and bottom of the copper nano-plate. The healing time is different in different temperature. The healing processes in different temperature present different slip bands for crack healing. When temperature is below 650K, the healing time decreases dramatically with temperature increase. When temperature is above 650K, the healing time decreases smoothly with temperature increase. The critical temperature of microcrack healing in copper nano-plate without pre-existing dislocations is about 400K.

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Sun, Li Gen, Hui Rong Li, and Jia Quan Zhang. "Research on Thermocouple Embedded Theory for Thermal State of CC Mould Copper Plate with High Casting Speed." Advanced Materials Research 361-363 (October 2011): 623–27. http://dx.doi.org/10.4028/www.scientific.net/amr.361-363.623.

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High casting speed would change the thermal state of the mould copper plate, The coupled visco-elasto-plastic FEM models have been presented for thermal process analysis of steel shell and the mould copper plates. With the understanding to the mould thermal state for different casting speed, the characters of mould copper plate thermal flux is obtained. It is shown that, the highest thermal flux zone is getting downward with casting speed increasing, and it would also make harder for breakout signals catching.

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Vinayagamoorthi, M. A., M. Prince, and S. Balasubramanian. "Effects of bottom plate in friction stir welding of AA6061-T6." Metallurgical Research & Technology 118, no. 1 (December 18, 2020): 108. http://dx.doi.org/10.1051/metal/2020087.

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The effects of 40 mm width bottom plates on the microstructural modifications and the mechanical properties of a 6 mm thick FSW AA6061-T6 joint have been investigated. The bottom plates are placed partially at the weld zone to absorb and dissipate heat during the welding process. An axial load of 5 to 7 kN, a rotational speed of 500 rpm, and a welding speed of 50 mm/min are employed as welding parameters. The size of the nugget zone (NZ) and heat-affected zone (HAZ) in the weld joints obtained from AISI 1040 steel bottom plate is more significant than that of weld joints obtained using copper bottom plate due to lower thermal conductivity of steel. Also, the weld joints obtained using copper bottom plate have fine grain microstructure due to the dynamic recrystallization. The friction stir welded joints obtained with copper bottom plate have exhibited higher ductility of 8.9% and higher tensile strength of 172 MPa as compared to the joints obtained using a steel bottom plate.

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Lin, Wan Ming, Yin Hui Wei, and Li Feng Hou. "Microstructure and Properties of Surface Nanostructured Copper." Advanced Materials Research 328-330 (September 2011): 1606–9. http://dx.doi.org/10.4028/www.scientific.net/amr.328-330.1606.

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Surface nanocrystallization (SNC) is a novel method for improving materials properties. Nanostructured surface layers of about 20 μm thickness were produced in copper plate samples by means of surface mechanical attrition treatment (SMAT). The behaviors of the SMAT samples were investigated by using transmission electron microscopy (TEM), Vickers hardness testing and potentiodynamic anodic polarization tests. The experimental results showed that the longer the peening time was performed on the copper pate samples, the thicker the deformation layers formed. The microhardness results for the top surface layer of the copper plate sample are 1.723 GPa and 1.752 GPa for 45 and 60 min, respectively, which are about two times higher than that of the matrix. The primary passivate potential of nanocrystalline copper was more negative than that of coarse-grain copper.

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Li, Ying, Ying Ying Zhai, Zheng Wang, and Zhi Guang Ao. "The Application of Breakout Prediction System with Thermal Imaging." Advanced Materials Research 402 (November 2011): 386–89. http://dx.doi.org/10.4028/www.scientific.net/amr.402.386.

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The system of breakout prediction with thermal imaging is developed, which used cubic spline interpolation algorithm, based on the characteristics of the practical temperature data. This system is designed using VC++. In the measuring temperature experiment, more thermocouples are arranged in the copper plate of the mold. Three rows of thermocouples are installed in the mold copper plate, and there are two adjacent thermocouples in one location. In the system, the temperature field of the mold copper plate is shown as an image, and the function of monitoring temperature on-line is realized. The image is more exquisite and pliable because of existing more measuring temperature points. This system with thermal imaging has a great application value in the steel factories.

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30

Noor, Abdul Muizz Mohd, Yoshikazu Ishikawa, and Seiji Yokoyama. "Preparation of Graphite Dispersed Copper Composite on Copper Plate with Spot Welding." MATERIALS TRANSACTIONS 58, no. 8 (2017): 1138–44. http://dx.doi.org/10.2320/matertrans.m2017073.

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31

Vasantamadhava, K. G. "A Note on the Pejavar Copper Plate 1352 Saka, 1430 A.D." Journal of the Royal Asiatic Society of Great Britain & Ireland 117, no. 1 (January 1985): 29–34. http://dx.doi.org/10.1017/s0035869x00154929.

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Karnataka has rich epigraphical sources. The entire edifice of Karnataka history from the 3rd century B.C. down to the end of Vijayanagara rests on epigraphical records. A volume of information concerning the political conditions, government and administration, political geography, the social structure and the life of the people, the religious faiths, economic conditions and many other topics, can be derived from a critical study of the inscriptions.The inscription under discussion is a copper plate from the village of Pejavar, Mangalore Taluka, South Kanara District, Karnataka State. The copper plate is now in the possession of K. Venkatraya Achar, Suratkal. It belongs to the period of the Vijayanagara emperor Immadi Devarāya (1424–1446 A.D.). The copper plate is in the Kannada language and script. The script seems to belong to a later period. The epigraphic department of the Government of India noticed this inscription in its annual report in the year 1967–68. Sri Venkatraya Achar, the discoverer of the inscription, made a few observations in the year 1957. This paper seeks to provide fresh information on political, religious and land transaction procedures on the basis of the contents of the copper plate.

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32

Sun, Li Gen, Hui Rong Li, and Jia Quan Zhang. "Influence of Different Steel Grades Casting for Mould Thermal State." Advanced Materials Research 487 (March 2012): 89–93. http://dx.doi.org/10.4028/www.scientific.net/amr.487.89.

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The steel grade has a great influence to the thermal state of the mould copper plate. The coupled visco-elasto-plastic FEM models have been presented for thermal process analysis of steel and the mould copper plates. With the understanding to the mould thermal state for the different steel grade casting, the characters of mould copper plate thermal state is obtained. It is shown that, the reasonable mould taper and casting techniscs are very important for the different steel grades casting, and they are also the important way to improve the mould life.

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33

Suryakant, Chappe Narsing, Abhishek Singh, Rahul Ramdas, Kunal Dighe, and Sripriya Ramamoorthy. "Enhanced absorption in structural acoustic silencers using piezo-shunting." Journal of the Acoustical Society of America 152, no. 2 (August 2022): 1112–22. http://dx.doi.org/10.1121/10.0013573.

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Structural acoustic silencers (sas) consist of a thin flexible plate that is introduced into a wall of an otherwise rigid-walled duct in which acoustic noise is propagating. Transmission loss (TL) in sas arises from reflection due to impedance mismatch, as well as partial absorption due to material damping in the plate. Reflection-based TL is less preferable than absorption-based TL, especially where back-pressure is undesirable. In this study, the TL arising out of absorption is increased by increasing the effective plate damping using the piezo-shunting method. Experiments are conducted on a custom-made sas with copper sheets of two different thicknesses. Piezo-shunting to increase the damping of the copper plate is done by connecting an electrical resistor to the external circuit of a thin piezoelectric bimorph attached to the copper plate. The effect of piezo-shunting on the sas TL is analyzed using a model. Piezo-shunt increases the fraction of power absorbed and decreases the reflected power fraction. The dependency of these fractions on the value of the electrical resistor and the impedance of the plate are discussed. This study demonstrates that piezo-shunting can be used to improve absorption-based TL in sas.

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34

Lu, Xin Wei, De Zhi Yang, Wen Jiong Cao, and Zhao Yao Zhou. "Numerical Simulation of Convection Heat Transfer in a Plate Channel with Sintered Copper Porous Ribs." Advanced Materials Research 605-607 (December 2012): 1350–55. http://dx.doi.org/10.4028/www.scientific.net/amr.605-607.1350.

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Convection heat transfer in a plate channel periodically fitted with sintered copper porous ribs attached to a copper plate was numerically studied. The local thermal equilibrium model was adopted in the energy equation to evaluate the temperature of fluid and solid. The effect of porosity, Reynolds number and heat flux applied to the copper plate on the heat transfer characteristic of the porous media was investigated respectively. The numerical results show that the heat transfer can be enhanced by increasing Reynolds number, decreasing the porosity and the heat transfer enhancement of the porous media took effect significantly when subjected to high heat flux. Detailed development of the porous media temperature field and the Nusselt number of the wall as a function of Reynolds number for different porosity and heat flux were also presented.

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35

Chiu, Liu Ho, Kuan Hung Chen, Chi Ying Tsai, and Shah Rong Lee. "The Galvanic Corrosion between Anodized 6061 Aluminum Plate and C1100 Copper Plate Couple." Advanced Materials Research 849 (November 2013): 14–19. http://dx.doi.org/10.4028/www.scientific.net/amr.849.14.

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The galvanic corrosion behavior of anodic AA6061 Al and C1100 Cu couples is investigated. Anodized AA6061-T6 Al plates were produced at different thickness of 1μm, 5μm and 12μm, respectively. The galvanic corrosion current of anodized plate and C1100 copper plate couples was measured using a zero resistance ammeter for 8 hours in two solutions, 3.5wt.% NaCl solution and 1.0 wt.% NaClO solution under temperatures of 25°C, 40°C and 60°C. The results show that the AA6061-T6 aluminum plate without anodizing produced the highest galvanic corrosion current, 1200 μA/cm2, among the tested specimens under flowing NaClO electrolyte at 60°C. Anodized AA6061-T6 aluminum plates with a 12μm anodized layer produced the lowest galvanic corrosion current, 15 μA/cm2, in a static 3.5wt.% NaCl electrolyte at 25°C. Severe corrosion attack was observed at the aluminum specimen with thin and non-uniform anodized layer after the galvanic corrosion tests. The anodizing AA6061 Al plate process can effectively reduce the galvanic corrosion of the AA6061 Al and C1100 Cu couples.

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36

Bin Shahadat, Muhammad Rubayat, and A. K. M. M. Morshed. "Explosive Boiling of Water on a Hot Copper Plate: A Molecular Dynamics Simulation Study." Advanced Engineering Forum 35 (February 2020): 18–28. http://dx.doi.org/10.4028/www.scientific.net/aef.35.18.

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Non-equilibrium molecular dynamics simulations have been employed to study the explosive boiling phenomena of water over a hot copper plate. The molecular system was comprised of three sections: solid copper wall, liquid water, and water vapor. A few layers of the liquid water were placed on the solid Cu surface. The rest of the simulation box was filled with water vapor. Initially, the water molecules were equilibrated by using Berendsen thermostat at 298 K. Then heat was given to the copper plate at different temperatures so that explosive boiling occurs. After achieving the equilibrium by performing the previous two steps, the liquid water at 298 K is suddenly dropped on the hot plate. NVE ensemble was used in the simulation and the temperature of the copper plate was controlled to different temperatures with phantom atom thermostat. Four temperatures (400K, 500K, 650 K and 1000K) were taken to study the explosive boiling. The simulation results show that, the explosive boiling temperature of water on Cu plate is 500 K temperature. At this point, the energy flux was found 1.79x108 J/m3 which is very promising with the experimental results. Moreover, if the temperature of the surface was increased the explosive boiling occurred at a faster rate. The simulation results also show that explosive boiling occurs earlier for the hydrophilic surface than hydrophobic surface as for the hydrophilic surface the water attracted the Cu plate more than the hydrophobic surface and so the amount of energy transfer is more for the hydrophilic surface.

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37

Chang, Qinghua, Peikai Gao, Junyi Zhang, Yiqang Huo, Zheng Zhang, and Jingpei Xie. "Numerical Simulation of Copper-Aluminum Composite Plate Casting and Rolling Process and Composite Mechanism." Materials 15, no. 22 (November 16, 2022): 8139. http://dx.doi.org/10.3390/ma15228139.

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This paper uses ANSYS Workbench platform to simulate the casting and rolling composite process, taking the horizontal type casting and rolling machine as the research object, and conducts the numerical simulation study of copper-aluminum composite solid-liquid casting and rolling heat-flow coupling, mainly to study different walking speed, aluminum pouring temperature, casting and rolling zone length, heat transfer coefficient on the temperature field, liquid phase rate influence law, and use it as a theoretical guide for copper-aluminum solid-liquid casting. The experiments of copper-aluminum solid-liquid casting-rolling composite were carried out to optimize the process parameters and to verify the experiments, so as to prepare a well-bonded copper-aluminum composite plate. The composite mechanism in the preparation of copper-aluminum composite plate was analyzed, and it was clarified that the interfacial layer was formed through four stages: contact between copper and aluminum surfaces, contact surface activation, mutual diffusion of copper and aluminum atoms, and reaction diffusion.

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38

Peng Hui, Li Ping, Pei Xiao-Yang, He Hong-Liang, Cheng He-Ping, and Qi Mei-Lan. "Rate-dependent characteristics of copper under plate impact." Acta Physica Sinica 63, no. 19 (2014): 196202. http://dx.doi.org/10.7498/aps.63.196202.

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39

Furui, Ryosuke. "A New Copper Plate Inscription of Gopala II." South Asian Studies 24, no. 1 (January 2008): 67–75. http://dx.doi.org/10.1080/02666030.2008.9628683.

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40

Nur Syahirah Wahid, Nor Aliza Abd Rahmin, Norihan Md Arifin, Najiyah Safwa Khashi’ie, Ioan Pop, Norfifah Bachok, and Mohd Ezad Hafidz Hafidzuddin. "Radiative Blasius Hybrid Nanofluid Flow Over a Permeable Moving Surface with Convective Boundary Condition." Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 100, no. 3 (December 31, 2022): 115–32. http://dx.doi.org/10.37934/arfmts.100.3.115132.

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The Blasius flow over a movable and permeable plate is envisaged in this study. Water-based hybrid nanofluid is incorporated with the insertion of thermal radiation, suction, and a convectively heated plate. The governing partial differential equations that simulate the fluid model are modified to ordinary differential equations through the implementation of self-similar transformation. A numerical solver known as bvp4c in Matlab is adopted to solve the problem numerically through the finite difference code with the Lobatto IIIa formula. Non-unique solutions are acquirable when the plate and the flow move in a dissimilar direction. As conducting the stability analysis, it is validated that the first solution is stable and reliable. The findings reveal that the imposition of stronger thermal radiation and greater Biot number for convection can lead to a better heat transfer performance. The 2% volume fraction of copper in the 1% volume fraction of alumina nanofluid composition would lead to greater skin friction when the plate is moving oppositely from the flow direction compared to the lesser volume fraction of copper. The boundary layer separation also can be efficiently prevented by composing a 2% copper volume fraction in the 1% alumina-water nanofluid compared to the lesser copper volume fraction.

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41

Liu, Peng, Jian Ping Jiang, and Bai Lian Sun. "Interface and Bonding Strength of Explosively Welded T2/DT4C Laminate." Advanced Materials Research 785-786 (September 2013): 1051–54. http://dx.doi.org/10.4028/www.scientific.net/amr.785-786.1051.

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T2 red copper plate and DT4C electrical pure iron plate were cladded by explosive welding. Microcosmic analysis and bonding strength of the bonding interface were also studied. Results indicate that the welded zone appears periodical wavy metallurgical interface and obvious element diffusion occurs in the interfacial zone. In addition, no separation happens after the bonding strength test and tension-shear test and the broken zone takes place in the T2 red copper part of the samples, indicating that the bonding strength of the welded interface can get no less than the strength of T2 red copper.

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42

Sun, Li Gen, Hui Rong Li, and Jia Quan Zhang. "Research on Thermal State of Mould Copper Plate with Different Heat Transfer Coefficient." Advanced Materials Research 402 (November 2011): 160–64. http://dx.doi.org/10.4028/www.scientific.net/amr.402.160.

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Heat transfer coefficient has a great influence to the thermal state of the mould copper plate. The coupled visco-elasto-plastic FEM models have been presented for thermal process analysis of steel the mould copper plates. With the understanding to the mould thermal state for different heat transfer coefficient, the characters of mould copper plate thermal state is obtained. It is shown that, when the heat transfer coefficient increasing, the surface temperature of the mould plate would be lower, but the temperature distribution trend is steady, and at same time, the heat transfer coefficient has little influence to the equivalent strain distribution, especially for the nodes nearer to the meniscus. For breakout signal catching of this mould, the thermocouple is better to embedded lower than 300mm to the meniscus by vertical, and less than 30mm to the mould cold side by level.

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43

Liu, Rui Liang, Wei Zhou, Wei Song Ling, Shuang Li Li, and Ping He. "Thermal Conductivity Measurements of Novel Porous Copper Fiber Sintered Sheet." Materials Science Forum 933 (October 2018): 159–68. http://dx.doi.org/10.4028/www.scientific.net/msf.933.159.

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In this work, a porous copper fiber sintered sheet (PCFSS) is fabricated by using a low-temperature solid-phase sintering method. Copper fiber is a raw material that is produced by a cutting method with a multi-tooth tool. A novel reference plate method (RPM) with a steady state heat transfer process is introduced to measure the thermal conductivity of PCFSS. The study involves experimentally investigating the effects of reference plate materials as well as the porosity and porosity gradients of PCFSS on thermal conductivity. The findings indicate that reasonable measurement results of thermal conductivity of PCFSS are obtained when 304 stainless steel is selected as a reference plate material when compared with that in the case of a red copper plate. The thermal conductivity increases with a decrease in the porosities of PCFSS in the approximate range of 70%–90%. With respect to the approximate measuring temperature range of 34°C~58°C, the thermal conductivities of PCFSSs with 70%, 80% and 90% porosities correspond to 25.35 W/(m·°C), 15.01 W/(m·°C) and 11.24 W/(m·°C), respectively. The thermal conductivity of PCFSS with 70%-80%-90% gradient porosity corresponds to 13.43 W/(m·°C), and this value is between 80% and 90% porosity of PCFSS.

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44

Хорьякова, N. Khoryakova, Агеев, and E. Ageev. "DEVELOPMENT COPPER PLATE FOR THE PISTON RINGS, THE MODIFIED NANOPARTICLES ELECTROEROSIVE OF COPPER." Alternative energy sources in the transport-technological complex: problems and prospects of rational use of 2, no. 1 (April 27, 2015): 337–39. http://dx.doi.org/10.12737/14068.

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45

Yi, Feng, and Xue Feng Liu. "Numerical Simulation of Temperature Field and Microstructure of a Wide Copper Plate during Warm Mold Continuous Casting." Materials Science Forum 898 (June 2017): 1289–99. http://dx.doi.org/10.4028/www.scientific.net/msf.898.1289.

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Wide plates are mainly prepared through traditional cold mold continuous casting technology. A problem is cracking which caused by the non-uniform temperature field in solidification. Warm mold continuous casting is a new technology. Warm mold continuous casting of wide copper plate (section 500mm×12mm) was studies. Temperature field, solid/liquid interface and microstructure were analyzed by ProCAST software. By simulation, the optimal processing parameters: withdrawing speed was 60-80 mm/min, and the temperature of copper melt, mold and cooling water were 1200°C, 800-900oC and 20 oC, respectively. The temperature field in the width direction of the copper plate broad face was uniform, and the temperature decreased uniformly along the withdrawing direction. The temperature difference between center and edge was within 10 oC, and the temperature difference between narrow and broadfaces was within 25oC. Microstructure of plate contained ‘bamboo-like’ grains along the withdrawing direction.

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46

AGRAWAL, ASHVINI. "A new copper-plate grant of Harsavardhana from the Punjab, year 8." Bulletin of the School of Oriental and African Studies 66, no. 2 (June 2003): 220–28. http://dx.doi.org/10.1017/s0041977x03000132.

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In this paper a newly discovered copper-plate grant, dated year 8 of the Harsa era (A.D. 614–15), along with the seal, of mahārājādhirāja Harsavardhana of the Pusyabhūti dynasty, has been deciphered, edited and studied for the first time. Discovered in a village in the Nabha district, Punjab, the inscription is the earliest of the three known epigraphs of this ruler and the only one from Punjab. The other two—the Banskhera copper-plate (year 22) and the Madhuban copper-plate (year 25) are from Uttar Pradesh. This is the only one of Harsa's inscriptions that has been discovered along with the seal that was attached to it. The grant refers to the donation of a village named Pannarāngaka in the Darikkāni visaya of the Jayarata bhukti to a Brahmin named Ulūkhasvāmin of Bhārgava gotra for the increase of merit and fame of Harsa's parents and elder brother Rājyavardhana.

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47

Sadrolhosseini, Amir Reza, Suraya Abdul Rashid, Azmi Zakaria, and Kamyar Shameli. "Green Fabrication of Copper Nanoparticles Dispersed in Walnut Oil Using Laser Ablation Technique." Journal of Nanomaterials 2016 (2016): 1–7. http://dx.doi.org/10.1155/2016/8069685.

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Synthesis of copper nanoparticles was achieved by laser irradiation of copper plate in walnut oil. The copper plate was irradiated using Nd:YAG pulse laser at different ablation time from 5 to 50 minutes, and the prepared samples were characterized using analytical methods to find the optical absorption, morphology, particle size, and capping of copper nanoparticles with walnut oil. Consequently, the absorption peak appeared at about 615, 606, 588, 576, and 561 nm; and the nanoparticles formed in spherical shape in walnut oil. The particle size varied from 25 to 4.01 nm, and the tail of the carbonyl band capped the copper nanoparticles through the electron transfer from the carboxylic group to copper nanoparticles. The refractive indices of the nanofluid were measured using a surface plasmon resonance technique and changed from 1.4691 + 0.008i to 1.4682 + 0.043i as the volume fraction increased from 0.0257 × 10−5to 1.26 × 10−5. Consequently, the laser ablation method is environmentally sensitive (i.e., green) and thus is suitable for the fabrication of copper nanoparticles in walnut oil without any agent.

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48

Zhang, Dong Hui, Chun Dong Liu, Landi Zhang, and Zhan Ying Wang. "Experimental Research on Flight Trajectory of Edge Electron of the Electron-Beam in the Electron Gun of Furnace." Advanced Materials Research 652-654 (January 2013): 2388–90. http://dx.doi.org/10.4028/www.scientific.net/amr.652-654.2388.

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An experimental measuring method of flight trajectory of edge electron of the electron-beam in the electron gun of furnace was designed. Intermediate perforated copper foil plate is placed in parallel at a key position within the electron gun. The theoretical beam diameter of the electron beam which is reaching the position can be obtained through measuring pore diameter in copper foil plate left after being broke down by the electron-beam, so experimental data got can be verified the theoretical results.

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49

Li, Ming, Rui Fan, Li Bao, Xue Yuan Zhang, Hong Yan Wang, and Michele M. Blum. "Simulation Research on Ploughing Extrusion Angle Influence on Machinability." Materials Science Forum 980 (March 2020): 117–25. http://dx.doi.org/10.4028/www.scientific.net/msf.980.117.

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In order to research the ploughing extrusion angle influence on cutting performance and realize the virtual design and manufacture of ploughing-extrusion forming cutter, the plough-extrusion forming process of wick micro-groove structure was simulated by DEFORM-3D software. The micro-copper tube with diameter of 6 mm was simplified to 0.4 mm thick copper plate in this paper. In the simulation process, only the single parameter of tool extrusion angle was changed (45°, 60°, and 90°). The structure, stress and strain distributions of copper plate fins formed by three kinds of extrusion angle cutters were analyzed. It is concluded that the plough-extrusion cutting performance of 60 degree extrusion angle cutter is the best.

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Yuan, Ju Long, Li Tao, Zhi Wei Wang, Qian Fa Deng, Feng Chen, and Ping Zhao. "Surface Lapping by Semi-Bonded Abrasive Grinding Plate for Copper Substrates of Amorphous Ni-Pd-P Alloy Films." Advanced Materials Research 53-54 (July 2008): 141–46. http://dx.doi.org/10.4028/www.scientific.net/amr.53-54.141.

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The amorphous Ni-Pd-P alloy films with superior property have good heat conductivity and wear performance. They are widely used in the protecting coating. Copper has been chosen to be a substrate material of the produce of amorphous Ni-Pd-P alloy films with its unique electrical properties. The precision lapping technology for the copper substrate using semi-bonded abrasive grinding plate is studied in this paper. The influences of the different lapping parameters on the surface roughness, material removal rate on copper substrate surface formation in the precision lapping process are both discussed. Experimental results indicate that the copper substrate can be efficiently processed by 800# SiC semi-bonded abrasive grinding plate of, and the initial roughness of a machined surface could be improved from 0.553μm Ra to 0.28μm in 10min, yielding a ideal rarely scratch surface.

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Journal articles on the topic 'Copper-plate'

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