Relevant bibliographies by topics / Copper-plate

Academic literature on the topic 'Copper-plate'

Author: Grafiati
Published: 4 June 2021
Last updated: 28 January 2023

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Contents

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Copper-plate.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Copper-plate"

1

Jiang, Weiyu, Lili Sun, Jijin Mao, Donghui Zhang, and A. Levtsev. "Study on Heat Transfer Performance of Non-integral Capillary Core Sintered Uniform Plate." Bulletin of Science and Practice 7, no. 5 (May 15, 2021): 292–301. http://dx.doi.org/10.33619/2414-2948/66/28.

Full text
Abstract:
This paper mainly introduces the sintering process of the monolithic capillary wick and analyzes the influence of different copper powder particle size, filling rate, copper powder shape and heat source size on the heat transfer performance of the isothermal plate. The experimental results show that: (1) For the isothermal plate sintered with spherical copper powder, the capillary force of large particle size copper powder is small, but the flow resistance is also small, and the performance of the isothermal plate sintered with large particle size copper powder is better. (2) In the case of low filling rate, the isothermal plate is dried due to insufficient return fluid. In the case of high filling rate, on the one hand, the thickness of the liquid film at the evaporation end of the isothermal plate is large, resulting in additional thermal resistance. On the other hand, the thin film evaporation mode will be transformed into pool boiling mode, which will reduce the heat transfer performance. (3) Spherical copper powder sintered plate with regular shape has the best performance, while dendritic copper powder sintered plate has relatively high thermal resistance. (4) The heat source area has a great influence on the thermal resistance of the plate. Under the same heating power, the thermal resistance of the small area heat source is much higher than that of the large area heat source; The thermal resistance of sintered copper plate is lower than that of pure copper plate under two heat source areas.
APA, Harvard, Vancouver, ISO, and other styles
2

Chen, Qiang, Shan Li, Ying Luo, and Wen Long Lu. "Parameters Research of Precise Straightening Process in Roll Straightener." Advanced Materials Research 1095 (March 2015): 800–803. http://dx.doi.org/10.4028/www.scientific.net/amr.1095.800.

Full text
Abstract:
Refined copper to obtain high quality can use the electrolytic method; the copper cathode plate is applied to the electrochemical machining. In order to make copper cathode plate has high flatness, assuring electrolytic cell cathode and anode plate spacing, so that the purity of copper electrolysis precipitation is higher, so change the straightening plate method has become the urgent task of the enterprise. Through the computer simulation, the ANSYS/LS-DYNA computer optimization, analysis precise straightening device parameters, in ensuring the copper starting sheet straightening can meet basic factories requirements, improve the machining precise straightening machine and copper starting sheet straightening efficiency.
APA, Harvard, Vancouver, ISO, and other styles
3

HANASAKA, Takao, Kowashi WATANABE, Shigeru YOKOUCHI, Yuuzo NIIOKA, and Suck Hee BE. "Outgassing Rate of Beryllium-copper Plate and Alumina Plate." SHINKU 36, no. 3 (1993): 230–33. http://dx.doi.org/10.3131/jvsj.36.230.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Andriy Borysovych Grigorov, Kyryl Volodymyrovych Shevchenko, and Irina Valeriivna Sinkevich. "INVESTIGATION OF CORROSIVE EFFECT ON METAL OF A BROAD FUEL FRACTION OBTAINED FROM SECONDARY POLYMER RAW MATERIAL." Bulletin of the National Technical University "KhPI". Series: Chemistry, Chemical Technology and Ecology, no. 2 (4) (July 28, 2022): 75–79. http://dx.doi.org/10.20998/2079-0821.2020.02.10.

Full text
Abstract:
A research of the corrosion effect on the metal (copper plate) of a broad fuel fraction (FPF) - a liquid product of thermal destruction of secondary raw materials made of low pressure polyethylene (LDPE) at temperatures up to 380 ° C and a pressure of 0,12-0,15 MPa. is conducted. Determination of the corrosion effect on the copper FFT plate was carried out in accordance with the standard ASTM D 130-10 at a temperature of 50 ° C for 120 minutes for both the dehydrated FFT sample and in the presence of 1% water. It was found that the copper plates, which were in the FFT and FFT + 1% water in the visual evaluation, had a light orange color, close to the color of the original plate. This, in turn, indicates that the investigated FFT samples have withstood the test, and the corrosive effect on the copper plate can be attributed to a slight fading, class 1.a. Also, together with the study under standard conditions, the corrosion effect on the copper plate of the products of combustion of FFT at different temperatures at which it was found that in the temperature range 180-230 ° C the surface of the copper plate becomes pale purple, and the corrosion effect on the copper plate can be attributed to moderate dimming, class 2.b; at temperatures of 230-290 ° the surface of the copper plate already has a silver color, and the corrosive effect on the copper plate corresponds to a moderate blackout, class 2.d. Therefore, when the combustion products of the FFT on the copper plate only oxygen corrosion occurs, which is due to the presence of oxygen in the area of the copper plate and the temperature of the combustion products. Thus, it was concluded that there is no corrosive elements in the FFT, which makes it suitable for use as a cheap component of motor, furnace and boiler fuels, improving their performance (e.g., reducing sulfur content).
APA, Harvard, Vancouver, ISO, and other styles
5

Li, Xin Cheng, Jie Liu, Wei Xing Zhu, Yong Chun Tang, and Xiao Li Wang. "Research on Preventing Copper-Brittleness Process for Hot Rolling Copper-Containing of Atmospheric Corrosion-Resisting Steel Used in Vehicles." Advanced Materials Research 1049-1050 (October 2014): 27–30. http://dx.doi.org/10.4028/www.scientific.net/amr.1049-1050.27.

Full text
Abstract:
Copper in hot rolling copper-containing steel plate can passivate the cathode-anode of corrosion reaction on plate surface and form a dense anti-rusting layer, so the rusting reaction is postponed and prevented, and the corrosion resistance is enhanced. However, copper enrichment around grain boundaries in copper-containing steel plate leads to the formation of net-like surface cracking called copper-brittleness. In this paper, through researching the technologies of smelting, and adding rare earth and heating, a reasonable and feasible production technology is found, which effectively prevents the defect of copper-brittleness.
APA, Harvard, Vancouver, ISO, and other styles
6

Billy, Anak Sup, Tanti Zanariah Shamshir Ali, Mohd Farid Zainudin, and Abu Bakar Rosli. "Experimental Study of Water Heating Efficiency between Aluminium and Copper Absorber Plate in Solar Flat Plate Collector." Applied Mechanics and Materials 660 (October 2014): 709–13. http://dx.doi.org/10.4028/www.scientific.net/amm.660.709.

Full text
Abstract:
Solar water heating using flat plate collector (FPC) is the widest application that had been used in residential and commercial area. The material for the absorber plate in FPC should have good thermal conductivity to ensure a high value for the heat removal yet able to store heat slightly high during minimum solar radiation period. An experimental of FPC water heating is conducted using copper and aluminium as absorber plate. The plates were exposed under intense sun radiation more than 800w/m2. The analysis is performed on the relationship between the material and the temperature difference of water. The results represented the heat gain and water heating efficiency between aluminium and copper. Aluminium had heat gain of 1100.69W. Copper had the heat gain of 1025.36W. The water heating efficiency calculated for aluminum is 0.97 while copper is 0.93. The paper finally justified that aluminium is better as the absorber plate in this flat plate solar collector compare to copper plate.
APA, Harvard, Vancouver, ISO, and other styles
7

Shi, Xueting, Libin Zhao, Jing Wang, and Libang Feng. "Toward Easily Enlarged Superhydrophobic Copper Surfaces with Enhanced Corrosion Resistance, Excellent Self-Cleaning and Anti-Icing Performance by a Facile Method." Journal of Nanoscience and Nanotechnology 20, no. 10 (October 1, 2020): 6317–25. http://dx.doi.org/10.1166/jnn.2020.17891.

Full text
Abstract:
This work reports a facile method for fabricating superhydrophobic surface on copper plate by AgNO3 treatment and dodecyl mercaptan modification. The as-prepared superhydrophobic copper plate presents hierarchical and rough morphology composed of nanosheets and nanoparticleformed matrix. Meanwhile, long alkyl chains are assembled onto the rough surface successfully. Consequently, the copper plate is endowed with excellent superhydrophobic performance with a water contact angle of 156.8° and a rolling angle of ca. 3°. Moreover, the superhydrophobicity has long-term durability and excellent stability. Grounded on the strong water repellence, the resultant superhydrophobic copper plate surface exhibits multi-functions. The excellent performance can be well explained by “Cushion effect” and Capillary phenomena. As a result, water and corrosive species can be prevented from contacting with the copper plate surface, and contaminants can be taken away easily by the rolling water droplets. Meanwhile, the icing process of water is delayed on the superhydrophobic surface. Therefore, the superhydrophobic copper is endued with enhanced corrosion resistance, excellent self-cleaning and anti-icing performance. We believe that this facile method provides a simple and cost-effective process to improve the properties of copper plate, and which may see practical application of the superhydrophobic materials.
APA, Harvard, Vancouver, ISO, and other styles
8

Fan, Shuai, Jing Song Wang, Qing Wei Guo, Wei Ming Zhang, and Ping Sun. "Recovery of Copper by Electrodeposition Method from Electroplating Wastewater." Applied Mechanics and Materials 662 (October 2014): 141–46. http://dx.doi.org/10.4028/www.scientific.net/amm.662.141.

Full text
Abstract:
Electrodeposition method was applied to recover copper from the simulation of copper-containing electroplating wastewater. Stainless steel plate is used as the cathode and the anode is made of titanium plate coated with RnO2+IrO2, titanium mesh coated with RnO2+IrO2 or stainless steel plate. The electrode potential of copper in electrolyte was calculated, and the effect of initial concentration of copper ions, temperature of electrolyte, voltage, electrode spacing, initial pH value and additive concentration on the recovery of copper was studied in detail. The experimental results showed that the proper anode is titanium plate coated with RnO2+IrO2.Under the condition ofinitial concentration of copper ions 25g/L, temperature of electrolyte 40°C, voltage 3.8V, electrode spacing 25mm, initial pH value 3.60, additive concentration 7.1g/L,the recovery rate of copper can achieve 99.4% and the current efficiency can achieve 88.5%.
APA, Harvard, Vancouver, ISO, and other styles
9

Subasri, Raghavan, and Tadashi Shinohara. "Investigations on the Photoprotection Ability of TiO2 Coated on Copper." Materials Science Forum 475-479 (January 2005): 297–300. http://dx.doi.org/10.4028/www.scientific.net/msf.475-479.297.

Full text
Abstract:
A TiO2 coating when directly applied on copper plate showed an instantaneous ptype behavior, i.e. ennoblement of electrode potential on ultraviolet (UV) illumination though a copper plate when galvanically coupled to an ITO glass coated with TiO2 showed immediate lowering of electrode potential (‘n’-type effect) on illumination under deaerated conditions. The instantaneous p-type effect in the former case was attributed to the presence of a copper oxide layer present between the copper plate and the TiO2 coating. However, a prolonged exposure of the TiO2 coated copper plate showed an n-type effect under illumination after nearly 24 h, following which the electrode potential appeared stable and highly negative. This observation indicated that the photogenerated electrons in TiO2 are capable of reducing the copper oxide layer to ultimately realize the n-type effect of TiO2. The n-type effect could not be observed in aerated electrolyte solutions. The effect of different conditions in the ambience on the photoeffect of copper coated TiO2 will be discussed.
APA, Harvard, Vancouver, ISO, and other styles
10

R., Indra Gandhi. "Pre-processing and Feature Extraction for a Copper Plate Character Recognition System." Journal of Advanced Research in Dynamical and Control Systems 12, SP3 (February 28, 2020): 1071–77. http://dx.doi.org/10.5373/jardcs/v12sp3/20201353.

Full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Dissertations / Theses on the topic "Copper-plate"

1

Ashton, Mark. "Behaviour of metals as a function of strain-rate and temperature." Thesis, Loughborough University, 1999. https://dspace.lboro.ac.uk/2134/10449.

Full text
Abstract:
Five materials, copper (two versions), iron, and armour plate steel (two versions) have been tested at different strain-rates and temperatures. All tests were in compression. The materials were studied to provide experimental data for input into hydrocode models of armour behaviour by the Defence Research Agency, Fort Halstead. A wide selection of metals was examined so that comparisons could be drawn between modelling the behaviour of face centred and body centred cubic metals, and to carry out a broader investigation into how the results obtained were affected by the test methods. Experiments were performed at temperatures from -100°C to 20°C and mean plastic strain-rates from 10-3 to 103 S-l, using a Split Hopkinson Pressure Bar (SHPB) system for high strain-rates and a Hounsfield 50 kN machine for quasistatic conditions. The stress-strain behaviour of the materials as a function of temperature and strain-rate was then determined. The effects of interfacial friction on the measured compreSSlve properties of copper and the armour plate steels have been investigated. Since the coefficient of friction was the critical parameter, ring tests were carried out and the Avitzur analysis applied. In general, the coefficient of friction decreased with increasing strain-rate and temperature. The tested specimen's appearance indicated the same friction trends. Hydrocode modelling of the SHPB system produced corrections to the flow stress, to compensate for interfacial friction, that agree well with those predicted by the Avitzur analysis. Deformed finite element mesh plots analysed in conjunction with barrelled specimens have given a clearer insight into the mechanisms of interfacial friction. The Armstrong-Zerilli constitutive models have been applied to copper, iron and armour plate steel results corrected for thermal softening and specimen-platen interfacial friction. These models have been shown to provide a reasonable description of the materials' behaviour. The research investigation has shown that in order to obtain fundamental stressstrain behaviour of the materials, then corrections must be applied, which can be quite significant. These corrections must take into account the effects of material thermal softening and the specimen-platen interfacial friction.
APA, Harvard, Vancouver, ISO, and other styles
2

Jordan, Rainer, Tao Zhang, Yunhao Du, Felix Müller, and Ihsan Amin. "Surface-initiated Cu(0) mediated controlled radical polymerization (SI-CuCRP) using a copper plate." Saechsische Landesbibliothek- Staats- und Universitaetsbibliothek Dresden, 2015. http://nbn-resolving.de/urn:nbn:de:bsz:14-qucosa-188989.

Full text
Abstract:
Surface engineering with polymer brushes has become one of the most versatile techniques to tailor surface properties of substrates for a broad variety of (bio-) technological applications. We report on a new facile approach to prepare defined and dense polymer brushes on planar substrates by surface-initiated Cu(0) mediated controlled radical polymerization (SI-CuCRP) of numerous vinyl monomers using a copper plate at room temperature. The fabrication of a variety of homo-, block, gradient and patterned polymer brushes as well as polymer brush arrays is demonstrated. The SI-CuCRP was found to be strictly surface-confined, of highly living character, proceeds remarkably fast and results in polymer brushes of very high grafting densities. The brush layer thickness can be modulated by the polymerization time or by the distance of the copper plate to the modified substrate. As the copper plate can be reused multiple times, no additional copper salts are added and only minimal amount of chemicals is needed, the simple and low-cost experimental conditions allows researchers from various fields to prepare tailored polymer brush surfaces for their needs.
APA, Harvard, Vancouver, ISO, and other styles
3

Suka, Akira. "Microstructure and mechanical properties of high copper HSLA-100 steel in 2-inch plate form." Thesis, Monterey, California. Naval Postgraduate School, 1992. http://hdl.handle.net/10945/23957.

Full text
Abstract:
Approved for public release; distribution is unlimited
The microstructure and mechanical properties of highly welda ble high copper HSLA-100 steel in two-inch (50 mm) plate form were investigated in this work. The mechanical property data showed that the steel in the as-quenched and aged conditions not only met the mechanical property specifications of the Navy for HSLA (HY) 100 steels but also satisfied the requirements for HY-130 steels. Optical, scanning and transmission electron microscope studies of the as-quenched plate indicated that the microstructure was a mixture of lath martensite/retained austenite and bainitic ferrite, which is typical of these steels. On aging this microstructure developed the tempered structures usually encountered in HSLA steels. This investigation concludes that: Increased copper HSLA steel meets all the mechanical property specifications of Navy HSLA-100 ksi yield strength steel regardless of heat treatment and plate thickness (up to 50 mm thickness). High copper HSLA-100 steel in 50 mm plate form can fulfill all the mechanical property requirements of Navy 130 ksi yield strength steel with an appropriate temper. The microstructures formed with various heat treatments are consistent with the HSLA-100 CCT diagram. Increasing copper in HSLA-100 steel also increases the toughness as well as the strength, though the dynamics of this process is not clear.
APA, Harvard, Vancouver, ISO, and other styles
4

Mirhi, Mohamad H. (Mohamad Hussein). "Gypsum scale formation on a heated copper plate under natural convection conditions and produced water remediation technologies review." Thesis, Massachusetts Institute of Technology, 2013. http://hdl.handle.net/1721.1/81612.

Full text
Abstract:
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2013.
Cataloged from PDF version of thesis.
Includes bibliographical references (p. 175-181).
Scaling or crystallization fouling of unwanted salts is one of the most challenging and expensive problems encountered in different applications such as heat exchangers and thermal water treatment technologies. Formation of dihydrated calcium sulfate scale, also known as gypsum, on a heated copper plate is studied in lab. The copper plate, held at a given temperature, is immersed in a supersaturated solution of calcium sulfate prepared at a given concentration. The flow conditions are governed by natural convection. A parametric study, in which surface temperature and the degree of supersaturation are varied, is set up and a scale inception time curve is plotted. No scale is observed at a supersaturation index smaller or equal to 1.4. Both higher temperatures and higher concentrations result in faster scale induction; however, the effect of temperature is more significant at lower degrees of supersaturation. SEM images of scale samples show needle-like crystals, the thinnest of which formed at a supersaturation index of 2.0. The classical nucleation theory of Mullin provides an excellent fit for the results. Interfacial energies calculated out of this model are in the reported ranges.
by Mohamad H. Mirhi.
S.M.
APA, Harvard, Vancouver, ISO, and other styles
5

Walter, Sunette. "Characterization of heterotrophic plate count (HPC) bacteria from biofilm and bulk water samples from the Potchefstroom drinking water distribution system / by S. Walter." Thesis, North-West University, 2009. http://hdl.handle.net/10394/4977.

Full text
Abstract:
The presence of heterotrophic plate count (HPC) bacteria in drinking water distribution systems is usually not considered harmful to the general consumer. However, precautions must be taken regarding the immunocompromised. All water supply authorities in South Africa are lawfully required to provide consumers with high-quality drinking water that complies with South African-and international standards. This study mainly focused on the isolation, identification and characterization of HPC and other bacteria from biofilm-and bulk water samples from two sampling points located within the Potchefstroom drinking water distribution system. Based on five main objectives set out in this study, results indicated that the bulk water at the J.S. van der Merwe building was of ideal quality fit for lifetime consumption. Application of enrichment-and selective media allowed for the isolation of 12 different bacterial morphotypes. These were identified by way of biochemical-and molecular methods as Bacillus cereus, Bacillus subtilis, Brevundimonas spp., Clostridiaceae, Corynebacterium renale, Flavobacteriaceae, Kytococcus sedentarius, Leuconostoc lactic, Lysinibacillus sphaericus, Pseudomonas spp., Staphylococcus aureus and Staphylococcus capitis. The greatest diversity of bacteria was detected early autumn 2008, while the lowest diversity occurred during mid-winter 2007. Bacillus cereus, Kytococcus sedentarius and Staphylococcus capitis displayed potential pathogenic properties on blood agar. Kytococcus sedentarius could be classified as potentially the most pathogenic among the isolates. All isolates displayed multiple-resistant patterns towards tested antibiotics. Corynebacterium renale and Staphylococcus aureus were least resistant bacterial species and Lysinibacillus sphaericus the most resistant. All isolates were susceptible to ciprofloxacin (CIP) and streptomycin (S), but most were resistant to erythromycin (E). Transmission electron microscopy (TEM) allowed for detailed examination of Brevundimonas spp., Pseudomonas spp. and Staphylococcus spp. The capability of Brevundimonas spp. to produce slime and store nutrients within inclusion bodies, suggests the ability of this bacterium to form biofilm and persist in the drinking water for prolonged periods. Despite the inhibitory or toxic effect of copper against bacterial growth, scanning electron microscopy (SEM) revealed the presence of biofilms as well as diatoms on red-copper coupons. Biofilm activity was also observed on reverse-osmosis (RO) filters. Since corrosion was evident on red-copper coupons, it is recommended that prospective studies also look into the significance of microbial induced corrosion (MIC) within the Potchefstroom drinking water distribution system. Other prospects include determining minimum inhibitory concentrations of isolates against antibiotics and the application of culture independent methods such as SSCP and DGGE to investigate biofilm development. The use of diatoms as an index of the drinking water quality is also suggested.
Thesis (M.Sc. (Environmental Science))--North-West University, Potchefstroom Campus, 2010.
APA, Harvard, Vancouver, ISO, and other styles
6

Tejpal, Jyoti. "The use of metal and metal oxide nanoparticles against biofilms." Thesis, De Montfort University, 2016. http://hdl.handle.net/2086/13114.

Full text
Abstract:
The persistence of biofilms in hospital settings are associated with Healthcare Associated Infections (HCAI), causing increased morbidity, mortality and healthcare costs. The resistance of biofilms against commonly used hospital disinfectants has been well reported. Metal and metal oxide nanoparticles (NP) such as silver (Ag), copper (Cu), zinc oxide (ZnO) and copper oxide (CuO) exhibit antimicrobial properties against various pathogens. Methods: Biofilm formation of Pseudomonas aeruginosa and Staphylococcus aureus in a Centre for Disease Control (CDC) biofilm reactor and a 96 well plate was compared. A three stage approach including Minimum Biofilm Reduction Concentration (MBRC), R2 values and log(10) reductions was used to assess the efficacy of Ag and ZnO NPs both alone and in combination against P. aeruginosa and S. aureus biofilms. Atomic Absorption Spectroscopy (AAS), Scanning Electron Microscopy (SEM) and Confocal Laser Scanning Microscopy (CLSM) was used to further assess the antimicrobial ability of the metal and metal oxide NPs. The prevention of P. aeruginosa and S. aureus adherence on Ag and ZnO thin film coating on silicon (Si) surfaces was also investigated, as well as icaC, ebpS and fnbB gene expression in S. aureus biofilms. Results: The CDC biofilm reactor demonstrated to be the most effective method for P. aeruginosa and S. aureus biofilm production in comparison to 96 well plates, with lower standard errors of the mean (SE) and higher replicability. Individual MBRC of ZnO and Ag NPs in suspension were 256 and 50 µg/ml for P. aeruginosa and 16 and 50 µg/ml for S. aureus respectively. The concentrations in combination were reduced by at least a half, with concentrations of 32/25 µg/ml of ZnO/Ag NPs in suspension resulting in a significant (p ≤0.05) reduction of 3.77 log(10) against P. aeruginosa biofilms and 8/12 µg/ml of ZnO/Ag NPs in suspension resulted in a 3.91 log(10) (p ≤0.05) against S. aureus biofilms. Both combinations showed an additive effect. Time point analysis confirmed that a 24 hour treatment is vital for any significant (p ≤0.05) antimicrobial activity. AAS data suggested that the Ag+ ions quenched Zn2+ ions, therefore the antimicrobial efficacy of the combination is mainly due to Ag+ ions. Damage of the biofilms from Ag and ZnO NPs was observed in the SEM imaging and energy dispersive X-ray (EDX) analysis confirmed the adherence of Zn and Ag within the biofilms. CLSM imaging showed dead (red) cells of P. aeruginosa and S. aureus biofilms throughout the depth of the biofilm. P. aeruginosa formation was reduced by 1.41 log(10) and 1.43 log(10) on Ag and ZnO thin film coatings respectively. For S. aureus, a reduction of 1.82 log(10) and 1.65 log(10) was obtained for Ag and ZnO coating respectively. Only low levels of ribonucleic acid (RNA) were achieved so no further gene analysis could occur. Conclusion: Reductions of ≥3 log(10) were observed for P. aeruginosa and S. aureus biofilm treatment with ZnO/Ag NP suspensions. It can be concluded that the ZnO/Ag NP suspensions had greater antimicrobial activity than Ag and ZnO coated surfaces owing to large concentrations of Ag+ and Zn2+ ions acting upon the biofilms. The slower release of ions from coated surfaces suggest an inadequate concentration of ions in the media, which are therefore unable to prevent biofilm formation as rapidly as NP suspensions, however provide a sustained release of ions over time. The results from this investigation propose that Ag and ZnO NPs in suspension could be a potential alternative to disinfectants for use in nosocomial environments against P. aeruginosa and S. aureus biofilms.
APA, Harvard, Vancouver, ISO, and other styles
7

Buřič, Jan. "Vnitřní prostředí a výplně otvorů." Master's thesis, Vysoké učení technické v Brně. Fakulta stavební, 2016. http://www.nusl.cz/ntk/nusl-239950.

Full text
Abstract:
The aim this diploma thesis is the design of heating and hot water in the building of a primary school in Trhové Sviny. The first part dealt with the issue of indoor environment and windows. The second part deals with a separate proposal heating and hot water in primary school. As a heat source was designed gas boiler, the second variant hot transfer station. The third part consists of technical reports and drawings of the specified object. The fourth part deals with the assessment of surface condensation on the surface of the window panes.
APA, Harvard, Vancouver, ISO, and other styles
8

Takeda, Sho. "A Study of the Consolidation Process of Cu from Powder to Plate by Compression Shearing Method." Thesis, Lyon, 2018. http://www.theses.fr/2018LYSEC047.

Full text
Abstract:
Compression shearing method at room temperature (COSME-RT)’ est une technique de moulage de matériaux (en particulier de métaux) de la poudre à la plaque en appliquant une force biaxiale simultanée à la température ambiante et dans une atmosphère ambiante. COSME-RT diffère des techniques de moulage conventionnelles en ce sens qu'il peut fabriquer des matériaux sans processus de chauffage et peut ainsi développer de nouveaux matériaux qui ne peuvent pas être formés par des procédés conventionnels. Cependant, le mécanisme de consolidation des matériaux de COSME-RT n’a pas été clarifié en raison de la difficulté de contrôler le processus. Pour contrôler le processus de consolidation des matériaux métalliques avec COSME-RT, j'ai tenté deux expériences visant à contrôler la force de cisaillement: (1) la suppression de la force de cisaillement en dispersant des particules solides de lubrifiant dans des particules de poudre de Cu; et (2) le test de frottement unidirectionnel sur l'échantillon de poudre comprimée uniaxiale pour créer et observer le changement de la condition de liaison dans la direction de la profondeur de l'échantillon. En conséquence, j'ai réussi à acquérir de nouvelles connaissances sur le processus de consolidation des plaques de Cu de poudre de COSME-RT et à construire le nouveau modèle de consolidation du Cu de COSME-RT
Compression shearing method at room temperature (COSME-RT) is a molding technique for materials (especially metals) from powder to plate by applying simultaneous biaxial force at room temperature and an ambient atmosphere. COSME-RT differs from conventional molding techniques in that it can fabricate materials without a heating process and can thus develop new materials that cannot be formed by conventional methods. However, the consolidation mechanism of materials by COSME-RT has not been clarified because of the difficulty of controlling the process. To control the consolidation process of metal materials by COSME-RT, I attempted two experiments to control the shearing force: (1) the suppression of the shearing force by dispersing solid lubricant particles into Cu powder particles; and (2) the unidirectional friction test on the uniaxial compressed powder sample to create and observe the change of the bonding condition in the depth direction of the sample. As a result, I successfully obtained new knowledge about the consolidation process of Cu plate from powder by COSME-RT and built the new consolidation model of Cu by COSME-RT
APA, Harvard, Vancouver, ISO, and other styles
9

Furberg, Richard. "Enhanced Boiling Heat Transfer on a Dendritic and Micro-Porous Copper Structure." Doctoral thesis, KTH, Tillämpad termodynamik och kylteknik, 2011. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-47538.

Full text
Abstract:
A novel surface structure comprising dendritically ordered nano-particles of copper was developed during the duration of this thesis research project. A high current density electrodeposition process, where hydrogen bubbles functioned as a dynamic mask for the materials deposition, was used as a basic fabrication method. A post processing annealing treatment was further developed to stabilize and enhance the mechanical stability of the structure. The structure was studied quite extensively in various pool boiling experiments in refrigerants; R134a and FC-72. Different parameters were investigated, such as; thickness of the porous layer, presence of vapor escape channels, annealed or non-annealed structure. Some of the tests were filmed with a high speed camera, from which visual observation were made as well as quantitative bubble data extracted. The overall heat transfer coefficient in R134a was enhanced by about an order of magnitude compared to a plain reference surface and bubble image data suggests that both single- and two-phase heat transfer mechanisms were important to the enhancement. A quantitative and semi-empirical boiling model was presented where the main two-phase heat transfer mechanism inside the porous structure was assumed to be; micro-layer evaporation formed by an oscillating vapor-liquid meniscus front with low resistance vapor transport through escape channels. Laminar liquid motion induced by the oscillating vapor front was suggested as the primary single-phase heat transfer mechanism. The structure was applied to a standard plate heat exchanger evaporator with varying hydraulic diameter in the refrigerant channel. Again, a 10 times improved heat transfer coefficient in the refrigerant channel was recorded, resulting in an improvement of the overall heat transfer coefficient with over 100%. A superposition model was used to evaluate the results and it was found that for the enhanced boiling structure, variations of the hydraulic diameter caused a change in the nucleate boiling mechanism, which accounted for the largest effect on the heat transfer performance. For the standard heat exchanger, it was mostly the convective boiling mechanism that was affected by the change in hydraulic diameter. The structure was also applied to the evaporator surface in a two-phase thermosyphon with R134a as working fluid. The nucleate boiling mechanism was found to be enhanced with about 4 times and high speed videos of the enhanced evaporator reveal an isolated bubble flow regime, similar to that of smooth channels with larger hydraulic diameters. The number and frequency of the produced bubbles were significantly higher for the enhanced surface compared to that of the plain evaporator. This enhanced turbulence and continuous boiling on the porous structure resulted in decreased oscillations in the thermosyphon for the entire range of heat fluxes.
QC 20111111
APA, Harvard, Vancouver, ISO, and other styles
10

Mašek, Jakub. "Funkční zkouška tepelného spínače pro prostředí planety Mars." Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2016. http://www.nusl.cz/ntk/nusl-254304.

Full text
Abstract:
Diplomová práce se zabývá studiem projektu tepelného spínače a dosažených výsledků. Zaměřuje se především na vývoj zařízení pro zkoušení tepelného spínače v podmínkách odpovídající prostředí planety Marsu. První část práce se zabývá především popisem vývoje zkušební komory určené pro simulaci extrémních podmínek, tj. nízkého tlaku a teplot, od předběžného návrhu až po konečnou podobu komory, která bude použita pro předepsané zkoušky. Práce popisuje také důvody úprav některých částí komory a uvádí návrhy řešení nepředvídaných událostí, které vznikly v průběhu testů. Cílem druhé části práce je návrh kampaně pro zkoušení tepelného spínače od úvodních zkoušek ověření základní funkčnosti komory, přes ověření vlastností a nastavení všech systémů měřícího zařízení, až po zkoušky na prvních vzorcích a závěrečném kvalifikačním modelu tepelného spínače. Dále se práce zaměřuje na postup vyhodnocení naměřených dat a jevů, které jej ovlivňují. Kalibrační zkoušky zařízení, systémů a postupu vyhodnocení naměřených dat, které byly provedeny na speciálně navržených náhradních vzorcích, jsou téměř u konce. Jakmile budou výsledky schváleny, zkušební komora i navržené postupy měření budou připraveny pro požadované zkoušení vzorků tepelného spínače.
APA, Harvard, Vancouver, ISO, and other styles
More sources

Books on the topic "Copper-plate"

1

Karnataka (India). Directorate of Archaeology & Museums. Copper plate inscriptions from Karnataka. Edited by Nagaraja Rao M. S and Ramesh K. V. 1935-. Mysore: Directorate of Archaeology & Museums, Govt. of Karnataka, 1997.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
2

R, Srinivasa Ayyangar, ed. Catalogue of copper plate grants. Chennai: Government Museum, 2000.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
3

Marlene, MacCallum, ed. Copper plate photogravure: Demystifying the process. Boston: Focal Press, 2003.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
4

Filliozat, Jean. A copper plate inscription of Śrīraṅgarāya I. Pondicherry: Pondicherry Museum, Govt. of Pondicherry, 1986.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
5

Copper-plate and stone inscriptions of ancient and medieval Assam. New Delhi: LBS Publications, 2010.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
6

Rowe, Michael, 1948 June 14-, ed. The colouring, bronzing, and patination of metals: A manual for the fine metalworker and sculptor : cast bronze, cast brass, copper and copper-plate, gilding metal, sheet yellow brass, silver and silver-plate. New York, N.Y: Watson-Guptill Publications, 1991.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
7

Richard, Hughes. The colouring, bronzing and patination of metals: A manual for the fine metalworker and sculptor, cast bronze, cast brass, copper and copper-plate, gilding metal, sheet yellow brass, silver and silver-plate. London: Crafts Council, 1988.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
8

Suka, Akira. Microstructure and mechanical properties of high copper HSLA-100 steel in 2-inch plate form. Monterey, Calif: Naval Postgraduate School, 1992.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
9

Copper-plate inscriptions of Odisha: A descriptive catalogue (circa fourth century to sixteenth century CE). New Delhi: D.K. Printworld, 2014.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
10

S, Nagaraja Rao M., and Ramesh K. V. 1935-, eds. Copper plate inscriptions from Karnataka: Recent discoveries in the Directorate of Archaeology & Museums, Govt. of Karnataka, Mysore. Mysore: The Directorate, 1985.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Book chapters on the topic "Copper-plate"

1

Greenspan, Donald. "Crack Development in a Stressed Copper Plate." In Particle Modeling, 161–69. Boston, MA: Birkhäuser Boston, 1997. http://dx.doi.org/10.1007/978-1-4612-1992-7_13.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Praveen Bharathwaj, R., M. B. Varun Pradeep, Joe Jones Raju, A. Satheesh, and P. Padmanathan. "Performance Study on Flat Plate Solar Water Heater with Copper Nanoparticles." In Lecture Notes in Mechanical Engineering, 539–53. Singapore: Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-7831-1_50.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Jaypuria, Sanjib, Santosh Kumar Gupta, Dilip Kumar Pratihar, Debalay Chakrabarti, and M. N. Jha. "Effect of Amplitude Oscillation on Spiking in Electron Beam Welding of Copper Plate." In Lecture Notes in Mechanical Engineering, 405–11. Singapore: Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-1307-7_45.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Kulke, Hermann. "Some Observations on the Political Functions of Copper-Plate Grants in Early Medieval India." In Schriften des Historischen Kollegs, 237–43. München: Oldenbourg, 1997. http://dx.doi.org/10.1524/9783486594355.237.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Kamaruddin, Norhalimatul Saadiah, Muhammad Amir Mohammad Zohir, Ahmad Kamal Ismail, and Nor Haslina Ibrahim. "Effect of a Gap Between Electrodes by Using the Coplanar Copper Plate in Capacitive Sensing." In Advanced Structured Materials, 137–46. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-67750-3_12.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Chaudhary, Santosh, and KM Kanika. "Hydromagnetic Flow of Copper-Water Nanofluid with Different Nanoparticle Shapes toward a Nonlinear Stretchable Plate." In Mathematics Applied to Engineering and Management, 267–84. Boca Raton : Taylor & Francis, a CRC title, part of the Taylor & Francis imprint, a member of the Taylor & Francis Group, the academic division of T&F Informa, plc, 2019. | Series: Mathematical engineering, manufacturing, and management sciences: CRC Press, 2019. http://dx.doi.org/10.1201/9781351123303-10.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Das, Dudul, and Pankaj Kalita. "Performance Improvement of a Novel Flat Plate Photovoltaic Thermal (PV/T) System Using Copper Oxide Nanoparticle—Water as Coolant." In Springer Proceedings in Energy, 97–104. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-63085-4_14.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Meng, Xiang-ning, and Miao-yong Zhu. "Effect of Casting Speed on Temperature Difference between Copper Plate and Solidifying Shell in Meniscus of Slab Continuous Casting Mold." In EPD Congress 2011, 755–62. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2012. http://dx.doi.org/10.1002/9781118495285.ch82.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Thakur, Amrit Kumar, and V. P. Chandramohan. "Productivity Enhancement of Passive Type Solar Still Using Copper and Aluminum Based Absorber Plate with Al2O3 NanoFluid in Water Basin." In Advances in Energy Research, Vol. 2, 273–81. Singapore: Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-2662-6_26.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Ahmed, Nihal, Ashfaq Ahmed, and Muntasir Mamun. "Comparative Study of Different Implicit Finite Difference Methods to Solve the Heat Convection–Diffusion Equation for a Thin Copper Plate." In Algorithms for Intelligent Systems, 105–16. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-0586-4_9.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Copper-plate"

1

Yokoyama, S., Y. Ishikawa, M. N. A. Muizz, M. N. N. Hisyamudin, K. Nishiyama, J. Sasano, and M. Izaki. "Preparation of graphite dispersed copper composite on copper plate with CO2 laser." In THE IRAGO CONFERENCE 2017: A 360-degree Outlook on Critical Scientific and Technological Challenges for a Sustainable Society. Author(s), 2018. http://dx.doi.org/10.1063/1.5021926.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Noor, Abdul Muizz Mohd, Yoshikazu Ishikawa, and Seiji Yokoyama. "Preparation of graphite dispersed copper composite with intruding graphite particles in copper plate." In THE IRAGO CONFERENCE 2016: 360 Degree Outlook on Critical Scientific and Technological Challenges for a Sustainable Society. Author(s), 2017. http://dx.doi.org/10.1063/1.4974798.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Sharma, Vyas Mani, Vikranth Racherla, and Surjya Kanta Pal. "Fabrication of Copper Foam Plate Using Friction Sintering." In ASME 2019 14th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/msec2019-2952.

Full text
Abstract:
Abstract A novel friction sintering process is used to obtain large copper foam plates using sintering and dissolution process. The process ensures easy and quick removal of the sintered product. Heat and pressure generated by downfeed of rotating tungsten tool pressed against a “top plate” results in solid-state sintering of copper powder particles. The large sized sintered part was obtained by providing a scan path for tool covering the “die” containing Cu-NaCl mixture. Note that no pre-compression of Cu-NaCl is done before the start of the process. Compaction and sintering both happen during the course of friction sintering. Scanning electron microscopy (SEM) images of fracture surface indicate that pore morphology is dictated by the morphology of NaCl particles. Temperature increases with the increase in plunge depth. The stress-strain curves for obtained foam in compression are similar to the reported in.
APA, Harvard, Vancouver, ISO, and other styles
4

Hoecker, Rainer, Bruce V. Johnson, Josef Hausladen, Matthias Rothbrust, and Bernhard Weigand. "Impingement Cooling Experiments With Flat Plate and Pin Plate Target Surfaces." In ASME 1999 International Gas Turbine and Aeroengine Congress and Exhibition. American Society of Mechanical Engineers, 1999. http://dx.doi.org/10.1115/99-gt-252.

Full text
Abstract:
Heat transfer experiments were conducted with three (3) different target plate configurations: a baseline copper flat smooth plate, a copper plate model with copper pins and a copper plate model with Teflon pins, to determine average heat transfer coefficients on the flat and pin surfaces for application with different plate materials. For each target plate surface configuration, the heat transfer experiments were conducted with selected impingement orifice plate configurations and with selected spacing between the orifice plate and the heat transfer target plate. The heat transfer results for the baseline copper smooth flat plate were in good agreement with a well-recognized correlation for the flow regions used in the correlation. An analytical procedure, similar to that used by Metzger et al. for pin-fins in coolant channels, was developed to separate the average heat transfer coefficients on the flat and pin surfaces. The results with the copper pins showed modest increases of approximately 35 percent in heat transfer at lower Reynolds numbers, decreasing with increased Reynolds number. Application of the experimental results to an analysis for high-pressure engine conditions with modest thermal conductivity materials showed that the overall heat transfer coefficient can decrease with pin surfaces for some conditions, compared to flat plates.
APA, Harvard, Vancouver, ISO, and other styles
5

Chen Zhonghua, Li Benjun, and Guo Fengyi. "Coupled temperature field analysis for copper wire/copper-dipped carbon plate under electric current." In 2011 1st International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST). IEEE, 2011. http://dx.doi.org/10.1109/icepe-st.2011.6123065.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Khrustalev, Dmitry K. "Thin Copper-Water Heat Pipe Plate for Electronic Cooling." In 34th Intersociety Energy Conversion Engineering Conference. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1999. http://dx.doi.org/10.4271/1999-01-2529.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Fu, Wei, Qilin Deng, Peng Cao, and Dianbing Chen. "Research of Laser Cladding on Mold Copper Plate Surface." In 2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering. Paris, France: Atlantis Press, 2014. http://dx.doi.org/10.2991/meic-14.2014.199.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Suzuki, Takashi, Takao Araki, and Minoru Nishida. "Surface activated bonding for copper plate by excimer laser irradiation." In LAMP 2002: International Congress on Laser Advanced Materials Processing, edited by Isamu Miyamoto, Kojiro F. Kobayashi, Koji Sugioka, Reinhart Poprawe, and Henry Helvajian. SPIE, 2003. http://dx.doi.org/10.1117/12.486585.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

DeMar, S. "Modernization and Customization of a Copper Plate Mill Descale System." In AISTech 2021. AIST, 2021. http://dx.doi.org/10.33313/382/177-21514-134.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

DeMar, S. "Modernization and Customization of a Copper Plate Mill Descale System." In AISTech 2021. AIST, 2021. http://dx.doi.org/10.33313/382/077.

Full text
APA, Harvard, Vancouver, ISO, and other styles
You might also be interested in the extended bibliographies on the topic 'Copper-plate' for particular source types:
Journal articles Dissertations / Theses Books
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography