Relevant bibliographies by topics / Copper-gold

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Copper-gold'

Author: Grafiati
Published: 4 June 2021
Last updated: 28 January 2023

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Journal articles on the topic "Copper-gold"

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Zhu, Zhimin. "Gold in iron oxide copper–gold deposits." Ore Geology Reviews 72 (January 2016): 37–42. http://dx.doi.org/10.1016/j.oregeorev.2015.07.001.

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Freeman Gilstrap, Dorothy. "From Copper to Gold." Journal of Bahá’í Studies 3, no. 2 (June 1, 1990): 25–33. http://dx.doi.org/10.31581/jbs-3.2.428(1990).

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Four areas concerning the biography From Copper to Gold are discussed: the historical context of this biography, the approach and pace of the book, typical problems associated with the writing, and the groundwork of beliefs from which Dorothy Baker gained her strength. *This paper is adapted from the Hasan Balyuzi Memorial Lecture presented at the 10th Annual Conference of the Association for Bahá’í Studies, Vancouver, August 1985.
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Stepanov, V. A., V. Ye Kungurova, and I. A. Koidan. "Металлогения Камчатского срединного массива." Bulletin of the North-East Science Center, no. 4 (December 28, 2020): 39–54. http://dx.doi.org/10.34078/1814-0998-2020-4-39-54.

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The article describes the ore bearance of three stages of reflected activation of the Kamchatka middle massif: Late Cretaceous, Eocene, and Miocene. In the first stage, gold mineralization of the gold-quartz and gold-sulfide-quartz formations was formed; in the second - sulfide platinoid-copper-nickel; in the third - gold-copper-molybdenum-porphyry. The relationship of gold, sulfide platinoid-copper-nickel and gold-copper-molybdenum-porphyry mineralization with certain igneous rock complexes - (Kola, Dukuk and Lavkin) is shown. The mining of nickel, copper from the Shanuch deposit and gold from placers has been noted.
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Swinbourne, D. R., G. G. Barbante, and A. Strahan. "Influence of gold content on copper oxidation from silver-gold-copper alloys." Metallurgical and Materials Transactions A 27, no. 10 (October 1996): 3187–91. http://dx.doi.org/10.1007/bf02663869.

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Guan, Y., and K. N. Han. "The dissolution behavior of gold and copper from gold and copper alloys." Mining, Metallurgy & Exploration 10, no. 2 (May 1993): 66–74. http://dx.doi.org/10.1007/bf03403002.

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Erdenebold, U., C. M. Sung, and J. P. Wang. "Gold recovery from flotation concentrate from gold mine tailings using dissolve smelting." Journal of Mining and Metallurgy, Section B: Metallurgy 55, no. 3 (2019): 343–49. http://dx.doi.org/10.2298/jmmb181005038e.

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Gold flotation concentrate may contain relatively high concentrations of valuable metals such as iron, copper, and zinc, and occasionally, even precious metals such as gold. The major components of the concentrate are SiO2, Fe2O3, and Al2O3, but it also contains reactive sulphide minerals such as pyrite. The sulphides in the flotation concentrate are fully converted into an oxide form during oxidative roasting, therefore, the chemical composition of the roasted concentrate is considered to be a copper slag. High temperature smelting with additives to dissolve Au from the gold concentrate into a molten copper was used in the research. Gold greatly dissolved at 1600?? under a CaO/SiO2 ratio of 1.25, suggesting the increase in the dissolution of gold into molten copper with decreasing viscosity of the molten slag-like concentrate at high temperatures.
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Asonen, H., C. J. Barnes, M. Pessa, R. S. Rao, and A. Bansil. "Electronic structure of copper-rich copper-gold alloys." Physical Review B 31, no. 6 (March 15, 1985): 3245–50. http://dx.doi.org/10.1103/physrevb.31.3245.

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Ho, Hong Meng, Wai Lam, Serguei Stoukatch, Petar Ratchev, Charles J. Vath, and Eric Beyne. "Direct gold and copper wires bonding on copper." Microelectronics Reliability 43, no. 6 (June 2003): 913–23. http://dx.doi.org/10.1016/s0026-2714(03)00074-x.

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Zalesov, M. V., V. A. Grigoreva, V. S. Trubilov, and A. Ya Boduen. "Designing of engineering solutions to enhance efficiency of high-copper gold-bearing ore processing." Mining Industry Journal (Gornay Promishlennost), no. 5/2021 (November 12, 2021): 51–56. http://dx.doi.org/10.30686/1609-9192-2021-5-51-56.

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The modern metals industry is characterised by a downward trend in the quality of ores involved in processing, and conventional methods of extracting useful components are inefficient for raw materials with complex composition. To maintain the growing level of metal production it is required to introduce new efficient technologies for processing of low-grade and refractory ores as well as man-made deposits. The article describes processing methods of refractory raw materials with high cyanide content using copper-gold ores as an example, where gold is the primary commodity, and copper is the accompanying useful component. The most common method of processing copper-gold ores is preconcentration followed by selective leaching of copper and gold. In some cases, technologies involving copper by-products and cyanide recovery from the cyanide leaching solutions offer equally effective options for processing of the copper-gold ores and concentrates. Copper-gold ores are processed at gold mines using the cyanide procedures, supplemented if required by gravity and flotation concentration. In all variations of the cyanide treatment, most of copper minerals actively react with cyanides of alkali metals, binding the CN– ions into the copper complex of [Cu(CN3)]2–. This reaction results in an increased solvent consumption, as well as in number of challenges related to cleaning tailings and slurries from highly toxic cyanide compounds and dissolved copper. In addition to technological complications associated with the need to meet strict requirements for the maximum permissible concentrations, copper accumulated in the cycling solutions also causes a decrease in gold extraction from the processed ores.
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Yin, Na, Wen Qing Qu, Shu Juan Yang, Rui Li, and Ying Ding. "Welding Technology of Gold Alloy." Advanced Materials Research 629 (December 2012): 214–19. http://dx.doi.org/10.4028/www.scientific.net/amr.629.214.

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Conducting ring is an electric transmission device to achieve current, video, data signal and power transmission between two relatively slewing mechanism, so it has been widely used in all kinds of precision turntable and inertial navigation equipment. The slip ring and brush wire of conducting ring are connected to other equipment by copper wire or copper transfer metal plates. Currently, Eutectic 63Sn-37Pb solder and electric iron manual welding are often used. But for gold alloy, when SnPb solder is used, gold element will dissolve in solder because Au dissolves in Sn easily, and brittleness intermetallic was produced at the interface during cooling, which embrittled the joint. This paper analyzed the solderability of gold alloy and copper, summed up the research status of soldering technology of gold alloy and copper in China and abroad. It pointed out that it is necessary and urgent to develop soldering technology of gold alloy with copper.
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Dissertations / Theses on the topic "Copper-gold"

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Altass, Hatem. "HCl nanoscience at copper and copper/gold alloy surfaces." Thesis, Cardiff University, 2013. http://orca.cf.ac.uk/50823/.

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The reaction of HCl with clean, Cu(100) and (111), and Au/ Cu(100) surfaces was investigated using x-ray photoelectron spectroscopy (XPS) and scanning tunneling microscopy (STM) under ultra high vacuum (UHV) conditions. Exposure of the Cu(100) and (111) samples to HCl at room temperature leads to the formation of a saturated copper chloride monolayer. In the case of Cu(100), the saturated coverage was half monolayer corresponding to a c(2x2)-Cl reconstruction (half monolayer is 7.25x1014 cm-2) while for Cu(111) it was one third monolayer consistent with the reconstruction of (√3x√3)R30o (one third monolayer 5.9x1014 cm-2). The interaction of HCl with preoxidised Cu(100) and (111) showed different behaviour from those of clean copper surface depending on the way of interaction of oxygen with copper surface. Interaction of HCl with peroxidised Cu(111) at saturation oxygen coverage leads to the adsorption of chlorine on top of the copper surface with one third coverage. In contrast, presence of oxygen on Cu(100) surface at saturation coverage or less leads to adsorb chlorine but with an excess in chlorine concentration (more than the expected c(2x2) coverage). Oxidized Cu(100) and (111) surface at elevated temperature leads to the formation multi oxide layer. The two oxide surfaces („‟44‟‟ and „‟29‟‟) observed at the Cu(111) depend on the temperature of the substrate at the time of oxidation. The (√2x2√2)R45o structure was observed on the Cu(100) surface on heating which is the same structure formed at saturation coverage at room temperature. Interaction of HCl with Cu(100) and (111) surfaces covered by multilayers of oxide lead to adsorption of chlorine on top of the copper surface with a coverage more than more than the saturation coverage. Interaction of HCl with Au/Cu(100) showed two different behaviour depending on the gold coverage. Au/Cu(100) alloy formed at half monolayer of gold coverage, forming c(2x2) structure. Exposure of the Au/Cu(100) alloy at half monolayer of gold coverage to HCl leads to the formation of c(2x2)-Cl structure with saturation coverage of half monolayer in similar manner of interaction of HCl with the clean cu(100) surface. Interaction of HCl with Au/Cu(100) surface at gold coverage more than half monolayer leads to a dealloying of the gold from the copper surface and forming the Au(111) surface. Cu-Cl formed underneath the Au(111) surface with excess of chlorine concentration.
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Zheng, Jialong. "An electrochemical study of the copper-gold-cyanide system with reference to the processing of copper-gold ores." Thesis, Zheng, Jialong (2000) An electrochemical study of the copper-gold-cyanide system with reference to the processing of copper-gold ores. PhD thesis, Murdoch University, 2000. https://researchrepository.murdoch.edu.au/id/eprint/52721/.

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Gold and copper often occur together in ores, an occurrence which creates processing difficulties since cyanide leach solutions are not selective for gold. Copper contamination can result in serious problems throughout the conventional carbon-inpulp process, often making the operation uneconomic. This thesis describes electrochemical studies of two ways of dealing with copper contamination. One concerns the selective electrodeposition of gold from coppercontaining cyanide solutions; the second concerns the possibility of selectively leaching gold from copper-containing ores using an aerated ammoniacal cyanide solution. In the electrowinning study, a rotating disc electrode technique was combined with a method of chemical analysis to investigate the codeposition behaviour of copper and gold. In these experiments, the variables were gold concentration, agitation, free cyanide concentration, pH and temperature. The experimental results obtained have provided an improved understanding of the electrolytic codeposition of copper with gold in cyanide solutions. The major factors influencing copper codeposition with gold are the free cyanide concentration, the operating temperature and the pH of the electrowinning solution. By controlling these variables in the electrowinning operation, it is possible to minimise the copper deposition. Pulsed potential control was employed as an alternative to constant potential electrodeposition as a means of reducing copper codeposition in the gold electrowinning process. It was demonstrated in this work that by simply varying the parameters of the applied pulsed potential waveform, all other operating conditions being the same as for the constant potential case, copper contamination was greatly reduced. This improvement is due to the high instantaneous gold deposition rate during the cathodic potential pulse period and the copper redissolution during the anodic potential pulse period. A rotating electrochemical quartz crystal microbalance (REQCM) technique was developed in this research work. It was demonstrated that this REQCM technique is capable of measuring the partial current of a metal deposition in the potential region where the hydrogen evolution reaction is involved.. Thus, obtaining information outside the electrochemical window of a solid electrode become possible. The REQCM was used to study the mechanism of copper and gold deposition from cyanide solution. One of the findings from this work is that when using the chronopotentiometric method to study metal dissolution or cementation reactions, the effect of the inert substrate must be taken into account. It was found that the substrate has no influence on the rate if the reaction is diffusion controlled; however, it markedly affects the rate of chemically controlled reactions. The magnitude of the effect is related to the catalytic activity of the substrate. The REQCM technique was also used to study the mechanism of selective leaching of gold from copper contaminated ores using ammoniacal cyanide. Experimental results show that in copper containing cyanide solutions, the copper-cyanide complex species takes part in the gold dissolution reaction. The addition of ammonia to solutions containing copper and cyanide greatly diminishes the rate of gold dissolution. However, when the cyanide to copper ratio is close to 2:1, the rate of gold dissolution increases on addition of ammonia. This may be due to the formation of some goldammonia complex or the involvement of the formation of Cu(II)- cyanide-ammonia complex which can act as an oxidant in the gold leaching process.
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Clark, Graeme Lawrence. "Studies of copper and gold vapour lasers." Thesis, University of St Andrews, 1988. http://hdl.handle.net/10023/13803.

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The work described in this thesis covers various aspects of pulsed copper and gold vapour lasers. The work is divided into four main parts : a computer model of the kinetics of the copper vapour laser discharge; construction and characterization of a copper vapour laser and a gold vapour laser system (to be used for photodynamic cancer treatment); analysis of the thermal processes occurring in the various forms of thermal insulation used in these lasers; and studies of the use of metal walls to confine a discharge plasma. The results of this work were combined in the design of the first copper vapour laser to use metal rather than an electrically insulating ceramic material for confinement of the discharge plasma. Laser action in copper vapour has been achieved in a number of metal-walled designs, with continuous lengths of metal ranging from 30 mm, in a segmented design, to 400 mm, where the discharge plasma was confined by two molybdenum tubes of this length. A theoretical explanation of the behaviour of plasmas in metal-walled discharge vessels is described.
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Breuer, Paul 1968. "Gold leaching in thiosulfate solutions containing copper(II) and ammonia." Monash University, Dept. of Chemical Engineering, 2002. http://arrow.monash.edu.au/hdl/1959.1/7762.

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Kydd, Richard Berwick Chemical Sciences &amp Engineering Faculty of Engineering UNSW. "Synthesis and characterisation of gold and copper oxidation catalysts." Awarded by:University of New South Wales. Chemical Sciences & Engineering, 2009. http://handle.unsw.edu.au/1959.4/44549.

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In this work, Gold and Copper oxidation catalysts supported on a range of metal oxides were synthesised via 2 previously uninvestigated preparation methods. In the first chapter, Gold nanoparticle catalysts were deposited onto TiO2, CeO2 and ZrO2 nanoparticles via the non-aqueous Modified Photodeposition procedure. This method was found to produce smaller Gold particle sizes following intrinsic excitation of the support than the conventional aqueous phase method, with surface physisorbed water apparently acting as the sacrificial reductant. The as prepared catalysts were drastically more active than those prepared by the conventional method and under standardised tests were directly comparable to those prepared by the Deposition Precipitation Method. The second part of the work, explored the preparation of metal oxide supported Copper catalysts via the Flame Spray Pyrolysis process. CO Oxidation tests established the following order of activity for 4wt% Cu loaded on the various supports: Cu-CeO2 > Cu-TiO2 > Cu-ZrO2 > Cu-Al2O3 > Cu-SiO2. CO-TPD studies found that more active materials tended to adsorbed more CO and reacted higher proportions of this with lattice oxygen to form CO2 at lower temperatures. The addition of Cu to each metal oxide surface was found to induce lengthening of the average Metal-Oxygen bond length, with higher electron density on surface O. This phenomenum is proposed as being responsible for the widely reported ???synergistic effect??? reported for similar Cu catalysts. Cu-CeO2 (0-12wt%) catalysts were tested in the Preferential CO Oxidation (COPROX) reaction. Increasing Cu content, varied the Cu morphology from monomers, through to dimers and ultimately CuO crystallites. DFT simulations of the Cu dimer structure revealed higher levels of bonding ionicity in this morphology, relative to the monomeric structure. This coincided with higher levels of activity, reinforcing the earlier finding that highly ionic bonds are conducive to higher levels of activity. High levels of activity and selectivity were maintained until approximately 423 K. Surface redox properties of the 4wt% Cu-CeO2 catalyst were assessed using temperature-programmed reduction (CO, H2) and desorption (CO) experiments, as well as in situ and phase-resolved infrared spectroscopy to study the transition to nonselective conditions. For the first time, it was demonstrated that CO and H2 react at identical surface sites, with CO2 formation proceeding simultaneously via three distinct Cux+-CO carbonyl species. Under non-selective conditions, a gradual red-shift and loss of intensity in the carbonyl peak was observed, indicating reduction of Cu+ to Cu0 and the onset of an alternate non-selective redox-type oxidation mechanism. These results for Cu-CeO2 suggest that improved low temperature catalytic activity will only be achieved at the expense of reduced high temperature selectivity and vice versa. The final section of work explored the use of Cu-based catalysts for the low temperature oxidation of Acetaldehyde (ACA). Based on this work, it is concluded that the ACA oxidation activity of these materials is determined by two main factors: the basicity of the metal oxide support (and its subsequent ability to convert ACA to carboxylates) and the availability of surface oxygen during acetate decomposition. It is proposed that a high concentration of reducible sites (either by Cu addition or naturally occurring on CeO2) accelerates the activation and provision of oxygen and also potentially provides sites for the stabilization of methoxy intermediates resulting from the acetate decomposition.
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Dawson, Susan Elizabeth 1963. "The Occurrence of gold at the Bajo de le Alumbrera Porphyry copper-gold deposit, Northwestern Argentina." Thesis, The University of Arizona, 1994. http://hdl.handle.net/10150/558233.

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Mohammadzadeh, Saeideh. "Electronic Transport Properties of Copper and Gold at Atomic Scale." Doctoral thesis, Universitätsbibliothek Chemnitz, 2010. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-63427.

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The factors governing electronic transport properties of copper and gold atomic-size contacts are theoretically examined in the present work. A two-terminal conductor using crystalline electrodes is adopted. The non-equilibrium Green’s function combined with the density functional tight-binding method is employed via gDFTB simulation tool to calculate the transport at both equilibrium and non-equilibrium conditions. The crystalline orientation, length, and arrangement of electrodes have very weak influence on the electronic characteristics of the considered atomic wires. The wire width is found to be the most effective geometric aspect determining the number of conduction channels. The obtained conductance oscillation and linear current-voltage curves are interpreted. To analyze the conduction mechanism in detail, the transmission channels and their decomposition to the atomic orbitals are calculated in copper and gold single point contacts. The presented results offer a possible explanation for the relation between conduction and geometric structure. Furthermore, the results are in good agreement with available experimental and theoretical studies
In der vorliegenden Arbeit werden die wesentlichen Faktoren, die die elektronischen Transporteigenschaften von Kontaktstrukturen atomarer Größe aus Kupfer bzw. Gold bestimmen, theoretisch untersucht. Untersuchungsgegenstand ist eine leitfähige Struktur zwischen zwei kristallinen Elektroden. Um Transportberechungen sowohl unter Gleichgewichts- als auch unter Nicht-Gleichgewichts-Bedingungen durchführen zu können, wird die Simulations-Software gDFTB, die auf dem Nicht-Gleichgewichts-Green-funktionenformalismus in Kombination mit der Dichtefunktional-Tight-Binding-Methode beruht, eingesetzt. Die elektronischen Eigenschaften der betrachteten atomaren Drähte werden nur sehr schwach von ihrer kristallinen Orientierung, ihrer Länge und der Elektrodenanordnung beeinflusst. Als effektivster geometrischer Faktor wurde der Leiterquerschnitt gefunden, weil dieser die Anzahl der Leitungskanäle bestimmt. Darüber hinaus werden die erhaltenen Leitfähigkeitsoszillationen und die linearen Strom-Spannungs-Kennlinien erklärt. Für eine detaillierte Analyse des Leitungsmechanismus werden bei den Ein-Atom-Kontakten aus Kupfer und Gold die Übertragungskanäle und ihre Aufspaltung in Atomorbitale betrachtet. Die präsentierten Ergebnisse bieten eine mögliche Erklärung für den Zusammenhang zwischen Leitfähigkeit und geometrischer Struktur. Die Resultate zeigen eine akzeptable Übereinstimmung mit den verfügbaren experimentellen und theoretischen Studien
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Ruggiero, Carmine. "Adsorption on copper and gold high index single crystal surfaces." Thesis, University of Reading, 1997. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.360756.

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Li, Maoshuai. "Development of gold and copper catalysts for sustainable chemical processing." Thesis, Heriot-Watt University, 2016. http://hdl.handle.net/10399/3129.

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Supported Au and Cu catalysts have been developed for clean/sustainable production of value fine chemicals (including alcohols, ketone, amines and imines) from selective reduction (of benzaldehyde, nitrobenzene and furfural) and coupled (dehydrogenation-hydrogenation) reaction in the continuous gas phase operation. Critical catalyst physicochemical properties are characterised by applying a range of techniques and correlated to the catalytic response. The role of support, Au particle size and electronic character in determining catalytic activity and selectivity in the hydrogenation of benzaldehyde and nitrobenzene over oxide supported nano-scale (2-8 nm) Au has been established. Hydrogenation (turnover frequency) TOF increases with decreasing Au size (from 8 to 4 nm) with measurably lower TOF over Au < 3 nm. Repulsion of –C=O and –NO2 functionalities with respect to Auδ+ and strong binding to surface oxygen vacancies have been found to lower hydrogenation rates. Promotional effect of water via catalytic dissociation has been found to enhance the selective benzaldehyde hydrogenation rate. Two catalytic routes for imine (N-benzylideneimine) synthesis in continuous gas phase operation have been established. Reductive coupling of benzaldehyde with nitrobenzene (using external hydrogen) over supported Au generated up to 99% selectivity to the target imine. Coupling of benzyl alcohol dehydrogenation with nitrobenzene hydrogenation (in the absence of external hydrogen supply) over Au/TiO2 + Cu/SiO2 mixture produced imine with full hydrogen utilisation. Incorporation of Au/TiO2 to Cu/SiO2 created a synergy between Cu and Au and enhanced catalyst stability. A tandem dehydrogenation/amination/reduction process has been developed for high throughout production of benzylamine in continuous gas phase operation over Cu/SiO2 and Au/TiO2. A synergy between Cu/SiO2 and Au/TiO2 serves to promote benzylamine formation with 81% yield achieved through an optimization of process parameters. Coupling of 2-butanol dehydrogenation with nitrobenzene hydrogenation over Cu/SiO2 in the absence of an external H2 supply delivered exclusive production of both 2-butanone and aniline at full conversion. Hydrogen utilisation efficiency was appreciably greater (by a factor of up to 50) in the coupled system relative to conventional stand-alone hydrogenation using pressurised hydrogen. Selective conversion of biomass-derived furfural to furfuryl alcohol over supported Au catalysts has been established. A series of approaches (e.g. promotional effect of water via catalytic dissociation, increased spillover hydrogen with addition of oxide support and coupling strategy) directed at increasing the surface availability of reactive hydrogen were adopted to enhance furfuryl alcohol production and hydrogen utilisation. Continuous production of γ-butyrolactone has been established in both stand-alone hydrogenation of succinic acid (using external H2) and reaction coupling with formic acid decomposition (as a source of H2) over Cu/SiO2. Pd/SiO2 and Ni/SiO2 promoted propanoic acid formation at higher reaction rates. The results presented in this thesis establish feasible catalytic routes to high value alcohols, imines and amines where critical process optimisation is demonstrated in terms of catalyst composition/surface structure and reaction conditions.
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Davis, Harrison Olivia. "Copper, Silver, and Gold Clusters: A Synthetic and Structural Investigation." Kent State University Honors College / OhioLINK, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=ksuhonors1557352298361181.

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Books on the topic "Copper-gold"

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David, Williams. Copper, gold and treasure. London: Mysterious, 1989.

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I, Groves D., ed. Potassic igneous rocks and associated gold-copper mineralization. 2nd ed. Berlin: Springer, 1997.

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Hunterian Art Galler (University of Glasgow), ed. Copper into gold: Whistler and 19th-century printmaking. Glasgow: Hunterian Art Gallery, 2003.

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Müller, Daniel, and David I. Groves. Potassic Igneous Rocks and Associated Gold-Copper Mineralization. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-23051-1.

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Müller, Daniel, and David I. Groves. Potassic Igneous Rocks and Associated Gold-Copper Mineralization. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-319-92979-8.

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Müller, Daniel, and David I. Groves. Potassic Igneous Rocks and Associated Gold-Copper Mineralization. Berlin, Heidelberg: Springer Berlin Heidelberg, 1995. http://dx.doi.org/10.1007/978-3-662-00920-8.

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Müller, Daniel, and David I. Groves. Potassic Igneous Rocks and Associated Gold-Copper Mineralization. Berlin, Heidelberg: Springer Berlin Heidelberg, 2000. http://dx.doi.org/10.1007/978-3-642-59665-0.

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I, Groves D., ed. Potassic igneous rocks and associated gold-copper mineralization. Berlin: Springer, 1995.

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Ortega, Rustin Cabrera. Geología y regularidades de la distribución de los yacimientos de cobre y oro de la región mineral de Las Villas. La Habana: Instituto de Geología y Paleontología, Academia de Ciencias de Cuba, 1986.

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Freeman, Dorothy. From copper to gold: The life of Dorothy Baker. Wilmette, Ill: Bahá'í Pub. Trust, 1999.

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Book chapters on the topic "Copper-gold"

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Phillips, Neil. "Gold-plus Copper-gold Deposits." In Modern Approaches in Solid Earth Sciences, 225–34. Singapore: Springer Nature Singapore, 2022. http://dx.doi.org/10.1007/978-981-16-3081-1_19.

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Hashmi, A. Stephen K. "A Critical Comparison: Copper, Silver, and Gold." In Silver in Organic Chemistry, 357–79. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2010. http://dx.doi.org/10.1002/9780470597521.ch12.

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Bowen, H. J. M. "The Cycles of Copper, Silver and Gold." In The Natural Environment and the Biogeochemical Cycles, 1–27. Berlin, Heidelberg: Springer Berlin Heidelberg, 1985. http://dx.doi.org/10.1007/978-3-540-39209-5_1.

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Müller, Daniel, and David I. Groves. "Indirect Associations Between Lamprophyres and Gold-Copper Deposits." In Potassic Igneous Rocks and Associated Gold-Copper Mineralization, 203–26. Cham: Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-23051-1_8.

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Müller, Daniel, and David I. Groves. "Indirect Associations between Lamprophyres and Gold-Copper Deposits." In Potassic Igneous Rocks and Associated Gold-Copper Mineralization, 121–44. Berlin, Heidelberg: Springer Berlin Heidelberg, 1995. http://dx.doi.org/10.1007/978-3-662-00920-8_7.

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Müller, Daniel, and David I. Groves. "Indirect Associations Between Lamprophyres and Gold-Copper Deposits." In Potassic Igneous Rocks and Associated Gold-Copper Mineralization, 143–66. Berlin, Heidelberg: Springer Berlin Heidelberg, 2000. http://dx.doi.org/10.1007/978-3-642-59665-0_7.

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Müller, Daniel, and David I. Groves. "Indirect Associations Between Lamprophyres and Gold-Copper Deposits." In Potassic Igneous Rocks and Associated Gold-Copper Mineralization, 279–306. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-92979-8_8.

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Lazreg, Faïma, and Catherine S. J. Cazin. "Medical Applications of NHC-Gold and -Copper Complexes." In N-Heterocyclic Carbenes, 173–98. Weinheim, Germany: Wiley-VCH Verlag GmbH & Co. KGaA, 2014. http://dx.doi.org/10.1002/9783527671229.ch07.

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Roundhill, D. Max. "Phase Transfer Extraction of Copper, Silver and Gold." In Extraction of Metals from Soils and Waters, 163–92. Boston, MA: Springer US, 2001. http://dx.doi.org/10.1007/978-1-4757-5204-5_8.

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Joost, Maximilian. "Fundamental Elementary Steps in Gold Chemistry." In Synthesis and Original Reactivity of Copper and Gold Complexes, 31–81. Cham: Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-18690-0_3.

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Conference papers on the topic "Copper-gold"

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Dahiya, Annu, and P. Senthil Kumar. "Plasmonic gold-copper alloy dimer as ‘nanorulers’." In DAE SOLID STATE PHYSICS SYMPOSIUM 2019. AIP Publishing, 2020. http://dx.doi.org/10.1063/5.0017257.

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Hashimoto, Yoshikazu, Yoshiaki Nishijima, Gediminas Seniutinas, Lorenzo Rosa, and Saulius Juodkazis. "Optical constants of gold-silver-copper alloy system." In JSAP-OSA Joint Symposia. Washington, D.C.: OSA, 2014. http://dx.doi.org/10.1364/jsap.2014.19p_c3_13.

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Ang, X. F., H. J. Lu, J. Wei, H. J. Zhang, and C. C. Wong. "Organic Monolayers for Low Temperature Copper – Gold Bonding." In ASME 2010 International Mechanical Engineering Congress and Exposition. ASMEDC, 2010. http://dx.doi.org/10.1115/imece2010-38552.

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In this study low temperature copper-gold bonding in ambient is demonstrated successfully with the help of organic monolayers. Further investigation is made to evaluate the influence of chain length of these monolayers to alleviate bonding temperature. We found that a single coat of organic monolayer on copper showed superior bond strength as compared to a double-coating on both copper and gold surfaces respectively. Despite effective surface passivation against oxide formation (Cu) and organic contaminant from ambient (Au) by long chain organic monolayers, when both surfaces are coated with the longest monolayer, weaker bond strength was observed. The results suggest that the ease of removal of organic monolayers from Cu and Au surface respectively prior to bonding plays a dominant role in enabling low temperature Cu-Au bonding.
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Qin, Wentao. "Corrosion Mechanisms of Copper and Gold Ball Bonds." In ISTFA 2022. ASM International, 2022. http://dx.doi.org/10.31399/asm.cp.istfa2022p0310.

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Abstract Copper ball bonding is the most widely used interconnection method in microelectronic packages. It has enabled many modern technologies, but the bond can fail due to corrosion. This paper concerns quantitative analyses of corrosion products of passing and failing copper ball bonds, and correlation with the corrosion thermodynamics. The role each element in the aluminum-copper intermetallic compound plays during crevice corrosion is described, and relative abundances of the oxidized elements are estimated. New insights regarding mechanisms of the highest vulnerability to corrosion attack in the thin film-stack across the bond are presented. Limited data indicate the same corrosion mechanisms for Au ball bonds.
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Sekisov, Arthur. "COMPARATIVE RESEARCH OF CYANIDE AND SULFATE-CHLORIDE GOLD LEACHING FROM OXIDIZED GOLD-COPPER ORE." In 18th International Multidisciplinary Scientific GeoConference SGEM2018. Stef92 Technology, 2018. http://dx.doi.org/10.5593/sgem2018/1.4/s04.005.

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Lee Kuan Fang, OD Kwon, Oranna Yauw, Don Capistrano, and Basil Milton. "Ultra low loop conversion from gold to copper wire." In 2010 34th International Electronics Manufacturing Technology Conference (IEMT). IEEE, 2010. http://dx.doi.org/10.1109/iemt.2010.5746666.

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Breach, C. D., Tee Wai Mun, Teck Kheng Lee, and R. Holliday. "Moisture induced corrosion in gold and copper ball bonds." In 2010 34th International Electronics Manufacturing Technology Conference (IEMT). IEEE, 2010. http://dx.doi.org/10.1109/iemt.2010.5746748.

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Prasad, Surendra, John Soraghan, Andrea Conti, and Rajendar Bahl. "Wired access technologies of future: Turning copper to gold." In 2013 IEEE International Conference on Signal Processing, Computing and Control (ISPCC). IEEE, 2013. http://dx.doi.org/10.1109/ispcc.2013.6663384.

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Watanabe, Akira. "Laser sintering of gold nanoparticles on a copper substrate toward an alternative to gold plating." In SPIE LASE, edited by Udo Klotzbach, Yongfeng Lu, and Kunihiko Washio. SPIE, 2013. http://dx.doi.org/10.1117/12.2001848.

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Frye, D., R. Guino, S. Gupta, M. Sano, K. Sato, and K. Iida. "Gold-Gold Interconnects to Copper Pillar using fast Thermal Compression Bonding using Non-conductive paste." In 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC). IEEE, 2010. http://dx.doi.org/10.1109/ectc.2010.5490938.

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Reports on the topic "Copper-gold"

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Kirkham, R. V., and W. D. Sinclair. Porphyry copper, gold, molybdenum, tungsten, tin, silver. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/208014.

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Walen, Holly. Sulfur-induced structural motifs on copper and gold surfaces. Office of Scientific and Technical Information (OSTI), May 2016. http://dx.doi.org/10.2172/1472067.

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Gandhi, S. S., and R. T. Bell. Kiruna/Olympic dam-type iron, copper, uranium, gold, silver. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/208028.

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Walen, Holly. Sulfur-induced structural motifs on copper and gold surfaces. Office of Scientific and Technical Information (OSTI), January 2016. http://dx.doi.org/10.2172/1342553.

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Gordon, J. G., L. S. Kau, M. G. Samant, and L. Blum. Structure of Electrochemically Deposited Copper on Gold (III) Alloy. Fort Belvoir, VA: Defense Technical Information Center, January 1991. http://dx.doi.org/10.21236/ada232345.

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Battaile, Corbett Chandler, Harry K. Moffat, Amy Cha-Tien Sun, David George Enos, Lysle M. Serna, and Neil Robert Sorensen. Modeling pore corrosion in normally open gold- plated copper connectors. Office of Scientific and Technical Information (OSTI), September 2008. http://dx.doi.org/10.2172/942183.

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Mason, R., and N. Melnik. The Mcintyre-hollinger Investigation, Timmins, Ontario: a Gold Dominated Porphyry Copper System. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1986. http://dx.doi.org/10.4095/120669.

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Zimmerman, R. L., D. Ila, E. K. Williams, S. S. Sarkisov, D. B. Poker, and D. K. Hensley. Fabrication of copper and gold nanoclusters in MgO (100) by MeV ion implantation. Office of Scientific and Technical Information (OSTI), October 1997. http://dx.doi.org/10.2172/634051.

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Laibinis, Paul E., and George M. Whitesides. Omega-Terminated Alkanethiolate Monolayers on Surfaces of Copper, Silver and Gold Have Similar Wettabilities. Fort Belvoir, VA: Defense Technical Information Center, December 1991. http://dx.doi.org/10.21236/ada243529.

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Ross, K. V., K. M. Dawson, C. I. Godwin, and L. Bond. Major lithologies of the Ajax West Pit, and alkalic copper-gold porphyry deposit, Kamloops, British Columbia. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1992. http://dx.doi.org/10.4095/132802.

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