Journal articles: 'Copper alloys'

1

Murphy, Michael. "Copper and copper alloys." Metal Finishing 95, no. 2 (February 1997): 24. http://dx.doi.org/10.1016/s0026-0576(97)94205-7.

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Mysik, R. K., S. V. Brusnitsyn, and A. V. Sulitsin. "Application Of Ni-Mg-Ce Master Alloy Scrap For Inoculation Of Copper-Nickel Alloys." KnE Materials Science 2, no. 2 (September 3, 2017): 102. http://dx.doi.org/10.18502/kms.v2i2.954.

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<p class="TTPAbstract">The problems of production of copper-nicckel alloys ingots by semicontinuous casting method are analysed. The requirement of grain size refinement in cast alloys macrostructure is shown. It is necessary to reduce the probability of hot cracks formation and increase the fabricability of cast bars during plastic working. The reasonability of fine fraction of Ni-Mg-Ce master alloy application for inoculation of copper-nickel alloys is established. The results of laboratory experiments on the study of master alloy quantity influence the structure and hardness of Cu-5Ni-1Fe, Cu-10Ni-1Fe-1Mn and Cu-30Ni-1Fe-1Mn copper-nickel alloys are presented. On the basis of industrial experiments it is revealed that inoculation of Cu-5Ni-Fe alloy ingots of diameter 200 mm by Ni-Mg-Ce master alloy leads to considerable reducing of macrograin size. It allows to improve mechanical properties of ingots and ensure their uniform distribution in cross section of ingots. It is established that residual magnesium content in alloy must be in range from 0,02 to <br />0,06 wt. %. The use of Ni-Mg-Ce master alloy makes it possible to increase the processability of copper-nickel alloys during plastic working and utilize the fine fraction master alloy scrap inevitably formed during its production.</p>

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Roy, Brandon, Erin LaPointe, Andrew Holmes, Dillon Camarillo, Bonolo Jackson, Daniel Mathew, and Andrew Craft. "Effect of Hydrogen Exposure Temperature on Hydrogen Embrittlement in the Palladium–Copper Alloy System (Copper Content 5–25 wt.%)." Materials 16, no. 1 (December 28, 2022): 291. http://dx.doi.org/10.3390/ma16010291.

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The yield strength, ultimate strength, and elongation/ductility properties of a series of palladium–copper alloys were characterized as a function of the temperature at which each alloy underwent absorption and desorption of hydrogen. The alloys studied ranged in copper content from 5 weight percent copper to 25 wt.% copper. Compared to alloy specimens that had been well-annealed in a vacuum and never exposed to hydrogen, alloys with copper content up to 15 wt.% showed strengthening and loss of ductility due to hydrogen exposure. In these alloys, it was found that the degree of strengthening and loss of ductility was dependent on the hydrogen exposure temperature, though this dependence decreased as the copper content of the alloy increased. For alloys with copper contents greater than 15 wt.%, hydrogen exposure had no discernible effect on the strength and ductility properties compared to the vacuum-annealed alloys, over the entire temperature range studied.

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Honkanen, Mari, Minnamari Vippola, and Toivo Lepistö. "Oxidation of copper alloys studied by analytical transmission electron microscopy cross-sectional specimens." Journal of Materials Research 23, no. 5 (May 2008): 1350–57. http://dx.doi.org/10.1557/jmr.2008.0160.

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In this work, the oxide structures of three polycrystalline copper grades, unalloyed oxygen-free (OF) copper and alloyed CuAg and deoxidized high-phosphor (DHP) copper, were studied using cross-sectional analytical transmission electron microscopy (AEM) samples. The oxidation treatments were carried out in air at 200 and 350 °C for different exposure times. The detailed oxide layer structures were characterized by AEM. At 200 °C, a nano-sized Cu2O layer formed on the all copper grades. At 350 °C, a nano-sized Cu2O layer formed first on the all copper grades. After longer exposure time at 350 °C, a crystalline CuO layer grew on the Cu2O layer of the unalloyed OF-copper. In the case of the alloyed CuAg- and DHP-copper, a crystalline and columnar shaped layer, consisting of Cu2O and CuO grains, formed on the nanocrystalline Cu2O layer. At 350 °C, the unalloyed copper oxidized notably slower than the alloyed coppers, and its oxide structures were different than those of the alloyed coppers.

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Pereplyotchikov, E. F. "Plasma-powder surfacing of nickel and cobalt alloys on copper and its alloys." Paton Welding Journal 2015, no. 6 (June 28, 2015): 10–13. http://dx.doi.org/10.15407/tpwj2015.06.02.

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Ma, Shi De, Xia Zhao, Hong Ren Wang, and Ji Zhou Duan. "Research on the Antifouling Mechanisms of Copper and its Alloys." Advanced Materials Research 79-82 (August 2009): 2179–82. http://dx.doi.org/10.4028/www.scientific.net/amr.79-82.2179.

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In this paper, the in-situ exposure tests of 15 kinds of copper and its alloys were carried out in seawater at Zhanjiang Harbor for 12 months in order to study their anti-fouling abilities and anti-corrosion properties. In the same way, the in-situ anti-fouling tests of copper and bronze were performed in Qingdao for 8 years. Successively, the anti-fouling properties were analyzed combining with the electrochemical process of copper alloy corrosion and biology process of the adhesion. The chemical, physical and biological factors influencing the fouling properties of copper alloys were also investigated. The results showed that the coppers can equip themselves with antifouling performance by producing some toxic substances during the processes of chemical and electrochemical reaction. In addition, the antifouling ability was proved to relate to the exfoliation effect, which was the result of interaction between stain layer adhesion and spalling force of the attachments.

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Tebyakin, A. V., A. N. Fokanov, and V. F. Podurazhnaya. "Multipurpose copper alloys." Proceedings of VIAM, no. 12 (December 2016): 5. http://dx.doi.org/10.18577/2307-6046-2016-0-12-5-5.

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MIURA, Hiromi. "Copper Alloys II." Journal of the Japan Society for Technology of Plasticity 54, no. 629 (2013): 466–68. http://dx.doi.org/10.9773/sosei.54.466.

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9

Hashimoto, Kaoru, Takehiko Sato, and Koichi Niwa. "Laser Welding Copper and Copper Alloys." Journal of Laser Applications 3, no. 1 (January 1991): 21–25. http://dx.doi.org/10.2351/1.4745272.

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10

Raikov, Yu N., G. V. Ashikhmin, A. K. Nikolaev, N. I. Revina, and S. A. Kostin. "Nanotechnology for copper and copper alloys." Metallurgist 51, no. 7-8 (July 2007): 408–16. http://dx.doi.org/10.1007/s11015-007-0074-5.

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11

Huang, Fu Xiang, Ping Yin, Chun Tian Li, and Ji Chao Li. "Formation and Growth of Intermetallic Compound Layers at Interface of Solder/Copper Alloys for Lead Frame." Advanced Materials Research 189-193 (February 2011): 3383–90. http://dx.doi.org/10.4028/www.scientific.net/amr.189-193.3383.

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The effect of chemical species of copper alloys on growth of intermetallic compounds (IMCs) at interface of solder/copper alloys for lead frame was investigated. The results have revealed that Cu is the main diffusing species during aging. After aged at 160°C for 300h, only a Cu6Sn5IMC layer is observed at SnPb/copper alloys interfaces. The growth rate of IMC on the Cu-Cr-Zr system alloys and Cu-Ni-Si alloys was much slower than that of IMC on the C19400 alloy. The Pb phase and voids were found to be inside the Cu6Sn5phase. Chromium, one of the alloying element in Cu-Cr-Zr-Zn alloys, has found to be segregated at the interface between the copper alloy/Cu6Sn5. Zn and Zr in the Cu-Cr-Zr-Zn system alloy are enriched in small amout inside the IMC. These observed results were discussed and analysed on the baisis of diffusion and growth kinetics.

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Abdul Kareem D.A, Rajaa S.N., and HALEEMAH S.M. "Study of the thermal, mechanical and costrictional properties to some Foreign dental amalgams using in Iraq." Tikrit Journal of Pure Science 20, no. 3 (February 10, 2023): 162–70. http://dx.doi.org/10.25130/tjps.v20i3.1200.

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In this paper, the preparation of five samples of amalgam alloy used for the restoration of teeth has been done using the amalgamation device for mixing alloys with mercury. The alloys included four high copper amalgams which are (SDI, Septalloy NG 50, YDA alloy, TG alloy) and the percentage of copper (28, 22.7 , 25, 24) % respectively, which are ready fillings. While the fifth alloy (Septalloy NG70) is for low copper amalgam with Copper ratio of 12.7%. The X-ray diffraction has been tested to study the structural properties of these samples and found for the four high-copper alloys increment in the intensity for the diffraction values of the two phases Ɛ - Cu3Sn, ƞ - Cu6Sn5 with the disappearance of the phase γ2 - Sn7Hg which decreases the intensity of this phase with copper increment, while in the low- copper alloy it shows an increase in the peaks representing the phases Ɛ - Cu3Sn, ƞ - Cu6Sn5 with an increasing proportion of copper in the amalgam, as the relationship is positive between copper increment and the tops increment of these two phases, and the relationship is inverse between the copper ratio increment in amalgams and phase γ2 where phase reacts with Eutects silver - copper component phases γ1 - Ag2Hg3, ƞ - Cu6Sn5. Also the mechanical and thermal properties has been studied for each one of five groups of amalgam alloy like compressive strength , micro hardness , thermal conductivity

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13

Grzegorczyk, Barbara. "Instability of Plastic Deformation in Low-Alloy Copper Alloys." Solid State Phenomena 275 (June 2018): 113–23. http://dx.doi.org/10.4028/www.scientific.net/ssp.275.113.

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The purpose of this paper is to determine the influence of temperature of plastic deformation on the structure and mechanical properties of copper alloys of the types CuCo1NiBe (CCNB), CuCo2Be (CB4), CuNi2SiCr (CNCS), CuNi1P (CNP) and CuCr1Zr (CW106C) applied on electrodesduring a tensile test. Tensile tests were carried out on polycrystalline samples of above mentioned alloys, which confirmed the presence of inhomogeneous plastic deformation in specified temperature ranges for each alloy. The tensile test of the investigated copper alloys were realized in the temperature range of 20÷800 °C with strain rate of 1.2•10-3s–1 on the universal testing machine. Metallographic observations of the structure were carried out on a light microscope and the fractographic investigation of fracture on an electron scanning microscope. Performed experimental studies have proven that analyzed structural factors, in a range of investigated strain conditions at elevated temperature, significantly influence the phenomenon of the Portevin Le Chatelier (PLC) type instability of plastic strain, revealed in low-alloy copper alloys. Moreover, it was found that the impact of examined factors on the PLC effect should be considered comprehensively, taking into account their synergic interactions.

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Simić, Marko, Nenad Radović, Milan Gordić, and Jovana Ruzic. "Effect of process parameters on the phase transformation kinetics in copper-based alloys and composites." Metallurgical and Materials Engineering 26, no. 4 (December 31, 2020): 365–73. http://dx.doi.org/10.30544/571.

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Copper-based alloys and composites, owing to their convenient properties, are being considered essential materials in various industries. Since copper possesses an ability to develop high corrosion resistance, putting it in the domain of a desirable material in the manufacturing of valves, pipes, and also systems that carry industrial gases and aqueous fluids. Its usage is also invaluable for cables and electrical wires. This review paper describes diversity in copper alloy processing techniques (powder and ingot metallurgy) which are alongside the phase transformation kinetics interpreted and explained in detail. Furthermore, the focus is put on the copper alloys, as well as the kinetics present in these systems, with the application being highlighted. Correlation between physical properties and phase transformation kinetics in copper alloys is made. It is shown that if certain alloying elements are to be added, different properties could be improved. The effect of phase precipitation on phase transformation kinetics of copper alloys is shown by studying the Cu–15Ni–8Sn alloy.

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15

Boyle, K. P. "Latent Hardening in Copper and Copper Alloys." Materials Science Forum 495-497 (September 2005): 1043–48. http://dx.doi.org/10.4028/www.scientific.net/msf.495-497.1043.

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A new phenomenological latent hardening model is developed for rate-dependent single crystal plasticity. The model quantitatively predicts the latent hardening evolution and latent hardening material dependence for f.c.c. single crystals. Increased overshoot, typically observed in copper alloys as opposed to copper, is rationalized based on the history dependence of latent hardening.

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16

KUROYANAGI, Takashi. "Copper and copper alloys in electronic materials." Journal of Japan Institute of Light Metals 37, no. 4 (1987): 313–26. http://dx.doi.org/10.2464/jilm.37.313.

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17

Iijima, Yoshiaki, Yoshihiro Wakabayashi, Toshihiko Itoga, and Ken-ichi Hirano. "Diffusion in Copper-rich Copper-Silicon Alloys." Materials Transactions, JIM 32, no. 5 (1991): 457–64. http://dx.doi.org/10.2320/matertrans1989.32.457.

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18

Ben Mbarek, Wael, Eloi Pineda, Lluïsa Escoda, Joan Suñol, and Mohamed Khitouni. "Dealloying of Cu-Mg-Ca Alloys." Metals 8, no. 11 (November 8, 2018): 919. http://dx.doi.org/10.3390/met8110919.

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The chemical dealloying of Cu-Mg-Ca alloys in free corrosion conditions was investigated for different alloy compositions and different leaching solutions. For some of the precursor alloys, a continuous, pure fcc copper with nanoporous structure can be obtained by dealloying in 0.04 M H2SO4 solution. Superficial nanoporous copper structures with extremely fine porous size were also obtained by dealloying in pure water and 0.1 M NaOH solutions. The dealloying of both amorphous and partially crystalline alloys was investigated obtaining bi-phase nanoporous/crystal composites with microstructures depending on the precursor alloy state. The fast dissolution of Mg and Ca makes the Cu-Mg-Ca system an ideal candidate for obtaining nanoporous copper structures with different properties as a function of different factors such as the alloy composition, the quenching process, and leaching conditions.

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Şerban, V. A., C. Codrean, D. Uţu, and C. Opriş. "Amorphous alloys for brazing copper based alloys." Journal of Physics: Conference Series 144 (January 1, 2009): 012098. http://dx.doi.org/10.1088/1742-6596/144/1/012098.

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20

Martyushev, Nikita. "Copper Alloys Structure Parameters." Advanced Materials Research 1040 (September 2014): 225–29. http://dx.doi.org/10.4028/www.scientific.net/amr.1040.225.

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In this research it was examined the influence of crystallisation conditions binary leaded bronze on parametres of a received microstructure. Change of crystallisation conditions was carried out by change of cooling melt speed, through preliminary heating of casting moulds. Quantitative regularities of influence of cooling rate of explored bronze on parametres dendritic cells, grain size are presented. The data about formation of lead inclusions between dendrites of a copper matrix are published as well. It is shown that high rates of cooling of an order 100-150°С/c lead to dendritic structures formation containing only axes of the first and second order. Decrease of cooling rate at the moment of crystallisation to the values less 15°C/c leads to appearance and growth of axes of 3rd order at dendrites matrix.

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Grammatikakis, J., and V. Katsika. "Compressibilities of copper alloys." Journal of Physics: Condensed Matter 2, no. 17 (April 30, 1990): 3903–8. http://dx.doi.org/10.1088/0953-8984/2/17/001.

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Verhoeven, J. D., F. A. Schmidt, E. D. Gibson, and W. A. Spitzig. "Copper-Refractory Metal Alloys." JOM 38, no. 9 (September 1986): 20–24. http://dx.doi.org/10.1007/bf03258680.

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Froes, F. H. "Enhanced copper based alloys." Metal Powder Report 45, no. 11 (November 1990): 741–43. http://dx.doi.org/10.1016/0026-0657(90)90455-p.

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Reid, J. V., and J. A. Schey. "Adhesion of copper alloys." Wear 104, no. 1 (July 1985): 1–20. http://dx.doi.org/10.1016/0043-1648(85)90242-x.

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Dyachkova, L. N. "Peculiarities of hardening of steel – copper alloy pseudo-alloys obtained by infiltration during hot plastic deformation." Proceedings of the National Academy of Sciences of Belarus, Physical-Technical Series 67, no. 2 (July 2, 2022): 156–66. http://dx.doi.org/10.29235/1561-8358-2022-67-2-156-166.

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The influence of the regimes of plastic deformation of steel – copper alloy pseudo-alloys obtained by infiltration on their structure, mechanical properties and anisotropy of properties is investigated. It has been established that hot forging of pseudo-alloys at a temperature of 700–950 °C provides an increase in strength by 1.5–3 times, impact strength by 1.5–2.5 times, plasticity by 1.5–2 %, and at 1100–1150 °С (above the melting point of copper) – leads to cracking of the material. It is shown that the properties of pseudo-alloys based on steel alloyed with chromium are lower than those based on steel alloyed with nickel, which is associated with the formation of chromium oxides due to its increased affinity for oxygen. The formation of macro-texture in pseudo-alloys after hot stamping has been established, which leads to secondary anisotropy of properties, the level of which is determined by the degree of deformation and temperature, but does not exceed 15–20 %. The deformation curve of the pseudo-alloy during hot forging was constructed, which revealed the optimum temperature (700–900 °С) and the limiting degree of deformation (65 %) depending on the composition of the pseudo-alloy. With an increase in the degree of deformation, microcracks form at the interface between the iron and copper phases, which in turn leads to a decrease in strength, ductility, as well as a 1.5–2-fold decrease in the impact strength of pseudo-alloys with a copper phase content of 15 % and destruction of pseudo-alloys with a 25 % copper content phases, in which the length of interphase iron-copper boundaries is much greater. The achieved mechanical properties of hot-forged steel-copper alloy pseudo-alloys make it possible to use them for parts of heavily loaded friction units, as well as parts for structural purposes.

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KHARISMA, Aji Abdillah, Haris RUDIANTO, Achmad Benny MUTIARA, Sulistyo PUSPITODJATI, Fahamsyah Hamdan LATIEF, Agus Sukarto WISMOGROHO, Wahyu Bambang WIDAYATNO, Didik ARYANTO, and Cherly FIRDHARINI. "The effects of copper on the mechanical properties of Ti-10Mo alloy prepared by powder metallurgy method." Journal of Metals, Materials and Minerals 34, no. 1 (February 2, 2024): 1813. http://dx.doi.org/10.55713/jmmm.v34i1.1813.

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Titanium alloys are currently widely explored and produced for applications in various engineering fields. Alloying metal elements such as Mo, Cu, and Mn bring more advantages among them to help improve the mechanical properties of titanium alloys. This study is intended for the evaluation of mechanical properties through compression and hardness testing performed on a Ti-10Mo alloy with copper addition by powder metallurgy. Ti-10Mo alloys with the addition of copper contents of 3 wt% Cu, 6 wt% Cu, and 9 wt% Cu were prepared to optimize the properties of Ti-10Mo-xCu alloys. With the addition of 3 wt% copper, the compressive strength increased to 577 MPa, which is the maximum compressive strength in this study. On the other hand, with 6 wt% and 9 wt% Cu addition, the compressive strength became 140 MPa and 201 MPa, respectively. A Ti-10Mo alloy with a 3 wt% copper content was able to achieve the maximum hardness of 576 HV. In short, the addition of 3 wt% copper successfully increased the compressive strength as well as the hardness of the prepared titanium alloys.

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Rahman, M. Muzibur, S. Reaz Ahmed, and M. Salim Kaiser. "Corrosion Behavior of Work Hardened SnPb-Solder Affected Copper in the Bay of Bengal Water Environment." Advances in Materials Science and Engineering 2022 (November 21, 2022): 1–14. http://dx.doi.org/10.1155/2022/2513391.

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Copper and its alloys are extensively used in marine applications due to high corrosion resistant behavior. But the corrosion immunity of copper varies with the environmental factors especially the sea water ingredients. Many researchers investigated corrosion level of copper materials in different oceans/seas. Unfortunately, such study is missing in the Bay of Bengal water. Moreover, inclusion of alloying elements can have influence on the corrosion behavior of copper, especially the addition of SnPb-solder for repair works and environmental effects due to ageing. In fact, the urge of using old copper to manufacture new components for marine applications necessitates the characterization of various properties. In this context, present paper is an attempt to investigate the corrosion behavior of copper and solder affected copper to enhance the reuse potential of SnPb-solder affected old/waste copper in contact of the bay water along with comparison with commercial copper alloys. Here, the result shows that overall leaching is increased for the addition of Sn and/or Pb in Cu over the whole immersion period in the stagnant water of the Bay of Bengal. The highest loss is found to be of Cu-Pb alloy which is followed by SnPb-solder affected copper, then Cu-Sn alloy and the lowest loss is of pure copper. The cold-rolled work-hardening has reduced the corrosion rate for all copper alloys. It also reveals that the solder affected copper is more corrosion resistant than commercial copper alloys such as brass and bronze.

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Wang, Chong Bi, Xiao Dong Kong, and Zhi Qiang Tian. "Evaluation of the Protection Effect on Copper with Different Sacrificial Anodes." Advanced Materials Research 602-604 (December 2012): 579–83. http://dx.doi.org/10.4028/www.scientific.net/amr.602-604.579.

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Sacrificial anodes performance of three iron alloys was measured by constant current test, The protection effects of iron alloys, zinc alloy and aluminum alloy sacrificial anodes on copper tube were compared and analysed by polarization test. The results show that all three iron alloys appearing well sacrificial anodes performance, with steady working potential, high practical electric capacity and current efficiency, the corrosion is uniform and the corrosion products fall easily. Iron alloys are more suitable for application on the cathodic protection of copper tube due to their more suitable driving voltage and coulpling current compared with zinc alloy and aluminum alloy.

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Mukanov, Samat, Pavel Loginov, Alexander Fedotov, Marina Bychkova, Maria Antonyuk, and Evgeny Levashov. "The Effect of Copper on the Microstructure, Wear and Corrosion Resistance of CoCrCuFeNi High-Entropy Alloys Manufactured by Powder Metallurgy." Materials 16, no. 3 (January 30, 2023): 1178. http://dx.doi.org/10.3390/ma16031178.

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This paper focuses on the microstructure, phase composition, mechanical, tribological and corrosion properties of high-entropy alloys (HEAs) in the CoCrCuFeNi system depending on copper content, which was varied from 0 to 20 at. % with an increment of 5%. CoCrCuFeNi alloys were manufactured by powder metallurgy methods: mechanical alloying and hot pressing of element mixtures. The solubility limit of copper in CoCrFeNi solid solution was found to be 9 at. %. Segregation of irregularly shaped copper grains sized 1–30 μm is observed at concentrations above this solubility limit. As copper concentration increases, the phase composition of CoCrCuFeNi alloys changes from the single phase based on FCC1 solid solution (Cu = 0–5 at. %) to the dual-phase FCC1 + FCC2 alloy (Cu = 10–20 at. %), where FCC1 is the main phase and FCC2 is the secondary copper-rich phase. Tribological tests have shown that doping the CoCrFeNi alloy with copper increased wear resistance by 23% due to solid solution hardening. As copper content rises above 20%, the content of the secondary FCC2 phase increases, while wear resistance and alloy hardness decline. An analysis of wear tracks and wear products has shown that abrasion of CoCrCuFeNi alloys occurs via the abrasive-oxidative wear mechanism. The corrosion tests of CoCrCuFeNi HEAs in 3.5% NaCl solution had demonstrated that doping the alloy with copper at low concentrations (5–10%) leads to decreasing of corrosion resistance, possibly due to the formation of undesirable oxide Cu2O along with protective Cr2O3. At high copper concentrations (15–20%) galvanic corrosion is suppressed due to coarsening of FCC2 grains and thus decreasing the specific contact surface area between the cathode (FCC2) and the anode (FCC1).

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Zhao, Siyue, Na Li, Guangtong Hai, and Zhigang Zhang. "An improved composition design method for high-performance copper alloys based on various machine learning models." AIP Advances 13, no. 2 (February 1, 2023): 025262. http://dx.doi.org/10.1063/5.0134416.

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The preparation of high-performance copper alloys generally considers alloying approaches to solve the conflicting problems of high strength and high electrical conductivity. The traditional “trial and error” research model is complicated and time-consuming. With the continuous accumulation of material databases and the advent of the “big data” era, machine learning has rapidly become a powerful tool for material design and development. In this paper, a total of 407 copper alloy data were collected. In the multi-objective prediction problem, the many-to-many prediction using back propagation neural network alone is improved to a many-to-one prediction. This improvement is based on back propagation neural network, tree model and support vector machine model. Through comparative analysis, an improved composition to property model was developed to predict the tensile strength and electrical conductivity of copper alloys, and the overall coefficient of determination reached 0.98; an improved property to composition model was developed to predict the composition of copper alloys, and the overall coefficient of determination reached 0.78. By combining these two models and the particle swarm optimization algorithm, an improved machine learning design system (MLDS) model was developed to achieve the composition prediction of copper alloy. The overall coefficient of determination reached 0.87, the prediction effect was better than the original MLDS model and with stronger stability. This method is of guiding significance for the alloy composition design of high-performance copper alloys. In addition, it also has certain reference value for the alloy composition design of other alloys.

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Gomes, I. B., L. C. Simões, and M. Simões. "The role of surface copper content on biofilm formation by drinking water bacteria." RSC Advances 9, no. 55 (2019): 32184–96. http://dx.doi.org/10.1039/c9ra05880j.

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Copper alloys demonstrated comparable or higher performance than elemental copper in biofilm control. The alloy containing 96% copper was the most promising surface in biofilm control and regrowth prevention.

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Michel, J., W. Moran, A. Estelle, K. Sexton, and H. Michels. "Antimicrobial Benefits of Copper Alloys." AM&P Technical Articles 170, no. 7 (July 1, 2012): 27–29. http://dx.doi.org/10.31399/asm.amp.2012-07.p027.

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Abstract Laboratory tests conducted at the University of Southampton, UK, found that many species of bacteria including hospital superbugs, MRSA and VRE, are killed in less than 2 h on copper alloy surfaces. Tests conducted in a third-party lab subject to EPA audits confirmed these results, concluding that a range of copper alloy surfaces, such as brass, bronze, copper nickel, and nickel silver, achieve a 99.9% reduction of bacteria within 2 h of contact and that the effect is not impaired by tarnish. Other such tests have since been conducted and the results are presented in the article.

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33

Zaba, Winnie, and Josias Willem Van der Merwe. "Investigating the corrosion resistance of spark plasma sintered copper with ruthenium powder." Anti-Corrosion Methods and Materials 65, no. 6 (November 5, 2018): 594–604. http://dx.doi.org/10.1108/acmm-07-2018-1965.

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Purpose The corrosion resistance of copper and copper-ruthenium alloys produced by powder metallurgy (spark plasma sintering process) and exposed in 2M sulphuric acid at 45°C and 65°C was investigated using scanning electron microscopy and potentiodynamic polarisation technique. Design/methodology/approach The small additions of ruthenium (0.5, 1 and 2 Wt.%) to the copper resulted in improved corrosion resistance of the copper alloy by up to 90 per cent when compared to casted copper. Findings All the sintered copper and copper alloys proved to have increased the corrosion resistance in all the temperatures. Originality/value Powder metallurgy was used in achieving these improvements.

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NAKATA, Kazuhiro. "Friction Stir Welding of Copper and Copper Alloys." Journal of the Japan Welding Society 74, no. 3 (2005): 148–51. http://dx.doi.org/10.2207/qjjws1943.74.148.

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Nakata, K. "Friction stir welding of copper and copper alloys." Welding International 19, no. 12 (December 2005): 929–33. http://dx.doi.org/10.1533/wint.2005.3519.

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Asonen, H., C. J. Barnes, M. Pessa, R. S. Rao, and A. Bansil. "Electronic structure of copper-rich copper-gold alloys." Physical Review B 31, no. 6 (March 15, 1985): 3245–50. http://dx.doi.org/10.1103/physrevb.31.3245.

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STERLING, A., A. ATRENS, and I. O. SMITH. "Accelerated Atmospheric Corrosion Of Copper And Copper Alloys." British Corrosion Journal 25, no. 4 (January 1990): 271–78. http://dx.doi.org/10.1179/000705990799156391.

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38

Hucińska, J., and M. Głowack. "Cavitation erosion of copper and copper-based alloys." Metallurgical and Materials Transactions A 32, no. 6 (June 2001): 1325–33. http://dx.doi.org/10.1007/s11661-001-0223-6.

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39

Small, M. B., D. A. Smith, and A. J. Garratt-Reed. "Segregation of copper in dilute aluminum - copper alloys." Scripta Metallurgica et Materialia 30, no. 12 (June 1994): 1531–34. http://dx.doi.org/10.1016/0956-716x(94)90303-4.

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McDonald, D. T., John F. Humphreys, Pete S. Bate, and Ian Brough. "Dynamic Recrystallization in Copper and Copper-Tin Alloys." Materials Science Forum 558-559 (October 2007): 449–56. http://dx.doi.org/10.4028/www.scientific.net/msf.558-559.449.

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Copper, Cu-2%Sn and Cu-4.5%Sn alloys have been deformed in plane strain compression at temperatures up to 700oC and the evolution of the microstructures and textures determined by high resolution EBSD. The effect of the solute is to raise the temperature at which dynamic recrystallization occurs and to significantly reduce the size of the dynamically recrystallized grains. In all the materials, there is a small increase in the cube texture component on dynamic recrystallization. The boundary bulges which precede recrystallization are different in the copper and Cu-Sn alloys, although in both materials there is evidence that local deformation in the boundary regions plays a significant role in dynamic recrystallization.

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Zozulya, Eduard, Anatolii Zubkov, Oleksandr Terletskyi, and Valentin Riaboshtan. "NIOBIUM IN COPPER AND COPPER-BASED ALLOYS. REVIEW." Collection of Scientific Works of the Ukrainian State University of Railway Transport, no. 206 (December 11, 2023): 31–43. http://dx.doi.org/10.18664/1994-7852.206.2023.296691.

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In the scientific and technical literature review, investigated the use of niobium as an environmentally friendly and effective alloying addition to enhance the temperature stability of the structure and properties of copper products with an ultrafine-grained structure has been investigated. Considerable attention is paid to the potential of niobium as an alloying addition in the context of the innovative use of niobium to form a special «layer» at grain boundaries to strengthen its influence on the structure, especially the grain structure, and consequently on the properties of copper and materials based on it. The review of literature and informational sources devoted to the Cu-Nb phase diagram has shown that niobium is one of the most effective segregants to limit grain growth in binary copperbased alloys. Additionally, the efficiency of niobium as an alloying element that improves the grain structure and the mechanisms believed to underlie this phenomenon have been discussed. In particular, the use of alloying and liquid metal processing technologies for refining the grain structure of copper alloys has been examined. It has been elucidated that niobium in copper-based alloys is also used to enhance physicalmechanical and technological properties. The impact of microimpurities on the final structure of the copper-niobium alloy has been highlighted, imposing specific requirements on the purity of input materials and the technologies used to eliminate contamination from the melt and improve its homogenization. The review briefly discusses other methods that can be employed to form a special «layer» at grain boundaries. Specifically, technologies of mechanical alloying and methods of simultaneous deposition of component vapors in a vacuum have been studied. Based on the results of the literature analysis, the considerable prospectiveness of methods involving the simultaneous deposition of component vapors in a vacuum to create a special «layer» at grain boundaries has been demonstrated. The article examines the results of studies on niobium segregation at grain boundaries in the copper-niobium system and similar systems, establishing that the improvement of several described technologies and methods can be quite promising for the further development of technology for its implementation in production.

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Wang, W. H., X. Sun, G. D. Köhlhoff, and K. Lücke. "Orientation Determination by Continuous Etching Patterns in Copper and Copper Alloys." Textures and Microstructures 24, no. 4 (January 1, 1995): 199–219. http://dx.doi.org/10.1155/tsm.24.199.

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A new method for determination of grain orientations using etch patterns was developed for copper and copper alloys. This method is based on the fact, that one gets etch patterns characteristic for the crystallographic orientation of the etched surface, if a specimen of copper or copper alloys is etched in conc. HNO3. In contrast to etch pits, the etch patterns are developed continuously over the whole grain. This allows a direct and continuous observation of the orientation changes within and between the grains, which is not possible for many other orientation determination methods. The determination accuracy of the new method depends on the crystallographic orientation of the etched surface and varies between 2° and 10°. For some special surface orientations the etch patterns allow even the determination of very small orientation changes (≤ 2°), occurring e.g. in a deformed grain.

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Vanzetti, Matteo, Michael J. Pavel, C. Jacob Williamson, Elisa Padovano, Lorena I. Pérez-Andrade, Mark Weaver, Luke N. Brewer, Federica Bondioli, and Paolo Fino. "Design and Characterization of Innovative Gas-Atomized Al-Si-Cu-Mg Alloys for Additive Manufacturing." Metals 13, no. 11 (November 3, 2023): 1845. http://dx.doi.org/10.3390/met13111845.

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Metallic powders are widely utilized as feedstock materials in metal additive manufacturing (MAM). However, only a limited number of alloys can currently be processed using these technologies, with most of them being casting alloys. The objective of this study is to investigate novel aluminum alloys produced via a close-coupled gas atomizer (CCGA) by adding an increasing amount of copper (4, 8, and 20 wt%) to an AlSi10Mg alloy. The obtained powders were fully characterized to evaluate the effect of copper, a well-established strengthener for aluminum alloys, in order to correlate the obtained hardness to the powder phase composition and microstructure. In particular, a dendritic microstructure was observed in all alloys, and, as the copper content was increased, the size of the secondary dendrite arm spacing (SDAS) decreased progressively. Consequently, the hardness measured on the powder cross-section linearly increased with the copper content, and the hardness value of 185 ± 13 HV of the AlCu20Si10Mg composition was found to be twice that of the AlSi10Mg alloy (88 ± 5 HV).

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Fan, Tiehan, Jianxin Hou, and Jian Hu. "An Effective Framework for Predicting Performance of Solid-Solution Copper Alloys Using a Feature Engineering Technique in Machine Learning." Metals 13, no. 10 (September 25, 2023): 1641. http://dx.doi.org/10.3390/met13101641.

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Utilized extensively in a myriad of industries, solid-solution copper alloys are prized for their superior electrical conductivity and mechanical properties. However, optimizing these often mutually exclusive properties poses a challenge, especially considering the complex interplay of alloy composition and processing techniques. To address this, we introduce a novel computational framework that employs advanced feature engineering within machine learning algorithms to accurately predict the alloy’s microhardness and electrical conductivity. Our methodology demonstrates a substantial enhancement over traditional data-driven models, achieving remarkable increases in R2 scores—from 0.939 to 0.971 for microhardness predictions and from −1.05 to 0.934 for electrical conductivity. Through machine learning, we also spotlight key determinants that significantly influence overall performance of solid-solution copper alloys, providing actionable insights for future alloy design and material optimization.

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Mahin Muntasir, Razia Khan Sharme, Mohammad Borhan Uddin, Mohammad Salman Haque, and Fahim Khan. "Modeling Microstructural and Mechanical Properties of Solidified Al-Sn-Cu System." Malaysian Journal on Composites Science and Manufacturing 12, no. 1 (November 29, 2023): 84–101. http://dx.doi.org/10.37934/mjcsm.12.1.84101.

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In this study,three samples were created using gravity die casting, i.e.,two modelsof immiscible alloys, Alloy1 (Al-12wt.%Sn-8wt.%Cu) and Alloy2 (Al-20wt.%Sn-10wt.%Cu),along with a control sample of pure Al.These gravity die-cast samples,homogenized at 700°Cfor 2hours,are analyzed formechanical properties and microstructures.Optical microscopy and scanning electron microscopy with energy dispersive spectroscopy (EDS) were used to analyze the changes in the Al-Sn-Cu solidified system resulting from the addition of specific alloying elements. Both Alloy1 and Alloy2 showed better mechanical properties than the control sample of pure Al. The tensile strength of Alloy2 shows a decrease from 110.878 MPato 105.750 MPacompared to Alloy1. However, there isan increase in the yield strength from 30.239 MPa to 32.362 MPa when the addition of tin exceeds 12% and copper exceeds 8%, respectively, which might be because of the alpha-phase solid solution’s interdendritic region that produces lattice strains.The impact resistance and ductility of the alloy are compromised as the hardness increases with the addition of more alloying elements. Alloy2 exhibited the highest hardness at 50.92 HB. The Brinell hardness values suggest these alloys arepotential candidatesto replace antifriction bronzes. However, hard CuAl2 is produced at the grain boundaries when copper percentages are increased, reducingthe impact properties. The effects of different alloying constituents and melt treatment on the microstructural control of Al-Sn-Cu solidified alloy werealso studied. The aluminum matrix with a semi-continuous network (reticular) distribution of tin on the grain boundary was observed. The grain size gradually decreased from 19.65 μm to 16.94 μm and became more equiaxed for Al-20wt.%Sn-10wt.%Cu than Al-12wt.%Sn-8wt.%Cu. The bond between tin and matrix improved with the increasing alloying element. The data obtained from this experiment will undoubtedly contribute to future research in this field

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Li, Lan, Lin Sheng Li, and Chang Jun Qiu. "A New Method of Directional Solidification of Cu-Cr Alloy." Advanced Materials Research 668 (March 2013): 804–7. http://dx.doi.org/10.4028/www.scientific.net/amr.668.804.

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In order to meet the need of high-strength and high-electrical conductivity copper alloys in industry. A method of making high-strength and high-electrical conductivity copper alloys is discussed in this paper. This method uses the technology of heated mold continuous casting to make Cu-Cr alloy. Because it utilizes the high electrical conductivity of copper matrix and high strength of the chromium phase, the in-situ composite Cu-Cr alloy with directional solidification structure is got. The in-situ composite Cu-Cr alloy has good properties and will be widely used in industry.

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Shelyakov, Alexander, Nikolay Sitnikov, Irina Khabibullina, Kirill Borodako, and Oleg Sevryukov. "Shape Memory Behavior of Rapidly Quenched High-copper TiNiCu Alloys." U.Porto Journal of Engineering 7, no. 2 (March 5, 2021): 2–10. http://dx.doi.org/10.24840/2183-6493_007.002_0002.

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Rapidly quenched quasibinary TiNi–TiCu system alloys with high copper contents (above 20 at.%) exhibit excellent shape memory effect and have considerably narrower hysteresis as compared with the TiNi binary alloy, this advantage being of special importance for cyclic load applications, e.g. for microelectromechanics (MEMS). The aim of this work is to study the effect of annealing parameters and copper content on the shape memory effect in TiNiCu alloys. Thin amorphous ribbons of TiNi-TiCu alloys with copper contents of 25 to 40 at.% were produced by planar flow casting at a melt cooling rate of about 106 K/s. The alloys were crystallized by isothermal annealing with variable duration and by exposing specimens to a short (10 ms) electric pulse. Increasing the copper content to above 30 at.% considerably reduces the plasticity and shape memory effect of the alloys. However, significant reduction of annealing duration greatly improves the shape memory performance due to prevention of the formation of brittle Ti-Cu phases in the alloys structure.

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Chu, C. N., N. Saka, S. T. Oktay, and N. P. Suh. "Dispersion-Strengthened Alloys by the Mixalloying Process." Journal of Engineering for Industry 113, no. 4 (November 1, 1991): 481–85. http://dx.doi.org/10.1115/1.2899727.

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Ceramic particle-dispersed metal-matrix alloys were produced by the Mixalloying Process. In this process, two liquid metal jets were impinged into a mixing head and intimately mixed by turbulence. Liquid copper solution with dilute boron and liquid copper solution with dilute zirconium were impinged and submicron size zirconium diboride particles were produced in liquid copper. The copper-zirconium diboride mixture was solidified in a water cooled mold. Addition of excessive zirconium enhanced boride particle dispersion. Because of particle strengthening, the room temperature microhardness was twice that of annealed copper, and the hardness was retained up to 1173 K in one hour annealing treatments. Experimental result on copper-aluminum oxide alloy is also reported.

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Ashkani, Omid, Mohammad Reza Tavighi, Mojtaba Karamimoghadam, Mahmoud Moradi, Mahdi Bodaghi, and Mohammad Rezayat. "Influence of Aluminum and Copper on Mechanical Properties of Biocompatible Ti-Mo Alloys: A Simulation-Based Investigation." Micromachines 14, no. 5 (May 20, 2023): 1081. http://dx.doi.org/10.3390/mi14051081.

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The use of titanium and titanium-based alloys in the human body due to their resistance to corrosion, implant ology and dentistry has led to significant progress in promoting new technologies. Regarding their excellent mechanical, physical and biological performance, new titanium alloys with non-toxic elements and long-term performance in the human body are described today. The main compositions of Ti-based alloys and properties comparable to existing classical alloys (C.P. TI, Ti-6Al-4V, Co-Cr-Mo, etc.) are used for medical applications. The addition of non-toxic elements such as Mo, Cu, Si, Zr and Mn also provides benefits, such as reducing the modulus of elasticity, increasing corrosion resistance and improving biocompatibility. In the present study, when choosing Ti-9Mo alloy, aluminum and copper (Cu) elements were added to it. These two alloys were chosen because one element is considered a favorable element for the body (copper) and the other element is harmful to the body (aluminum). By adding the copper alloy element to the Ti-9Mo alloy, the elastic modulus decreases to a minimum value of 97 GPa, and the aluminum alloy element increases the elastic modulus up to 118 GPa. Due to their similar properties, Ti-Mo-Cu alloys are found to be a good optional alloy to use.

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Haubner, R., and S. Strobl. "Microstructural Examinations of Copper Antimony Alloys." Practical Metallography 58, no. 10 (October 1, 2021): 620–29. http://dx.doi.org/10.1515/pm-2021-0054.

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Abstract Among other materials, fahlores were used in the Bronze Age copper ore smelting process. These contain, apart from sulfur, arsenic and antimony. Therefore, these elements can be found in Bronze Age copper casting ingots or artifacts. In order to study the behavior of Sb more closely, two copper alloys containing 10 and 30 wt. % Sb were melted and subjected to a metallographic examination. On the one hand, microstructures with copper dendrites and homogeneous interdendritic areas primarily composed of intermetallic phase could be found. On the other hand, at higher Sb concentrations, first Cu3Sb precipitated which, in turn, transformed to Cu10Sb3 upon cooling. The crystals in these microstructures were characterized by numerous parallel cracks. No further phases were observed by XRD.

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Journal articles on the topic 'Copper alloys'

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