Relevant bibliographies by topics / Copper alloys

Academic literature on the topic 'Copper alloys'

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Published: 4 June 2021
Last updated: 28 July 2024

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Journal articles on the topic "Copper alloys"

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Murphy, Michael. "Copper and copper alloys." Metal Finishing 95, no. 2 (February 1997): 24. http://dx.doi.org/10.1016/s0026-0576(97)94205-7.

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Mysik, R. K., S. V. Brusnitsyn, and A. V. Sulitsin. "Application Of Ni-Mg-Ce Master Alloy Scrap For Inoculation Of Copper-Nickel Alloys." KnE Materials Science 2, no. 2 (September 3, 2017): 102. http://dx.doi.org/10.18502/kms.v2i2.954.

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<p class="TTPAbstract">The problems of production of copper-nicckel alloys ingots by semicontinuous casting method are analysed. The requirement of grain size refinement in cast alloys macrostructure is shown. It is necessary to reduce the probability of hot cracks formation and increase the fabricability of cast bars during plastic working. The reasonability of fine fraction of Ni-Mg-Ce master alloy application for inoculation of copper-nickel alloys is established. The results of laboratory experiments on the study of master alloy quantity influence the structure and hardness of Cu-5Ni-1Fe, Cu-10Ni-1Fe-1Mn and Cu-30Ni-1Fe-1Mn copper-nickel alloys are presented. On the basis of industrial experiments it is revealed that inoculation of Cu-5Ni-Fe alloy ingots of diameter 200 mm by Ni-Mg-Ce master alloy leads to considerable reducing of macrograin size. It allows to improve mechanical properties of ingots and ensure their uniform distribution in cross section of ingots. It is established that residual magnesium content in alloy must be in range from 0,02 to <br />0,06 wt. %. The use of Ni-Mg-Ce master alloy makes it possible to increase the processability of copper-nickel alloys during plastic working and utilize the fine fraction master alloy scrap inevitably formed during its production.</p>
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Roy, Brandon, Erin LaPointe, Andrew Holmes, Dillon Camarillo, Bonolo Jackson, Daniel Mathew, and Andrew Craft. "Effect of Hydrogen Exposure Temperature on Hydrogen Embrittlement in the Palladium–Copper Alloy System (Copper Content 5–25 wt.%)." Materials 16, no. 1 (December 28, 2022): 291. http://dx.doi.org/10.3390/ma16010291.

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The yield strength, ultimate strength, and elongation/ductility properties of a series of palladium–copper alloys were characterized as a function of the temperature at which each alloy underwent absorption and desorption of hydrogen. The alloys studied ranged in copper content from 5 weight percent copper to 25 wt.% copper. Compared to alloy specimens that had been well-annealed in a vacuum and never exposed to hydrogen, alloys with copper content up to 15 wt.% showed strengthening and loss of ductility due to hydrogen exposure. In these alloys, it was found that the degree of strengthening and loss of ductility was dependent on the hydrogen exposure temperature, though this dependence decreased as the copper content of the alloy increased. For alloys with copper contents greater than 15 wt.%, hydrogen exposure had no discernible effect on the strength and ductility properties compared to the vacuum-annealed alloys, over the entire temperature range studied.
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Honkanen, Mari, Minnamari Vippola, and Toivo Lepistö. "Oxidation of copper alloys studied by analytical transmission electron microscopy cross-sectional specimens." Journal of Materials Research 23, no. 5 (May 2008): 1350–57. http://dx.doi.org/10.1557/jmr.2008.0160.

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In this work, the oxide structures of three polycrystalline copper grades, unalloyed oxygen-free (OF) copper and alloyed CuAg and deoxidized high-phosphor (DHP) copper, were studied using cross-sectional analytical transmission electron microscopy (AEM) samples. The oxidation treatments were carried out in air at 200 and 350 °C for different exposure times. The detailed oxide layer structures were characterized by AEM. At 200 °C, a nano-sized Cu2O layer formed on the all copper grades. At 350 °C, a nano-sized Cu2O layer formed first on the all copper grades. After longer exposure time at 350 °C, a crystalline CuO layer grew on the Cu2O layer of the unalloyed OF-copper. In the case of the alloyed CuAg- and DHP-copper, a crystalline and columnar shaped layer, consisting of Cu2O and CuO grains, formed on the nanocrystalline Cu2O layer. At 350 °C, the unalloyed copper oxidized notably slower than the alloyed coppers, and its oxide structures were different than those of the alloyed coppers.
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Pereplyotchikov, E. F. "Plasma-powder surfacing of nickel and cobalt alloys on copper and its alloys." Paton Welding Journal 2015, no. 6 (June 28, 2015): 10–13. http://dx.doi.org/10.15407/tpwj2015.06.02.

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Ma, Shi De, Xia Zhao, Hong Ren Wang, and Ji Zhou Duan. "Research on the Antifouling Mechanisms of Copper and its Alloys." Advanced Materials Research 79-82 (August 2009): 2179–82. http://dx.doi.org/10.4028/www.scientific.net/amr.79-82.2179.

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In this paper, the in-situ exposure tests of 15 kinds of copper and its alloys were carried out in seawater at Zhanjiang Harbor for 12 months in order to study their anti-fouling abilities and anti-corrosion properties. In the same way, the in-situ anti-fouling tests of copper and bronze were performed in Qingdao for 8 years. Successively, the anti-fouling properties were analyzed combining with the electrochemical process of copper alloy corrosion and biology process of the adhesion. The chemical, physical and biological factors influencing the fouling properties of copper alloys were also investigated. The results showed that the coppers can equip themselves with antifouling performance by producing some toxic substances during the processes of chemical and electrochemical reaction. In addition, the antifouling ability was proved to relate to the exfoliation effect, which was the result of interaction between stain layer adhesion and spalling force of the attachments.
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Tebyakin, A. V., A. N. Fokanov, and V. F. Podurazhnaya. "Multipurpose copper alloys." Proceedings of VIAM, no. 12 (December 2016): 5. http://dx.doi.org/10.18577/2307-6046-2016-0-12-5-5.

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MIURA, Hiromi. "Copper Alloys II." Journal of the Japan Society for Technology of Plasticity 54, no. 629 (2013): 466–68. http://dx.doi.org/10.9773/sosei.54.466.

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Hashimoto, Kaoru, Takehiko Sato, and Koichi Niwa. "Laser Welding Copper and Copper Alloys." Journal of Laser Applications 3, no. 1 (January 1991): 21–25. http://dx.doi.org/10.2351/1.4745272.

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Raikov, Yu N., G. V. Ashikhmin, A. K. Nikolaev, N. I. Revina, and S. A. Kostin. "Nanotechnology for copper and copper alloys." Metallurgist 51, no. 7-8 (July 2007): 408–16. http://dx.doi.org/10.1007/s11015-007-0074-5.

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Dissertations / Theses on the topic "Copper alloys"

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Wood, G. P. "Electrodeposition of copper-zinc alloys." Thesis, University of Nottingham, 1985. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.355428.

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Hamilton, M. A. "The optical properties of oxide films on copper and copper alloys." Thesis, London Metropolitan University, 1985. http://repository.londonmet.ac.uk/3378/.

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Suitable conditions were selected to allow thin, thermal oxide films consisting of cuprous oxide only to be grown on copper and dilute copper alloy substrates. The identity of the oxide was confirmed by x-ray diffraction and coulometry. Spectral measurements covering the wavelength range 350 - 750 nm were made using an automatic, self-nulling ellipsometer. From this data the optical constants and thickness of the oxide films were computed and compared to those of the bulk oxide. The optical constants of the oxide were found to depend on the thickness of the film and the identity of the alloying addition in the substrate. The effect of different substrates on the optical constants of cuprous oxide was tested by growing thin cuprous oxide films on gold and glass substrates. Optical property changes of the oxide are attributed to space-charge effects existing at the substrate/oxide interface.
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Durandet, Y. C. "Rapidly solidified high-copper dental amalgam alloys /." Title page, contents and summary only, 1990. http://web4.library.adelaide.edu.au/theses/09PH/09phd949.pdf.

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Gao, Guilian. "Dealloying of copper alloys in aqueous solutions." Thesis, University of Cambridge, 1989. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.316771.

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Smith, Jacob A. "Electrical Performance of Copper-Graphene Nano-Alloys." Ohio University / OhioLINK, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=ohiou1550675878730599.

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Cottle, Rand Duprez. "Isotropic copper-invar alloys for microelectronics packaging /." Digital version accessible at:, 2000. http://wwwlib.umi.com/cr/utexas/main.

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Athavale, Saurabh. "Effect of Cu concentration and cooling rate on microstructure of Sn-3.9Ag-XCu." Diss., Online access via UMI:, 2006.

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Vega-Garcia, Jean-Paul. "Microstructural Investigation of Precipitation Hardened CuNi2S+Zr Alloys for Rotor Applications." Master's thesis, University of Central Florida, 2010. http://digital.library.ucf.edu/cdm/ref/collection/ETD/id/2157.

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Industrial generator components experience high stresses and electrical fields during their service life. Material integrity is key in guaranteeing component performance. CuNi2SiZr, used as rotor wedges in generators, serve to maintain rotor slot content in place while experiencing high centrifugal stresses and low cycle fatigue during start and stop at elevated temperature. The quality and integrity of this material in service can be directly related to its microstructure, which is determined by the processing procedures of the wedges. In this study, the microstructure development in this material is evaluated to eliminate grain boundary defects by optimizing processing parameters, determining the best temperature/time combination for precipitation hardening, and determining cold work effect on aging parameters. Two chemistries containing Nickel-to-Silicon ratios of 3.2 and 3.8 were selected for analysis. Cast samples were hot extruded, cold worked, and precipitation hardened. Parameters were varied at each processing step. Five different levels of cold work (4, 5, 7, 10 and 13%) were evaluated using 5 different aging temperatures (450, 460, 470, 490 and 500°C). Each processing parameters' effect on microstructure and subsequently on hardness, conductivity, and tensile strength was recorded to assess material performance and identify grain boundary defects origination. Finding of this study identified observed grain boundary defects, using Transmission Electron Analysis, as voids/micro-tears. These defects on grain boundary are detrimental to low cycle fatigue, creep rupture and tensile strength properties and important aspects of the material performance. Grain boundary defects were observed at all levels of cold work, however, origination of defects was only observed in grain sizes larger than 50µm. The strengthening phases for the CuNi2Si+Zr alloy system were identified as Ni2Si and Cr3Si. The Nickel-to-Silicon ratio had an evident effect on the electrical conductivity of the material. However, aging benefits were not clearly established between the two Nickel-to-Silicon ratios.
M.S.M.S.E.
Department of Mechanical, Materials and Aerospace Engineering;
Engineering and Computer Science
Materials Science & Engr MSMSE
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Tarhan, Elif. "Ageing Characteristics Of Copper Based Shape Memory Alloys." Phd thesis, METU, 2004. http://etd.lib.metu.edu.tr/upload/3/593541/index.pdf.

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Martensite-to-Beta transformation temperatures of CuAlNiMn and CuAlNi shape memory alloys has been determined by differential scanning calorimetry (DSC). In CuAlNiMn alloys, each new betatizing treatment has resulted in randomly varying transformation temperatures on the same specimen and an anomalously diffuse and serrated Martensite-to-Beta transformation peaks in the first cycle. Therefore, as quenched alloy samples were thermally cycled for three times in DSC prior to ageing to obtain thermally stable and reproducible transformation temperatures and to eliminate the anomalous effect of betatizing on the transformation temperatures. CuAlNiMn alloys were aged in martensitic condition at temperatures in the range 80&
#61616
C to 150&
#61616
C for 24 hours to 312 hours ageing periods. Both A_s and A_f temperatures have increased with ageing temperature and time while M_s and M_f temperatures have not changed during martensite ageing. Transformation temperatures of CuAlNi alloys, on the other hand, have not changed during martensite ageing. In this respect, CuAlNiMn alloys were found to be more prone to martensite stabilization than the CuAlNi alloys. Through Transmission Electron Microscope investigation in the Cu-12.6wt%Al-5.9wt%Ni-1.8wt%Mn alloy aged at 150&
#61616
C for 312 hours has revealed no sign of precipitate formation and it has been concluded that the &
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precipitates pinning martensite boundaries&
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mechanism could not be responsible of martensite stabilization. Beta phase ageing of CuAlNiMn alloys at temperatures 200&
#61616
C, 230&
#61616
C, 250&
#61616
C and 270&
#61616
C, have drastically shortened the periods for stabilization to the extent that &
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-to-M transformation completely ceases. With regard to the Manganese content, highest Manganese bearing alloy was the one stabilized first and the lowest manganese containing one was the longest lasting alloy during beta phase ageing. Beta stabilization was not observed in any of the four CuAlNi alloys at the end of 96 hours ageing at 200&
#61616
C while beta stabilization was realized after 26, 38 and 11 hours ageing at the same temperature in the three Mn containing alloys studied. In conclusion, on the basis of ageing studies at 200&
#61616
C, with regard to beta stabilization, CuAlNi alloys were found to be more resistant to high temperature ageing than CuAlNiMn alloys. Equilibrium &
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_2 and &
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phases were observed with coupled-grown lamellar morphologies in Cu-13.6%Al-3.0%Ni alloy aged above 400&
#61616
C.
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Setna, R. P. "Study of the decomposition of copper-cobalt alloys." Thesis, University of Oxford, 1994. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.239277.

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Books on the topic "Copper alloys"

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R, Davis J., and ASM International. Handbook Committee., eds. Copper and copper alloys. Materials Park, OH: ASM International, 2001.

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Society, Non-Ferrous Founders, and Copper Development Association, eds. Copper casting alloys. New York: Copper Development Association, 1994.

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Justin, Furness, Segal Agnes, and Materials Information Service, eds. Using copper alloys. London: Institute of Materials, 1994.

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Wang, Shuisheng. Electrodeposition of copper-cobalt alloys and copper-nickel alloys and pulse plating of copper-cobalt alloys. [s.l: s.n.], 1989.

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Society, American Foundrymen's, ed. Casting copper-base alloys. 2nd ed. Schaumburg, Ill: American Foundrymen's Society, 2007.

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Casting copper-base alloys. 3rd ed. Schaumburg, Ill: American Foundrymen's Society, 2016.

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Society, American Foundrymen's, ed. Casting copper-base alloys. 2nd ed. Schaumburg, Ill: American Foundrymen's Society, 2007.

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Howard, Mendenhall J., ed. Understanding copper alloys: The manufacture and use of copper and copper alloy sheet and strip. Malabar, Fla: R.E. Krieger Pub. Co., 1986.

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Society, American Foundrymen's, ed. Casting copper-base alloys. 2nd ed. Schaumburg, Ill: American Foundrymen's Society, 2007.

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Volov, Igor. Copper and Copper Alloys: Studies of Additives. [New York, N.Y.?]: [publisher not identified], 2013.

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Book chapters on the topic "Copper alloys"

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Sequeira, C. A. C. "Copper and Copper Alloys." In Uhlig's Corrosion Handbook, 757–85. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9780470872864.ch56.

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Freudenberger, Jens, and Hans Warlimont. "Copper and Copper Alloys." In Springer Handbook of Materials Data, 297–305. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-69743-7_12.

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Kundig, Konrad J. A., and John G. Cowie. "Copper and Copper Alloys." In Mechanical Engineers' Handbook, 117–220. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2006. http://dx.doi.org/10.1002/0471777447.ch4.

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Watts, G. R. "Alloys with Copper." In Rh Rhodium, 250–58. Berlin, Heidelberg: Springer Berlin Heidelberg, 1991. http://dx.doi.org/10.1007/978-3-662-06411-5_43.

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Schaller, H. J., G. Fickel, and A. Maaz. "Thermodynamic Properties of Solid Copper-Aluminium and Copper-Germanium Alloys." In Thermochemistry of Alloys, 359–70. Dordrecht: Springer Netherlands, 1989. http://dx.doi.org/10.1007/978-94-009-1027-0_21.

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Bolton, William, and R. A. Higgins. "Copper and its alloys." In Materials for Engineers and Technicians, 211–26. Seventh edition. | Abingdon, Oxon ; New York, NY : Routledge, 2021.: Routledge, 2020. http://dx.doi.org/10.1201/9781003082446-16.

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Hummert, K., H. Müller, and C. Spiegelhauer. "Spray forming: Copper alloys." In Powder Metallurgy Data, 247–57. Berlin, Heidelberg: Springer Berlin Heidelberg, 2003. http://dx.doi.org/10.1007/10689123_14.

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Chengchang, Jia, and Xu Kuangdi. "Powder Metallurgy Copper Alloys." In The ECPH Encyclopedia of Mining and Metallurgy, 1–2. Singapore: Springer Nature Singapore, 2024. http://dx.doi.org/10.1007/978-981-19-0740-1_1463-1.

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Boyle, K. P. "Latent Hardening in Copper and Copper Alloys." In Materials Science Forum, 1043–48. Stafa: Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-975-x.1043.

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Müller, Hilmar R., and Igor Altenberger. "Spray Forming of Copper Alloys." In Metal Sprays and Spray Deposition, 407–62. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-52689-8_11.

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Conference papers on the topic "Copper alloys"

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Okamoto, S., K. Hashimoto, T. Sato, and K. Niwa. "Laser welding copper and copper alloys." In ICALEO® ‘89: Proceedings of the Materials Processing Conference. Laser Institute of America, 1989. http://dx.doi.org/10.2351/1.5058338.

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Schneider, M. S. "Laser-Induced Shock Compression of Copper and Copper Aluminum Alloys." In SHOCK COMPRESSION OF CONDENSED MATTER - 2003: Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter. AIP, 2004. http://dx.doi.org/10.1063/1.1780312.

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Doiron, Theodore D., John R. Stoup, Patricia Snoots, and Grace Chaconas. "Measuring the stability of three copper alloys." In San Dieg - DL Tentative, edited by Roger A. Paquin. SPIE, 1990. http://dx.doi.org/10.1117/12.22862.

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Perovskaya, M. V., G. V. Shlyakhova, S. A. Barannikova, and L. B. Zuev. "STRUCTURAL INVESTIGATIONS OF DEFORMED COPPER-NICKEL ALLOYS." In Physical Mesomechanics of Materials. Physical Principles of Multi-Layer Structure Forming and Mechanisms of Non-Linear Behavior. Novosibirsk State University, 2022. http://dx.doi.org/10.25205/978-5-4437-1353-3-111.

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Petring, Dirk, and Vahid Nazery Goneghany. "Learning more about laser beam welding by applying it to copper and copper alloys." In ICALEO® 2010: 29th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Laser Institute of America, 2010. http://dx.doi.org/10.2351/1.5062079.

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Lo, C. C. H. "Effects of copper precipitation on the magnetic properties of aged copper-containing ferrous alloys." In REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 31. AIP, 2012. http://dx.doi.org/10.1063/1.4716374.

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El Abdi, Rochdi, and Erwann Carvou. "Damage Study of Copper Alloys Submitted to Vibration Tests." In ASME 2010 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/detc2010-28026.

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The main requirement for the connector materials used in electrical contacts and submitted to vibration mode is to maintain very low and stable electrical resistance. Wear and fretting corrosion are a major cause of connector failure and the main reasons influencing the reliability of the electrical system. If the use of coating materials in electrical contacts is widespread, the coatings disappear from the contact surfaces after a certain number of vibration cycles and the contact is carried out between the two basic substrates in contact at the interface. Our study relates to the contact resistance characterization under dynamic vibrations for a contact between a sphere and plane using high content copper alloys with no coatings. Only one contact part is subjected to a vibratory movement, the other part is fixed. The contact resistance is continuously measured during the test. An experimental study of contact resistance behaviour is undertaken in order to evaluate the influence of mechanical and electrical material properties on the degradation of conduction. The obtained results show that the hardness and the resistivity of the copper alloys used have a large influence on the component lifespan.
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"Copper-Zinc-Lead Alloys, Features And Applications (Technical Review)." In 3rd International Conference on Advances in Engineering Sciences and Applied Mathematics. International Institute of Engineers, 2015. http://dx.doi.org/10.15242/iie.e0315067.

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Miller, M. K., and K. F. Russell. "Clustering and precipitation in neutron irradiated low copper and copper-free steels and model alloys." In 2006 19th International Vacuum Nanoelectronics Conference and 50th International Field Emission Symposium. IEEE, 2006. http://dx.doi.org/10.1109/ivnc.2006.335299.

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Suriano, A. M., S. M. Howard, C. D. Christofferson, I. J. Arnquist, and E. W. Hoppe. "Developing radiopure copper alloys for high strength low background applications." In LOW RADIOACTIVITY TECHNIQUES 2017 (LRT 2017): Proceedings of the 6th International Workshop on Low Radioactivity Techniques. Author(s), 2018. http://dx.doi.org/10.1063/1.5019009.

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Reports on the topic "Copper alloys"

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Simon, N. J., E. S. Drexler, and R. P. Reed. Properties of copper and copper alloys at cryogenic temperatures. Gaithersburg, MD: National Institute of Standards and Technology, 1992. http://dx.doi.org/10.6028/nist.mono.177.

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Simon, N., E. Drexler, and R. Reed. Properties of copper and copper alloys at cryogenic temperatures. Final report. Office of Scientific and Technical Information (OSTI), February 1992. http://dx.doi.org/10.2172/5340308.

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Leedy, K. D., J. F. Stubbins, B. N. Singh, and F. A. Garner. Fatigue behavior of copper and selected copper alloys for high heat flux applications. Office of Scientific and Technical Information (OSTI), April 1996. http://dx.doi.org/10.2172/270446.

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Garner, F. A., and H. R. Brager. Neutron-induced changes in density of copper alloys. Office of Scientific and Technical Information (OSTI), January 1991. http://dx.doi.org/10.2172/6224137.

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Pawel, R. E., and R. K. Williams. Survey of physical property data for several alloys. [Nitronic 33; copper C10400; copper C17510]. Office of Scientific and Technical Information (OSTI), August 1985. http://dx.doi.org/10.2172/5337885.

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M.Sadayappan, J.P.Thomson, M.Elboujdaini, G.Ping Gu, and M. Sahoo. Grain Refinement of Permanent Mold Cast Copper Base Alloys. Office of Scientific and Technical Information (OSTI), April 2005. http://dx.doi.org/10.2172/840819.

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Fabritsiev, S. A., S. J. Zinkle, and A. F. Rowcliffe. Effect of fission neutron irradiation on the tensile and electrical properties of copper and copper alloys. Office of Scientific and Technical Information (OSTI), April 1995. http://dx.doi.org/10.2172/114937.

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Fabritsiev, S. A., A. S. Pokrovsky, V. A. Sandakov, S. J. Zinkle, A. F. Rowcliffe, D. J. Edwards, F. A. Garner, B. N. Singh, and V. R. Barabash. The effect of neutron spectrum on the mechanical and physical properties of pure copper and copper alloys. Office of Scientific and Technical Information (OSTI), April 1996. http://dx.doi.org/10.2172/219451.

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Garner, F. A., and H. R. Brager. Swelling of copper-aluminum and copper-nickel alloys in FFTF-MOTA at approximately 450/sup 0/C. Office of Scientific and Technical Information (OSTI), June 1986. http://dx.doi.org/10.2172/5349021.

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Zinkle, S. J., and W. S. Eatherly. Tensile and electrical properties of high-strength high-conductivity copper alloys. Office of Scientific and Technical Information (OSTI), September 1998. http://dx.doi.org/10.2172/330628.

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