Relevant bibliographies by topics / Copper

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Copper'

Author: Grafiati
Published: 4 June 2021
Last updated: 8 October 2024

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Copper.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Copper"

1

Honkanen, Mari, Minnamari Vippola, and Toivo Lepistö. "Oxidation of copper alloys studied by analytical transmission electron microscopy cross-sectional specimens." Journal of Materials Research 23, no. 5 (May 2008): 1350–57. http://dx.doi.org/10.1557/jmr.2008.0160.

Full text
Abstract:
In this work, the oxide structures of three polycrystalline copper grades, unalloyed oxygen-free (OF) copper and alloyed CuAg and deoxidized high-phosphor (DHP) copper, were studied using cross-sectional analytical transmission electron microscopy (AEM) samples. The oxidation treatments were carried out in air at 200 and 350 °C for different exposure times. The detailed oxide layer structures were characterized by AEM. At 200 °C, a nano-sized Cu2O layer formed on the all copper grades. At 350 °C, a nano-sized Cu2O layer formed first on the all copper grades. After longer exposure time at 350 °C, a crystalline CuO layer grew on the Cu2O layer of the unalloyed OF-copper. In the case of the alloyed CuAg- and DHP-copper, a crystalline and columnar shaped layer, consisting of Cu2O and CuO grains, formed on the nanocrystalline Cu2O layer. At 350 °C, the unalloyed copper oxidized notably slower than the alloyed coppers, and its oxide structures were different than those of the alloyed coppers.
APA, Harvard, Vancouver, ISO, and other styles
2

Xu, Xiaowei, Jing Hua, Houhu Zhang, Zehua Zhao, Yi Wang, Dapeng Zhang, Jun Zhang, and Xiaoxi Chen. "Environmental Risk Assessment of Recycled Products of Spent Coppery Etchant in Jiangsu Province, China." International Journal of Environmental Research and Public Health 18, no. 15 (July 26, 2021): 7881. http://dx.doi.org/10.3390/ijerph18157881.

Full text
Abstract:
With the vigorous development of the 5G industry, the characteristic hazardous waste, spent coppery etchant, was also produced in large quantities. In recent years, there are many companies that have begun to collect spent coppery etchant for the purpose of producing recycled products, such as copper sulfate, copper oxide, basic copper chloride, and copper powder, which often contain large amounts of heavy metals. However, due to the lack of relevant standards and applicable regulatory measures, some of the recycled products flow to the feed processing industry and even to the food processing industry. This study investigated the pollution status of heavy metals in recycled products of spent coppery etchant and evaluated the impact of recycled products exposure on human health. The results showed that the content of Zn was the highest, which was 21 times higher than the corresponding standard limit. Human health risk assessment indicated that the hazard quotients of As account for 87.5% of the entire HI value, while the average carcinogenic risk values of As for copper sulfate, copper oxide, basic copper chloride, and copper powder are 1.09 × 10−5, 3.19 × 10−5, 1.29 × 10−5, 7.94 × 10−6, respectively. Meanwhile, suggestions on the supervision of recycled products and the concentration limits of heavy metals in recycled products were put forward.
APA, Harvard, Vancouver, ISO, and other styles
3

Lalancette, N., and K. A. McFarland. "Phytotoxicity of Copper-Based Bactericides to Peach and Nectarine." Plant Disease 91, no. 9 (September 2007): 1122–30. http://dx.doi.org/10.1094/pdis-91-9-1122.

Full text
Abstract:
Organometallic copper, consisting of a mixture of copper abietate, copper linoleate, and copper oleate (CuALO), is important for postbloom management of bacterial spot in New Jersey peach and nectarine orchards. Rotation of CuALO with oxytetracycline reduces cost and helps prevent (or delay) resistant organisms. However, because copper is also phytotoxic, higher rates and inorganic coppers have not been utilized. A study was conducted on ‘Encore’ peach and ‘Redgold’ nectarine to determine the quantitative relationship between copper concentration (metallic equivalent) and phytotoxicity. Different rates of CuALO and copper hydroxide (CuOH) were applied seven times postbloom. Foliar injury and defoliation increased with number of applications and copper concentration. Maximum ‘Encore’ defoliation was 10 to 17%, while ‘Redgold’ sustained 30 to 35% leaf loss. CuOH caused similar or less leaf injury and defoliation than CuALO. No injury was observed on fruit, even at three times the labeled metallic copper rate of CuALO. Fruit size and soluble solids were not influenced by copper. Estimates of foliar density and tree volume indicated that sufficient photosynthetic capacity existed to allow acceptable leaf damage and loss from copper applications. These results showed that inorganic coppers may be viable alternatives to organometallic copper for postbloom bacterial spot control; nectarine may be more sensitive to copper injury than peach; and higher rates of metallic copper, above the current commercial rate, can be applied to peach. In the latter case, greater amounts of copper may provide longer residual activity and improved bacterial spot control on highly susceptible cultivars.
APA, Harvard, Vancouver, ISO, and other styles
4

Carrillo, F., J. Martínez, R. Barrios, and A. Roselló. "Kinetics of the conversion of copper sulfide to blister copper." Revista de Metalurgia 38, no. 5 (October 30, 2002): 334–38. http://dx.doi.org/10.3989/revmetalm.2002.v38.i5.416.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Cooper, H. Kory, Garett Hunt, Nicholas Waber, and Carey Gray. "Precontact Native Copper Innovation in British Columbia." Canadian Journal of Archaeology 44, no. 2 (2020): 185–22. http://dx.doi.org/10.51270/44.2.185.

Full text
Abstract:
Copper has figured prominently in discussions of social complexity among Northwest Coast Cultures. Coppers, shield-like sheets of copper variable in size, were a form of lineage wealth displayed, gifted, or ritually destroyed at potlatches; and copper artifacts have been recovered from human burials. The former use of copper is well-documented ethnographically and historically while the latter phenomenon is less well understood. This paper provides an overview of the occurrence of copper in precontact archaeological contexts in British Columbia using published and unpublished literature. Our investigation is framed within a Behavioral Archaeology approach that elicits ideas on copper innovation and all that it entailed. We find that copper is rare in precontact contexts from a province-wide perspective; there was likely more than one instance of native copper innovation; and contrary to previous suggestions, the copper-rich Dene region of south-central Alaska and southwestern Yukon cannot account for most of the precontact examples of copper use in the province. We offer some hypotheses to explain the precontact distribution of copper in BC, including both local invention and diffusion, not in an attempt to deliver the final verdict on this topic, but rather, to stimulate additional research.
APA, Harvard, Vancouver, ISO, and other styles
6

Zhang, Jing, Jie Wang, Yong Gao, Yaocheng Hu, Yupeng Xie, Zhiming You, and Sheng Wang. "Influence of Film Coating Thickness on Secondary Electron Emission Characteristics of Non-Evaporable Getter Ti-Hf-V-Zr Coated Open-Cell Copper Foam Substrates." Materials 15, no. 6 (March 16, 2022): 2185. http://dx.doi.org/10.3390/ma15062185.

Full text
Abstract:
The application of vacuum materials with low secondary electron yield (SEY) is one of the effective methods to mitigate the electron cloud (EC). In this study, the Ti-Hf-V-Zr non-evaporable getter (NEG) film was deposited on open-cell copper foams with different pore sizes for the suppression of electron multipacting effects. Besides, the influence of the film thickness on the secondary electron emission (SEE) characteristics of Ti-Hf-V-Zr NEG film-coated open-cell copper foam substrates was investigated for the first time. The results highlighted that all uncoated and NEG-coated foamed porous copper substrates achieved a low SEY (<1.2), which reduced at least 40% compared to the traditional copper plates, and the foamed porous coppers with 1.34-μm-thick NEG coating had the lowest SEY. Moreover, the surface chemistry and the morphological and structural properties of foamed porous coppers of different pore sizes with and without Ti-Hf-V-Zr NEG films were systematically analyzed.
APA, Harvard, Vancouver, ISO, and other styles
7

Chang, Chao Cheng, and Teng Chiao Wang. "Effects of Grain Size on Micro Backward Extrusion of Copper." Advanced Materials Research 83-86 (December 2009): 1092–98. http://dx.doi.org/10.4028/www.scientific.net/amr.83-86.1092.

Full text
Abstract:
This study investigates the effects of grain size on the micro backward extrusion of copper cups. An equal channel angular extrusion (ECAE) technique was applied to refine the grain size in copper. Commercial available copper was annealed, deformed by six-pass ECAE at room temperature and then heat treated to obtain a microstructure with a grain size of about 4μm. Microstructure was examined and mechanical properties including hardness and stress-strain relationship were also investigated. The processed copper was then used in a micro backward extrusion of cups with the diameter of 3 mm and the wall thickness of 0.1 mm. The extruded cups were compared with those resulting from the coppers with larger grain size prepared by different heat treated processes. This study shows that the quality of the micro extruded cup increases as the grain size decreases. By using the refine-grained coppers for the micro backward extrusion, the cups with even rim height and uniform wall thickness can be easily produced.
APA, Harvard, Vancouver, ISO, and other styles
8

Ilca, Dacian, Tiberiu Manescu, Gilbert-Rainer Gillich, Zeno-Iosif Praisach, and Cristian Tufisi. "Determination of proper parameters for ultrasonic welding of copper plate with copper wire strands." Vibroengineering Procedia 51 (October 20, 2023): 167–72. http://dx.doi.org/10.21595/vp.2023.23680.

Full text
Abstract:
Ultrasonic welding parameters originally provided by the components supplier caused negative pull/peel tension results. In this paper, we present a method to find the optimal parameters for the ultrasonic welding of copper elements. These elements represent components inside an electrical harness from automotive industry: coper plate and copper wire strands. The design of experiments (DoE) was used as a method within the Six Sigma approach. We succeeded in obtaining welding parameters that ensure successfully passing the pull/peel tension test.
APA, Harvard, Vancouver, ISO, and other styles
9

Lee, Hyun-Ju, Chang-Wook Ji, Sung-Min Woo, Man-Ho Choi, Yoon-Hwae Hwang, Jae-Ho Lee, and Yang-Do Kim. "Formation of Copper Seed Layers and Copper Via Filling with Various Additives." Korean Journal of Materials Research 22, no. 7 (July 27, 2012): 335–41. http://dx.doi.org/10.3740/mrsk.2012.22.7.335.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Chen, Hao, Jin Hui Li, and Mi Song Chen. "Effect of Rare Earth on Microstructure and Property of Refining Impure-Copper." Advanced Materials Research 189-193 (February 2011): 3982–85. http://dx.doi.org/10.4028/www.scientific.net/amr.189-193.3982.

Full text
Abstract:
The self-prepared Cu-RE refining agents were used to refine impure-copper. The influences of RE elements on refinements and structures were studied and the mechanism of RE was discussed. The results show that by adding proper amounts of Cu-RE refining agents into impure-coppers, the refinements of RE on impure-coppers are perfect. Furthermore, the dendrites of the RE-refined ingot are refined and the structure becomes more homogeneous, leading that the electric conduction function and mechanics function of impure-copper have been improved.
APA, Harvard, Vancouver, ISO, and other styles
More sources

Dissertations / Theses on the topic "Copper"

1

Clark, Susan Ferguson. "Copper status in multiple trauma patients : measurement of copper balance, serum copper and ceruloplasmin /." This resource online, 1990. http://scholar.lib.vt.edu/theses/available/etd-09162005-115033/.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Graca, D. S. "Effects of copper depletion on subcellular hepatic copper and biliary copper excretion in cattle." Thesis, University of Aberdeen, 1985. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.370105.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Clark, Susan F. "Copper status in multiple trauma patients: measurement of copper balance, serum copper and ceruloplasmin." Diss., Virginia Tech, 1990. http://hdl.handle.net/10919/39376.

Full text
Abstract:
see document
Changes in copper metabolism have been reported in both thermal injury and skeletal trauma; data regarding copper status in multiple trauma patients (MTP) are nonexistent. Hypercatabolism following multiple trauma may increase copper utilization, deplete copper stores and compromise cuproenzyme synthesis and function. The purpose of this study was to provide information on copper status in MTP and determine whether age, injury severity, clinical outcome or nutritional intake influenced copper status. Twenty-four hour copper losses, serum copper and ceruloplasmin were measured in 11 MTP with Injury Severity Scores (ISS) >12 at 24-48 hours post admission. Collections of biological fluids (urine, nasogastric, chest tube, drains, stools) were analyzed for copper using atomic absorption spectrophotometry (AAS) and quantified over 5 days. Serial serum copper and ceruloplasmin were determined on days 1,3,5,10,15 and patient discharge by ASS and rate nephelometry inmunoprecipition, respectively. Eight patients received parenteral nutrition (PN). Three received intravenous glucose/electrolyte infusions (IV). urine (n=11) and nasogastric losses (n=8) were statistically greater than normal (p<.001). The mean ± SEM cumulative copper losses of urine, chest tube drainage, nasogastric secretions and other drains were 790 ± 116 (n=11), 833 ± 130 (n=7), 261 ± 46 (n+8), and 150 ± 58 μg/5 d (n=8), respectively. Urinary losses represented 10 to 12 times the normal copper excretion. Serum copper on day 1 and ceruloplasmin day 3 were significantly higher than normal (p<.025). Cumulative copper balance in the IV group was - 2266 μg and -440 μg in the PN group. No relationship was found between copper loss and ISS. Patients in their twenties demonstrated the greatest urinary copper loss. The physiological and biochemical effects of extensive copper loss in the MTP require further evaluation. These patients may have a predisposition to copper deficiency due to excessive copper losses and may require increased copper supplementation.
Ph. D.
APA, Harvard, Vancouver, ISO, and other styles
4

Reed, Stewart T. "Copper adsorption/desorption characteristics on copper amended soils." Diss., This resource online, 1993. http://scholar.lib.vt.edu/theses/available/etd-06062008-171512/.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Mao, Zhong. "Effects of copper-ligand and copper-copper interactions on excited state properties of luminescent copper (I) complexes : structural and photophysical studies /." View the Table of Contents & Abstract, 2003. http://sunzi.lib.hku.hk/hkuto/record/B26450859.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Mao, Zhong, and 毛中. "Effects of copper-ligand and copper-copper interactions on excited state properties of luminescent copper (I) complexes: structural and photophysical studies." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2003. http://hub.hku.hk/bib/B45015582.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Gremillion, Eric J. "Copper Kingdom." ScholarWorks@UNO, 2015. http://scholarworks.uno.edu/td/1973.

Full text
Abstract:
This paper thoroughly examines the production of the thesis film Copper Kingdom. From writing, directing, production design, editing, to cinematography, sound, and workflow, each aspect of the creation of Copper Kingdom is carefully detailed, with insights regarding the decisions made throughout the filmmaking process.
APA, Harvard, Vancouver, ISO, and other styles
8

Törndahl, Tobias. "Atomic Layer Deposition of Copper, Copper(I) Oxide and Copper(I) Nitride on Oxide Substrates." Doctoral thesis, Uppsala University, Department of Materials Chemistry, 2004. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-4651.

Full text
Abstract:

Thin films play an important role in science and technology today. By combining different materials, properties for specific applications can be optimised. In this thesis growth of copper, copper(I) oxide and copper(I) nitride on two different substrates, amorphous SiO2 and single crystalline α-Al2O3 by the so called Atomic Layer Deposition (ALD) techniques has been studied. This technique allows precise control of the growth process at monolayer level on solid substrates. Other characteristic features of ALD are that it produces films with excellent step coverage and good uniformity even as extremely thin films on complicated shaped substrates.

Alternative deposition schemes were developed for the materials of interest. It was demonstrated that use of intermediate water pulses affected the deposition pathways considerably. By adding water, the films are thought to grow via formation of an oxide over-layer instead of through a direct reaction between the precursors as in the case without water.

For growth of copper(I) nitride from Cu(hfac)2 and ammonia no film growth occurred without adding water to the growth process. The Cu3N films could be transformed into conducting copper films by post annealing. In copper growth from CuCl and H2 the water affected film growth on the alumina substrates considerably more than on the fused silica substrates. The existence of surface -OH and/or -NHx groups was often found to play an important role, according to both theoretical calculations and experimental results.

APA, Harvard, Vancouver, ISO, and other styles
9

Törndahl, Tobias. "Atomic layer deposition of copper, copper(I) oxide and copper(I) nitride on oxide substrates /." Uppsala : Acta Universitatis Upsaliensis : Univ.-bibl. [distributör], 2004. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-4651.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Fitzsimons, Nuala Patricia. "Copper hydride as a precursor for supported copper catalysts." Thesis, University of Cambridge, 1992. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.281998.

Full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Books on the topic "Copper"

1

R, Davis J., and ASM International. Handbook Committee., eds. Copper and copper alloys. Materials Park, OH: ASM International, 2001.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
2

Atkinson, R. L. Copper and copper mining. Princes Risborough: Shire, 1987.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
3

Johanson, Paula. Copper. New York: The Rosen Pub. Group, 2007.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
4

C, Dameron, Howe Paul, National Research Centre for Environmental Toxicology (Australia), WHO Task Group on Environmental Health Criteria for Copper., United Nations Environment Programme, International Labour Organisation, World Health Organization, Inter-Organization Programme for the Sound Management of Chemicals., and International Program on Chemical Safety., eds. Copper. Geneva: World Health Organization, 1998.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
5

United States. Agency for Toxic Substances and Disease Registry. Division of Toxicology. Copper. Atlanta, GA: Dept. of Health and Human Services, Public Health Service, Agency for Toxic Substances and Disease Registry, Division of Toxicology, 2004.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
6

Butler, L. J. Copper Empire. London: Palgrave Macmillan UK, 2007. http://dx.doi.org/10.1057/9780230589766.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Hohl, Joan. California copper. London: Silhouette Books, 1987.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
8

Hohl, Joan. California copper. Don Mills, Ont: Mira Books, 1995.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
9

Draper, Sharon M. Copper sun. New York, N.Y: Simon Pulse, 2008.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
10

Copper & copper alloys. Potters Bar: Copper Development Association, 1991.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Book chapters on the topic "Copper"

1

Sequeira, C. A. C. "Copper and Copper Alloys." In Uhlig's Corrosion Handbook, 757–85. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9780470872864.ch56.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Freudenberger, Jens, and Hans Warlimont. "Copper and Copper Alloys." In Springer Handbook of Materials Data, 297–305. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-69743-7_12.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Kundig, Konrad J. A., and John G. Cowie. "Copper and Copper Alloys." In Mechanical Engineers' Handbook, 117–220. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2006. http://dx.doi.org/10.1002/0471777447.ch4.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Castroviejo, Ricardo. "Copper(Cu/Native Copper)." In A Practical Guide to Ore Microscopy—Volume 1, 227–32. Cham: Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-12654-3_37.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Bährle-Rapp, Marina. "copper." In Springer Lexikon Kosmetik und Körperpflege, 128. Berlin, Heidelberg: Springer Berlin Heidelberg, 2007. http://dx.doi.org/10.1007/978-3-540-71095-0_2406.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Kurtz, Wolfgang, and Hans Vanecek. "Copper." In W Tungsten, 200–234. Berlin, Heidelberg: Springer Berlin Heidelberg, 1987. http://dx.doi.org/10.1007/978-3-662-08690-2_26.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Crowson, Philip. "Copper." In Mining in the Asia-Pacific, 217–36. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-61395-6_13.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Liu, Xingcheng, and Xiaolin Xiong. "Copper." In Encyclopedia of Earth Sciences Series, 1–3. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-39193-9_216-1.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Liu, Xingcheng, and Xiaolin Xiong. "Copper." In Encyclopedia of Earth Sciences Series, 303–5. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-39312-4_216.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Crowson, Phillip. "Copper." In Minerals Handbook 1992–93, 76–83. London: Palgrave Macmillan UK, 1992. http://dx.doi.org/10.1007/978-1-349-12564-7_12.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Copper"

1

Okamoto, S., K. Hashimoto, T. Sato, and K. Niwa. "Laser welding copper and copper alloys." In ICALEO® ‘89: Proceedings of the Materials Processing Conference. Laser Institute of America, 1989. http://dx.doi.org/10.2351/1.5058338.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Ang, X. F., A. T. Lin, J. Wei, Z. Chen, and C. C. Wong. "Low Temperature Copper-Copper Thermocompression Bonding." In 2008 10th Electronics Packaging Technology Conference (EPTC). IEEE, 2008. http://dx.doi.org/10.1109/eptc.2008.4763467.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Ryding, David G., Douglas Allen, and Richard H. Lee. "Brazing copper to dispersion-strengthened copper." In SPIE's 1996 International Symposium on Optical Science, Engineering, and Instrumentation, edited by Ali M. Khounsary. SPIE, 1996. http://dx.doi.org/10.1117/12.259829.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Kishida, S., Y. Takada, Z. Yinan, J. M. Song, and K. Yasuda. "Copper-Copper Ultrasonic Bonding by Using Blue Laser-Sintered Copper Nanoparticles." In 2022 International Conference on Electronics Packaging (ICEP). IEEE, 2022. http://dx.doi.org/10.23919/icep55381.2022.9795481.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Kim, Wooyoung, Seung Ho Han, Yongin Lee, Donggap Shin, Wonyoung Choi, Jiwon Moon, Kyeongbin Lim, BumKi Moon, and Minwoo Daniel Rhee. "Copper contamination control in Hybrid Copper Bonding." In 2023 International Conference on Electronics Packaging (ICEP). IEEE, 2023. http://dx.doi.org/10.23919/icep58572.2023.10129740.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Zeng, Xian, Yu Zhang, Chengqiang Cui, Kai Zhang, Xun Chen, Xin Chen, Jian Gao, Yunbo He, and Hui Tang. "Synthesis of copper nanoparticles using copper hydroxide." In 2018 19th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2018. http://dx.doi.org/10.1109/icept.2018.8480621.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Hu, Liangxing, Simon Chun Kiat Goh, Shaoteng Wu, and Chuan Seng Tan. "Sputtered Copper Nitride-Copper Nitride Direct Bonding." In 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2021. http://dx.doi.org/10.1109/ltb-3d53950.2021.9598450.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Dell'Erba, M., P. Sforza, G. Chita, and L. Cento. "New Problems Emerging From CO 2 Laser Material Processing: Copper To Copper And Copper To Non-Copper Welding." In 1986 Int'l European Conf on Optics, Optical Systems, and Applications, edited by Stefano Sottini and Silvana Trigari. SPIE, 1987. http://dx.doi.org/10.1117/12.937099.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Sakamoto, Hirokatsu, Tadashi Teranishi, Rumi Nagai, Ryo Itaya, and Akihiko Happoya. "Polymer Hybrid Bonding using Copper-Copper Bonding Materials and Thermosetting Resins for Copper-Copper Bonding at 200–250 °C." In 2024 International Conference on Electronics Packaging (ICEP). IEEE, 2024. http://dx.doi.org/10.23919/icep61562.2024.10535679.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Gondcharton, P., B. Imbert, L. Benaissa, and M. Verdier. "Copper-copper direct bonding: Impact of grain size." In 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM). IEEE, 2015. http://dx.doi.org/10.1109/iitc-mam.2015.7325657.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Reports on the topic "Copper"

1

Kirkham, R. V., and W. D. Sinclair. Vein copper. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/208010.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Dawson, K. M., and R. V. Kirkham. Skarn copper. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/208018.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Simon, N. J., E. S. Drexler, and R. P. Reed. Properties of copper and copper alloys at cryogenic temperatures. Gaithersburg, MD: National Institute of Standards and Technology, 1992. http://dx.doi.org/10.6028/nist.mono.177.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Kirkham, R. V. Volcanic redbed copper. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/207986.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Eckstrand, O. R. Nickel-copper sulphide. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/208042.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Blais, A. Copper Rand Mine. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1991. http://dx.doi.org/10.4095/132280.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Palmer, D. A., J. M. Simonson, and D. B. Joyce. Volatility of copper. Office of Scientific and Technical Information (OSTI), August 1996. http://dx.doi.org/10.2172/285269.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Zhao, L., P. E. Phelan, R. C. Niemann, and B. R. Weber. Thermal resistance across a copper/Kapton/copper interface at cryogenic temperatures. Office of Scientific and Technical Information (OSTI), September 1997. http://dx.doi.org/10.2172/554889.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Delaney, G. D. Investigations of sediment-hosted copper and copper-uranium mineralization, Wollaston Domain. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/205407.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Kidwell, David A. Measuring Copper in Seawater - An Automated Detection of Copper Binding Capacity. Fort Belvoir, VA: Defense Technical Information Center, December 2003. http://dx.doi.org/10.21236/ada419453.

Full text
APA, Harvard, Vancouver, ISO, and other styles
You might also be interested in the extended bibliographies on the topic 'Copper' for particular source types:
Journal articles Dissertations / Theses Books
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography