Relevant bibliographies by topics / Copper

Academic literature on the topic 'Copper'

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Published: 4 June 2021
Last updated: 30 July 2024

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Journal articles on the topic "Copper"

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Honkanen, Mari, Minnamari Vippola, and Toivo Lepistö. "Oxidation of copper alloys studied by analytical transmission electron microscopy cross-sectional specimens." Journal of Materials Research 23, no. 5 (May 2008): 1350–57. http://dx.doi.org/10.1557/jmr.2008.0160.

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In this work, the oxide structures of three polycrystalline copper grades, unalloyed oxygen-free (OF) copper and alloyed CuAg and deoxidized high-phosphor (DHP) copper, were studied using cross-sectional analytical transmission electron microscopy (AEM) samples. The oxidation treatments were carried out in air at 200 and 350 °C for different exposure times. The detailed oxide layer structures were characterized by AEM. At 200 °C, a nano-sized Cu2O layer formed on the all copper grades. At 350 °C, a nano-sized Cu2O layer formed first on the all copper grades. After longer exposure time at 350 °C, a crystalline CuO layer grew on the Cu2O layer of the unalloyed OF-copper. In the case of the alloyed CuAg- and DHP-copper, a crystalline and columnar shaped layer, consisting of Cu2O and CuO grains, formed on the nanocrystalline Cu2O layer. At 350 °C, the unalloyed copper oxidized notably slower than the alloyed coppers, and its oxide structures were different than those of the alloyed coppers.
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Xu, Xiaowei, Jing Hua, Houhu Zhang, Zehua Zhao, Yi Wang, Dapeng Zhang, Jun Zhang, and Xiaoxi Chen. "Environmental Risk Assessment of Recycled Products of Spent Coppery Etchant in Jiangsu Province, China." International Journal of Environmental Research and Public Health 18, no. 15 (July 26, 2021): 7881. http://dx.doi.org/10.3390/ijerph18157881.

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With the vigorous development of the 5G industry, the characteristic hazardous waste, spent coppery etchant, was also produced in large quantities. In recent years, there are many companies that have begun to collect spent coppery etchant for the purpose of producing recycled products, such as copper sulfate, copper oxide, basic copper chloride, and copper powder, which often contain large amounts of heavy metals. However, due to the lack of relevant standards and applicable regulatory measures, some of the recycled products flow to the feed processing industry and even to the food processing industry. This study investigated the pollution status of heavy metals in recycled products of spent coppery etchant and evaluated the impact of recycled products exposure on human health. The results showed that the content of Zn was the highest, which was 21 times higher than the corresponding standard limit. Human health risk assessment indicated that the hazard quotients of As account for 87.5% of the entire HI value, while the average carcinogenic risk values of As for copper sulfate, copper oxide, basic copper chloride, and copper powder are 1.09 × 10−5, 3.19 × 10−5, 1.29 × 10−5, 7.94 × 10−6, respectively. Meanwhile, suggestions on the supervision of recycled products and the concentration limits of heavy metals in recycled products were put forward.
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Lalancette, N., and K. A. McFarland. "Phytotoxicity of Copper-Based Bactericides to Peach and Nectarine." Plant Disease 91, no. 9 (September 2007): 1122–30. http://dx.doi.org/10.1094/pdis-91-9-1122.

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Organometallic copper, consisting of a mixture of copper abietate, copper linoleate, and copper oleate (CuALO), is important for postbloom management of bacterial spot in New Jersey peach and nectarine orchards. Rotation of CuALO with oxytetracycline reduces cost and helps prevent (or delay) resistant organisms. However, because copper is also phytotoxic, higher rates and inorganic coppers have not been utilized. A study was conducted on ‘Encore’ peach and ‘Redgold’ nectarine to determine the quantitative relationship between copper concentration (metallic equivalent) and phytotoxicity. Different rates of CuALO and copper hydroxide (CuOH) were applied seven times postbloom. Foliar injury and defoliation increased with number of applications and copper concentration. Maximum ‘Encore’ defoliation was 10 to 17%, while ‘Redgold’ sustained 30 to 35% leaf loss. CuOH caused similar or less leaf injury and defoliation than CuALO. No injury was observed on fruit, even at three times the labeled metallic copper rate of CuALO. Fruit size and soluble solids were not influenced by copper. Estimates of foliar density and tree volume indicated that sufficient photosynthetic capacity existed to allow acceptable leaf damage and loss from copper applications. These results showed that inorganic coppers may be viable alternatives to organometallic copper for postbloom bacterial spot control; nectarine may be more sensitive to copper injury than peach; and higher rates of metallic copper, above the current commercial rate, can be applied to peach. In the latter case, greater amounts of copper may provide longer residual activity and improved bacterial spot control on highly susceptible cultivars.
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Carrillo, F., J. Martínez, R. Barrios, and A. Roselló. "Kinetics of the conversion of copper sulfide to blister copper." Revista de Metalurgia 38, no. 5 (October 30, 2002): 334–38. http://dx.doi.org/10.3989/revmetalm.2002.v38.i5.416.

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Thiele, D. J., and D. H. Hamer. "Tandemly duplicated upstream control sequences mediate copper-induced transcription of the Saccharomyces cerevisiae copper-metallothionein gene." Molecular and Cellular Biology 6, no. 4 (April 1986): 1158–63. http://dx.doi.org/10.1128/mcb.6.4.1158-1163.1986.

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Transcription of the Saccharomyces cerevisiae copper-metallothionein gene, CUP1, inducible by copper. By analyzing deletion and fusion mutants in the CUP1 5'-flanking region, we identified two closely related, tandemly arranged copper regulatory elements. A synthetic version of one of these elements conferred efficient copper induction on a heterologous promoter when present in two tandem copies.
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Thiele, D. J., and D. H. Hamer. "Tandemly duplicated upstream control sequences mediate copper-induced transcription of the Saccharomyces cerevisiae copper-metallothionein gene." Molecular and Cellular Biology 6, no. 4 (April 1986): 1158–63. http://dx.doi.org/10.1128/mcb.6.4.1158.

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Transcription of the Saccharomyces cerevisiae copper-metallothionein gene, CUP1, inducible by copper. By analyzing deletion and fusion mutants in the CUP1 5'-flanking region, we identified two closely related, tandemly arranged copper regulatory elements. A synthetic version of one of these elements conferred efficient copper induction on a heterologous promoter when present in two tandem copies.
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Cooper, H. Kory, Garett Hunt, Nicholas Waber, and Carey Gray. "Precontact Native Copper Innovation in British Columbia." Canadian Journal of Archaeology 44, no. 2 (2020): 185–22. http://dx.doi.org/10.51270/44.2.185.

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Copper has figured prominently in discussions of social complexity among Northwest Coast Cultures. Coppers, shield-like sheets of copper variable in size, were a form of lineage wealth displayed, gifted, or ritually destroyed at potlatches; and copper artifacts have been recovered from human burials. The former use of copper is well-documented ethnographically and historically while the latter phenomenon is less well understood. This paper provides an overview of the occurrence of copper in precontact archaeological contexts in British Columbia using published and unpublished literature. Our investigation is framed within a Behavioral Archaeology approach that elicits ideas on copper innovation and all that it entailed. We find that copper is rare in precontact contexts from a province-wide perspective; there was likely more than one instance of native copper innovation; and contrary to previous suggestions, the copper-rich Dene region of south-central Alaska and southwestern Yukon cannot account for most of the precontact examples of copper use in the province. We offer some hypotheses to explain the precontact distribution of copper in BC, including both local invention and diffusion, not in an attempt to deliver the final verdict on this topic, but rather, to stimulate additional research.
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Cusick, Kathleen, Ane Iturbide, Pratima Gautam, Amelia Price, Shawn Polson, Madolyn MacDonald, and Ivan Erill. "Enhanced copper-resistance gene repertoire in Alteromonas macleodii strains isolated from copper-treated marine coatings." PLOS ONE 16, no. 9 (September 28, 2021): e0257800. http://dx.doi.org/10.1371/journal.pone.0257800.

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Copper is prevalent in coastal ecosystems due to its use as an algaecide and as an anti-fouling agent on ship hulls. Alteromonas spp. have previously been shown to be some of the early colonizers of copper-based anti-fouling paint but little is known about the mechanisms they use to overcome this initial copper challenge. The main models of copper resistance include the Escherichia coli chromosome-based Cue and Cus systems; the plasmid-based E. coli Pco system; and the plasmid-based Pseudomonas syringae Cop system. These were all elucidated from strains isolated from copper-rich environments of agricultural and/or enteric origin. In this work, copper resistance assays demonstrated the ability of Alteromonas macleodii strains CUKW and KCC02 to grow at levels lethal to other marine bacterial species. A custom database of Hidden Markov Models was designed based on proteins from the Cue, Cus, and Cop/Pco systems and used to identify potential copper resistance genes in CUKW and KCC02. Comparative genomic analyses with marine bacterial species and bacterial species isolated from copper-rich environments demonstrated that CUKW and KCC02 possess genetic elements of all systems, oftentimes with multiple copies, distributed throughout the chromosome and mega-plasmids. In particular, two copies of copA (the key player in cytoplasmic detoxification), each with its own apparent MerR-like transcriptional regulator, occur on a mega-plasmid, along with multiple copies of Pco homologs. Genes from both systems were induced upon exposure to elevated copper levels (100 μM– 3 mM). Genomic analysis identified one of the merR-copA clusters occurs on a genomic island (GI) within the plasmid, and comparative genomic analysis found that either of the merR-copA clusters, which also includes genes coding for a cupredoxin domain-containing protein and an isoprenylcysteine methyltransferase, occurs on a GI across diverse bacterial species. These genomic findings combined with the ability of CUKW and KCC02 to grow in copper-challenged conditions are couched within the context of the genome flexibility of the Alteromonas genus.
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Zhang, Jing, Jie Wang, Yong Gao, Yaocheng Hu, Yupeng Xie, Zhiming You, and Sheng Wang. "Influence of Film Coating Thickness on Secondary Electron Emission Characteristics of Non-Evaporable Getter Ti-Hf-V-Zr Coated Open-Cell Copper Foam Substrates." Materials 15, no. 6 (March 16, 2022): 2185. http://dx.doi.org/10.3390/ma15062185.

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The application of vacuum materials with low secondary electron yield (SEY) is one of the effective methods to mitigate the electron cloud (EC). In this study, the Ti-Hf-V-Zr non-evaporable getter (NEG) film was deposited on open-cell copper foams with different pore sizes for the suppression of electron multipacting effects. Besides, the influence of the film thickness on the secondary electron emission (SEE) characteristics of Ti-Hf-V-Zr NEG film-coated open-cell copper foam substrates was investigated for the first time. The results highlighted that all uncoated and NEG-coated foamed porous copper substrates achieved a low SEY (<1.2), which reduced at least 40% compared to the traditional copper plates, and the foamed porous coppers with 1.34-μm-thick NEG coating had the lowest SEY. Moreover, the surface chemistry and the morphological and structural properties of foamed porous coppers of different pore sizes with and without Ti-Hf-V-Zr NEG films were systematically analyzed.
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Chang, Chao Cheng, and Teng Chiao Wang. "Effects of Grain Size on Micro Backward Extrusion of Copper." Advanced Materials Research 83-86 (December 2009): 1092–98. http://dx.doi.org/10.4028/www.scientific.net/amr.83-86.1092.

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This study investigates the effects of grain size on the micro backward extrusion of copper cups. An equal channel angular extrusion (ECAE) technique was applied to refine the grain size in copper. Commercial available copper was annealed, deformed by six-pass ECAE at room temperature and then heat treated to obtain a microstructure with a grain size of about 4μm. Microstructure was examined and mechanical properties including hardness and stress-strain relationship were also investigated. The processed copper was then used in a micro backward extrusion of cups with the diameter of 3 mm and the wall thickness of 0.1 mm. The extruded cups were compared with those resulting from the coppers with larger grain size prepared by different heat treated processes. This study shows that the quality of the micro extruded cup increases as the grain size decreases. By using the refine-grained coppers for the micro backward extrusion, the cups with even rim height and uniform wall thickness can be easily produced.
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Dissertations / Theses on the topic "Copper"

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Clark, Susan Ferguson. "Copper status in multiple trauma patients : measurement of copper balance, serum copper and ceruloplasmin /." This resource online, 1990. http://scholar.lib.vt.edu/theses/available/etd-09162005-115033/.

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Graca, D. S. "Effects of copper depletion on subcellular hepatic copper and biliary copper excretion in cattle." Thesis, University of Aberdeen, 1985. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.370105.

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Clark, Susan F. "Copper status in multiple trauma patients: measurement of copper balance, serum copper and ceruloplasmin." Diss., Virginia Tech, 1990. http://hdl.handle.net/10919/39376.

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Changes in copper metabolism have been reported in both thermal injury and skeletal trauma; data regarding copper status in multiple trauma patients (MTP) are nonexistent. Hypercatabolism following multiple trauma may increase copper utilization, deplete copper stores and compromise cuproenzyme synthesis and function. The purpose of this study was to provide information on copper status in MTP and determine whether age, injury severity, clinical outcome or nutritional intake influenced copper status. Twenty-four hour copper losses, serum copper and ceruloplasmin were measured in 11 MTP with Injury Severity Scores (ISS) >12 at 24-48 hours post admission. Collections of biological fluids (urine, nasogastric, chest tube, drains, stools) were analyzed for copper using atomic absorption spectrophotometry (AAS) and quantified over 5 days. Serial serum copper and ceruloplasmin were determined on days 1,3,5,10,15 and patient discharge by ASS and rate nephelometry inmunoprecipition, respectively. Eight patients received parenteral nutrition (PN). Three received intravenous glucose/electrolyte infusions (IV). urine (n=11) and nasogastric losses (n=8) were statistically greater than normal (p<.001). The mean ± SEM cumulative copper losses of urine, chest tube drainage, nasogastric secretions and other drains were 790 ± 116 (n=11), 833 ± 130 (n=7), 261 ± 46 (n+8), and 150 ± 58 μg/5 d (n=8), respectively. Urinary losses represented 10 to 12 times the normal copper excretion. Serum copper on day 1 and ceruloplasmin day 3 were significantly higher than normal (p<.025). Cumulative copper balance in the IV group was - 2266 μg and -440 μg in the PN group. No relationship was found between copper loss and ISS. Patients in their twenties demonstrated the greatest urinary copper loss. The physiological and biochemical effects of extensive copper loss in the MTP require further evaluation. These patients may have a predisposition to copper deficiency due to excessive copper losses and may require increased copper supplementation.
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Reed, Stewart T. "Copper adsorption/desorption characteristics on copper amended soils." Diss., This resource online, 1993. http://scholar.lib.vt.edu/theses/available/etd-06062008-171512/.

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Mao, Zhong. "Effects of copper-ligand and copper-copper interactions on excited state properties of luminescent copper (I) complexes : structural and photophysical studies /." View the Table of Contents & Abstract, 2003. http://sunzi.lib.hku.hk/hkuto/record/B26450859.

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Mao, Zhong, and 毛中. "Effects of copper-ligand and copper-copper interactions on excited state properties of luminescent copper (I) complexes: structural and photophysical studies." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2003. http://hub.hku.hk/bib/B45015582.

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Gremillion, Eric J. "Copper Kingdom." ScholarWorks@UNO, 2015. http://scholarworks.uno.edu/td/1973.

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This paper thoroughly examines the production of the thesis film Copper Kingdom. From writing, directing, production design, editing, to cinematography, sound, and workflow, each aspect of the creation of Copper Kingdom is carefully detailed, with insights regarding the decisions made throughout the filmmaking process.
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Törndahl, Tobias. "Atomic Layer Deposition of Copper, Copper(I) Oxide and Copper(I) Nitride on Oxide Substrates." Doctoral thesis, Uppsala University, Department of Materials Chemistry, 2004. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-4651.

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Thin films play an important role in science and technology today. By combining different materials, properties for specific applications can be optimised. In this thesis growth of copper, copper(I) oxide and copper(I) nitride on two different substrates, amorphous SiO2 and single crystalline α-Al2O3 by the so called Atomic Layer Deposition (ALD) techniques has been studied. This technique allows precise control of the growth process at monolayer level on solid substrates. Other characteristic features of ALD are that it produces films with excellent step coverage and good uniformity even as extremely thin films on complicated shaped substrates.

Alternative deposition schemes were developed for the materials of interest. It was demonstrated that use of intermediate water pulses affected the deposition pathways considerably. By adding water, the films are thought to grow via formation of an oxide over-layer instead of through a direct reaction between the precursors as in the case without water.

For growth of copper(I) nitride from Cu(hfac)2 and ammonia no film growth occurred without adding water to the growth process. The Cu3N films could be transformed into conducting copper films by post annealing. In copper growth from CuCl and H2 the water affected film growth on the alumina substrates considerably more than on the fused silica substrates. The existence of surface -OH and/or -NHx groups was often found to play an important role, according to both theoretical calculations and experimental results.

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Törndahl, Tobias. "Atomic layer deposition of copper, copper(I) oxide and copper(I) nitride on oxide substrates /." Uppsala : Acta Universitatis Upsaliensis : Univ.-bibl. [distributör], 2004. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-4651.

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Fitzsimons, Nuala Patricia. "Copper hydride as a precursor for supported copper catalysts." Thesis, University of Cambridge, 1992. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.281998.

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Books on the topic "Copper"

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R, Davis J., and ASM International. Handbook Committee., eds. Copper and copper alloys. Materials Park, OH: ASM International, 2001.

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Atkinson, R. L. Copper and copper mining. Princes Risborough: Shire, 1987.

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Johanson, Paula. Copper. New York: The Rosen Pub. Group, 2007.

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C, Dameron, Howe Paul, National Research Centre for Environmental Toxicology (Australia), WHO Task Group on Environmental Health Criteria for Copper., United Nations Environment Programme, International Labour Organisation, World Health Organization, Inter-Organization Programme for the Sound Management of Chemicals., and International Program on Chemical Safety., eds. Copper. Geneva: World Health Organization, 1998.

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United States. Agency for Toxic Substances and Disease Registry. Division of Toxicology. Copper. Atlanta, GA: Dept. of Health and Human Services, Public Health Service, Agency for Toxic Substances and Disease Registry, Division of Toxicology, 2004.

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Butler, L. J. Copper Empire. London: Palgrave Macmillan UK, 2007. http://dx.doi.org/10.1057/9780230589766.

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Hohl, Joan. California copper. London: Silhouette Books, 1987.

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Hohl, Joan. California copper. Don Mills, Ont: Mira Books, 1995.

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Draper, Sharon M. Copper sun. New York, N.Y: Simon Pulse, 2008.

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Copper & copper alloys. Potters Bar: Copper Development Association, 1991.

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Book chapters on the topic "Copper"

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Sequeira, C. A. C. "Copper and Copper Alloys." In Uhlig's Corrosion Handbook, 757–85. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9780470872864.ch56.

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Freudenberger, Jens, and Hans Warlimont. "Copper and Copper Alloys." In Springer Handbook of Materials Data, 297–305. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-69743-7_12.

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Kundig, Konrad J. A., and John G. Cowie. "Copper and Copper Alloys." In Mechanical Engineers' Handbook, 117–220. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2006. http://dx.doi.org/10.1002/0471777447.ch4.

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Castroviejo, Ricardo. "Copper(Cu/Native Copper)." In A Practical Guide to Ore Microscopy—Volume 1, 227–32. Cham: Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-12654-3_37.

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Bährle-Rapp, Marina. "copper." In Springer Lexikon Kosmetik und Körperpflege, 128. Berlin, Heidelberg: Springer Berlin Heidelberg, 2007. http://dx.doi.org/10.1007/978-3-540-71095-0_2406.

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Kurtz, Wolfgang, and Hans Vanecek. "Copper." In W Tungsten, 200–234. Berlin, Heidelberg: Springer Berlin Heidelberg, 1987. http://dx.doi.org/10.1007/978-3-662-08690-2_26.

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Crowson, Philip. "Copper." In Mining in the Asia-Pacific, 217–36. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-61395-6_13.

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Liu, Xingcheng, and Xiaolin Xiong. "Copper." In Encyclopedia of Earth Sciences Series, 1–3. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-39193-9_216-1.

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Liu, Xingcheng, and Xiaolin Xiong. "Copper." In Encyclopedia of Earth Sciences Series, 303–5. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-39312-4_216.

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Crowson, Phillip. "Copper." In Minerals Handbook 1992–93, 76–83. London: Palgrave Macmillan UK, 1992. http://dx.doi.org/10.1007/978-1-349-12564-7_12.

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Conference papers on the topic "Copper"

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Okamoto, S., K. Hashimoto, T. Sato, and K. Niwa. "Laser welding copper and copper alloys." In ICALEO® ‘89: Proceedings of the Materials Processing Conference. Laser Institute of America, 1989. http://dx.doi.org/10.2351/1.5058338.

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Ang, X. F., A. T. Lin, J. Wei, Z. Chen, and C. C. Wong. "Low Temperature Copper-Copper Thermocompression Bonding." In 2008 10th Electronics Packaging Technology Conference (EPTC). IEEE, 2008. http://dx.doi.org/10.1109/eptc.2008.4763467.

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Ryding, David G., Douglas Allen, and Richard H. Lee. "Brazing copper to dispersion-strengthened copper." In SPIE's 1996 International Symposium on Optical Science, Engineering, and Instrumentation, edited by Ali M. Khounsary. SPIE, 1996. http://dx.doi.org/10.1117/12.259829.

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Kishida, S., Y. Takada, Z. Yinan, J. M. Song, and K. Yasuda. "Copper-Copper Ultrasonic Bonding by Using Blue Laser-Sintered Copper Nanoparticles." In 2022 International Conference on Electronics Packaging (ICEP). IEEE, 2022. http://dx.doi.org/10.23919/icep55381.2022.9795481.

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Kim, Wooyoung, Seung Ho Han, Yongin Lee, Donggap Shin, Wonyoung Choi, Jiwon Moon, Kyeongbin Lim, BumKi Moon, and Minwoo Daniel Rhee. "Copper contamination control in Hybrid Copper Bonding." In 2023 International Conference on Electronics Packaging (ICEP). IEEE, 2023. http://dx.doi.org/10.23919/icep58572.2023.10129740.

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Zeng, Xian, Yu Zhang, Chengqiang Cui, Kai Zhang, Xun Chen, Xin Chen, Jian Gao, Yunbo He, and Hui Tang. "Synthesis of copper nanoparticles using copper hydroxide." In 2018 19th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2018. http://dx.doi.org/10.1109/icept.2018.8480621.

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Hu, Liangxing, Simon Chun Kiat Goh, Shaoteng Wu, and Chuan Seng Tan. "Sputtered Copper Nitride-Copper Nitride Direct Bonding." In 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2021. http://dx.doi.org/10.1109/ltb-3d53950.2021.9598450.

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Dell'Erba, M., P. Sforza, G. Chita, and L. Cento. "New Problems Emerging From CO 2 Laser Material Processing: Copper To Copper And Copper To Non-Copper Welding." In 1986 Int'l European Conf on Optics, Optical Systems, and Applications, edited by Stefano Sottini and Silvana Trigari. SPIE, 1987. http://dx.doi.org/10.1117/12.937099.

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Sakamoto, Hirokatsu, Tadashi Teranishi, Rumi Nagai, Ryo Itaya, and Akihiko Happoya. "Polymer Hybrid Bonding using Copper-Copper Bonding Materials and Thermosetting Resins for Copper-Copper Bonding at 200–250 °C." In 2024 International Conference on Electronics Packaging (ICEP). IEEE, 2024. http://dx.doi.org/10.23919/icep61562.2024.10535679.

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Gondcharton, P., B. Imbert, L. Benaissa, and M. Verdier. "Copper-copper direct bonding: Impact of grain size." In 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM). IEEE, 2015. http://dx.doi.org/10.1109/iitc-mam.2015.7325657.

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Reports on the topic "Copper"

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Kirkham, R. V., and W. D. Sinclair. Vein copper. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/208010.

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Dawson, K. M., and R. V. Kirkham. Skarn copper. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/208018.

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Simon, N. J., E. S. Drexler, and R. P. Reed. Properties of copper and copper alloys at cryogenic temperatures. Gaithersburg, MD: National Institute of Standards and Technology, 1992. http://dx.doi.org/10.6028/nist.mono.177.

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4

Kirkham, R. V. Volcanic redbed copper. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/207986.

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Eckstrand, O. R. Nickel-copper sulphide. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/208042.

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Blais, A. Copper Rand Mine. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1991. http://dx.doi.org/10.4095/132280.

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Palmer, D. A., J. M. Simonson, and D. B. Joyce. Volatility of copper. Office of Scientific and Technical Information (OSTI), August 1996. http://dx.doi.org/10.2172/285269.

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Zhao, L., P. E. Phelan, R. C. Niemann, and B. R. Weber. Thermal resistance across a copper/Kapton/copper interface at cryogenic temperatures. Office of Scientific and Technical Information (OSTI), September 1997. http://dx.doi.org/10.2172/554889.

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Delaney, G. D. Investigations of sediment-hosted copper and copper-uranium mineralization, Wollaston Domain. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/205407.

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Kidwell, David A. Measuring Copper in Seawater - An Automated Detection of Copper Binding Capacity. Fort Belvoir, VA: Defense Technical Information Center, December 2003. http://dx.doi.org/10.21236/ada419453.

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