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Journal articles on the topic 'Cooling Devices'

Author: Grafiati

Published: 28 June 2021

Last updated: 1 February 2022

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1

Ijam, Ali, and R. Saidur. "Nanofluid as a coolant for electronic devices (cooling of electronic devices)." Applied Thermal Engineering 32 (January 2012): 76–82. http://dx.doi.org/10.1016/j.applthermaleng.2011.08.032.

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2

Posobkiewicz, Krzysztof, and Krzysztof Górecki. "Influence of Selected Factors on Thermal Parameters of the Components of Forced Cooling Systems of Electronic Devices." Electronics 10, no. 3 (February 1, 2021): 340. http://dx.doi.org/10.3390/electronics10030340.

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The paper presents some investigation results on the properties of forced cooling systems dedicated to electronic devices. Different structures of such systems, including Peltier modules, heat sinks, fans, and thermal interfaces, are considered. Compact thermal models of such systems are formulated. These models take into account a multipath heat transfer and make it possible to compute waveforms of the device’s internal temperature at selected values of the power dissipated in the device. The analytical formulas describing the dependences of the thermal resistance of electronic devices co-operating with the considered cooling systems on the power dissipated in the cooled electronic device and the power feeding the Peltier module and the speed of airflow caused by a fan are proposed. The correctness of the proposed models is verified experimentally in a wide range of powers dissipated in electronic devices operating in different configurations of the used cooling system.

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3

NAKAYAMA, Wataru. "Cooling of Electronic Devices." Journal of the Society of Mechanical Engineers 88, no. 802 (1985): 1048–53. http://dx.doi.org/10.1299/jsmemag.88.802_1048.

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4

Joshi, Yogendra. "Heat Out of Small Packages." Mechanical Engineering 123, no. 12 (December 1, 2001): 56–58. http://dx.doi.org/10.1115/1.2001-dec-5.

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Compact cooling devices are taking shape to deal with the next generation of computer chips. One of the research projects, conducted at the University of Maryland under initial sponsorship from several private companies and federal government laboratories, studied liquid cooling. In order to avoid the design complexities associated with direct liquid cooling, and to make the device of near-term applicability to systems designers, the research team at Maryland decided to use indirect liquid cooling. The university researchers focused on the use of two phase thermosyphons to meet these requirements. Researchers conceptualized a two-chamber, closed-loop device with an evaporator chamber at the chip and a condenser some distance away connected through tubing. The working fluid tested in laboratory experiments was the dielectric coolant PF 5060 made by 3M Co. The University of Maryland and Hewlett-Packard team selected two test beds to evaluate the performance and ease of integration of these devices within existing high-performance computing systems.

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5

Mertens, Robert G., Louis Chow, Kalpathy B. Sundaram, R. Brian Cregger, Daniel P. Rini, Louis Turek, and Benjamin A. Saarloos. "Spray Cooling of IGBT Devices." Journal of Electronic Packaging 129, no. 3 (May 18, 2007): 316–23. http://dx.doi.org/10.1115/1.2753937.

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The popularity and increased usage of insulated gate bipolar transistors (IGBTs) in power control systems have made the problem of cooling them a subject of considerable interest in recent years. In this investigation, a heat flux of 825W∕cm2 at the die was achieved when air-water spray cooling was used to cool IGBTs at high current levels. The junction temperature of the device was measured accurately through voltage-to-temperature characterization. Results from other cooling technologies and other spray cooling experiments were reviewed. A discussion of electrical power losses in IGBTs, due to switching and conduction, is included in this paper. Experiments were conducted on 19 IGBTs, using data collection and software control of the test set. Three types of cooling were explored in this investigation: single-phase convection with water, spray cooling with air-water and spray cooling with steam-water. The results of these experiments show clear advantages of air-water spray cooling IGBTs over other cooling technologies. The applications of spray cooling IGBTs are discussed in open (fixed) and closed (mobile) systems. Current and heat flux levels achieved during this investigation could not have been done using ordinary cooling methods. The techniques used in this investigation clearly demonstrate the superior cooling performance of air-water spray cooling over traditional cooling methods.

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6

Das, Anupam, Aarti Sarda, and Abhishek De. "Cooling devices in laser therapy." Journal of Cutaneous and Aesthetic Surgery 9, no. 4 (2016): 215. http://dx.doi.org/10.4103/0974-2077.197028.

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7

Lorenz, Susanne, Ulrich Hohenleutner, and Michael Landthaler. "Cooling Devices in Laser Therapy." Medical Laser Application 16, no. 4 (January 2001): 283–91. http://dx.doi.org/10.1078/1615-1615-00033.

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8

Zebarjadi, M. "Electronic cooling using thermoelectric devices." Applied Physics Letters 106, no. 20 (May 18, 2015): 203506. http://dx.doi.org/10.1063/1.4921457.

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9

Xu, Shanglong, Weijie Wang, Zongkun Guo, Xinglong Hu, and Wei Guo. "A multi-channel cooling system for multiple heat source." Thermal Science 20, no. 6 (2016): 1991–2000. http://dx.doi.org/10.2298/tsci140313123x.

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High-power electronic devices with multiple heating elements often require temperature uniformity and operating within their functional temperature range for optimal performance. A multi-channel cooling experiment apparatus is developed for studying heat removal inside an electronic device with multiple heat sources. It mainly consists of a computer-controlled pump, a multi-channel heat sink for multi-zone cooling and the apparatus for measuring the temperature and pressure drop. The experimental results show the system and the designed multi-channel heat sink structure can control temperature distribution of electronic device with multiple heat sources by altering coolant flow rate.

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10

Siricharoenpanich, A., S. Wiriyasart, A. Srichat, and P. Naphon. "Thermal cooling system with Ag/Fe3O4 nanofluids mixture as coolant for electronic devices cooling." Case Studies in Thermal Engineering 20 (August 2020): 100641. http://dx.doi.org/10.1016/j.csite.2020.100641.

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11

Duan, Junxi, Xiaoming Wang, Xinyuan Lai, Guohong Li, Kenji Watanabe, Takashi Taniguchi, Mona Zebarjadi, and Eva Y. Andrei. "High thermoelectricpower factor in graphene/hBN devices." Proceedings of the National Academy of Sciences 113, no. 50 (November 23, 2016): 14272–76. http://dx.doi.org/10.1073/pnas.1615913113.

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Fast and controllable cooling at nanoscales requires a combination of highly efficient passive cooling and active cooling. Although passive cooling in graphene-based devices is quite effective due to graphene’s extraordinary heat conduction, active cooling has not been considered feasible due to graphene’s low thermoelectric power factor. Here, we show that the thermoelectric performance of graphene can be significantly improved by using hexagonal boron nitride (hBN) substrates instead of SiO2. We find the room temperature efficiency of active cooling in the device, as gauged by the power factor times temperature, reaches values as high as 10.35 W⋅m−1⋅K−1, corresponding to more than doubling the highest reported room temperature bulk power factors, 5 W⋅m−1⋅K−1, in YbAl3, and quadrupling the best 2D power factor, 2.5 W⋅m−1⋅K−1, in MoS2. We further show that the Seebeck coefficient provides a direct measure of substrate-induced random potential fluctuations and that their significant reduction for hBN substrates enables fast gate-controlled switching of the Seebeck coefficient polarity for applications in integrated active cooling devices.

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12

Sokolovs, Alvis, and Ilya Galkin. "Matrix Converter Bi-directional Switch Power Loss and Cooling Condition Estimation for Integrated Drives." Scientific Journal of Riga Technical University. Power and Electrical Engineering 27, no. 1 (January 1, 2010): 138–41. http://dx.doi.org/10.2478/v10144-010-0036-9.

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Matrix Converter Bi-directional Switch Power Loss and Cooling Condition Estimation for Integrated DrivesIn this paper power loss estimation of bi-directional switch of matrix converter is done by means of calculation and experiments. For safe operation of power devices an efficient cooling system of specific device must be designed. This work is part of a greater project of integrated matrix converter AC drives and the cooling problem here is viewed in context of this task. It is necessary to develop a compact power board and cooling system to extract excessive heat from power devices.

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13

Dehra, Himanshu. "Cooling load and noise characterization modeling for photovoltaic driven building integrated thermoelectric cooling devices." E3S Web of Conferences 128 (2019): 01019. http://dx.doi.org/10.1051/e3sconf/201912801019.

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Photovoltaic driven thermoelectric cooling devices are investigated for installation in a modular outdoor test-room. Because of Peltier effect in a thermoelectric cooling (TEC), heating and cooling is achieved by applying a voltage difference across the thermoelectric module. Theoretical design modeling of cooling load and noise characterization of building integrated Thermoelectric (TEC) Devices is analyzed. System design of photovoltaic driven TEC devices is investigated with varying fresh outdoor ventilation rates. Building integrated design of TEC devices inside ceiling suspended duct along with TEC devices mounted on wall driven by rooftop and active façade photovoltaic devices is considered in the analysis. In this way, two-stage dehumidification is achieved by two different sets of TEC devices. The investigation is conducted for effect of voltage, air flow rate and height of fin heat transfer surface. Expressions along with results for noise characterization in photovoltaic driven building integrated TEC devices are also provided.

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14

Sukstanskii, A. L., and D. A. Yablonskiy. "Theoretical limits on brain cooling by external head cooling devices." European Journal of Applied Physiology 101, no. 1 (April 12, 2007): 41–49. http://dx.doi.org/10.1007/s00421-007-0452-5.

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15

Madyshev, Ilnur N., Oksana S. Dmitrieva, and Andrey V. Dmitriev. "Efficiency of cooling the water droplets within Jet-Film unit of cooling tower filler." MATEC Web of Conferences 224 (2018): 02079. http://dx.doi.org/10.1051/matecconf/201822402079.

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Researches of blocks of sprinklers of cooling towers with jet-film devices are presented. The conducted numerical studies allow us to estimate the influence of the design and operating parameters of the proposed contact device on the efficiency of the process of cooling the recycled water. The increase in the average gas velocity leads to a more intense flow of water drops and more efficient cooling. To achieve high performance, it is necessary to create zones of drip interaction of phases with droplet sizes up to 100 µm at relatively low speeds of two-phase gas-liquid flow. Under such conditions, the drop can be cooled by more than 10°C within one contact stage. The proposed sprinkler units with jet-film contact devices will be able to achieve a lower level of cooling water temperatures in the cooling towers of industrial enterprises at relatively low operating costs.

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16

Ismailov, T. A., D. V. Evdulov, A. G. Mustafaev, and D. K. Ramazanova. "DEVICES FOR COOLING ELECTRONIC CIRCUIT BOARDS." Herald of Dagestan State Technical University. Technical Sciences 35, no. 4 (January 1, 2014): 50–56. http://dx.doi.org/10.21822/2073-6185-2014-35-4-50-56.

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17

Perret, C., Y. Avenas, Ch Gillot, J. Boussey, and Ch Schaeffer. "Integrated cooling devices in silicon technology." European Physical Journal Applied Physics 18, no. 2 (May 2002): 115–23. http://dx.doi.org/10.1051/epjap:2002033.

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18

Qian, Bosen, and Fei Ren. "Cooling performance of transverse thermoelectric devices." International Journal of Heat and Mass Transfer 95 (April 2016): 787–94. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2015.12.027.

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19

Colangelo, G., E. Favale, M. Milanese, A. de Risi, and D. Laforgia. "Cooling of electronic devices: Nanofluids contribution." Applied Thermal Engineering 127 (December 2017): 421–35. http://dx.doi.org/10.1016/j.applthermaleng.2017.08.042.

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20

Cosman, M. D. "Devices for controlling cooling and warming." Cryobiology 25, no. 6 (December 1988): 552. http://dx.doi.org/10.1016/0011-2240(88)90423-3.

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21

Bradeško, Andraž, Lovro Fulanović, Marko Vrabelj, Aleksander Matavž, Mojca Otoničar, Jurij Koruza, Barbara Malič, and Tadej Rojac. "Multifunctional Cantilevers as Working Elements in Solid-State Cooling Devices." Actuators 10, no. 3 (March 12, 2021): 58. http://dx.doi.org/10.3390/act10030058.

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Despite the challenges of practical implementation, electrocaloric (EC) cooling remains a promising technology because of its good scalability and high efficiency. Here, we investigate the feasibility of an EC cooling device that couples the EC and electromechanical (EM) responses of a highly functionally, efficient, lead magnesium niobate ceramic material. We fabricated multifunctional cantilevers from this material and characterized their electrical, EM and EC properties. Two active cantilevers were stacked in a cascade structure, forming a proof-of-concept device, which was then analyzed in detail. The cooling effect was lower than the EC effect of the material itself, mainly due to the poor solid-to-solid heat transfer. However, we show that the use of ethylene glycol in the thermal contact area can significantly reduce the contact resistance, thereby improving the heat transfer. Although this solution is most likely impractical from the design point of view, the results clearly show that in this and similar cooling devices, a non-destructive, surface-modification method, with the same effectiveness as that of ethylene glycol, will have to be developed to reduce the thermal contact resistance. We hope this study will motivate the further development of multifunctional cooling devices.

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22

Yan, Zhibin, Mingliang Jin, Zhengguang Li, Guofu Zhou, and Lingling Shui. "Droplet-Based Microfluidic Thermal Management Methods for High Performance Electronic Devices." Micromachines 10, no. 2 (January 25, 2019): 89. http://dx.doi.org/10.3390/mi10020089.

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Advanced thermal management methods have been the key issues for the rapid development of the electronic industry following Moore’s law. Droplet-based microfluidic cooling technologies are considered as promising solutions to conquer the major challenges of high heat flux removal and nonuniform temperature distribution in confined spaces for high performance electronic devices. In this paper, we review the state-of-the-art droplet-based microfluidic cooling methods in the literature, including the basic theory of electrocapillarity, cooling applications of continuous electrowetting (CEW), electrowetting (EW) and electrowetting-on-dielectric (EWOD), and jumping droplet microfluidic liquid handling methods. The droplet-based microfluidic cooling methods have shown an attractive capability of microscale liquid manipulation and a relatively high heat flux removal for hot spots. Recommendations are made for further research to develop advanced liquid coolant materials and the optimization of system operation parameters.

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23

Yan, Qiufeng, Jiahan You, Wanting Sun, Ying Wang, Hongmei Wang, and Lei Zhang. "Advances in Piezoelectric Jet and Atomization Devices." Applied Sciences 11, no. 11 (May 31, 2021): 5093. http://dx.doi.org/10.3390/app11115093.

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In recent years, the piezoelectric jet and atomization devices have exhibited tremendous advantages including their simple construction, and the fact that they are discreet and portable as well as low cost. They have been widely used in cell printing, spray cooling, drug delivery, and other industry fields. First, in this paper, two different concepts of jet and atomization are defined, respectively. Secondly, based on these two concepts, the piezoelectric jet and atomization devices can be divided into two different categories: piezoelectric micro jet device and piezoelectric atomization device. According to the organizational structure, piezoelectric micro jet devices can be classified into four different models: bend mode, push mode, squeeze mode, and shear mode. In addition, their development history and structural characteristics are summarized, respectively. According to the location of applied energy, there are two kinds of piezoelectric atomization devices, i.e., the static mesh atomization device and the vibration mesh atomization device, and both their advantages and drawbacks are discussed. The research achievements are summarized in three aspects of cell printing, spray cooling, and drug delivery. Finally, the future development trends of piezoelectric jet and atomization devices are prospected and forecasted.

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24

Moon, Seung-Mi, Sook-Youn Kwon, and Jae-Hyun Lim. "Minimization of Temperature Ranges between the Top and Bottom of an Air Flow Controlling Device through Hybrid Control in a Plant Factory." Scientific World Journal 2014 (2014): 1–7. http://dx.doi.org/10.1155/2014/801590.

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To maintain the production timing, productivity, and product quality of plant factories, it is necessary to keep the growth environment uniform. A vertical multistage type of plant factory involves different levels of growing trays, which results in the problem of difference in temperature among vertically different locations. To address it, it is necessary to install air flow devices such as air flow fan and cooling/heating device at the proper locations in order to facilitate air circulation in the facility as well as develop a controlling technology for efficient operation. Accordingly, this study compares the temperature and air distribution within the space of a vertical multistage closed-type plant factory by controlling cooling/heating devices and air flow fans harmoniously by means of the specially designed testbed. The experiment results indicate that in the hybrid control of cooling and heating devices and air flow fans, the difference in temperature decreased by as much as 78.9% compared to that when only cooling and heating devices were operated; the air distribution was improved by as much as 63.4%.

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25

Incropera, F. P. "Convection Heat Transfer in Electronic Equipment Cooling." Journal of Heat Transfer 110, no. 4b (November 1, 1988): 1097–111. http://dx.doi.org/10.1115/1.3250613.

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To maintain the best possible thermal environment in electronic packages, the engineer must establish the most efficient path for heat transfer from the electronic devices to an external cooling agent. The path is typically subdivided into internal and external components, representing, respectively, heat transfer by conduction through different materials and interfaces separating the devices from the package surface and heat transfer by convection from the surface to the coolant. Depending on the scale and speed of the electronic circuits, as well as on constraints imposed by nonthermal considerations, the coolant may be a gas or a liquid and heat transfer may be by natural, forced, or mixed convection or, in the case of a liquid, by pool or forced convection boiling. In this paper a comprehensive review of convection cooling options is provided.

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26

Ding, Zemin, Susu Qiu, Lingen Chen, and Wenhua Wang. "Modeling and Performance Optimization of Double-Resonance Electronic Cooling Device with Three Electron Reservoirs." Journal of Non-Equilibrium Thermodynamics 46, no. 3 (April 22, 2021): 273–89. http://dx.doi.org/10.1515/jnet-2020-0105.

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Abstract In this paper, a new model of the three-electron reservoir energy selective electronic cooling device applying double-resonance energy filters is proposed by using finite time thermodynamics. The analytical formulas of the main performance parameters for the double-resonance three-electron reservoir cooling device are derived. The optimal cooling load and coefficient of performance of the cooling device varying with major structure design parameters are explored and the optimal operation regions are further determined. Moreover, detailed analyses are conducted to reveal the influences of center energy level difference, chemical potential difference, energy level width, energy spacing and the phonon transmission induced heat leakage on the optimal performance characteristics of the cooling device. Finally, a performance comparison is made between the double-resonance and single-resonance three-electron reservoir electronic cooling devices. It is shown that through reasonable structure design, the optimal performance characteristics of the double-resonance device can be controlled to be much higher than those of the single-resonance cooling device.

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27

Vestergaard, J. B. "Test method for evaluation of anti-scale devices for cooling condensers." Water Science and Technology 49, no. 2 (January 1, 2004): 161–68. http://dx.doi.org/10.2166/wst.2004.0114.

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Can new types of anti-scaling devices prevent scaling on condensing pipes in industrial cooling condensers and supersede conventional water treatment? To examine this question a test method has been developed, test rigs have been built and different kinds of anti-scale devices have been tested. As cooling towers are based on an open-air system with evaporation of water they will have higher demands on the effectiveness of the anti-scale devices compared to the closed systems which are typical drinking water systems in buildings. The test method is based on an open-air system. The rigs are mobile and can be used to give an indication of whether it is possible to treat the local water with an anti-scale device. The result of the test is a scaling rate and a germination time. In addition to these tests the anti-scale devices have been tested in the field at cooling condensers.

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28

Lim, Taesub, Woong Seog Yim, and Daeung Danny Kim. "Evaluation of Daylight and Cooling Performance of Shading Devices in Residential Buildings in South Korea." Energies 13, no. 18 (September 11, 2020): 4749. http://dx.doi.org/10.3390/en13184749.

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Accounting for more than half of buildings in South Korea, the energy consumed by residential buildings has become a main concern and the cooing demand has rapidly increased. To reduce energy consumption, several passive and active design strategies have generally been applied. However, there has been an increasing demand for high window-to-wall ratios in residential buildings, it is imperative to block sunlight into a building effectively. Focusing on the reduction of cooling energy consumption in a residential building, the present study assessed the daylight and energy performance of shading devices. Among various types of shading devices, the Venetian blind, horizontal louver, light shelf, and egg-crate were selected. The illuminance levels in three different areas in a building were measured. In addition, the annual cooling energy consumption by these shading devices was investigated. As a result, both daylight and energy performance varied with different design options of these shading devices. Because of the slight performance difference among shading devices, the artificial loads of two best shading devices were compared. In sum, the egg-crate shading was the most proper shading device to block sunlight as well as reduce the cooling energy consumption effectively.

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29

Li, Deyu, Scott T. Huxtable, Alexis R. Abramson, and Arun Majumdar. "Thermal Transport in Nanostructured Solid-State Cooling Devices." Journal of Heat Transfer 127, no. 1 (January 1, 2005): 108–14. http://dx.doi.org/10.1115/1.1839588.

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Low-dimensional nanostructured materials are promising candidates for high efficiency solid-state cooling devices based on the Peltier effect. Thermal transport in these low-dimensional materials is a key factor for device performance since the thermoelectric figure of merit is inversely proportional to thermal conductivity. Therefore, understanding thermal transport in nanostructured materials is crucial for engineering high performance devices. Thermal transport in semiconductors is dominated by lattice vibrations called phonons, and phonon transport is often markedly different in nanostructures than it is in bulk materials for a number of reasons. First, as the size of a structure decreases, its surface area to volume ratio increases, thereby increasing the importance of boundaries and interfaces. Additionally, at the nanoscale the characteristic length of the structure approaches the phonon wavelength, and other interesting phenomena such as dispersion relation modification and quantum confinement may arise and further alter the thermal transport. In this paper we discuss phonon transport in semiconductor superlattices and nanowires with regards to applications in solid-state cooling devices. Systematic studies on periodic multilayers called superlattices disclose the relative importance of acoustic impedance mismatch, alloy scattering, and crystalline imperfections at the interfaces. Thermal conductivity measurements of mono-crystalline silicon nanowires of different diameters reveal the strong effects of phonon-boundary scattering. Experimental results for Si/SiGe superlattice nanowires indicate that different phonon scattering mechanisms may disrupt phonon transport at different frequencies. These experimental studies provide insight regarding the dominant mechanisms for phonon transport in nanostructures. Finally, we also briefly discuss Peltier coolers made from nanostructured materials that have shown promising cooling performance.

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30

Dragomirov, Sergei, Pavel Eydel, Anton Gamayunov, Michael Dragomirov, and Ivan Kuleshov. "ANALYSIS OF THE CURRENT LEVEL OF TECHNOLOGY COOLANT FILTRATION AUTOTRANSPORT ENGINES." National Association of Scientists 1, no. 30(57) (August 10, 2020): 26–31. http://dx.doi.org/10.31618/nas.2413-5291.2020.1.57.254.

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The article deals with modern technologies and means of filtering the cooling liquid of autotransport engines. A comparative analysis of the devices used is given. Their performance characteristics are given. Promising approaches to cleaning the coolant are described. The conclusion is made about the wide prospects of hydrocyclone devices for effective cleaning of the coolant of autotransport engines.

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31

Bin, Sun, and Yan Zhou. "The Contrastive Analysis of Several Radiation Cooling Terminal Devices." Applied Mechanics and Materials 229-231 (November 2012): 400–405. http://dx.doi.org/10.4028/www.scientific.net/amm.229-231.400.

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From three ways of the temperature gradient, the change rate of indoor temperature and heat flux, contrast analysis the cooling effect of three cooling devices on the capillary tube, cooling ceiling and radiant floor, the conclusions could be obtained. The average of vertical temperature gradient in simulated room is equal to 1°C/m, which meets the requirements of human thermal comfort. When the temperature in simulation room falls from 30°C to 26°C, the temperature drop velocity for cooling ceiling is the fastest. The heat flux of the cooling ceiling is maximum, the second one for the capillary tube, and the least one for the radiant floor. Thus, the cooling effect of cooling ceiling is the best.

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32

Kazakov, Alexey. "NUMERICAL SIMULATION OF COOLING SYSTEMS ELECTRONIC DEVICES." Bulletin of Perm National Research Polytechnic University. Electrotechnics, informational technologies, control systems, no. 2 (August 13, 2020): 128–44. http://dx.doi.org/10.15593/2224-9397/2020.2.08.

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33

Sajid, Muhammad, Ibrahim Hassan, and Aziz Rahman. "An overview of cooling of thermoelectric devices." Renewable and Sustainable Energy Reviews 78 (October 2017): 15–22. http://dx.doi.org/10.1016/j.rser.2017.04.098.

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34

Abramzon, Boris. "Numerical Optimization of the Thermoelectric Cooling Devices." Journal of Electronic Packaging 129, no. 3 (November 5, 2006): 339–47. http://dx.doi.org/10.1115/1.2753959.

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The present study proposes a unified numerical approach to the problem of optimum design of the thermoelectric devices for cooling electronic components. The standard mathematical model of a single-stage thermoelectric cooler (TEC) with constant material properties is employed. The model takes into account the thermal resistances from the hot and cold sides of the TEC. Values of the main physical parameters governing the TEC performance (Seebeck coefficient, electrical resistance, and thermal conductance) are derived from the manufacturer catalog data on the maximum achievable temperature difference, and the corresponding electric current and voltage. The optimization approach is illustrated with several examples for different design objective functions, variables, and constraints. The objective for the optimization search is the maximization of the total cooling rate or the performance coefficient of the cooling device. The independent variables for the optimization search are as follows: The number of the thermoelectric modules, the electric current, and the cold side temperature of the TEC. Additional independent variables in other cases include the number of thermoelectric couples and the area-to-height ratio of the thermoelectric pellet. In the present study, the optimization problems are solved numerically using the so-called multistart adaptive random search method.

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35

Konstantinov, S. G., V. V. Parkhomchuk, and V. B. Reva. "Space charge oscillation in electron cooling devices." Technical Physics 48, no. 1 (January 2003): 85–89. http://dx.doi.org/10.1134/1.1538733.

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36

Wietrzak, A., and D. Poulikakos. "Turbulent forced convective cooling of microelectronic devices." International Journal of Heat and Fluid Flow 11, no. 2 (June 1990): 105–13. http://dx.doi.org/10.1016/0142-727x(90)90003-t.

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37

Dulnev, G. N., V. A. Korablyev, and A. V. Sharkov. "Evaporation cooling of high power electronic devices." IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A 19, no. 3 (1996): 431–34. http://dx.doi.org/10.1109/95.536845.

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38

Chang, Yu-Wei, Chih-Chung Chang, Ming-Tsun Ke, and Sih-Li Chen. "Thermoelectric air-cooling module for electronic devices." Applied Thermal Engineering 29, no. 13 (September 2009): 2731–37. http://dx.doi.org/10.1016/j.applthermaleng.2009.01.004.

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39

Possamai, F. C., I. Setter, and L. L. Vasiliev. "Miniature heat pipes as compressor cooling devices." Applied Thermal Engineering 29, no. 14-15 (October 2009): 3218–23. http://dx.doi.org/10.1016/j.applthermaleng.2009.04.030.

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Chen, Ruirui, and Fei Fred Wang. "SiC and GaN Devices With Cryogenic Cooling." IEEE Open Journal of Power Electronics 2 (2021): 315–26. http://dx.doi.org/10.1109/ojpel.2021.3075061.

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Absadikov, B. A. "Research of the air-water-vapor cooling process in air cooling devices." ACADEMICIA: An International Multidisciplinary Research Journal 10, no. 6 (2020): 1344. http://dx.doi.org/10.5958/2249-7137.2020.00569.8.

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UCHIYAMA, Joji, Kimihiko NAKANO, Takashi SAITO, Masami FUJII, Nobuhiro TANAKA, Hirochika IMOTO, Hirosuke FUJISAWA, and Michiyasu SUZUKI. "Analysis on Cooling Performance of Focal Cortical Cooling Devices Using Thermoelectric Chip." Transactions of the Japan Society of Mechanical Engineers Series B 73, no. 735 (2007): 2331–36. http://dx.doi.org/10.1299/kikaib.73.2331.

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Absadikov, B. A., and Sh K. Agzamov. "Study of Air and Water Evaporative Cooling Process in Air Cooling Devices." Oil and Gas Technologies 128, no. 3 (2020): 61–64. http://dx.doi.org/10.32935/1815-2600-2020-128-3-61-64.

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Shen, Weijan, and Fock-Lai Tan. "Thermal management of mobile devices." Thermal Science 14, no. 1 (2010): 115–24. http://dx.doi.org/10.2298/tsci1001115s.

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This paper presents the experimental study of using phase change material in the cooling of the mobile devices. It investigates the thermal performance of transient charging and discharging of mobile devices in three different situations; making phone calls frequently, making long duration calls, and making occasional calls. The results show that mobile devices are heated up fastest during the long duration usage. Experiments are also conducted to determine the effect of fins and effect of orientation of the mobile device on its thermal performance.

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Rosul, Md Golam, Doeon Lee, David H. Olson, Naiming Liu, Xiaoming Wang, Patrick E. Hopkins, Kyusang Lee, and Mona Zebarjadi. "Thermionic transport across gold-graphene-WSe2 van der Waals heterostructures." Science Advances 5, no. 11 (November 2019): eaax7827. http://dx.doi.org/10.1126/sciadv.aax7827.

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Solid-state thermionic devices based on van der Waals structures were proposed for nanoscale thermal to electrical energy conversion and integrated electronic cooling applications. We study thermionic cooling across gold-graphene-WSe2-graphene-gold structures computationally and experimentally. Graphene and WSe2 layers were stacked, followed by deposition of gold contacts. The I-V curve of the structure suggests near-ohmic contact. A hybrid technique that combines thermoreflectance and cooling curve measurements is used to extract the device ZT. The measured Seebeck coefficient, thermal and electrical conductance, and ZT values at room temperatures are in agreement with the theoretical predictions using first-principles calculations combined with real-space Green’s function formalism. This work lays the foundation for development of efficient thermionic devices.

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Baisheva, L. M., P. P. Permyakov, and A. M. Bolshakov. "Heat and Mass Transfer of a Coolant in Horizontal Seasonal Cooling Devices." IOP Conference Series: Materials Science and Engineering 753 (March 7, 2020): 042092. http://dx.doi.org/10.1088/1757-899x/753/4/042092.

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Vlček, Petr, and Marian Formánek. "Optimization of Lubricant Return in Refrigeration Systems." Advanced Materials Research 1041 (October 2014): 35–38. http://dx.doi.org/10.4028/www.scientific.net/amr.1041.35.

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Oil is necessary for most of the heat pumps, cooling and freezing equipment, for proper operation of the compressor and other moving parts. Speed of the refrigerant vapor in the critical section, which is suction piping, is strongly dependent on the evaporating temperature, but also on the actual device performance. Well-designed piping is essential to the proper function of the cooling devices or heat pumps and affects the efficiency of the device. The aim of this paper is to describe problems of returning of oil in refrigerant devices and investigate the exact solution of design of refrigerant speed for carrying the lubricating oil in all segments of refrigerant pipes. Paper is based on facts obtained during developing of new refrigeration equipment. The resulting proposal of the device was numerically verified.

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Bognár, György, Gábor Takács, Péter G. Szabó, Gábor Rózsás, László Pohl, and Balázs Plesz. "Integrated Thermal Management in System-on-Package Devices." Periodica Polytechnica Electrical Engineering and Computer Science 64, no. 2 (December 18, 2019): 200–210. http://dx.doi.org/10.3311/ppee.14986.

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Thanks to the System-on-Package technology (SoP) the integration of different elements into a single package was enabled. However, from the thermal point of view the heat removal path in modern packaging technologies (FCBGA) goes through several layers of thermal interface material (TIM) that together with the package material create a relatively high thermal resistance which may lead to elevated chip temperature which causes functional error or other malfunctions. In our concept, we overcome this problem by creating integrated microfluidic channel based heat sink structures that can be used for cooling the high heat dissipation semiconductor devices (e.g.: processors, high power transistor or concentrated solar cells). These microchannel cooling assemblies can be integrated into the backside of the substrate of the semiconductor devices or into the system assemblies in SoP technology. In addition to the realization of the novel CMOS compatible microscale cooling device we have developed precise and valid measurement methodology, simulation cases studies and a unique compact model that can be added to numerical simulators as an external node. In this paper the achievements of a larger research are summarized as it required the cooperation of several experts in their fields to fulfil the goal of creating a state-of-the-art demonstrator. Thanks to the System-on-Package technology (SoP) the integration of different elements into a single package was enabled. However, from the thermal point of view the heat removal path in modern packaging technologies (FCBGA) goes through several layers of thermal interface material (TIM) that together with the package material create a relatively high thermal resistance which may lead to elevated chip temperature which causes functional error or other malfunctions. In our concept, we overcome this problem by creating integrated microfluidic channel based heat sink structures that can be used for cooling the high heat dissipation semiconductor devices (e.g.: processors, high power transistor or concentrated solar cells). These microchannel cooling assemblies can be integrated into the backside of the substrate of the semiconductor devices or into the system assemblies in SoP technology. In addition to the realization of the novel CMOS compatible microscale cooling device we have developed precise and valid measurement methodology, simulation cases studies and a unique compact model that can be added to numerical simulators as an external node. In this paper the achievements of a larger research are summarized as it required the cooperation of several experts in their fields to fulfil the goal of creating a state-of-the-art demonstrator.

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Kohri, Hitoshi, and Ichiro Shiota. "Development of Thermoelectric Cooling Devices with Graded Structure." Materials Science Forum 492-493 (August 2005): 151–56. http://dx.doi.org/10.4028/www.scientific.net/msf.492-493.151.

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Every thermoelectric material shows high performance at a specific narrow temperature range. The temperature range with high performance can be expanded by joining the materials with different peak temperature. This is the concept of a functionally graded material (FGM) for thermoelectric materials. Bismuth telluride is the best material for cooling devices at around room temperature. Then we investigated the thermoelectric cooling properties for bismuth telluride with two step graded structure. FGM samples were fabricated by three methods. The first FGM was synthesized by in situ method. The second one was fabricated by joining in a hot-press equipment. The last one was composed by joining with solder. Thermoelectric cooling properties were evaluated by observing the maximum temperature drop to electric current when the high temperature side was kept constant. The large temperature difference was obtained when the proper configuration of thermoelectric materials along the temperature gradient were performed. The coincidence of optimum electrical currents of composing materials is also essential to obtain the high cooling performance.

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Münsterjohann, Sven, Jens Grabinger, Stefan Becker, and Manfred Kaltenbacher. "CAA of an Air-Cooling System for Electronic Devices." Advances in Acoustics and Vibration 2016 (October 20, 2016): 1–17. http://dx.doi.org/10.1155/2016/4785389.

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This paper presents the workflow and the results of fluid dynamics and aeroacoustic simulations for an air-cooling system as used in electronic devices. The setup represents a generic electronic device with several electronic assemblies with forced convection cooling by two axial fans. The aeroacoustic performance is computed using a hybrid method. In a first step, two unsteady CFD simulations using the Unsteady Reynolds-Averaged Navier-Stokes simulation with Shear Stress Transport (URANS-SST) turbulence model and the Scale Adaptive Simulation with Shear Stress Transport (SAS-SST) models were performed. Based on the unsteady flow results, the acoustic source terms were calculated using Lighthill’s acoustic analogy. Propagation of the flow-induced sound was computed using the Finite Element Method. Finally, the results of the acoustic simulation are compared with measurements and show good agreement.

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