Journal articles on the topic 'Compact thermal modeling'
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Wei Huang, M. R. Stan, and K. Skadron. "Parameterized physical compact thermal modeling." IEEE Transactions on Components and Packaging Technologies 28, no. 4 (December 2005): 615–22. http://dx.doi.org/10.1109/tcapt.2005.859737.
Full textLasance, C. "Special section on compact thermal modeling." IEEE Transactions on Components and Packaging Technologies 26, no. 1 (March 2003): 134–35. http://dx.doi.org/10.1109/tcapt.2003.814000.
Full textCodecasa, L., D. D'Amore, and P. Maffezzoni. "Compact Thermal Networks for Modeling Packages." IEEE Transactions on Components and Packaging Technologies 27, no. 1 (March 2004): 96–103. http://dx.doi.org/10.1109/tcapt.2004.825796.
Full textNarasimhan, S., A. Bar-Cohen, and R. Nair. "Thermal compact modeling of parallel plate heat sinks." IEEE Transactions on Components and Packaging Technologies 26, no. 1 (March 2003): 136–46. http://dx.doi.org/10.1109/tcapt.2003.811860.
Full textJanicki, Marcin, Przemysław Ptak, Tomasz Torzewicz, and Krzysztof Górecki. "Compact Thermal Modeling of Modules Containing Multiple Power LEDs." Energies 13, no. 12 (June 17, 2020): 3130. http://dx.doi.org/10.3390/en13123130.
Full textChen, Ming, Yan Ting Yu, Bo Wang, and Yong Tang. "Test of IGBT Transient Thermal Impedance and Modeling Research on Thermal Model." Advanced Materials Research 148-149 (October 2010): 429–33. http://dx.doi.org/10.4028/www.scientific.net/amr.148-149.429.
Full textCodecasa, Lorenzo, Vincenzo d’Alessandro, Alessandro Magnani, Niccolò Rinaldi, Andre G. Metzger, Robin Bornoff, and John Parry. "Partition-based approach to parametric dynamic compact thermal modeling." Microelectronics Reliability 79 (December 2017): 361–70. http://dx.doi.org/10.1016/j.microrel.2017.06.059.
Full textKOYAMADA, Koji, Yasuharu YAMADA, Toshihiko NISHIO, and Hidetoshi KOTERA. "Compact Modeling Approach using GA for Accurate Thermal Simulation." Transactions of the Japan Society of Mechanical Engineers Series B 65, no. 632 (1999): 1370–76. http://dx.doi.org/10.1299/kikaib.65.1370.
Full textJanicki, Marcin, Przemyslaw Ptak, Tomasz Torzewicz, and Krzysztof Gorecki. "Compact Thermal Modeling of Color LEDs—A Comparative Study." IEEE Transactions on Electron Devices 67, no. 8 (August 2020): 3186–90. http://dx.doi.org/10.1109/ted.2020.2998459.
Full textBartholomeusz, Brian J. "Thermal modeling studies of organic compact disk-writable media." Applied Optics 31, no. 7 (March 1, 1992): 909. http://dx.doi.org/10.1364/ao.31.000909.
Full textKOYAMADA, Koji, Masanori KUZUNO, and Toshihiko NISHIO. "Compact Modeling for Thermal Simulation Using Response Surface Methodology." Proceedings of OPTIS 2000.4 (2000): 187–92. http://dx.doi.org/10.1299/jsmeoptis.2000.4.187.
Full textRoy, A. S., and C. C. Enz. "Compact Modeling of Thermal Noise in the MOS Transistor." IEEE Transactions on Electron Devices 52, no. 4 (April 2005): 611–14. http://dx.doi.org/10.1109/ted.2005.844735.
Full textKaija, Kimmo, Pekka Heino, and Eero O. Ristolainen. "Modeling Thermal Behavior of System-in-Package with Dynamic Compact Model." Journal of Microelectronics and Electronic Packaging 2, no. 1 (January 1, 2005): 64–71. http://dx.doi.org/10.4071/1551-4897-2.1.64.
Full textWang, Y., H. Cai, L. A. B. Naviner, Y. Zhang, J. O. Klein, and W. S. Zhao. "Compact thermal modeling of spin transfer torque magnetic tunnel junction." Microelectronics Reliability 55, no. 9-10 (August 2015): 1649–53. http://dx.doi.org/10.1016/j.microrel.2015.06.029.
Full textKoyamada, Koji, Yasuharu Yamada, Toshihiko Nishio, and Hidetoshi Kotera. "Compact modeling approach using genetic algorithms for accurate thermal simulation." Heat Transfer?Asian Research 30, no. 1 (2000): 28–39. http://dx.doi.org/10.1002/1523-1496(200101)30:1<28::aid-htj4>3.0.co;2-3.
Full textWalter, Frederick M., and Jose A. Pons. "Modeling the Atmosphere of RX J1856.5−3754." Symposium - International Astronomical Union 218 (2004): 279–82. http://dx.doi.org/10.1017/s0074180900181173.
Full textAlexeev, A., G. Martin, and G. Onushkin. "Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs." Microelectronics Reliability 87 (August 2018): 89–96. http://dx.doi.org/10.1016/j.microrel.2018.05.014.
Full textLiu, Zao, Sheldon X. D. Tan, Hai Wang, Yingbo Hua, and Ashish Gupta. "Compact thermal modeling for packaged microprocessor design with practical power maps." Integration 47, no. 1 (January 2014): 71–85. http://dx.doi.org/10.1016/j.vlsi.2013.07.003.
Full textWei Huang, S. Ghosh, S. Velusamy, K. Sankaranarayanan, K. Skadron, and M. R. Stan. "HotSpot: a compact thermal modeling methodology for early-stage VLSI design." IEEE Transactions on Very Large Scale Integration (VLSI) Systems 14, no. 5 (May 2006): 501–13. http://dx.doi.org/10.1109/tvlsi.2006.876103.
Full textMelczarsky, I., J. A. Lonac, F. Filicori, and A. Santarelli. "Compact Empirical Modeling of Nonlinear Dynamic Thermal Effects in Electron Devices." IEEE Transactions on Microwave Theory and Techniques 56, no. 9 (September 2008): 2017–24. http://dx.doi.org/10.1109/tmtt.2008.2001956.
Full textLasance, C. J. M. "Two benchmarks to facilitate the study of compact thermal modeling phenomena." IEEE Transactions on Components and Packaging Technologies 24, no. 4 (2001): 559–65. http://dx.doi.org/10.1109/6144.974943.
Full textChen, Ming, An Hu, Yong Tang, and Bo Wang. "SABER-Based Simulation for Compact Dynamic Electro-Thermal Modeling Analysis of Power Electronic Devices." Advanced Materials Research 291-294 (July 2011): 1704–8. http://dx.doi.org/10.4028/www.scientific.net/amr.291-294.1704.
Full textDing, Feilong, Baokang Peng, Xi Li, Lining Zhang, Runsheng Wang, Zhitang Song, and Ru Huang. "A review of compact modeling for phase change memory." Journal of Semiconductors 43, no. 2 (February 1, 2022): 023101. http://dx.doi.org/10.1088/1674-4926/43/2/023101.
Full textMerrikh, Ali Akbar. "Compact thermal modeling methodology for predicting skin temperature of passively cooled devices." Applied Thermal Engineering 85 (June 2015): 287–96. http://dx.doi.org/10.1016/j.applthermaleng.2015.04.007.
Full textGórecki, Paweł. "Compact Thermal Modeling of Power Semiconductor Devices with the Influence of Atmospheric Pressure." Energies 15, no. 10 (May 12, 2022): 3565. http://dx.doi.org/10.3390/en15103565.
Full textDomański, Krzysztof, Piotr Prokaryn, Daniel Tomaszewski, Michał Marchewka, and Piotr Grabiec. "Development and Modeling of Thermal Energy Harvesting Setup." Journal of Nano Research 39 (February 2016): 191–201. http://dx.doi.org/10.4028/www.scientific.net/jnanor.39.191.
Full textAlexeev, Anton, Grigory Onushkin, Jean-Paul Linnartz, and Genevieve Martin. "Multiple Heat Source Thermal Modeling and Transient Analysis of LEDs." Energies 12, no. 10 (May 15, 2019): 1860. http://dx.doi.org/10.3390/en12101860.
Full textPatil, Chandrashekhar. "A Novel Thermal Modeling of Through Silicon Vias in 3-D IC structures." International Journal of Materials 7 (January 15, 2021): 104–10. http://dx.doi.org/10.46300/91018.2020.7.19.
Full textEnder, Ferenc, Márton Németh, Péter Pálovics, Andras Drozdy, and András Poppe. "Thermal compact modeling approach of droplet microreactor based Lab-on-a-Chip devices." Microelectronics Journal 45, no. 12 (December 2014): 1786–94. http://dx.doi.org/10.1016/j.mejo.2014.07.005.
Full textZhang, Liuyang, Yuanqing Cheng, Wang Kang, Lionel Torres, Youguang Zhang, Aida Todri-Sanial, and Weisheng Zhao. "Addressing the Thermal Issues of STT-MRAM From Compact Modeling to Design Techniques." IEEE Transactions on Nanotechnology 17, no. 2 (March 2018): 345–52. http://dx.doi.org/10.1109/tnano.2018.2803340.
Full textPacelli, A., P. Palestri, and M. Mastrapasqua. "Compact modeling of thermal resistance in bipolar transistors on bulk and SOI substrates." IEEE Transactions on Electron Devices 49, no. 6 (June 2002): 1027–33. http://dx.doi.org/10.1109/ted.2002.1003724.
Full textShengjie, Ying, Y. C. Lam, S. C. M. Yu, and K. C. Tam. "Thermal debinding modeling of mass transport and deformation in powder-injection molding compact." Metallurgical and Materials Transactions B 33, no. 3 (June 2002): 477–88. http://dx.doi.org/10.1007/s11663-002-0058-6.
Full textPohl, László, Gusztáv Hantos, János Hegedüs, Márton Németh, Zsolt Kohári, and András Poppe. "Mixed Detailed and Compact Multi-Domain Modeling to Describe CoB LEDs." Energies 13, no. 16 (August 5, 2020): 4051. http://dx.doi.org/10.3390/en13164051.
Full textBahrami, M., J. R. Culham, and M. M. Yovanovich. "Modeling Thermal Contact Resistance: A Scale Analysis Approach." Journal of Heat Transfer 126, no. 6 (December 1, 2004): 896–905. http://dx.doi.org/10.1115/1.1795238.
Full textGlowka, D. A., and C. M. Stone. "Thermal Response of Polycrystalline Diamond Compact Cutters Under Simulated Downhole Conditions." Society of Petroleum Engineers Journal 25, no. 02 (April 1, 1985): 143–56. http://dx.doi.org/10.2118/11947-pa.
Full textCeccarelli, L., A. S. Bahman, and F. Iannuzzo. "Impact of device aging in the compact electro-thermal modeling of SiC power MOSFETs." Microelectronics Reliability 100-101 (September 2019): 113336. http://dx.doi.org/10.1016/j.microrel.2019.06.028.
Full textSahu, Yogendra, Pragya Kushwaha, Avirup Dasgupta, Chenming Hu, and Yogesh Singh Chauhan. "Compact Modeling of Drain Current Thermal Noise in FDSOI MOSFETs Including Back-Bias Effect." IEEE Transactions on Microwave Theory and Techniques 65, no. 7 (July 2017): 2261–70. http://dx.doi.org/10.1109/tmtt.2017.2666811.
Full textLasance, Clemens J. M. "Ten Years of Boundary-Condition- Independent Compact Thermal Modeling of Electronic Parts: A Review." Heat Transfer Engineering 29, no. 2 (February 2008): 149–68. http://dx.doi.org/10.1080/01457630701673188.
Full textCheng, Hsien-Chie, Siang-Yu Lin, and Yan-Cheng Liu. "Transient Electro-Thermal Coupled Modeling of Three-Phase Power MOSFET Inverter during Load Cycles." Materials 14, no. 18 (September 19, 2021): 5427. http://dx.doi.org/10.3390/ma14185427.
Full textKim, Duckjong, Sung Jin Kim, and Alfonso Ortega. "Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks." Journal of Electronic Packaging 126, no. 3 (September 1, 2004): 342–50. http://dx.doi.org/10.1115/1.1772415.
Full textAngelotti, Alberto Maria, Gian Piero Gibiino, Corrado Florian, and Alberto Santarelli. "Trapping Dynamics in GaN HEMTs for Millimeter-Wave Applications: Measurement-Based Characterization and Technology Comparison." Electronics 10, no. 2 (January 10, 2021): 137. http://dx.doi.org/10.3390/electronics10020137.
Full textAngelotti, Alberto Maria, Gian Piero Gibiino, Corrado Florian, and Alberto Santarelli. "Trapping Dynamics in GaN HEMTs for Millimeter-Wave Applications: Measurement-Based Characterization and Technology Comparison." Electronics 10, no. 2 (January 10, 2021): 137. http://dx.doi.org/10.3390/electronics10020137.
Full textSon, Minji, Yesol Woo, Geunjae Kwak, Yun-Jo Lee, and Myung-June Park. "CFD modeling of a compact reactor for methanol synthesis: Maximizing productivity with increased thermal controllability." International Journal of Heat and Mass Transfer 145 (December 2019): 118776. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2019.118776.
Full textGao, Xin, Min Chen, G. Jeffrey Snyder, Søren Juhl Andreasen, and Søren Knudsen Kær. "Thermal Management Optimization of a Thermoelectric-Integrated Methanol Evaporator Using a Compact CFD Modeling Approach." Journal of Electronic Materials 42, no. 7 (March 7, 2013): 2035–42. http://dx.doi.org/10.1007/s11664-013-2514-2.
Full textChirtoc, M., and N. Horny. "Toolbox for modeling frequency-domain photothermal experiments on multilayers." Journal of Applied Physics 131, no. 21 (June 7, 2022): 214502. http://dx.doi.org/10.1063/5.0091688.
Full textSaleh, Alaa, Abdel Kader El Rafei, Mountakha Dieng, Tibault Reveyrand, Raphael Sommet, Jean-Michel Nebus, and Raymond Quere. "Compact RF non-linear electro thermal model of SiGe HBT for the design of broadband ADC's." International Journal of Microwave and Wireless Technologies 4, no. 6 (August 29, 2012): 569–78. http://dx.doi.org/10.1017/s1759078712000566.
Full textColangelo, Alessandro, Elisa Guelpa, Andrea Lanzini, Giulia Mancò, and Vittorio Verda. "Compact Model of Latent Heat Thermal Storage for Its Integration in Multi-Energy Systems." Applied Sciences 10, no. 24 (December 16, 2020): 8970. http://dx.doi.org/10.3390/app10248970.
Full textScognamillo, Ciro, Antonio Pio Catalano, Michele Riccio, Vincenzo d’Alessandro, Lorenzo Codecasa, Alessandro Borghese, Ravi Nath Tripathi, Alberto Castellazzi, Giovanni Breglio, and Andrea Irace. "Compact Modeling of a 3.3 kV SiC MOSFET Power Module for Detailed Circuit-Level Electrothermal Simulations Including Parasitics." Energies 14, no. 15 (August 2, 2021): 4683. http://dx.doi.org/10.3390/en14154683.
Full textCodecasa, Lorenzo, Vincenzo d'Alessandro, Alessandro Magnani, and Niccolo Rinaldi. "Fast Nonlinear Dynamic Compact Thermal Modeling With Multiple Heat Sources in Ultra-Thin Chip Stacking Technology." IEEE Transactions on Components, Packaging and Manufacturing Technology 7, no. 1 (January 2017): 58–69. http://dx.doi.org/10.1109/tcpmt.2016.2623420.
Full textKhoong, L. E., Y. C. Lam, J. C. Chai, J. Ma, and L. Jiang. "Modeling of mass transfers in a porous green compact with two-component binder during thermal debinding." Chemical Engineering Science 64, no. 12 (June 2009): 2837–50. http://dx.doi.org/10.1016/j.ces.2009.03.006.
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