Log in

Relevant bibliographies by topics / Compact thermal modeling

Contents

Journal articles
Dissertations / Theses
Book chapters
Conference papers
Reports

Academic literature on the topic 'Compact thermal modeling'

Author: Grafiati

Published: 25 June 2022

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Compact thermal modeling.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Compact thermal modeling"

1

Wei Huang, M. R. Stan, and K. Skadron. "Parameterized physical compact thermal modeling." IEEE Transactions on Components and Packaging Technologies 28, no. 4 (December 2005): 615–22. http://dx.doi.org/10.1109/tcapt.2005.859737.

Full text

APA, Harvard, Vancouver, ISO, and other styles

2

Lasance, C. "Special section on compact thermal modeling." IEEE Transactions on Components and Packaging Technologies 26, no. 1 (March 2003): 134–35. http://dx.doi.org/10.1109/tcapt.2003.814000.

Full text

APA, Harvard, Vancouver, ISO, and other styles

3

Codecasa, L., D. D'Amore, and P. Maffezzoni. "Compact Thermal Networks for Modeling Packages." IEEE Transactions on Components and Packaging Technologies 27, no. 1 (March 2004): 96–103. http://dx.doi.org/10.1109/tcapt.2004.825796.

Full text

APA, Harvard, Vancouver, ISO, and other styles

4

Narasimhan, S., A. Bar-Cohen, and R. Nair. "Thermal compact modeling of parallel plate heat sinks." IEEE Transactions on Components and Packaging Technologies 26, no. 1 (March 2003): 136–46. http://dx.doi.org/10.1109/tcapt.2003.811860.

Full text

APA, Harvard, Vancouver, ISO, and other styles

5

Janicki, Marcin, Przemysław Ptak, Tomasz Torzewicz, and Krzysztof Górecki. "Compact Thermal Modeling of Modules Containing Multiple Power LEDs." Energies 13, no. 12 (June 17, 2020): 3130. http://dx.doi.org/10.3390/en13123130.

Full text

Abstract:

Temperature is an essential factor affecting the operation of light-emitting diodes (LEDs), which are often used in circuits containing multiple devices influencing each other. Therefore, the thermal models of such circuits should take into account not only the self-heating effects, but also the mutual thermal influences among devices. This problem is illustrated here based on the example of a module containing six LEDs forming on the substrate a hexagon. This module is supposed to operate without any heat sink in the natural convection cooling conditions, hence it has been proposed to increase the thermal pad area in order to lower the device-operating temperature. In the experimental part of the paper, the recorded diode-heating curves are processed using the network identification by deconvolution method. This allows for the computation of the thermal time constant spectra and the generation of device-compact thermal models. Moreover, the influence of the thermal pad surface area on the device temperature and the thermal coupling between LEDs is investigated.

APA, Harvard, Vancouver, ISO, and other styles

6

Chen, Ming, Yan Ting Yu, Bo Wang, and Yong Tang. "Test of IGBT Transient Thermal Impedance and Modeling Research on Thermal Model." Advanced Materials Research 148-149 (October 2010): 429–33. http://dx.doi.org/10.4028/www.scientific.net/amr.148-149.429.

Full text

Abstract:

As the operation performances and reliability of semiconductor devices are tightly related to its operating temperature, the research on the heat transfer characteristic and thermal modeling do a significant meaning to extend services lifetime and improve application reliability of the IGBT modules. The physical structure and the conception, RC component network of thermal resistance, test principle and platform of the transient thermal impedance of IGBT module and three modeling methods are briefly introduced. The parameters of Cauer RC thermal network of a certain type IGBT is derived based on transmission line method. The junction-case thermal resistance can be deduced by Finite Element Method in the numerical simulator ANSYS and the transient thermal impedance curve. Thermal compact model can also be deduced from the numerical simulation and experimental results. An excellent agreement is obtained between experimental results derived by the transient thermal impedance curve and numerical simulation results based on FEM. The thermal compact model and experimental results could be helpful for modeling of thermal model and heat sink design for such electronic devices.

APA, Harvard, Vancouver, ISO, and other styles

7

Codecasa, Lorenzo, Vincenzo d’Alessandro, Alessandro Magnani, Niccolò Rinaldi, Andre G. Metzger, Robin Bornoff, and John Parry. "Partition-based approach to parametric dynamic compact thermal modeling." Microelectronics Reliability 79 (December 2017): 361–70. http://dx.doi.org/10.1016/j.microrel.2017.06.059.

Full text

APA, Harvard, Vancouver, ISO, and other styles

8

KOYAMADA, Koji, Yasuharu YAMADA, Toshihiko NISHIO, and Hidetoshi KOTERA. "Compact Modeling Approach using GA for Accurate Thermal Simulation." Transactions of the Japan Society of Mechanical Engineers Series B 65, no. 632 (1999): 1370–76. http://dx.doi.org/10.1299/kikaib.65.1370.

Full text

APA, Harvard, Vancouver, ISO, and other styles

9

Janicki, Marcin, Przemyslaw Ptak, Tomasz Torzewicz, and Krzysztof Gorecki. "Compact Thermal Modeling of Color LEDs—A Comparative Study." IEEE Transactions on Electron Devices 67, no. 8 (August 2020): 3186–90. http://dx.doi.org/10.1109/ted.2020.2998459.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Bartholomeusz, Brian J. "Thermal modeling studies of organic compact disk-writable media." Applied Optics 31, no. 7 (March 1, 1992): 909. http://dx.doi.org/10.1364/ao.31.000909.

Full text

APA, Harvard, Vancouver, ISO, and other styles

More sources

Dissertations / Theses on the topic "Compact thermal modeling"

1

Li, Xiaoming. "Compact thermal modeling for 3D IC design." Diss., Online access via UMI:, 2005.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

2

Ocak, Mustafa. "Conduction Based Compact Thermal Modeling For Thermal Analysis Of Electronic Components." Master's thesis, METU, 2010. http://etd.lib.metu.edu.tr/upload/12612100/index.pdf.

Full text

Abstract:

Conduction based compact thermal modeling of DC/DC converters, which are electronic components commonly used in military applications, are investigated. Three carefully designed numerical case studies are carried out at component, board and system levels using ICEPAK software. Experiments are conducted to gather temperature data that can be used to study compact thermal models (CTMs) with different levels of simplification. In the first (component level) problem a series of conduction based CTMs are generated and used to study the thermal behavior of a Thin-Shrink Small Outline Package (TSSOP) type DC/DC converter under free convection conditions. In the second (board level) case study, CTM alternatives are produced and investigated for module type DC/DC converter components using a printed circuit board (PCB) of an electro-optic system. In the last case study, performance of the CTM alternatives generated for the first case are assessed at the system level using them on a PCB placed inside a realistic avionic box. v Detailed comparison of accuracy of simulations obtained using CTMs with various levels of simplification is made based on experimentally obtained temperature data. Effects of grid size and quality, choice of turbulence modeling and space discretization schemes on numerical solutions are discussed in detail. It is seen that simulations provide results that are in agreement with measurements when appropriate CTMs are used. It is also showed that remarkable reductions in modeling and simulation times can be achieved by the use of CTMs, especially in system level analysis.

APA, Harvard, Vancouver, ISO, and other styles

3

Nie, Qihong. "Experimentally validated multiscale thermal modeling of electronic cabinets." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/26492.

Full text

Abstract:

Thesis (Ph.D)--Mechanical Engineering, Georgia Institute of Technology, 2009.
Committee Chair: Joshi, Yogendra; Committee Member: Gallivan, Martha; Committee Member: Graham, Samuel; Committee Member: Yeung, Pui-Kuen; Committee Member: Zhang, Zhuomin. Part of the SMARTech Electronic Thesis and Dissertation Collection.

APA, Harvard, Vancouver, ISO, and other styles

4

O'brien, Jonathan. "Medium Power, Compact Periodic Spiral Antenna." Scholar Commons, 2013. http://scholarcommons.usf.edu/etd/4926.

Full text

Abstract:

Historical, well developed, procedures for RF design have minimal emphasis on exploring the third dimension due to the difficulty of fabrication. Recent material advancements applicable to 3D printing have brought about low-loss thermoplastics with excellent mechanical properties. Research into depositing conductive inks onto arbitrary 3D shapes has achieved resolutions better than 50 μm with conductivity values approaching that of copper cladding. The advancements in additive manufacturing have improved reliability and repeatability of three dimensional designs while decreasing fabrication time. With this design approach other considerations, such as stability and strength, can be concentrated on during the structure design to realize new shapes. The next step in the future of RF research will encompass designing and further understanding the benefits and consequences of using all three dimensions. This could include meandering an antenna element around other electronic components to make the overall package size smaller or integrating an antenna array into a wing. The design and analysis of the periodic spiral antenna (PSA) takes a look at a specific case of full volume utilization. In this application meandering in the z-dimension allowed the design to become smaller and more efficient than what is achievable with planar methods. This thesis will go into detail on the characterization of the periodic spiral antenna. To exemplify the benefits of meandering in the z-dimension a loop antenna is presented and benchmarked against other miniaturization techniques. Measured results of two different PSA models are presented and remarks on improving fabrication are given. When an antenna is used as a transmitter incident power will cause thermal generation so a study was conducted to understand how material properties can govern the amount of heat generated.

APA, Harvard, Vancouver, ISO, and other styles

5

Raghupathy, Arun Prakash. "Boundary-Condition-Independent Reduced-Order Modeling for Thermal Analysis of Complex Electronics Packages." University of Cincinnati / OhioLINK, 2009. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1240536463.

Full text

APA, Harvard, Vancouver, ISO, and other styles

6

D'Esposito, Rosario. "Electro-thermal characterization, TCAD simulations and compact modeling of advanced SiGe HBTs at device and circuit level." Thesis, Bordeaux, 2016. http://www.theses.fr/2016BORD0147/document.

Full text

Abstract:

Ce travail de thèse présente une étude concernant la caractérisation des effets électrothermiques dans les transistors bipolaires à hétérojonction (HBT) en SiGe. Lors de ces travaux, deux procédés technologiques BiCMOS à l’état de l’art ont été analysés: le B11HFC de Infineon Technologies (130nm) et le B55 de STMicroelectronics (55nm).Des structures de test dédiées ont étés conçues, pour évaluer l’impact électrothermique du back end of line (BEOL) de composants ayant une architecture à un ou plusieurs doigts d’émetteur. Une caractérisation complète a été effectuée en régime continu et en mode alternatif en petit et en grand signal. De plus, une extraction des paramètres thermiques statiques et dynamiques a été réalisée et présentée pour les structures de test proposées. Il est démontré que les figures de mérite DC et RF s’améliorent sensiblement en positionnant des couches de métal sur le transistor, dessinées de manière innovante et ayant pour fonction de guider le flux thermique vers l’extérieur. L’impact thermique du BEOL a été modélisé et vérifié expérimentalement dans le domaine temporel et fréquentiel et aussi grâce à des simulations 3D par éléments finis. Il est à noter que l’effet du profil de dopage sur la conductivité thermique est analysé et pris en compte.Des topologies de transistor innovantes ont étés conçues, permettant une amélioration des spécifications de l’aire de sécurité de fonctionnement, grâce à un dessin innovant de la surface d’émetteur et du deep trench (DTI).Un modèle compact est proposé pour simuler les effets de couplage thermique en dynamique entre les émetteurs des HBT multi-doigts; ensuite le modèle est validé avec de mesures dédiées et des simulations TCAD.Des circuits de test ont étés conçus et mesurés, pour vérifier la précision des modèles compacts utilisés dans les simulateurs de circuits; de plus, l’impact du couplage thermique entre les transistors sur les performances des circuits a été évalué et modélisé. Finalement, l’impact du dissipateur thermique positionné sur le transistor a été étudié au niveau circuit, montrant un réel intérêt de cette approche
This work is focused on the characterization of electro-thermal effects in advanced SiGe hetero-junction bipolar transistors (HBTs); two state of the art BiCMOS processes have been analyzed: the B11HFC from Infineon Technologies (130nm) and the B55 from STMicroelectronics (55nm).Special test structures have been designed, in order to evaluate the overall electro-thermal impact of the back end of line (BEOL) in single finger and multi-finger components. A complete DC and RF electrical characterization at small and large signal, as well as the extraction of the device static and dynamic thermal parameters are performed on the proposed test structures, showing a sensible improvement of the DC and RF figures of merit when metal dummies are added upon the transistor. The thermal impact of the BEOL has been modeled and experimentally verified in the time and frequency domain and by means of 3D TCAD simulations, in which the effect of the doping profile on the thermal conductivity is analyzed and taken into account.Innovative multi-finger transistor topologies are designed, which allow an improvement of the SOA specifications, thanks to a careful design of the drawn emitter area and of the deep trench isolation (DTI) enclosed area.A compact thermal model is proposed for taking into account the mutual thermal coupling between the emitter stripes of multi-finger HBTs in dynamic operation and is validated upon dedicated pulsed measurements and TCAD simulations.Specially designed circuit blocks have been realized and measured, in order to verify the accuracy of device compact models in electrical circuit simulators; moreover the impact on the circuit performances of mutual thermal coupling among neighboring transistors and the presence of BEOL metal dummies is evaluated and modeled

APA, Harvard, Vancouver, ISO, and other styles

7

Xie, Jianyong. "Electrical-thermal modeling and simulation for three-dimensional integrated systems." Diss., Georgia Institute of Technology, 2013. http://hdl.handle.net/1853/50307.

Full text

Abstract:

The continuous miniaturization of electronic systems using the three-dimensional (3D) integration technique has brought in new challenges for the computer-aided design and modeling of 3D integrated circuits (ICs) and systems. The major challenges for the modeling and analysis of 3D integrated systems mainly stem from four aspects: (a) the interaction between the electrical and thermal domains in an integrated system, (b) the increasing modeling complexity arising from 3D systems requires the development of multiscale techniques for the modeling and analysis of DC voltage drop, thermal gradients, and electromagnetic behaviors, (c) efficient modeling of microfluidic cooling, and (d) the demand of performing fast thermal simulation with varying design parameters. Addressing these challenges for the electrical/thermal modeling and analysis of 3D systems necessitates the development of novel numerical modeling methods. This dissertation mainly focuses on developing efficient electrical and thermal numerical modeling and co-simulation methods for 3D integrated systems. The developed numerical methods can be classified into three categories. The first category aims to investigate the interaction between electrical and thermal characteristics for power delivery networks (PDNs) in steady state and the thermal effect on characteristics of through-silicon via (TSV) arrays at high frequencies. The steady-state electrical-thermal interaction for PDNs is addressed by developing a voltage drop-thermal co-simulation method while the thermal effect on TSV characteristics is studied by proposing a thermal-electrical analysis approach for TSV arrays. The second category of numerical methods focuses on developing multiscale modeling approaches for the voltage drop and thermal analysis. A multiscale modeling method based on the finite-element non-conformal domain decomposition technique has been developed for the voltage drop and thermal analysis of 3D systems. The proposed method allows the modeling of a 3D multiscale system using independent mesh grids in sub-domains. As a result, the system unknowns can be greatly reduced. In addition, to improve the simulation efficiency, the cascadic multigrid solving approach has been adopted for the voltage drop-thermal co-simulation with a large number of unknowns. The focus of the last category is to develop fast thermal simulation methods using compact models and model order reduction (MOR). To overcome the computational cost using the computational fluid dynamics simulation, a finite-volume compact thermal model has been developed for the microchannel-based fluidic cooling. This compact thermal model enables the fast thermal simulation of 3D ICs with a large number of microchannels for early-stage design. In addition, a system-level thermal modeling method using domain decomposition and model order reduction is developed for both the steady-state and transient thermal analysis. The proposed approach can efficiently support thermal modeling with varying design parameters without using parameterized MOR techniques.

APA, Harvard, Vancouver, ISO, and other styles

8

Sahoo, Amit Kumar. "Electro-thermal Characterizations, Compact Modeling and TCAD based Device Simulations of advanced SiGe : C BiCMOS HBTs and of nanometric CMOS FET." Thesis, Bordeaux 1, 2012. http://www.theses.fr/2012BOR14557/document.

Full text

Abstract:

Ce travail de thèse présente une évaluation approfondie des différentes techniques de mesure transitoire et dynamique pour l’évaluation du comportement électro-thermique des transistors bipolaires à hétérojonctions HBT SiGe:C de la technologie BiCMOS et des transistors Métal-Oxyde-Semiconducteur à effet de champ (MOSFET) de la technologie CMOS 45nm. En particulier, je propose une nouvelle approche pour caractériser avec précision le régime transitoire d'auto-échauffement, basée sur des mesures impulsionelles. La méthodologie a été vérifiée par des mesures statiques à différentes températures ambiantes, des mesures de paramètres S à basses fréquences et des simulations thermiques transitoires. Des simulations thermiques par éléments finis (TCAD) en trois dimensions ont été réalisées sur les transistors HBTs de la technologie submicroniques SiGe: C BiCMOS. Cette technologie est caractérisée par une fréquence de transition fT de 230 GHz et une fréquence maximum d’oscillation fMAX de 290 GHz. Par ailleurs, cette étude a été réalisée sur les différentes géométries de transistor. Une évaluation complète des mécanismes d'auto-échauffement dans les domaines temporels et fréquentiels a été réalisée. Une expression généralisée de l'impédance thermique dans le domaine fréquentiel a été formulée et a été utilisé pour extraire cette impédance en deçà de la fréquence de coupure thermique. Les paramètres thermiques ont été extraits par des simulations compactes grâce au modèle compact de transistors auquel un modèle électro-thermique a été ajouté via le nœud de température. Les travaux théoriques développés à ce jour pour la modélisation d'impédance thermique ont été vérifiés avec nos résultats expérimentaux. Il a été montré que, le réseau thermique classique utilisant un pôle unique n'est pas suffisant pour modéliser avec précision le comportement thermique transitoire et donc qu’un réseau plus complexe doit être utilisé. Ainsi, nous validons expérimentalement pour la première fois, le modèle distribué électrothermique de l'impédance thermique utilisant un réseau nodal récursif. Le réseau récursif a été vérifié par des simulations TCAD, ainsi que par des mesures et celles ci se sont révélées en excellent accord. Par conséquent, un modèle électro-thermique multi-géométries basé sur le réseau récursif a été développé. Le modèle a été vérifié par des simulations numériques ainsi que par des mesures de paramètre S à basse fréquence et finalement la conformité est excellente quelque soit la géométrie des dispositifs
An extensive evaluation of different techniques for transient and dynamic electro-thermal behavior of microwave SiGe:C BiCMOS hetero-junction bipolar transistors (HBT) and nano-scale metal-oxide-semiconductor field-effect transistors (MOSFETs) have been presented. In particular, new and simple approach to accurately characterize the transient self-heating effect, based on pulse measurements, is demonstrated. The methodology is verified by static measurements at different ambient temperatures, s-parameter measurements at low frequency region and transient thermal simulations. Three dimensional thermal TCAD simulations are performed on different geometries of the submicron SiGe:C BiCMOS HBTs with fT and fmax of 230 GHz and 290 GHz, respectively. A comprehensive evaluation of device self-heating in time and frequency domain has been investigated. A generalized expression for the frequency-domain thermal impedance has been formulated and that is used to extract device thermal impedance below thermal cut-off frequency. The thermal parameters are extracted through transistor compact model simulations connecting electro-thermal network at temperature node. Theoretical works for thermal impedance modeling using different networks, developed until date, have been verified with our experimental results. We report for the first time the experimental verification of the distributed electrothermal model for thermal impedance using a nodal and recursive network. It has been shown that, the conventional single pole thermal network is not sufficient to accurately model the transient thermal spreading behavior and therefore a recursive network needs to be used. Recursive network is verified with device simulations as well as measurements and found to be in excellent agreement. Therefore, finally a scalable electro-thermal model using this recursive network is developed. The scalability has been verified through numerical simulations as well as by low frequency measurements and excellent conformity has been found in for various device geometries

APA, Harvard, Vancouver, ISO, and other styles

9

Chen, Minghui. "DESIGN, FABRICATION, TESTING, AND MODELING OF A HIGH-TEMPERATURE PRINTED CIRCUIT HEAT EXCHANGER." The Ohio State University, 2015. http://rave.ohiolink.edu/etdc/view?acc_num=osu1431072434.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Martins, Olivier. "Méthodologie d'analyse thermique multi niveaux de systèmes électroniques par des modèles compacts." Grenoble INPG, 2010. https://theses.hal.science/tel-00569192.

Full text

Abstract:

Au cours de ces dernières années, la taille des transistors a diminué considérablement permettant ainsi de réduire la taille des composants et de multiplier le nombre de composants dans un système. Cette condensation des transistors avec la montée en fréquence des circuits est à l'origine d'une augmentation drastique de la densité de puissance et d'une élévation importante de la température du composant, dommageable pour les performances de celui-ci. Le but de ces travaux de thèse est de proposer une méthodologie de génération de modèles thermiques, légers (rapidement simulables) et indépendants des conditions aux limites, de systèmes électroniques complexes. Cette méthodologie permet de décomposer un système complexe en sous-éléments, de construire un modèle léger de chaque élément et de les reconnecter afin de recomposer le comportement thermique du système global. La méthodologie permet d'effectuer une analyse thermique du système tôt dans le processus de conception d'un système et offre de nombreux avantages par rapport aux modèles existants
Over the past few years, the size of transistors has drastically decreased which enables to design smaller components and to add more and more components in electronic Systems. The transistor technology réduction and the rise of the operating frequency hâve caused a dramatic increase of power density in Integrated Circuits and a high température rise of the component that can affect its performances. The aim of the thesis is to suggest a new methodology to build boundary condition independent compact thermal models of complex electronic Systems. This methodology enables to split the Systems in éléments, to build a compact thermal model of each élément and to connect them to model the thermal behaviour of the whole System. The Flex-CTM methodology enables to perform a thermal analysis at an early stage of a system's design flow and has numerous advantages than existing thermal models

APA, Harvard, Vancouver, ISO, and other styles

More sources

Book chapters on the topic "Compact thermal modeling"

1

Ma, Yue, and Christian Gontrand. "Efficient and Simple Compact Modeling of Interconnects." In Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement, 47–96. Boca Raton : Taylor & Francis, a CRC title, part of the Taylor & Francis imprint, a member of the Taylor & Francis Group, the academic division of T&F Informa, plc, 2018.: CRC Press, 2019. http://dx.doi.org/10.1201/9780429399619-3.

Full text

APA, Harvard, Vancouver, ISO, and other styles

2

Wang, X. Q., and Marc P. Mignolet. "Towards Compact Structural Bases for Coupled Structural-Thermal Nonlinear Reduced Order Modeling." In Nonlinear Structures & Systems, Volume 1, 197–206. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-77135-5_23.

Full text

APA, Harvard, Vancouver, ISO, and other styles

3

Gaspar, Pedro Dinis, Pedro Dinho da Silva, João Pedro Marques Gonçalves, and Rui Carneiro. "Computational Modelling and Simulation to Assist the Improvement of Thermal Performance and Energy Efficiency in Industrial Engineering Systems." In Advances in Systems Analysis, Software Engineering, and High Performance Computing, 1–68. IGI Global, 2016. http://dx.doi.org/10.4018/978-1-4666-8823-0.ch001.

Full text

Abstract:

Computational modelling is nowadays a powerful tool for project and design of engineering systems, anticipating and/or correcting problems that may lead to inefficiencies. This chapter describes three distinct computational tools with different mathematical and numerical models. The computational tools are used with the purpose of improving the thermal and energy performance of cold stores. All tools are applied to the same agrifood company. First, Computational Fluid Dynamics is used to optimize velocity and temperature fields for the interior a cold room. Afterwards, an energy analysis and thermal load simulation is performed to the cold store facility to reduce its thermal loads. Finally, a statistical prediction model based on empirical correlations is used to predict the energy performance of the cold store and compare it to an average behaviour. The numerical results indicate the improvement of the thermal performance and consequently of food safety, as well as considerable energy savings that can be achieved in cold stores by the combined use of different modelling techniques.

APA, Harvard, Vancouver, ISO, and other styles

4

Debbarma, Sumita, Biplab Das, and Jagadish. "Optimization of Performance and Emissions Parameters of a Biodiesel-Run Diesel Engine." In Advances in Environmental Engineering and Green Technologies, 115–38. IGI Global, 2019. http://dx.doi.org/10.4018/978-1-5225-8579-4.ch006.

Full text

Abstract:

Biodiesel has been immersed as an immediate alternative of fossil fuels for diesel engines. However, choosing a good combination of biodiesel blends based on both performance and emission depend on various factors. The chapter presents the modeling and optimization of performance and emissions parameters of a biodiesel-run diesel engine using an integrated MCDM approach. The integrated MCDM approach consists of entropy with MCRA method. An experimental case study on performance and emission study of diesel engine is considered to show the modeling capability of the proposed method. The results show that trail no. 4 yields the optimal setting compare to the other combinations. The trail no. 4 gives optimum operating condition such as 85-90% load and PB10 which provides optimum performance parameters like higher brake thermal efficiency (BTE), lower brake-specific energy consumption (BSEC), lower carbon monoxide (CO), lower hydro carbon (HC), and lower oxides of nitrogen (NOx), respectively.

APA, Harvard, Vancouver, ISO, and other styles

5

Jussila, Petri. "Thermomechanical Model for Compacted Bentonite." In Coupled Thermo-Hydro-Mechanical-Chemical Processes in Geo-Systems - Fundamentals, Modelling, Experiments and Applications, 137–42. Elsevier, 2004. http://dx.doi.org/10.1016/s1571-9960(04)80031-4.

Full text

APA, Harvard, Vancouver, ISO, and other styles

6

Issakhov, Alibek. "Mathematical Modelling of the Thermal Process in the Aquatic Environment with Considering the Hydrometeorological Condition at the Reservoir-Cooler by Using Parallel Technologies." In Sustaining Power Resources through Energy Optimization and Engineering, 227–43. IGI Global, 2016. http://dx.doi.org/10.4018/978-1-4666-9755-3.ch010.

Full text

Abstract:

This paper presents the mathematical model of the thermal power plant in reservoir under different hydrometeorological conditions, which is solved by three dimensional Navier - Stokes and temperature equations for an incompressible fluid in a stratified medium. A numerical method based on the projection method, which divides the problem into four stages. At the first stage it is assumed that the transfer of momentum occurs only by convection and diffusion. Intermediate velocity field is solved by fractional steps method. At the second stage, three-dimensional Poisson equation is solved by the Fourier method in combination with tridiagonal matrix method (Thomas algorithm). At the third stage it is expected that the transfer is only due to the pressure gradient. Finally stage equation for temperature solved like momentum equation with fractional step method. To increase the order of approximation compact scheme was used. Then qualitatively and quantitatively approximate the basic laws of the hydrothermal processes depending on different hydrometeorological conditions are determined.

APA, Harvard, Vancouver, ISO, and other styles

7

Villar, María Victoria, and Antonio Lloret. "Temperature Influence on the Mechanical Behaviour of a Compacted Bentonite." In Coupled Thermo-Hydro-Mechanical-Chemical Processes in Geo-Systems - Fundamentals, Modelling, Experiments and Applications, 305–10. Elsevier, 2004. http://dx.doi.org/10.1016/s1571-9960(04)80058-2.

Full text

APA, Harvard, Vancouver, ISO, and other styles

8

Gens, A., L. do N. Guimarães, S. Olivella, and M. Sánchez. "Analysis of the Thmc Behaviour of Compacted Swelling Clay for Radioactive Waste Isolation." In Coupled Thermo-Hydro-Mechanical-Chemical Processes in Geo-Systems - Fundamentals, Modelling, Experiments and Applications, 317–22. Elsevier, 2004. http://dx.doi.org/10.1016/s1571-9960(04)80060-0.

Full text

APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Compact thermal modeling"

1

Janicki, M., P. Zajac, M. Szermer, and A. Napieralski. "Compact thermal modeling of microbolometers." In 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2014. http://dx.doi.org/10.1109/eurosime.2014.6813849.

Full text

APA, Harvard, Vancouver, ISO, and other styles

2

Alexeev, Anton, Genevieve Martin, and Volker Hildenbrand. "Structure function analysis and thermal compact model development of a mid-power LED." In 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2017. http://dx.doi.org/10.1109/semi-therm.2017.7896942.

Full text

APA, Harvard, Vancouver, ISO, and other styles

3

Drummond, Kevin P., Justin A. Weibel, and Suresh V. Garimella. "Experimental study of flow boiling in a compact hierarchical manifold microchannel heat sink array." In 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2017. http://dx.doi.org/10.1109/semi-therm.2017.7896921.

Full text

APA, Harvard, Vancouver, ISO, and other styles

4

Rogie, B., S. Grosjean, E. Monier-Vinard, V. Bissuel, F. Joly, O. Daniel, N. Laraqi, and K. Vera. "Delphi-like dynamical compact thermal models using model order reduction based on modal approach." In 2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2018. http://dx.doi.org/10.1109/semi-therm.2018.8357347.

Full text

APA, Harvard, Vancouver, ISO, and other styles

5

Huang, Wei, Mircea R. Stan, Kevin Skadron, Karthik Sankaranarayanan, Shougata Ghosh, and Sivakumar Velusam. "Compact thermal modeling for temperature-aware design." In the 41st annual conference. New York, New York, USA: ACM Press, 2004. http://dx.doi.org/10.1145/996566.996800.

Full text

APA, Harvard, Vancouver, ISO, and other styles

6

Torzewicz, T., P. Ptak, A. Samson, T. Raszkowski, M. Janicki, and K. Gorecki. "Parametric Compact Thermal Modeling of Power LEDs." In 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2019. http://dx.doi.org/10.1109/itherm.2019.8757301.

Full text

APA, Harvard, Vancouver, ISO, and other styles

7

Codecasa, L., A. Magnani, V. d'Alessandro, N. Rinaldi, A. G. Metzger, R. Bornoff, and J. Parry. "Novel MOR approach for extracting dynamic compact thermal models with massive numbers of heat sources." In 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2016. http://dx.doi.org/10.1109/semi-therm.2016.7458469.

Full text

APA, Harvard, Vancouver, ISO, and other styles

8

Kulkarni, Devdatta P., and Robin Steinbrecher. "Compact liquid enhanced air cooling thermal solution for high power processors in existing air-cooled platforms." In 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2016. http://dx.doi.org/10.1109/semi-therm.2016.7458449.

Full text

APA, Harvard, Vancouver, ISO, and other styles

9

Baring, Matthew G., Alice K. Harding, Ye-Fei Yuan, Xiang-Dong Li, and Dong Lai. "Modeling the Non-Thermal X-ray Tail Emission of Anomalous X-ray Pulsars." In ASTROPHYSICS OF COMPACT OBJECTS: International Conference on Astrophysics of Compact Objects. AIP, 2008. http://dx.doi.org/10.1063/1.2840459.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Guillemet, Ph, C. Pascot, and Y. Scudeller. "Compact thermal modeling of Electric Double-Layer-Capacitors." In 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems (THERMINIC). IEEE, 2008. http://dx.doi.org/10.1109/therminic.2008.4669891.

Full text

APA, Harvard, Vancouver, ISO, and other styles

Reports on the topic "Compact thermal modeling"

1

O'Brien, M., B. Merrill, and S. Ugaki. Combustion testing and thermal modeling of proposed CIT (Compact Ignition Tokamak) graphite tile materials. Office of Scientific and Technical Information (OSTI), September 1988. http://dx.doi.org/10.2172/6934874.

Full text

APA, Harvard, Vancouver, ISO, and other styles

We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!