Relevant bibliographies by topics / Co-fired ceramics

Academic literature on the topic 'Co-fired ceramics'

Author: Grafiati
Published: 10 December 2022
Last updated: 29 January 2023

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Journal articles on the topic "Co-fired ceramics"

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Mercke, William L., Thomas Dziubla, Richard E. Eitel, and Kimberly Anderson. "Biocompatibility Evaluation of Human Umbilical Vein Endothelial Cells Directly onto Low-Temperature Co-fired Ceramic Materials for Microfluidic Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (September 1, 2012): 000549–56. http://dx.doi.org/10.4071/cicmt-2012-tha11.

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Expansion of Low-Temperature Co-fired Ceramic materials into microfluidic systems technology has many beneficial applications due to their ability to combine complex three dimensional structures with optical, fluidic, electrical functions. Evaluations of the biocompatibility of these Low-Temperature Co-fired Ceramic materials are vital for expanding into biomedical research. The few biocompatibility studies on Low-Temperature Co-fired Ceramics generally show negative cellular response to thick film pastes used in generating the electronic circuitry patterns. In this study, biocompatibility of Human Umbilical Vein Endothelial Cells was examined on Heraeus's Low-Temperature Co-fired Ceramic tape and two of their conductive pastes. The biocompatibility was assessed by monitoring cellular attachment and viability up to three days. This study examines the idea of leachates being detrimental to cells due to a study that suggests the possibility of harmful leachates. Results indicate difficulty in initial attachment of Human Umbilical Vein Endothelial Cells to sintered Low-Temperature Co-fired Ceramic tapes, but no hindrance of cellular attachment and growth onto the two conductive pastes. Outcomes also demonstrate that possible harmful leachates from Low-Temperature Co-fired Ceramic materials don't thwart cellular attachment and growth for up to three days of cell culturing. These results provide a basis for biological devices using Low-Temperature Co-fired Ceramic materials.
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Majer, Zdeněk, Kateřina Štegnerová, Pavel Hutař, Martin Pletz, Raul Bermejo, and Luboš Náhlík. "Residual Lifetime Determination of Low Temperature Co-Fired Ceramics." Key Engineering Materials 713 (September 2016): 266–69. http://dx.doi.org/10.4028/www.scientific.net/kem.713.266.

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The effect of subcritical crack growth is nowadays intensively studied mainly in relation to the strength of ceramic materials. The main aim of the contribution is to describe behavior of micro-crack propagating in the Low Temperature Co-fired Ceramics (LTCC) under subcritical crack growth (SCCG) conditions. The micro-crack behavior is significantly influenced by residual stresses developed in the LTCC due to different coefficients of thermal expansion of individual components. Two-dimensional numerical model was developed to simulate micro-crack propagation through the composite. The micro-crack propagation direction was determined using Sih’s criterion based on the strain energy density factor and the micro-crack path was obtained. The residual lifetime of the specific ceramic particulate composite (LTCC) was estimated on the basis of experimental data. The paper contributes to a better understanding of micro-crack propagation in particulate ceramic composites in the field of residual stresses.
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Wang, Rui, Ji Zhou, Hongjie Zhao, Bo Li, and Longtu Li. "Oxyfluoride glass-silica ceramic composite for low temperature co-fired ceramics." Journal of the European Ceramic Society 28, no. 15 (November 2008): 2877–81. http://dx.doi.org/10.1016/j.jeurceramsoc.2008.05.010.

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Zhang, Wenli, and Richard E. Eitel. "Sintering Behavior, Properties, and Applications of Co-Fired Piezoelectric/Low Temperature Co-Fired Ceramic (PZT-SKN/LTCC) Multilayer Ceramics." International Journal of Applied Ceramic Technology 10, no. 2 (February 6, 2012): 354–64. http://dx.doi.org/10.1111/j.1744-7402.2011.02747.x.

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Makarovič, Kostja, Darko Belavič, Barbara Malič, Andreja Benčan, Franci Kovač, and Janez Holc. "Small ozone generator fabricated from low-temperature co-fired ceramics." Microelectronics International 38, no. 1 (January 12, 2021): 1–5. http://dx.doi.org/10.1108/mi-07-2020-0043.

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Purpose The purpose of this study is the design, fabrication and evaluation of a miniature ozone generator using the principle of electric discharge are presented. Design/methodology/approach The device was fabricated using a low-temperature co-fired ceramics (LTCC) technology, by which a multilayered ceramic structure with integrated electrodes, buried channels and cavities in micro and millimeter scales was realized. Findings The developed ozone generator with the dimensions of 63.6 × 41.8 × 1.3 mm produces approximately 1 vol. % of ozone in oxygen flow of 15 ml/min, at an applied voltage of 7 kV. Originality/value A miniature ozone generator, manufactured in LTCC technology, produces high amount of ozone and more than it is described in the available references or in datasheets of commercial devices of similar size.
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Zhang, Yong Gang, and Xiao Gang Wu. "Dielectric Properties and Microstructure of BaO-Nd2O3-Bi2O3-TiO2 Microwave Ceramics with Li2O-B2O3-SiO2." Advanced Materials Research 906 (April 2014): 12–17. http://dx.doi.org/10.4028/www.scientific.net/amr.906.12.

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Low temperature co-fired ceramics (LTCC) technology becomes crucial in the development of various modules and substrates in electronic packaging, especially in wireless and microwave applications [. With this technology, passive components (such as capacitors and inductors) can be embedded into substrates, and co-fired with high-conductive metals (such as silver and copper) below 900°C. Therefore, the shringkage and dielectric properties of LTCC are of great importance to the performance of components. So far, ceramic/glass composites have been widely researched for LTCC application due to tailored physical properties and low sintering temperature [2-3].
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Murata, Takaki, Satoshi Ohga, and Yasutaka Sugimoto. "Development of a Novel Low Temperature Co-Fired Ceramics System Composed of Two Different Co-Firable Low Temperature Co-Fired Ceramics Materials." Japanese Journal of Applied Physics 45, no. 9B (September 22, 2006): 7401–4. http://dx.doi.org/10.1143/jjap.45.7401.

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Mohanram, Aravind, Sang-Ho Lee, Gary L. Messing, and David J. Green. "Constrained Sintering of Low-Temperature Co-Fired Ceramics." Journal of the American Ceramic Society 89, no. 6 (June 2006): 1923–29. http://dx.doi.org/10.1111/j.1551-2916.2006.01079.x.

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Chu, Xiang Cheng, Li Dan Ding, Xiang Yu Meng, and Long Tu Li. "Vibration and Temperature Measuring Experiments on Multilayer Piezoelectric Actuator." Advanced Materials Research 177 (December 2010): 306–9. http://dx.doi.org/10.4028/www.scientific.net/amr.177.306.

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In this paper, a kind of Mg, Nb co-doped multilayer piezoelectric ceramic is prepared and a non-contact accurate testing method is introduced. Using Pb(Mg1/3Nb2/3)O3- Pb(Ni1/3Nb2/3)O3- Pb(ZrTi)O3 low temperature co-fired ceramics powder and 90/10 Ag-Pb internal electrodes, the sample is prepared with tape casting processing method and low temperature co-fired technique at 960°C. Based on non-contact method, the piezoelectric constant, butterfly curve, and temperature characters are tested. Experiments show that non-contact method is more accurate for d33 testing. The effect of mechanical load on piezoelectric performance is also investigated. Under external mechanical load, switching polarization (Ps) and remnant polarization (Pr) increase respectively. Mechanical load press is also favorable to dominate the temperature rise of the piezoelectric device.
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Malecha, Karol. "Integration of Optoelectronic Components with LTCC (Low Temperature Co-Fired Ceramic) Microfluidic Structure." Metrology and Measurement Systems 18, no. 4 (January 1, 2011): 713–22. http://dx.doi.org/10.2478/v10178-011-0067-3.

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Integration of Optoelectronic Components with LTCC (Low Temperature Co-Fired Ceramic) Microfluidic StructureInvestigations on integration of optoelectronic components with LTCC (low temperature co-fired ceramics) microfluidic module are presented. Design, fabrication and characterization of the ceramic structure for optical absorbance is described as well. The geometry of the microfluidic channels has been designed according to results of the CFD (computational fluid dynamics) analysis. A fabricated LTCC-based microfluidic module consists of an U-shaped microchannel, two optical fibers and integrated light source (light emitting diode) and photodetector (light-to-voltage converter). Properties of the fabricated microfluidic system have been investigated experimentally. Several concentrations of potassium permanganate (KMnO4) in water were used for absorbance/transmittance measurements. The test has shown a linear detection range for various concentrations of heavy metal ions in distilled water. The fabricated microfluidic structure is found to be a very useful system in chemical analysis.
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Dissertations / Theses on the topic "Co-fired ceramics"

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Lim, Hui Fern Michele. "Low Temperature Co-fired Ceramics Technology for Power Magnetics Integration." Diss., Virginia Tech, 2008. http://hdl.handle.net/10919/30156.

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This dissertation focuses on the development of low-temperature co-fired ceramics (LTCC) technology for power converter magnetics integration. Because magnetic samples must be fabricated with thick conductors for power applications, the conventional LTCC process is modified by cutting trenches in the LTCC tapes where conductive paste is filled to produce thick conductors to adapt to this requirement. Characterization of the ceramic magnetic material is performed, and an empirical model based on the Steinmetz equation is developed to help in the estimation of losses at frequencies between 1 MHz to 4 MHz, operating temperature between 25 °C and 70 °C, DC pre-magnetization from 0 A/m to 1780 A/m, and AC magnetic flux densities between 5 mT to 50 mT. Temperature and DC pre-magnetization dependence on Steinmetz exponents are included in the model to describe the loss behavior. In the development of the LTCC chip inductor, various geometries are evaluated. Rectangular-shaped conductor geometry is selected due to its potential to obtain a much smaller footprint, as well as the likelihood of having lower losses than almond-shaped conductors with the same cross-sectional area, which are typically a result of screen printing. The selected geometry has varying inductance with varying current, which helps improve converter efficiency at light load. The efficiency at a light-load current of 0.5 A can be improved by 30 %. Parametric variation of inductor geometry is performed to observe its effect on inductance with DC current as well as on converter efficiency. An empirical model is developed to describe the change in inductance with DC current from 0 A to 16 A for LTCC planar inductors fabricated using low-permeability tape with conductor widths between 1 mm to 4 mm, conductor thickness 180 μm to 550 μm, and core thickness 170 μm to 520 μm. An inductor design flow diagram is formulated to help in the design of these inductors. Configuring the inductor as the substrate carrying the semiconductor and the other electronic components is a next step to freeing the surface area of the bulky component and improving the power density. A conductive shield is introduced between the circuitry and the magnetic substrate to avoid adversely affecting circuit operation by having a magnetic substrate in close proximity to the circuitry. The shield helps reduce parasitic inductances when placed in close proximity to the circuitry. A shield thickness in the range of 50 μm to 100 μm is found to be a good compromise between power loss and parasitic inductance reduction. The shield is effective when its conductivity is above 107 S/m. When a shield is introduced between the inductor substrate and the circuitry, the sample exhibits a lower voltage overshoot (47 % lower) and an overall higher efficiency (7 % higher at 16 A), than an inductor without a shield. A shielded active circuitry placed on top of an inductive substrate performs similarly to a shielded active circuitry placed side-by-side with the inductor. Using a floating shield for the active circuitry yields a slightly better performance than using a grounded shield.
Ph. D.
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Shafique, Muhammad Farhan. "Laser Prototyping of Low Temperature Co-fired Ceramics for System-In-Package Applications." Thesis, University of Leeds, 2010. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.521480.

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Bhutani, Akanksha [Verfasser]. "Low Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHz / Akanksha Bhutani." Karlsruhe : KIT Scientific Publishing, 2019. http://d-nb.info/1196294542/34.

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Zhang, Wenli. "HIGH PERFORMANCE PIEZOELECTRIC MATERIALS AND DEVICES FOR MULTILAYER LOW TEMPERATURE CO-FIRED CERAMIC BASED MICROFLUIDIC SYSTEMS." UKnowledge, 2011. http://uknowledge.uky.edu/gradschool_diss/200.

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The incorporation of active piezoelectric elements and fluidic components into micro-electromechanical systems (MEMS) is of great interest for the development of sensors, actuators, and integrated systems used in microfluidics. Low temperature cofired ceramics (LTCC), widely used as electronic packaging materials, offer the possibility of manufacturing highly integrated microfluidic systems with complex 3-D features and various co-firable functional materials in a multilayer module. It would be desirable to integrate high performance lead zirconate titanate (PZT) based ceramics into LTCC-based MEMS using modern thick film and 3-D packaging technologies. The challenges for fabricating functional LTCC/PZT devices are: 1) formulating piezoelectric compositions which have similar sintering conditions to LTCC materials; 2) reducing elemental inter-diffusion between the LTCC package and PZT materials in co-firing process; and 3) developing active piezoelectric layers with desirable electric properties. The goal of present work was to develop low temperature fired PZT-based materials and compatible processing methods which enable integration of piezoelectric elements with LTCC materials and production of high performance integrated multilayer devices for microfluidics. First, the low temperature sintering behavior of piezoelectric ceramics in the solid solution of Pb(Zr0.53,Ti0.47)O3-Sr(K0.25, Nb0.75)O3 (PZT-SKN) with sintering aids has been investigated. 1 wt% LiBiO2 + 1 wt% CuO fluxed PZT-SKN ceramics sintered at 900oC for 1 h exhibited desirable piezoelectric and dielectric properties with a reduction of sintering temperature by 350oC. Next, the fluxed PZT-SKN tapes were successfully laminated and co-fired with LTCC materials to build the hybrid multilayer structures. HL2000/PZT-SKN multilayer ceramics co-fired at 900oC for 0.5 h exhibited the optimal properties with high field d33 piezoelectric coefficient of 356 pm/V. A potential application of the developed LTCC/PZT-SKN multilayer ceramics as a microbalance was demonstrated. The final research focus was the fabrication of an HL2000/PZT-SKN multilayer piezoelectric micropump and the characterization of pumping performance. The measured maximum flow rate and backpressure were 450 μl/min and 1.4 kPa respectively. Use of different microchannel geometries has been studied to improve the pumping performance. It is believed that the high performance multilayer piezoelectric devices implemented in this work will enable the development of highly integrated LTCC-based microfluidic systems for many future applications.
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Luo, Jin. "The Development and Biocompatibility of Low Temperature Co-Fired Ceramic (LTCC) for Microfluidic and Biosensor Applications." UKnowledge, 2014. http://uknowledge.uky.edu/cme_etds/30.

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Low temperature co-fired ceramic (LTCC) electronic packaging materials are applied for their electrical and mechanical properties, high reliability, chemical stability and ease of fabrication. Three dimensional features can also be prepared allowing integration of microfluidic channels and cavities inside LTCC modules. Mechanical, optical, electrical, microfluidic functions have been realized in single LTCC modules. For these reasons LTCC is attractive for biomedical microfluidics and Lab-on-a-Chip systems. However, commercial LTCC systems, optimized for microelectrics applications, have unknown cytocompatibility, and are not compatible with common surface functionalization chemistries. The first goal of this work is to develop biocompatible LTCC materials for biomedical applications. In the current work, two different biocompatible LTCC substrate materials are conceived, formulated and evaluated. Both materials are based from well-known and widely utilized biocompatible materials. The biocompatibilities of the developed LTCC materials for in-vitro applications are studied by cytotoxicity assays, including culturing endothelial cells (EC) both in LTCC leachate and directly on the LTCC substrates. The results demonstrate the developed LTCC materials are biocompatible for in-vitro biological applications involving EC. The second goal of this work is to develop functional capabilities in LTCC microfluidic systems suitable for in-vitro and biomedical applications. One proposed application is the evaluation of oxygen tension and oxidative stress in perfusion cell culture and bioreactors. A Clark-type oxygen sensor is successfully integrated with LTCC technique in this work. In the current work, a solid state proton conductive electrolyte is used to integrate an oxygen sensor into the LTCC. The measurement of oxygen concentration in Clark-type oxygen sensor is based on the electrochemical reaction between working electrode and counter electrode. Cyclic voltammetry and chronoamperometry are measured to determine the electrochemical properties of oxygen reduction in the LTCC based oxygen sensor. The reduction current showed a linear relationship with oxygen concentration. In addition, LTCC sensor exhibits rapid response and sensitivity in the physiological range 1─9 mg/L. The fabricated devices have the capabilities to regulate oxygen supply and determination of local dissolved oxygen concentration in the proposed applications including perfusion cell culture and biological assays.
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Ahyoune, Saiyd. "Heterogeneous Integration of RF and Microwave Systems Using Multi-layer Low-Temperature Co-fired Ceramics Technology." Doctoral thesis, Universitat de Barcelona, 2017. http://hdl.handle.net/10803/459117.

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The aim of this work is the development of a modelling methodology for the fast analysis of non-radiative multilayer RF passive components without compromising solution accuracy. Instead of following a compact model approach, oftenly used in integrated technologies, the method is based on a specialized quasi-static partial element equivalent circuit (PEEC) numerical solver. Besides speed and accuracy, the solver can be embedded in circuit simulators; thus, models are already available in the schematic entry. Using this framework, model scalability is enhanced in terms of geometry, substrate cross-section, material properties, topology and boundary conditions. The dissertation starts showing the actual performance of the obtained solver and the motivations beneath its development. Then, the description about solver development is splitted in three parts, but all of them are interrelated. First, the PEEC formulation is adapted according to relevant electromagnetic behaviour of the component. It is worth stressing that a different perspective related to the principle of virtual work is used in this formulation. The second part deals with the evaluation of partial elements, the core of the solver. It is carried out using analytical space-domain close-form solutions of the Green’s function (GF) of the substrate. Partial elements are then assembled into a mesh. Therefore, the importance of the mesh up on solution accuracy is discussed in the last part and a basic layout aware mesh generator is proposed. Practical application of the methodology includes the implementation of a library of RF passives for multilayer substrate. For validation, the chosen substrate is a low temperature co-fired ceramics (LTCC) technology. Different set of devices have been fabricated, characterized and compared against model prediction. In addition, the obtained results are also verified using state-of-the-art electromagnetic solvers.
El objetivo de este trabajo es el desarrollo de una metodología de modelado para el análisis rápido, pero sin comprometer la precisión de la solución, de componentes pasivos no radiativos de RF en substratos multicapa. El método se basa en el algoritmo numérico cuasi-estático de los elementos parciales de circuito equivalente (PEEC). Éste puede ser incorporado en simuladores de circuitos; por tanto, los modelos ya están disponibles en la entrada de esquemático de forma transparente para el diseñador de circuitos. Utilizando este marco, la escalabilidad del modelo se mejora en términos de la geometría, la definición del corte tecnológico, las propiedades del material, la topología del componente y las condiciones de contorno electro-magnéticas. Esta disertación comienza mostrando las motivaciones que han llevado a su desarrollo y la capacidad real del método de resolución obtenido. A partir de aquí, se realiza la descripción de todo el desarrollo del marco numérico que se divide en tres partes que están interrelacionadas. En primer lugar, la formulación PEEC se adapta según el comportamiento electromagnético real del componente. Vale la pena subrayar que en esta formulación se utiliza una perspectiva diferente a la habitual y que está relacionada con el principio de los trabajos virtuales de d’Alembert. La segunda parte trata de cómo se evalúan los elementos parciales y constituye el núcleo principal del algoritmo. Se lleva a cabo utilizando soluciones analíticas de la función de Green (GF) del sustrato en el dominio espacial. Los elementos parciales, que forman la malla numérica del modelo, se ensamblan en la matriz del sistema siguiendo un procedimiento de análisis nodal modificado (MNA). En la última parte, se discute la importancia de la malla sobre la precisión de la solución y se propone un generador de malla basado en la física del componente y no sólo en la descripción de la geometría. Como aplicación práctica de la metodología, se realiza la generación de una biblioteca de componentes pasivos RF para sustratos multicapa.
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Mercke, William L. "Diagnosis of Systemic Inflammation Using Transendothelial Electrical Resistance and Low-Temperature Co-fired Ceramic Materials." UKnowledge, 2013. http://uknowledge.uky.edu/cme_etds/21.

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Systemic inflammation involves a complex array of cytokines that can result in organ dysfunction. Mortality remains high despite the vast amount of research conducted to find an effective biomarker. The cause of systemic inflammation can be broad and non-specific; therefore, this research investigates using transendothelial electrical resistance (TEER) measurements to better define systemic inflammatory response syndrome (SIRS)/sepsis within a patient. Results show a difference in TEER measurements between healthy individuals and SIRS-rated patients. This research also displays correlations between TEER measurements and biomarkers currently studied with systemic inflammation (tumor necrosis factor-α, C- reactive protein, procalcitonin). Furthermore, this research also presents the groundwork for developing a microfluidic cell-based biosensor using low temperature co-fired ceramic materials. An LTCC TEER-based microfluidic device has the potential to aid in a more effective treatment strategy for patients and potentially save lives.
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Bhutani, Akanksha [Verfasser], and T. [Akademischer Betreuer] Zwick. "Low Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHz / Akanksha Bhutani ; Betreuer: T. Zwick." Karlsruhe : KIT-Bibliothek, 2019. http://d-nb.info/119312719X/34.

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Gilham, David Joel. "Packaging of a High Power Density Point of Load Converter." Thesis, Virginia Tech, 2013. http://hdl.handle.net/10919/19325.

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Due to the power requirements for today\'s microprocessors, point of load converter packaging is becoming an important issue.   Traditional thermal management techniques involved in removing heat from a printed circuit board are being tested as today\'s technologies require small footprint and volume from all electrical systems.  While heat sinks are traditionally used to spread heat, ceramic substrates are gaining in popularity for their superior thermal qualities which can dissipate heat without the use of a heat sink.  3D integration techniques are needed to realize a solution that incorporates the active and components together.  The objective of this research is to explore the packaging of a high current, high power density, high frequency DC/DC converter using ceramic substrates to create a low profile converter to meet the needs of current technologies.
    One issue with current converters is the large volume of the passive components.  Increasing the switching frequency to the megahertz range is one way to reduce to volume of these components.  The other way is to fundamentally change the way these inductors are designed.  This work will explore the use of low temperature co-fired ceramic (LTCC) tapes in the magnetic design to allow a low profile planar inductor to be used as a substrate.  LTCC tapes have excellent properties in the 1-10 MHz range that allow for a high permeability, low loss solution.  These tapes are co-fired with a silver paste as the conductor.  This paper looks at ways to reduce dc resistance in the inductor design through packaging methods which in turn allow for higher current operation and better heavy load efficiency.  Fundamental limits for LTCC technologies are pushed past their limits during this work.  This work also explores fabrication of LTCC inductors using two theoretical ideas: vertical flux and lateral flux.  Issues are presented and methods are conceived for both types of designs.  The lateral flux inductor gives much better inductance density which results in a much thinner design.
    It is found that the active devices must be shielded from the magnetic substrate interference so active layer designs are discussed.  Alumina and Aluminum Nitride substrates are used to form a complete 3D integration scheme that gives excellent thermal management even in natural convection.  This work discusses the use of a stacked power technique which embeds the devices in the substrate to give double sided cooling capabilities.  This fabrication goes away from traditional photoresist and solder-masking techniques and simplifies the entire process so that it can be transferred to industry.  Time consuming sputtering and electroplating processes are removed and replaced by a direct bonded copper substrate which can have up to 8 mil thick copper layers allowing for even greater thermal capability in the substrate.  The result is small footprint and volume with a power density 3X greater than any commercial product with comparable output currents.  A two phase coupled inductor version using stacked power is also presented to achieve even higher power density.
    As better device technologies come to the marketplace, higher power density designs can be achieved.  This paper will introduce a 3D integration design that includes the use of Gallium Nitride devices.  Gallium Nitride is rapidly becoming the popular device for high frequency designs due to its high electron mobility properties compared to silicon.  This allows for lower switching losses and thus better thermal characteristics at high frequency.  The knowledge learned from the stacked power processes gives insight into creating a small footprint, high current ceramic substrate design.  A 3D integrated design is presented using GaN devices along with a lateral flux inductor.  Shielded and Non-Shielded power loop designs are compared to show the effect on overall converter efficiency.  Thermal designs and comparisons to PCB are made using thermal imaging.  The result is a footprint reduction of 40% from previous designs and power densities reaching close to 900W/in3.

Master of Science
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Li, Qiang. "Low-Profile Magnetic Integration for High-Frequency Point-of-Load Converter." Diss., Virginia Tech, 2011. http://hdl.handle.net/10919/28637.

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Today, every microprocessor is powered with a Voltage Regulator (VR), which is also known as a high current Point-of-Load converter (POL). These circuits are mostly constructed using discrete components, and populated on the motherboard. With this solution, the passive components such as inductors and capacitors are bulky. They occupy a considerable footprint on the motherboard. The problem is exacerbated with the current trend of reducing the size of all forms of portable computing equipment from laptop to netbook, increasing functionalities of PDA and smart phones. In order to solve this problem, a high power density POL needs to be developed. An integration solution was recently proposed to incorporate passive components, especially magnetic components, with active components in order to realize the needed power density for the POL. Todayâ s discrete VR only has around 100W/in3 power density. The 3D integration concept is widely used for low current integrated POL. With this solution, a very low profile planar inductor is built as a substrate for the active components of the POL. By doing so, the POL footprint can be dramatically saved, and the available space is also fully utilized. This 3D integrated POL can achieve 300-1000W/in3 power density, however, with considerably less current. This might address the needs of small hand-held equipment such as PDA and Smart phone type of applications. It does not, however, meet the needs for such applications as netbook, laptop, desk-top and server applications where tens and hundreds of amperes are needed. So, although the high density integrated POL has been demonstrated at low current level, magnetic integration is still one of the toughest barriers for integration, especially for high current POL. In order to alleviate the intense thirst from the computing and telecom industry for high power density POL, the 3D integration concept needs be extended from low current applications to high current applications. The key technology for 3D integration is the low profile planar inductor design. Before this research, there was no general methodology to analyze and design a low profile planar inductor due to its non-uniform flux distribution, which is totally different as a conventional bulky inductor. A Low Temperature Co-fired Ceramic (LTCC) inductor is one of the most promising candidates for 3D integration for high current applications. For the LTCC inductor, besides the non-uniform flux, it also has non-linear permeability, which makes this problem even more complicated. This research focuses on penetrating modeling and design barriers for planar magnetic to develop high current 3D integrated POL with a power density dramatically higher than todayâ s industry products in the same current level. In the beginning, a general analysis method is proposed to classify different low profile inductor structures into two types according to their flux path pattern. One is a vertical flux type; another one is a lateral flux type. The vertical flux type means that the magnetic flux path plane is perpendicular with the substrate. The lateral flux type means that the magnetic flux path plane is parallel with the substrate. This analysis method allows us to compare different inductor structures in a more general way to reveal the essential difference between them. After a very thorough study, it shows that a lateral flux structure is superior to a vertical flux structure for low profile high current inductor design from an inductance density point of view, which contradicts conventional thinking. This conclusion is not only valid for the LTCC planar inductor, which has very non-linear permeability, but is also valid for the planar inductor with other core material, which has constant permeability. Next, some inductance and loss models for a planar lateral flux inductor with a non-uniform flux are also developed. With the help of these models, different LTCC lateral flux inductor structures (single-turn structure and multi-turn structures) are compared systematically. In this comparison, the inductance density, winding loss and core loss are all considered. The proposed modeling methodology is a valuable extension of previous uniform flux inductor modeling, and can be used to solve other modeling problems, such as non-uniform flux transformer modeling. After that, a design method is proposed for the LTCC lateral flux inductor with non-uniform flux distribution. In this design method, inductor volume, core thickness, winding loss, core loss are all considered, which has not been achieved in previous conventional inductor design methods. With the help of this design method, the LTCC lateral flux inductor can be optimized to achieve small volume, small loss and low profile at the same time. Several LTCC inductor substrates are also designed and fabricated for the 3D integrated POL. Comparing the vertical flux inductor substrate with the lateral flux inductor substrate, we can see a savings of 30% on the footprint, and a much simpler fabrication process. A 1.5MHz, 5V to 1.2V, 15A 3D integrated POL converter with LTCC lateral flux inductor substrate is demonstrated with 300W/in3 power density, which has a factor of 3 improvements when compared to todayâ s industry products. Furthermore, the LTCC lateral flux coupled inductor is proposed to further increase power density of the 3D integrated POL converter. Due to the DC flux cancelling effect, the size of LTCC planar coupled inductor can be dramatically reduced to only 50% of the LTCC planar non-coupled inductor. Compared to previous vertical flux coupled inductor prototypes, a lateral flux coupled inductor prototype is demonstrated to have a 50% core thickness reduction. A 1.5MHz, 5V to 1.2V, 40A 3D integrated POL converter with LTCC lateral flux coupled inductor substrate is demonstrated with 700W/in3 power density, which has a factor of 7 improvements when compared to today's industry POL products in the same current level. In conclusion, this research not only overcame some major academia problems about analysis and design for planar magnetic components, but also made significant contributions to the industry by successfully scaling the integrated POL from today's 1W-5W case to a 40W case. This level of integration would significantly save the cost, and valuable motherboard real estate for other critical functions, which may enable the next technological innovation for the whole computing and telecom industry.
Ph. D.
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Book chapters on the topic "Co-fired ceramics"

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Rabe, Torsten, Markus Eberstein, and Wolfgang A. Schiller. "Low Temperature Co-Fired Ceramics (LTCC) - Design and Characterization of Interfaces." In Ceramic Transactions Series, 173–78. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9781118144145.ch27.

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Bermejo, Raul, Peter Supancic, Clemens Krautgasser, and Robert Danzer. "Evaluation of Subcritical Crack Growth in Low Temperature Co-Fired Ceramics." In Mechanical Properties and Performance of Engineering Ceramics and Composites VIII, 161–72. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2013. http://dx.doi.org/10.1002/9781118807514.ch17.

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Geyer, Richard G., Liang Chai, Aziz Shaikh, and Vern Stygar. "Microwave Properties of Low-Temperature Co-Fired Ceramic Systems." In Ceramic Transactions Series, 261–85. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2012. http://dx.doi.org/10.1002/9781118380802.ch25.

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Sawhill, Howard T. "Materials Compatibility and Co-Sintering Aspects in Low Temperature Co-Fired Ceramic Packages." In Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12, 1603–17. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2008. http://dx.doi.org/10.1002/9780470310519.ch5.

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Mattox, Douglas M., Stephen R. Gurkovich, John A. Olenick, and Keith M. Mason. "Low Dielectric Constant, Alumina-Compatible, Co-Fired Multilayer Substrate." In Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12, 1567–78. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2008. http://dx.doi.org/10.1002/9780470310519.ch2.

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Verma, K. K. "Advantages of Co-Fired Multilayer over Thick Film Technology." In Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12, 1618–28. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2008. http://dx.doi.org/10.1002/9780470310519.ch6.

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Nair, K. M., M. F. McCombs, K. E. Souders, J. M. Parisi, K. H. Hang, D. M. Nair, and S. C. Beers. "DuPontTM Green TapeTM 9K7 Low Temperature Co-fired Ceramic (LTCC) Low Loss Dielectric System for High Frequency Microwave Applications." In Ceramic Transactions Series, 213–29. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2010. http://dx.doi.org/10.1002/9780470930915.ch20.

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Birol, Hansu, Thomas Maeder, Caroline Jacq, Giancarlo Corradini, Marc Boers, Sigfrid Straessler, and Peter Ryser. "Structuration and Fabrication of Sensors Based on LTCC (Low Temperature Co-Fired Ceramic) Technology." In Key Engineering Materials, 1849–52. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-410-3.1849.

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Rane, Vivek, Varsha Chaware, Shrikant Kulkarni, Siddharth Duttagupta, and Girish Phatak. "Materials for Embedded Capacitors, Inductors, Nonreciprocal Devices, and Solid Oxide Fuel Cells in Low Temperature Co-fired Ceramic." In Springer Tracts in Mechanical Engineering, 285–301. New Delhi: Springer India, 2014. http://dx.doi.org/10.1007/978-81-322-1913-2_17.

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Birol, Hansu, Thomas Maeder, and Peter Ryser. "Modification of Thick-Film Conductors Used in IP Technology for Reduction of Warpage during Co-Firing of LTCC (Low Temperature Co-Fired Ceramic) Modules." In Key Engineering Materials, 746–49. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-410-3.746.

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Conference papers on the topic "Co-fired ceramics"

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van Dijk, Raymond, Gijs van der Bent, Mohamed Ashari, and Mark McKay. "Circulator integrated in low temperature co-fired ceramics technology." In 2014 44th European Microwave Conference (EuMC). IEEE, 2014. http://dx.doi.org/10.1109/eumc.2014.6986744.

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van Dijk, Raymond, Gijs van der Bent, Mohamed Ashari, and Mark McKay. "Circulator integrated in low temperature co-fired ceramics technology." In 2014 9th European Microwave Integrated Circuits Conference (EuMIC). IEEE, 2014. http://dx.doi.org/10.1109/eumic.2014.6997928.

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Moilanen, Ville, Kari Kautio, Pentti Karioja, Raimo Rikola, Jarmo Lehtomaa, and Jouko Malinen. "Low temperature co-fired ceramics on optoelectronic sensors integration." In International Congress on Optics and Optoelectronics, edited by Francesco Baldini, Jiri Homola, Robert A. Lieberman, and Miroslav Miler. SPIE, 2007. http://dx.doi.org/10.1117/12.724158.

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Stekovic, Michal, and Josef Sandera. "Fabrication of electrochemical sensor in Low Temperature Co-fired Ceramics." In 2014 37th ISSE International Spring Seminar in Electronics Technology (ISSE). IEEE, 2014. http://dx.doi.org/10.1109/isse.2014.6887567.

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Qassym, L., V. Laur, R. Lebourgcois, and P. Queffelec. "Ferrimagnetic garnets for Low Temperature Co-fired Ceramics microwave circulators." In 2018 IEEE/MTT-S International Microwave Symposium - IMS 2018. IEEE, 2018. http://dx.doi.org/10.1109/mwsym.2018.8439250.

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Ochi, Atsuhiko, Hikaru Setsuda, Kazuki Komiya, and Yoko Takeuchi. "Development of Micro Pixel Chamber using Low Temperature Co-fired Ceramics." In 2019 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC). IEEE, 2019. http://dx.doi.org/10.1109/nss/mic42101.2019.9059907.

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Lu, A. G., and T. Qiu. "Sintering and dielectric properties of CaO-B2O3-SiO2 low temperature co-fired ceramics." In 2008 International Conference on Microwave and Millimeter Wave Technology (ICMMT). IEEE, 2008. http://dx.doi.org/10.1109/icmmt.2008.4540394.

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Parker, Norbert, Nicolas Ryon, Lilia Qassym, Richard Lebourgeois, Gerard Cibien, Camilla Karnfelt, Vincent Laur, Vincent Castel, and Rose-Marie Sauvage. "Ku-Band Microstrip Junction Circulators Manufactured using Low Temperature Co-fired Ceramics Technology." In 2022 Asia-Pacific Microwave Conference (APMC). IEEE, 2022. http://dx.doi.org/10.23919/apmc55665.2022.10000006.

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Elelimy, A. M., and A. G. Sobih. "Multilayer tri-band BPF embedded in low temperature co-fired ceramics for modern wireless applications." In 2014 31st National Radio Science Conference (NRSC). IEEE, 2014. http://dx.doi.org/10.1109/nrsc.2014.6835086.

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Kaneko, Takuya, Shogo Takagi, Risa Matsubara, and Yasushi Horii. "A compact Mobius ring bandpass filter embedded in low-temperature co-fired ceramics (LTCC) substrate." In 2012 Asia Pacific Microwave Conference (APMC). IEEE, 2012. http://dx.doi.org/10.1109/apmc.2012.6421649.

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Reports on the topic "Co-fired ceramics"

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Moll, Amy J., Judi Steciak, and Donald G. Plumlee. Micro-Propulsion Devices in Low Temperature Co-Fired Ceramics. Fort Belvoir, VA: Defense Technical Information Center, February 2009. http://dx.doi.org/10.21236/ada495405.

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Uribe, Fernando R., Alice C. Kilgo, John Mark Grazier, Paul Thomas Vianco, Gary L. Zender, Paul Frank Hlava, and Jerome Andrew Rejent. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates. Office of Scientific and Technical Information (OSTI), September 2008. http://dx.doi.org/10.2172/942186.

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Uribe, Fernando, Paul Thomas Vianco, and Gary L. Zender. Pull strength evaluation of Sn-Pb solder joints made to Au-Pt-Pd and Au thick film structures on low-temperature co-fired ceramic -final report for the MC4652 crypto-coded switch (W80). Office of Scientific and Technical Information (OSTI), June 2006. http://dx.doi.org/10.2172/887252.

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