Academic literature on the topic 'CIP failure'

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Journal articles on the topic "CIP failure"

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Prandoni, P., A. W. A. Lensing, H. R. Büller, M. Carta, M. Vigo, A. Cogo, S. Cuppini, and J. W. ten Cate. "Failure of Computerized Impedance Plethysmography in the Diagnostic Management of Patients with Clinically Suspected Deep-Vein Thrombosis." Thrombosis and Haemostasis 65, no. 03 (1991): 233–36. http://dx.doi.org/10.1055/s-0038-1647490.

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SummaryBefore a new diagnostic modality can be introduced in clinical medicine, the validity of both a normal and abnormal test result have to be assessed prospectively in an appropriate patient group. We have evaluated the clinical validity of. a new computerized impedance plethysmography (CIP) in the diagnostic management of 381 consecutive patients with clinically suspected venous thrombosis. In patients with serially normal CIP results, the diagnosis of venous thrombosis was refuted and, consequently, they were not treated with anticoagulant therapy and all were followed up for a period of 6 months to estimate the occurrence of symptomatic venous thromboembolism.The study was prematurely terminated by the safety monitoring committee because of an unacceptably high incidence of confirmed venous thromboembolism (10 patients, 3.2%; 95% confidence interval: 1.6% to 6%), including 4 episodes of fatal pulmonary embolism. In a subsequent explanatory study using ultrasonography in 29 other symptomatic patients who had at least 2 repeated normal CIP test results, the failure of CIP to detect proximal vein thrombosis was confirmed in 4 patients (14%). The reasons for this failure are probably related to the use of a modified device to measure impedance in the CIP apparatus, resulting in a lower ability to separate patients without venous thrombosis from those with the disease.We concluded that CIP is insensitive for the detection of proximal vein thrombosis and, therefore, not clinically useful in the diagnostic management of patients with suspected venous thrombosis.
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Lyu, Li-Hua, Wen-Di Liu, and Bao-Zhong Sun. "Electromagnetic Wave-Absorbing and Bending Properties of Three-Dimensional Honeycomb Woven Composites." Polymers 13, no. 9 (May 5, 2021): 1485. http://dx.doi.org/10.3390/polym13091485.

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To avoid the delamination of the traditional three-dimensional (3-D) honeycomb electromagnetic (EM) absorbing composites and improving the defects of low mechanical properties, the 3-D honeycomb woven fabrics were woven on the ordinary loom by practical design. The fabrication of 3-D honeycomb woven EM absorbing composites was based on carbon black/carbonyl iron powder/basalt fiber/carbon fiber/epoxy resin (CB/CIP/BF/CF/EP) by the vacuum-assisted resin transfer molding (VARTM) process. A CB/CIP composite absorbent study showed that CB/CIP composite absorbent belongs to a magnetic loss type absorbent. Adding CB/CIP significantly improved the absorption performance of composite, increased the absorption peak and the effective absorption bandwidth (EAB), but the bending performance decreased. The normalization analysis results showed that when the thickness was 15 mm, the mechanical properties and EM wave-absorbing properties of the 3-D honeycomb woven composite were the best matches. The morphological characteristics and displacement load curves of the composite after fracture were analyzed. The bending failure modes were brittle fracture of the fiber bundle, matrix cracking, and typical shear failure. Despite the above failure mechanism, the 3-D honeycomb woven EM absorbing composites still has good integrity without delamination.
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Wang, Guang Feng, and Tian Yu Wang. "Technology Research on Technical Innovation and Troubleshooting of Beer Production Equipment." Applied Mechanics and Materials 556-562 (May 2014): 6650–52. http://dx.doi.org/10.4028/www.scientific.net/amm.556-562.6650.

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This paper analyzes the shortcomings of traditional CIP cleaning and causes, proposing an improved method for CIP cleaning. It gives a general theoretical and practical discussion on production quality and efficiency of the weak links including squeezing bottles, conveyor’s recurring breakage, bottle washing machine frequently clogged and filter brewer's failure, etc..., which is of strong guidance in practice , appropriateness, effectiveness .
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Shepherd, Starane, Ayush Batra, and David P. Lerner. "Review of Critical Illness Myopathy and Neuropathy." Neurohospitalist 7, no. 1 (September 19, 2016): 41–48. http://dx.doi.org/10.1177/1941874416663279.

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Critical illness myopathy (CIM) and neuropathy are underdiagnosed conditions within the intensive care setting and contribute to prolonged mechanical ventilation and ventilator wean failure and ultimately lead to significant morbidity and mortality. These conditions are often further subdivided into CIM, critical illness polyneuropathy (CIP), or the combination—critical illness polyneuromyopathy (CIPNM). In this review, we discuss the epidemiology and pathophysiology of CIM, CIP, and CIPNM, along with diagnostic considerations such as detailed clinical examination, electrophysiological studies, and histopathological review of muscle biopsy specimens. We also review current available treatments and prognosis. Increased awareness and early recognition of CIM, CIP, and CIPNM in the intensive care unit setting may lead to earlier treatments and rehabilitation, improving patient outcomes.
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Mohd Shahar, Siti Fatimah, Saiful Amri Mazlan, Norhasnidawani Johari, Mohd Aidy Faizal Johari, Siti Aishah Abdul Aziz, Muntaz Hana Ahmad Khairi, Nur Azmah Nordin, and Norhiwani Mohd Hapipi. "Mechanical Properties and Microstructural Behavior of Uniaxial Tensile-Loaded Anisotropic Magnetorheological Elastomer." Actuators 11, no. 11 (October 26, 2022): 306. http://dx.doi.org/10.3390/act11110306.

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Magnetorheological elastomers (MREs) are well-known for their ability to self-adjust their mechanical properties in response to magnetic field influence. This ability, however, diminishes under high-strain conditions, a phenomenon known as the stress-softening effect. Similar phenomena have been observed in other filled elastomers; hence, the current study demonstrates the role of fillers in reducing the effect and thus maintaining performance. Anisotropic, silicone-based MREs with various carbonyl iron particle (CIP) concentrations were prepared and subjected to uniaxial tensile load to evaluate high-strain conditions with and without magnetic influence. The current study demonstrated that non-linear stress–strain behavior was observed in all types of samples, which supported the experimental findings. CIP concentration has a significant impact on the stress–strain behavior of MREs, with about 350% increased elastic modulus with increasing CIP content. Microstructural observations using field emission scanning electron microscopy (FESEM) yielded novel micro-mechanisms of the high-strain failure process of MREs. The magnetic force applied during tension loading was important in the behavior and characteristics of the MRE failure mechanism, and the discovery of microcracks and microplasticity, which was never reported in the MRE quasi-static tensile, received special attention in this study. The relationships between these microstructural phenomena, magnetic influence, and MRE mechanical properties were defined and discussed thoroughly. Overall, the process of microcracks and microplasticity in the MRE under tensile mode was primarily formed in the matrix, and the formation varies with CIP concentrations.
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Chen, Robert. "Electrophysiological Studies in the Critical Care Unit: Investigating Polyneuropathies." Canadian Journal of Neurological Sciences / Journal Canadien des Sciences Neurologiques 25, S1 (February 1998): S32—S35. http://dx.doi.org/10.1017/s0317167100034703.

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AbstractPolyneuropathies frequently contribute to ventilator dependency and prolonged stay in the intensive care unit. As clinical examination is often limited in critically ill patients, electrophysiological studies are invaluable in establishing the diagnosis of neuropathy, determining its pathophysiology, severity and in following the patients' progression. Guillain-Barré syndrome (GBS) developing before intensive care unit admission and critical illness polyneuropathy (CIP) developing as a complication of sepsis and multiorgan failure are the commonest causes of neuropathy. Electrophysiological findings in CIP are that of an axonal neuropathy whereas the findings in GBS are usually consistent with a demyelinating neuropathy. Axonal GBS can be distinguished from CIP by the preceding illnesses, slow nerve conduction velocity in some cases, lack of spontaneous activity on the initial needle electromyographic study and cerebrospinal fluid findings.
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Yang, Meng, Yanmin Jia, and Dongwei Liang. "Shaking Table Tests and Simulations of Grouting Sleeve Connecting Prefabricated Bridge Piers." Symmetry 14, no. 4 (March 23, 2022): 652. http://dx.doi.org/10.3390/sym14040652.

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To investigate the seismic performance of prefabricated piers with a grouting sleeve connection, two scaled model specimens of symmetrical prefabricated piers with different reinforcement anchorage lengths, and two cast-in-place (CIP) comparison symmetrical specimens, were designed and manufactured. The fabricated specimens were connected by a grouting sleeve, which was in the column of the pier. The height of the pier column of the test piece was 1.425 m, the diameter of the pier column was 0.25 m, and the size of the bearing platform was 0.85 m × 0.85 m × 0.5 m. Shake table tests were performed on the specimens to evaluate crack development, dynamic characteristics, acceleration response and relative displacement of the pier tops, as well as strain in the plastic hinge area. The results revealed the dominant failure mode of the test piers was bending failure, while the cracks were generally horizontal through-cracks. The failure location of the prefabricated specimens with the grouting sleeve was concentrated within one diameter of the pier in the upper sleeve region. Compared with the CIP specimens, the plastic hinge exhibited an obvious upward movement. Under a maximum test loading condition, the peak acceleration at the pier top of the fabricated pier was 11.0% smaller than that of the CIP specimen, the peak relative displacement was 34.2% smaller than that of the CIP specimen, and the peak tensile strain of the pier body was 46.8% smaller. The seismic performance of the prefabricated pier connected via the grouting sleeves was barely affected by changing the anchoring length of the reinforcements in the grouting sleeves. An ABAQUS finite element model was established for the specimens, with good agreement between the model and experimental results. When the seismic load was 0.65 g, the difference between the peak acceleration of the pier top in the X direction and the Y direction of the numerical simulation and the experimental data was less than 15%.
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Khosravi, S., S. Jafari, H. Zamani, and M. Nilkar. "Synergistic antimicrobial effects of atmospheric pressure non-thermal argon plasma and ciprofloxacin antibiotic against multi-drug resistant P. aeruginosa biofilm." Journal of Applied Physics 131, no. 21 (June 7, 2022): 213301. http://dx.doi.org/10.1063/5.0091001.

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Bacterial biofilm formation is regarded as the major cause of infection development, therapeutic failure, and antibiotic resistance. This study aimed to assess the synergistic antibiofilm potential of an atmospheric-pressure non-thermal argon plasma and ciprofloxacin (Cip) against multi-drug-resistant Pseudomonas aeruginosa. Bacterial biofilms were pre-treated with the non-thermal Ar-plasma and subsequently treated with Cip antibiotic. Then, the bacterial biofilm formation level and cell viability were investigated using crystal violet staining, 3-(4,5-dimethylthiazol-2-yl)-2,5-diphenyl-2H-tetrazolium bromide, SEM, and fluorescence microscopy, respectively. It was found that a short-time (a few seconds) pretreating with Ar-plasma not only reduced bacterial biofilm formation but also significantly decreased the viability of the cells within the biofilm matrix. According to the results, treating with Cip alone reduced bacterial biofilms by 32%, while pretreatment with Ar-plasma for 5, 10, 30, 60, and 90 s and subsequent treatment with Cip reduced bacterial biofilms by 76%, 79%, 81%, 75%, and 88%, respectively. In addition, the viability of bacterial cells within the biofilm matrix reduced to 66% in Cip treated cells, while pretreating with Ar-plasma for 5, 10, 30, 60, and 90 s and then treating with Cip significantly decreased cell viability to 28%, 25%, 21%, 23%, and 15%, respectively. This concept opens a promising approach for the treatment of drug-resistant bacteria for decontamination of heat-sensitive materials and human tissues based on the combination of atmospheric-pressure non-thermal Ar-plasma and antibiotics.
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Latronico, Nicola, Frank A. Rasulo, Daniela Recupero, Andrea Beindorf, Paolo Liberini, Roberto Stefini, and Andrea Candiani. "Acute quadriplegia with delayed onset and rapid recovery." Journal of Neurosurgery 88, no. 4 (April 1998): 769–72. http://dx.doi.org/10.3171/jns.1998.88.4.0769.

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✓ The authors describe a patient with severe head injury and sepsis who became acutely quadriplegic 3 days postinjury because of a critical illness polyneuropathy (CIP) and critical illness myopathy (CIM), which resolved rapidly after treatment of the underlying infection. In only 3 days the patient developed septic shock together with flaccid quadriplegia and absent deep tendon reflexes with no clinical or radiological evidence of central nervous system deterioration. Neurophysiological studies showed an acute axonal sensorimotor polyneuropathy, whereas the clinical course strongly suggested a concurrent myopathy. A severe Staphylococcus epidermidis infection accompanied by bacteremia was treated and the patient recovered fully within a few days. Although the case described here is unique because of its very early onset and rapid resolution, CIP and CIM are frequent complications of sepsis and multiple organ failure. The authors suggest that severely head injured patients with sepsis should be evaluated for CIP and CIM when presenting with unexplained muscle weakness or paralysis.
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Kim, Bongyoung, Taul Cheong, and Jungmo Ahn. "How Does Antimicrobial Resistance Increase Medical Costs in Community-Acquired Acute Pyelonephritis?" Antimicrobial Stewardship & Healthcare Epidemiology 1, S1 (July 2021): s23. http://dx.doi.org/10.1017/ash.2021.42.

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Background: The proportion of antimicrobial-resistant Enterobacterales that are causative pathogens for community-acquired acute pyelonephritis (CA-APN) has been increasing. We examined the effect of antimicrobial resistance on medical costs in CA-APN. Methods: A single-center retrospective cohort study was conducted at a tertiary-care hospital in Korea between January 2018 to December 2019. All hospitalized patients aged ≥19 years who were diagnosed with CA-APN were recruited, and those with Enterobacterales as a causative pathogen were included. Comparisons between CA-APN caused by extended-spectrum β-lactamase (ESBL)–producing pathogens (ESBL+ group) and those by non–ESBL-producing organisms (ESBL– group) as well as CA-APN caused by ciprofloxacin-resistant pathogens (CIP-R group) and those by ciprofloxacin-sensitive pathogens (CIP-S group) were performed. Log-linear regression was performed to determine the risk factors for medical costs. Results: In total, 241 patients were included in this study. Of these, 75 (31.1%) had an ESBL-producing pathogen and 87 (36.1%) had a ciprofloxacin-resistant pathogen. The overall medical costs were significantly higher in the ESBL+ group compared with the ESBL− group (US$3,730.18 vs US$3,119.32) P <0.001) as well as in CIP-R group compared with CIP-S group (3,730.18 USD vs. 3,119.32 USD, P =0.005). In addition, length of stay was longer in ESBL+ group compared with ESBL-group (11 vs. 8 days, P <0.001) as well as in CIP-R group compared with CIP-S group (11 vs. 8 days, P <0.001). There were no significant difference in the proportion of clinical failure between ESBL+ and ESBL- groups; CIP-R and CIP-S groups. Based on the log-linear regression model, the costs associated with ESBL-producing Enterobacterales as the causative pathogen would be, on average, 27% higher or US$1,211 higher than its counterpart (P = .026). By the same token, a patient who is a year older would incur US$23 higher cost (P = .040). Having any structural problem in urinary tract would incur US$1,231 higher cost (P = .015). A unit increase in Pitt score would incur US$767 USD higher cost (P < 0.001) higher cost, all other things constant. Conclusions: Medical costs for hospitalized patients with CA-APN are increased by the existence of ESBL-producing Enterobacterales but not by the existence of ciprofloxacin-resistant Enterobacterales.Funding: NoDisclosures: None
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Dissertations / Theses on the topic "CIP failure"

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Michel, Kenan. "Failure Behaviour of Masonry under Compression Based on Numerical and Analytical Modeling." Doctoral thesis, Saechsische Landesbibliothek- Staats- und Universitaetsbibliothek Dresden, 2017. http://nbn-resolving.de/urn:nbn:de:bsz:14-qucosa-191765.

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In this work the compression behavior of masonry was investigated. After a detailed review of code approaches and different research works, a new formula was suggested to describe the compression strength of masonry, based on the mechanical and geometrical properties of its components, when deformation properties of units are larger than the ones of mortar. Later on, a new model, Extended Drucker-Prager Cap Yielding Function, is suggested to describe the three axial compression stress state of mortar in masonry in case deformation properties of mortar are larger than the ones of mortar, and to describe the three axial compression stress state of brick in the other case. This includes defining its parameters based on test diagrams of the mortar material, implementing the model in the numerical software ANSYS, and the numerical results are evaluated for simple cube example. The controlling equations of creep based on the visco-elastic creep theory are presented in the general case of three axial creep under three axial loading conditions. The special case of three axial creep under axial loading is also presented. The “transversal creep” relevant for the compression strength of masonry was discussed and numerical examples have been added to show the effect of changed time-dependent Poisson’s ratio. In another chapter, many examples are presented showing the application of the suggested material models and discontinuous numerical method named eXtended finite element method. Conclusions and recommendations are given in the last chapter.
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Muncy, Jennifer V. "Predictive Failure Model for Flip Chip on Board Component Level Assemblies." Diss., Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/5131.

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Environmental stress tests, or accelerated life tests, apply stresses to electronic packages that exceed the stress levels experienced in the field. In theory, these elevated stress levels are used to generate the same failure mechanisms that are seen in the field, only at an accelerated rate. The methods of assessing reliability of electronic packages can be classified into two categories: a statistical failure based approach and a physics of failure based approach. This research uses a statistical based methodology to identify the critical factors in reliability performance of a flip chip on board component level assembly and a physics of failure based approach to develop a low cycle strain based fatigue equation for flip chip component level assemblies. The critical factors in determining reliability performance were established via experimental investigation and their influence quantified via regression analysis. This methodology differs from other strain based fatigue approaches because it is not an empirical fit to experimental data; it utilizes regression analysis and least squares to obtain correction factors, or correction functions, and constants for a strain based fatigue equation, where the total inelastic strain is determined analytically. The end product is a general flip chip on board equation rather than one that is specific to a certain test vehicle or material set.
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Tsai, Wen-Kai Mike. "High yield flip chip processing and failure mode analysis for surface mount applications." Thesis, Georgia Institute of Technology, 2000. http://hdl.handle.net/1853/17063.

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Beckler, Matthew Layne. "On-Chip Diagnosis of Generalized Delay Failures using Compact Fault Dictionaries." Research Showcase @ CMU, 2017. http://repository.cmu.edu/dissertations/906.

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Integrated Circuits (ICs) are an essential part of nearly every electronic device. From toys to appliances, spacecraft to power plants, modern society truly depends on the reliable operation of billions of ICs around the world. The steady shrinking of IC transistors over past decades has enabled drastic improvements in IC performance while reducing area and power consumption. However, with continued scaling of semiconductor fabrication processes, failure sources of many types are becoming more pronounced and are increasingly affecting system operation. Additionally, increasing variation during fabrication also increases the difficulty of yielding chips in a cost-effective manner. Finally, phenomena such as early-life and wear-out failures pose new challenges to ensuring robustness. One approach for ensuring robustness centers on performing test during run-time, identifying the location of any defects, and repairing, replacing, or avoiding the affected portion of the system. Leveraging the existing design-for-testability (DFT) structures, thorough tests that target these delay defects are applied using the scan logic. Testing is performed periodically to minimize user-perceived performance loss, and if testing detects any failures, on-chip diagnosis is performed to localize the defect to the level of repair, replacement, or avoidance. In this dissertation, an on-chip diagnosis solution using a fault dictionary is described and validated through a large variety of experiments. Conventional fault dictionary approaches can be used to locate failures but are limited to simplistic fail behaviors due to the significant computational resources required for dictionary generation and memory storage. To capture the misbehaviors expected from scaled technologies, including early-life and wear-out failures, the Transition-X (TRAX) fault model is introduced. Similar to a transition fault, a TRAX fault is activated by a signal level transition or glitch, and produces the unknown value X when activated. Recognizing that the limited options for runtime recovery of defective hardware relax the conventional requirements for defect localization, a new fault dictionary is developed to provide diagnosis localization only to the required level of the design hierarchy. On-chip diagnosis using such a hierarchical dictionary is performed using a new scalable hardware architecture. To reduce the computation time required to generate the TRAX hierarchical dictionary for large designs, the incredible parallelism of graphics processing units (GPUs) is harnessed to provide an efficient fault simulation engine for dictionary construction. Finally, the on-chip diagnosis process is evaluated for suitability in providing accurate diagnosis results even when multiple concurrent defects are affecting a circuit.
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Mohammadi, Panah Mahshid. "Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies." Thesis, Blekinge Tekniska Högskola, Institutionen för maskinteknik, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:bth-10918.

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Oh, Yoonchan. "Multi-physics investigation on the failure mechanism and short-time scale wave motion in flip-chip configuration." Texas A&M University, 2004. http://hdl.handle.net/1969.1/2719.

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The demands for higher clock speeds and larger current magnitude in high-performance flip-chip electronic packaging configurations of small footprint have inevitably raised the concern over rapid thermal transients and large thermal spatial gradients that could severely compromise package performance. Coupled electrical-thermal-mechanical multi-physics were explored to evaluate the concern and to establish the knowledge base necessary for improving flip-chip reliability. It was found that within the first few hundred nanoseconds upon power-on, there were fast attenuating, dispersive shock waves of extremely high frequency propagating in the package. The notions of high cycle fatigue, power density and joint time-frequency analysis were employed to characterize the waves and the various failure modes associated with the moving of these short-lived dynamical disturbances in bulk materials and along interfaces. A qualitative measure for failure was also developed which enables the extent of damages inflicted by short-time wave propagation to be calculated in the probability sense. Failure modes identified in this study are all in agreement with what have been observed in industry. This suggests that micron cracks or interfacial flaws initiated at the short-time scale would be further propagated by the CTE-induced thermal stresses at the long-time scale and result in eventual electrical disruptions. Although epoxy-based underfills with fillers were shown to be effective in alleviating thermal stresses and improving solder joint fatigue performance in thermal cycling tests of long-time scale, underfill material viscoelasticity was found to be insignificant in attenuating short-time scale wave propagation. On the other hand, the inclusion of Cu interconnecting layers in flip-chips was shown to perform significantly better than Al layers in suppressing short-time scale effects. These results imply that, if improved flip-chip reliability is to be achieved, all packaging constituent materials need to be formulated to have well-defined short-time scale and long-time scale properties. In addition, the results also suggest that the composition and layout of all packaging components be optimized to achieve discouraging or suppressing short-time scale dynamic effects. In summary, results reported herein and numerical procedures developed for the research would not just render higher packaging manufacturing yield, but also bring out significant impact on packaging development, packaging material formulation and micro-circuit layout design.
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Tambara, Lucas Antunes. "Analyzing the Impact of Radiation-induced Failures in All Programmable System-on-Chip Devices." reponame:Biblioteca Digital de Teses e Dissertações da UFRGS, 2017. http://hdl.handle.net/10183/164461.

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O recente avanço da indústria de semicondutores tem possibilitado a integração de componentes complexos e arquiteturas de sistemas dentro de um único chip de silício. Atualmente, FPGAs do estado da arte incluem, não apenas a matriz de lógica programável, mas também outros blocos de hardware, como processadores de propósito geral, blocos de processamento dedicado, interfaces para vários periféricos, estruturas de barramento internas ao chip, e blocos analógicos. Estes novos dispositivos são comumente chamados de Sistemasem-Chip Totalmente Programáveis (APSoCs). Uma das maiores preocupações acerca dos efeitos da radiação em APSoCs é o fato de que erros induzidos pela radiação podem ter diferente probabilidade e criticalidade em seus blocos de hardware heterogêneos, em ambos os níveis de dispositivo e projeto. Por esta razão, este trabalho realiza uma investigação profunda acerca dos efeitos da radiação em APSoCs e da correlação entre a sensibilidade de recursos de hardware e software na performance geral do sistema. Diversos experimentos estáticos e dinâmicos inéditos foram realizados nos blocos de hardware de um APSoC a fim de melhor entender as relações entre confiabilidade e performance de cada parte separadamente. Os resultados mostram que há um comprometimento a ser analisado entre o desempenho e a área de choque de um projeto durante o desenvolvimento de um sistema em um APSoC. Desse modo, é fundamental levar em consideração cada opção de projeto disponível e todos os parâmetros do sistema envolvidos, como o tempo de execução e a carga de trabalho, e não apenas a sua seção de choque. Exemplificativamente, os resultados mostram que é possível aumentar o desempenho de um sistema em até 5.000 vezes com um pequeno aumento na sua seção de choque de até 8 vezes, aumentando assim a confiabilidade operacional do sistema. Este trabalho também propõe um fluxo de análise de confiabilidade baseado em injeções de falhas para estimar a tendência de confiabilidade de projetos somente de hardware, de software, ou de hardware e software. O fluxo objetiva acelerar a procura pelo esquema de projeto com a melhor relação entre performance e confiabilidade dentre as opções possíveis. A metodologia leva em consideração quatro grupos de parâmetros, os quais são: recursos e performance; erros e bits críticos; medidas de radiação, tais como seções de choque estáticas e dinâmicas; e, carga de trabalho média entre falhas. Os resultados obtidos mostram que o fluxo proposto é um método apropriado para estimar tendências de confiabilidade de projeto de sistemas em APSoCs antes de experimentos com radiação.
The recent advance of the semiconductor industry has allowed the integration of complex components and systems’ architectures into a single silicon die. Nowadays, state-ofthe-art FPGAs include not only the programmable logic fabric but also hard-core parts, such as hard-core general-purpose processors, dedicated processing blocks, interfaces to various peripherals, on-chip bus structures, and analog blocks. These new devices are commonly called of All Programmable System-on-Chip (APSoC) devices. One of the major concerns about radiation effects on APSoCs is that radiation-induced errors may have different probability and criticality in their heterogeneous hardware parts at both device and design levels. For this reason, this work performs a deep investigation about the radiation effects on APSoCs and the correlation between hardware and software resources sensitivity in the overall system performance. Several static and dynamic experiments were performed on different hardware parts of an APSoC to better understand the trade-offs between reliability and performance of each part separately. Results show that there is a trade-off between design cross section and performance to be analyzed when developing a system on an APSoC. Therefore, today it is mandatory to take into account each design option available and all the parameters of the system involved, such as the execution time and the workload of the system, and not only its cross section. As an example, results show that it is possible to increase the performance of a system up to 5,000 times by changing its architecture with a small impact in cross section (increase up to 8 times), significantly increasing the operational reliability of the system. This work also proposes a reliability analysis flow based on fault injection for estimating the reliability trend of hardware-only designs, software-only designs, and hardware and software co-designs. It aims to accelerate the search for the design scheme with the best trade-off between performance and reliability among the possible ones. The methodology takes into account four groups of parameters, which are the following: area resources and performance; the number of output errors and critical bits; radiation measurements, such as static and dynamic cross sections; and, Mean Workload Between Failures. The obtained results show that the proposed flow is a suitable method for estimating the reliability trend of system designs on APSoCs before radiation experiments.
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Weiss, Alexander. "Effiziente externe Beobachtung von CPU-Aktivitäten auf SoCs." Doctoral thesis, Saechsische Landesbibliothek- Staats- und Universitaetsbibliothek Dresden, 2015. http://nbn-resolving.de/urn:nbn:de:bsz:14-qucosa-184227.

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Die umfassende Beobachtbarkeit von System‐on‐Chips (SoCs) ist eine wichtige Voraussetzung für das effiziente Testen und Debuggen eingebetteter Systeme. Ausgehend von einer Analyse verschiedener Anwendungsfälle ergibt sich ein Katalog von Anforderungen an die Beobachtbarkeit von SoCs. Ein wichtiges Kriterium ist hier die Vollständigkeit der Beobachtung und umfasst die Aktivitäten der CPU (ausgeführte Instruktionen, gelesene und geschriebene Daten, Verhalten des Caches, Ausführungszeiten), des Bussystems und von Umgebungsbedingungen. Weitere Kriterien sind die Echtzeitfähigkeit und die Kontinuität der Beobachtung sowie die gleichzeitige Durchführung verschiedener Beobachtungsaufgaben. Dabei soll es zu einer möglichst geringen Beeinflussung des SoCs kommen. Weitere wichtige Aspekt sind die Kosten der Lösung, die Universalität, die Skalierbarkeit sowie die Latenz der Verfügbarkeit der Beobachtungsergebnisse. Für viele Anwendungen, besonders in sicherheitskritischen Bereichen, muss zudem nachgewiesen werden, dass das Beobachtungsverfahren kein Fehlverhalten des SoCs bewirkt bzw. ein solches maskiert. Eine besondere Herausforderung stellen Multiprozessor‐SoCs (MPSoCs) dar, da hier die Kommunikation zwischen den einzelnen CPUs im Inneren des SoC stattfindet und entsprechend schwierig für einen externen Bobachter sichtbar zu machen ist. Der Stand der Technik zur Beobachtung von SoCs wird im Wesentlichen durch zwei Verfahren dargestellt. Bei der Software‐Instrumentierung wird zum funktionalen Programmcode zusätzlicher Code hinzugefügt, welcher zur Beobachtung des Programms dient. Diese Methode ist einfach und universell anwendbar, erfüllt aber die genannten Kriterien nur sehr eingeschränkt. Nachteilig ist hier der Ressourcenverbrauch im Falle des Verbleibs der Instrumentierung im fertigen Produkt. Wird die Instrumentierung nur temporär dem Code hinzugefügt, muss sichergestellt werden, dass das Beobachtungsergebnis auch für den finalen Code anwendbar ist – was besonders bei ressourcen‐abhängigen Integrationstests nur schwierig erfüllbar ist. Eine alternative Lösung stellt eine spezielle Hardware‐Unterstützung in SoCs („embedded Trace“) dar. Hier werden im SoC Zustandsinformationen (z.B. Taskwechsel, ausgeführte Instruktionen, Datentransfers) gesammelt und mittels Trace‐Nachrichten an den Beobachter übermittelt. Dabei stellt die Bandbreite, die zur Ausgabe der Trace‐Nachrichten vom SoC verfügbar ist, ein entscheidendes Nadelöhr dar ‐ im SoC sind viel mehr den Beobachter interessierende Informationen verfügbar als nach außen transferiert werden können. Damit haben beide dem gegenwärtige Stand der Technik entsprechende Beobachtungsverfahren eine Reihe von Einschränkungen, die sich besonders bei der Vollständigkeit der Beobachtung, der Flexibilität, der Kontinuität und der Unterstützung von MPSoCs zeigen. In dieser Arbeit wird nun ein neuer Ansatz vorgestellt, welcher gegenüber dem Stand der Technik in einigen Bereichen deutliche Verbesserungen bietet. Dabei werden die Trace‐Daten nicht vom zu beobachtenden SoC direkt, sondern aus einer parallel mitlaufenden Emulation gewonnen. Die Bandbreite der für die Synchronisation der Emulation erforderlichen Daten ist in vielen Fällen deutlich geringer als bei der Ausgabe von umfassenden Trace‐Nachrichten mittels „embedded Trace“‐Lösungen. Gleichzeitig ist eine vollständige, äußerst detaillierte Beobachtung der Vorgänge innerhalb des SoC möglich. Das neue Beobachtungsverfahren wurde mittels verschiedener FPGA-basierter Implementierungen evaluiert, hier konnte auch die Anwendbarkeit für MPSoCs gezeigt werden.
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Gamal, Wesam. "Real-time bioimpedance measurements of stem cellbased disease models-on-a-chip." Thesis, University of Edinburgh, 2016. http://hdl.handle.net/1842/20444.

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In vitro disease models are powerful platforms for the development of drugs and novel therapies. Stem-cell based approaches have emerged as cutting-edge tools in disease modelling, allowing for deeper insights into previously unknown disease mechanisms. Hence the significant role of these disease-in-a-dish methods in therapeutics and translational medicine. Impedance sensing is a non-invasive, quantitative technique that can monitor changes in cellular behaviour and morphology in real-time. Bioimpedance measurements can be used to characterize and evaluate the establishment of a valid disease model, without the need for invasive end-point biochemical assays. In this work, two stem cell-based disease models-on-a-chip are proposed for acute liver failure (ALF) and age-related macular degeneration (AMD). The ALF disease model-on-a-chip integrates impedance sensing with the highly-differentiated HepaRG cell line to monitor in real-time quantitative and dynamic response to various hepatotoxins. Bioimpedance analysis and modelling has revealed an unknown mechanism of paracetamol hepatotoxicity; a temporal, dose-dependent disruption of tight junctions (TJs) and cell-substrate adhesion. This disruption has been validated using ultrastructural imaging and immunostaining of the TJ-associated protein ZO-1. Age-related macular degeneration (AMD) is the leading cause of blindness in the developed world with a need for disease models for its currently incurable forms. Human induced pluripotent stem cells (hiPSCs) technology offers a novel approach for disease modelling, with the potential to impact translational retinal research and therapy. Recent developments enable the generation of Retinal Pigment Epithelial cells from patients (hiPSC-RPE), thus allowing for human retinal disease in vitro studies with great clinical and physiological relevance. In the current study, the development of a tissue-on- a-chip AMD disease model has been established using RPE generated from a patient with an inherited macular degeneration (case cell line) and from a healthy sibling (control cell line). A reproducible Electric Cell-substrate Impedance Sensing (ECIS) electrical wounding assay was conducted to mimic RPE damage in AMD. First, a robust and reproducible real-time quantitative monitoring over a 25-day period demonstrated the establishment and maturation of RPE layers on microelectrodes. A spatially-controlled RPE layer damage that mimicked cell loss in AMD was then initiated. Post recovery, significant differences in migration rates were found between case and control cell lines. Data analysis and modelling suggested this was due to the lower cell-substrate adhesion of the control cell line. These findings were confirmed using cell adhesion biochemical assays. Moreover, different-sized, individually-addressed square microelectrode arrays with high spatial resolution were designed and fabricated in-house. ECIS wounding assays were performed on these chips to study immortalized RPE migration. Migration rates comparable to those obtained with ECIS circular microelectrodes were determined. The two proposed disease-models-on-a-chip were then used to explore the therapeutic potential of the antioxidant N-Acetyl-Cysteine (NAC) on hiPSC-RPE and HepaRG cell recovery. Addition of 10 mM NAC at the end of a 24h paracetamol challenge caused a slight increase in the measured impedance, suggesting partial cell recovery. On the other hand, no effect on case hiPSC-RPE migration has been observed. More experiments are needed to examine the effect of different NAC concentrations and incubation periods. The therapeutic potential of electrical stimulation has also been explored. A preliminary study to evaluate the effect of electrical stimulation on RPE migration has been conducted. An externally applied direct current electric field (DC EF) of 300 mV/mm was found to direct the migration of the immortalized RPE cell line (hTERT-RPE1) perpendicular to the EF. The cells were also observed to elongate and to realign their long axes perpendicular to the applied EF. The proposed tissue-on-a-chip disease models are powerful platforms for translational studies. The potential of such platforms has been demonstrated through revealing unknown effects of acetaminophen on the liver as well as providing deeper insights into the underlying mechanisms of macular degeneration. Combining stem cell technology with impedance sensing provides a high throughput platform for studying patient-specific diseases and evaluating potential therapies.
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Bredin, Fredrik. "Passive volume reduction heart surgery using the Acorn cor cap cardiac support device /." Stockholm : Karolinska institutet, 2007. http://diss.kib.ki.se/2007/978-91-7357-284-2/.

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Books on the topic "CIP failure"

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Bass, Jeffrey. Avoiding failure of leachate collection and cap drainage systems. Cincinnati, OH: U.S. Environmental Protection Agency, Hazardous Waste Engineering Research Laboratory, 1986.

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Avoiding failure of leachate collection and cap drainage systems. Park Ridge, N.J., U.S.A: Noyes Data Corp., 1986.

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Holzhey, Christoph F. E., and Arnd Wedemeyer, eds. Errans. Berlin: ICI Berlin Press, 2022. http://dx.doi.org/10.37050/ci-24.

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Today’s critical discourses and theorizing vanguards agree on the importance of getting lost, of failure, of erring — as do life coaches and business gurus. The taste for a departure from progress and other teleologies, the fascination with disorder, unfocused modes of attention, or improvisational performances cut across wide swaths of scholarly and activist discourses, practices in the arts, but also in business, warfare, and politics. Yet often the laudible failures are only those that are redeemed by subsequent successes. What could it mean to think errancy beyond such restrictions? And what would a radical critique of productivity, success, and fixed determination look like that doesn’t collapse into the infamous ‘I would prefer not to’? This volume looks for an answer in the complicated word field branching and stretching from the Latin errāre. Its contributions explore the implications of embracing error, randomness, failure, non-teleological temporalities across different disciplines, discourses, and practices, with critical attention to the ambivalences such an impossible embrace generates.
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1946-, Paastela Jukka, ed. The Finnish Communist Party: The failure of attempts to modernize a C.P. Tampere: Tampereen yliopisto, Politiikan tutkimuksen laitos, 1985.

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Maximus, Lucius. How Malaysia never reached the World Cup: Harimau Malaya's 40-year chronicle of failure. Petaling Jaya, Malaysia: Fixi Mono, 2014.

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The perfect failure: Kennedy, Eisenhower, and the CIA at the Bay of Pigs. New York: Norton, 1987.

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Gardner, J. R. Independent Orbiter assessment: Assessment of the instrumental subsystem FMEA/CIL. Houston, Tex: McDonnell Douglas Astronautics Company, Houston Division, 1988.

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1975-, Nussbaum Jeff, ed. Intelligence matters: The CIA, the FBI, Saudi Arabia, and the failure of America's War on Terror. Lawrence, Kan: University Press of Kansas, 2008.

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Carden, Lyle P. Investigation of flange failures in falsework cap and sill beams: Recommendations for the design of beams and posts in bridge falsework. Sacramento, CA: California Dept. of Transportation, Division of Research and Innovation, 2008.

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The CIA and the culture of failure: U.S. intelligence from the end of the Cold War to the invasion of Iraq. Stanford, Calif: Stanford Security Series, 2008.

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Book chapters on the topic "CIP failure"

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O’Halloran, Bryan M., Robert B. Stone, and Irem Y. Tumer. "A Method to Compute Early Design Risk Using Customer Importance and Function-Flow Failure Rates." In CIRP Design 2012, 291–300. London: Springer London, 2012. http://dx.doi.org/10.1007/978-1-4471-4507-3_28.

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Carstensen, Jan, Torben Carstensen, Simon Aden, Andrej Dick, Jens Hübner, Sven Krause, Alexander Michailik, Johann Wigger, Jan Friederichs, and Jens Kotlarski. "A Failure-Tolerant Approach for Autonomous Mobile Manipulation in RoboCup@Work." In RoboCup 2015: Robot World Cup XIX, 95–105. Cham: Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-29339-4_8.

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Eid, Mohamed, Terhi Kling, Tuula Hakkarainen, Yohan Barbarin, Amelie Grangeat, and Dominique Serafin. "Cascading Failures: Dynamic Model for CIP Purposes - Case of Random Independent Failures Following Poisson Stochastic Process." In Critical Information Infrastructures Security, 326–31. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-31664-2_33.

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Hulubei, Tudor, and Barry O’Sullivan. "Failure Analysis in Backtrack Search for Constraint Satisfaction." In Principles and Practice of Constraint Programming - CP 2006, 731–35. Berlin, Heidelberg: Springer Berlin Heidelberg, 2006. http://dx.doi.org/10.1007/11889205_60.

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DallaLibera, Fabio, Shuhei Ikemoto, Takashi Minato, Hiroshi Ishiguro, Emanuele Menegatti, and Enrico Pagello. "Biologically Inspired Mobile Robot Control Robust to Hardware Failures and Sensor Noise." In RoboCup 2010: Robot Soccer World Cup XIV, 218–29. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-20217-9_19.

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Laurence, Arian, John A. Duley, H. Anne Simmonds, Mark Layton, Stephen J. Rose, and Susan J. Kelly. "Erythrocyte Cdp-Choline Accumulation in Haemolytic Anaemia and Renal Failure (Rf)." In Advances in Experimental Medicine and Biology, 155–59. Boston, MA: Springer US, 1998. http://dx.doi.org/10.1007/978-1-4615-5381-6_30.

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Abad, Pio. "The Collection of Jane Ryan & William Saunders." In Cultural Inquiry, 37–46. Berlin: ICI Berlin Press, 2022. http://dx.doi.org/10.37050/ci-21_05.

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This paper focuses on an ongoing project that began in 2012, entitled The Collection of Jane Ryan & William Saunders. This project is an attempt to reconstitute the Marcos Collection. Sourced from auction catalogues, museum archives, and scant government records, their lavish inventory of commissioned portraits, jewellery, Regency silverware, and old master paintings is reproduced as photographic installations, postcards, and three-dimensional prints. Reconstruction, in this instance, becomes a sustained democratic gesture, allowing an increasingly forgetful public to access a collection that has remained unavailable through a systemic failure by successive post-dictatorial governments to institutionalize collective acts of remembering.
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Shin, Dong Kil, Seung Woo Kim, Shin Kim, Seok Won Lee, and Hee Kook Choi. "Optimal Structural Design of Multi Chip Package to Reduce the Failure in Substrate." In Key Engineering Materials, 912–17. Stafa: Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-978-4.912.

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Barotsi, Rosa. "Not Yet." In Errans, 75–92. Berlin: ICI Berlin Press, 2022. http://dx.doi.org/10.37050/ci-24_3.

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Mafrouza is a twelve-hour-long documentary by French director Emanuelle Demoris, shot in a now-demolished neighbourhood in Alexandria, Egypt. Demoris is one of a long chain of western filmmakers who appeal to some form of ‘taking one’s time’ as an instrument for — morally, politically, epistemologically — adequate representation. Based on the work of Trinh T. Minh-ha, Eduard Glissant, and Poor Theory, this chapter evaluates what happens when a film adopts a strategy of deferral in cases in which it is not clear how questions of ‘doing justice’ could be resolved. Using long duration and an insistence on the quotidian, Demoris’s film forces us to think about the conditions that make pronouncements about character, situation, and narrative possible, continuously postponing the moment when it will become possible to say: ‘this film is about …’. By setting itself up for failure, the film proposes one possible approach to the ethics and politics of visibility.
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Xu, Hui. "Failure Analysis and Optimized Validation of Certain Diesel Engine Con-Rod with Four Cap Screws." In Proceedings of China SAE Congress 2020: Selected Papers, 1007–26. Singapore: Springer Singapore, 2022. http://dx.doi.org/10.1007/978-981-16-2090-4_62.

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Conference papers on the topic "CIP failure"

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Hillen, Michelle M., and James D. Hampshire. "Upgrading the LCAC APU System." In ASME Turbo Expo 2005: Power for Land, Sea, and Air. ASMEDC, 2005. http://dx.doi.org/10.1115/gt2005-69083.

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The Navy’s Landing Craft Air Cushion (LCAC) hovercraft vehicles use two Auxiliary Power Unit (APU) engines to provide AC power to the craft and bleed air to start the main engines. The APU Engine Sequencing Unit (ESU) and bleed air valve have consistently been high failure items. NAVSEA Philadelphia and Hamilton-Sundstrand have developed a Component Improvement Program (CIP) to increase the APU reliability and reduce repair/replacement cost by upgrading the ESU and bleed air valve. This paper will document and outline the APU CIP development effort, along with the installation, testing, and operation of the new APU components.
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Ohnsorg, R. W., and G. V. Srinivasan. "Development and Characterization of High Strength SiC Rotors." In ASME 1991 International Gas Turbine and Aeroengine Congress and Exposition. American Society of Mechanical Engineers, 1991. http://dx.doi.org/10.1115/91-gt-191.

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Sintered α-SiC (Hexoloy® SA*) turbine engine components have been fabricated by Carborundum for the Advanced Gas Turbine (AGT) Program and, more recently, for the Advanced Turbine Technology Applications Project (ATTAP) using three primary forming procedures — injection molding, cold isostatic pressing (CIP) followed by green machining, and slip casting. The near net-shape fabrication of injection molded AGT-100 radial rotors for the Allison Gas Turbine Division (AGTD) of General Motors Corporation and, more recently, AGT-5 axial rotors, has been demonstrated. The current emphasis at Carborundum is to refine the injection molding process, bringing it to a performance and reproducibility level sufficient for production needs. The process changes leading to increases in component strength from approximately 380 MPa (55 ksi) to 595 MPa (86 ksi) will be discussed, as well as investigation of the failure mechanism and proposed process modifications to enhance properties even further.
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Ng, Hui Peng, Angela Teo, Ghim Boon Ang, Alfred Quah, N. Dayanand, Naiyun Xu, Chang Qing Chen, Zhi Hong Mai, and Jeffrey Lam. "MEMS Failure Analysis In Wafer Fabrication." In ISTFA 2016. ASM International, 2016. http://dx.doi.org/10.31399/asm.cp.istfa2016p0188.

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Abstract This paper discussed on how the importance of failure analysis to identify the root cause and mechanism that resulted in the MEMS failure. The defect seen was either directly on the MEMS caps or the CMOS integrated chip in wafer fabrication. Two case studies were highlighted in the discussion to demonstrate how the FA procedures that the analysts had adopted in order to narrow down to the defect site successfully on MEMS cap as well as on CMOS chip on MEMS package units. Besides the use of electrical fault isolation tool/technique such as TIVA for defect localization, a new physical deprocessing approach based on the cutting method was performed on the MEMS package unit in order to separate the MEMS from the Si Cap. This approach would definitely help to prevent the introduction of particles and artifacts during the PFA that could mislead the FA analyst into wrong data interpretation. Other FA tool such as SEM inspection to observe the physical defect and Auger analysis to identify the elements in the defect during the course of analysis were also documented in this paper.
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Qu, Qiang, Satoshi Izumi, and Shinsuke Sakai. "Development of Reliability Assessment Method for Piping Containing Local Metal Loss at Structure Discontinuity." In ASME 2016 Pressure Vessels and Piping Conference. American Society of Mechanical Engineers, 2016. http://dx.doi.org/10.1115/pvp2016-63444.

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In chemical plants, Corrosion Under Insulation (CUI) is a typical maintenance issue of internal pressed pipes. This form of localized corrosion leads to metal loss at the outside surface of pipes, reduces the pipe’s resistance to internal pressure [1]. Once the local metal loss is inspected, it is important to apply a Fitness-For-Service (FFS) assessment to evaluate the remaining safety margin against working internal pressure. However, if the local metal loss occurs at the piping discontinuity, it is impossible to calculate the critical collapsing pressure without any existing theoretical expression. Moreover, evaluation based upon standards may produce too much conservative evaluation and lead to unnecessary repairing-replacement cost. In this study, both deterministic analysis and probabilistic reliability analysis are performed to evaluate the safety margin of piping containing local metal loss at piping branch connection, and the obtained results are compared with those evaluated based upon API579-1/ASME FFS-1 standard. In addition, sensitivity analysis is conducted to show the dependence of metal loss geometries regarding both width and depth, material strength and working internal pressure on the safety margin. Finally, a proper reliability assessment procedure by using advanced Response Surface Method (RSM) is proposed. In the deterministic analysis part, a FEM structural analysis is performed to calculate the critical collapsing internal pressures (CIP) for several cases of various metal loss geometries regarding width and depth and material tensile strength. These results are compared with maximum allowable working internal pressure (MAWP) calculated by the procedures which are provided in API579-1/ASME FFS-1 standard. (The safety margin is defined as CIP/ MAWP). It is shown that the safety margins are greater than 6 in most of the cases. Since there are uncertainties in the geometrical dimensions of local metal loss, material tensile strength and working internal pressure, it is necessary to perform a reliability analysis to quantify the probability of failure (Pf) caused by these uncertainties. In the probabilistic analysis part, the metal loss geometries, material strength and internal pressure are considered as random variable with distributions. The reliability index of each group of geometries-strength-pressure combinations is calculated by first order reliability method (FORM). The reliability index of the case working under MAWP is also investigated. In order to define the limit state function, response surface method is used to predict the response which relates the critical collapsing internal pressure to the metal loss geometries and material strength. Finally, the sensitivity analysis is performed to clarify the dependence of metal loss geometries, material strength, and internal pressure on the Pf, and to specify the dominant variables and negligible variables.
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Kim, Joohee, Daniel H. Jung, Jonghyun Cho, Jun So Pak, Joungho Kim, Jong Min Yook, and Jun Chul Kim. "High-Frequency TSV Failure Detection Method with Z Parameter." In ISTFA 2012. ASM International, 2012. http://dx.doi.org/10.31399/asm.cp.istfa2012p0050.

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Abstract As the TSV count increases, chip yield can be severely degraded due to failures during the TSV or die-stacking processes. This paper will present and discuss on the usage of failure masks designed to detect and differentiate failure types such as connection failure and insulator failure based on frequency-domain one point probing measurement. The failure masks are proposed on the basis of the frequency domain analysis of TSV failures with Z11 magnitudes.
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Morshed, Muhammad Monzur, Esther Chen, and Anita Madan. "Study of Thermal Cycle Induced CPI Failure Mode in a Lidded FC-BGA Package." In ISTFA 2019. ASM International, 2019. http://dx.doi.org/10.31399/asm.cp.istfa2019p0402.

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Abstract Dissimilarities of thermal expansion coefficient between chip and package materials results in stress and strain at the solder interconnect leading to fatigue failures. Underfill is used between chip and package to reduce the interfacial stress and hence increase reliability. In this work, four flipchip package test vehicles underwent thermal cycling to accelerate the stress and were investigated systematically with different failure analysis techniques to study their failure modes. The prevalent failure mode was observed to be at the corner area between the chip and package using different advanced failure analysis techniques. This work demonstrates the technical complexity of analyzing stress induced defects and provides insight into CPI-based material selection.
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Bethke, David, and Wayland Seifert. "TDR Analysis of Advanced Microprocessors." In ISTFA 2001. ASM International, 2001. http://dx.doi.org/10.31399/asm.cp.istfa2001p0087.

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Abstract Time Domain Reflectrometry or TDR is an analytical technique used to determine the impedance and electrical length of conductors. This relatively inexpensive technique utilizes a pulse card and digital oscilloscope whereby the reflected signal amplitude from an initiating pulse is measured versus time. The technique is useful for characterizing the impedance of a conductor in the time domain, and has traditionally been employed in board level analysis. More recently, TDR has been shown to be useful in electrically isolating integrated circuit package failures1. Historically, open failures on non-flip chip devices were resolved through relatively straight-forward, low risk methods in a failure analysis lab. Typically, root cause analysis involved simple verification on a curve tracer, non-destructive inspection using X-Ray imaging, chemical, thermal or mechanical decapsulation, optical and electron microscopy and as necessary, the use of mechanical probe isolation. The implementation of advanced flip chip package technology rendered the traditional isolation methodologies inadequate. After verification and X-ray inspection, a decision had to be made prior to subsequent destructive physical analysis as to the most probable failure location. Since the board interconnects, board interposer, and bump locations were not geometrically aligned, isolation of opens through physical cross-sectioning became risky, tedious and lengthy. These constraints were overcome through the use of TDR analysis. The authors have successfully incorporated the TDR technique into AMD’s microprocessor failure analysis flow, improving success rate, reducing risk and decreasing turn-around time. The paper will include a brief description of TDR theory and hardware, technical barriers that the authors encountered during implementation, sample preparation as well as details where the technique was successfully employed in failure isolation. The remaining portion of this paper provides illustrative examples where TDR was effectively utilized in the analysis of slot A cards, ceramic flip chip PGA pins, and internal package trace failures.
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Hsiung, Steve, and Victer Chan. "Failure Analysis Process Flows and Common Failure Mechanisms in Flip-Chip Packaged Device." In ISTFA 2000. ASM International, 2000. http://dx.doi.org/10.31399/asm.cp.istfa2000p0107.

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Abstract With the increasing complexity of packaging technology, especially Flip-chip, package failure analysts face challenges to identify failure root cause. Due to the complex construction of Flip-chip packages, the conventional failure analysis process flow needs to be enhanced. Thus, generating a bench marked failure analysis process flow specifically for Flip-chip packaged devices becomes necessary. In this paper, the failure analysis process flow for Flip-chip package devices along with different failure mechanisms will be discussed and demonstrated. For instance, even in a simple continuity-open failure, instead of cross-sectioning the device as the initial fault identification step, the process flow details how to start from non-destructive C-SAM, TDR, to destructive die removal, polishing and finally cross-sectioning.
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Evan, Dennis, L. Balacano, and Lito P. De La Rama. "Effect of Die Chip-Outs and Reflow Temperature on the Mechanical Behavior of a 5-Die-Stacked Chip Scale Package." In ISTFA 2007. ASM International, 2007. http://dx.doi.org/10.31399/asm.cp.istfa2007p0130.

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Abstract During package qualification, a 5-die-stacked chip scale package was being marginally triggered on high stand-by current collectively known as Power ICCS failure. Affected lots are subjected to 3x reflow at 240°C. Post reflow failures include blown_up, high standby current in Vcc pin (ISBLO), and high standby current in Vccq pin (ISBLOQ). Backside chip-outs are observed on Die 1 and Die 3 of the three failures. Electrical validation showed that only Die 3 is failing. Corner crack on Die 3 is common to the blown_up and ISBLO failing units while crack on Die 3 backside is observed to propagate toward the active area on ISBLOQ failing units. Fracture analysis results show that the crack of the three failures all originated from die backside chip-out. Thermo-mechanical model of the package shows that, by design, Die 3 generates the highest stress concentration. Results show that if chip-outs are present on the area of the die with the highest stress concentration and the unit is subjected to reflow temperature of 240°C, die crack will propagate from the chip-out. This paper presents the unique failure mechanism observed on a 5-die-stacked chip scale package and the corrective actions applied to solve the issue.
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Luo, D., and X. Song. "Voltage Contrast Application on 1M SRAM Single Bit Failure Analysis." In ISTFA 1997. ASM International, 1997. http://dx.doi.org/10.31399/asm.cp.istfa1997p0339.

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Abstract A single bit failure is the most common and the most difficult failure mode to analyze in a Static Random Access Memory (SRAM). As chip feature sizes decrease, the difficulties compound. Traditional failure analysis techniques are often ineffective, particularly for high temperature operating life (HTOL) failures, because HTOL failures are most often caused by subtle physical defects. A new analysis approach, using Focused Ion Beam (FIB) cross-sectioning combined with Fffi passive voltage contrast (PVC), greatly enhances the analysis success rate. In this paper, we outline the use of these new techniques and apply them to a technologically important problem.
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Reports on the topic "CIP failure"

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Pu, Fenglan, Tianli Li, Yingqiao Wang, Chunmei Tang, Chen Shen, and Jianping Liu. Cordyceps preparations for preventing contrast-induced nephropathy: A protocol of systematic review of randomized controlled trials. INPLASY - International Platform of Registered Systematic Review and Meta-analysis Protocols, June 2022. http://dx.doi.org/10.37766/inplasy2022.6.0098.

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Review question / Objective: To systematically evaluate the efficacy and safety of cordyceps preparations as a complementary preventive therapy for Contrast-induced nephropathy (CIN). Condition being studied: At present, contrast agents are widely used in diagnostic and interventional radiology examinations worldwide. However, they can affect kidney function and cause a risk of renal impairment. Contrast-induced nephropathy (CIN) is defined as a rise in serum creatinine (SCr) levels by ≥ 25% of baseline or 44 µmol/l from the pre-contrast value within 72 h of intravascular administration of a contrast agent in the absence of an alternative etiology. The incidence of CIN varies widely among studies depending on study population and baseline risk factors, as for high-risk groups such as pre-existing renal insufficiency, diabetes, advanced age, or receiving nephrotoxic agents, the incidence is up to 30–50%. To date, CIN has been the third most common cause of hospital-acquired renal failure, after impaired renal perfusion and nephrotoxic medications, which can lead to longer hospital stay, increased costs and higher mortality.
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Jiang, Zhiping, Ao Zhang, Shuxing Wang, Quanlei Ren, and Yizhu Wang. Prognostic value of ASXL1 mutations in patients with myelodysplastic syndromes and acute myeloid leukemia: A meta-analysis. INPLASY - International Platform of Registered Systematic Review and Meta-analysis Protocols, April 2022. http://dx.doi.org/10.37766/inplasy2022.4.0013.

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Review question / Objective: A meta-analysis was performed to investigate prognostic value of ASXL1 mutations in patients with myelodysplastic syndromes and acute myeloid leukemia. Condition being studied: Some MDS or AML patients have ASXL1 mutations while others haven’t. Main outcome(s): We used OS as the primary endpoint and AML transformation as the secondary endpoint. OS was defined as either death (failure) or survival at the last follow-up. AML transformation was defined as starting when the patient entered the trial and proceeding to the time of AML diagnosis.Combined HRs and 95% CIs for OS and AML transformation were used to evaluate the prognostic effect of ASXL1 mutations using the generic inverse variance method.
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WIERSMA, BRUCE, and STEPHEN HARRIS. RELATIONSHIP BETWEEN THE MARGINAL PROBABILITY OF FAILURE FOR A CPP TEST AND THE RECOMMENDED CORROSION CONTROL REQUIREMENTS FOR HANFORD DOUBLE SHELL WASTE TANKS. Office of Scientific and Technical Information (OSTI), February 2022. http://dx.doi.org/10.2172/1846764.

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4

Newman-Toker, David E., Susan M. Peterson, Shervin Badihian, Ahmed Hassoon, Najlla Nassery, Donna Parizadeh, Lisa M. Wilson, et al. Diagnostic Errors in the Emergency Department: A Systematic Review. Agency for Healthcare Research and Quality (AHRQ), December 2022. http://dx.doi.org/10.23970/ahrqepccer258.

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Objectives. Diagnostic errors are a known patient safety concern across all clinical settings, including the emergency department (ED). We conducted a systematic review to determine the most frequent diseases and clinical presentations associated with diagnostic errors (and resulting harms) in the ED, measure error and harm frequency, as well as assess causal factors. Methods. We searched PubMed®, Cumulative Index to Nursing and Allied Health Literature (CINAHL®), and Embase® from January 2000 through September 2021. We included research studies and targeted grey literature reporting diagnostic errors or misdiagnosis-related harms in EDs in the United States or other developed countries with ED care deemed comparable by a technical expert panel. We applied standard definitions for diagnostic errors, misdiagnosis-related harms (adverse events), and serious harms (permanent disability or death). Preventability was determined by original study authors or differences in harms across groups. Two reviewers independently screened search results for eligibility; serially extracted data regarding common diseases, error/harm rates, and causes/risk factors; and independently assessed risk of bias of included studies. We synthesized results for each question and extrapolated U.S. estimates. We present 95 percent confidence intervals (CIs) or plausible range (PR) bounds, as appropriate. Results. We identified 19,127 citations and included 279 studies. The top 15 clinical conditions associated with serious misdiagnosis-related harms (accounting for 68% [95% CI 66 to 71] of serious harms) were (1) stroke, (2) myocardial infarction, (3) aortic aneurysm and dissection, (4) spinal cord compression and injury, (5) venous thromboembolism, (6/7 – tie) meningitis and encephalitis, (6/7 – tie) sepsis, (8) lung cancer, (9) traumatic brain injury and traumatic intracranial hemorrhage, (10) arterial thromboembolism, (11) spinal and intracranial abscess, (12) cardiac arrhythmia, (13) pneumonia, (14) gastrointestinal perforation and rupture, and (15) intestinal obstruction. Average disease-specific error rates ranged from 1.5 percent (myocardial infarction) to 56 percent (spinal abscess), with additional variation by clinical presentation (e.g., missed stroke average 17%, but 4% for weakness and 40% for dizziness/vertigo). There was also wide, superimposed variation by hospital (e.g., missed myocardial infarction 0% to 29% across hospitals within a single study). An estimated 5.7 percent (95% CI 4.4 to 7.1) of all ED visits had at least one diagnostic error. Estimated preventable adverse event rates were as follows: any harm severity (2.0%, 95% CI 1.0 to 3.6), any serious harms (0.3%, PR 0.1 to 0.7), and deaths (0.2%, PR 0.1 to 0.4). While most disease-specific error rates derived from mainly U.S.-based studies, overall error and harm rates were derived from three prospective studies conducted outside the United States (in Canada, Spain, and Switzerland, with combined n=1,758). If overall rates are generalizable to all U.S. ED visits (130 million, 95% CI 116 to 144), this would translate to 7.4 million (PR 5.1 to 10.2) ED diagnostic errors annually; 2.6 million (PR 1.1 to 5.2) diagnostic adverse events with preventable harms; and 371,000 (PR 142,000 to 909,000) serious misdiagnosis-related harms, including more than 100,000 permanent, high-severity disabilities and 250,000 deaths. Although errors were often multifactorial, 89 percent (95% CI 88 to 90) of diagnostic error malpractice claims involved failures of clinical decision-making or judgment, regardless of the underlying disease present. Key process failures were errors in diagnostic assessment, test ordering, and test interpretation. Most often these were attributed to inadequate knowledge, skills, or reasoning, particularly in “atypical” or otherwise subtle case presentations. Limitations included use of malpractice claims and incident reports for distribution of diseases leading to serious harms, reliance on a small number of non-U.S. studies for overall (disease-agnostic) diagnostic error and harm rates, and methodologic variability across studies in measuring disease-specific rates, determining preventability, and assessing causal factors. Conclusions. Although estimated ED error rates are low (and comparable to those found in other clinical settings), the number of patients potentially impacted is large. Not all diagnostic errors or harms are preventable, but wide variability in diagnostic error rates across diseases, symptoms, and hospitals suggests improvement is possible. With 130 million U.S. ED visits, estimated rates for diagnostic error (5.7%), misdiagnosis-related harms (2.0%), and serious misdiagnosis-related harms (0.3%) could translate to more than 7 million errors, 2.5 million harms, and 350,000 patients suffering potentially preventable permanent disability or death. Over two-thirds of serious harms are attributable to just 15 diseases and linked to cognitive errors, particularly in cases with “atypical” manifestations. Scalable solutions to enhance bedside diagnostic processes are needed, and these should target the most commonly misdiagnosed clinical presentations of key diseases causing serious harms. New studies should confirm overall rates are representative of current U.S.-based ED practice and focus on identified evidence gaps (errors among common diseases with lower-severity harms, pediatric ED errors and harms, dynamic systems factors such as overcrowding, and false positives). Policy changes to consider based on this review include: (1) standardizing measurement and research results reporting to maximize comparability of measures of diagnostic error and misdiagnosis-related harms; (2) creating a National Diagnostic Performance Dashboard to track performance; and (3) using multiple policy levers (e.g., research funding, public accountability, payment reforms) to facilitate the rapid development and deployment of solutions to address this critically important patient safety concern.
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Yaron, Zvi, Abigail Elizur, Martin Schreibman, and Yonathan Zohar. Advancing Puberty in the Black Carp (Mylopharyngodon piceus) and the Striped Bass (Morone saxatilis). United States Department of Agriculture, January 2000. http://dx.doi.org/10.32747/2000.7695841.bard.

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Both the genes and cDNA sequences encoding the b-subunits of black carp LH and FSH were isolated, cloned and sequenced. Sequence analysis of the bcFSHb and LHb5'flanking regions revealed that the promoter region of both genes contains canonical TATA sequences, 30 bp and 17 bp upstream of the transcription start site of FSHb and LHb genes, respectively. In addition, they include several sequences of cis-acting motifs, required for inducible and tissue-specific transcriptional regulation: the gonadotropin-specific element (GSE), GnRH responsive element (GRE), half sites of estrogen and androgen response elements, cAMP response element, and AP1. Several methods have been employed by the Israeli team to purify the recombinant b subunits (EtOH precipitation, gel filtration and lentil lectin). While the final objective to produce pure recombinantGtH subunits has not yet been achieved, we have covered much ground towards this goal. The black carp ovary showed a gradual increase in both mass and oocyte diameter. First postvitellogenic oocytes were found in 5 yr old fish. At this age, the testes already contained spermatozoa. The circulating LH levels increased from 0.5 ng/ml in 4 yr old fish to >5ng/ml in 5 yr old fish. In vivo challenge experiments in black carp showed the initial LH response of the pituitary to GnRH in 4 yr old fish. The response was further augmented in 5 yr old fish. The increase in estradiol level in response to gonadotropic stimulation was first noted in 4 yr old fish but this response was much stronger in the following year. In vivo experiments on the FSHb and LHb mRNA levels in response to GnRH were carried out on common carp as a model for synchronom spawning cyprinids. These experiments showed the prevalence of FSHP in maturing fish while LHP mRNA was prevalent in mature fish, especially in females. The gonadal fat-pad was found to originate from the retroperitoneal mesoderm and not from the genital ridge, thus differing from that reported in certain amphibians This tissue possibly serves as the major source of sex steroids in the immature black carp. However, such a function is taken over by the developing gonads in 4 yr old fish. In the striped bass, we described the ontogeny of the neuro-endocrine parameters along the brain-pituitary-gonadal axis during the first four years of life, throughout gonadal development and the onset of puberty. We also described the responsiveness of the reproductive axis to long-term hormonal manipulations at various stages of gonadal development. Most males reached complete sexual maturity during the first year of life. Puberty was initiated during the third year of life in most females, but this first reproductive cycle did not lead to the acquisition of full sexual maturity. This finding indicates that more than one reproductive cycle may be required before adulthood is reached. Out of the three native GnRHs present in striped bass, only sbGnRH and cGnRH II increased concomitantly with the progress of gonadal development and the onset of puberty. This finding, together with data on GtH synthesis and release, suggests that while sbGnRH and cGnRH II may be involved in the regulation of puberty in striped bass, these neuropeptides are not limiting factors to the onset of puberty. Plasma LH levels remained low in all fish, suggesting that LH plays only a minor role in early gonadal development. This hypothesis was further supported by the finding that experimentally elevated plasma LH levels did not result in the induction of complete ovarian and testicular development. The acquisition of complete puberty in 4 yr old females was associated with a rise in the mRNA levels of all GtH subunit genes, including a 218-fold increase in the mRNA levels of bFSH. mRNA levels of the a and PLH subunits increased only 11- and 8-fold, respectively. Although data on plasma FSH levels are unavailable, the dramatic increase in bFSH mRNA suggests a pivotal role for this hormone in regulating the onset and completion of puberty in striped bass. The hormonal regulation of the onset of puberty and of GtH synthesis and release was studied by chronic administration of testosterone (T) and/or an analog of gonadotropin-releasing hormone (G). Sustained administration of T+G increased the mRNA levels of the PLH subunit to the values characteristic of sexually mature fish, and also increased the plasma levels of LH. However, these changes did not result in the acceleration of sexual maturation. The mRNA levels of the bFSH subunit were slightly stimulated, but remained about 1/10 of the values characteristic of sexually mature fish. It is concluded that the stimulation of FSH gene expression and release does not lead to the acceleration of sexual maturity, and that the failure to sufficiently stimulate the bFSH subunit gene expression may underlie the inability of the treatments to advance sexual maturity. Consequently, FSH is suggested to be the key hormone to the initiation and completion of puberty in striped bass. Future efforts to induce precocious puberty in striped bass should focus on understanding the regulation of FSH synthesis and release and on developing technologies to induce these processes. Definite formulation of hormonal manipulation to advance puberty in the striped bass and the black carp seems to be premature at this stage. However, the project has already yielded a great number of experimental tools of DNA technology, slow-release systems and endocrine information on the process of puberty. These systems and certain protocols have been already utilized successfully to advance maturation in other fish (e.g. grey mullet) and will form a base for further study on fish puberty.
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