Dissertations / Theses on the topic 'CHIRP INPUT'
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Hadi, Muhammad Usman. "Digital predistortion for compensation of nonlinearities in Radio over Fiber Links." Master's thesis, Alma Mater Studiorum - Università di Bologna, 2016.
Find full textLinke, Kevin Robert. "An on-chip input driver for a high-voltage SAR ADC." Thesis, Massachusetts Institute of Technology, 2014. http://hdl.handle.net/1721.1/91837.
Full textCataloged from PDF version of thesis.
Includes bibliographical references (page 49).
This thesis describes the design of a novel on-chip input driver for a SAR ADC. The driver achieves performance gains relative to off-chip alternatives by being integrated into the signal path of the ADC between the sampling switches and sampling capacitor. This placement allows for auto-zeroing the offset of the driver and reducing flicker noise. Additional performance benefits are possible because the driver can be optimized for the specific load and timings of the ADC. The most important benefit of an on-chip input driver is that it simplifies the design process for the ADC user by eliminating the external op-amp and reducing the constraints on the external filter by reducing input current load. Design simplicity is especially important to users in high-voltage SAR ADC applications, so the input driver is designed for an ADC with a +/- 10.24 V input range and +/- 15 V supply rails. This high-voltage input relaxes noise and headroom constraints, but makes device overvoltage a significant concern. The driver is designed in a BiCMOS process, and simulation results with a computer-modeled ADC are presented here. In these simulations, the driver achieves a THD of -124.7 dB at 2 kHz and a noise voltage spectral density of 5.5 nV / [square root of] Hz with a power consumption of 27.6 mW. The LT1469, an example of a state-of-the-art external input driver, has a THD of -123 dB at 2 kHz, a noise voltage spectral density of 5 nV / [square root of] Hz, and a power consumption of 123 mW.
by Kevin Robert Linke.
M. Eng.
Zhu, Yan. "Microfluidic Technology for Low-Input Epigenomic Analysis." Diss., Virginia Tech, 2018. http://hdl.handle.net/10919/83402.
Full textPh. D.
Fan, Su Yan. "Wide-input-range supply voltage tolerant capacitive sensor readout using on-chip solar cell." Thesis, University of Macau, 2015. http://umaclib3.umac.mo/record=b3335734.
Full textBurrow, Ryan David. "Enhancing Input/Output Correctness, Protection, Performance, and Scalability for Process Control Platforms." Thesis, Virginia Tech, 2019. http://hdl.handle.net/10919/89903.
Full textMaster of Science
Complex modern systems, from unmanned aircraft system to industrial plants are almost always controlled digitally. These digital control systems (DCSes) need to be verified for correctness since failures can have disastrous consequences. However, proving that a DCS will always act correctly can be infeasible if the system is too complex. In addition, with the growth of inter-connectivity of systems through the internet, malicious actors have more access than ever to attempt to cause these systems to deviate from their proper operation. This thesis seeks to solve these problems by introducing a new architecture for DCSes that uses isolated components that can be verified for correctness. In addition, safety monitors are implemented as a part of the architecture to prevent unsafe operation.
Wilson, James Edward. "Design techniques for first pass silicon in SOC radio transceivers." Columbus, Ohio : Ohio State University, 2007. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=osu1180555088.
Full textZvěřina, Martin. "Výpočtová simulace procesu třískového obrábění." Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2010. http://www.nusl.cz/ntk/nusl-229040.
Full textYoo, Sungjong. "Electromagnetic Modeling of Multi-Dimensional Scale Problems: Nanoscale Solar Materials, RF Electronics, Wearable Antennas." Diss., The University of Arizona, 2014. http://hdl.handle.net/10150/333484.
Full textMANDAVIA, DHAIVAT. "SLIDING MODE OBSERVERS FOR OBSERVING THE DYNAMICS OF NUCLEAR REACTOR SYSTEMS." Thesis, 2016. http://dspace.dtu.ac.in:8080/jspui/handle/repository/14612.
Full textPeng, Chih-Yang, and 彭志洋. "Block and Input/Ouput Buffer Placement in Flip-Chip Design." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/61649670636516290542.
Full text國立臺灣大學
電子工程學研究所
91
The flip-chip package gives the highest chip density of any packaging method to support the pad-limited ASIC design. One of the most important characteristics of flip chip designs is that the input/output buffers could be placed anywhere inside a chip. For most practical designs, we have to control the timing of the input/output signals. This can be achieved through controlling the positions of bump balls, input/output buffers, and first stage/last-stage cells in a flip chip. Specifically, we intend to minimize the path length between blocks and bump balls as well as the delay skew of the paths. In this thesis, we propose a hierarchical top-down method for the block and input/output buffer placement in flip-chip design. We first cluster a block and its corresponding buffers to reduce the problem size. Then, we go into iterations of the following two steps: the alternating and interacting global optimization step and the partitioning step. The global optimization step places modules based on simulated annealing using the B*-tree representation to minimize a given cost function. The partitioning step dissects the chip into two subregions, and the modules are divided into two groups according to their coordinates and are placed in respective subregions. The two steps repeat until each subregion contains at most a given number of modules, defined by the ratio of the total module area to the chip area. At last, we refine the placement by perturbing modules inside a subregion as well as in different subregions. Compared with the placement using the B*-tree alone, our method obtains significantly better results, with an average cost of only 48.4\% of that obtained by using the B*-tree alone.
Lin, chih-chung, and 林志忠. "Chip Design of Passive Input Device Signal Detection for Earphone Controller." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/t8q659.
Full text國立臺北科技大學
電子工程系
106
End user usual has two devices used for works and communications today, first one was Notebook and the other was smart mobile device. Both has 3.5mm Audio Jack functions with earphone, but notebook doesn’t support this earphone control circuit. Thus, this paper proposed a chip design of passive input device signal detection for earphone controller. Chip works by detecting the microphone bias voltage. Each of bottoms has different resistor connection between microphone and ground. Once the bottom was triggered, the comparators sense the input voltage comparing with reference voltage to decide the proper region. Basically, this architecture uses the bandgap for reference voltage and using comparators to generate four digital control signals (GPIO). And thus, the notebook can use these signals to carry out different operations predefined by user. For verifying, this chip is implemented with TSMC 0.18μm 1P4M CMOS process, which power consumption is 16.1 mW and chip size is 0.63 x 0.63 mm2 (including PAD). The experimental results show that we can easily control NB by earphone controller with low cost and this architecture can be applied to future smart devices.
Narayana, Sagar 1986. "Throughput-Efficient Network-on-Chip Router Design with STT-MRAM." Thesis, 2012. http://hdl.handle.net/1969.1/148157.
Full textChao, Wen-Chang. "Performance-Driven Block and Input/Output Buffer Placement in Flip-Chip Design." 2004. http://www.cetd.com.tw/ec/thesisdetail.aspx?etdun=U0001-2907200414064000.
Full textChao, Wen-Chang, and 趙文璋. "Performance-Driven Block and Input/Output Buffer Placement in Flip-Chip Design." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/6565c8.
Full text國立臺灣大學
電子工程學研究所
92
The flip-chip package gives the highest chip density of any packaging methods to support the pad-limited ASIC design. One of the most important characteristics of flip chip designs is that the input/output buffers could be placed anywhere inside a chip. For most practical designs, we have to control the timing of the input/output signals. This can be achieved through controlling the positions of bump balls, input/output buffers, and first-stage/last-stage cells in a flip chip. Specifically, we intend to minimize the path length between blocks and bump balls as well as the delay skew of the paths. In this thesis, we propose a two-stage placement method for the block and input/output buffer placement in flip-chip design. In the first stage, we apply simulated annealing using the B*-tree representation to minimize the maximum wirelength and obtain an initial feasible placement. In the second stage, we apply an iterative algorithm to improve the initial solution. In each iteration, we find the zero-skew position for each buffer to minimize the signal delay skew between the buffer and one with the maximum signal delay. The iterative improvement terminates when all of the signal delay skews of input/output buffers are under an user-specified range. Compared with the placement using the B*-tree alone and the work in [16], our method obtains significantly better results. The B*-tree based algorithm ([16]) results in overall cost of 32.23 times (14.08 times) of that of our algorithm. In terms of running time, the B*-tree based algorithm ([16]) needs 15.34 times (10.47 times) of our CPU time. In particular, setting an appropriate grid size and a signal skew range, we can even get a placement with zero signal skews for all input/output buffers.
Jen-ChunFan and 范仁俊. "Design of an Automatically Calibrated Temperature Sensing Chip with Wide Input Range." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/454feq.
Full textHsieh, Cheng-Ku, and 謝政谷. "The 10-bit 20-MS/s Fully Differential SAR ADC Chip Design Using Positive Input Signal Tracking DAC Switching Method." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/62182120701248612696.
Full text國立臺灣科技大學
電子工程系
102
This paper presents a 1.8-V 10-bit 20MS/s successive approximation register (SAR) analog-to-digital converter (ADC) implemented in the TSMC 0.18-um CMOS process. By applying a single-sided switching method that reduces DAC switching energy, the proposed SAR ADC achieves lower power consumption. In order to avoid using an external high frequency clock to drive the ADC, asynchronous control logic is used. A pre-amplifier based comparator reduces the kickback noise from the logic circuit. A bootstrapped switch increases the sample linearity of the ADC. The SAR ADCs were simulated by HSPICE and SpectreRF. The 10-bit ADC was taped out by TSMC. The measured results for differential and integral nonlinearity of the 10-bit ADC are within 1.2/-0.4 LSB (Least Significant Bit) and -1.54~1.1LSB respectively at full sampling rate. The measurement results show an effective number of bits (ENOB) of 8.85-bits with a sampling frequency of 20 MHz at a 10 KHz input frequency. The chip area, including pads, is 0.57 mm2. Power consumption of this ADC is 910μW with a 1.8 V supply voltage.
Chen, Yen-Ming, and 陳彥名. "Design and Implementation of New On-Chip Current-Mode DC-DC Buck Converter and Low-Dropout Voltage Regulator with Negative Input-Output Voltage." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/xnpr38.
Full text國立臺北科技大學
電腦與通訊研究所
95
In the first part of this thesis, we present an integrated buck converter using hysteresis current controlled (HCC) techniques without slope compensation. The proposed current sensing circuit is very simple and only consists of few components, which can be designed easily. The designed buck converter using the current sensing circuit and HCC techniques can be stable even if the duty cycle is greater than 50%. The buck converter is implemented with 3.3-V TSMC 0.35μm CMOS DPQM processes, and the chip area is 2.33mm2 with PAD. In the second part of this thesis, we present a low-dropout linear regulator (LDO) with negative in-out voltage. The characteristic of proposed LDO is its very low quiescent current and ultra high DC gain. Therefore, the line/load regulation of designed LDO is great than other design. The LDO is implemented with 3.3-V TSMC 0.35μm CMOS DPQM processes, and the chip area is 0.45mm2 with PAD.
YEH, CHENG-SHIN, and 葉承鑫. "A Study of the Material Model of Complementary inputs for an Insufficient Output of the LED Chip Manufacturing Plant." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/20183578462155545487.
Full text中華大學
工業管理學系碩士班
102
The LED industry involves four kinds of production processes which includeraw material side, upstream, midstream, and downstream. The LED Chip Manufacturers (LED-CM) is a part of the midstream and is a key role of the LED industry. In order to satisfy the various requirements of the downstream, the LED Chip Manufacturers (LED-CMs) are always the type ofMTO production. Their productionprocessesare not only complicated but also uncertain which makes low Hit Target Ratio (HT) and with a lot of variation. Therefore the critical issue of LED manufacturersusually confrontwith how to plan complementary inputs, during an insufficient output of a Make Order (MO) that means productionmanagers should make a decision for complementary inputs which specification of Epitaxy Wafer(EPI), and how many chip should put in, that could both reduce production cost and inventory burden.This thesis proposes a material model of complementary inputs, and to explore the optimal complementaryput in model. First, this study explains LED-CMs’various outputs and issues of HT, second uses a real-life LED-CM case to discuss feasible complementary input model todesign simulation and experiment scenario, toverify effectiveness of different models, and finally discover the optimal complementary inputs model, to offer the application for practitioners.
Li, Cheng-Ting, and 李政廷. "Design of the Broadband Millimeter-Wave On-Chip Antenna, a Novel Structure of Decreasing Side Lobes and Increasing Frequency Scanning Region for Leaky Wave Antenna and High Isolation Multi-Input Multi-Output Antenna." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/33350568547591856787.
Full text國立交通大學
電信工程研究所
99
This paper proposes three designs of antennas. One is the research of the on-chip antenna, another is the research of the novel structure for the decreasing side-lobe and increasing beam steering range leaky-wave antenna, the other is the search of the low relationship multi-input multi-output antenna (MIMO). For the first topic, a broadband millimeter-wave on-chip antenna is presented here. We design the proposed antenna by using the construction of monopole antenna. To reach the End-Fired radiation pattern, the reflector of the Yagi-Uda construction is used in the research. The proposed on-chip antenna has the combination of two constructions about monopole antenna and the part of the reflector in Yagi-Uda. Then, the second topic, a novel structure for leaky-wave antenna, is introduced here. To decrease back lobe, we can design slots on conventional leaky-wave antenna, and utilize the energy of the reflected wave of the leaky-wave antenna. Here, we design the monopole antenna on the open end of leaky-wave antenna. It can utilize the energy of the reflected wave of the leaky-wave antenna to composite the radiation pattern of leaky-wave antenna to increase frequency scanning range. Due to the reflected wave is guided to the monopole, the back lobe level can be decreased by the method. Finally, the third topic, the high isolation multi-input multi-output (MIMO) antenna is presented. We use some method to decrease the relationship between two antennas like orthogonal quadrature hybrid and resonator. Because the MIMO antenna is designed to apply to the personal motion communication device, the radiation pattern is designed to be omni-directional.