Journal articles on the topic 'Chip-compression ratio'
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Zhou, Jun, and Rong Di Han. "Experimental Investigation of Turning with Magnetized Cutting Emulsion." Key Engineering Materials 426-427 (January 2010): 225–29. http://dx.doi.org/10.4028/www.scientific.net/kem.426-427.225.
Full textDeng, Wen Jun, Ping Lin, Zi Chun Xie, and Qing Li. "Analysis of Large-Strain Extrusion Machining with Different Chip Compression Ratios." Journal of Nanomaterials 2012 (2012): 1–12. http://dx.doi.org/10.1155/2012/851753.
Full textLi, Guo Ning, Yan Yan Liu, Shuang Li Han, and Long Xu Jin. "Design of the JPEG2000 Compression System Based on ADV212." Applied Mechanics and Materials 602-605 (August 2014): 2761–64. http://dx.doi.org/10.4028/www.scientific.net/amm.602-605.2761.
Full textPawade, Raju, Avinash Khadtare, Dhanashree Dhumal, and Vishal Wankhede. "Machinability Assessment in High Speed Turning of High Strength Temperature Resistant Superalloys." Journal of Advanced Manufacturing Systems 18, no. 04 (November 19, 2019): 595–623. http://dx.doi.org/10.1142/s021968671950032x.
Full textPervaiz, Salman, Sathish Kannan, Saqib Anwar, and Dehong Huo. "Machinability analysis of dry and liquid nitrogen–based cryogenic cutting of Inconel 718: experimental and FE analysis." International Journal of Advanced Manufacturing Technology 118, no. 11-12 (October 18, 2021): 3801–18. http://dx.doi.org/10.1007/s00170-021-08173-1.
Full textBhuvaneshwari, P., and T. R. Jaya Chandra Lekha. "Design of Advanced High Performance Bus Tracer in System on Chip Using Matrix Based Compression for Low Power Applications." Journal of Computational and Theoretical Nanoscience 17, no. 4 (April 1, 2020): 1852–56. http://dx.doi.org/10.1166/jctn.2020.8453.
Full textWu, Xian, Yu Zhou, Congfu Fang, Laifa Zhu, Feng Jiang, Ke Sun, Yuan Li, and Yiyang Lin. "Experimental Investigation on the Machinability Improvement in Magnetic-Field-Assisted Turning of Single-Crystal Copper." Micromachines 13, no. 12 (December 4, 2022): 2147. http://dx.doi.org/10.3390/mi13122147.
Full textLiu, Yan Yan, Yin Han Gao, Guo Ning Li, Wen Hua Wang, Ran Feng Zhang, and Long Xu Jin. "Design of High Speed and Parallel Compression System Used in the Big Area CCD of High Frame Frequency." Advanced Materials Research 411 (November 2011): 488–96. http://dx.doi.org/10.4028/www.scientific.net/amr.411.488.
Full textJackson, Mark J., Jameson K. Nelson, Michael D. Whitfield, Jonathan S. Morrell, Rodney G. Handy, and Peter L. Schmidt. "Chip formation and similarity in the plano-grinding of explosive surrogates." Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 232, no. 12 (January 6, 2017): 2071–82. http://dx.doi.org/10.1177/0954405416683972.
Full textHuang, Guilin, Zhengjin Zhang, Honghai Wang, Jiabao Jiang, and Qilin Wu. "Encoding Test Pattern of System-on-Chip (SOC) Using Annular Scan Chain." Security and Communication Networks 2022 (September 2, 2022): 1–7. http://dx.doi.org/10.1155/2022/6974101.
Full textGao, Chong Yang, Bin Fang, and Yuan Tong Gu. "Theoretical Analysis of Serrated Chip Formation Based on Ideal Models in High Speed Cutting." Advanced Materials Research 154-155 (October 2010): 239–45. http://dx.doi.org/10.4028/www.scientific.net/amr.154-155.239.
Full textPi, Yunyun, Xiaolong Yin, Wenjun Deng, and Wei Xia. "Study on Surface Hardness and Microstructure of Pure Copper Chip Strips Prepared by LSEM." Advances in Materials Science and Engineering 2019 (July 8, 2019): 1–9. http://dx.doi.org/10.1155/2019/5254892.
Full textRajak, Abdul, Vilas H. Gaidhane, and Aaron D’costa. "Design and Implementation of a Network Security Chip with Improved Compression Approach." Recent Advances in Electrical & Electronic Engineering (Formerly Recent Patents on Electrical & Electronic Engineering) 13, no. 4 (July 5, 2020): 507–15. http://dx.doi.org/10.2174/2352096512666190423111018.
Full textMostafa, Gody, Abdelhalim Zekry, and Hatem Zakaria. "FPGA implementation of Lempel-Ziv data compression." International Journal of Reconfigurable and Embedded Systems (IJRES) 10, no. 2 (July 1, 2021): 99. http://dx.doi.org/10.11591/ijres.v10.i2.pp99-108.
Full textKim, Mi-Song, Won Sik Hong, and Myeongin Kim. "Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing." Journal of Welding and Joining 39, no. 4 (August 30, 2021): 359–67. http://dx.doi.org/10.5781/jwj.2021.39.4.3.
Full textLeksycki, Kamil, and Eugene Feldshtein. "On the analysis of chip shaping after finishing turning of Ti6Al4V titanium alloy under dry, wet and MQL conditions." Archives of Mechanical Technology and Materials 39, no. 1 (January 1, 2019): 36–40. http://dx.doi.org/10.2478/amtm-2019-0007.
Full textQu, Wei, and Xiao Xin Sun. "Design and Hardware Implementation of Image Compression Denoising Based on Median Filter and Wavelet Transform." Applied Mechanics and Materials 602-605 (August 2014): 3218–22. http://dx.doi.org/10.4028/www.scientific.net/amm.602-605.3218.
Full textYoon, Sungchul, Sungho Jun, Yongkwon Cho, Kilwhan Lee, Hyukjae Jang, and Tae Hee Han. "Optimized Lossless Embedded Compression for Mobile Multimedia Applications." Electronics 9, no. 5 (May 23, 2020): 868. http://dx.doi.org/10.3390/electronics9050868.
Full textLéger, Éric, Benoit Landry, and Gabriel LaPlante. "High flow compression molding for recycling discontinuous long fiber thermoplastic composites." Journal of Composite Materials 54, no. 23 (March 26, 2020): 3343–50. http://dx.doi.org/10.1177/0021998320913625.
Full textWang, Jun. "On-chip frame memory reduction using a high-compression-ratio codec in the overdrives of liquid-crystal displays." Optical Engineering 49, no. 11 (November 1, 2010): 117005. http://dx.doi.org/10.1117/1.3509370.
Full textSun, Shoujin, Milan Brandt, and Matthew S. Dargusch. "Effect of tool wear on chip formation during dry machining of Ti-6Al-4V alloy, part 2: Effect of tool failure modes." Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 231, no. 9 (September 4, 2015): 1575–86. http://dx.doi.org/10.1177/0954405415600011.
Full textDas, Anshuman, S. K. Patel, B. B. Biswal, and Aniket Santoshwar. "Comparative Study of some Machining Characteristics during Hard Turning of Alloy Steel with Untreated and Cryotreated Cermet Inserts." Materials Science Forum 978 (February 2020): 64–76. http://dx.doi.org/10.4028/www.scientific.net/msf.978.64.
Full textGorski, Dmitri, Jan Hill, Per Engstrand, and Lars Johansson. "Review: Reduction of energy consumption in TMP refining through mechanical pre-treatment of wood chips." Nordic Pulp & Paper Research Journal 25, no. 2 (May 1, 2010): 156–61. http://dx.doi.org/10.3183/npprj-2010-25-02-p156-161.
Full textYuan, Haiying, Jiaping Mei, Xun Sun, K. T. Cheng, and Kun Guo. "A Power Efficient Test Data Compression Method on Count Compatible PRL Coding." Journal of Circuits, Systems and Computers 24, no. 06 (May 26, 2015): 1550084. http://dx.doi.org/10.1142/s021812661550084x.
Full textElkhouly, Mohamed, Chang-Soon Choi, Srdjan Glisic, Frank Ellinger, and J. Christoph Scheytt. "A 60 GHz eight-element phased-array receiver front-end in 0.25 µm SiGe BiCMOS technology." International Journal of Microwave and Wireless Technologies 4, no. 6 (September 20, 2012): 579–94. http://dx.doi.org/10.1017/s1759078712000591.
Full textZhu, Chen, Huang, Wang, and Yu. "A High-Efficiency K-band MMIC Linear Amplifier Using Diode Compensation." Electronics 8, no. 5 (April 30, 2019): 487. http://dx.doi.org/10.3390/electronics8050487.
Full textChoe, Young-Joe, Hyohyun Nam, and Jung-Dong Park. "A Compact 5 GHz Power Amplifier Using a Spiral Transformer for Enhanced Power Supply Rejection in 180-nm CMOS Technology." Electronics 8, no. 9 (September 17, 2019): 1043. http://dx.doi.org/10.3390/electronics8091043.
Full textStandke, Mark. "RD53B Wafer Testing for the ATLAS ITk Pixel Detector." Journal of Physics: Conference Series 2374, no. 1 (November 1, 2022): 012087. http://dx.doi.org/10.1088/1742-6596/2374/1/012087.
Full textLakshmi Narayanan, K., G. P. Ramesh, and V. Divya. "Robust and brittle secured video for IOT." International Journal of Engineering & Technology 7, no. 2.20 (April 18, 2018): 93. http://dx.doi.org/10.14419/ijet.v7i2.20.11762.
Full textFang, Hong-Wen, and Chih-Cheng Lu. "A Real Time and Lossless Encoding Scheme for Patch Electrocardiogram Monitors." Applied Sciences 8, no. 12 (November 24, 2018): 2379. http://dx.doi.org/10.3390/app8122379.
Full textMehta, Usha, K. S. Dasgupta, and N. M. Devashrayee. "Weighted Transition Based Reordering, Columnwise Bit Filling, and Difference Vector: A Power-Aware Test Data Compression Method." VLSI Design 2011 (October 5, 2011): 1–8. http://dx.doi.org/10.1155/2011/756561.
Full textStorchak, Michael, Thomas Stehle, and Hans-Christian Möhring. "Determination of the Shear Angle in the Orthogonal Cutting Process." Journal of Manufacturing and Materials Processing 6, no. 6 (October 28, 2022): 132. http://dx.doi.org/10.3390/jmmp6060132.
Full textvan Veen, Co, Bart Vandevelde, and Eric Beyne. "Influence Of Solder Joint Shape On The Thermo-Mechanical Reliability Of CSP's." Journal of Microelectronics and Electronic Packaging 1, no. 2 (January 1, 2004): 53–63. http://dx.doi.org/10.4071/1551-4897-1.2.53.
Full textTseng, Chwan-Lu, Chun-Chieh Hsiao, I.-Chi Chou, Chia-Jung Hsu, Yi-Ju Chang, and Ren-Guey Lee. "DESIGN AND IMPLEMENTATION OF ECG COMPRESSION ALGORITHM WITH CONTROLLABLE PERCENT ROOT-MEAN-SQUARE DIFFERENCE." Biomedical Engineering: Applications, Basis and Communications 19, no. 04 (August 2007): 259–68. http://dx.doi.org/10.4015/s1016237207000343.
Full textPope, Gunnar C., and Ryan J. Halter. "Design and Implementation of an Ultra-Low Resource Electrodermal Activity Sensor for Wearable Applications ‡." Sensors 19, no. 11 (May 29, 2019): 2450. http://dx.doi.org/10.3390/s19112450.
Full textHidei, Volodymyr, Iurii Sidun, Oleksii Hunyak, Svitlana Stanchak, and Volodymyr Bidos. "Application of wastepaper sludge ash as mineral powder for hot asphalt concrete mix." Theory and Building Practice 2020, no. 2 (November 20, 2020): 42–47. http://dx.doi.org/10.23939/jtbp2020.02.042.
Full textMitra, Sanjoy, and Debaprasad Das. "A SoC-IP Core Test Data Compression Scheme based on Error Correcting Hamming Codes." Indonesian Journal of Electrical Engineering and Computer Science 12, no. 3 (December 1, 2018): 933. http://dx.doi.org/10.11591/ijeecs.v12.i3.pp933-940.
Full textLau, John, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen, et al. "Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000576–83. http://dx.doi.org/10.4071/isom-2017-tha35_056.
Full textMuhammad, Riaz. "A Fuzzy Logic Model for the Analysis of Ultrasonic Vibration Assisted Turning and Conventional Turning of Ti-Based Alloy." Materials 14, no. 21 (November 1, 2021): 6572. http://dx.doi.org/10.3390/ma14216572.
Full textLau, John, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen, et al. "Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)." Journal of Microelectronics and Electronic Packaging 14, no. 4 (October 1, 2017): 123–31. http://dx.doi.org/10.4071/imaps.522798.
Full textLiu, Qiang, Guo Hua Fu, Xin Ge Lian, and Jun Wang. "Based on ARM Embedded Remote Data Acquisition System." Advanced Materials Research 614-615 (December 2012): 1566–69. http://dx.doi.org/10.4028/www.scientific.net/amr.614-615.1566.
Full textRahimzadeh, Jason, Fanjie Meng, Fredrick Sachs, Jianbin Wang, Deepika Verma, and Susan Z. Hua. "Real-time observation of flow-induced cytoskeletal stress in living cells." American Journal of Physiology-Cell Physiology 301, no. 3 (September 2011): C646—C652. http://dx.doi.org/10.1152/ajpcell.00099.2011.
Full textSa’don, Norazzlina M., Abdul Razak Abdul Karim, and Siti Noor Linda Taib. "Comparative Strength of Fibre Reinforced Peat and Clayey-Silt by Using Shredded Scrap-Tire." Materials Science Forum 1030 (May 2021): 124–37. http://dx.doi.org/10.4028/www.scientific.net/msf.1030.124.
Full textSaponara, Sergio, Filippo Giannetti, and Bruno Neri. "Design Exploration of mm-Wave Integrated Transceivers for Short-Range Mobile Communications Towards 5G." Journal of Circuits, Systems and Computers 26, no. 04 (December 6, 2016): 1750069. http://dx.doi.org/10.1142/s0218126617500694.
Full textHu, Zheng Fei, Ying Mei Chen, and Min Di Huang. "A 5GHz Analog Laser Diode Driver for Radio-over-Fiber Transmission Applications." Applied Mechanics and Materials 635-637 (September 2014): 1063–66. http://dx.doi.org/10.4028/www.scientific.net/amm.635-637.1063.
Full textOppermann, Hermann, Lothar Dietrich, Matthias Klein, Bernhard Wunderle, and Herbert Reichl. "Nano-Porous Gold Interconnect." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (January 1, 2010): 002249–90. http://dx.doi.org/10.4071/2010dpc-tha31.
Full textZheng, Yi Lin, Ying Mei Chen, Jian Wei Gong, and Jian Guo Yao. "A 2.4GHz Radio-Over-Fiber Laser Diode Drive Amplifier in 0.18-um CMOS." Applied Mechanics and Materials 433-435 (October 2013): 1463–69. http://dx.doi.org/10.4028/www.scientific.net/amm.433-435.1463.
Full textSun, Ke Mei. "Wireless Image Transmission System." Applied Mechanics and Materials 336-338 (July 2013): 1661–64. http://dx.doi.org/10.4028/www.scientific.net/amm.336-338.1661.
Full textJiang, Shuang, Shibin Liu, Chenguang Guo, Xu Fan, Teng Ma, and Prayag Tiwari. "Implementation of ARINC 659 Bus Controller for Space-Borne Computers." Electronics 8, no. 4 (April 16, 2019): 435. http://dx.doi.org/10.3390/electronics8040435.
Full textJang, Seojin, Wei Liu, and Yongbeom Cho. "Convolutional Neural Network Model Compression Method for Software—Hardware Co-Design." Information 13, no. 10 (September 26, 2022): 451. http://dx.doi.org/10.3390/info13100451.
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