Journal articles on the topic 'Chemical-mechanical cleaning'
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Liu, Chi-Wen, Bau-Tong Dai, and Ching-Fa Yeh. "Post cleaning of chemical mechanical polishing process." Applied Surface Science 92 (February 1996): 176–79. http://dx.doi.org/10.1016/0169-4332(95)00226-x.
Full textShang, Cass, Taishih Maw, and Fadi Coder. "Post Chemical Mechanical Polish Cleaning Chemistry for through Silicon via Process." Solid State Phenomena 195 (December 2012): 154–57. http://dx.doi.org/10.4028/www.scientific.net/ssp.195.154.
Full textZhou, Kan, Shuguang Sang, Chengyu Wang, and Yihua Zhou. "Principle, application and development trend of laser cleaning." Journal of Physics: Conference Series 2383, no. 1 (December 1, 2022): 012075. http://dx.doi.org/10.1088/1742-6596/2383/1/012075.
Full textWang, Y. L., T. C. Wang, J. Wu, W. T. Tseng, and C. F. Lin. "A modified multi-chemical spray cleaning process for post shallow trench isolation chemical mechanical polishing cleaning application." Thin Solid Films 332, no. 1-2 (November 1998): 385–90. http://dx.doi.org/10.1016/s0040-6090(98)01207-3.
Full textCooper, Kevin, Anand Gupta, and Stephen Beaudoin. "Simulation of Particle Adhesion: Implications in Chemical Mechanical Polishing and Post Chemical Mechanical Polishing Cleaning." Journal of The Electrochemical Society 148, no. 11 (2001): G662. http://dx.doi.org/10.1149/1.1409975.
Full textKim, Young-Min, Han-Chul Cho, and Hae-Do Jeong. "Effect of Chemical Mechanical Cleaning(CMC) on Particle Removal in Post-Cu CMP Cleaning." Transactions of the Korean Society of Mechanical Engineers A 33, no. 10 (October 1, 2009): 1023–28. http://dx.doi.org/10.3795/ksme-a.2009.33.10.1023.
Full textYang, Chan Ki, Jin Goo Park, Jung Hun Jo, Geun Sik Lim, Tae Hyung Kim, and In Soo Jo. "Removal of Slurry Residues in Tungsten Plug during Chemical Mechanical Planarization." Solid State Phenomena 124-126 (June 2007): 157–60. http://dx.doi.org/10.4028/www.scientific.net/ssp.124-126.157.
Full textRamachandran, Manivannan, Byoung-Jun Cho, Tae-Young Kwon, and Jin-Goo Park. "Hybrid Cleaning Technology for Enhanced Post-Cu/Low-Dielectric Constant Chemical Mechanical Planarization Cleaning Performance." Japanese Journal of Applied Physics 52, no. 5S3 (May 1, 2013): 05FC02. http://dx.doi.org/10.7567/jjap.52.05fc02.
Full textWei, Kuo-Hsiu, Chi-Cheng Hung, Yu-Sheng Wang, Chuan-Pu Liu, Kei-Wei Chen, and Ying-Lang Wang. "Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning." Thin Solid Films 618 (November 2016): 77–80. http://dx.doi.org/10.1016/j.tsf.2016.05.007.
Full textSuzuki, Kazunari, Ki Han, Shoichi Okano, Jyunichiro Soejima, and Yoshikazu Koike. "Application of Novel Ultrasonic Cleaning Equipment Using Waveguide mode for Post-Chemical-Mechanical-Planarization Cleaning." Japanese Journal of Applied Physics 48, no. 7 (July 21, 2009): 07GM04. http://dx.doi.org/10.1143/jjap.48.07gm04.
Full textShay, Kenneth. "Denture Hygiene: A Review and Update." Journal of Contemporary Dental Practice 1, no. 2 (1999): 36–43. http://dx.doi.org/10.5005/jcdp-1-2-36.
Full textPark, Kihong, Sang-hyeon Park, Seokjun Hong, Jongsoo Han, Sanghcuk Jeon, Chang min Kim, and Taesung Kim. "Post Chemical Mechanical Planarization (CMP) Cleaning Using Hydrogen Dissolved Water." ECS Meeting Abstracts MA2021-01, no. 20 (May 30, 2021): 813. http://dx.doi.org/10.1149/ma2021-0120813mtgabs.
Full textTung Ming Pan, Tan Fu Lei, Chao Chyi Chen, Tien Sheng Chao, Ming Chi Liaw, Wen Lu Yang, Ming Shih Tsai, C. P. Lu, and W. H. Chang. "Novel cleaning solutions for polysilicon film post chemical mechanical polishing." IEEE Electron Device Letters 21, no. 7 (July 2000): 338–40. http://dx.doi.org/10.1109/55.847373.
Full textCahue, Kiana A., Abigail L. Dudek, Mantas M. Miliauskas, Tatiana R. Cahue, Amy Mlynarski, and Jason J. Keleher. "Design of “Low Stress” Post-CMP Cleaning Processes for Advanced Technology Nodes." ECS Transactions 108, no. 4 (May 20, 2022): 3–15. http://dx.doi.org/10.1149/10804.0003ecst.
Full textCahue, Kiana A., Abigail L. Dudek, Mantas M. Miliauskas, Tatiana R. Cahue, Amy Mlynarski, and Jason J. Keleher. "Design of “Low Stress” Post-CMP Cleaning Processes for Advanced Technology Nodes." ECS Meeting Abstracts MA2022-01, no. 28 (July 7, 2022): 1242. http://dx.doi.org/10.1149/ma2022-01281242mtgabs.
Full textJamal, Alainna Juliette, Rajni Pantelidis, Rachael Sawicki, Angel Li, Wayne Chiu, Deborah Morrison, John Marshman, et al. "Chemical, Mechanical, and Heat Cleaning to Decontaminate Hospital Drains Harboring Carbapenemase-Producing Enterobacteriales." Infection Control & Hospital Epidemiology 41, S1 (October 2020): s466—s467. http://dx.doi.org/10.1017/ice.2020.1141.
Full textHupka, Lukasz. "SURFACE FORCES IN CHEMICAL MECHANICAL PLANARIZATION AND SEMICONDUCTOR WAFER CLEANING SYSTEMS." Wiadomości Chemiczne 75, no. 9 (October 15, 2021): 1229–40. http://dx.doi.org/10.53584/wiadchem.2021.10.5.
Full textHarada, Ken, Atsushi Ito, Yasuhiro Kawase, Toshiyuki Suzuki, Makoto Hara, Rina Sakae, Chiharu Kimura, and Hidemitsu Aoki. "Study of Cu-Inhibitor State for Post-Chemical Mechanical Polishing Cleaning." Japanese Journal of Applied Physics 50, no. 5S1 (May 1, 2011): 05EC06. http://dx.doi.org/10.7567/jjap.50.05ec06.
Full textZhang, Liming, Srini Raghavan, and Milind Weling. "Minimization of chemical-mechanical planarization (CMP) defects and post-CMP cleaning." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 17, no. 5 (1999): 2248. http://dx.doi.org/10.1116/1.590901.
Full textHarada, Ken, Atsushi Ito, Yasuhiro Kawase, Toshiyuki Suzuki, Makoto Hara, Rina Sakae, Chiharu Kimura, and Hidemitsu Aoki. "Study of Cu-Inhibitor State for Post-Chemical Mechanical Polishing Cleaning." Japanese Journal of Applied Physics 50, no. 5 (May 20, 2011): 05EC06. http://dx.doi.org/10.1143/jjap.50.05ec06.
Full textZhang, F., and A. Busnaina. "Submicron particle removal in post-oxide chemical-mechanical planarization (CMP) cleaning." Applied Physics A: Materials Science & Processing 69, no. 4 (October 1, 1999): 437–40. http://dx.doi.org/10.1007/s003390051028.
Full textSerpokrylov, Nikolai, Alla Smolyanichenko, and Vladimir Nelidin. "Development of technology for water purification by filtration using vibration." E3S Web of Conferences 175 (2020): 12009. http://dx.doi.org/10.1051/e3sconf/202017512009.
Full textHan, Ja Hyung, Ja Eung Koo, Kyo Se Choi, Byung Lyul Park, Ju Hyuk Chung, Sang Rok Hah, Sun Yong Lee, Young Jae Kang, and Jin Goo Park. "A Study on Water-Mark Defects in Copper/Low-k Chemical Mechanical Polishing." Solid State Phenomena 134 (November 2007): 295–98. http://dx.doi.org/10.4028/www.scientific.net/ssp.134.295.
Full textTaylor, Keyanna P., and Debra D Harris. "Cleaning and disinfecting protocols for hospital environmental surfaces: A systematic review of the literature." Journal of Hospital Administration 8, no. 6 (October 22, 2019): 27. http://dx.doi.org/10.5430/jha.v8n6p27.
Full textBhushan, Bharat, and Victor Multanen. "Designing liquid repellent, icephobic and self-cleaning surfaces with high mechanical and chemical durability." Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences 377, no. 2138 (December 24, 2018): 20180270. http://dx.doi.org/10.1098/rsta.2018.0270.
Full textHarada, Ken, Tomohiro Kusano, Toshiaki Shibata, and Yasuhiro Kawase. "Investigation of Co surface reaction by in situ measurement for chemical mechanical planarization and post-chemical mechanical planarization cleaning." Japanese Journal of Applied Physics 57, no. 7S2 (June 20, 2018): 07MD02. http://dx.doi.org/10.7567/jjap.57.07md02.
Full textParisi, Erica I., Nicole Bonelli, Emiliano Carretti, Rodorico Giorgi, Gabriel M. Ingo, and Piero Baglioni. "Film forming PVA-based cleaning systems for the removal of corrosion products from historical bronzes." Pure and Applied Chemistry 90, no. 3 (February 23, 2018): 507–22. http://dx.doi.org/10.1515/pac-2017-0204.
Full textChoi, Jae Gon, Hyo Geun Yoon, Woo Jin Kim, Geun Min Choi, Young Wook Song, and Jin Goo Park. "The Dependence of Chemical Mechanical Polishing Residue Removal on Post-Cleaning Treatments." Solid State Phenomena 134 (November 2007): 303–6. http://dx.doi.org/10.4028/www.scientific.net/ssp.134.303.
Full textMiyamoto, Makoto, Shinya Hirano, Hiroyuki Chibahara, Takashi Watadani, Moriaki Akazawa, and Seiji Furukawa. "Enhancement of Post-Cu-Chemical Mechanical Polishing Cleaning Process for Low-kSubstrate." Japanese Journal of Applied Physics 45, no. 10A (October 6, 2006): 7637–44. http://dx.doi.org/10.1143/jjap.45.7637.
Full textUeda, Takayuki, Keitaro Kubo, Takeshi Saito, Tomokuni Obata, Takeshi Wada, Koichiro Yanagisawa, and Kaoru Sakurai. "Surface morphology of silicone soft relining material after mechanical and chemical cleaning." Journal of Prosthodontic Research 62, no. 4 (October 2018): 422–25. http://dx.doi.org/10.1016/j.jpor.2018.03.002.
Full textManivannan, Ramachandran, Byoung-Jun Cho, Xiong Hailin, Srinivasan Ramanathan, and Jin-Goo Park. "Characterization of non-amine-based post-copper chemical mechanical planarization cleaning solution." Microelectronic Engineering 122 (June 2014): 33–39. http://dx.doi.org/10.1016/j.mee.2014.02.034.
Full textDevarapalli, Vamsi Krishna, Ying Li, and Cetin Cetinkaya. "Post-chemical mechanical polishing cleaning of silicon wafers with laser-induced plasma." Journal of Adhesion Science and Technology 18, no. 7 (January 2004): 779–94. http://dx.doi.org/10.1163/156856104840273.
Full textZhang, Fan, Ahmed A. Busnaina, and Goodarz Ahmadi. "Particle Adhesion and Removal in Chemical Mechanical Polishing and Post‐CMP Cleaning." Journal of The Electrochemical Society 146, no. 7 (July 1, 1999): 2665–69. http://dx.doi.org/10.1149/1.1391989.
Full textBu, Nai Jing, Hong Lei, Ru Ling Chen, and Xiao Li Hu. "Post-CMP Cleaning of Atom-Scale Planarization Surface of Computer Hard Disk Substrate." Advanced Materials Research 97-101 (March 2010): 1181–85. http://dx.doi.org/10.4028/www.scientific.net/amr.97-101.1181.
Full textGupta, R. K., A. Kumar, P. Ganesh, and R. Kaul. "Failure Analysis of Stainless Steel Sheets of Heat Shield Assembly of a Vacuum Degassing Furnace." Practical Metallography 58, no. 1 (January 1, 2021): 48–61. http://dx.doi.org/10.1515/pm-2020-0003.
Full textChoi, Hoo Mi, Jang Ah Kim, Yu Jin Cho, Taeh Yun Hwang, Jon Woo Lee, and Tae Sung Kim. "Surface Cleaning of Graphene by CO2 Cluster." Solid State Phenomena 219 (September 2014): 68–70. http://dx.doi.org/10.4028/www.scientific.net/ssp.219.68.
Full textTudu, Balraj Krishnan, Aditya Kumar, and Bharat Bhushan. "Facile approach to develop anti-corrosive superhydrophobic aluminium with high mechanical, chemical and thermal durability." Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences 377, no. 2138 (December 24, 2018): 20180272. http://dx.doi.org/10.1098/rsta.2018.0272.
Full textCho, Han Chul, Young Min Kim, Hyun Seop Lee, Suk Bae Joo, and Hae Do Jeong. "The Effect of PVA Brush Scrubbing on Post CMP Cleaning Process for Damascene Cu Interconnection." Solid State Phenomena 145-146 (January 2009): 367–70. http://dx.doi.org/10.4028/www.scientific.net/ssp.145-146.367.
Full textSampurno, Yasa, Yun Zhuang, Xun Gu, Sian Theng, Takenao Nemoto, Ting Sun, Fransisca Sudargho, Akinobu Teramoto, Ara Philipossian, and Tadahiro Ohmi. "Effect of Various Cleaning Solutions and Brush Scrubber Kinematics on the Frictional Attributes of Post Copper CMP Cleaning Process." Solid State Phenomena 145-146 (January 2009): 363–66. http://dx.doi.org/10.4028/www.scientific.net/ssp.145-146.363.
Full textZhu, Yong Qiang, Feng Gao, Ping Cao, and Zhan Jun Zhang. "A Preliminary Study on the Effect of WEC Cleaner Papermaking Chemical on the Improvement of Paper Physical Strength." Applied Mechanics and Materials 541-542 (March 2014): 18–24. http://dx.doi.org/10.4028/www.scientific.net/amm.541-542.18.
Full textSahoo, Bichitra N., Sonil Nanda, Janusz A. Kozinski, and Sushanta K. Mitra. "PDMS/camphor soot composite coating: towards a self-healing and a self-cleaning superhydrophobic surface." RSC Advances 7, no. 25 (2017): 15027–40. http://dx.doi.org/10.1039/c6ra28581c.
Full textMahadik, Sonalee Nitin, and V. Balasubramanian. "A Novel Engraving Planarization Innovation to Rectify Non-Consistency Post Chemical Mechanical Cleaning." Indian Journal of Public Health Research & Development 8, no. 3s (2017): 129. http://dx.doi.org/10.5958/0976-5506.2017.00258.3.
Full textStrohwald, N. K. H., and E. P. Jacobs. "An Investigation into UF Systems in the Pretreatment of Seawater for RO Desalination." Water Science and Technology 25, no. 10 (May 1, 1992): 69–78. http://dx.doi.org/10.2166/wst.1992.0238.
Full textSenftleben, Oliver, Hermann Baumgärtner, and Ignaz Eisele. "Cleaning of Silicon Surfaces for Nanotechnology." Materials Science Forum 573-574 (March 2008): 77–117. http://dx.doi.org/10.4028/www.scientific.net/msf.573-574.77.
Full textWirayuni, Kadek Ayu, and Sintha Nugrahini. "JUMLAH KOLONI CANDIDA ALBICANS PADA PLAT RESIN AKRILIK HEAT CURED SETELAH DILAKUKAN PERENDAMAN EKSTRAK DAUN KEMANGI (OCIMUM BASSILICUM LINN) 50%." Interdental Jurnal Kedokteran Gigi (IJKG) 16, no. 2 (December 10, 2020): 61–63. http://dx.doi.org/10.46862/interdental.v16i2.1126.
Full textHeo, Kyuyoung, Brian J. Ree, Kyeung-Keun Choi, and Moonhor Ree. "Structural reliability evaluation of low-k nanoporous dielectric interlayers integrated into microelectronic devices." RSC Advances 5, no. 106 (2015): 87084–89. http://dx.doi.org/10.1039/c5ra16983f.
Full textWang, Lin, Yi Shang, Xia Xiao, Bo Mu, and Guang Wen Zhang. "Research Progress of the Polyurethane-nTiO2 Self-Cleaning Coating." Applied Mechanics and Materials 633-634 (September 2014): 261–65. http://dx.doi.org/10.4028/www.scientific.net/amm.633-634.261.
Full textLi, Jie, Huichao Jia, Jing Lin, Han Luo, Zhenya Liu, Xuewen Xu, Yang Huang, et al. "Free-standing membranes made of activated boron nitride for efficient water cleaning." RSC Advances 5, no. 88 (2015): 71537–43. http://dx.doi.org/10.1039/c5ra11899a.
Full textSundberg, Martin, Anders Christiansson, Cecilia Lindahl, Lotten Wahlund, and Carol Birgersson. "Cleaning effectiveness of chlorine-free detergents for use on dairy farms." Journal of Dairy Research 78, no. 1 (December 7, 2010): 105–10. http://dx.doi.org/10.1017/s0022029910000762.
Full textЛебедев, Валерий, Valeriy Lebedev, Михаил Тамаркин, Mihail Tamarkin, Марина Бойко, and Marina Boiko. "Energy condition of efficient product vibratory cleaning at stage of product preparation to utilization." Science intensive technologies in mechanical engineering 2018, no. 2 (February 20, 2019): 8–15. http://dx.doi.org/10.30987/article_5c486cc3471ce9.56869432.
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