Academic literature on the topic 'Characterization techniques for microelectroniq'
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Journal articles on the topic "Characterization techniques for microelectroniq":
Klymko, N. R., J. A. Casey, L. Tai, J. A. Fitzsimmons, and F. Adar. "Role of Raman Microprobe Spectroscopy in the Characterization of Microelectronic Materials." Microscopy and Microanalysis 7, S2 (August 2001): 150–51. http://dx.doi.org/10.1017/s1431927600026829.
Busch, Brett W., Olivier Pluchery, Yves J. Chabal, David A. Muller, Robert L. Opila, J. Raynien Kwo, and Eric Garfunkel. "Materials Characterization of Alternative Gate Dielectrics." MRS Bulletin 27, no. 3 (March 2002): 206–11. http://dx.doi.org/10.1557/mrs2002.72.
Zhou, Shenglin, Zhaohui Yang, and Xiaohua Zhang. "Characterization tools of thin polymer films." International Journal of Modern Physics B 32, no. 18 (July 15, 2018): 1840007. http://dx.doi.org/10.1142/s0217979218400076.
Huang, Zhiheng, Ziyan Liao, Kaiwen Zheng, Xin Zeng, Yuezhong Meng, Hui Yan, and Yang Liu. "Microstructural Hierarchy Descriptor Enabling Interpretative AI for Microelectronic Failure Analysis." EDFA Technical Articles 26, no. 2 (May 1, 2024): 10–18. http://dx.doi.org/10.31399/asm.edfa.2024-2.p010.
Mouro, João, Rui Pinto, Paolo Paoletti, and Bruno Tiribilli. "Microcantilever: Dynamical Response for Mass Sensing and Fluid Characterization." Sensors 21, no. 1 (December 27, 2020): 115. http://dx.doi.org/10.3390/s21010115.
Murray, Conal E., A. J. Ying, S. M. Polvino, I. C. Noyan, and Z. Cai. "Nanoscale strain characterization in microelectronic materials using X-ray diffraction." Powder Diffraction 25, no. 2 (June 2010): 108–13. http://dx.doi.org/10.1154/1.3394205.
Jansen, K. M. B., V. Gonda, L. J. Ernst, H. J. L. Bressers, and G. Q. Zhang. "State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films." Journal of Electronic Packaging 127, no. 4 (December 22, 2004): 530–36. http://dx.doi.org/10.1115/1.2070092.
Guégan, Hervé. "Use of a Nuclear Microprobe in Electronic Device Characterization." EDFA Technical Articles 9, no. 4 (November 1, 2007): 14–19. http://dx.doi.org/10.31399/asm.edfa.2007-4.p014.
Ruales, Mary, and Kinzy Jones. "Characterization of silicate sensors on Low Temperature Cofire Ceramic (LTCC) substrates using DSC and XRD techniques." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000598–603. http://dx.doi.org/10.4071/isom-2012-wa31.
Nguyen, T. K., L. M. Landsberger, V. Logiudice, and C. Jean. "Electrical characterization of fluorine-implanted gate oxide structures." Canadian Journal of Physics 74, S1 (December 1, 1996): 74–78. http://dx.doi.org/10.1139/p96-836.
Dissertations / Theses on the topic "Characterization techniques for microelectroniq":
Vavrille, Benjamin. "Développement d'une méthode innovante de mesures des propriétés thermomécaniques de films minces. Application à un dispositif imageur." Electronic Thesis or Diss., Université Grenoble Alpes, 2023. http://www.theses.fr/2023GRALI126.
Polymers are very widespread in microelectronics. In addition to their relevant electrical and optical properties for integration, their thermomechanical properties generally exhibit a high contrast with semiconductor substrates, but also with other materials also integrated into microchips, like oxides or metals. This mismatch between materials generally leads to a sharp increase of stresses in the various layers under consideration, which in returns results of a sharp increase in the wafer curvature. Excessive stresses can lead to cracking or delamination, threatening the mechanical integrity of the structure. Knowing the properties of each layer, especially polymer films, enables designers to verify the compatibility of integrated materials and guarantee component reliability. However, to achieve this goal, it is mandatory to develop characterization techniques, especially for thin films deposited on substrates.Thus, the aim of this work is to develop an experimental method to determine the thermomechanical properties of integrated layers, and then to verify the mechanical integrity of microelectronic devices using analytical or numerical simulation tools. This method is based on measuring the variation of curvature during thermal cycles. Then the completion of the polymer cross-linking process can be checked and its temperature of glass transition can be determined. By measuring the thermally induced curvature of two distinct substrates with the same deposited polymer material, the biaxial modulus and the coefficient of thermal expansion of the film are determined. By characterizing a large number of polymers using this technique, we can build up a materials database that can be supplemented with other integrated materials. These data are used in modeling to predict the strain and stress levels of several devices used in microelectronics.In particular, we will study the case of image sensors by performing a predictive calculation of strain and stress distributions of stacks in order to examine the compatibility of different materials. We will also work on the mechanical integrity of these devices, to guarantee their manufacture and reliability over time. We will show that the material selection is eased by structural modeling and a method to study crack initiation and propagation using numerical models
Py, Matthieu. "A study of interfaces and nanostructures by time of flight mass spectrometry : towards a spatially resolved quantitative analysis." Phd thesis, Université de Grenoble, 2011. http://tel.archives-ouvertes.fr/tel-00721832.
Neelamraju, Bharati. "Characterization Techniques for Photonic Materials." Thesis, The University of Arizona, 2016. http://hdl.handle.net/10150/613403.
Bosley, Amber L. "Algae Characterization and Processing Techniques." University of Toledo / OhioLINK, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=toledo1321538296.
FRANCO, CAROLINE SOUSA. "GLASS ELECTROTHERMAL POLING AND CHARACTERIZATION TECHNIQUES." PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIRO, 2004. http://www.maxwell.vrac.puc-rio.br/Busca_etds.php?strSecao=resultado&nrSeq=5435@1.
ERICSSON DO BRASIL
É possível criar uma não-linearidade de segunda ordem em amostras de sílica a partir do processo de polarização. Essas amostras vítreas com o X(2) induzido potencialmente podem ser utilizadas na fabricação de componentes como moduladores ópticos e dobradores de freqüência. O processo de polarização eletrotérmica utiliza alta tensão e alta temperatura e forma uma região de depleção de íons (camada de depleção) onde um campo elétrico intenso é gravado de forma permanente dentro da amostra. Neste trabalho, foram utilizadas diferentes técnicas de caracterização para medir a extensão dessa camada e os resultados foram comparados. As técnicas escolhidas foram: Ataque Químico Interferométrico (com ácido fluorídrico), Maker Fringe, Microscopia Óptica e de Força Atômica e Ataque Interferométrico com Medida de Segundo Harmônico em Tempo Real. Além disso, foram feitos alguns estudos paralelos visando à otimização e a reprodutibilidade do processo de polarização. Foram realizadas dessa forma análises sobre o material dos eletrodos utilizados e sobre a influência da condição inicial da superfície da amostra antes da polarização.
It is possible to create a second order non linearity in silica samples with the poling process. The glass samples with an induced X(2) have a potential application on the fabrication of optical devices such as modulators and frequency converters. In the electrothermal poling process, high voltage and high temperature are applied to the samples forming an ion depleted region (depletion layer), where an intense electric field is permanently recorded. In this work, several characterization techniques have been utilized to measure the width of the depletion layer and compared the obtained results. The chosen techniques were: Interferometric Etching, Maker Fringe, Optical and Atomic Force Microscopy and the Interferometric Etching with Real Time Second Harmonic Measurement. In addition to this, we performed other studies aiming the optimization and reproducibility of the poling process. In this way, we analyzed the material used for the electrodes and the influence of the initial condition of the sample surface before poling.
Damianou, Christakis 1964. "Characterization techniques for contaminated gate oxide." Thesis, The University of Arizona, 1990. http://hdl.handle.net/10150/278760.
Stangoni, Maria Virginia. "Scanning probe techniques for dopant profile characterization /." [S.l.] : [s.n.], 2005. http://e-collection.ethbib.ethz.ch/show?type=diss&nr=16024.
Xia, Huiyong. "Materials characterization using novel ion beam techniques." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1997. http://www.collectionscanada.ca/obj/s4/f2/dsk2/ftp03/NQ28531.pdf.
Wisell, David. "Measurement Techniques for Characterization of Power Amplifiers." Doctoral thesis, Stockholm : KTH School of Electrical Engineering, 2007. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-4566.
George, Lindsay. "Characterization of Unsaturated Soils Using Acoustic Techniques." ScholarWorks @ UVM, 2009. http://scholarworks.uvm.edu/graddis/91.
Books on the topic "Characterization techniques for microelectroniq":
John, Lowell, Chen Ray T, Mathur Jagdish P, and Society of Photo-optical Instrumentation Engineers., eds. Optical characterization techniques for high-performance microelectronic device manufacturing II: 25-26 October 1995, Austin, Texas. Bellingham, Wash: SPIE, 1995.
Damon, DeBusk, Ajuria Sergio, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization), and Electrochemical Society, eds. In-line characterization techniques for performance and yield enhancement in microelectronic manufacturing: 1-2 October 1997, Austin, Texas. Bellingham, Wash., USA: SPIE, 1997.
Sergio, Ajuria, Hossain Tim Z, Society of Photo-optical Instrumentation Engineers., and Solid State Technology (Organization), eds. In-line characterization techniques for performance and yield enhancement in microelectronic manufacturing II: 23-24 September, 1998, Santa Clara, California. Bellingham, Washington: SPIE, 1998.
Maliva, Robert G. Aquifer Characterization Techniques. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-32137-0.
Campbell, D. Polymer characterization: Physical techniques. London: Chapman and Hall, 1989.
Mike, Resso, and Bogatin Eric, eds. Signal integrity characterization techniques. Chicago, Ill: International Engineering Consortium, 2008.
D, Campbell. Polymer characterization: Physical techniques. London: Chapman and Hall, 1989.
D, Campbell. Polymer characterization: Physical techniques. 2nd ed. Cheltenham, Glos., U.K: S. Thornes, 2000.
Ortiz Ortega, Euth, Hamed Hosseinian, Ingrid Berenice Aguilar Meza, María José Rosales López, Andrea Rodríguez Vera, and Samira Hosseini. Material Characterization Techniques and Applications. Singapore: Springer Singapore, 2022. http://dx.doi.org/10.1007/978-981-16-9569-8.
Provder, Theodore, Marek W. Urban, and Howard G. Barth, eds. Hyphenated Techniques in Polymer Characterization. Washington, DC: American Chemical Society, 1994. http://dx.doi.org/10.1021/bk-1994-0581.
Book chapters on the topic "Characterization techniques for microelectroniq":
Herrera Ramirez, Jose Martin, Raul Perez Bustamante, Cesar Augusto Isaza Merino, and Ana Maria Arizmendi Morquecho. "Characterization Techniques." In Unconventional Techniques for the Production of Light Alloys and Composites, 129–65. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-48122-3_8.
Meredith, G. R. "Characterization Techniques." In Nonlinear Optical Effects in Organic Polymers, 385–87. Dordrecht: Springer Netherlands, 1989. http://dx.doi.org/10.1007/978-94-009-2295-2_34.
Hernández Hernández, Marla Berenice, Mario Alberto García-Ramírez, Yaping Dan, Josué A. Aguilar-Martínez, Bindu Krishnan, and Sadasivan Shaji. "Characterization Techniques." In Semiconductors, 95–126. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-02171-9_3.
Eigler, Siegfried, and Ayrat M. Dimiev. "Characterization Techniques." In Graphene Oxide, 85–120. Chichester, UK: John Wiley & Sons, Ltd, 2016. http://dx.doi.org/10.1002/9781119069447.ch3.
Herman, Marian A., and Helmut Sitter. "Characterization Techniques." In Molecular Beam Epitaxy, 135–227. Berlin, Heidelberg: Springer Berlin Heidelberg, 1996. http://dx.doi.org/10.1007/978-3-642-80060-3_4.
Pampillón Arce, María Ángela. "Characterization Techniques." In Growth of High Permittivity Dielectrics by High Pressure Sputtering from Metallic Targets, 41–62. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-66607-5_3.
Arya, Sandeep, and Prerna Mahajan. "Characterization Techniques." In Solar Cells, 211–35. Singapore: Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-99-7333-0_8.
Purkait, Mihir Kumar, and Randeep Singh. "Characterization Techniques." In Membrane Technology in Separation Science, 101–29. Boca Raton : Taylor & Francis, [2018]: CRC Press, 2018. http://dx.doi.org/10.1201/9781315229263-4.
Panoth, Deepthi, Kunnambeth M. Thulasi, Fabeena Jahan, Sindhu Thalappan Manikkoth, Divya Puthussery, Baiju Kizhakkekilikoodayil Vijayan, and Anjali Paravannoor. "Characterization Techniques." In Supercapacitors and Their Applications, 87–104. Boca Raton: CRC Press, 2023. http://dx.doi.org/10.1201/9781003258384-6.
Bolokang, A. S., and M. N. Mathabathe. "Characterization Techniques." In Advanced Materials Processing and Manufacturing, 113–75. New York: CRC Press, 2023. http://dx.doi.org/10.1201/9781003356714-6.
Conference papers on the topic "Characterization techniques for microelectroniq":
Motooka, Teruaki, T. Iwanaga, and M. Koutani. "Ellipsometric characterization techniques for Si processing technologies." In Microelectronic Manufacturing '95, edited by John K. Lowell, Ray T. Chen, and Jagdish P. Mathur. SPIE, 1995. http://dx.doi.org/10.1117/12.221191.
Carpio, Ronald A., and Jon Taylor. "Advanced optical characterization techniques for borophosphosilicate films." In Microelectronic Manufacturing '95, edited by John K. Lowell, Ray T. Chen, and Jagdish P. Mathur. SPIE, 1995. http://dx.doi.org/10.1117/12.221205.
Držík, Milan. "Laser and optical measurement techniques for characterization of microelectronic components." In SPIE Proceedings, edited by Anton Štrba, Dagmar Senderákova, and Miroslav Hrabovský. SPIE, 2005. http://dx.doi.org/10.1117/12.638919.
Paniez, Patrick J., Benedicte P. Mortini, Severine Gally, Alain Prola, Charles Rosilio, and Pierre-Olivier Sassoulas. "Understanding advanced lithographic materials: challenges and new characterization techniques." In Microelectronic Manufacturing Technologies, edited by Chris A. Mack and Tom Stevenson. SPIE, 1999. http://dx.doi.org/10.1117/12.346879.
Drzik, Milan, and Juraj Chlpik. "Mechanical characterization of microelectronic structures by optical vibrational measurements." In Sixth International Conference on Vibration Measurements by Laser Techniques: Advances and Applications. SPIE, 2004. http://dx.doi.org/10.1117/12.579566.
Cristoloveanu, S., M. Bawedin, and I. Ionica. "Special characterization techniques for advanced FDSOI process." In 2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S). IEEE, 2015. http://dx.doi.org/10.1109/s3s.2015.7333543.
Boostandoost, M., X. Ycaza, R. Leihkauf, U. Kerst, and C. Boit. "Challenges for Parametric Analysis of the Solar Cells Using Failure Analysis Technique Developed for the Microelectronics." In ISTFA 2012. ASM International, 2012. http://dx.doi.org/10.31399/asm.cp.istfa2012p0255.
Furlong, Cosme, and Ryszard J. Pryputniewicz. "Advanced OEH Methodology for Evaluation of Microelectronics and Packaging." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39508.
Ogita, Yoh-Ichiro, Hiroshi Shinohara, Tsuyoshi Sawanobori, and Masaki Kurokawa. "Silicon wafer subsurface characterization with blue-laser/microwave and UV-laser/millimeter-wave photoconductivity techniques." In Microelectronic Manufacturing, edited by Sergio A. Ajuria and Tim Z. Hossain. SPIE, 1998. http://dx.doi.org/10.1117/12.324421.
Wise, Michael L., and Stephen W. Downey. "Characterization of Semiconductor Materials by the Photoionization of Sputtered Neutrals Using Ultra-High Laser Intensities." In Laser Applications to Chemical and Environmental Analysis. Washington, D.C.: Optica Publishing Group, 1996. http://dx.doi.org/10.1364/lacea.1996.lfb.6.
Reports on the topic "Characterization techniques for microelectroniq":
Rossabi, J., and S. E. Nave. Characterization of DNAPL Using Fluorescence Techniques. Office of Scientific and Technical Information (OSTI), March 1998. http://dx.doi.org/10.2172/633949.
Siderius, Martin. Acoustic Characterization Techniques for Shallow Water. Fort Belvoir, VA: Defense Technical Information Center, September 2003. http://dx.doi.org/10.21236/ada629541.
Abraham, M. M. (Optical characterization techniques applied to ceramic oxides). Office of Scientific and Technical Information (OSTI), October 1990. http://dx.doi.org/10.2172/6493049.
Ragland, William. Evaluation of Characterization Techniques for Carbon-Carbon Composites. Fort Belvoir, VA: Defense Technical Information Center, May 1992. http://dx.doi.org/10.21236/ada252693.
Cleaver, A. E., P. Huntsman, C. J. Rickwood, E. Berryman, J. Cole, H. P. White, L. He, and P. Unger. Fugitive dust monitoring and characterization techniques: challenges and opportunities. Natural Resources Canada/CMSS/Information Management, 2022. http://dx.doi.org/10.4095/g274826.
Glen, Crystal Chanea, Andres L. Sanchez, Gabriel Anthony Lucero, Randal L. Schmitt, Mark S. Johnson, Matthew S. Tezak, and Brandon Lee Servantes. Aerosol characterization study using multi-spectrum remote sensing measurement techniques. Office of Scientific and Technical Information (OSTI), September 2013. http://dx.doi.org/10.2172/1096516.
Beechem, Iii, Thomas Edwin, Justin Raymond Serrano, and Patrick E. Hopkins. Simultaneous electronic and lattice characterization using coupled femtosecond spectroscopic techniques. Office of Scientific and Technical Information (OSTI), September 2009. http://dx.doi.org/10.2172/1097197.
Meeks, A. M., J. M. Keller, J. M. Giaquinto, and T. Ross. Improved separation techniques for the characterization of radioactive waste samples. Office of Scientific and Technical Information (OSTI), December 1994. http://dx.doi.org/10.2172/28208.
Gala, H., and R. Hucko. Application of surface and bulk characterization techniques for coal preparation. Office of Scientific and Technical Information (OSTI), January 1990. http://dx.doi.org/10.2172/6994530.
Taylor, L. T., J. W. Hellgeth, and A. Sequeira. Coal liquefaction process streams characterization and evaluation. Chromatographic and spectroscopic techniques. Office of Scientific and Technical Information (OSTI), January 1992. http://dx.doi.org/10.2172/10148085.