Journal articles on the topic 'Ceramic multilayer system'
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Partsch, Uwe, Adrian Goldberg, Martin Ihle, Gunter Hagen, and D. Arndt. "Novel Technology Options for Multilayer-Based Ceramic Microsystems." Journal of Microelectronics and Electronic Packaging 8, no. 3 (July 1, 2011): 95–101. http://dx.doi.org/10.4071/imaps.292.
Full textPartsch, Uwe, Adrian Goldberg, Martin Ihle, Gunter Hagen, and D. Arndt. "Novel Technology Options for Multilayer-Based Ceramic Microsystems." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, CICMT (September 1, 2011): 000166–71. http://dx.doi.org/10.4071/cicmt-2011-wa13.
Full textZiesche, Steffen, Adrian Goldberg, Uwe Partsch, Holger Kappert, Heidrun Kind, Mirko Aden, and Falk Naumann. "On-turbine multisensors based on Hybrid Ceramic Manufacturing Technology." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (July 1, 2019): 000107–11. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000107.
Full textCegła, Marcin. "SPECIAL CERAMICS IN MULTILAYER BALLISTIC PROTECTION SYSTEMS." PROBLEMY TECHNIKI UZBROJENIA 147, no. 3/2018 (January 4, 2019): 63–74. http://dx.doi.org/10.5604/01.3001.0012.8312.
Full textGurauskis, Jonas, Antonio Javier Sanchez-Herencia, and Carmen Baudín. "Laminated Ceramic Structures within Alumina / YTZP System Obtained by Low Pressure Joining." Key Engineering Materials 333 (March 2007): 219–22. http://dx.doi.org/10.4028/www.scientific.net/kem.333.219.
Full textQian, Zheng Hua, Feng Jin, Zi Kun Wang, and Kikuo Kishimoto. "The Horizontally Polarized Shear Waves in Multilayered Piezo-Composites with 2-2 Connectivity." Key Engineering Materials 261-263 (April 2004): 465–70. http://dx.doi.org/10.4028/www.scientific.net/kem.261-263.465.
Full textGu, Yan, Yilong Feng, Junfeng Yang, Zhifu Liu, Tong Zhuang, and Yongxiang Li. "Wire-bondable multilayer ceramic capacitors." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (May 1, 2016): 000183–88. http://dx.doi.org/10.4071/2016cicmt-tha14.
Full textWang, Yunda, Ziyang Zhang, Tomoyasu Usui, Michael Benedict, Sakyo Hirose, Joseph Lee, Jamie Kalb, and David Schwartz. "A high-performance solid-state electrocaloric cooling system." Science 370, no. 6512 (October 1, 2020): 129–33. http://dx.doi.org/10.1126/science.aba2648.
Full textMujiyono, Mujiyono, Didik Nurhadiyanto, Alaya Fadllu Hadi Mukhammad, Tri Widodo Besar Riyadi, Kristanto Wahyudi, Nur Kholis, Asri Peni Wulandari, and Shukur bin Abu Hassan. "Damage formations of ramie fiber composites multilayer armour system under high-velocity impacts." Eastern-European Journal of Enterprise Technologies 1, no. 12 (121) (February 24, 2023): 16–25. http://dx.doi.org/10.15587/1729-4061.2023.273788.
Full textHuang, Cheng-Liang, Jsung-Ta Tsai, and Han-Shui Hsueh. "Simplified multilayer ceramic planar filter for wireless communication system." Microwave and Optical Technology Letters 25, no. 4 (May 20, 2000): 233–35. http://dx.doi.org/10.1002/(sici)1098-2760(20000520)25:4<233::aid-mop2>3.0.co;2-s.
Full textKot, Marcin, Kinga Chronowska-Przywara, Łukasz Major, and Juergen Lackner. "Adhesion of Cr/CrN Multilayers to Steel Substrates." Applied Mechanics and Materials 759 (May 2015): 27–35. http://dx.doi.org/10.4028/www.scientific.net/amm.759.27.
Full textCapraro, Beate, Manuel Heidenreich, and Jörg Töpfer. "Large Thermal Expansion LTCC System for Cofiring with Integrated Functional Ceramics Layers." Materials 15, no. 2 (January 12, 2022): 564. http://dx.doi.org/10.3390/ma15020564.
Full textDericioglu, Arcan F., Y. F. Liu, and Yutaka Kagawa. "Extensive deformation behavior of an all-oxide Al2O3-TiO2 nanostructured multilayer ceramic at room temperature." Journal of Materials Research 24, no. 11 (November 2009): 3387–96. http://dx.doi.org/10.1557/jmr.2009.0418.
Full textGu, Xiao Wei, Xiao An Bao, Cheng Hai Yu, Xiong Wei Li, and Li Cao. "Design of Embedded and Miniaturized Multilayer LTCC Hairpin Bandpass Filters." Advanced Materials Research 542-543 (June 2012): 846–49. http://dx.doi.org/10.4028/www.scientific.net/amr.542-543.846.
Full textZhang, Wenli, Yipeng Su, and Fred C. Lee. "Multilayer Ferrite Inductor Substrate for Ceramic-Based High Current Point-of-Load (POL) Converter." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (May 1, 2016): 000039–46. http://dx.doi.org/10.4071/2016cicmt-tp2a2.
Full textNgah, N. A., Amiza Rasmi, Azmi Ibrahim, Zulkifli Ambak, Mohd Zulfadli Mohamed Yusoff, and Rosidah Alias. "Thermal Management Study of LTCC PIN Photodiode Module." Materials Science Forum 934 (October 2018): 13–17. http://dx.doi.org/10.4028/www.scientific.net/msf.934.13.
Full textQuy, Le Minh, and Tran Ich Thinh. "Plastic damage evolution in multilayer coatings/ductile substrate system under spherical indentation: Influence of a metallic interlayer." Vietnam Journal of Mechanics 27, no. 2 (June 28, 2005): 86–95. http://dx.doi.org/10.15625/0866-7136/27/2/5718.
Full textZhu, Ji Jun, Ju Long Yuan, and Simon S. Ang. "Study on the Polishing Mechanism of Low Temperature Co-Fired Ceramic for Microsystem Application." Key Engineering Materials 375-376 (March 2008): 47–51. http://dx.doi.org/10.4028/www.scientific.net/kem.375-376.47.
Full textFerraro, Peter, Sugianto Hanggodo, Ian Burn, Amanda Baker, and Weiguo Qu. "Use of Polyalkylene Carbonate Binders for Improved Performance in Multilayer Ceramic Capacitors." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000785–88. http://dx.doi.org/10.4071/isom-2011-wp4-paper2.
Full textAliouat, M., B. Itaalit, N. Amaouz, and Ahcène Chaouchi. "Low Temperature Sintering and Characterization of MgTiO3." Applied Mechanics and Materials 61 (June 2011): 95–99. http://dx.doi.org/10.4028/www.scientific.net/amm.61.95.
Full textTang, G., and Y. L. Shen. "Numerical Assessment of Compressive Deformation in Metal-Ceramic Multilayer Micro-Pillars." Journal of Mechanics 35, no. 02 (October 30, 2017): 199–207. http://dx.doi.org/10.1017/jmech.2017.96.
Full textEngel, Guenter F. "Material Requirements for Power and High Temperature Multilayer Ceramic Capacitors (MLCC)." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, CICMT (September 1, 2015): 000021–28. http://dx.doi.org/10.4071/cicmt-ta12.
Full textAkhmedov, Abduraxman, Galina Sauchuk, Natallia Yurkevich, Sardorbek Khudoyberganov, Mahammatyakub Bazarov, and Karimberdi Karshiev. "The influence of production conditions on the electrophysical parameters of piezoceramics for different applications." E3S Web of Conferences 264 (2021): 04020. http://dx.doi.org/10.1051/e3sconf/202126404020.
Full textZhu, Xiao Li, Zhong Hua Wang, and Paula M. Vilarinho. "Cu3TeO6 Dielectric Thick Films: Processing by Electrophoretic Deposition and Electrical Characterization." Key Engineering Materials 654 (July 2015): 114–21. http://dx.doi.org/10.4028/www.scientific.net/kem.654.114.
Full textHarun, Zawati, Tze Ching Ong, and Rosli Ahmad. "Estimation of Water Desorption in Drying of Membrane Structure System." Advanced Materials Research 1004-1005 (August 2014): 405–8. http://dx.doi.org/10.4028/www.scientific.net/amr.1004-1005.405.
Full textHuh, Yong Hak, Dong Iel Kim, Dong Jin Kim, Kyung Ho Lee, and Dong Jin Kim. "Measurement of Adhesion Strength for Patterned Single Layer Ceramic Capacitor Sheet." Key Engineering Materials 345-346 (August 2007): 1181–84. http://dx.doi.org/10.4028/www.scientific.net/kem.345-346.1181.
Full textMarkowski, Piotr M. "Multilayer thick-film thermoelectric microgenerator based on LTCC technology." Microelectronics International 33, no. 3 (August 1, 2016): 155–61. http://dx.doi.org/10.1108/mi-05-2016-0038.
Full textHenry, Jim, Orville Brown, Ed Graddy, Ed Stadnicar, and Bob Gardner. "New Ferro L8 LTCC System Ready for High Reliability Electronic Packaging Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, CICMT (September 1, 2011): 000119–26. http://dx.doi.org/10.4071/cicmt-2011-tp31.
Full textBaba, Ryosuke, Tomoaki Karaki, and Tadashi Fujii. "Vertical morphotropic phase boundary in lead-free piezoelectric ceramics (K,Na,Li)NbO3–BaZrO3–(La,Na)TiO3 system." Journal of Advanced Dielectrics 06, no. 02 (June 2016): 1650008. http://dx.doi.org/10.1142/s2010135x16500089.
Full textChen, Z., and J. J. Mecholsky. "Control of strength and toughness of ceramic/metal laminates using interface design." Journal of Materials Research 8, no. 9 (September 1993): 2362–69. http://dx.doi.org/10.1557/jmr.1993.2362.
Full textWang, Xiuwu, Kai Wei, Yong Tao, Xujing Yang, Hao Zhou, Rujie He, and Daining Fang. "Thermal protection system integrating graded insulation materials and multilayer ceramic matrix composite cellular sandwich panels." Composite Structures 209 (February 2019): 523–34. http://dx.doi.org/10.1016/j.compstruct.2018.11.004.
Full textAlonso-Olazabal, Ainhoa, Luis Angel Ortega, Maria Cruz Zuluaga, Graciela Ponce-Antón, Javier Jiménez Echevarría, and Carmen Alonso Fernández. "Compositional Characterization and Chronology of Roman Mortars from the Archaeological Site of Arroyo De La Dehesa De Velasco (Burgo De Osma- Ciudad De Osma, Soria, Spain)." Minerals 10, no. 5 (April 28, 2020): 393. http://dx.doi.org/10.3390/min10050393.
Full textLi, Chuanhao, Mingdong Yi, Gaofeng Wei, and Chonghai Xu. "Synthesis and Mechanical Characterization of a Ti(C,N)/Mo–Co–Ni/CaF2@Al2O3 Self-Lubricating Cermet." Materials 12, no. 23 (November 30, 2019): 3981. http://dx.doi.org/10.3390/ma12233981.
Full textShi, J. Z., X. M. Xie, F. Stubhan, and J. Freytag. "A Novel High Performance Die Attach for Ceramic Packages." Journal of Electronic Packaging 122, no. 2 (March 15, 1999): 168–71. http://dx.doi.org/10.1115/1.483150.
Full textDai, Kun, Ruina Ma, Xing Wang, Zhaoyang Zheng, Yongzhe Fan, Xue Zhao, An Du, and Xiaoming Cao. "Quantifying the Improvement in Dielectric Properties of BaSrTiO3-Based Ceramics by Adding MgO." Materials 15, no. 8 (April 14, 2022): 2875. http://dx.doi.org/10.3390/ma15082875.
Full textWisniewski, Pawel, Ryszard Sitek, Aleksandra Towarek, Emilia Choinska, Dorota Moszczynska, and Jaroslaw Mizera. "Molding Binder Influence on the Porosity and Gas Permeability of Ceramic Casting Molds." Materials 13, no. 12 (June 16, 2020): 2735. http://dx.doi.org/10.3390/ma13122735.
Full textGajdardziska-Josifovska, M., M. R. McCartney, W. J. de Ruijter, C. M. Scanlan, and C. R. Aita. "HREM study of tetragonal zirconia in Al2O3/ZrO2 multilayers." Proceedings, annual meeting, Electron Microscopy Society of America 52 (1994): 754–55. http://dx.doi.org/10.1017/s042482010017150x.
Full textEstournès, Claude, Djar Oquab, Serge Selezneff, Mathieu Boidot, Daniel Monceau, D. Grossin, Christophe Drouet, et al. "Shaping of Nanostructured Materials or Coatings through Spark Plasma Sintering." Materials Science Forum 706-709 (January 2012): 24–30. http://dx.doi.org/10.4028/www.scientific.net/msf.706-709.24.
Full textHarun, Zawati, Nazri Mohd Nawi, Mohd Faizal Batcha, and David Gethin. "Modeling of Layering Ceramic Shell Mould." Applied Mechanics and Materials 232 (November 2012): 548–52. http://dx.doi.org/10.4028/www.scientific.net/amm.232.548.
Full textSchulz, Alexander, Tilo Welker, Nam Gutzeit, Dirk Stoepel, Frank Wollenschlaeger, and Jens Mueller. "Optimized cavities for microwave applications using the new low loss LTCC material Du Pont 9k7." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (September 1, 2012): 000258–62. http://dx.doi.org/10.4071/cicmt-2012-tp65.
Full textPEPIN, JOHN G. "Subsolidus Phase Relations in the System Pd-Ag-O and Application to Multilayer Ceramic Capacitor Electrodes." Advanced Ceramic Materials 3, no. 5 (September 1988): 517–19. http://dx.doi.org/10.1111/j.1551-2916.1988.tb00269.x.
Full textBartnitzek, Thomas, Torsten Thelemann, Stefan Apel, and Karl-Heinz Suphan. "Advantages and limitations of ceramic packaging technologies in harsh applications." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000581–85. http://dx.doi.org/10.4071/isom-2016-thp23.
Full textZaraska, Krzysztof, Janina Gaudyn, Adam Bieńkowski, Marek Dohnalik, Andrzej Czerwiński, Mariusz Płuska, and Monika Machnik. "X-Ray Inspection of LTCC Devices." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, CICMT (September 1, 2011): 000215–23. http://dx.doi.org/10.4071/cicmt-2011-wp13.
Full textZhong, Jie, Dongling Yang, Shuangquan Guo, Xiaofeng Zhang, Xinghua Liang, and Xi Wu. "Rear Earth Oxide Multilayer Deposited by Plasma Spray-Physical Vapor Deposition for Envisaged Application as Thermal/Environmental Barrier Coating." Coatings 11, no. 8 (July 26, 2021): 889. http://dx.doi.org/10.3390/coatings11080889.
Full textDai, Steve, and Lung-Hwa Hsieh. "Miniature Lowpass Filters in Low Loss 9k7 LTCC." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, CICMT (September 1, 2015): 000054–57. http://dx.doi.org/10.4071/cicmt-tp11.
Full textOdinokov, V. I., A. I. Evstigneev, E. A. Dmitriev, D. V. Chernyshova, and A. A. Evstigneeva. "Morphological structure of shell mould in investment casting." Izvestiya. Ferrous Metallurgy 65, no. 10 (October 30, 2022): 740–47. http://dx.doi.org/10.17073/0368-0797-2022-10-740-747.
Full textVereshchaka, A. S., A. A. Vereshchaka, and A. K. Kirillov. "Ecologically Friendly Dry Machining by Cutting Tool from Layered Composition Ceramic with Nano-Scale Multilayered Coatings." Key Engineering Materials 496 (December 2011): 67–74. http://dx.doi.org/10.4028/www.scientific.net/kem.496.67.
Full textKIM, Bok-Hee, Woo-Jin LEE, and Jong-Hee KIM. "Fabrication of Temperature-Stable Multilayer Ceramic Capacitor in the (1 -x-y)PMN-xPT-yPNW Ternary System." Journal of the Ceramic Society of Japan 111, no. 1291 (2003): 212–16. http://dx.doi.org/10.2109/jcersj.111.212.
Full textTick, T., and H. Jantunen. "An X-Ray Imaging-Based Layer Alignment and Tape Deformation Inspection System for Multilayer Ceramic Circuit Boards." IEEE Transactions on Electronics Packaging Manufacturing 31, no. 2 (April 2008): 168–73. http://dx.doi.org/10.1109/tepm.2008.919330.
Full textChun, Doo-Man, Chung-Soo Kim, Jung-Oh Choi, Gil-Yong Lee, Caroline Sunyong Lee, and Sung-Hoon Ahn. "Multilayer deposition of ceramic and metal at room temperature using nanoparticle deposition system (NPDS) and planarization process." International Journal of Advanced Manufacturing Technology 72, no. 1-4 (October 5, 2013): 41–46. http://dx.doi.org/10.1007/s00170-013-5327-9.
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