Books on the topic 'Bonding wire'
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Chauhan, Preeti S., Anupam Choubey, ZhaoWei Zhong, and Michael G. Pecht. Copper Wire Bonding. New York, NY: Springer New York, 2014. http://dx.doi.org/10.1007/978-1-4614-5761-9.
Full textHarman, George G. Wire bonding in microelectronics: Materials, processes, reliability, and yield. 2nd ed. New York: McGraw-Hill, 1997.
Find full textSchwizer, Jürg. Force sensors for microelectronic packaging applications. Berlin: Springer, 2004.
Find full textPrasad, Shankara K. Advanced wirebond interconnection technology. Boston: Kluwer Academic Publishers, 2004.
Find full textHager, Christian. Lifetime estimation of aluminum wire bonds based on computational plasticity. Konstanz: Hartung-Gorre, 2000.
Find full textInternational Society for Hybrid Microelectronics., ed. Reliability and yield problems of wire bonding in microelectronics: The application of materials and interface science. Reston, Va: International Society for Hybrid Microelectronics, 1989.
Find full textM, Mayer, and Brand Oliver 1964-, eds. Force sensors for microelectronic packaging applications. Berlin: Springer, 2005.
Find full textCenter for Women's Resources (Philippines) and International Consultation on Micro-Chips Technology (1986 Manila, Philippines). From bonding wires to banding women: Proceedings of the International Consultation on Micro-Chips Technology, Manila, Philippines, 1986. Quezon City: Center for Women's Resources, 1988.
Find full textCopper Wire Bonding. Springer-Verlag New York Inc., 2013.
Find full textPecht, Michael G., ZhaoWei Zhong, Preeti S. Chauhan, and Anupam Choubey. Copper Wire Bonding. Springer London, Limited, 2013.
Find full textCopper Wire Bonding. Springer New York, 2016.
Find full textWire Bonding In Microelectronics. McGraw-Hill Professional Publishing, 2010.
Find full textGallaugher, Matthew. Surface characterization of gold bonding wire for high density interconnect applications. 2007.
Find full textThe 2006-2011 World Outlook for Saws and Scribing-Fracturing, Die Bonding, and Wire Bonding Semiconductor Assembly Dicing Machines. Icon Group International, Inc., 2005.
Find full textParker, Philip M. The 2007-2012 World Outlook for Saws and Scribing-Fracturing, Die Bonding, and Wire Bonding Semiconductor Assembly Dicing Machines. ICON Group International, Inc., 2006.
Find full textPrasad, Shankara K. Advanced Wirebond Interconnection Technology. Springer, 2004.
Find full textsr, swamy. Strong Bonding of Wife and Husband: S-Formula India. Independently Published, 2017.
Find full textFrom bonding wires to banding women: Proceedings of the International Consultation on Micro-Chips Technology, Manila, Philippines, 1986. Center for Women's Resources, 1988.
Find full textTossell, John A., and David J. Vaughan. Theoretical Geochemistry. Oxford University Press, 1992. http://dx.doi.org/10.1093/oso/9780195044034.001.0001.
Full textKrishnan, Kannan M. Principles of Materials Characterization and Metrology. Oxford University Press, 2021. http://dx.doi.org/10.1093/oso/9780198830252.001.0001.
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