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Journal articles on the topic 'Bonding technology'

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Published: 4 June 2021
Last updated: 19 February 2022

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1

Mori, Kunio. "Molecular Bonding Technology." Journal of Japan Institute of Electronics Packaging 19, no. 2 (2016): 91–102. http://dx.doi.org/10.5104/jiep.19.91.

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2

Kim, Joo-Han, and Chul-Ku Lee. "Laser Micro Bonding Technology." Journal of the Korean Welding and Joining Society 25, no. 2 (April 30, 2007): 1–2. http://dx.doi.org/10.5781/kwjs.2007.25.2.001.

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3

Huschka, M. "Advanced Multilayer Bonding Technology." Circuit World 18, no. 1 (April 1991): 9–13. http://dx.doi.org/10.1108/eb046148.

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4

Miura, Hiroshi. "Technology of Wire Ball Bonding." Journal of SHM 12, no. 2 (1996): 9–13. http://dx.doi.org/10.5104/jiep1993.12.2_9.

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5

Christensen, Lars R., and Jason B. Cope. "Digital technology for indirect bonding." Seminars in Orthodontics 24, no. 4 (December 2018): 451–60. http://dx.doi.org/10.1053/j.sodo.2018.10.009.

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6

Nakamura, K. "Bonding technology on RF-MEMS." Welding International 22, no. 5 (May 2008): 304–9. http://dx.doi.org/10.1080/09507110802200549.

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7

HIMURO, Katsuya, Motoyasu ASAKAWA, and Kenichi YAMAMOTO. "Structural Bonding Technology for Automotive." Journal of The Adhesion Society of Japan 53, no. 8 (August 1, 2017): 283–89. http://dx.doi.org/10.11618/adhesion.53.283.

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8

Qin, Ivy, Aashish Shah, Hui Xu, Bob Chylak, and Nelson Wong. "Advances in Wire Bonding Technology for Different Bonding Wire Material." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000406–12. http://dx.doi.org/10.4071/isom-2015-wp33.

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With all the advances in 2.5D and 3D packaging, wire bonding is still the most popular interconnect technology and the workhorse of the industry. Wire bonding technology has been the lower cost solution comparing to flip chip. Wire bonding package cost is much reduced with the introduction of Copper wire bonding. Technology development and innovation in wire bonding provides new packaging solutions that improves performance and reduces cost. This paper reviews the recent innovations in ball bonding technology to provide optimized ball bonding solutions targeted for different bonding wire material. It examines the different challenges for the alternative wire types including Cu wire, Pd coated, and AuPd coated Cu wire and Ag Alloy wire. We will discuss key development in ball bonding equipment, process and material to overcome the challenges and provide robust low cost solutions. The advantages of each wire type are outlined, and guidelines to select the right bonding wire type per application requirements are provided.
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9

Xiao, Zhi-Xiong, Guo-Ying Wu, Zhi-Hong Li, Guo-Bing Zhang, Yi-Long Hao, and Yang-Yuan Wang. "Silicon–glass wafer bonding with silicon hydrophilic fusion bonding technology." Sensors and Actuators A: Physical 72, no. 1 (January 1999): 46–48. http://dx.doi.org/10.1016/s0924-4247(98)00197-6.

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10

Ishida, Hiroyuki, and Stefan Lutter. "Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers." Journal of Photopolymer Science and Technology 27, no. 2 (2014): 173–76. http://dx.doi.org/10.2494/photopolymer.27.173.

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11

Brožek, M. "Bonding of plywood." Research in Agricultural Engineering 62, No. 4 (November 28, 2016): 198–204. http://dx.doi.org/10.17221/39/2015-rae.

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The contribution contains results of bonded joints strength tests. The tests were carried out according to the modified standard ČSN EN 1465 (66 8510):2009. The spruce three-ply wood of 4 mm thickness was used for bonding according to ČSN EN 636 (49 2419):2013. The test samples of 100 × 25 mm size were cut out from a semi-product of 2,440 × 1,220 mm size in the direction of its longer side (angle 0°), in the oblique direction (angle 45°) and in the direction of its shorter side (crosswise – angle 90°). The bonding was carried out using eight different domestic as well as foreign adhesives according to the technology prescribed by the producer. All used adhesives were designated for wood bonding. At the bonding the consumption of the adhesive was determined. After curing, the bonded assemblies were loaded using a universal tensile-strength testing machine up to the rupture. The rupture force and the rupture type were registered. Finally, the technical-economical evaluation of the experiments was carried out.
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12

Naito, Makio, Hiroya Abe, and Kazuyoshi Sato. "Nanoparticle Bonding Technology for Composite Materials." Advances in Science and Technology 45 (October 2006): 1704–10. http://dx.doi.org/10.4028/www.scientific.net/ast.45.1704.

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Nanoparticle bonding technology can present a promising method for nano/micro structural controls of composite particles as well as composite materials. The nanoparticle bonding can be well conducted by making use of the unique properties of nanoparticle surface at lower temperature without any binder in dry phase. In this paper, the concept of nanoparticle bonding technology is introduced. The examples of nano/micro structural controls of particles including composite particles and the composite materials are shown.
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13

Lee, Chin C., Chen Y. Wang, and Goran Matijasevic. "Advances in Bonding Technology for Electronic Packaging." Journal of Electronic Packaging 115, no. 2 (June 1, 1993): 201–7. http://dx.doi.org/10.1115/1.2909318.

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Recent progress in bonding materials is briefly reviewed with highlights of some of the advantages and disadvantages of the various attachment processes. The principle and experimental results of bonding with multilayer structures of Au-Sn and Au-In are presented. Using solid state as well as liquid phase diffusion of the multilayers, bonding temperatures less than the final melting point of the alloy can be used. This technique therefore allows reversal of the conventional soldering step hierarchy allowing a higher temperature process to follow the multilayer bonding step. Proper deposition of the multilayers inhibits oxidation of tin or indium. Die attachment experiments confirmed that high quality bonding can be obtained as seen in the void-free bonding layer images done by scanning acoustic microscopy. Cross-section examinations with SEM and EDX show near-eutectic alloy formation of good uniformity. Thermal shock tests confirmed the high strength of these solder alloys.
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14

ISHIKAWA, Junzo. "Atomic Bonding Controlling Technology by Beams." SHINKU 36, no. 11 (1993): 833–39. http://dx.doi.org/10.3131/jvsj.36.833.

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15

MIYAIRI, Hiroo. "Applications of Structural Bonding Technology（1）." Journal of the Japan Society of Colour Material 87, no. 5 (2014): 178–82. http://dx.doi.org/10.4011/shikizai.87.178.

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16

MIYAIRI, Hiroo. "Applications of Structural Bonding Technology (2)." Journal of the Japan Society of Colour Material 87, no. 6 (2014): 216–22. http://dx.doi.org/10.4011/shikizai.87.216.

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17

SHI Ya-li, 史亚莉, 张文生 ZHANG Wen-sheng, 徐德 XU De, 张正涛 ZHANG Zheng-tao, and 张娟 ZHANG Juan. "Time/pressure pL micro-bonding technology." Optics and Precision Engineering 19, no. 11 (2011): 2724–30. http://dx.doi.org/10.3788/ope.20111911.2724.

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18

Fujimaki, Hirohiko, and Kazuhito Sano. "Bonding Technology of Copper Stranded Conductors." QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY 11, no. 2 (1993): 277–81. http://dx.doi.org/10.2207/qjjws.11.277.

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19

KANEDA, Tsuyoshi, Hiroshi WATANABE, Yukiharu AKIYAMA, Kunihiro TSUBOSAKI, Asao NISHIMURA, and Kunihiko NISHI. "Development of Coated-Wire Bonding Technology." QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY 16, no. 4 (1998): 540–47. http://dx.doi.org/10.2207/qjjws.16.540.

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20

Tang, Ya-Sheng, Yao-Jen Chang, and Kuan-Neng Chen. "Wafer-level Cu–Cu bonding technology." Microelectronics Reliability 52, no. 2 (February 2012): 312–20. http://dx.doi.org/10.1016/j.microrel.2011.04.016.

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21

MIOKI, Kohshi, Akihiro MOCHIZUKI, Shinichi HIROTA, and Takayuki MIYASHITA. "New Bonding Technology for Dissimilar Materials." NIPPON GOMU KYOKAISHI 90, no. 5 (2017): 268–73. http://dx.doi.org/10.2324/gomu.90.268.

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22

Oglesby, Dave. "Improvements in PCB innerlayer bonding technology." Circuit World 28, no. 3 (September 2002): 22–26. http://dx.doi.org/10.1108/03056120310418448.

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23

De Ying Chen and Guo Hang Tang. "Vacuum microelectronic diode using bonding technology." Sensors and Actuators A: Physical 55, no. 2-3 (July 1996): 149–52. http://dx.doi.org/10.1016/s0924-4247(97)80070-2.

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24

Lau, J. H., S. J. Erasmus, and D. W. Rice. "Overview of Tape Automated Bonding Technology." Circuit World 16, no. 2 (January 1990): 5–24. http://dx.doi.org/10.1108/eb044017.

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25

Büchter, Edwin, Stefan Kreling, Fabian Fischer, and Klaus Dilger. "Reliable bonding using mobile laser technology." ADHESION ADHESIVES&SEALANTS 9, no. 3 (September 2012): 34–39. http://dx.doi.org/10.1365/s35784-012-0064-2.

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26

LyondellBasell, Erik Licht. "Innovative Bonding with Plastics Interface Technology." Plastics Engineering 70, no. 6 (June 2014): 32–33. http://dx.doi.org/10.1002/j.1941-9635.2014.tb01192.x.

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27

Ashcheulov, A. A., O. N. Manik, and S. F. Marenkin. "Cadmium Antimonide: Chemical Bonding and Technology." Inorganic Materials 39 (2003): S59—S68. http://dx.doi.org/10.1023/b:inma.0000008886.21975.f8.

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28

Doobe, Marlene. "Adhesive bonding technology on the move." ADHESION ADHESIVES&SEALANTS 13, no. 2 (June 2016): 3. http://dx.doi.org/10.1007/s35784-016-0019-0.

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29

Lee, Ho Sung, Jong Hoon Yoon, and Joon Tae Yoo. "Manufacturing of Aerospace Parts with Diffusion Bonding Technology." Applied Mechanics and Materials 87 (August 2011): 182–85. http://dx.doi.org/10.4028/www.scientific.net/amm.87.182.

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The objective of this study is to manufacture aerospace components with diffusion bonding technology. Examples produced with this technology consist of thin-sheet diffusion bonding and massive diffusion bonding. The mechanism of diffusion bonding process was presented with schematic microstructure development. Aerospace parts include titanium tanks and a scaled combustion chamber with bonded steel and copper. The microstructure of bonded region shows no indication of heterogeneous phases at interface. It is shown that the diffusion bonding of aerospace materials was successfully performed to manufacture lightweight aerospace parts.
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30

SAEKI, Keiji. "Equipment and Automation Technology-Current State and Future Problems. Flip Chip Bonding Technology and Bonding System." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 11, no. 4 (1996): 240–43. http://dx.doi.org/10.5104/jiep1995.11.240.

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31

Yu, Jin Wei. "Research on Bonding Technology Match of ENEPIG PCB of Digital Microphone." Advanced Materials Research 418-420 (December 2011): 928–31. http://dx.doi.org/10.4028/www.scientific.net/amr.418-420.928.

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By analyzing the crucial structure of digital microphone , it has character of welding and bonding technology, in order to increase reliability of PCB connecting , especially reliability of PCB for IC bonding with chip connecting , ENEPIG PCB is leaded in , and achieve the high reliability connecting . And according to the demand of bonding technology , bonding temperature, bonding machine pressure, bonding power and bonding time are elected , a series of bonding experiments have been done , obtain some related experiment data of bonding point and analyze the data , obtained the plating thickness parameter of matching with ENEPIG PCB .
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32

Shah, Aashish, Gary Schulze, Nestor Mendoza, J. H. Yang, Rob Ellenberg, Ivy Qin, and Bob Chylak. "Advances in Wire Bonding Technology for Overhang Applications." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000456–62. http://dx.doi.org/10.4071/isom-2016-tha36.

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Abstract Wire bonding is the most popular interconnect technology and the workhorse of the semiconductor packaging industry. Wire bonding is widely used for 3D packaging in which multiple dies are often stacked vertically in a ‘stacked die’ configuration. In such packages, one or more dies may be unsupported in an ‘overhang’ (e.g. cantilever beam) configuration. Wire bonding on an overhang die causes die deflection. If not optimized, it may lead to improper ball shape, inconsistent looping, pad crack and die crack issues. Therefore, careful process optimization is needed to have the best outcome in wire bonding performance. This optimization is often tedious and time-consuming. Moreover, recent trends towards minimizing package size (e.g. ultra-thin dies) and increasing number of die stacks add to the challenges of optimizing a wire bonding process for overhang devices. This paper examines the challenges of wire bonding on overhang devices. Finite element analysis (FEA) of overhang devices is presented. Die deflection data obtained from the FEA correlates well with the experimental results obtained on the ball bonder. The FEA results show that die deflection increases significantly with decreasing die thickness and increasing overhang distance. Other factors such as substrate thickness, and bonding temperature also effect die deflection, although less significantly than die thickness and overhang distance. Various considerations for optimizing a ball bonding process on overhang devices are discussed. Experimental results of ball bonding optimization on 50 μm and 75 μm thick overhang devices with different overhang configurations are presented.
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33

Ren, Zhihao, Jikai Xu, Xianhao Le, and Chengkuo Lee. "Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G." Micromachines 12, no. 8 (August 11, 2021): 946. http://dx.doi.org/10.3390/mi12080946.

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Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications of the thin films obtained by wafer bonding technology in the fields of electronics, optical devices, on-chip integrated mid-infrared sensors, and wearable sensors. The fabrication of silicon-on-insulator (SOI) wafers based on the Smart CutTM process, heterogeneous integrations of wide-bandgap semiconductors, infrared materials, and electro-optical crystals via wafer bonding technology for thin-film transfer are orderly presented. Furthermore, device design and fabrication progress based on the platforms mentioned above is highlighted in this work. They demonstrate that the transferred films can satisfy high-performance power electronics, molecular sensors, and high-speed modulators for the next generation applications beyond 5G. Moreover, flexible composite structures prepared by the wafer bonding and de-bonding methods towards wearable electronics are reported. Finally, the outlooks and conclusions about the further development of heterogeneous structures that need to be achieved by the wafer bonding technology are discussed.
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34

MIURA, Kazuma, and Koii SERIZAWA. "Micro-Metal Bonding Technology for LSI Package." Journal of the Society of Materials Science, Japan 50, no. 6Appendix (2001): 127–31. http://dx.doi.org/10.2472/jsms.50.6appendix_127.

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35

Ikesue, Akio, Yan Aung, Tomosumi Kamimura, Sawao Honda, and Yuji Iwamoto. "Composite Laser Ceramics by Advanced Bonding Technology." Materials 11, no. 2 (February 9, 2018): 271. http://dx.doi.org/10.3390/ma11020271.

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36

Yasuda, Kiyokazu. "Ultrasonic Bonding Technology for Micro System Integration." Journal of The Japan Institute of Electronics Packaging 22, no. 5 (August 1, 2019): 395–99. http://dx.doi.org/10.5104/jiep.22.395.

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37

Sakakura, Mitsuaki. "Progress and Perspective of Wire Bonding Technology." Journal of The Japan Institute of Electronics Packaging 22, no. 5 (August 1, 2019): 422–26. http://dx.doi.org/10.5104/jiep.22.422.

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38

Mori, Kunio, and Akihiko Hapoya. "Fluid and Non-fluid Molecular Bonding Technology." Seikei-Kakou 30, no. 3 (February 20, 2018): 103–6. http://dx.doi.org/10.4325/seikeikakou.30.103.

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39

Koo, Ja-Myeong, Jong-Woong Kim, Jeong-Won Yoon, Bo-In Noh, Chang-Yong Lee, Jeong-Hoon Moon, Choong-Don Yoo, and Seung-Boo Jung. "Ultrasonic Bonding Technology for Flip Chip Packaging." Journal of the Korean Welding and Joining Society 26, no. 1 (February 28, 2008): 31–36. http://dx.doi.org/10.5781/kwjs.2008.26.1.031.

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40

HARAGA, Kosuke, Tetsuya NISHIKAWA, and Kazuyoshi TERAMOTO. "Technology of adhesive bonding for electric appliances." Journal of the Japan Welding Society 60, no. 3 (1991): 227–32. http://dx.doi.org/10.2207/qjjws1943.60.227.

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41

Ko, Cheng-Ta, and Kuan-Neng Chen. "Low temperature bonding technology for 3D integration." Microelectronics Reliability 52, no. 2 (February 2012): 302–11. http://dx.doi.org/10.1016/j.microrel.2011.03.038.

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42

Shirouzu, Shunji. "High Performance Bonding Technology for Semiconductor Sensor." HYBRIDS 8, no. 4 (1992): 7–13. http://dx.doi.org/10.5104/jiep1985.8.4_7.

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43

YONENO, Minoru. "Recent Adhesive Bonding Technology in Automotive Industry." Tetsu-to-Hagane 77, no. 7 (1991): 1169–76. http://dx.doi.org/10.2355/tetsutohagane1955.77.7_1169.

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44

Wada, Hiroshi, Hironori Sasaki, and Takeshi Kamijoh. "Wafer bonding technology for optoelectronic integrated devices." Solid-State Electronics 43, no. 8 (August 1999): 1655–63. http://dx.doi.org/10.1016/s0038-1101(99)00115-x.

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45

Morita, Toshiaki, Eiichi Ide, Yusuke Yasuda, Akio Hirose, and Kojiro Kobayashi. "Study of Bonding Technology Using Silver Nanoparticles." Japanese Journal of Applied Physics 47, no. 8 (August 8, 2008): 6615–22. http://dx.doi.org/10.1143/jjap.47.6615.

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46

Evans, D. "Materials technology for magnet insulation and bonding." IEEE Transactions on Appiled Superconductivity 10, no. 1 (March 2000): 1300–1305. http://dx.doi.org/10.1109/77.828474.

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47

MIZUNO, Jun, Katsuyuki SAKUMA, Masatsugu NIMURA, Fumihiro WAKAI, and Shuichi SHOJI. "Thermo-compression Micro Bonding Technology Using Au." Journal of the Japan Society for Precision Engineering 79, no. 8 (2013): 714–18. http://dx.doi.org/10.2493/jjspe.79.714.

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48

Kim, Sun-Chul, and Youngh-Ho Kim. "Low Temperature bonding Technology for Electronic Packaging." Journal of the Microelectronics and Packaging Society 19, no. 1 (March 31, 2012): 17–24. http://dx.doi.org/10.6117/kmeps.2012.19.1.017.

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49

Okikawa, S., M. Tanimoto, H. Watanabe, H. Mikino, and T. Kaneda. "Development of a coated wire bonding technology." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 12, no. 4 (1989): 603–8. http://dx.doi.org/10.1109/33.49022.

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50

Toyozawa, K., K. Fujita, S. Minamide, and T. Maeda. "Development of copper wire bonding application technology." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 13, no. 4 (1990): 667–72. http://dx.doi.org/10.1109/33.62577.

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