Books on the topic 'Bonding technology'

Ulrich, Gösele, ed. Wafer Bonding: Applications and Technology. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004.

Advanced wood adhesives technology. New York: M. Dekker, 1994.

Tong, Q. Y. Semiconductor wafer bonding: Science and technology. New York: John Wiley, 1999.

Handbook of aluminum bonding technology and data. New York: M. Dekker, 1993.

Technology of wood bonding: Principles in practice. New York: Van Nostrand Reinhold, 1992.

Jean-François, Roulet, and Vanherle Guido, eds. Adhesive technology for restorative dentistry. London: Quintessence, 2005.

Suni, Tommi. Direct wafer bonding for MEMS and microelectronics. [Espoo, Finland]: VTT Technical Research Centre of Finland, 2006.

Surface preparation techniques for adhesive bonding. Park Ridge, N.J., U.S.A: Noyes Publications, 1989.

International, Symposium on Semiconductor Wafer Bonding (9th 2006 Cancun Mexico). Simiconductor wafer bonding 9: Science, technology, and applications. Pennington, N.J: The Electrochemical Society, 2006.

Applied adhesive bonding: A practical guide for flawless results. Weinheim: Wiley-VCH, 2009.

Prasad, Shankara K. Advanced wirebond interconnection technology. Boston: Kluwer Academic Publishers, 2004.

1962-, Ye L., ed. Fusion bonding of polymer composites: [from basic mechanisms to process optimisation]. London: Springer, 2002.

Germany) International Conference on Polymer Bonding (2004 Munich. Polymer bonding 2004: 1st international conference focussing on the bonding of rubber and plastics to various substrates : Munich, Germany, 27-28 April 2004. Shawbury: RAPRA Technology, 2004.

International, Symposium on Semiconductor Wafer Bonding: Science Technology and Applications (2nd 1993 Honolulu Hawaii). Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications. Pennington, NJ: Electrochemical Society, 1993.

International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications (1st 1991 Phoenix, Ariz.). Proceedings of the First International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications. Pennington, NJ: Electrochemical Society, 1992.

Evans, R. W. Electrical bonding: A survey of requirements, methods, and specifications. MSFC, Ala: National Aeronautics and Space Administration, Marshall Space Flight Center, 1998.

International Symposium on Semiconductor Wafer Bonding (6th 2001 San Francisco, Calif.). Semiconductor wafer bonding: Science, technology, and applications VI : proceedings of the international symposium. Edited by Baumgart H and Electrochemical Society Electronics Division. Pennington, NJ: Electrochemical Society, 2002.

Goss, Bob. Practical guide to adhesive bonding of small engineering plastic and rubber parts. Shrewsbury: iSmithers, 2010.

International, Symposium on Semiconductor Wafer Bonding (4th 1997 Paris France). Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding: Science, technology, and applications. Pennington, NJ: Electrochemical Society, 1998.

Ignatovich, Lyudmila, and Sergey Shet'ko. Technology of furniture production and joinery. ru: INFRA-M Academic Publishing LLC., 2020. http://dx.doi.org/10.12737/1030852.

Internationales Kolloquium "Verbindungstechnik in der Elektronik" (5th 1990 Fellbach, Germany). Verbindungstechnik in der Elektronik: Vorträge und Poster-Beiträge des 5. Internationalen Kolloquiums in Fellbach, vom 20. bis 22. Februar 1990 : Interconnection technology in electronics : lectures and poster show contributions of the 5th International Conference taking place in Fellbach from February 20th to 22nd, 1990 / organized by the German Welding Society, Düsseldorf. --. Düsseldorf: Deutscher Verlag für Schweisstechnik DVS-Verlag GmbH, 1990.

NIH, Technology Assessment Workshop: the Health Benefits of Pets (1987 Bethesda Md ). NIH Technology Assessment Workshop, Health Benefits of Pets: September 10-11, 1987, Masur Auditorium, Warren Grant Magnuson Clinical Center, National Institutes of Health. Bethesda, Md: The Institutes, 1987.

Sagamore Army Materials Research Conference (35th 1988 Watertown, Mass.). The science and technology of adhesive bonding: Proceedings of the 35th Sagamore Army Materials Research Conference. New York: Gordon and Breach, 1990.

International Meeting on Modern Ceramics Technologies (12th 2010 Montecatini Terme, Italy). Ceramics surfaces for tribology and corrosion & ceramic joining science and technology: 12th international ceramics conference, part C. Stafa-Zurich: Trans Tech Pub., on behalf of Techna Group, 2011.

American Society of Mechanical Engineers. Winter Meeting. Technology of glass, ceramic, or glass-ceramic to metal sealing: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Boston, Massachusetts, December 13-18, 1987. New York, N.Y: American Society of Mechanical Engineers, 1987.

Center for Women's Resources (Philippines) and International Consultation on Micro-Chips Technology (1986 Manila, Philippines). From bonding wires to banding women: Proceedings of the International Consultation on Micro-Chips Technology, Manila, Philippines, 1986. Quezon City: Center for Women's Resources, 1988.

Armstrong, Keith B. Care and repair of advanced composites. 2nd ed. Warrendale, PA: SAE International, 2006.

T, Barrett Richard, ed. Care and repair of advanced composites. Warrendale, Pa: Society of Automotive Engineers, 1998.

Graham, Bevan L., and Cole William F, eds. Care and repair of advanced composites. 2nd ed. Warrendale, Pa: SAE International, 2005.

Swiss Bonding 87 (1987 Technikum Rapperswil). Kleben: Grundlagen, Technologie, Anwendung : [Swiss Bonding 87], 1. Fachseminar am Technikum Rapperswil vom 12.-14. Mai 1987 : Tagungsband. Darmstadt: Hoppenstedt Technik Tabellen Verlag, 1987.

Simonetta, M., A. Gavezzotti, K. D. Warren, and O. Ermer. Bonding Forces. Simonetta M, 2013.

Bonding in Microsystem Technology. Springer, 2006.

Bonding in Microsystem Technology. Dordrecht: Springer Netherlands, 2006. http://dx.doi.org/10.1007/1-4020-4589-1.

Rudawska, Anna. Surface Treatment in Bonding Technology. Elsevier Science & Technology, 2019.

Surface Treatment in Bonding Technology. Elsevier, 2019. http://dx.doi.org/10.1016/c2018-0-01281-5.

M, Alexe, and Gösele U, eds. Wafer bonding: Applications and technology. Berlin: Springer, 2004.

Adhesive bonding: Materials, applications and technology. Weinheim: Wiley-VCH, 2009.

Tong, Q. Y., and U. Gösele. SemiConductor Wafer Bonding: Science and Technology. Wiley-Interscience, 1998.

D, Adams Robert, ed. Adhesive bonding: Science, technology and applications. Cambridge: Woodhead Publishing, 2005.

Adams, Robert D. Adhesive Bonding: Science, Technology and Applications. Elsevier Science & Technology, 2021.

Adhesive Bonding: Science, Technology, and Applications. CRC, 2005.

Ageorges, C., and L. Ye. Fusion Bonding of Polymer Composites. Springer, 2012.

Ageorges, C., and L. Ye. Fusion Bonding of Polymer Composites. Springer, 2002.

Surface Treatment of Materials for Adhesion Bonding. William Andrew Publishing, 2006.

Minford, J. D. Handbook of Aluminum Bonding Technology and Data. CRC Press, 1993. http://dx.doi.org/10.1201/b16947.

Özer, Halil, ed. Applied Adhesive Bonding in Science and Technology. InTech, 2018. http://dx.doi.org/10.5772/intechopen.68926.

Pizzi, A. Wood Adhesives: Chemistry and Technology, VOL. 2. CRC, 1989.

(Contributor), S. Fischer, D. Kurad (Contributor), J. Mehmke (Contributor), K. H. Tytko (Contributor), and D.M.P. Mingos (Editor), eds. Bonding and Charge Distribution in Polyoxometalates, A Bond Valence Approach (Structure and Bonding). Springer, 1999.

Twisk, James Van, and Raymond F. Wegman. Surface Preparation Techniques for Adhesive Bonding. William Andrew, 2012.

S, Iyer Subramanian, Auberton-Hervé Andre J, Institution of Electrical Engineers, and INSPEC (Information service). EMIS Group, eds. Silicon wafer bonding technology: For VLSI and MEMS applications. London: Institution of Electrical Engineers, 2002.