Relevant bibliographies by topics / Bonding technology

Academic literature on the topic 'Bonding technology'

Author: Grafiati
Published: 4 June 2021
Last updated: 19 February 2022

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Journal articles on the topic "Bonding technology"

1

Mori, Kunio. "Molecular Bonding Technology." Journal of Japan Institute of Electronics Packaging 19, no. 2 (2016): 91–102. http://dx.doi.org/10.5104/jiep.19.91.

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Kim, Joo-Han, and Chul-Ku Lee. "Laser Micro Bonding Technology." Journal of the Korean Welding and Joining Society 25, no. 2 (April 30, 2007): 1–2. http://dx.doi.org/10.5781/kwjs.2007.25.2.001.

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Huschka, M. "Advanced Multilayer Bonding Technology." Circuit World 18, no. 1 (April 1991): 9–13. http://dx.doi.org/10.1108/eb046148.

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Miura, Hiroshi. "Technology of Wire Ball Bonding." Journal of SHM 12, no. 2 (1996): 9–13. http://dx.doi.org/10.5104/jiep1993.12.2_9.

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Christensen, Lars R., and Jason B. Cope. "Digital technology for indirect bonding." Seminars in Orthodontics 24, no. 4 (December 2018): 451–60. http://dx.doi.org/10.1053/j.sodo.2018.10.009.

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Nakamura, K. "Bonding technology on RF-MEMS." Welding International 22, no. 5 (May 2008): 304–9. http://dx.doi.org/10.1080/09507110802200549.

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HIMURO, Katsuya, Motoyasu ASAKAWA, and Kenichi YAMAMOTO. "Structural Bonding Technology for Automotive." Journal of The Adhesion Society of Japan 53, no. 8 (August 1, 2017): 283–89. http://dx.doi.org/10.11618/adhesion.53.283.

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Qin, Ivy, Aashish Shah, Hui Xu, Bob Chylak, and Nelson Wong. "Advances in Wire Bonding Technology for Different Bonding Wire Material." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000406–12. http://dx.doi.org/10.4071/isom-2015-wp33.

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With all the advances in 2.5D and 3D packaging, wire bonding is still the most popular interconnect technology and the workhorse of the industry. Wire bonding technology has been the lower cost solution comparing to flip chip. Wire bonding package cost is much reduced with the introduction of Copper wire bonding. Technology development and innovation in wire bonding provides new packaging solutions that improves performance and reduces cost. This paper reviews the recent innovations in ball bonding technology to provide optimized ball bonding solutions targeted for different bonding wire material. It examines the different challenges for the alternative wire types including Cu wire, Pd coated, and AuPd coated Cu wire and Ag Alloy wire. We will discuss key development in ball bonding equipment, process and material to overcome the challenges and provide robust low cost solutions. The advantages of each wire type are outlined, and guidelines to select the right bonding wire type per application requirements are provided.
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Xiao, Zhi-Xiong, Guo-Ying Wu, Zhi-Hong Li, Guo-Bing Zhang, Yi-Long Hao, and Yang-Yuan Wang. "Silicon–glass wafer bonding with silicon hydrophilic fusion bonding technology." Sensors and Actuators A: Physical 72, no. 1 (January 1999): 46–48. http://dx.doi.org/10.1016/s0924-4247(98)00197-6.

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Ishida, Hiroyuki, and Stefan Lutter. "Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers." Journal of Photopolymer Science and Technology 27, no. 2 (2014): 173–76. http://dx.doi.org/10.2494/photopolymer.27.173.

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Dissertations / Theses on the topic "Bonding technology"

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Parameswaran, Lalitha. "Silicon pressure sensor using wafer bonding technology." Thesis, Massachusetts Institute of Technology, 1993. http://hdl.handle.net/1721.1/12471.

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Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993.
Includes bibliographical references (leaves 101-105).
by Lalitha Parameswaran.
M.S.
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Devoto, Roberto J. "Micromachined infrared detector using wafer bonding technology." Thesis, Massachusetts Institute of Technology, 1996. http://hdl.handle.net/1721.1/10579.

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Fiore, Daniel F. "High strength bonding of sapphire." Link to electronic thesis, 2002. http://www.wpi.edu/Pubs/ETD/Available/etd-0829102-155924.

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Parameswaran, Lalitha. "Integrated silicon pressure sensors using wafer bonding technology." Thesis, Massachusetts Institute of Technology, 1997. http://hdl.handle.net/1721.1/10451.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1997.
Includes bibliographical references (p. 151-156).
by Lalitha Parameswaran.
Ph.D.
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Fan, Andy 1976. "Three dimensional integration technology using copper wafer bonding." Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/37915.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2006.
Includes bibliographical references (p. 216-219).
With 3-D integration, the added vertical component could theoretically increase the device density per footprint ratio of a given chip by n-fold, provide a means of heterogeneous integration of devices fabricated from different technologies, and reduce the global RC delay to a non-factor in circuits by using smarter 3-D CAD tools for optimizing device placement. This thesis work will focus primarily on the development and realization of a viable 3-D flow fabricated within MTL. Specifically, the presentation will attempt on answering these questions in regards to 3-D: 1. What enabling technologies were needed for 3-D to work ? 2. Does it really work ? 3. Will the "3-D heat dissipation problem" prevent it from working ? 4. What applications is it good for ? Referring to the first item, a viable 3-D integration flow has been developed on both the wafer-and-die-level, and the enabling technologies were the following: Low temperature Cu-Cu thermocompression bonding, an aluminum-Cu based temporary laminate structure used stabilizing the handle wafer - SOI wafer bond, and tooling optimization of the die-die bonder setup in TRL.
(cont.,) Next, nominal feasibility of the 3-D flow was demonstrated by fabricating a 21-stage and 43-stage CMOS ring oscillators, where each single CMOS inverter / buffer stage was constructed by connecting NMOS-only devices from one substrate with PMOS-only devices from a separate substrate. Proof-of-concept was accomplished when all 92 Cu-Cu bonds, 204 thru-SOI Cu damascene vias, and 56 pairs of MOSFETs communicated simultaneously to produce a 2.75 MHz (43-stage) and 5.5 MHz (21-stage) oscillators, ringing rail-to-rail at 5 V Vdd under proper Vt adjustments on the SOI-PMOS using integrated backgates. Furthermore, to combat the perceived heat dissipation problem in 3-D, this work focused on using the Cu-Cu interlayer bond as heat dissipators, with Cu planes working as flux spreaders and Cu vias as direct heat conduits. Finally, 3-D RF passive integration onto existing chips can be made feasible, under certain device performance trade-offs, by using cobalt magnetic shielding, which offers at least a -10 dB throughout 0-20 GHz, with a max isolation of -24 dB at 13 GHz, at +4 dBm reference input power.
by Andy Fan.
Ph.D.
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Ng, Kay-Yip. "A liquid-shear-stress sensor using wafer-bonding technology." Thesis, Massachusetts Institute of Technology, 1990. http://hdl.handle.net/1721.1/13434.

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Fritz, Mark A. Cassidy Daniel Thomas. "Die bonding of diode lasers /." *McMaster only, 2004.

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Prochaska, A. "Silicon micromachining technology for drop-on-demand liquid dispensers." Thesis, Queen's University Belfast, 2001. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.368466.

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Choi, Yuk-ning Alta. "Repair technology for cracked metallic structures using composite materials /." Hong Kong : University of Hong Kong, 1999. http://sunzi.lib.hku.hk/hkuto/record.jsp?B21213239.

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Wennergren, Karl Fredrik. "Metal Filling of Through Silicon Vias (TSVs) using Wire Bonding Technology." Thesis, KTH, Mikro- och nanosystemteknik, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-145552.

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Through Silicon Vias (TSVs) are vertical interconnections providing the shortest possible signal paths between vertically stacked chips in 3D packaging. In this thesis, TSVs are fabricated and two novel approaches for the metal filling of TSVs are investigated. A wire bonder is utilized to apply TSV core material in the form of gold stud bumps. The metal filling approaches are carried out by 1) squeezing stud bumps down the TSV holes by utilizing a wafer bonder and 2) stacking stud bumps on the outer periphery of the TSV holes and thereby forcing the material further down. Both approaches have successfully filled TSV holes of varying depths and no voids have been observed. The squeezing approach reaches measured depths of up to 52.9 μm and the stacking approach reaches depths of up to 100 μm.
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Books on the topic "Bonding technology"

1

Ulrich, Gösele, ed. Wafer Bonding: Applications and Technology. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004.

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2

Advanced wood adhesives technology. New York: M. Dekker, 1994.

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Tong, Q. Y. Semiconductor wafer bonding: Science and technology. New York: John Wiley, 1999.

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Handbook of aluminum bonding technology and data. New York: M. Dekker, 1993.

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Technology of wood bonding: Principles in practice. New York: Van Nostrand Reinhold, 1992.

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Jean-François, Roulet, and Vanherle Guido, eds. Adhesive technology for restorative dentistry. London: Quintessence, 2005.

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Suni, Tommi. Direct wafer bonding for MEMS and microelectronics. [Espoo, Finland]: VTT Technical Research Centre of Finland, 2006.

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Surface preparation techniques for adhesive bonding. Park Ridge, N.J., U.S.A: Noyes Publications, 1989.

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International, Symposium on Semiconductor Wafer Bonding (9th 2006 Cancun Mexico). Simiconductor wafer bonding 9: Science, technology, and applications. Pennington, N.J: The Electrochemical Society, 2006.

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Applied adhesive bonding: A practical guide for flawless results. Weinheim: Wiley-VCH, 2009.

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Book chapters on the topic "Bonding technology"

1

Bhowmik, Shantanu, R. Benedictus, and Yu Dan. "Adhesive Bonding Technology." In Handbook of Manufacturing Engineering and Technology, 1–17. London: Springer London, 2014. http://dx.doi.org/10.1007/978-1-4471-4976-7_58-2.

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Bhowmik, Shantanu, R. Benedictus, and Yu Dan. "Adhesive Bonding Technology." In Handbook of Manufacturing Engineering and Technology, 765–84. London: Springer London, 2014. http://dx.doi.org/10.1007/978-1-4471-4670-4_58.

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Colinge, J. P. "Basics of Silicon-on-Insulator (SOI) Technology." In Wafer Bonding, 61–83. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-662-10827-7_2.

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Baker, Jill L. "Bonding agents." In Technology of the Ancient Near East, 48–59. Milton Park, Abingdon, Oxon: Routledge, 2018.: Routledge, 2018. http://dx.doi.org/10.4324/9781351188111-6.

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Sakaguchi, K., and T. Yonehara. "ELTRAN® Technology Based on Wafer Bonding and Porous Silicon." In Wafer Bonding, 107–56. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-662-10827-7_4.

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Lutz, Andreas. "Preparation for Bonding." In Handbook of Adhesion Technology, 941–75. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-01169-6_37.

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Lutz, Andreas. "Preparation for Bonding." In Handbook of Adhesion Technology, 1–40. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-42087-5_37-2.

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Lutz, Andreas. "Preparation for Bonding." In Handbook of Adhesion Technology, 1051–89. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-55411-2_37.

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Rose, Joseph L. "Ultrasonic Nondestructive Evaluation Technology for Adhesive Bond and Composite Material Inspection." In Adhesive Bonding, 425–48. Boston, MA: Springer US, 1991. http://dx.doi.org/10.1007/978-1-4757-9006-1_15.

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Peschka, Manfred. "Equipment for Adhesive Bonding." In Handbook of Adhesion Technology, 977–95. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-01169-6_38.

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Conference papers on the topic "Bonding technology"

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Hatada, K., H. Fujimoto, T. Kawakita, and T. Ochi. "A new LSI bonding technology 'Micron bump bonding assembly technology'." In Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle. IEEE, 1988. http://dx.doi.org/10.1109/emts.1988.16142.

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Hu, Xiao-Ming. "Conductive Adhesive Bonding Technology." In 2016 International Conference on Mechanics and Materials Science (MMS2016). WORLD SCIENTIFIC, 2017. http://dx.doi.org/10.1142/9789813228177_0042.

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Yang, Guohua, Guorong He, Wanhua Zheng, and Lianghui Chen. "Direct wafer bonding technology employing vacuum-cavity pre-bonding." In Asia-Pacific Optical Communications, edited by Yong Hee Lee, Fumio Koyama, and Yi Luo. SPIE, 2006. http://dx.doi.org/10.1117/12.688864.

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Ruiz, A., E. Vega, R. Katiyar, and R. Valentin. "Novel Enabling Wire Bonding Technology." In 2007 Electronic Components and Technology Conference. IEEE, 2007. http://dx.doi.org/10.1109/ectc.2007.373837.

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Ho, Hong Meng. "Advanced copper wire bonding technology." In 2010 34th International Electronics Manufacturing Technology Conference (IEMT). IEEE, 2010. http://dx.doi.org/10.1109/iemt.2010.5746772.

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Suga, Tadatomo, and Fengwen Mu. "Surface Activated Bonding Method for Low Temperature Bonding." In 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE, 2018. http://dx.doi.org/10.1109/estc.2018.8546367.

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Melanio, Rodan, Robert Altar, and Regine Cervantes. "Copper bonding on thin top metal bonding pad." In 2014 IEEE 36th International Electronics Manufacturing Technology Conference (IEMT). IEEE, 2014. http://dx.doi.org/10.1109/iemt.2014.7123111.

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Tok, C. W., I. Langut, A. Menache, D. R. M. Calpito, and Y. H. Chew. "Wire Bonding Improvement through Optimal Bonding Tools and Materials Selection." In 2007 9th Electronics Packaging Technology Conference. IEEE, 2007. http://dx.doi.org/10.1109/eptc.2007.4469785.

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Ji, Hongjun, Mingyu Li, and Chunqing Wang. "Interfacial Characterization and Bonding Mechanism of Ultrasonic Wedge Bonding." In 2006 7th International Conference on Electronic Packaging Technology. IEEE, 2006. http://dx.doi.org/10.1109/icept.2006.359760.

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Ishikawa, Dai, Hideo Nakako, Yuki Kawana, Chie Sugama, Motohiro Negishi, Yoshinori Ejiri, Suguru Ueda, et al. "Copper Die-Bonding Sinter Paste: Sintering and Bonding Properties." In 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE, 2018. http://dx.doi.org/10.1109/estc.2018.8546455.

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Reports on the topic "Bonding technology"

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Hunter, Scott R., and Marty Efird. Superhydrophobic Materials Technology-PVC Bonding Techniques. Office of Scientific and Technical Information (OSTI), May 2013. http://dx.doi.org/10.2172/1078118.

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