Journal articles: 'Bonding mechanisms'

1

LUANGTANAANAN, M., and J. FELL. "Bonding mechanisms in tabletting." International Journal of Pharmaceutics 60, no. 3 (May 21, 1990): 197–202. http://dx.doi.org/10.1016/0378-5173(90)90073-d.

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Van Helvoort, A. T. J., K. M. Knowles, and J. A. Fernie. "Joining Mechanisms in Electrostatic Bonding." Key Engineering Materials 264-268 (May 2004): 649–54. http://dx.doi.org/10.4028/www.scientific.net/kem.264-268.649.

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3

Levine, Lee. "Wire Bonding: The Ultrasonic Bonding Mechanism." International Symposium on Microelectronics 2020, no. 1 (September 1, 2020): 000230–34. http://dx.doi.org/10.4071/2380-4505-2020.1.000230.

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Abstract Wire bonding is a welding process. During both ball and wedge bonding, wire and bond pad are massively deformed between the bond tool and the anvil of the bond pad or substrate. The dominant variables affecting deformation are ultrasonic energy, temperature, bond force and bond time. Deformation exposes new surface material that is clean and has not been exposed to atmospheric contamination and oxidation. As the new wire and bond pad surfaces mix, they form diffusion couples that grow and transform into the intermetallic weld nugget. The initial mixing is not at equilibrium in that it does not initially form the compounds described by the equilibrium phase diagram, but temperature and time very quickly allows diffusion to relax the initial mixture into the equilibrium phase diagram compounds. This paper will discuss the mechanisms behind the formation of ball and wedge bonds.

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4

Long, Yangyang, Folke Dencker, Andreas Isaak, Chun Li, Friedrich Schneider, Jörg Hermsdorf, Marc Wurz, Jens Twiefel, and Jörg Wallaschek. "Revealing of ultrasonic wire bonding mechanisms via metal-glass bonding." Materials Science and Engineering: B 236-237 (October 2018): 189–96. http://dx.doi.org/10.1016/j.mseb.2018.11.010.

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Kaabi, A., Y. Bienvenu, D. Ryckelynck, L. Prévond, and B. Pierre. "Architectured bimetallic laminates by roll bonding: bonding mechanisms and applications." Materials Science and Technology 30, no. 7 (December 6, 2013): 782–90. http://dx.doi.org/10.1179/1743284713y.0000000412.

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Wu, H., and S. Lee. "Effect of bonding variables on bonding mechanisms in press bonding superplastic 8090 aluminium alloy." Materials Science and Technology 17, no. 8 (August 2001): 906–11. http://dx.doi.org/10.1179/026708301101510915.

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7

Loehman, Ronald E., Antoni P. Tomsia, Joseph A. Pask, and Sylvia M. Johnson. "Bonding Mechanisms in Silicon Nitride Brazing." Journal of the American Ceramic Society 73, no. 3 (March 1990): 552–58. http://dx.doi.org/10.1111/j.1151-2916.1990.tb06552.x.

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8

Philip, M. "Materials, bonding mechanisms and physical properties." Physics Education 32, no. 3 (May 1997): 145–48. http://dx.doi.org/10.1088/0031-9120/32/3/011.

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Kozlov, Sergey M., Francesc Viñes, and Andreas Görling. "Bonding Mechanisms of Graphene on Metal Surfaces." Journal of Physical Chemistry C 116, no. 13 (March 19, 2012): 7360–66. http://dx.doi.org/10.1021/jp210667f.

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Rieutord, Francois, H. Moriceau, Rémi Beneyton, Luciana Capello, Christophe Morales, and Anne-Marie Charvet. "Rough Surface Adhesion Mechanisms for Wafer Bonding." ECS Transactions 3, no. 6 (December 21, 2019): 205–15. http://dx.doi.org/10.1149/1.2357071.

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11

Rebhan, B., and K. Hingerl. "Physical mechanisms of copper-copper wafer bonding." Journal of Applied Physics 118, no. 13 (October 7, 2015): 135301. http://dx.doi.org/10.1063/1.4932146.

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12

Plach, T., K. Hingerl, S. Tollabimazraehno, G. Hesser, V. Dragoi, and M. Wimplinger. "Mechanisms for room temperature direct wafer bonding." Journal of Applied Physics 113, no. 9 (March 7, 2013): 094905. http://dx.doi.org/10.1063/1.4794319.

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13

Deng, Youjun, Ana Luisa Barrientos Velázquez, Ferenc Billes, and Joe B. Dixon. "Bonding mechanisms between aflatoxin B1 and smectite." Applied Clay Science 50, no. 1 (September 2010): 92–98. http://dx.doi.org/10.1016/j.clay.2010.07.008.

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Fu, C. L., and M. H. Yoo. "Bonding mechanisms and point defects in TiAl." Intermetallics 1, no. 1 (January 1993): 59–63. http://dx.doi.org/10.1016/0966-9795(93)90022-n.

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15

Ramsey, M. J., and M. H. Lewis. "Interfacial reaction mechanisms in Syalon ceramic bonding." Materials Science and Engineering 71 (May 1985): 113–22. http://dx.doi.org/10.1016/0025-5416(85)90213-7.

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16

Shie, Kai-Cheng, Po-Ning Hsu, Yu-Jin Li, Dinh-Phuc Tran, and Chih Chen. "Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling." Materials 14, no. 19 (September 24, 2021): 5522. http://dx.doi.org/10.3390/ma14195522.

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The failure mechanisms of Cu–Cu bumps under thermal cycling test (TCT) were investigated. The resistance change of Cu–Cu bumps in chip corners was less than 20% after 1000 thermal cycles. Many cracks were found at the center of the bonding interface, assumed to be a result of weak grain boundaries. Finite element analysis (FEA) was performed to simulate the stress distribution under thermal cycling. The results show that the maximum stress was located close to the Cu redistribution lines (RDLs). With the TiW adhesion layer between the Cu–Cu bumps and RDLs, the bonding strength was strong enough to sustain the thermal stress. Additionally, the middle of the Cu–Cu bumps was subjected to tension. Some triple junctions with zig-zag grain boundaries after TCT were observed. From the pre-existing tiny voids at the bonding interface, cracks might initiate and propagate along the weak bonding interface. In order to avoid such failures, a postannealing bonding process was adopted to completely eliminate the bonding interface of Cu–Cu bumps. This study delivers a deep understanding of the thermal cycling reliability of Cu–Cu hybrid joints.

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Boccaccini, D. N., O. Sevecek, H. L. Frandsen, I. Dlouhy, S. Molin, M. Cannio, J. Hjelm, and P. V. Hendriksen. "Investigation of the bonding strength and bonding mechanisms of SOFCs interconnector–electrode interfaces." Materials Letters 162 (January 2016): 250–53. http://dx.doi.org/10.1016/j.matlet.2015.07.137.

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18

Rezaei Anvar, Behrouz, and Abbas Akbarzadeh. "Roll bonding of AA5052 and polypropylene sheets: Bonding mechanisms, microstructure and mechanical properties." Journal of Adhesion 93, no. 7 (December 30, 2015): 550–74. http://dx.doi.org/10.1080/00218464.2015.1116067.

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19

Nishiguchi, Kimiyuki, Yasuo Takahashi, and Tsutomu Koguchi. "Analysis of the solid state bonding process by the diagrams of bonding mechanisms." QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY 4, no. 2 (1986): 311–16. http://dx.doi.org/10.2207/qjjws.4.311.

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20

Abdul Razak, S. N., and A. R. Othman. "A Review on the Performance of Adhesive Bonding in Polymer Composite Joints." Key Engineering Materials 471-472 (February 2011): 610–15. http://dx.doi.org/10.4028/www.scientific.net/kem.471-472.610.

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Past and on-going research works on adhesive bonding in composite and sandwich were reviewed. Discussion was emphasized on critical failure mechanisms (e.g. mechanism of peel fracture) to enhance the performance of the bonding. This paper also focused on the application of good adhesive bonding in the application of sandwich structures. Debonding between skin and core is one of the failure mechanisms that should be given more attention in fabrication of sandwich structures. Incorporating fillet in composite bonding is one of the alternative ways to reduce the stress concentration at the edges of overlap length and to produce high peel strength for bonding. Basic understanding of the designs, theories and manufacturing of adhesive bonding were also presented. Several important parameters in the design such as the strain energy release rate (SERR) and formation of fillet also discussed. The analysis of SERR using virtual crack closure technique (VCCT) has also been highlighted to achieve high strength of adhesive bonding, providing the key element for optimization of the delamination resistance in maximizing energy absorption during fracture. Significant challenges or limitations in improving and optimizing the design were also highlighted.

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21

Indah Lestari, Rohmini, Sugeng Wahyudi, Harjum Muharam, and Mohamad Nur Utomo. "THE ROLE OF MONITORING AND BONDING MECHANISMS OF GOOD CORPORATE GOVERNANCE TOWARDS BANKS PERFORMANCE." Humanities & Social Sciences Reviews 8, no. 2 (March 28, 2020): 328–36. http://dx.doi.org/10.18510/hssr.2020.8237.

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Purpose of the study: This paper aims to examine the effects of the monitoring mechanism and bonding mechanism of corporate governance on the performance of the bank. The monitoring mechanism is divided into an external mechanism, represented by concentrated ownership, and the internal mechanism is represented by the proportion of independent board. Bonding mechanism is measured issuance of bonds as long-term debt financing. Methodology: This study is predictive and exploratory, so the Partial Least Squares Structural Equation Modeling using a WarpPLS60 application. Researchers use data from 24 banks that constantly has the value of bonds circulated, which from 2011 to 2018. There are consists of 4 state-owned commercial banks, 13 private banks, and 7 regional government-owned banks. Main Findings: The researcher found that external monitoring mechanisms as measured by ownership concentration, positively and significantly influence the performance at government-owned banks. Internal monitoring mechanism, as measured by the percentage of the number of independent commissioners, positively and significantly affects the performance at all the banks. The bonding mechanism as measured by issuing bonds negatively and significantly affects the performance of all the banks. Applications of this study: The integrative multi-theory model proposed by the authors in this study is a unique contribution to the intermediary financial literature. Banks seeking to maximize their performance must be balanced with the interests of shareholders and their stakeholders. Novelty/Originality of this study: The study examined the differences in behaviour and the role of monitoring and bonding mechanisms of corporate governance in state-owned banks and private. The results of this study contribute to the theory of entrenchment and financial intermediation.

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22

Bai, S. L., C. M. L. Wu, Y. W. Mai, H. M. Zeng, and R. K. Y. Li. "Failure Mechanisms of Sisal Fibres in Composites." Advanced Composites Letters 8, no. 1 (January 1999): 096369359900800. http://dx.doi.org/10.1177/096369359900800102.

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Model specimens, each containing five embedded continuous sisal fibres in an epoxy matrix, were subjected to four-point bending tests. The micro-failure behaviour of sisal fibres was examined using scanning electron microscopy (SEM). Interfacial debonding of both sisal fibre bundle/epoxy matrix and tubular micro-fibre/bonding material was also noted in all embedded fibres. The fibre bundle/matrix interface had a moderate high strength; but the adhesive strength between the micro-tubular fibre and the bonding material appeared to be small.

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23

Walker, Michael. "Microstructure and bonding mechanisms in cold spray coatings." Materials Science and Technology 34, no. 17 (June 11, 2018): 2057–77. http://dx.doi.org/10.1080/02670836.2018.1475444.

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24

Johnson, Zachary V., and Larry J. Young. "Neurobiological mechanisms of social attachment and pair bonding." Current Opinion in Behavioral Sciences 3 (June 2015): 38–44. http://dx.doi.org/10.1016/j.cobeha.2015.01.009.

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25

Schmidt, Reinhard H., and Gerd R. Wagner. "Risk distribution and bonding mechanisms in industrial marketing." Journal of Business Research 13, no. 5 (October 1985): 421–33. http://dx.doi.org/10.1016/0148-2963(85)90022-0.

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26

Treheux, D., P. Lourdin, B. Mbongo, and D. Juve. "Metal-ceramic solid state bonding: Mechanisms and mechanics." Scripta Metallurgica et Materialia 31, no. 8 (October 1994): 1055–60. http://dx.doi.org/10.1016/0956-716x(94)90526-6.

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27

Zhou, Liying, Shaobo Feng, Mingyue Sun, Bin Xu, and Dianzhong Li. "Interfacial microstructure evolution and bonding mechanisms of 14YWT alloys produced by hot compression bonding." Journal of Materials Science & Technology 35, no. 8 (August 2019): 1671–80. http://dx.doi.org/10.1016/j.jmst.2019.04.005.

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28

Numan, Michael, and Larry J. Young. "Neural mechanisms of mother–infant bonding and pair bonding: Similarities, differences, and broader implications." Hormones and Behavior 77 (January 2016): 98–112. http://dx.doi.org/10.1016/j.yhbeh.2015.05.015.

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29

Song, Xiaohui, Shunli Wu, and Rui Zhang. "Computational Study on Surface Bonding Based on Nanocone Arrays." Nanomaterials 11, no. 6 (May 21, 2021): 1369. http://dx.doi.org/10.3390/nano11061369.

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Surface bonding is an essential step in device manufacturing and assembly, providing mechanical support, heat transfer, and electrical integration. Molecular dynamics simulations of surface bonding and debonding failure of copper nanocones are conducted to investigate the underlying adhesive mechanism of nanocones and the effects of separation distance, contact length, temperature, and size of the cones. It is found that van der Waals interactions and surface atom diffusion simultaneously contribute to bonding strength, and different adhesive mechanisms play a main role in different regimes. The results reveal that increasing contact length and decreasing separation distance can simultaneously contribute to increasing bonding strength. Furthermore, our simulations indicate that a higher temperature promotes diffusion across the interface so that subsequent cooling results in better adhesion when compared with cold bonding at the same lower temperature. It also reveals that maximum bonding strength was obtained when the cone angle was around 53°. These findings are useful in designing advanced metallic bonding processes at low temperatures and pressure with tenable performance.

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30

Bayse, Craig A. "Halogen bonding from the bonding perspective with considerations for mechanisms of thyroid hormone activation and inhibition." New Journal of Chemistry 42, no. 13 (2018): 10623–32. http://dx.doi.org/10.1039/c8nj00557e.

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31

Wang, Chenxi, Yannan Liu, Yue Li, Yanhong Tian, Chunqing Wang, and Tadatomo Suga. "Mechanisms for Room-Temperature Fluorine Containing Plasma Activated Bonding." ECS Journal of Solid State Science and Technology 6, no. 7 (2017): P373—P378. http://dx.doi.org/10.1149/2.0081707jss.

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32

Ashworth, M. A., M. H. Jacobs, and S. Davies. "Basic mechanisms and interface reactions in HIP diffusion bonding." Materials & Design 21, no. 4 (August 2000): 351–58. http://dx.doi.org/10.1016/s0261-3069(99)00088-6.

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33

Cher Ming Tan and Zhenghao Gan. "Failure mechanisms of aluminum bondpad peeling during thermosonic bonding." IEEE Transactions on Device and Materials Reliability 3, no. 2 (June 2003): 44–50. http://dx.doi.org/10.1109/tdmr.2003.814408.

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34

Cooter, Robert, and Winand Emons. "Truth-Bonding and Other Truth-Revealing Mechanisms for Courts." European Journal of Law and Economics 17, no. 3 (May 2004): 307–27. http://dx.doi.org/10.1023/b:ejle.0000028643.10059.9f.

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35

Kubo, Shisei, Werner J. Finger, Michael Müller, and Wolfgang Podszun. "Principles and Mechanisms of Bonding with Dentin Adhesive Materials." Journal of Esthetic and Restorative Dentistry 3, no. 2 (March 1991): 62–69. http://dx.doi.org/10.1111/j.1708-8240.1991.tb00812.x.

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36

Selvaduray, Guna S. "Die bond materials and bonding mechanisms in microelectronic packaging." Thin Solid Films 153, no. 1-3 (October 1987): 431–45. http://dx.doi.org/10.1016/0040-6090(87)90203-3.

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37

Long, Yangyang, Folke Dencker, Andreas Isaak, Jörg Hermsdorf, Marc Wurz, and Jens Twiefel. "Self-cleaning mechanisms in ultrasonic bonding of Al wire." Journal of Materials Processing Technology 258 (August 2018): 58–66. http://dx.doi.org/10.1016/j.jmatprotec.2018.03.016.

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38

Bogatov, A. A., and D. R. Salikhyanov. "Development of Bonding Mechanisms for Different Materials During Forming." Metallurgist 60, no. 11-12 (March 2017): 1175–79. http://dx.doi.org/10.1007/s11015-017-0424-x.

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39

Chen, Yuan, and Xiao Wen Zhang. "Applications of Focused Ion Beam Technology in Bonding Failure Analysis for Microelectronic Devices." Applied Mechanics and Materials 58-60 (June 2011): 2171–76. http://dx.doi.org/10.4028/www.scientific.net/amm.58-60.2171.

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Focused ion beam (FIB) system is a powerful microfabrication tool which uses electronic lenses to focus the ion beam even up to nanometer level. The FIB technology has become one of the most necessary failure analysis and failure mechanism study tools for microelectronic device in the past several years. Bonding failure is one of the most common failure mechanisms for microelectronic devices. But because of the invisibility of the bonding interface, it is difficult to analyze this kind of failure. The paper introduced the basic principles of FIB technology. And two cases for microelectronic devices bonding failure were analyzed successfully by FIB technology in this paper.

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40

Gretzinger, Susanne, and Birgit Leick. "Brokerage-based value creation: the case of a Danish offshore business network." IMP Journal 11, no. 3 (October 16, 2017): 353–75. http://dx.doi.org/10.1108/imp-02-2016-0004.

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Purpose Social capital plays an important role in transforming knowledge within and across inter-firm business networks in industries. The purpose of this paper is to explore different kinds of transfer mechanism such as “bonding,” “bridging,” and “protecting” within a case network of the Danish offshore windmill industry. Its aim is to describe how these mechanisms interactively support value co-creation among the involved enterprises and how social capital, residing in the relationships between actors from the firms, is influenced by the different transfer mechanisms. Design/methodology/approach Based upon a single case study, the paper demonstrates “bonding,” “bridging,” and “protecting” as distinct, yet related, mechanisms for inter-firm business networking. The sample used covers selected key actors from the network as well as third-party experts from the Danish windmill industry, which together represent the most important knowledge-offering and knowledge-demanding domains. Findings Activities associated with “bridging” and “bonding” clearly matter for creating value for the business network and the industry alike, as they are supportive of strategic capability development (for instance, high-skilled work). While producers and supply companies apply such “bridging,” “bonding,” and additional “protecting” mechanisms based upon their predominant position, small- and medium-sized enterprises (SMEs), however, need to shape teams to do so. A major finding of the study is, thus, that team-based interrelationships among SMEs activate “bridging,” “bonding.” and “protecting” initiatives which are particularly supportive of capability improvement and industry growth. They enable the transfer of relevant capabilities between different projects where actors within SMEs organizations learn to activate and use such knowledge transfer mechanisms. Moreover, asymmetrical dependency-relationships can be partly overcome by shaping and using the mechanisms on the part of SMEs in the network. Originality/value To date, brokerage is still an under-explored topic with regard to inter-firm business networks. This case study contributes to the research by illustrating important and distinct qualitative aspects of brokerage, which are conceptualized as “bonding,” “bridging,” and “protecting” initiatives on the part of brokers. The study highlights that not only strong actors with central positions can step into the role as a broker. Even less resourceful actors within asymmetrical relations can act as broker and compensate a lack of resources or strengthen their position within the industry network. Consequently, value co-creating processes within industry networks can also be boosted by brokerage initiated by small companies.

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41

OHNO, Kentaro, Kimitaka UJI, Atsushi UENO, and So KUROHARA. "OS11F089 Estimation of AE Source Mechanisms in Bonding Surface between Existing Concrete and Repairing Material under Shear Tests." Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics 2011.10 (2011): _OS11F089——_OS11F089—. http://dx.doi.org/10.1299/jsmeatem.2011.10._os11f089-.

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42

Xu, Jikai, Chenxi Wang, Te Wang, Yuan Wang, Qiushi Kang, Yannan Liu, and Yanhong Tian. "Mechanisms for low-temperature direct bonding of Si/Si and quartz/quartz via VUV/O3 activation." RSC Advances 8, no. 21 (2018): 11528–35. http://dx.doi.org/10.1039/c7ra13095c.

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43

PIRGAZI, HADI, and ABBAS AKBARZADEH. "CHARACTERIZATION OF NANOSTRUCTURED ALUMINUM SHEETS PROCESSED BY ACCUMULATIVE ROLL BONDING." International Journal of Modern Physics B 22, no. 18n19 (July 30, 2008): 2840–47. http://dx.doi.org/10.1142/s0217979208047663.

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An ultrafine grained (UFG) aluminum sheet was produced using severe plastic deformation (SPD) by a process known as accumulative roll bonding (ARB). Electron Back Scattered Diffraction (EBSD) method and Transmission Electron Microscopy (TEM) were utilized for characterization of the subgrain and grain structures of the processed sheets. The results indicate that different mechanisms at different levels of strain lead to the gradual evolution of ultrafine or nanocrystalline grains. Grain fragmentation as well as the development of subgrains are the major mechanisms at the early stages of ARB. Strain induced transformation of low angle to high angle grain boundaries and formation of a thin lamellar structure occur at the medium level of strain. Finally, the progressive fragmentation of these thin lamellar structures into more equi-axed grains is the dominant mechanism at relatively high strains which results in grain size reduction to submicron scale.

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44

Zhang, Jian Yang, Ming Yue Sun, Bin Xu, and Dian Zhong Li. "Interfacial Microstructural Evolution and Metallurgical Bonding Mechanisms for IN718 Superalloy Joint Produced by Hot Compressive Bonding." Metallurgical and Materials Transactions B 49, no. 5 (June 21, 2018): 2152–62. http://dx.doi.org/10.1007/s11663-018-1313-9.

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45

Dong, Shuhan, Huiyong Yuan, Xiaochao Cheng, Xue Zhao, Mingxu Yang, Yongzhe Fan, and Xiaoming Cao. "Improved Friction and Wear Properties of Al6061-Matrix Composites Reinforced by Cu-Ni Double-Layer-Coated Carbon Fibers." Metals 10, no. 11 (November 19, 2020): 1542. http://dx.doi.org/10.3390/met10111542.

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The friction and wear properties of an Al6061 alloy reinforced with carbon fibers (CF) modified with Cu-Ni bimetallic layers were researched. Cu-Ni double layers were applied to the CF by electroless plating and Al6061-matrix composites were prepared by powder metallurgy technology. The metal-CF/Al interfaces and post-dry-wear-testing wear loss weights, friction coefficients, worn surfaces, and wear debris were characterized. After T6 heat treatment, the interfacial bonding mechanism of Cu-Ni-CF changed from mechanical bonding to diffusion bonding and showed improved interfacial bonding strength because the Cu transition layer reduced the fiber damage caused by Ni diffusion. The metal–CF interfacial bonding strongly influenced the composite’s tribological properties. Compared to the Ni-CF/Al and Cu-CF/Al composites, the Cu-Ni-CF/Al composite showed the highest hardness, the lowest friction coefficient and wear rate, and the best load-carrying capacity. The wear mechanisms of Cu-Ni-CF/Al composite are mainly slight abrasive wear and adhesive wear.

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46

Chegini, H., A. Morsali, M. R. Bozorgmehr, and S. A. Beyramabadi. "Theoretical Study on the Mechanism of Covalent Bonding of Dapsone onto Functionalised Carbon Nanotubes: Effects of Coupling Agent." Progress in Reaction Kinetics and Mechanism 41, no. 4 (November 2016): 345–55. http://dx.doi.org/10.3184/146867816x14716178637309.

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Using density functional theory, two mechanisms of covalent bonding of dapsone onto functionalised carbon nanotubes have been investigated, the first one being direct bonding and the second one being bonding by using coupling agents. In this work, the mechanism of functioning of an important coupling agent (1-[bis(dimethylamino)methylene]-1H-1,2,3-triazolo [4,5-b]pyridinium 3-oxide hexafluorophosphate, N-HATU) has been investigated. The activation energy and activation Gibbs free energy of the two pathways have been calculated and compared with each other. It was found that using the coupling agents will reduce the energy barrier. All of the calculations have been performed in the solution phase (polarised continuum model) using the B3YLP hybrid density functional.

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47

Wang, Yong Bo, Kun Lin Song, and Shuang Bao Zhang. "The Research Progress in Pretreatment Techniques of Self-Bonding Composites." Advanced Materials Research 113-116 (June 2010): 2337–43. http://dx.doi.org/10.4028/www.scientific.net/amr.113-116.2337.

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As methods of preparation, many technical such as degradation of lignocellulose materials, organic synthesis, the reinforcement of composites et al. have been introduced into self-bonding technology. According to different treatment, pretreatment methods have been divided into three categories: Physical method, chemical method and biological method. According to different mechanisms, each method is further classified. The types and action mechanism of pretreatment were summarized. Physical pretreatment usually have various degrees impact on the bonding strength but weak controllability, while chemical pretreatment have obvious effect on the bonding strength increased but serious pollution. Biological pretreatment is a promising but immature technology. By comparing the advantages and disadvantages of different methods, Feasibility of combined application of different methods is analyzed. Finally, the development foreground of pretreatment techniques in self-bonding composites is predicted based on the current research.

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48

Sarr, Serigne, Julien Pilmé, Gilles Montavon, Jean-Yves Le Questel, and Nicolas Galland. "Astatine Facing Janus: Halogen Bonding vs. Charge-Shift Bonding." Molecules 26, no. 15 (July 28, 2021): 4568. http://dx.doi.org/10.3390/molecules26154568.

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The nature of halogen-bond interactions was scrutinized from the perspective of astatine, potentially the strongest halogen-bond donor atom. In addition to its remarkable electronic properties (e.g., its higher aromaticity compared to benzene), C6At6 can be involved as a halogen-bond donor and acceptor. Two-component relativistic calculations and quantum chemical topology analyses were performed on C6At6 and its complexes as well as on their iodinated analogues for comparative purposes. The relativistic spin–orbit interaction was used as a tool to disclose the bonding patterns and the mechanisms that contribute to halogen-bond interactions. Despite the stronger polarizability of astatine, halogen bonds formed by C6At6 can be comparable or weaker than those of C6I6. This unexpected finding comes from the charge-shift bonding character of the C–At bonds. Because charge-shift bonding is connected to the Pauli repulsion between the bonding σ electrons and the σ lone-pair of astatine, it weakens the astatine electrophilicity at its σ-hole (reducing the charge transfer contribution to halogen bonding). These two antinomic characters, charge-shift bonding and halogen bonding, can result in weaker At-mediated interactions than their iodinated counterparts.

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Mahendrarajah, Ghowsalya, Everson Kandare, and Akbar A. Khatibi. "Fabrication of Fibre Metal Laminates with Multiscale Toughening Mechanisms." Key Engineering Materials 847 (June 2020): 22–27. http://dx.doi.org/10.4028/www.scientific.net/kem.847.22.

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Although Fibre Metal Laminates (FMLs) show many advantages compared to other composite materials, their layered structure, a result of bonding dissimilar materials, makes FMLs prone to delamination. Conventional solutions to toughen the metal-composite interface have already reached their limit. For further improvement to the metal-composite interfacial bonding properties, a multiscale approach involving micro/nanotoughening mechanisms needs to be implemented. However, the fabrication of FMLs with controlled toughening at different length scales is complicated. This paper introduces a new methodology to manufacture FMLs having micro-and nanosized features using a 3D interconnected silver nanowire interleave at the metal-composite interface. The effects of processing parameters on the extent and effectiveness of the multiscale toughening mechanisms are presented.

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Long, Luping, Wensheng Liu, Yunzhu Ma, Lei Wu, and Siwei Tang. "Evolution of Voids in Mg/Al Diffusion Bonding Process." High Temperature Materials and Processes 36, no. 10 (October 26, 2017): 985–92. http://dx.doi.org/10.1515/htmp-2016-0024.

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AbstractThe closure process of voids was very crucial for diffusion bonding, voids behaviors in Mg/Al bonding process were investigated, and the control mechanisms of diffusion at different predominant process parameters were discussed in this paper. Finite element simulation was utilized to investigate the influence of thermal residual stresses on the appearance of secondary voids. The results showed that: the dominant mechanism of void closure was plastic deformation in the initial stage of Mg/Al diffusion bonding. Numerical results indicated that secondary voids could be easily generated in the regions where tensile residual stress gradient achieves the maximum, corresponding to area that Al3Mg2 layer at the nearby Al/Al3Mg2 interface, the segregation of voids deteriorated the performances of the bonded joints.

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Journal articles on the topic 'Bonding mechanisms'

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