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Academic literature on the topic 'Bonding mechanisms'

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Published: 4 June 2021
Last updated: 1 February 2022

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Journal articles on the topic "Bonding mechanisms"

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LUANGTANAANAN, M., and J. FELL. "Bonding mechanisms in tabletting." International Journal of Pharmaceutics 60, no. 3 (May 21, 1990): 197–202. http://dx.doi.org/10.1016/0378-5173(90)90073-d.

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Van Helvoort, A. T. J., K. M. Knowles, and J. A. Fernie. "Joining Mechanisms in Electrostatic Bonding." Key Engineering Materials 264-268 (May 2004): 649–54. http://dx.doi.org/10.4028/www.scientific.net/kem.264-268.649.

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Levine, Lee. "Wire Bonding: The Ultrasonic Bonding Mechanism." International Symposium on Microelectronics 2020, no. 1 (September 1, 2020): 000230–34. http://dx.doi.org/10.4071/2380-4505-2020.1.000230.

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Abstract Wire bonding is a welding process. During both ball and wedge bonding, wire and bond pad are massively deformed between the bond tool and the anvil of the bond pad or substrate. The dominant variables affecting deformation are ultrasonic energy, temperature, bond force and bond time. Deformation exposes new surface material that is clean and has not been exposed to atmospheric contamination and oxidation. As the new wire and bond pad surfaces mix, they form diffusion couples that grow and transform into the intermetallic weld nugget. The initial mixing is not at equilibrium in that it does not initially form the compounds described by the equilibrium phase diagram, but temperature and time very quickly allows diffusion to relax the initial mixture into the equilibrium phase diagram compounds. This paper will discuss the mechanisms behind the formation of ball and wedge bonds.
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Long, Yangyang, Folke Dencker, Andreas Isaak, Chun Li, Friedrich Schneider, Jörg Hermsdorf, Marc Wurz, Jens Twiefel, and Jörg Wallaschek. "Revealing of ultrasonic wire bonding mechanisms via metal-glass bonding." Materials Science and Engineering: B 236-237 (October 2018): 189–96. http://dx.doi.org/10.1016/j.mseb.2018.11.010.

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Kaabi, A., Y. Bienvenu, D. Ryckelynck, L. Prévond, and B. Pierre. "Architectured bimetallic laminates by roll bonding: bonding mechanisms and applications." Materials Science and Technology 30, no. 7 (December 6, 2013): 782–90. http://dx.doi.org/10.1179/1743284713y.0000000412.

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Wu, H., and S. Lee. "Effect of bonding variables on bonding mechanisms in press bonding superplastic 8090 aluminium alloy." Materials Science and Technology 17, no. 8 (August 2001): 906–11. http://dx.doi.org/10.1179/026708301101510915.

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Loehman, Ronald E., Antoni P. Tomsia, Joseph A. Pask, and Sylvia M. Johnson. "Bonding Mechanisms in Silicon Nitride Brazing." Journal of the American Ceramic Society 73, no. 3 (March 1990): 552–58. http://dx.doi.org/10.1111/j.1151-2916.1990.tb06552.x.

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Philip, M. "Materials, bonding mechanisms and physical properties." Physics Education 32, no. 3 (May 1997): 145–48. http://dx.doi.org/10.1088/0031-9120/32/3/011.

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Kozlov, Sergey M., Francesc Viñes, and Andreas Görling. "Bonding Mechanisms of Graphene on Metal Surfaces." Journal of Physical Chemistry C 116, no. 13 (March 19, 2012): 7360–66. http://dx.doi.org/10.1021/jp210667f.

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Rieutord, Francois, H. Moriceau, Rémi Beneyton, Luciana Capello, Christophe Morales, and Anne-Marie Charvet. "Rough Surface Adhesion Mechanisms for Wafer Bonding." ECS Transactions 3, no. 6 (December 21, 2019): 205–15. http://dx.doi.org/10.1149/1.2357071.

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Dissertations / Theses on the topic "Bonding mechanisms"

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Cui, Lu. "Hydrogen Bonding and Cucurbituril Complexation as Self-Assembly Mechanisms." Scholarly Repository, 2009. http://scholarlyrepository.miami.edu/oa_dissertations/450.

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The supramolecular interactions of small organic molecules with different host molecules are investigated in this dissertation. Additionally, the author also describes the self-assembly mechanisms in hydrogen bonding motif. These studies were carried out by many techniques including, NMR, cyclic voltammetry, steady state voltammetry, mass spectroscopy, UV-visible spectroscopy and fluorescence spectroscopy. Chapter 1 introduces the science of supramolecular chemistry and the background of cucurbiturils, one of the most important host molecules studied in this research work. It describes the structures and binding behaviors of each host molecule. Additionally, the selectivity and binding properties in the host-guest interactions involved cucurbiturils are discussed. Chapter 2 compares the electrochemical properties of cationic and neutral ferrocene derivatives upon addition of cucurbiturils. It is observed that the cationic ferrocene compounds bind to cucurbit[7]uril much stronger compared to the neutral ferrocene compounds. The positive charged side chains favor to interact with cucurbit[7]uril portals and thus stabilize the complexes. Besides, the author describes a simple analytical method to determine the binding constants by a competitive binding with a standard reference compound, cobaltocenium, which is reported to bind strongly to cucurbit[7]uril. Chapter 3 described the research of the pH-dependent binding affinity between cucurbit[7]uril and ferrocene guests. The electrochemical behavior of ferrocene moiety in aqueous solution was investigated by cyclic voltammetry in the presence of cucurbit[7]uril in acidic and basic environment respectively. The protonation and deprotonation processes affect the binding behaviors of the ferrocene residues with cucurbit[7]uril. Chapter 4 describes the synthesis and characterization of a new series of 4-phenyl-pyridinium derivatives. These compounds contain a phenyl-pyridinium residue which is favorable to be bound by cucurbit[8]uril. The 1:1 and 1:2 host-guest binding stoichiometries are both observed by UV-visible spectroscopy. These new compounds can be dimerized encapsulated inside the cucurbit[8]uril portals without being electrochemical reduced. Chapter 5 is a brief introduction into the science of hydrogen bonding. This chapter investigates the application of multiple hydrogen-bonding in supramolecular chemistry extensively. Multiple hydrogen bonds with their directionality and reversibility are of great interest and importance in the design and investigations of well-defined supramolecular assemblies. The potential of hydrogen bonding is limitless and is still developing. Chapter 6 describes the synthesis and photochemical behaviors of a series of ureido-pyrimidione derivatives. All of the DDAA derivatives form stable, non-covalent dimers in non-polar solvents. The dimeric molecular assemblies of these hydrogen bonding motifs in their DDAA pyrimidinedione units are investigated by NMR, X-ray crystallography, fluorescence spectroscopy and computations. Additionally, their hetero-dimerization is well studied by fluorescence spectroscopy. The observation and comparison of fluorescence quenching on the photochemical fluorophore for each compound by ferrocene-DDAA and isopropyl-DDAA reveal the electron transfer process through the quadruple hydrogen bonding motifs.
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Long, Yangyang [Verfasser]. "Investigations on the mechanisms of ultrasonic wire bonding : Untersuchungen zu den Mechanismen des Ultraschall-Drahtbondens / Yangyang Long." Hannover : Gottfried Wilhelm Leibniz Universität Hannover, 2019. http://d-nb.info/1187440396/34.

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Hussain, Tanvir. "A study of bonding mechanisms and corrosion behaviour of cold sprayed coatings." Thesis, University of Nottingham, 2011. http://eprints.nottingham.ac.uk/11811/.

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Cold gas dynamic spraying (CDGS) is a material deposition technique, in which powder particles are accelerated to speeds of between 300-1200 m/s and upon impact deform plastically and adhere. The overall aims of this research project were to understand the bonding behaviour in cold spraying of copper, aluminium and titanium, and to produce corrosion resistance barrier layer of titanium coatings using cold spraying. The mechanism of bonding in cold spraying is still a matter of some debate. In this thesis, copper has been cold sprayed onto aluminium alloy substrates, the surfaces of which had been prepared in a variety of ways. The coating - substrate bonding was assessed via a novel intermetallic growth method along with adhesive pull-off testing. The bond strength has been rationalised in terms of a modified composite strength model, with two operative bonding mechanisms, namely (i) metallurgical bonding and (ii) mechanical interlocking of substrate material into the coating. In most cases, mechanical interlocking is able to account for a large proportion of the total bond strength, with metallurgical bonding only contributing significantly when the substrate had been polished and annealed prior to spraying. In addition, grit-blasting has been shown to significantly reduce the bond strength compared to other substrate preparation methods. Aluminium has also been cold sprayed onto copper substrates, the mechanical interlocking of substrate material was not observed and the bond strength was relatively low. Titanium particles have been deposited onto three different steel substrates, namely low carbon steel, an Armco iron, and an austenitic stainless steel. Using the novel intermetallic growth method it was found that a barrier does exist at the interface of the titanium deposited onto the low carbon steel and Armco iron substrates which is not removed in either of the stages of impact or during the heat treatment process. On the other hand, in the case of titanium deposited onto the austenitic stainless steel, the barrier is removed. Cold spraying is believed to have the potential for the deposition of corrosion resistant barrier coatings. However, to be effective, a barrier coating must not have interconnected porosity. Titanium coatings were sprayed using nitrogen as an accelerant gas at two process gas temperatures of 600 and 800˚C to reduce porosity. A modified in-situ grit blasting was used to improve the coating-substrate adhesion. The mean bond strength of the titanium deposits was ~70 MPa and tensile strength was 250 MPa. Mercury intrusion porosimetry (MIP) was used to characterize the interconnected porosity over a size range of micrometers to nanometers. The MIP results showed that in cold sprayed deposits a significant proportion of the porosity was sub-micron and so could not be reliably measured by optical microscope based image analysis. A set of free standing deposits was also vacuum heat treated to further decrease porosity levels. The effect of porosity on the corrosion behaviour of titanium coatings onto carbon steels was investigated in 3.5 wt.% NaCl. The electrochemical measurements of the coatings showed significant substrate influence when the interconnected porosity of the coating was 11.3 vol.% but a decreased substrate influence with a porosity level of 5.9 vol.%. Salt spray (fog) tests confirmed these electrochemical findings and showed the formation of corrosion products following 24-h exposure. Laser surface melting (LSM) was used to seal the top ~140 μm of the coating to eliminate any interconnected porosity. The LSM titanium coatings showed no sign of corrosion after 100-h of salt spray tests, and the open circuit potential and passive current density values were similar to those of the bulk titanium.
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Ong, Markus D. "Novel bonding and releasing mechanisms for film transfer in three-dimensional structures /." May be available electronically:, 2008. http://proquest.umi.com/login?COPT=REJTPTU1MTUmSU5UPTAmVkVSPTI=&clientId=12498.

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Abdallah, Sadoon Mushrif. "Bonding mechanisms and strength of hooked-end steel fibre reinforced cementitious composites." Thesis, Brunel University, 2017. http://bura.brunel.ac.uk/handle/2438/15827.

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Concrete is a strong material as to its compressive strength. However, it is a material with a low tensile and shear strength, and brittleness at failure. Concrete has to be reinforced with appropriate materials. Steel fibre is one of the most common materials currently being used to develop reinforced concrete, which may replace partially or completely conventional steel reinforcement. Successful reinforcement of concrete composite is closely related to the bond characteristics between the reinforcing fibre and matrix. The effective utilisation of steel fibre reinforced concrete (SFRC) requires in-depth and detailed understanding of bonding mechanisms governing the tensile behaviour. In response to this demand, this study embraced two main areas: understanding the reinforcing mechanisms of fibres in SFRC and material's post-cracking behaviour. Comprehensive experimental and theoretical programmes have therefore been developed: the experimental work is subdivided into three parts. The first part was to investigate the effect of various physical parameters, such as fibre characteristics (i.e. geometry, inclination angle, embedded length, diameter and tensile strength) and matrix strength which controls the pull-out behaviour of steel fibres. The second part is concerned with the assessment of the bond mechanisms of straight and hooked end fibres after exposure to elevated temperatures and varying matrix strength. The third part is devoted to gain further insight on the bond mechanisms governing the post-cracking behaviour through uniaxial and bending tests. It was found that the varying hook geometry and matrix strength each had a major influence on the pull-out response of hooked end fibres. As the number of the hook's bends increased, the mechanical anchorage provided by fibre resulted in significant improvement of mechanical properties of SFRC. The reduction in bond strength at elevated temperatures is found to be strongly related to the degradation in properties of the constituent materials, i.e. the fibre and concrete. The most effective combination of matrix strength and fibre geometry was found to be as follows: 3DH (single bend) fibre with normal-medium strength matrix, 4DH (double bend) fibre with high strength matrix and 5DH (triple bend) fibre with ultra-high performance matrix. Two analytical models to predict the pull-out behaviour of hooked end fibres were developed. Both models were able to predict the pull-out response of SFRC made from a variety of fibre and matrix characteristics at ambient temperature. This work has established a comprehensive database to illustrate the bonding mechanisms of SFRC and anchorage strengthening of various hooked end fibres, and this should contribute towards an increasing interest and growing number of structural applications of SFRC in construction.
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Hoque, Abdul. "Bonding mechanisms in the application of thermal barrier coatings to turbine blades." Thesis, Sheffield Hallam University, 2004. http://shura.shu.ac.uk/19825/.

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Thermal barrier coatings (TBC's) are used to protect gas turbine blades from environmental degradation as well as to increase thermodynamic efficiency. Most TBC systems consist of a ceramic thermal barrier coating such as partially stabilized zirconia adhering to an oxidation resistant bond coat, which in turn is bonded to the turbine blade. This is required since partially stabilised zirconia will not readily bond to superalloys. However, the TBC can fail in service either by bond coat oxidation or thermal expansion mismatch between the bond coat and the TBC. A systematic literature survey has shown that the superalloy substrate material, type of bond coat selected, with the coating application techniques i.e. thermal spray or Electron Beam PVD (EBPVD) plays a fundamental role in determining the failure mechanisms involved. This program of work is concerned with the development of coatings with enhanced temperature capabilities for turbine blade applications by understanding the fundamental mechanisms responsible for adhesion between the nickel based turbine blade and zirconia based TBC. An understanding of the bonding mechanisms will allow the design of advanced coating systems with increased operating temperatures. This program of work introduces the Glow Discharge Optical Emission Spectroscopy (GDOES) technique, an atomic emission technique used for both bulk and depth profile analysis, which had not previously been applied to TBC's, and SEM and TEM in order to enhance understanding of failure modes in TBC systems and adhesion process. The results obtained from the studies indicate that the GDOES technique can be applied to depth profile bond coats and exposed TBC systems both qualitatively and semi-quantitatively. GDOES has been able to detect elements such as silicon and sodium that are in the ppm levels which are difficult/impossible to detect using EDX systems, and are very important in coating developments. In addition, as a preliminary guide GDOES has shown Ti diffusion from the superalloy substrate into the bond coat to be detrimental towards coating adhesion on most of the systems studied. The results of SEM and cross-sectional TEM on selected bond coat systems has shown the low cost Pt bond coat microstructure system to consist of TBC, Al2O3 bond coat and CMSX-4 superalloy substrate in all cases. The intermediate layer between the TBC and bond coat consists of Al2O3 which has been identified as responsible for maintaining the adhesion. Also identified is evidence of Ti segregation at the Al2O3/bond coat interface, known to lead to decohesion in coatings. Failure in the low cost Pt bond coat system has been identified as the decohesion between the interfacial layer of Al2O3 and the bond coat. The program of studies has enabled failure mechanisms and factors affecting bonding to be identified in low cost Pt bond coat systems, so that in future better coating systems with enhanced properties can be designed This should also ensure that improved reliability in engines and increased service life of turbine blades be achieved.
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Osborne, James Dominic. "Bonding mechanisms involved in the roller compaction of an amorphous food material." Thesis, University of Sheffield, 2013. http://etheses.whiterose.ac.uk/4512/.

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Sugar, Joshua D. "Mechanisms of microstructure development at metallic-interlayer/ceramic interfaces during liquid-film-assisted bonding." Berkeley, Calif. : Oak Ridge, Tenn. : Lawrence Berkeley National Laboratory ; distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 2003. http://www.osti.gov/servlets/purl/825347-j6A0Su/native/.

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Thesis (M.S.); Submitted to the University of California, Berkeley, CA (US); 1 Dec 2003.
Published through the Information Bridge: DOE Scientific and Technical Information. "LBNL--54185" Sugar, Joshua D. USDOE Director. Office of Science. Basic Energy Sciences (US) 12/01/2003. Report is also available in paper and microfiche from NTIS.
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Ghaffar, Seyed Hamidreza. "Aggregated understanding of characteristics of wheat straw node and internode with their interfacial bonding mechanisms." Thesis, Brunel University, 2016. http://bura.brunel.ac.uk/handle/2438/13451.

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The demand for the efficient utilisation of straw biomass requires detailed analyses of its fundamental chemical structures, morphological complexity, individual cell wall components and the correlation of physicochemical to mechanical properties. The study involved two main areas: understanding the details of microstructure and characterisation/differentiation of properties of various profiled wheat straw. Comprehensive and systematic experimental programmes were therefore designed in order to thoroughly investigate the node and internode of wheat straw with quantitative appraisals and qualitative interpretations. This could contribute towards its valorisation in bio-refinery pathways. The sophisticated morphology of node and internode, inner and outer surface was investigated. It was found that the morphology across node area has a great variety when the longitudinal profile is investigated in the upwards direction to grain head. A 3D image of nodes illustrated the dense core with elliptical shaped rings organised in order to provide the echanical strength to the overall stem. The variation of cell wall composition across wheat straw node and internode showed that node yielded slightly higher Klason lignin, extractives and ash content than internode, which could be related to their morphology, precisely the higher ash and extractives content in the node are explained by thicker epidermis tissue. The physicochemical and mechanical properties of node and internode were differentiated and the effects of a combination of mild physical pre-treatment were monitored. The results indicated: i) the reduction of waxes from the outer surface, ii) significantly lower (P < 0.05) extractives and iii) the dissolution of silicon (Si weight %) on the outer surface of node and internode. The tensile strength of nodes and internodes after pre-treatments also resulted in a significant increase (P < 0.05). The accumulated characteristic data enabled the investigation of interfacial properties and bonding mechanisms of the inner and outer surface of wheat straw with thermosetting resins. Different surface functionalities and anatomical sections, altered the bonding performance, i.e. waxes and silica concentrated on the outer surface inhibited the quality of the interface. Nevertheless, the treatment improved interface (P < 0.05) between resins and the micro-porous surface of wheat straw by causing the microcellular structure of straw to expand and hence inspire the mechanical entanglement on a micro level upon resin solidification.
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Åhman, Andreas. "Undersökning av bindningsmekanismer vid pressning av metallaminat : Investigation of bondning mechanisms at the pressing of metal laminates." Thesis, KTH, Materialvetenskap, 2013. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-131413.

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Increased understanding of the mechanisms that operate in conjunction with the welding of metal surfaces may help to improve existing manufacturing processes, and to enable new products and combinations of materials. The purpose of the project has therefore been to acquire a deeper understanding of what is happening in the bond for steel and for the factors that form the basis for a bond to develop between metals in the production of laminates by pressing. The merge has been done by pressing and the surfaces after the experiments have been studied in detail in the scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDX) and with interferenceprofilometry in Wyko, to provide a greater understanding of the mechanisms that influence the bonding in the interface between metals.   The project was limited to contain the materials Docol 1000, HyTens 1200, Aluminum AA3003 and a commercial steel. The parameters varied in the experiments to study their influence closer are temperature, pressure, heat treatment and pretreatment. This has been implemented by pressing with varying temperature and pressure. The materials have been pressed at room temperature or heated in an oven at 300 or 600 degrees and pressed immediately after the levying. Pretreatment was done by cleaning in acetone followed by either brushing or sandblasting alternatively no pretreatment have been done at all. The result was that the increased pressure and increased temperature increases the chance of joining by pressing. Pressing at slightly elevated temperature (about 100-250 degrees, depending on the material) makes bonding possible for metals which are not joined together at room temperature. Pretreatment by sandblasting gives a rougher and more riddled surface than brushing. At the cracking in the oxide layer at the pressing, wells new clean metal into between the oxides to the surface. When the new material reaches the surface, a joint can be made with the opposite clean material. The clean metal that wells up, then flows in a pattern which presses down the oxide in the material, away from the surface. This is done so more clean material can come to the surface and a finer binding can be obtained.
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Books on the topic "Bonding mechanisms"

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1962-, Ye L., ed. Fusion bonding of polymer composites: [from basic mechanisms to process optimisation]. London: Springer, 2002.

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Waters, William Allen. Failure mechanisms of laminates transversely loaded by bolt push-through. Hampton, Va: National Aeronautics and Space Administration, Langley Research Center, 1985.

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Walrafen, George E. Structure and Bonding in Noncrystalline Solids. Boston, MA: Springer US, 1986.

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Giovanni, Ferrari Marco Adolfo, ed. Bonding to dentin: Mechanism, morphology and efficacy of bonding resin composites to dentin in vitro and in vivo. [S.l: s.n.], 1995.

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Paul, Blaise, ed. Quantum oscillators. Hoboken, N.J: Wiley, 2011.

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R, Browning, and Lewis Research Center, eds. Current viewpoints on oxide adherence mechanisms. [Cleveland, Ohio: National Aeronautics and Space Administration, Lewis Research Center, 1985.

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Walrafen, George E., and Akos G. Revesz. Structure and Bonding in Noncrystalline Solids. Springer, 2012.

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Hirst, William, and Jeremy Yamashiro. Social Aspects of Forgetting. Oxford University Press, 2018. http://dx.doi.org/10.1093/oso/9780198737865.003.0005.

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Forgetting is as open to social influence as remembering. Indeed, if human memory evolved in part to promote social bonding, a tendency to forget collectively may be as adaptive as remembering. This chapter discusses socially sensitive cognitive mechanisms of forgetting, and underscores how they are more likely to promote collective forgetting within, but not between groups. First are culture-specific schemata, which help determine what is meaningful within a particular community, and thus what is memorable or easily forgotten. Second are effects of communicative remembering. Selective retelling of the past can induce forgetting in both speakers and listeners. This forgetting may propagate through groups and is most likely to occur when such forgetting serves social needs.
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Paxton, Pamela, and Robert Ressler. Trust and Participation in Associations. Edited by Eric M. Uslaner. Oxford University Press, 2017. http://dx.doi.org/10.1093/oxfordhb/9780190274801.013.6.

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This chapter provides an overview of theory relating participation in voluntary associations to increased levels of trust. It highlights theory that explains how trust is generalized to individuals outside of associations, theory that distinguishes among types of associations in their ability to produce generalized trust, and additional theory that refutes these claims. The chapter also introduces new theory that combines the two most common distinctions—bridging versus bonding associations and connected versus isolated associations. The end of the chapter documents how each of the theories and mechanisms have been supported, challenged, or neglected in existing empirical evidence and concludes with recommendations for how to test theories on trust and participation moving forward.
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1935-, Wightman James P., and Langley Research Center. Materials Division., eds. Fracture surface analysis in composite and titanium bonding: Semi-annual report. Blacksburg, VA: Chemistry Dept., Virginia Polytechnic Institute & State University, 1985.

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Book chapters on the topic "Bonding mechanisms"

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Lee, Lieng-Huang. "Recent Studies in Polymer Adhesion Mechanisms." In Adhesive Bonding, 1–30. Boston, MA: Springer US, 1991. http://dx.doi.org/10.1007/978-1-4757-9006-1_1.

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Fleischman, Diana. "Sex as Bonding Mechanisms." In Encyclopedia of Evolutionary Psychological Science, 1–2. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-16999-6_1717-1.

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Good, Robert J., and Rakesh K. Gupta. "The Coupling of Interfacial, Rheological, and Thermal Control Mechanisms in Polymer Adhesion." In Adhesive Bonding, 47–73. Boston, MA: Springer US, 1991. http://dx.doi.org/10.1007/978-1-4757-9006-1_3.

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Crawford, Andrew M., Julien J. H. Cotelesage, Roger C. Prince, and Graham N. George. "The Catalytic Mechanisms of the Molybdenum and Tungsten Enzymes." In Structure and Bonding, 63–100. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/430_2018_30.

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Dedieu, Alain. "Theoretical Treatment of Organometallic Reaction Mechanisms and Catalysis." In Organometallic Bonding and Reactivity, 69–107. Berlin, Heidelberg: Springer Berlin Heidelberg, 1999. http://dx.doi.org/10.1007/3-540-69707-1_3.

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Takahashi, Yasuo. "Numerical Modeling of Solid State Bonding Based on Fundamental Bonding Mechanisms: For Bonding between Dissimilar Materials." In Advances in Joining of Ceramics, 29–47. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2012. http://dx.doi.org/10.1002/9781118405802.ch2.

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Hienerwadel, R., A. Boussac, J. Breton, B. A. Diner, and C. Berthomieu. "FTIR Study of TYRD and TYRZ: Hydrogen Bonding Interactions." In Photosynthesis: Mechanisms and Effects, 1185–88. Dordrecht: Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-011-3953-3_283.

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Hench, L. L., and D. B. Spilman. "Composition and Bonding Mechanisms in Bioglass™ Implants." In Glass … Current Issues, 656–61. Dordrecht: Springer Netherlands, 1985. http://dx.doi.org/10.1007/978-94-009-5107-5_55.

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Aresta, Michele, Angela Dibenedetto, and Eugenio Quaranta. "CO2 Coordination to Metal Centres: Modes of Bonding and Reactivity." In Reaction Mechanisms in Carbon Dioxide Conversion, 35–69. Berlin, Heidelberg: Springer Berlin Heidelberg, 2016. http://dx.doi.org/10.1007/978-3-662-46831-9_2.

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Acevedo, Bianca P., and Arthur P. Aron. "Romantic love, pair-bonding, and the dopaminergic reward system." In Mechanisms of social connection: From brain to group., 55–69. Washington: American Psychological Association, 2014. http://dx.doi.org/10.1037/14250-004.

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Conference papers on the topic "Bonding mechanisms"

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Gunther, Michael, Klaus-jurgen Wolter, Martin Rittner, and Wolfgang Nuchter. "Failure Mechanisms of Direct Copper Bonding Substrates (DCB)." In 2006 1st Electronic Systemintegration Technology Conference. IEEE, 2006. http://dx.doi.org/10.1109/estc.2006.280090.

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Abadie, Karine, Frank Fournel, Pierre Montmeat, and Markus Wimplinger. "Mechanical behaviour and delamination mechanisms in temporary bonding." In 2016 6th Electronic System-Integration Technology Conference (ESTC). IEEE, 2016. http://dx.doi.org/10.1109/estc.2016.7764688.

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Imbert, B., P. Gondcharton, L. Benaissa, F. Fournel, and M. Verdier. "Wafer level metallic bonding: Voiding mechanisms in copper layers." In 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM). IEEE, 2015. http://dx.doi.org/10.1109/iitc-mam.2015.7325619.

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Qin, Wentao, Harold Anderson, Tom Anderson, George Chang, and Denise Barrientos. "Corrosion Mechanisms of Cu Wire Bonding on Al Pads." In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC). IEEE, 2018. http://dx.doi.org/10.1109/ectc.2018.00221.

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Nash, Richard, Timothy Pruyn, Heather Chaput, and Yaning Li. "Mechanical Behavior of Bio-Inspired Wavy Adhesive Bonding Under Shear." In ASME 2017 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/imece2017-71791.

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Inspired by biological suture joints with wavy morphology, wavy adhesive joints were designed and the shear resistance of the designs were explored via finite element (FE) simulations. The influences of waviness and material properties of the layer on the mechanical behaviors of the adhesive joints were quantified. Both adhesive and cohesive failure mechanisms were explored: (1) delamination along the interface between the softer layer and the harder substrates, and (2) layer material failure. In the FE models, both cohesive interaction and ductile damage mechanics models were used to capture the two failure mechanisms. The effects of Young’s modulus and damage evolution parameters on the force-displacement relation were studied. Both failure mechanisms were observed by varying the material properties in the adhesive layer. It was found that, the stiffness, strength and the failure mechanisms of the wavy adhesive joints are largely dependent on the geometry and material properties of the layer.
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Lu, Ying-Xu, Ying-Ta Chiu, Tang-Yuan Chen, Meng-Kai Shih, and Sheng-Rui Jian. "Microcosmic mechanisms of Cu to Cu bonding by molecular dynamic simulation." In 2017 IEEE CPMT Symposium Japan (ICSJ). IEEE, 2017. http://dx.doi.org/10.1109/icsj.2017.8240133.

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Fournel, F., L. Sanchez, B. Montmayeul, C. Castan, M. Laugier, L. Bally, V. Larrey, et al. "Die to wafer direct bonding: from fundamental mechanisms to optoelectronic and 3D applications." In 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2019. http://dx.doi.org/10.23919/ltb-3d.2019.8735248.

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Sepehrband, Panthea, and Maryam Gholamirad. "Analysis of Intermetallic Formation During Ultrasonic Ball Bonding." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48812.

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During ultrasonic ball bonding of copper wire to aluminum pad, the two alloys are joined over an immensely short period of time (<100ms), at a relatively low temperature (< 200°C). Bond formation in such condition is related to accelerated diffusional processes and formation of intermetallic compounds (IMC). Despite the industrial importance of the phenomenon, the micro-mechanism of IMC formation is not clearly understood, nor deeply studied. One of the main barriers toward understanding the phenomena is the limited capability of experimental analysis for analyzing processes occurring over short period of time. In this research, a combination of theoretical analysis and finite element simulation is used to investigate the mechanisms that lead to diffusion enhancement and, as a result, IMCs formation.
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Sarkar, M., S. P. Joshi, P. S. Shiakolas, and A. Bulusu. "Theoretical Analysis of Focusing and Intensity Mechanisms for a Spot Bonding Process Using Femtosecond Laser." In ASME 2003 International Mechanical Engineering Congress and Exposition. ASMEDC, 2003. http://dx.doi.org/10.1115/imece2003-41906.

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In this paper we present the analysis of the focus and intensity mechanisms for a spot bonding process using a femtosecond pulsed laser with a Gaussian beam profile. The bonding process bonds two thin optically transparent materials by focusing the laser beam at their interface to form a joint with minimum damage to the surrounding material. The parameters that effect the bonding process are the focal length of the lens used, the beam intensity and waist, the angle of incidence of the laser on the material surface, and material characteristics such as thickness and refraction index. We performed numerical analysis for a number of focal lengths considering the above-mentioned factors. Plots showing the heat affected zone and energy loss to reflection through the thickness of the material as functions of focal length are presented. These plots help in determining the focal length to be used for surface bonding with femtosecond lasers.
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Chew, M., and M. Phan. "Application of Learning Control Theory to Mechanisms: Part 2 — Reduction of Residual Vibrations in High-Speed Electromechanical Bonding Machines." In ASME 1994 Design Technical Conferences collocated with the ASME 1994 International Computers in Engineering Conference and Exhibition and the ASME 1994 8th Annual Database Symposium. American Society of Mechanical Engineers, 1994. http://dx.doi.org/10.1115/detc1994-0240.

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Abstract Learning control provides an integrated approach for handling inverse kinematics and inverse dynamics of mechanisms, in the presence of parametric errors in system modeling. This technique is applied to reduce residual vibrations at the bonding cap of an electromechanical bonding machine for integrated circuits (ICs); a process of electrically linking silicon chips to the leads. The bonding cap trajectory for the bonding motion is actuated by high-speed cams driven by electric motors. The primary causes of residual vibrations are due to errors in the design model of the nonlinear electromechanical system, in camshaft speed control, as well as, in cam profile fabrication. This article demonstrates the capability of learning control to reduce the residual vibrations in such machines, by compensating for these sources of errors.
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Reports on the topic "Bonding mechanisms"

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Sugar, Joshua D. Mechanisms of microstructure development at metallic-interlayer/ceramic interfaces during liquid-film-assisted bonding. Office of Scientific and Technical Information (OSTI), December 2003. http://dx.doi.org/10.2172/825347.

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Freeman, A. J. Energetics, bonding mechanism and electronic structure of metal/ceramic interfaces. Office of Scientific and Technical Information (OSTI), January 1992. http://dx.doi.org/10.2172/5652379.

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Freeman, A. J. Energetics, bonding mechanism and electronic structure of metal/ceramic interfaces. Office of Scientific and Technical Information (OSTI), January 1993. http://dx.doi.org/10.2172/7081085.

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Freeman, A. J. Energetics, bonding mechanism and electronic structure of metal/ceramic interfaces. Annual progress report, April 1, 1991--March 31, 1992. Office of Scientific and Technical Information (OSTI), May 1992. http://dx.doi.org/10.2172/10140444.

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Freeman, A. J. Energetics, bonding mechanism and electronic structure of metal/ceramic interfaces. Annual progress report, April 1, 1992--March 31, 1993. Office of Scientific and Technical Information (OSTI), December 1993. http://dx.doi.org/10.2172/10185416.

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Freeman, A. J. Energetics, bonding mechanism and electronic structure of ceramic/ceramic and metal/ceramic interfaces. Annual progress report, April 1, 1994--September 30, 1994. Office of Scientific and Technical Information (OSTI), October 1994. http://dx.doi.org/10.2172/10185440.

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Freeman, A. J. Energetics, bonding mechanism and electronic structure of ceramic/ceramic and metal/ceramic interfaces. Annual progress report, April 1, 1993--March 31, 1994. Office of Scientific and Technical Information (OSTI), March 1994. http://dx.doi.org/10.2172/10134458.

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