Relevant bibliographies by topics / Bonding

Academic literature on the topic 'Bonding'

Author: Grafiati
Published: 4 June 2021
Last updated: 6 September 2023

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Journal articles on the topic "Bonding"

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Breugst, Martin, Daniel von der Heiden, and Julie Schmauck. "Novel Noncovalent Interactions in Catalysis: A Focus on Halogen, Chalcogen, and Anion-π Bonding." Synthesis 49, no. 15 (May 23, 2017): 3224–36. http://dx.doi.org/10.1055/s-0036-1588838.

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Noncovalent interactions play an important role in many biological and chemical processes. Among these, hydrogen bonding is very well studied and is already routinely used in organocatalysis. This Short Review focuses on three other types of promising noncovalent interactions. Halogen bonding, chalcogen bonding, and anion-π bonding have been introduced into organocatalysis in the last few years and could become important alternate modes of activation to hydrogen bonding in the future.1 Introduction2 Halogen Bonding3 Chalcogen Bonding4 Anion-π Bonding5 Conclusions
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Riorini, Sri Vandayuli. "PENGARUH IKATAN HUBUNGAN TERHADAP KESETIAAN PELANGGAN." Media Riset Bisnis & Manajemen 9, no. 1 (April 8, 2009): 65–90. http://dx.doi.org/10.25105/mrbm.v9i1.1074.

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This research explains about the effects of three relationship bondings, namely financial bonding, social bonding and structural bonding to consumer's trust that will lead to the commitment of the consumers and ultimately will affect the loyalty of the consumers.Data was gathered by distributing questionaire to 100 respondents who have been a student in their course center. The sampling technique used was a purposive sampling. The analysis tool used was Structural Equation Modeling using Amos version 16 software. .The hypotesis testing result showed that among three relationship bondings, the bonds that has a significant effect to trust are social bonding and structural bonding, whereas financial bonding has no effect to the trust of consumers. Trust also has a significant effect to commitment and ultimately the commitment has an effect to loyalty.It is highly recommended to explore another services industry beside education industry for the next research and possibly to add other variables which may have any effect to the variables observed by this current research.Keywords : Relationship bonding, Trust, Commitment, Loyally
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Brožek, M. "Bonding of plywood." Research in Agricultural Engineering 62, No. 4 (November 28, 2016): 198–204. http://dx.doi.org/10.17221/39/2015-rae.

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The contribution contains results of bonded joints strength tests. The tests were carried out according to the modified standard ČSN EN 1465 (66 8510):2009. The spruce three-ply wood of 4 mm thickness was used for bonding according to ČSN EN 636 (49 2419):2013. The test samples of 100 × 25 mm size were cut out from a semi-product of 2,440 × 1,220 mm size in the direction of its longer side (angle 0°), in the oblique direction (angle 45°) and in the direction of its shorter side (crosswise – angle 90°). The bonding was carried out using eight different domestic as well as foreign adhesives according to the technology prescribed by the producer. All used adhesives were designated for wood bonding. At the bonding the consumption of the adhesive was determined. After curing, the bonded assemblies were loaded using a universal tensile-strength testing machine up to the rupture. The rupture force and the rupture type were registered. Finally, the technical-economical evaluation of the experiments was carried out.
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Brožek, M. "Bonding of wood." Research in Agricultural Engineering 61, No. 3 (June 2, 2016): 134–39. http://dx.doi.org/10.17221/8/2014-rae.

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The paper presents the results of strength tests of joints made using six different adhesives destined by their producers for bonding wood. Bonded samples were made from seven sorts of wood commonly growing in the Czech Republic, namely ash, beach, cherry, maple, pine, spruce and walnut. From semi-products (boards, planks, squared timber logs) the test samples of dimensions 25 × 100 mm and 4 mm thickness were cut out in the direction of year rings. Always two samples were bonded together so that their overlap was of 12.5 mm. All these assemblies were loaded using the universal testing machine up to their rupture. The rupture force and the rupture type (rupture in the joint, in the bonded material) were registered. The aim of the tests was to assess the influence of the used adhesive on the bonded joint strength at different woods, to assess the variability of the adhesive consumption at the manual adhesive application by different workers and to determine costs for bonding of different woods using different adhesives. From the results it follows that between six tested adhesives used for bonding of seven sorts of wood, considerable differences exist not only as regards their price, but also their quality. From the results it also follows that the manual adhesive application is very unequal, because it depends on the dexterity and care of the worker. Next, the costs for bonding of different woods using different adhesives were determined.
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Kim, Yeongjung, Byeong Jo Han, and Jong-Hyun Lee. "Paste Containing 1.5 μm Ag Particles with Enhanced Surface Area: Ultrafast Thermo-Compression Sinter-Bonding and Annealing Effects." Korean Journal of Metals and Materials 60, no. 11 (November 5, 2022): 827–36. http://dx.doi.org/10.3365/kjmm.2022.60.11.827.

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To rapidly sinter a bondline and obtain mechanical stability at high temperature and high thermal conductivity, 1.5 μm Ag particles with enhanced surface area were synthesized by a wet-chemical method, and a sinter-bonding paste containing these Ag particles was obtained. Some particles were present in the form of agglomerates of spike stems and short-branch dendrites, while others existed as spheres with rough nodule surfaces or relatively smooth surfaces. To determine an effective sinter-bonding process, a significantly short thermo-compression bonding (10 s) under 5 MPa in air and subsequent annealing in nitrogen were performed. The thermo-compression bonding at 250 oC resulted in a low shear strength of 8.15 MPa in the formed bondline. Although the annealing at 250 oC increased its strength, it did not reach 20 MPa, which is required for practical applications. Interestingly, the 10 s bonding at 300 oC exhibited sufficient shear strength of 21.96 MPa, and when annealed for 30 min at 300 oC, the excellent strength of 37.75 MPa was obtained. The bondline porosity of 12.16% immediately after the thermo-compression bonding, decreased to 9.13% after annealing for 30 min. The densification in bondline by the annealing also induced a change in the fracture path as well as enhancement in the shear strength. Thus, the suggested subsequent annealing is an effective method for sinter-bonding, similar to the pressureless sinter-bonding process. Consequently, the synthesized Ag particles exhibited superior sintering properties and the suggested combination process shows potential for tremendously improving chip sinter-bonding productivity.
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Ghafouri, Reza, Fatemeh Ektefa, and Mansour Zahedi. "Characterization of Hydrogen Bonds in the End-Functionalized Single-Wall Carbon Nanotubes: A DFT Study." Nano 10, no. 03 (April 2015): 1550036. http://dx.doi.org/10.1142/s1793292015500368.

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A systematic computational study is carried out to shed some light on the structure of semiconducting armchair single-wall carbon nanotubes (n, n) SWCNTs, n = 4, 5 and 6, functionalized at the end with carboxyl (– COOH ) and amide (– CONH 2) from the viewpoint of characterizing the intramolecular hydrogen bondings at the B3LYP/6-31++G(d, p) level. Geometry parameters display different types of intramolecular hydrogen bonding possibilities in the considered functionalized SWCNTs. All of the hydrogen bondings are confirmed by natural bonding orbitals (NBO) analysis as well as nuclear magnetic resonance (NMR) and nuclear quadrupole resonance (NQR) parameters. Based on NBO analysis, the calculated [Formula: see text] delocalization energies E(2), 1.15 kcal/mol to 7.04 kcal/mol, are in direct relation with the hydrogen bonding strengths. Differences in the chemical shielding principal components of 13 C and 17 O nuclei correlate well with the strengths of the hydrogen bondings. Participating in stronger hydrogen bondings, a larger SWCNT has a decreasing effect on 13 C (= O ) and 17 O isotropic chemical shieldings, σiso, consistent with the NBO analysis. The considerable changes of 13 C /17 O σiso can be interpreted as a result of shielding tensor component orientation. The 13 C (= O ) and 17 O quadrupole coupling constants C Q decrease under the effect of hydrogen bonding while asymmetry parameters ηQ significantly increase, indicating that 17 O ηQ is more sensitive to hydrogen bondings.
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Kumar Katta, Prashanth. "Composition of Bonding Agents." Indian Journal of Dental Education 13, no. 2 (April 1, 2020): 75–77. http://dx.doi.org/10.21088/ijde.0974.6099.13220.5.

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Yokura, Miyoshi, Kenichi Uehara, Guo Xiang, Kazuya Hanada, Yoshinobu Nakamura, Lakshmi Sanapa Reddy, Kazuhiro Endo, and Tamio Endo. "Ultralong Lifetime of Active Surface of Oxygenated PET Films by Plasma-irradiation and Bonding Elements." MRS Proceedings 1454 (2012): 201–6. http://dx.doi.org/10.1557/opl.2012.1128.

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ABSTRACTBiaxially oriented polyethylene terephthalate (PET) films can be bonded directly by oxygen plasma irradiation and low temperature heat press around 100°C. The irradiated films were kept in the atmosphere for six years, yet they can be bonded tightly as well. Dry- and wet-peel tests indicate that two bonding elements can be suggested, hydrogen bonding and chemical bonding. The films are bonded by these two elements at lower temperatures, but by the pure chemical bonding at higher temperatures. FTIR results on the non-irradiated, irradiated and bonded samples indicate that OH and COOH groups are created at the surface, they are responsible for the hydrogen and chemical bondings. Dehydrated condensation reaction is proposed for the chemical bonding. It is briefly mentioned on two origins for the long lifetime of irradiated active surface.
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Brammer, Lee. "Halogen bonding, chalcogen bonding, pnictogen bonding, tetrel bonding: origins, current status and discussion." Faraday Discuss. 203 (2017): 485–507. http://dx.doi.org/10.1039/c7fd00199a.

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The role of the closing lecture in a Faraday Discussion is to summarise the contributions made to the Discussion over the course of the meeting and in so doing capture the main themes that have arisen. This article is based upon my Closing Remarks Lecture at the 203rdFaraday Discussion meeting on Halogen Bonding in Supramolecular and Solid State Chemistry, held in Ottawa, Canada, on 10–12thJuly, 2017. The Discussion included papers on fundamentals and applications of halogen bonding in the solid state and solution phase. Analogous interactions involving main group elements outside group 17 were also examined. In the closing lecture and in this article these contributions have been grouped into the four themes: (a) fundamentals, (b) beyond the halogen bond, (c) characterisation, and (d) applications. The lecture and paper also include a short reflection on past work that has a bearing on the Discussion.
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ZHANG, YAN, CHANG-SHENG WANG, and ZHONG-ZHI YANG. "ESTIMATION ON THE INTRAMOLECULAR 8- AND 12-MEMBERED RING N–H…O=C HYDROGEN BONDING ENERGIES IN β-PEPTIDES." Journal of Theoretical and Computational Chemistry 08, no. 02 (April 2009): 279–97. http://dx.doi.org/10.1142/s0219633609004708.

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Computation of accurate hydrogen bonding energies in peptides is of great importance in understanding the conformational stabilities of peptides. In this paper, the intramolecular 8- and 12-membered ring N – H … O = C hydrogen bonding energies in β-peptide structures were evaluated. The optimal structures of the β-peptide conformers were obtained using MP2/6-31G(d) method. The MP2/6-311++G(d,p) calculations were then carried out to evaluate the single-point energies. The results show that the intramolecular 8-membered ring N – H … O = C hydrogen bonding energies in the five β-dipeptide structures β-di, β-di-R1, β-di-R2, β-di-R3, and β-di-R4 are -5.50, -5.40, -7.28, -4.94, and -6.84 kcal/mol with BSSE correction, respectively; the intramolecular 12-membered ring N – H … O = C hydrogen bonding energies in the nine β-tripeptide structures β-tri, β-tri-R1, β-tri-R2, β-tri-R3, β-tri-R4, β-tri-R1', β-tri-R2', β-tri-R3' and β-tri-R4' are -10.23, -10.32, -9.53, -10.30, -10.32, -10.55, -10.09, -10.51, and -9.60 kcal/mol with BSSE correction, respectively. Our calculation results further indicate that for the intramolecular 8-membered ring hydrogen bondings, the structures where the orientation of the side chain methyl group is "a–a" have stronger intramolecular hydrogen bondings than those where the orientation of the side chain methyl group is "e–e", while for the intramolecular 12-membered ring hydrogen bondings, the structures where the orientation of the side chain methyl group is "e–e" have stronger intramolecular hydrogen bondings than those where the orientation of the side chain methyl group is "a–a". The method is also applied to estimate the individual intermolecular hydrogen bonding energies in the dimers of amino-acetaldehyde, 2-amino-acetamide, 2-oxo-acetamide, and oxalamide, each dimer having two identical intermolecular hydrogen bonds. According to our method, the individual intermolecular hydrogen bonding energies in the four dimers are calculated to be -1.71, -1.50, -4.67, and -3.22 kcal/mol at the MP2/6-311++G(d,p) level, which are in good agreement with the values of -1.84, -1.72, -4.93, and -3.26 kcal/mol predicted by the supermolecular method.
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Dissertations / Theses on the topic "Bonding"

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Clarke, D. E. "Bonding in cokes." Thesis, University of Newcastle Upon Tyne, 1986. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.372550.

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Hodgson, Michael John. "Bonding in semiconductors." Thesis, University of Cambridge, 1991. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.240971.

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Xu, Hui. "Thermosonic ball bonding : a study of bonding mechanism and interfacial evolution." Thesis, Loughborough University, 2010. https://dspace.lboro.ac.uk/2134/6325.

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Thermosonic ball bonding is a key technology in electrical interconnections between an integrated circuit and an external circuitry in microelectronics. Although this bonding process has been extensively utilised in electronics packaging industry, certain fundamental aspects behind all the practice are still not fully understood. This thesis is intended to address the existing knowledge gap in terms of bonding mechanisms and interfacial characteristics that are involved in thermosonic gold and copper ball bonding on aluminium pads. The research specifically targets the fine pitch interconnect applications where a thin metal wire of approximately 20 µm in diameter is commonly used. In thermosonic ball bonding process, a thin gold or copper ball formed at the end of a wire is attached to an aluminum pad through a combination of ultrasonic energy, pressure and heat, in order to initiate a complex solid-state reaction. In this research, the mechanisms of thermosonic ball bonding were elaborated by carefully examining interfacial characteristics as the results of the bonding process by utilising dual-beam focused ion beam and high resolution transmission electron microscopy, including the breakdown of the native alumina layer on Al pads, and formation of initial intermetallic compounds (IMCs). The effect of bonding parameters on these interfacial behaviours and bonding strength is also investigated in order to establish an inter-relationship between them. Interfacial evolution in both Au-Al and Cu-Al bonds during isothermal annealing in the temperature rage from 175ºC to 250ºC was investigated and compared. The results obtained demonstrated that the remnant alumina remains inside IMCs and moves towards the ball during annealing. The IMCs are formed preferentially in the peripheral and the central areas of the bonds during bonding and, moreover, they grow from the initially formed IMC particles. Growth kinetics of Cu-Al IMCs obey a parabolic growth law before the Al pad is completely consumed. The activation energies calculated for the growth of CuAl2, Cu9Al4 and the combination (CuAl2 + Cu9Al4) are 60.66 kJ/mol, 75.61 kJ/mol, and 65.83 kJ/mol, respectively. In Au-Al bonds, Au-Al IMC growth is controlled by diffusion only at the start of the annealing process. A t^0.2-0.3 growth law can be applied to the Au-Al IMC growth after the Al pad is depleted. The sequence of IMC phase transformation in both Au-Al and Cu-Al bonds were investigated. Voids in Au-Al bonds grow dramatically during annealing, however, only a few voids nucleate and grow very slowly in Cu-Al bonds. The mechanisms of void formation, including volumetric shrinkage, oxidation and metal diffusion were proposed and discussed.
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Cornes, Stuart. "Halogen bonding, hydrogen bonding and Lewis acidic receptors for anion recognition." Thesis, University of Oxford, 2016. https://ora.ox.ac.uk/objects/uuid:0725f9c4-ff44-4158-b94e-9bcaf0fa3b4d.

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This thesis describes the preparation of acyclic, macrocyclic and interlocked receptors for the recognition of anions in competitive organic and aqueous solvent media. Chapter One introduces the field of anion supramolecular chemistry, with a particular focus on the non-covalent interactions used for anion recognition and the synthesis of mechanically interlocked molecules. Chapter Two discusses the preparation of halogen bonding and hydrogen bonding acyclic and interlocked pyridinium-based receptors. Investigations into their anion selectivity trends are undertaken using 1H NMR titration experiments. The anion sensing properties of analogous hosts containing a fluorescent quinolinium motif are also described. Chapter Three presents the synthesis of acyclic and macrocyclic receptors containing the dicationic 1,2-bis(pyridinium)ethane motif. Attempts towards the preparation of interlocked receptors containing the motif are also discussed. Chapter Four focuses on a series of water-soluble receptors based around functionalised a-cyclodextrins. Isothermal titration calorimetry experiments are used to investigate differences in the thermodynamics of anion binding to halogen bonding and hydrogen bonding analogues. Chapter Five details the preparation of a [2]rotaxane containing a Lewis acidic triarylborane motif. Investigations into its anion binding properties are conducted using multinuclear NMR and UV-visible spectroscopies. Chapter Six provides the experimental details and characterisation data for the compounds discussed in Chapters Two to Five. Protocols for the titration experiments conducted are also described. Full crystallographic data is provided in the Appendix.
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Chen, Xi. "Designing Acrylic Block Copolymers with Multiple Hydrogen Bonding or Multiple Ionic Bonding." Thesis, Virginia Tech, 2018. http://hdl.handle.net/10919/84961.

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The dynamic characteristics of hydrogen and ionic bonding contributes to the reversible properties of acrylic polymers, opening new avenues for designing materials with mechanical strength and processability. These non-covalent interactions function as physical crosslinks, which provide enhanced structural and mechanical integrity to acrylic block copolymers. The strong hydrogen bonding or ionic interaction also directs self-assembly to hierarchical microstructures, which enables many applications including thermoplastic elastomers and energy storage devices. Inspired by complementary hydrogen bonding interactions between nucleobase pairs in DNA, a series of bioinspired nucleobase-acrylate monomers such as adenine acrylate (AdA), thymine acrylate (ThA), cytosine acrylate (CyA) were designed, whose synthesis were afforded by aza-Michael addition. Among those nucleobases, cytosine arises as a unique category. It is not only able to self-associate via weak hydrogen bonds, but also forms quadruple hydrogen-bond bearing units (ureido-cytosine) when functionalized with isocyanates. Reversible addition-fragmentation chain transfer polymerization (RAFT) yielded acrylic ABA triblock copolymers with CyA external hard blocks. A subsequent post-functionalization using hexyl-isocyanate generated the corresponding ureido-cytosine acrylate(UCyA)-containing triblock copolymers. The self-complementary quadruple hydrogen bonding in the UCyA polymers achieved a broader service iii temperature window, while the alkyl chain ends of UCyA units allowed tunability of the mechanical strength to apply as thermoplastic elastomers. In addition, quadruple hydrogen bonding induced stronger propensity of self-assembly and denser packing of the polymers, which contributed to a well-defined ordered morphology and enhanced resistance to moisture uptake. A facile 2-step synthesis provided doubly-charged styrenic DABCO salt monomer(VBDC18BrCl) containing an octadecyl tail. RAFT polymerization allowed the preparation of DABCO ABA block copolymers with defined molecular weights and low polydispersity. Thermal analysis revealed a melting transition of the VBDC18BrCl block copolymer resulting from the side-chain crystallization of the long alkyl tail. Systematic mechanical comparisons between DABCO salt-containing copolymers and the corresponding singly-charged polymer controls demonstrated superior mechanical properties attributable to a stronger ionic interaction between the doubly-charged groups. Morphological characterizations revealed a well-ordered lamellar microstructure and a unique three-phase morphology of the DABCO block copolymers, which involve a soft phase, a hard phase, and an ionic aggregates domain dispersed within the hard domain.
Master of Science
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Rix, Douglas. "Bond strengths and fluoride release of modified glass ionomer and resin adhesives." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1999. http://www.collectionscanada.ca/obj/s4/f2/dsk2/ftp01/MQ39873.pdf.

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Johnsen, Bernt Brønmo. "Adhesive bonding of aluminium." Doctoral thesis, Norwegian University of Science and Technology, Faculty of Engineering Science and Technology, 2004. http://urn.kb.se/resolve?urn=urn:nbn:no:ntnu:diva-515.

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In order to get approval of adhesive bonding as a reliable joining method in the automotive industry, a better understanding of the interfacial interactions between aluminium surfaces and adhesives is important. It is also important to get a better understanding of the degradation mechanisms of the bonded systems in humid environments, as humidity is known to have a detrimental effect. This work has been focused on an aluminium alloy and a one-component epoxy adhesive that are of particular interest to the automotive industry.

Pretreatment of the aluminium substrates before adhesive bonding is essential. However, the most successful pretreatment processes involve the use of hexavalent chromium, which will be banned from use within few years due to environmental considerations. Alternative pretreatments need to be developed. A literature study identified silanisation with GPS as a pretreatment method with the potential to obtain good durability. On the basis of research performed by SINTEF Materials Technology, AC anodising in hot phosphoric and sulphuric acid solutions were also identified as interesting pretreatment methods.

A modified version of the Boeing wedge test was used to determine the durability of adhesively bonded joints tested in hydrothermal environments. The joints were made of AA6060-T6 aluminium alloy and Betamate XD4600 epoxy adhesive. Both silane films and anodic oxides were investigated using reflection-absorption FT-IR spectroscopy. Other techniques of surface analysis were also used (SEM, TEM, WLI, XPS, ToF-SIMS and contact angle measurements).

The environmental durability of pretreated AA6060-T6 substrates was significantly improved after silanisation with GPS. The grit-blasting + GPS pretreatment process resulted in considerable higher durability then the chromic-sulphuric acid FPL-etch. The general understanding is that silanisation improves the durability through the formation of strong, covalent bonds between the aluminium surface and the adhesive. FT-IR spectroscopy strongly indicated that a chemical reaction took place between GPS films and amine curing agents. Particularly interesting was the reaction with dicyandiamide, which is a common curing agent in one-component epoxy adhesives. The amines also catalysed the condensation of SiOH groups, resulting in higher degree of SiOSi crosslink density in the siloxane films. However, chemical reaction is not necessary for improved durability. The hydrophobicity of the bonded surface is also an important factor. This effect has not been studies extensively earlier.

Exposure of GPS films to degrading environments showed that the silane desorbed from the surface in acidic solutions, but it was stable in alkaline solutions. The durability of adhesive joints was also reduced in acidic environments. The two models for the degradation of the silanised aluminium surface in acidic environments were proposed: hydrolysis of the siloxane network and corrosion of the underlying aluminium surface.

The environmental durability of substrates that were AC anodised in hot phosphoric and sulphuric acid solutions was good, almost as good as the well-established FPL + PAA pretreatment. DC anodising in sulphuric acid gave inferior durability. FT-IR spectroscopy showed that the anodic films formed in sulphuric acid contained significant amounts of sulphate. This can have a significant negative effect on the long-term properties of bonded joints. The anodic films released water during curing of the adhesive. The observations suggested that a transformation from the hydroxide to the oxide state took place.

Adhesive bonding in wet environment of substrates that were anodised in sulphuric acid had a negative effect on durability. The effect was more pronounced for DC anodised, than for AC anodised substrates. Bonding in wet environment also resulted in changed adhesive properties close to the oxide surface. Very little thixotropic agent was present in a ~200 nm wide region in the adhesive. This was explained by desorption of water from the oxide during curing of the adhesive.


Papers II, V and VI are reprinted with kind permission of Elsevier, sciencedirect.com.
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Joshua, Nilmini Sureka, University of Western Sydney, and Faculty of Science and Technology. "Novel phosphate bonding composites." THESIS_FST_XXX_Joshua_N.xml, 1997. http://handle.uws.edu.au:8081/1959.7/282.

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A cement material has been developed that has a controllable set time, compressive strength of about 50 MPa and shrinkage of under 2% when heated to 960 degrees centigrade. The main compound of this material has been shown to be the potassium analogue of struvite, in which potassium ion is substituted for the ammonium ion. The cement is formed by reacting a slurry made with potassium carbonate and monoammonium phosphate with magnesium oxide. Ihe amount and rate of addition of water to the mixture is controlled to determine the set time. It has been demonstrated that this cement may be used as a matrix in conjunction with cenospheres or cellulose fibres to form a low density composite material, and with silica powder to form a high strength composite. As well as optimising the cement mix for maximum strength and minimum shrinkage, a variety of properties of the K-cement were investigated. It was found that long term exposure of the cement to the atmosphere does not result in the formation of magnesium carbonate, but long term exposure to saline solutions can result in the formation of dypingite on the surface. No effect on strength was observed as a consequence of the age of the slurry or the cement, within 1-2 weeks
Doctor of Philosophy (PhD)
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Joshua, Nilmini Sureka. "Novel phosphate bonding composites /." View thesis, 1997. http://library.uws.edu.au/adt-NUWS/public/adt-NUWS20030828.115030/index.html.

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Wang, Xiaowei. "Adhesive bonding of polypropylene." Thesis, University of Bristol, 2002. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.247559.

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Books on the topic "Bonding"

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Chemical bonding. Oxford: Oxford University Press, 1994.

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Damico, DJ, TL Wilkinson, and SLF Niks, eds. Composites Bonding. 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959: ASTM International, 1994. http://dx.doi.org/10.1520/stp1227-eb.

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Alexe, Marin, and Ulrich Gösele, eds. Wafer Bonding. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-662-10827-7.

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Metrangolo, P., and G. Resnati, eds. Halogen Bonding. Berlin, Heidelberg: Springer Berlin Heidelberg, 2008. http://dx.doi.org/10.1007/978-3-540-74330-9.

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Lee, Lieng-Huang, ed. Adhesive Bonding. Boston, MA: Springer US, 1991. http://dx.doi.org/10.1007/978-1-4757-9006-1.

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Hancock, David. Brick Bonding. London: Macmillan Education UK, 1990. http://dx.doi.org/10.1007/978-1-349-11431-3.

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Abbott, Stephen. Sole bonding. Edited by Carter Alan, Tame Roger, Larcombe Peter, and SATRA Footwear Technology Centre. Kettering: SATRA, 1996.

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Centre, SATRA Technology. Sole bonding. [Kettering]: SATRA, 1999.

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1924-, Lee Lieng-Huang, ed. Adhesive bonding. New York: Plenum Press, 1991.

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Earthing & bonding. 9th ed. London: IET, 2012.

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Book chapters on the topic "Bonding"

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Kim, Tae Hyung. "Bonding." In CIRP Encyclopedia of Production Engineering, 1–4. Berlin, Heidelberg: Springer Berlin Heidelberg, 2018. http://dx.doi.org/10.1007/978-3-642-35950-7_6618-3.

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Kim, Tae Hyung. "Bonding." In CIRP Encyclopedia of Production Engineering, 149–53. Berlin, Heidelberg: Springer Berlin Heidelberg, 2019. http://dx.doi.org/10.1007/978-3-662-53120-4_6618.

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Barnes, John R. "Bonding." In Robust Electronic Design Reference Book, 799–808. New York, NY: Springer US, 2004. http://dx.doi.org/10.1007/1-4020-7830-7_33.

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Kim, Tae Hyung. "Bonding." In CIRP Encyclopedia of Production Engineering, 102–5. Berlin, Heidelberg: Springer Berlin Heidelberg, 2014. http://dx.doi.org/10.1007/978-3-642-20617-7_6618.

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Weik, Martin H. "bonding." In Computer Science and Communications Dictionary, 138. Boston, MA: Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_1758.

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Symons, Douglas K. "Bonding." In Encyclopedia of Child Behavior and Development, 267–68. Boston, MA: Springer US, 2011. http://dx.doi.org/10.1007/978-0-387-79061-9_387.

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Tres, Paul A. "Bonding." In Designing Plastic Parts for Assembly, 311–26. München: Carl Hanser Verlag GmbH & Co. KG, 2014. http://dx.doi.org/10.3139/9781569905562.009.

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Tres, Paul A. "Bonding." In Designing Plastic Parts for Assembly, 319–34. München: Carl Hanser Verlag GmbH & Co. KG, 2017. http://dx.doi.org/10.3139/9781569906699.009.

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Gooch, Jan W. "Bonding." In Encyclopedic Dictionary of Polymers, 89. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_1486.

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Kleiman, Karen. "Bonding." In Therapy and the Postpartum Woman, 211–17. New York: Routledge, 2022. http://dx.doi.org/10.4324/9781003248477-29.

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Conference papers on the topic "Bonding"

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Ishida, Hiroyuki, Sumant Sood, Christopher Rosenthal, and Stefan Lutter. "Temporary bonding/de-bonding and permanent wafer bonding solutions for 3D integration." In 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan). IEEE, 2012. http://dx.doi.org/10.1109/icsj.2012.6523416.

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Kutscha, Eileen, Kay Blohowiak, Vicki Wu, and Marc Piehl. "Optically Enhanced Bonding Workstation for Robust Bonding." In SAMPE 2019 - Charlotte, NC. SAMPE, 2019. http://dx.doi.org/10.33599/nasampe/s.19.1398.

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Melanio, Rodan, Robert Altar, and Regine Cervantes. "Copper bonding on thin top metal bonding pad." In 2014 IEEE 36th International Electronics Manufacturing Technology Conference (IEMT). IEEE, 2014. http://dx.doi.org/10.1109/iemt.2014.7123111.

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Rongzhi Gao, Lei Han, and Jue Zhong. "Experimental studies on bonding pressure in wire bonding." In Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. IEEE, 2006. http://dx.doi.org/10.1109/hdp.2006.1707578.

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Suga, Tadatomo, and Fengwen Mu. "Surface Activated Bonding Method for Low Temperature Bonding." In 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE, 2018. http://dx.doi.org/10.1109/estc.2018.8546367.

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Mu, Fengwen, Tadatomo Suga, Masahisa Fujino, Yoshikazu Takahashi, Haruo Nakazawa, and Kenichi Iguchi. "SiC wafer bonding by modified suface activated bonding method." In 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2014. http://dx.doi.org/10.1109/ltb-3d.2014.6886194.

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Ji, Hongjun, Mingyu Li, and Chunqing Wang. "Interfacial Characterization and Bonding Mechanism of Ultrasonic Wedge Bonding." In 2006 7th International Conference on Electronic Packaging Technology. IEEE, 2006. http://dx.doi.org/10.1109/icept.2006.359760.

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Yang, Guohua, Guorong He, Wanhua Zheng, and Lianghui Chen. "Direct wafer bonding technology employing vacuum-cavity pre-bonding." In Asia-Pacific Optical Communications, edited by Yong Hee Lee, Fumio Koyama, and Yi Luo. SPIE, 2006. http://dx.doi.org/10.1117/12.688864.

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Fujino, Masahisa, Kenji Takahashi, and Katsuya Kikuchi. "Wafer-level hybrid bonding for Cu/Interlayer-dielectric bonding." In 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2019. http://dx.doi.org/10.23919/ltb-3d.2019.8735413.

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Wang, Chenxi, Eiji Higurashi, and Tadatomo Suga. "Silicon Wafer Bonding by Modified Surface Activated Bonding Methods." In 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Polytronic 2007. IEEE, 2007. http://dx.doi.org/10.1109/polytr.2007.4339133.

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Reports on the topic "Bonding"

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Mishra, Umesh, and Gerald L. Witt. Wafer Cleaning and Pre-Bonding Module for Wafer Bonding. Fort Belvoir, VA: Defense Technical Information Center, December 2007. http://dx.doi.org/10.21236/ada502259.

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Lyon, R., C. Walkup, and J. Matthews. Adhesive for composite bonding. Office of Scientific and Technical Information (OSTI), November 1989. http://dx.doi.org/10.2172/5211026.

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Makowiecki, D. M., and R. M. Bionta. Low temperature reactive bonding. Office of Scientific and Technical Information (OSTI), June 1995. http://dx.doi.org/10.2172/100316.

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Meer, Jonathan, and Harvey Rosen. Family Bonding with Universities. Cambridge, MA: National Bureau of Economic Research, November 2009. http://dx.doi.org/10.3386/w15493.

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Blumenberg, Aly, Samantha Davis, Ali Graham, Rachel Medina, and Emily Rayder. Infant Massage and Bonding. University of Tennessee Health Science Center, May 2020. http://dx.doi.org/10.21007/chp.mot2.2020.0005.

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R. Q. Hwang, J. C. Hamilton, and J. E. Houston. Smart interfacial bonding alloys. Office of Scientific and Technical Information (OSTI), April 1999. http://dx.doi.org/10.2172/751020.

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Pacchioni, Gianfranco, Francesc Illas, Michael R. Philpott, and Paul S. Bagus. Bonding Geometry and Bonding Character of Thiocyanate Adsorbed on A Ag(100). Fort Belvoir, VA: Defense Technical Information Center, March 1991. http://dx.doi.org/10.21236/ada233176.

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Baker, D. A. Local Bonding Arrangements in Amorphous Ge2Sb2Te5: The Importance of GE and TE Bonding. Fort Belvoir, VA: Defense Technical Information Center, December 2006. http://dx.doi.org/10.21236/ada464396.

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Dallimore, S. R. Ice Bonding and Excess Ice. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1991. http://dx.doi.org/10.4095/132231.

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Leymann, N., C. Heidemann, M. Zhang, B. Sarikaya, and M. Cullen. Huawei's GRE Tunnel Bonding Protocol. RFC Editor, May 2017. http://dx.doi.org/10.17487/rfc8157.

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