Dissertations / Theses on the topic 'Bipolar switching'
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Chin, Shaoan. "MOS-bipolar composite power switching devices." Diss., Virginia Polytechnic Institute and State University, 1985. http://hdl.handle.net/10919/54275.
Full textPh. D.
Rabah, Kefa V. O. "A study of switching of MOS-bipolar power transistor hybrids." Thesis, Lancaster University, 1991. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.314432.
Full textYang, Xin. "Controlled IGBT switching for power electronics building block." Thesis, University of Cambridge, 2014. https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.708442.
Full textNicholls, Jonathan Christopher. "Soft-switching performance analysis of the clustered insulated gate bipolar transistor (CIGBT)." Thesis, De Montfort University, 2009. http://hdl.handle.net/2086/2396.
Full textHossin, Mohamad Abdalla. "Evaluation of gallium arsenide Schottky Gate Bipolar Transistor for high-voltage power switching applications." Thesis, University of Newcastle Upon Tyne, 1998. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.263129.
Full textGambetta, Daniele Morco. "Sensorless technique for BLDC motors." University of Southern Queensland, Faculty of Engineering and Surveying, 2006. http://eprints.usq.edu.au/archive/00001427/.
Full textHatem, Firas Odai. "Bipolar resistive switching of bi-layered Pt/Ta2O5/TaOx/Pt RRAM : physics-based modelling, circuit design and testing." Thesis, University of Nottingham, 2017. http://eprints.nottingham.ac.uk/39786/.
Full textEio, Samson. "Current Injection Techniques to Optimise the Switching Transients of Power Diodes. Thyristors and Insulated Gate Bipolar Transistors (IGBTs)." Thesis, Staffordshire University, 2008. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.522131.
Full textYou, Tiangui. "Resistive switching in BiFeO3-based thin films and reconfigurable logic applications." Doctoral thesis, Universitätsbibliothek Chemnitz, 2016. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-212501.
Full textDie Herunterskalierung von Transistoren für die Informationsverarbeitung in der Halbleiterindustrie wird in den nächsten Jahren zu einem Ende kommen. Auch die Herunterskalierung von nichtflüchtigen Speichern für die Informationsspeicherung sieht ähnlichen Herausforderungen entgegen. Es ist daher notwendig, neue IT-Paradigmen und neue Speicherkonzepte zu entwickeln. Das Widerstandsschaltbauelement ist ein elektrisches passives Bauelement, in dem ein der Widerstand mittels elektrischer Spannungspulse geändert wird. Solche Widerstandsschaltbauelemente zählen zu den aussichtsreichsten Kandidaten für die nächste Generation von nichtflüchtigen Speichern sowie für eine rekonfigurierbare Logik. Sie bieten die Möglichkeit zur gleichzeitigen Informationsverarbeitung und -speicherung. Der Fokus der vorliegenden Arbeit liegt bei der Herstellung und der Charakterisierung von BiFeO 3 (BFO)-basierenden Metal-insulator-Metall (MIM) Strukturen, um zukünftig deren Anwendung in nichtflüchtigen Speichern und in rekonfigurierbaren Logikschaltungen zu ermöglichen. Das Widerstandsschalten wurde in MIM-Strukturen mit einer BFO-Einzelschicht untersucht. Ein besonderes Merkmal von BFO-basierten MIM-Strukturen ist es, dass keine elektrische Formierung notwendig ist. Der Widerstandsschaltmechnismus wird durch das Modell einer variierten Schottky-Barriere erklärt. Dabei dienen Sauerstoff-Vakanzen im BFO als beweglichen Donatoren, die unter der Wirkung eines elektrischen Schreibspannungspulses nichtflüchtig umverteilt werden und die Schottky-Barriere des Bottom-Metallkontaktes ändern. Dabei spielen die während der Herstellung von BFO substitutionell eingebaute Ti-Donatoren in der Nähe des Bottom-Metallkontaktes eine wesentliche Rolle. Die Ti-Donatoren fangen Sauerstoff-Vakanzen beim Anlegen eines positiven elektrischen Schreibspannungspulses ein oder lassen diese beim Anlegen eines negativen elektrischen Schreibspannungspules wieder frei. Es wurde gezeigt, dass die Ti-Donatoren auch durch Ti-Implantation der Bottom-Elektrode in das System eingebracht werden können. MIM-Strukturen mit BiFeO 3 /Ti:BiFeO 3 (BFO/BFTO) Zweischichten weisen substitutionell eingebaute Ti-Donatoren sowohl nahe der Bottom-Elektrode als auch nahe der Top-Elektrode auf. Sie zeigen nichtflüchtiges, komplementäres Widerstandsschalten mit einer komplementär variierbaren Schottky-Barriere an der Bottom-Elektrode und an der Top-Elektrode ohne elektrische Formierung. Der Widerstand der BFO/BFTO-MIM-Strukturen hängt nicht nur von der Schreibspannung, sondern auch von der Polarität der Lesespannung ab. Für die rekonfigurierbaren logischen Anwendungen kann die Polarität der Lesespannung als zusätzliche Logikvariable verwendet werden. Damit gelingt die Programmierung und Speicherung aller 16 Booleschen Logik-Funktionen mit drei logischen Zyklen in dieselbe BFTO/BFO MIM-Struktur
Perez, Stéphanie. "Etude des effets de dose et débit de dose sur des amplificateurs à technologies bipolaires. Mise en application sur le satellite Robusta." Thesis, Montpellier 2, 2011. http://www.theses.fr/2011MON20075/document.
Full textThe aggressive space radiation environment constitutes a major cause of failure for components and systems on board the satellites. Bipolar transistors are know to be sensitive to ionizing radiation and may present dose rate effect (ELDRS). A greater degradation is observed at low dose rate. Current standards test methods can not fully take into account this sensitivity to the dose rate. The new Dose rate Switching test methodology takes into account this ELDRS effect. A Payload developed on the Robusta satellite and presented here will allow a first validation of the method. Classical amplifier (VFA) whose dose rate sensibility is well known and induce circuit effects, that means a non monotonous degradation of parameters related to antagonist phenomena, will be loaded on board Robusta satellite and used to validated the method. The satellite Payload is composed of LM124 and LM139. The low dose rate choice and the different switching applied relied on mission radiation analysis. This method allowed to reproduce the dose induced degradation of the components in half the time it takes at low dose rate. The results produced can then, after Robusta is launched, be compared to low dose rate data obtained in flight. A second study on current conveyor amplifier (CFA), so far very little studied, demonstrated the sensitivity to ionizing dose of this type of amplifier and identified new effects circuits. This study was conducted using three different types of irradiation and based on a circuit analysis. Irradiations and circuit analysis have shown that the amplitude of the degradation measured on the different parameters studied is erratic and depends on the perfect symmetry of the circuit: a slight discrepancy in the process between two transistors will induce a more or less significant symmetry in the parameters degradation. This early work will be a base for various studies, including the study of synergy dose/SET or synergy dose/EMC on CFA
Olsson, Johanna. "Implementation of Nodes in HVDC Grids." Thesis, KTH, Skolan för elektroteknik och datavetenskap (EECS), 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-293884.
Full textProjektet syftar till att få en djupare förståelse för hur frekvensen och amplituden på de vågor som skapar kontollvågen i en pulsbreddsmodulerad likspänningsomvandlare med två nivåer påverkar effektkvalitén och effektförlusterna. Resultatet av studien var att en hög frekvens minskar ”Total Harmonic Distortion” men ökar effektförlusterna. Amplituden å andra sidan reducerar både ”Total Harmonic Distortion” och effektförlusterna när den ökar. Alla analyserna är gjorda i simuleringsprogrammet Simulink. Resultaten kan appliceras när högspända likspänningsomvandlare vidareutvecklas för att skapa ett fungerande högspänt-likströms elnät som öppnar upp för en bredare användning av förnyelsebara energikällor.
Kandidatexjobb i elektroteknik 2020, KTH, Stockholm
Lefebvre, Stéphane. "Contribution à la caractérisation de l'IGBT en commutation à zéro de courant." Cachan, Ecole normale supérieure, 1994. http://www.theses.fr/1994DENS0009.
Full textLiu, Zi-Jheng, and 劉子正. "Bipolar Resistive Switching Characteristics of ZnO Thin Films." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/13708289730999744303.
Full textYou, Ding-Hong, and 尤定宏. "Bipolar resistive switching properties of tellurium dioxide nanostructures." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/s2nyzj.
Full text國立東華大學
物理學系
106
The tellurium (Te) mico- and nano-structures were synthesized using tube furnace chemical vapor deposition (TFCVD). Then the mico- and nano-structures are annealed in TFCVD in order to produce the tellurium oxide (TeO2) mico- and nano-structures. The morphology of these Te and TeO2 mico- and nano-structures were studied using field-emission scanning electron microscopy (FESEM). The elemental information and electronic structure were revealed using energy dispersive X-ray spectroscopy (EDS) and X-ray photoelectron spectroscopy (XPS). The crystal structures were studied using X-ray diffractometry (XRD), Raman spectroscopy, and transmission electron microscopy (TEM). The various as-synthesized Te and TeO2 micro- and nano-structures were investigated with the electrical measurements of IV loops to probe the resistive switching properties at room temperature. We found only the TeO2 nanostructures of ~95 nm wide have the bipolar resistive switching properties, which are very potential to the application in random access memory (RRAM) devices.
Chen, Chia-Hung, and 陳佳宏. "Unipolar and bipolar resistive switching behaviors in transition metal oxides." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/74016178025359544756.
Full text國立聯合大學
電子工程學系碩士班
98
TiO2 films deposited by sol-gel method with two process variables are prepared to investigate the bipolar resistive switching (BRS) and unipolar resistive switching (URS) in metal/insulator/metal structure cells, and the difference between BRS and URS is the polarity of the on/off state transition voltage in the current-voltage curves. The first variable is the thermal treatment atmosphere in Ag/TiO2/Pt cells. The cells are URS in air atmosphere and BRS in oxygen atmosphere. The second variable is the bottom electrode materials of TiO2 cells, which are thermal treatment in air atmosphere. The cells are URS on Pt metal electrode and BRS on ITO oxide electrode. Compared with URS cells, BRS cells are lower in the operation voltage (BRS:1V < URS:2V) and current (BRS:10-3A < URS:10-2A), while higher in operation stability under multi-switching cycles (BRS:0.1V > URS:2.6V). Analyzing the IV curves in full-logarithmic plot, we find that by observing the fitting curves which show linear dependence (I?fV) at smaller voltage and the square one (I?fV2) at higher voltage, the carrier conduction mechanism concurs with space-charge-limited current theory. We infer that the critical factors for inducing URS or BRS could be the depth of traps in the film.
Yang, Tun-Chih, and 楊敦智. "Oxide-based bipolar selector device for resistive switching memory applications." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/28unfb.
Full textHuang, Yan-Cheng, and 黃彥程. "Bipolar resistive switching of NiO/HfO double-layer thin films." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/30159625652929499839.
Full text國立東華大學
物理學系
104
Double-layers of nickel oxide/hafnium dioxides (NiO/HfO2) are synthesized on p-Si wafers using hot-filament metal oxide deposition technique. The thickness of the HfO2 thin films is controlled using the deposition time while the synthesis of NiO are kept same. The morphological feature and thickness of the thin films is observed using field-emission scanning electron microscopy (FESEM) equipped with the backscattering electron (BE) microscopy. The chemical compositions of the bi-layer NiO/HfO2 layer is confirmed using energy dispersive spectroscopy (EDS). Using X-ray diffractometry (XRD) we showed that thin films of NiO and HfO2 consists of cubic and monoclinic crystal structures, respectively. The resistive switching properties of the bi-layer NiO/HfO2 structures are studied using current-voltage sourcemeter. When the thickness of the HfO2 layer reduced to is ~40 nm, the NiO/HfO2 double layers shows an excellent resistive switching behavior. However, when the thickness of the HfO2 layer is over 40 nm, the resistive switching property does not exists. In addition, neither a thin film of single NiO nor HfO2 has the resistive switching characteristics, so it is indicative that the interface between the NiO layer and HfO2 layer plays a significant role by supplying a plenty of oxygen vacancies and hopping electrons.
Chen, Ying-Chan, and 陳昱丞. "Bipolar Switching properties of HfO2 based Resistive Random Access Memory Devices." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/50170076258052413995.
Full textJeng, Huei-Yau, and 鄭暉耀. "Mechanism analysis of bipolar resistive switching in modified DNA biopolymer devices." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/32hp54.
Full textYu, Po Lin, and 游柏林. "Bipolar and complementary resistive switching characteristics using Ir/SiO2/TiN structure." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/6xz84h.
Full text長庚大學
電子工程學系
104
In this thesis, bipolar resistive switching (BRS) characteristics using W/SiO2/TiN and Ir/SiO2/TiN RRAM structure have been investigated. Complementary resistive switching (CRS) using Ir/SiO2/TiN single cell has also been demonstrated. Defective SiO2 switching material is confirmed by X-ray photoelectron spectroscopy. Typical BRS are shown in W/SiO2/TiN stack at the current compliances of 500 µA and 200 µA. Statistical analysis is done by taking randomly 50 devices which confirm that device-to-device switching uniformity is ˃ 75%. In case of W/SiO2/TiN, the low resistance state (LRS) current shows Ohmic conduction, and high resistance state (HRS) current shows Schottky emission at low field and hopping conduction at higher field. On the other hand, both HRS and LRS show Ohmic conduction at low field, and hoping conduction is observed at higher field by using Ir/SiO2/TiN structure. The SiO2 thickness based BRS characteristics have been explained. In addition, good data retention of > 3hr and long read endurance of >106 cycles with a small pulse width of 1µs are observed. Resistive switching mechanism using W and Ir electrode is explained by oxygen ions migration under external bias has been explained by schematic model. The CRS is observed by tuning proper bias in Ir/SiO2/TiN single cell without metal interlayer. In CRS, low field and high field regimes are complied with space-charge limited current (SCLC) and Fowler-Nordheim (F-N) tunneling mechanism, respectively. The CRS mechanism has been explained considering oxygen ions migration or vacancy (VO) mediated filamentary schematic model. Superior read endurance of ˃104 cycles is obtained at small pulse width of 1 µs with acceptable resistance ratio of ~10. The non-linearity factor of >10 is also obtained, which is useful for future three-dimensional (3D) crossbar memory applications.
Chen, Jing-Yuh, and 陳敬育. "Investigation of InP-based Heterojunction Bipolar Transistors and Optoelectronic Switching Devices." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/04342709273737323496.
Full text國立成功大學
微電子工程研究所碩博士班
93
In this dissertation, we have successfully fabricated and demonstrated InP-based heterojunction bipolar transistors (HBTs). The characteristics of InP/InGaAs HBT with a superlattice-collector (SC) structure and InGaAs/InGaAsP composite-collector HBT (CCHBT) are measured and discussed. In addition, two interesting optoelectric switches, a double-barrier-emitter triangular-barrier optoelectronic switch (DTOS) and a bulk-barrier optoelectronic switch (BBOS) with an AlGaAs/δ(n+)-doped sheet/GaAs/InAlGaP collector structure are also investigated and discussed. The studied devices were grown by low-pressure metal organic chemical vapor deposition (LP-MOCVD) and molecular beam epitaxy (MBE). The characteristics of epitaxial layers will be analyzed by double-crystal x-ray diffraction (DCXRD), photoluminescence (PL), and electrochemical CV profiling (ECV). After finishing the growth, mesa-type devices were formed by utilizing photolithography, vacuum evaporation, lift-off, alloying and selective etching techniques. DC characteristics of an interesting InP/InGaAs heterojunction bipolar transistor with a superlattice (SL) structure incorporated in the base-collector (B-C) junction are demonstrated. In the SL structure, holes injected from the collector collide with holes confined in the SL and impact them out of the SL across the valence-band discontinuities. With a collector-emitter (C-E) voltage VCE less than the C-E breakdown voltage BVCEO, the current gain can be increased at base-current inputs because the released holes from the SL inject into the base to cause the E-B junction operating under more forward-biased condition. An AC current gain up to 204 is obtained. At B-E voltage VBE inputs, the released holes travel to the base terminal to decrease the base current. The studied HBT exhibits common-emitter current gains exceeding 47 at low current levels and useful gains spreading over 7 orders of magnitude of collector current. DC characteristics of an interesting HBT with an InGaAs/InGaAsP composite-collector (CC) structure are studied and reported. Due to the insertion of an InGaAsP setback layer at the base-emitter (B-E) heterojunction, the potential spikes as well as the electron blocking effect are suppressed significantly. In addition, the presence of an effective base-collector (B-C) homojunction can substantially reduce the current blocking effect. The studied device gives impressed dc performance including small offset and saturation voltages without degrading the breakdown behaviors. The typical dc current gain of 118 and the desired current amplification over 11 decades of magnitude of collector current IC are obtained. On the other hand, a triangular-barrier and a double-barrier structure are combined to form a double-barrier-emitter triangular-barrier optoelectronic switch (DTOS). In the structure center of the triangular barrier, a p-type delta-doped quantum well is inserted to enhance the hole confinement. Owing to the resonant tunneling through the double-barrier structure and avalanche multiplication in the reverse-biased junction, N-shaped and S-shaped negative-differential-resistance (NDR) phenomena occur in the current-voltage (I-V) characteristics under normal and reverse operation modes, respectively. The NDR characteristics show variations from dark to illumination condition. Temperature effects on the NDRs of the DTOS are also obvious. The illumination and temperature influences on the device characteristics are investigated. Two-terminal switching performances are observed in a new bulk-barrier optoelectronic switch (BBOS) with an AlGaAs/δ(n+)/GaAs/InAlGaP collector structure. The device shows that the switching action takes place from a low current state to a high current state through a region of NDR. The transition from either state to the other may be induced by an appropriate optical or electrical input. It is seen that the effect of illumination increases the switching voltage VS, holding voltage VH, holding current IH and decreases the switching current IS, which is quite different from other reported results. In addition, it possesses obvious NDR even up to 435K. This high-temperature performance provides the studied device with potential high-temperature applications.
Tsai, Ken-Hsiao, and 蔡侃學. "Study on Electrode Materials and Switching Characteristics of HfO2 Bipolar Resistive Memory." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/25086875614433159578.
Full text國立清華大學
電子工程研究所
99
In this thesis, we discuss on the top electrode effect, current conduction mechanism and annealing effect for the HfO2 based RRAM. At the discussion of the top electrode effect, the W top electrode causes the device to present unipolar operation, but in the W/Ti top electrode present bipolar operation. We may know that top electrode influence the switching characteristic and the polarity of RRAM seriously. Second, the W/Ti/HfO2/TiN device in LRS is the ohmic conduction, but when HRS, the low voltage region (<0.05V) is the ohmic conduction, the high voltage region (>0.1V) is Poole-Frenkel emission. Finally, in the annealing effect, the suitable temperature condition to obtain the 10 times of promotion in endurance. From the result of the annealing effect, we can provide a method to improve endurance and have the development potential.
Tsai, Wei Che, and 蔡維哲. "Analysis and Design of Single-Phase Bipolar Voltage Switching DC-AC Converter." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/11636705527367712422.
Full text東海大學
電機工程學系
100
In this paper we present the design and through the TSMC 0.25μm HV process to achieve a single-phase bipolar voltage switching DC-AC inverter. The design of the main structure is PWM bipolar switching technology and a level shift circuit connect to full-bridge circuit to do the DC input voltage to the AC output voltage control. A supply voltage and temperature-independent bandgap reference circuit is used in the inverter that has a output voltage of 9.4V/60Hz of sine wave. The AC sine wave voltage is provided to a small AC LED load. The chip area is 1.9 x 2.05mm2. Circuit simulation verifies the performance and feasibility of the conversion system.
Yang, Zi-Jian, and 楊梓鍵. "Study of size-dependent bipolar resistive switching responses of modified biopolymer devices." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/9mh644.
Full textKalkert, Christin. "Elektrischer Transport in Manganatschichten: Einfluss von elektrischen Feldern und Licht." Doctoral thesis, 2013. http://hdl.handle.net/11858/00-1735-0000-0001-BABD-5.
Full textJiun-JieFang and 方駿杰. "The study of TaOx-based rram bipolar resistive switching process by impedance spectroscopy." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/63zyay.
Full text國立成功大學
材料科學及工程學系
103
Abstract In this study, the resistance switching mechanisms of Ta/TaOx/Pt and Ta/TaOx/ITO devices are explored based on I-V sweeping curves, characteristic impedance and material characteristics. First, TEM is used to investigate the thickness of the device and crystallinity of the TaOx films. Chemical bonding state in TaOx active layer is observed with XPS. Second, regarding to electrical properties of TaOx-based device, we not only use precision semiconductor parameter analyzer (Agilent 4156C) to get the resistive switching curve of TaOx-based device, but also use the precision impedance analyzer (Agilent 4294A)to get the characteristic impedance of TaOx-based device at different states and different dc bias. The first part of this dissertation is about material characteristics of TaOx TEM, analysis reveals that TaOx is amorphous. Second, from the result of XPS, the chemical states of Ta(+0) and Ta(+5) are coexist near Ta/TaOx interface, so we can conclude that there is a oxygen vacancy-rich region, the Transition Region (TR), exist near Ta/TaOx interface. The second part of this study is about electrical properties of TaOx-based devices. From resistive switching curves, both Ta/TaOx/Pt and Ta/TaOx/ITO devices can be operated in bipolar mode, with writing at positive bias and erasing at negative bias. The characteristic impedance at high and low resistance states of the two devices can be fitted with Rs-R//C model, and the value of R at high resistance state (HRS) is higher than at low resistance state (LRS) for both devices, which means that during the resistance-switching process, oxygen vacancies will be driven by different polarity bias to form or rupture the conductive filament. In the third part of this study, we measure the impedance under positive and negative dc bias to observe the characteristic impedance during set and reset process. From the result of positive dc bias impedance measurement on the HRS devices, we found that the equilibrium circuit of the two devices will be first changed from Rs-R//C model into a complex model involving inductors, then turn back to Rs-R//C after removing positive bias. In the meaning time, the R changes from the initially high value to a low value, which means that the conductive filament will be formed and the shape of the filament will be changed during positive dc bias operation. From the result of negative dc bias impedance measurement on the LRS devices, the equilibrium circuit of the two devices will approximately maintain Rs-R//C, and the value of R for two devices is gradually become larger during negative biased impedance measurement, which means that the conductive filament in active layer will be ruptured during negative dc bias operation. Regarding the differences of using Pt and ITO bottom electrodes is that, ITO bottom electrode will absorb or release oxygen vacancies during resistance switching process, which may affect the resistance-switching process, however, Pt bottom electrode will not. So from the experiment, we can found that several difference between Ta/TaOx/Pt device and Ta/TaOx/ITO device. First, in high resistance state (HRS), the value of R fitted from Rs-R//C model in Ta/TaOx/Pt device is larger than Ta/TaOx/ITO device, however, in low resistance state (LRS) , the value of R fitted from Rs-R//C model in Ta/TaOx/Pt device is smaller than Ta/TaOx/ITO device. Second, the two electrical parameters of Vset and on/off ratio, which get from characteristic resistive switching curve, both in Ta/TaOx/Pt device are larger than in Ta/TaOx/ITO device. Summary The resistive switching process in oxide-based RRAM is generally originated from the formation-and-rupture of conductive filament via oxygen vacancies. However, to observe the filament evolution during resistive switching process is difficult. In our study, we measure impedance of RRAM at different resistance states to study the filament evolution during resistive switching. Two TaOx-based resistive switching memories, Ta/TaOx/Pt and Ta/TaOx/ITO devices are investigated in this work. First, from the material analysis, we have found an oxygen vacancy rich region, the transition region, existing near Ta/TaOx interface. Secondly, from the analysis of impedance at different states for two devices, we can find that the impedance at different states all can be fitted with Rs-R//C circuit model, and the value of R for two devices in high resistance state is substantially larger than in low resistance state, which is the evidence to show that the filament rupture or formation during resistive switching process.
Murali, Santosh. "Investigation of bipolar resistive switching in zinc-tin-oxide for resistive random access memory." Thesis, 2011. http://hdl.handle.net/1957/26622.
Full textGraduation date: 2012
Lin, Wei-Jye, and 林偉捷. "Analysis of Switching Speed Improvement in Insulated Gate Bipolar Transistor (IGBT) By Electron Irradiation." Thesis, 2000. http://ndltd.ncl.edu.tw/handle/54388837044773115923.
Full text國立清華大學
電子工程研究所
88
Electron Irradiation is a technique used to control the Insulated Gate Bipolar Transistor (IGBT) switching performance. It can reduce the minority carrier lifetime and increase the recombination rate of the excess minority carriers by generating the atomic displacement and trap centers in the drift region of the IGBTs. However, electron irradiation induces undesired effects on other parameters, such as forward voltage drop and threshold voltage. In this thesis, we design a series of electron irradiation dosage to optimize the steady states and switching performance of IGBTs considering various design parameters. Then, the model of predicting turn-off time is created by two-dimensional simulator MEDICI and circuit simulator HSPICE. Finally, We have successful fabricated IGBT with 600V breakdown voltage, 10A on-current, 2.49V on-state voltage drop at 10A, and high speed, 365nsec turn-off time.
Wang, Wei-Chou, and 王偉州. "Investigation of InGa(Al)As/InP Heterojunction Bipolar Transistors and Negative-Differential-Resistance Switching Devices." Thesis, 2001. http://ndltd.ncl.edu.tw/handle/05594953355958493387.
Full text國立成功大學
電機工程學系
89
In this dissertation, we have successfully fabricated and demonstrated InP-based heterojunction bipolar transistors (HBT's). The characteristics of InGaAs/InP superlattice emitter resonant tunneling bipolar transistors (SE-RTBT's) and InGaAlAs/InP d-doped HBT's are measured and discussed. The characteristics of epitaxial layers and SiO2 film will be analyzed by double-crystal x-ray diffraction (DCXRD), photoluminescence (PL), energy dispersive x-ray spectrometer (EDS), and Auger electron spectroscopy (AES). The scanning electron microscope (SEM) technique shows the top view and cross section of the studied devices. In addition, DC and RF heterojunction bipolar transistor (HBT) fabrication process are illustrated. The transfer length method (TLM) measurement is used to calculate the resistance of each ohmic contact layers. Two different SE-RTBT's are reported. The device A contains a 5-period superlattice and 800A emitter layer. In addition, a 3-period superlattice and 150A emitter are included for device B. AC common emitter current gain up to 170 and 54 are obtained for device A and B, respectively. The current gains are reduced about 6% and 7.4% for both devices as the temperature is decreased from 300K to 77K. The resonant tunneling effect is observed at 77K for device A. Due to the use of superlattice and critical-designed emitter, the DC performance is improved and more stable temperature-dependent characteristics is achieved. By using InP emitter ledge, DC current gain of the devices can be enhanced. The unit current gain cutoff frequency fT of 12GHz and 15GHz for device A and B are obtained, respectively. Power characteristics and noise performance are also illustrated. A narrow base d-doped InGaAlAs/InP negative-differential-resistance (NDR) HBT is proposed in this thesis. The AC common-emitter current gain up to 22 is obtained. For the different controlled base current ( IB=2uA/step, 10uA/step, 100uA/step ), the different topee-shaped, N-shaped, and conventional characteristics of HBT's are observed. The peak-to-valley-current ratio (PVCR) up to 11 is obtained. The mechanism is considered to be the modulation of potential spike due to the base resistance effect on the emitter injection efficiency. Besides, multiple S-shaped NDR phenomena are also observed under the inverted operation mode. This is due to the avalanche multiplication and two-stage barrier lowering effect. Optical characteristics of the studied NDR-HBT show that a photocurrent up to 1.01mA is obtained. On the other hand, a new multiple-state and optically controllable optoelectronic switch based on an InGaAlAs/InP -doped HBT structure is demonstrated. Common-emitter current gain up to 25 is obtained as the device is operated under forward operation mode. However, a significant S-shaped NDR phenomenon is found under the applied reverse-biased voltage. The second-route S-shaped NDR phenomenon is observed under illumination without changing the bias condition. The multiple-route and multiple-step current-voltage (I-V) characteristics at 77K are also observed. The novel MNDR I-V characteristics are attributed to the avalanche multiplication, successive two-stage barrier lowering process and electron confinement effect in the InGaAs quantum well. Experimental results reveal that the studied device can be operated among a wide temperature range. Table Captions Figure Captions Chapter 1. Introduction 1.1. Brief history of heterojunction bipolar transistors (HBT's) 1.2. Advantages of InGa(Al)As/InP over AlGaAs/GaAs or InGaP/GaAs 1.3. Dissertation objective Chapter 2. Material Growth and Device Fabrication 2.1. Introduction 2.2. MOCVD system 2.3. Growth conditions and characteristics of InP and InGa(Al)As 2.4. A.C. sputtering system and characteristics of SiO2 film 2.5. HBT fabrication process 2.5.1. D.C. and R.F. layout design 2.5.2. Emitter, base, and collector definition 2.5.3. Selective etching and device isolation 2.5.4. SiO2 growth and interconnection 2.5.5. Transfer length method (TLM) ohmic contact measurement 2.6. Summary Chapter 3.InGaAs/InP Superlattice Emitter Resonant Tunneling Bipolar Transistors (SE-RTBT's) 3.1. Introduction 3.2. Layer structures of 54 and 32 SE-RTBT's 3.3. Theoretical analyses of emitter thickness and superlattice layers 3.4. Theoretical analyses of high frequency performance 3.5. Experimental results and discussion 3.5.1. Advantages of superlattice and InP emitter layers 3.5.2. D.C. and temperature dependent characteristics of SE-RTBT's 3.5.3. Performance of InP emitter ledge 3.5.4. Influence of SiO2 on the device characteristics 3.5.5. RF characteristics of SE-RTBT's 3.6. Summary Chapter 4. InGaAlAs/InP Delta-Doped Negative-Differential-Resistance Heterojunction Bipolar Transistor (NDR-HBT) 4.1. Introduction 4.2. Layer structure of NDR-HBT 4.3. Experimental results and discussion 4.3.1. Influence of delta-doped sheet on the potential spike 4.3.2. D.C. characteristics and photonic-sensitive performance of NDR-HBT 4.3.3. Mechanism of NDR-HBT 4.3.4. Circuit applications of NDR-HBT 4.4. Summary Chapter 5. InGaAlAs/InP Multiple-Negative-Differential-Resistance (MNDR) Switching Device with HBT Structure 5.1. Introduction 5.2. Layer structure of MNDR switching device 5.3. Experimental results and discussion 5.3.1. D.C. and temperature characteristics of MNDR device 5.3.2. Mechanism of MNDR switching device 5.3.3. Circuit applications of MNDR switching device 5.4. Summary Chapter 6. Conclusion and Prospect 6.1. Achievement 6.2. Future work References Publication List Vita
Yeh, Yu-Ting, and 葉昱廷. "Effect of Ti Top Electrode on Bipolar Resistive Switching Properties of RF Sputtered SrZrO3 Thin Films." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/36793869807842651866.
Full text國立交通大學
電子工程系所
97
In this thesis, the RRAM devices manufactured based on SrZrO3 (SZO) thin films are studied and developed. At first, we will introduce the applications, fundamental characteristics, and advantages of next-generation nonvolatile memories. The conduction mechanisms of RRAM that have been published are also discussed. In experimental details, Pure SZO film was deposited on the LaNiO3 buffer layer by RF magnetron sputter. Pt and Ti act as bottom and top electrode by Dual E-Gun evaporation, respectively. Therefore, electrode/resistive thin film/buffer layer/electrode structure is formed. In the beginning, we will discuss the influence of various top-electrode metals for SZO thin film devices. The switching property, endurance and device yield could be stabilized and enhanced by Ti top electrode. Secondly, we use the post metal annealing (PMA) treatment on Ti/SZO structure to generate TiOx interface layer could reduce the operation voltages and also enhance the endurance and device yield of memory device. The SZO memory device with Ti top electrode has the better and stable resistive switching characteristic by PMA at 200℃ for 1 hour. The effects of resistive switching property by different PMA temperatures are also compared and discussed. We conjecture that TiOx interface layer between Ti and SZO film by PMA at 200℃ has good influence on resistive switching property by experiment and proofs.
Tseng, Chan-Yu, and 曾占宇. "The effect of ZnO film thickness on bipolar resistive switching behaviors of ZnO-based transparent structure." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/34112147920335133241.
Full textChao, Chi-Liang, and 趙啟良. "Study of Bipolar Resistive Switching in Copper-doped Tantalum Oxide Thin Films Prepared by Plasma Oxidation." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/80178226980350476572.
Full text國立臺灣科技大學
材料科學與工程系
100
A thin copper-doped tantalum oxide (Cu-TaOx) film was prepared by plasma oxidation of a copper-doped tantalum nitride (Cu-TaN), and its resistance switching behavior was studied. A Cu-TaN film was firstly deposited by co-sputtering as a bottom electrode, then the Cu-TaN film was oxidized in an oxygen-containing plasma to form an insulating layer (Cu-TaOx). At last, the TaN film was deposited on top of the insulating layer as the top electrode to form a MIM structure. The insulating layer was fabricated by RF plasma oxidation and microwave plasma oxidation, respectively. Both of these two devices exhibited bipolar resistance switching when DC voltages were swept. And the resistance ratio of RHRS/RLRS measured at +0.3 V were above 10 to 100 using two different compliant currents. This phenomenon suggested that conducting filamentary paths may form inside the Cu-TaOx layer. In the microwave plasma oxidation, the device showed Schottky emission in the low voltage region of HRS, and exhibited poole-frenkel emission in the high voltage region of HRS, whereas LRS followed SCLC mechanism. In the contrast, when the insulating layer was formed by RF plasma oxidation, the device showed SCLC mechanism in HRS and Ohmic contact in LRS, respectively. The insulating layers made by two different oxidization methods were examined by XPS, SEM and TEM. Different compositions and structures were revealed in the insulating layer, causing different conducting mechanism in the I-V analysis.
葉川慶. "Bipolar Switching properties in Resistive Random Access Memory Devices with Pd electrode and Ni inserted layer." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/92232709371559873905.
Full textHuang, Hsin-Ping, and 黃欣萍. "Effect of Interfacial Oxide layer (TiOx) on Bipolar Resistive Switching of Ti/ITO and ITO/Ti Devices." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/47675666800588181866.
Full text國立臺灣科技大學
材料科學與工程系
102
In this study, we used titanium (Ti) and indium tin oxide (ITO) as the eletrodes to fabricate the TiN/Ti/TiOx/ITO and ITO/TiOx/Ti/TiN resistance random acess memory (RRAM) without depositing a resistor layer. It was found that an interfacial-oxide layer TiOx was spontaneously formed between Ti and ITO layers. The TiN/Ti/TiOx/ITO device showed bipolar switching of resistance in counterclockwise direction without forming a process. The TiN/Ti/TiOx/ITO device changed from high resistive state (HRS) to low resistive state (LRS) at about 1.16 V and changed back to HRS at about -1.00 V. The endurance test showed resistance ratio, RHRS/RLRS, for TiN/Ti/TiOx/ITO device was 8, and the DC voltage sweeps could achieve about 500 cycles at room temperature. The conducting mechanism for TiN/Ti/TiOx/ITO device followed Ohmic cconduction at LRS. And the HRS also followed Ohmic cconduction at low voltage, but Poole-Frenkel emission at high voltage. Furthermore, the area-dependence characteristic of resistance for the TiN/Ti/TiOx/ITO device was constant at LRS, but decreased with increased areas at HRS. And the characteristic of resistance was increased with temperatures for the TiN/Ti/TiOx/ITO device at LRS and HRS. Filamentary path of oxygen vacancies was suggested to dominate the conduction in the TiN/Ti/TiOx/ITO device. The ITO/TiOx/Ti/TiN device also showed bipolar switching of resistance but in clockwise direction without a forming process. And the ITO/TiOx/Ti/TiN device could be reset from LRS to HRS at about 2.0 V and set back to LRS at about -1.4 V. Furthermore, the resistance ratio, RHRS/RLRS, was around 1.5 and unstable for the ITO/TiOx/Ti/TiN device. After switching stably, the conducting mechanism of ITO/TiOx/Ti/TiN device followed Ohmic cconduction at LRS, but combined Ohmic at low voltages and space-charge-limited conduction at high voltages at HRS. By annealing it in vacuum at 250 ℃ for 30 min, the ITO/TiOx/Ti/TiN device had stable switching behavior.
Chuang, Yan-Ting, and 莊彥庭. "Self-compliance bipolar switching behavior in a ZnO NRs/CuO p-n heterojuntion with low operating current." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/95370746763416728055.
Full text國立臺灣大學
應用物理所
101
The growth and bipolar resistive switching behavior of ZnO nanorods / CuO PN heterojunction are reported in this thesis. ZnO nanorods were grown on ITO substrate by using hydrothermal method. A Cu layer was then grown on top of the ZnO nanorods and oxidized to become CuO, but before the growth of the Cu layer, the empty spaces between nanorods were filled with photo-resist to prevent current leakage. Scanning electron microscope, Photoluminescence and X-Ray diffraction were used to study the surface morphology and the crystalline structure of the sample and the results indicate that the sample have good crystalline quality and optical properties. Typical PN junction rectifying behavior was observed for the sample in the current- voltage measurement. After the forming process, the bipolar switching behavior can be clearly observed with a high/low ratio of about 10 between high resistance state and low resistance state. The operation current is very low in our device, and it can be operated at a current level of 10-7 A. In additions, current self- compliance is observed in both the set and reset processes; the current in the device decreases in both the set and rest processes. Several different kinds of electrodes were deposited on the samples to study the effect of the electrodes on the switching behavior of the devices, and the results indicate that the switching behavior is electrode-independent. A model which takes into account of the migration of vacancies in the depletion region is proposed and can explain successfully the observed experimental results.
Li, Chia-Hui, and 黎佳惠. "Effect of Interfacial Aluminum Oxide on Bipolar Resistive Switching of the Al/TaOxNy/TaN and TaN/TaOxNy/Al Devices." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/87359955082210959701.
Full text國立臺灣科技大學
材料科學與工程系
101
In this study, we demonstrate the effect of interfacial aluminum oxide (AlOz) layer near the Al-TaOxNy interface and compare reversible switching behaviors of the Al/TaOxNy/TaN and TaN/TaOxNy/Al resistance random access memory (RRAM) devices. The TaN and Al films which are compatible with the integrated circuits technology were prepared by sputter deposition as the electrode layers to replace expensive Pt electrode, and the tantalum oxynitride (TaOxNy) film was prepared by reactive sputtering or microwave plasma oxidation of the TaN films as the insulating layer. The resistance swiching operation was unstable for the Al/TaOxNy/TaN devices whose TaOxNy films were prepared by reactive sputtering or microwave plasma oxidation, and the resistance of HRS and LRS increased with increased resistance switching cycles. In comparison, the switching behavior of TaN/TaOxNy/Al device whose TaOxNy film was prepared by reactive sputtering exhibited good stability. The resistance ratio of RHRS/RLRS measured at -0.2 V of the TaN/TaOxNy/Al device was about 2.5, and the numbers of resistance switching could be up to 1000 cycles at room temperature. On the mechanism analysis of TaN/TaOxNy/Al device, HRS were the Ohmic conduction at the low operation voltages and the Poole-Frenkel emission at high operation voltages, respectively, and LRS was the Ohmic conduction. To elucidate the conduction mechanism, we carried out electrical measurements of the RRAM with different cell areas and at various temperatures. The TaN/TaOxNy/Al device in LRS had constant resistance with increased cell’s area and decreased resistance with increased temperature. It suggests that the electron transport is probably attributed to oxygen vacancies in conduction filaments.
CHANG, CHUN-YEN, and 張駿彥. "The Width of Anode and Junction Depth correlated with the Switching Speed on Insulated Gate Bipolar Transistor and Electrical-Curve Fitting P-FinFET Transistor." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/3fnccm.
Full text明新科技大學
電子工程系碩士班
106
Abstract Insulated Gate Bipolar Transistor (IGBT) is a popular power discrete device. The gate voltage of the MOSFET controls the high input impedance of the transistor, and it also uses the BJT's double-loaded sub-stream to achieve high current and low on-voltage control performances. By the way, IGBTs can also work with high reverse bias and is thus considered the prime power discrete. However, in order to understand the electrical performances of IGBT, some alternative measuring tool is used to do the job because high power curve tracer is not always available. In this study, devices of different device structures (including different gate widths and source widths) with different processes are fabricated and measured. The author analyzes the switching function to conclude the performances of the devices. The comparisons give the clues on the size design for the layout corresponding to the selected process conditions. On the other hand, 3-D PFinFET devices are put to measurement. The traditional current-voltage characteristic formula is modified and the modified one is used to fit measured I-V curves. At higher VG, the leakage current is ignorable and the fitting curves can reasonably fit the I-V curves. But for VG = 0.0V, it becomes mandatory that the leakage term, which is proportional to the difference of Gate and Drain biases, should be taken into account to appropriately fit the curves.
Bogusz, Agnieszka. "Development of novel YMnO3-based memristive structures." 2016. https://monarch.qucosa.de/id/qucosa%3A21352.
Full textDer Memristor ist definiert als eine Zweipol-Vorrichtung, die eine hysteretische Strom-Spannungs-Charakteristik aufweist. Memristoren sind nichtflüchtige Widerstandsspeicher, deren elektrischer Widerstand mittels elektrischer Spannungspulse verändert werden kann. Sowohl Memristoren als auch memristive Widerstandsschalter (RS) werden seit mehr als zwei Jahrzehnten intensiv untersucht. Diese Dissertation untersucht YMnO3-Dünnschichten mit zirkularen Vorderseiten-Elektroden und unstrukturierten Rückseiten-Elektroden und erforscht ein neues Konzept über die Nutzung der multiferroischen Eigenschaften für die Aktivierung und/oder Verbesserung des memristiven Verhaltens. Es wird angenommen, dass die geladenen Domänenwände und/oder Vortices in YMnO3-Dünnschichten die Bildung leitfähiger Filamente wirksam unterstützt und folglich die Entwicklung eines neuartigen, formierungs-freiem Widerstandsspeichersermöglicht. Die Ergebnisse der elektrischen Charakterisierung von YMnO3-basierten Widerstandsschalter zeigen unipolares RS (URS), wenn eine metallische Rückseitenelektrode verwendet wird und bipolares RS (BRS), wenn als Rückseitenelektrode ein metallisch leitendes Oxid-Substrat verwendet werden. Das URS wird als thermochemisches RS klassifiziert und mit der Bildung und Auflösung metallisch leitender Filamente korreliert. Das BRS wird auf das Einfangen/Freigeben von Defekten in der Raumladungszone des YMnO3 im pn-Übergang von p-YMnO3/n-Nb:SrTiO3-Strukturen zurückgeführt. Die wichtigsten Eigenschaften des formierungsfreien URS sind die sehr gute Retention der programmiertenWiderstandszustände, große Speicherfenster (zwischen 10E+2 und 10E+4), die hohe Schreibspannung für den Set-Prozess und der hohe Schreibstrom für den Reset-Prozess. Die Endurance ist aufgrund der Degradation des Vorderseiten-Elektrode gering. Die Ergebnisse des polaritätsabhängigen Widerstandsschaltens zeigen, dass der Set-Prozess mit elektrostatischer Entladung einhergeht. Die ferroelektrische Charakterisierung zeigt, dass die YMnO3–Dünnfilme keine ferroelektrischen Eigenschaften aufweisen. Daher kann das beobachtete URS nicht direkt auf die Anwesenheit von geladenen Domänenwände und Vortices zurückgeführt werden. Darüberhinaus wurden die photodetektierenden Eigenschaften von Metall-YMnO3-Isulator-Halbleiter-Stacks als potenzielle Erweiterung der Funktionalität von YMnO3-basierten memristiven Bauelementen vorgestellt und vorgeschlagen. Im Rahmen der vorliegenden Dissertation wurde das Widerstandsschalten von multiferroischen, YMnO3-basierten Widerstandsschaltern untersucht. Die erhaltenen Ergebnisse tragen zu einem besseren Verständnis des Widerstandsschaltens von multiferroischen Materialien bei.
Rosa, José Manuel Atalaia. "Solution-based IGZO nanoparticles memristor." Master's thesis, 2016. http://hdl.handle.net/10362/21755.
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