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Journal articles on the topic 'Bi/Cu'

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Author: Grafiati

Published: 9 March 2023

Last updated: 10 March 2023

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1

Schilling, A., J. D. Guo, M. Cantoni, F. Hulliger, B. Xue, and H. R. Ott. "New cuprates with (Bi, Cu)-O monolayers: (Bi,Cu)Sr2LnCeCu2O9−δ." Materials Letters 15, no. 3 (November 1992): 141–45. http://dx.doi.org/10.1016/0167-577x(92)90133-5.

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2

Odahara, Hirotaka, Osamu Yamashita, Kouji Satou, Shoichi Tomiyoshi, Jun-ichi Tani, and Hiroyasu Kido. "Increase of the thermoelectric power factor in Cu∕Bi∕Cu,Ni∕Bi∕Ni, and Cu∕Bi∕Ni composite materials." Journal of Applied Physics 97, no. 10 (May 15, 2005): 103722. http://dx.doi.org/10.1063/1.1895468.

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3

Kambe, Shiro, Yasuhiro Murakoshi, Rika Sekine, Maki Kawai, Kohki Yamada, Shigetoshi Ohshima, and Katsuro Okuyama. "Bi and Cu valences of Bi-based superconductors." Physica C: Superconductivity 190, no. 1-2 (December 1991): 139–40. http://dx.doi.org/10.1016/s0921-4534(05)80228-x.

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4

Kong, Xiangxia, F. Sun, Miaosen Yang, and Yang Liu. "High temperature creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints by nanoindentation method." Soldering & Surface Mount Technology 28, no. 3 (June 6, 2016): 167–74. http://dx.doi.org/10.1108/ssmt-01-2016-0001.

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Purpose This paper aims to investigate the creep properties of the bulks of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints from 298 to 358 K. The creep constitutive modelling was developed. Meanwhile, the creep mechanism of the bulks of Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints was discussed. Design/methodology/approach The creep properties of the bulks of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints from 298 to 358 K were investigated using the nanoindentation method. Findings The results of the experiments showed that the indentation depth and area increased with increasing temperatures. At the test temperature of 298-358 K, the creep strain rate of the bulks of the micro solder joints increases with the rising of the tested temperature. The values of creep stress exponent and activation energy calculated for the bulks of Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints were reasonably close to the published data. At the tested temperatures, dislocation climb took place and the dislocation climb motion was controlled by the dislocation pipe mechanism, and the second-phase particles enhancement mechanism played a very important role. Originality/value This study provides the creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints at different temperatures. The creep constitutive modelling has been developed for low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints.

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5

Kovensky, I. M., and V. V. Povetkin. "Annealing of electrolytic Cu-Bi, Ni-Bi, and Co-Bi alloys." Journal of Electronic Materials 22, no. 6 (June 1993): 659–60. http://dx.doi.org/10.1007/bf02666413.

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6

Chikova, O. A., V. S. Tsepelev, and V. V. V’yukhin. "VISCOSITY OF HIGH-ENTROPY MELTS IN CU–SN–PB–BI–GA, CU–SN, CU–PB, CU–GA, AND CU–BI EQUIATOMIC COMPOSITIONS." Izvestiya Vuzov. Tsvetnaya Metallurgiya (Proceedings of Higher Schools. Nonferrous Metallurgy) 1, no. 2 (April 28, 2015): 9. http://dx.doi.org/10.17073/0021-3438-2015-2-9-13.

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7

Yamauchi, Akira, Kenta Ida, Masahito Fukuda, and Takuma Yamaguchi. "Tensile Properties of Sn-Bi Lead-Free Solder Alloys." Solid State Phenomena 273 (April 2018): 72–76. http://dx.doi.org/10.4028/www.scientific.net/ssp.273.72.

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The Influence of alloy composition on tensile properties of Sn-Bi, Sn-Bi-Cu and Sn-Bi-Ni lead-free solder alloys were investigated. It is found that the elongation of Sn-Bi alloys depend on Bi content, and Sn-40wt% Bi alloy has the highest elongation. The addition of Cu and Ni improves the ductility of Sn 35-45wt% Bi alloys. The fine microstructure of Sn-Bi-Cu or Ni alloys have an effect on the ductility of Sn-Bi based alloys. The elongation increases with decreasing strain rate and increasing temperature. Cu and Ni added to Sn-Bi alloy showed the super plasticity behavior at low strain rate and high temperature (more than 333 K). Moreover, strain rate sensitivity ‘m’ increases with temperature.

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8

Wade, Charles Austin, Mark J. McLean, Richard P. Vinci, and Masashi Watanabe. "Aberration-Corrected Scanning Transmission Electron Microscope (STEM) Through-Focus Imaging for Three-Dimensional Atomic Analysis of Bismuth Segregation on Copper [001]/33° Twist Bicrystal Grain Boundaries." Microscopy and Microanalysis 22, no. 3 (May 5, 2016): 679–89. http://dx.doi.org/10.1017/s1431927616000696.

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AbstractScanning transmission electron microscope (STEM) through-focus imaging (TFI) has been used to determine the three-dimensional atomic structure of Bi segregation-induced brittle Cu grain boundaries (GBs). With TFI, it is possible to observe single Bi atom distributions along Cu [001] twist GBs using an aberration-corrected STEM operating at 200 kV. The depth resolution is ~5 nm. Specimens with GBs intentionally inclined with respect to the microscope’s optic axis were used to investigate Bi segregant atom distributions along and through the Cu GB. It was found that Bi atoms exist at most once per Cu unit cell along the GB, meaning that no continuous GB film is present. Therefore, the reduced fracture toughness of this particular Bi-doped Cu boundary would not be caused by fracture of Bi–Bi bonds.

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9

Kattner, U. R., and B. P. Burton. "The Al-Bi-Cu system." Journal of Phase Equilibria 13, no. 6 (December 1992): 629–35. http://dx.doi.org/10.1007/bf02667213.

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10

Wnuk, G. "Experimental Study on Thermodynamics of the Cu-Ni-Sn-Bi Liquid Alloys." Archives of Metallurgy and Materials 56, no. 2 (June 1, 2011): 305–10. http://dx.doi.org/10.2478/v10172-011-0034-8.

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Experimental Study on Thermodynamics of the Cu-Ni-Sn-Bi Liquid AlloysThe activity of Bi in dilute Cu-Ni-Sn-Bi alloys has been determined by the method of equilibrium saturation with metal vapour at T= 1398, 1448 and 1473 K. As the method of equilibrium saturation is a comparative one, it is necessary to have an appropriate reference mixture. The Cu-Bi alloy was accepted as the reference mixture. The interaction parameters εBi/Bi, εBi/Bi and εBi/Bi were determined by the least squares method.

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11

Sunyadeth, Surakan, Pun Wirot, Boonrat Lohwongwatana, and Ratchatee Techapiesancharoenkij. "The Alloying and Aging Effects on the Wettability and Intermetallic Bonding of the Sn-Zn-Cu-Bi Soldering Alloy on a Cu Substrate." Materials Science Forum 857 (May 2016): 26–30. http://dx.doi.org/10.4028/www.scientific.net/msf.857.26.

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The soldered bonding between the Sn-Zn-Cu-Bi system and a Cu substrate was studied and reported herein. The alloying compositions were varied to investigate the effects of Zn, Cu, Bi contents on the solders’ melting temperature (Tm), microstructures, wettability and the intermetallic-compound (IMC) bonding with a Cu substrate. The Sn-7Zn and Sn-9Zn exhibited low Tm (198 °C), but poor wettability on the Cu substrates. Both Cu and Bi additions significantly improved the solder wettability. However, the Tm of the Sn-Zn-Cu series increased sharply to about 225 °C by the addition of 4-wt% Cu. The addition of 3-wt% Bi lowered Tm of the Sn-Zn-Cu alloys by 5 °C. The thickness of the IMC layers between solder and substrate was maximum for Sn-9Zn and significantly decreased with the Cu addition. With the addition of Bi to Sn-Zn-Cu, the IMC thickness increased. The aging of 150 °C for 150 hours minimally affected the IMC-bonding thicknesses of most samples; however, micro crack could be observed along the aged IMC layers.

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12

KAMIKO, MASAO, HIROAKI CHIHAYA, WATARU SUGIMOTO, RYOICHI YAMAMOTO, SANGMUN OH, JUNHUA XU, and ISAO KOJIMA. "EFFECT OF Bi SURFACTANT IN THE HETEROEPITAXIAL GROWTH OF Co ON Cu SURFACES." Surface Review and Letters 13, no. 02n03 (April 2006): 201–7. http://dx.doi.org/10.1142/s0218625x06008153.

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We have investigated the effect of Bi on the heteroepitaxial growth of Co on Cu by reflection high-energy electron diffraction (RHEED) measurements. It was found that Bi enhanced the layer-by-layer growth of Co on the Cu (111) surfaces at 100°C. The dependence of the growth on Bi layer thickness suggested that there existed a suitable amount of Bi surfactant layer that enhanced smoother layered growth. On the contrary, for the case of Co growth on Cu (100), Bi depressed the layer-by-layer growth of Co on Cu (100). The surface segregation effect of Bi was also studied by Auger electron spectroscopy (AES).

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13

Zhang, Li Na, and Bai Xiong Liu. "Investigation on the Preparation Processes of Cu-Bi Master Alloy." Advanced Materials Research 335-336 (September 2011): 841–44. http://dx.doi.org/10.4028/www.scientific.net/amr.335-336.841.

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The Microstructure of Cu-Bi master alloy with different melt processes, such as different melting temperature and holding time, was observed by PHILIPS-XL30 scanning electron microscopy (SEM); phase analysis was conducted by Miniflex X-ray diffraction(XRD); Magix(PW2424) X-ray fluorescence analyzer(XRF) was used to analyze chemical compositions of Cu-Bi master alloy. The results show that there are Cu and Bi two phases in the Cu-Bi master alloy; The yielding rate of bismuth decreases with the rising melting temperature. It decreases slowly between 1100 °C to 1150 °C,while it decreases rapidly between 1150 °C to 1200 °C.The bismuth particles in the Cu-Bi master alloy prepared at 1100 °C are much larger than those prepared at 1150 °C,while the size of bismuth particles change little from 1150 °C to 1200 °C. So the better melting temperature of preparing Cu-Bi master alloy is 1150 °C.The yielding rate of bismuth decreases with the holding time increasing. But when the holding time is too short, there are large bismuth particles in Cu-Bi alloy .So the better holding time is 120s.

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14

Mederski, Sławomir, Jaroslav Pršek, Dimitrina Dimitrova, and Bahri Hyseni. "A Combined EPMA and LA-ICP-MS Investigation on Bi-Cu-Au Mineralization from the Kizhnica Ore Field (Vardar Zone, Kosovo)." Minerals 11, no. 11 (November 3, 2021): 1223. http://dx.doi.org/10.3390/min11111223.

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This paper describes a newly discovered Bi-Cu±Au mineralization co-occurring with Pb-Zn-Ag hydrothermal mineralization within the Kizhnica-Hajvalia-Badovc ore field, central Kosovo, Vardar Zone. The mineralogy of two styles of Bi-Cu±Au mineralization was described using EPMA in combination with reflected and transmitted light microscopy. Hydrothermal Cu-Bi veinlets in the Kizhnica andesite quarry consist of Bi sulfosalts (bismuthinite, cosalite, aikinite, and krupkaite), pyrite, hematite, chalcopyrite, galena, sphalerite, and tetrahedrite group minerals. Disseminated Bi-Au-Cu-Te mineralization from the contact type of mineralization (hornfels) consists of Bi sulfosalts (cannizzarite, bismuthinite, galenobismutite, cosalite), associated with sulfarsenides (arsenopyrite, gersdorffite, and cobaltite), base metal sulfides (chalcopyrite, pyrite, sphalerite, pyrrhotite, and galena), native gold, native bismuth, and tetradymite. LA-ICP-MS analyses of sphalerite, chalcopyrite, and tetrahedrite indicate increased content of In and Sn in the Kizhnica Bi-Cu-Au mineralizing system, while LA-ICP-MS analyses in pyrites show the presence of many elements, e.g., Au, As, Co, Sb, Tl, Hg, Pb, Bi related to the structure of pyrite or controlled by nano-inclusions. The results suggest a connection between Bi-Cu±Au mineralization and the proximity to intrusive rocks, which may be helpful for Au exploration in Kosovo.

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15

Huang, Yuhong, Hongkuan Yuan, and Hong Chen. "Passivating Surface States on Water Splitting Cuprous Oxide Photocatalyst with Bismuth Decoration." Molecules 24, no. 22 (November 16, 2019): 4156. http://dx.doi.org/10.3390/molecules24224156.

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To enhance the visible light photocatalystic activity of Cu 2 O(100) surface, we performed first-principles calculations on the structural, electronic and optical properties of a bismuth (Bi)-decorated Cu 2 O(100) surface (Bi@Cu 2 O(100)). It is shown that the Bi prefer to be loaded to the hollow sites among four surface oxygen atoms and tend to individual dispersion instead of aggregating on the surface due to the lowest formation energy and larger distance between two Bi atoms at the surface than the Bi clusters; the coverage of around 0.25 monolayer Bi atoms can effectively eliminate the surface states and modify the band edges to satisfy the angular momentum selection rules for light excited transition of electrons, and the loaded Bi atoms contribute to the separation of photogenerated electron-holes. The relative positions between the band edges and the redox potentials are suitable for photocatalytic hydrogen production from the redox water, and moreover, the optical absorption spectrum indicates a positive response of the Bi 0 . 25 @Cu 2 O(100) to visible light, implying that the Bi 0 . 25 @Cu 2 O(100) is a promising visible light photocatalyst.

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16

Gao, Feng, Cuiping Wang, X. J. Liu, Yoshikazu Takaku, I. Ohnuma, and Kiyohito Ishida. "Experimental investigation and thermodynamic calculation in the Ag–Bi–Ni and Cu–Bi–Ni systems." Journal of Materials Research 24, no. 8 (August 2009): 2644–53. http://dx.doi.org/10.1557/jmr.2009.0302.

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The phase equilibria at 300, 400, 500, and 600 °C in the Ag–Bi–Ni system and 300, 400, and 500 °C in the Cu–Bi–Ni system were experimentally determined by metallography and electron probe microanalysis on equilibrated alloys and diffusion couples. Differential scanning calorimetry was used to measure the temperatures of phase transformations. All the experimental results show that the solubilities of the ternary elements of the binary intermetallic compounds in the Ag–Bi–Ni system are limited. However, the binary intermetallic compounds have some solubilities of the ternary elements in the Cu–Bi–Ni system. No ternary intermetallic compound was found in the Ag–Bi–Ni and Cu–Bi–Ni systems. On the basis of the determined results, the phase equilibria in the Ag–Bi–Ni and Cu–Bi–Ni systems were thermodynamically assessed, and reasonable agreement between the calculated results and experimental data was obtained.

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17

Mizuno, K., K. Higashino, K. Setsune, and K. Wasa. "Fabrication of thin‐film‐type Josephson junctions using a Bi‐Sr‐Ca‐Cu‐O /Bi‐Sr‐Cu‐O/Bi‐Sr‐Ca‐Cu‐O structure." Applied Physics Letters 56, no. 15 (April 9, 1990): 1469–71. http://dx.doi.org/10.1063/1.103173.

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18

Chen, Wei-Sheng, Shota Mesaki, and Cheng-Han Lee. "Separation of Sn, Sb, Bi, and Cu from Tin Anode Slime by Solvent Extraction and Chemical Precipitation." Metals 11, no. 3 (March 21, 2021): 515. http://dx.doi.org/10.3390/met11030515.

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Tin anode slime is a by-product of the tin electrolytic refining process. This study investigated a route to separate Sn, Sb, Bi, and Cu from tin anode slime after leaching with hydrochloric acid. In the solvent extraction process with tributyl phosphate, Sb and Sn were extracted into the organic phase. Bi and Cu were unextracted and remained in the liquid phase. In the stripping experiment, Sb and Sn were stripped and separated with HCl and HNO3. Bi and Cu in the aqueous phase were also separated with chemical precipitation procedure by controlling pH value. The purities of Sn, Sb, Cu solution and the Bi-containing solid were 96.25%, 83.65%, 97.51%, and 92.1%. The recovery rates of Sn, Sb, Cu, and Bi were 76.2%, 67.1%, and 96.2% and 92.4%.

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19

Wasa, Kiyotaka, Tomoaki Matsushima, and Kentaro Setsune. "Layer-by-layer deposition of multilayer BiSrCaCuO/BiSrCuO." Vacuum 43, no. 11 (November 1992): 1027–29. http://dx.doi.org/10.1016/0042-207x(92)90321-m.

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20

Fukamizu, Shohei, Daisuke Hironiwa, and Takashi Minemoto. "Crystal Quality Improvement of CuInS₂ Thin Film by Two Step Fabrication Method with Bismuth Addition." Applied Mechanics and Materials 372 (August 2013): 563–66. http://dx.doi.org/10.4028/www.scientific.net/amm.372.563.

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CuInS2 (CIS) is the promising candidate of an absorber layer of high efficiency thin film solar cells. The crystal quality of CIS is one of the important factors for high efficiency. A chemical doping approach using antimony and bismuth (Bi) is well known for improving crystal quality in Cu (In,Ga)Se2 thin films. In this study, the effect of Bi doping on evaporated CIS thin films was investigated. A CIS thin film without Bi doping annealed at 600°C showed small crystal grain size of ~1 μm, which was smaller than the CIS film thickness of 2 μm. The small addition of 50 nm-thick Bi promoted crystal growth and large grain size of greater than 1 μm, which was comparable to the CIS film thickness, was realized. The CIS films without and with Bi addition had surface precipitates identified as Cu-S and Cu-Bi-S compounds, respectively. The crystal growth promotion by Bi addition can be attributed to that the Cu-Bi-S compound which has lower melting point of 470~490°C than that of the Cu-S compound of 507°C acted as flux for crystal growth.

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21

Chikova, O. A., V. S. Tsepelev, and V. V. V’yukhin. "Viscosity of high-entropy melts in Cu-Sn-Pb-Bi-Ga, G-Sn, Cu-Pb, Cu-Ga, and Cu-Bi equiatomic compositions." Russian Journal of Non-Ferrous Metals 56, no. 3 (May 2015): 246–50. http://dx.doi.org/10.3103/s1067821215030037.

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22

Hallstedt, Bengt, and Ludwig J. Gauckler. "Revision of the thermodynamic descriptions of the Cu–O, Ag–O, Ag–Cu–O, Bi–Sr–O, Bi–Ca–O, Bi–Cu–O, Sr–Cu–O, Ca–Cu–O and Sr–Ca–Cu–O systems." Calphad 27, no. 2 (June 2003): 177–91. http://dx.doi.org/10.1016/s0364-5916(03)00050-6.

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23

Murayama, Kei, Taiji Sakai, Nobuaki Imaizumi, and Mitsutoshi Higashi. "Electro-migration Behavior in Micro-joints of Sn-57Bi solder and Cu Post Bumps." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000997–1006. http://dx.doi.org/10.4071/isom-2011-tha3-paper6.

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The bonding technique for high density Flip Chip(F.C.) packages requires a low temperature and a low stress process to achieve high reliability of the micro joining. Sn-Bi solder has been noted as a low temperature bonding material. Electromigration behavior of Sn-57wt%Bi flip chip interconnection with Cu post bumps was investigated. The flip chip bumps used for this experiments consisted of Cu post formed with plating and Sn-57wt%Bi solder. Two types of under bump metal(UBM) of organic substrate were studied, that is, electroless Ni(6μm)/Au(0.5μm) on Cu pad and Cu pad. Electron flow to induce the electro-migration was from organic substrate side (Cu pad) to chip side (Cu post) with current density of 40000A/cm2 at 125 degree C. At both types of the UBM, Bi migrated and accumulated to the anode side (Cu post) and Sn migrated to the cathode side (substrate pad). Each interconnect resistance has increased to about 25% and 46% within 100 hours, respectively. However, after more than 3000 hours, they were stabilized. With Ni/Au UBM pad, Cu3Sn/Cu6Sn5 intermetallic compounds (IMCs) were formed at the Cu bump side. And under the Bi layer Cu6Sn5/Ni-Sn compounds were formed. But we didn’t observe the failure like cracks or voids at the Ni layer. With Cu pad, only Cu3Sn IMC at the Cu bump side and under the Bi layer Cu6Sn5/Cu3Sn compounds were formed after 4000 hours. Although the voids were observed at Cu3Sn/Cu interface, good electrical connection was obtained.

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24

Shih, Po-Cheng, and Kwang-Lung Lin. "Effect of microstructural evolution on electrical property of the Sn–Ag–Cu solder balls joined with Sn–Zn–Bi paste." Journal of Materials Research 20, no. 10 (October 2005): 2854–65. http://dx.doi.org/10.1557/jmr.2005.0352.

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Sn–8Zn–3Bi solder paste and Sn–3.2Ag–0.5Cu solder balls were reflowed simultaneously on Cu/Ni/Au metallized ball grid array (BGA) substrates. The correlation between microstructural evolution and the electrical resistance of the joints under various testing conditions of reflow cycles and heat treatment was investigated. The electrical resistance of the Sn–Ag–Cu joints without Sn–Zn–Bi was also conducted for comparison. The average resistance values of Sn–Ag–Cu and Sn–Ag–Cu/Sn–Zn–Bi samples changed, respectively, from 7.1 (single reflow) to 7.3 (10 cycles) mΩ and from 7.2 (single reflow) to 7.6 (10 cycles) mΩ. Furthermore, the average resistance values of Sn–Ag–Cu and Sn–Ag–Cu/Sn–Zn–Bi samples changed, respectively, from 7.1 (aging 0 h) to 7.8 (aging 1000 h) mΩ and from 7.2 (aging 0 h) to 7.9 (aging 1000 h) mΩ. It was also noticeable that the average resistance values of Sn–Ag–Cu/Sn–Zn–Bi samples were higher than those of Sn–Ag–Cu samples in each specified testing condition. The possible reasons for the greater resistance exhibited by the Sn–Zn–Bi incorporated joints were discussed.

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25

Nishikawa, Hiroshi, Yuki Hirata, Chih-han Yang, and Shih-kang Lin. "Effect of Low Bi Content on Reliability of Sn-Bi Alloy Joints Before and After Thermal Aging." JOM 74, no. 4 (February 1, 2022): 1751–59. http://dx.doi.org/10.1007/s11837-021-05146-3.

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AbstractSn-58Bi, an eutectic alloy, has been explored for use as a low-temperature lead-free solder alloy. However, the properties of Sn-Bi alloys as well as those of their joints need to be improved significantly so that these alloys can be applicable for practical use. In particular, two drawbacks need to be addressed: the intrinsic brittleness of Bi and the microstructure coarsening of these alloys during aging. In this study, Sn-Bi-Zn (SBZ) and SBZ-In (SBZI) alloys with low Bi contents were examined to elucidate the effects of the addition of Zn and In to the Sn-45Bi alloy on the interface and shear strengths of Cu/Cu joints before and after aging. In the case of the SBZ/Cu and SBZI/Cu joints, Bi coarsening was not observed either near or at the interfaces of the Cu/Cu joints. The shear strengths of the SBZ and SBZI joints remained unchanged after aging for 1008 h, suggesting that the SBZI alloy demonstrated the highest long-term reliability among all the joints examined.

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26

Alam, S. N., N. Jindal, and N. Naithani. "Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy." Materials Science-Poland 37, no. 2 (June 1, 2019): 212–24. http://dx.doi.org/10.2478/msp-2019-0032.

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AbstractThe present work reports the effect of Cu addition on the melting point, hardness and electrical resistivity of Sn-57 wt.% Bi eutectic solder alloy. Both binary eutectic Sn-57 wt.% Bi and ternary Sn-(57-x)Bi-xCu (x = 0.1, 0.3, 0.5, 0.7 and 1 wt.%) alloys containing various amounts of Cu were developed by melting casting route. The microstructure of the various solder alloys was analyzed using an optical microscope and a SEM. The variation in melting point, hardness and electrical resistivity of the Sn-Bi eutectic solder alloys with the addition of Cu was determined. The melting point of the eutectic Sn-Bi solder alloy was found to decrease up to the addition of 0.7 wt.% Cu. However, further addition of Cu led to an increase in the melting point of the alloy. Addition of Cu led to an increase in the hardness of the eutectic Sn-Bi solder alloy whereas the electrical resistivity of this alloy was found to increase up to the addition of 0.7 wt.% of Cu beyond which a decrease in the electrical resistivity was observed. A change in the microstructure of the solder alloy was observed when it was reheated above the melting temperature.

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27

Meyer, H. M., D. M. Hill, J. H. Weaver, K. C. Goretta, and U. Balachandran. "Ni/YBa2Cu3O7−x and Ni/Bi2Sr2Ca0.8Y0.2Cu2Ox interface formation: Reactivity, segregation, and chemical trapping." Journal of Materials Research 6, no. 2 (February 1991): 270–77. http://dx.doi.org/10.1557/jmr.1991.0270.

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Interfaces formed by condensing Ni atoms onto YBa2Cu3O7−x (Y-123) and Bi2Sr2Ca0.8Y0.2Cu2Ox (Bi-2212) have been studied with x-ray photoelectron spectroscopy. For both Y-123 and Bi-2212, the Ni 2p3/2 and O 1s core level features indicate Ni–O reactions and changes in the Cu 2p3/2 emission that reflect reduction from nominal Cu2+ to Cu1+ oxidation states. Ni deposition onto Bi-2212 also reduces Bi–O bonding and releases Bi atoms. For Ni/Y-123, analysis of emission intensities as a function of coverage shows that O and Ba intermix in the growing metal overlayer but that Cu is trapped at the buried interface. For Ni/Bi-2212, similar analysis shows O and Bi intermixing but less effective Cu trapping.

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28

Gao, Weichun, Lulu Gao, Jing Meng, Dan Li, Yinyan Guan, Li Cui, Xinjun Shen, and Jiyan Liang. "Preparation of a novel Cu-Sn-Bi cathode and performance on nitrate electroreduction." Water Science and Technology 79, no. 1 (January 1, 2019): 198–206. http://dx.doi.org/10.2166/wst.2019.049.

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Abstract Cu-Sn-Bi layer coated on Ti substrate was prepared using electrodeposition method and applied as cathode material for electrochemical reduction of nitrate in this research. Linear sweep voltammetry (LSV), chronoamperometry (CA), scanning electron microscope (SEM), energy dispersive spectrometry (EDS), X-ray diffraction (XRD) were used to scrutinize the electrochemical performance and the cathode materials. LSV results illustrated that Cu-Sn-Bi cathode possessed the ability for nitrate reduction. Preparation conditions including deposition time, current density, temperature and the content of Bi were optimized based on NO3–N removal and byproducts selectivity. Results showed that the cathode with Bi content of 3.18 at.%, and electrodepositing at current density of 6 mA cm−2, 35 °C for 30 min achieved the best performance during the experiment. The increase of Bi content could improve the electrocatalytic activity and stability of the cathode. Compared with other common researched cathodes (Cu and Fe), Cu-Sn-Bi (3.18 at.%) exhibited better performance, i.e. the highest NO3–N removal of 88.43% and the selectivity of harmless N2 was 77.80%. The kinetic studies showed that the reduction of nitrate on Cu-Sn-Bi followed pseudo-first-order kinetics.

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29

EZRAHNI, M., D. SURESH BABU, L. BROHAN, R. J. D. TILLEY, and M. GANNE. "INVESTIGATIONS ON LOCKING OF DISPLACIVE MODULATION IN Bi-Sr-Ca-Cu-O SYSTEM BY T.E.M." International Journal of Modern Physics B 07, no. 01n03 (January 1993): 151–56. http://dx.doi.org/10.1142/s0217979293000342.

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We have investigated the effect of temperature, oxygen content and Bi/Ca substitution on the q vector, by T.E.M, on Bi-Sr-Ca-Cu-O system in order to explain the locking of displacive modulation along one or two directions. q value is independent of temperature and oxygen content but dependent on Bi/Ca substitution. The data suggests that the locking of displacive modulation is due to ordering of Bi atoms on Ca sites (4f) in commensurate space group Pnnn. We have obtained composition limits as Bi 2.2 Sr 2 Ca 0.8 Cu 2 O 8+d and Bi 2.04 Sr 2 Ca 0.96 Cu 2 O 8+d for one and two direction(s) of modulation respectively.

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30

GUSKOS, N., S. K. PATAPIS, and C. POLITIS. "THE EPR STUDIES OF HIGH-Tc SUPERCONDUCTORS (Bi, Pb)-Ca-Sr-Cu-O." Modern Physics Letters B 05, no. 10 (April 30, 1991): 701–5. http://dx.doi.org/10.1142/s021798499100085x.

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The high-T c superconductors Bi 1.55 Pb 0.25 Sr 2 Ca 2.2 Cu 3 O 10, Bi 1.75 Pb 0.25 Sr 2 Ca 2 Cu 3 O 10 and Bi 1.75 Pb 0.25 Sr 2 Ca 3 Cu 4 O 12 (with about T c =106, 103 and 101 K, respectively) have been investigated using EPR method. Differences in intensities of the EPR spectra of Cu 2+ ions have been observed. These differences could be caused by the skin effect.

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31

Wang, Naiding. "The Cu-Bi-S system: results from low-temperature experiments." Mineralogical Magazine 58, no. 391 (June 1994): 201–4. http://dx.doi.org/10.1180/minmag.1994.058.391.02.

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AbstractLow-temperature experiments in the ‘dry’ ternary Cu-Bi-S system, conducted by using sulphidation methods down to 120°C produced a new metastable solid solution series Cu10Bi2S13-Cu5Bi2S8 at 178°C coexisting with CuS. This transformed slowly at 190–200°C to an assemblage of either CuS-(Cu,Bi)8S9 or CuS-Bi2S3 or both, depending on available sulphur. Sulphidation experiments on Cu3BiS3 similarly revealed a solid solution range for the phase (Cu,Bi)8S9 of up to Cu/Bi = 3/2 at 178–190°C, and a lower stability limit of 138°C Isothermal sections of the system were constructed at 200 and 300°C, based on the new information collected but excluding the metastable series.

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32

Cao, Liuqi, Liming Wang, Lihui Xu, Yong Shen, Mingrui Xie, and Huimin Hao. "Controllable growth of Cu–Bi co-doped ZnO nanospheres on cotton fabrics and a study on their photocatalytic performance in visible light." RSC Advances 11, no. 47 (2021): 29416–25. http://dx.doi.org/10.1039/d1ra05317e.

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33

MENYHARD, M., B. BLUM, C. J. McMAHON, Jr., S. CHIKWAMBANI, and J. WEERTMAN. "BISMUTH SEGREGATION IN Cu-Bi BICRYSTALS." Le Journal de Physique Colloques 49, no. C5 (October 1988): C5–457—C5–462. http://dx.doi.org/10.1051/jphyscol:1988556.

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34

Raghavan, V. "Al-Bi-Cu (Aluminum-Bismuth-Copper)." Journal of Phase Equilibria and Diffusion 30, no. 6 (October 6, 2009): 614–16. http://dx.doi.org/10.1007/s11669-009-9586-y.

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35

MURUGAKOOTHAN, P., R. JAYAVEL, C. R. VENKATESWARA RAO, C. SUBRAMANIAN, and P. RAMASAMY. "GROWTH AND CHARACTERISATION OF Bi2Sr2Ca1Cu2−xNixOy SINGLE CRYSTALS." Modern Physics Letters B 05, no. 30 (December 30, 1991): 1989–95. http://dx.doi.org/10.1142/s0217984991002392.

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Effect of partial substitution of Ni in the high Tc superconductor single crystals Bi-Sr-Ca-Cu-O has been studied. Single crystals of Bi-Sr-Ca-Cu/Ni-O are grown from its stoichiometric melt. The addition of Nickel in this system ( Bi 2 Sr 2 Ca 1 Cu 2−x Ni x O y, x=0.1, 0.3) is found to change the growth temperature, superconducting transition temperature, surface morphology, and mechanical property.

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36

López, Gabriel A., and Eric J. Mittemeijer. "Auger Electron Spectroscopical Investigation of Interfacial Segregation in the Cu-Bi System." Defect and Diffusion Forum 237-240 (April 2005): 1141–46. http://dx.doi.org/10.4028/www.scientific.net/ddf.237-240.1141.

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A systematic investigation of the segregation of Bi at both free surfaces and grain boundaries in Cu, under identical conditions, is reported. The problem of Bi evaporation upon Bi segregation at free surfaces was overcome using a special method for sample preparation. Cu bicrystals containing deliberately made internal cavities at the grain boundary were doped with Bi, annealed at temperatures between 1073 and 1223 K, and broken along the grain boundary in an ultrahigh vacuum chamber for Auger electron spectroscopy. For the first time, the equilibrium surface segregation of Bi in Cu has been measured. The segregation at the free surface was found to be stronger than the segregation at the grain boundary.

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37

Yang, Bin, Bai Xiong Liu, Bao Jun Han, Li Na Zhang, and Ying Hui Zhang. "Investigation on Microstructure Evolution of Hot Deformed Free-Cutting Cu-Zn-Se-Bi-Sn Alloy." Advanced Materials Research 146-147 (October 2010): 682–86. http://dx.doi.org/10.4028/www.scientific.net/amr.146-147.682.

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The microstructure evolution of hot deformed Cu-Zn-Se-Bi-Sn alloy was investigated by Hitachi-800 transmission electron microscopy (TEM). The result shows that there are three different dislocation configurations such as dislocation network, dislocation wall and dislocation cell in hot deformed Cu-Zn-Se-Bi-Sn alloy. The dislocation network was firstly formed in some certain grains of Cu-Zn-Se-Bi-Sn alloy when the deformation strain amounted to 2%. Then dislocations initially arranged regularly beside original grain boundaries and the arranged dislocation walls were formed in some area and sub-grains merging emerged when the deformation strain amounted to 20%. Eventually, obvious dynamic recrystallization nucleation by sub-grain merging emerged in Cu-Zn-Se-Bi-Sn alloy when the strain attached 80%.

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38

Zhang, QingKe, HeFei Zou, and Zhe-Feng Zhang. "Improving tensile and fatigue properties of Sn–58Bi/Cu solder joints through alloying substrate." Journal of Materials Research 25, no. 2 (February 2010): 303–14. http://dx.doi.org/10.1557/jmr.2010.0035.

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To eliminate the Bi segregation and interfacial embrittlement of the SnBi/Cu joints, we deliberately added some Ag or Zn elements into the Cu substrate. Then, the reliability of the SnBi/Cu–X (X = Ag or Zn) solder joints was evaluated by investigating their interfacial reactions, tensile property, and fatigue life compared with those of the SnBi/Cu and SnAg/Cu joints. The experimental results demonstrate that even after aging for a long time, the addition of the Ag or Zn elements into the Cu substrate can effectively eliminate the interfacial Bi embrittlement of the SnBi/Cu–X joints under tensile or fatigue loadings. Compared with the conventional SnAg/Cu joints, the SnBi/Cu–X joints exhibit higher adhesive strength and comparable fatigue resistance. Finally, the fatigue and fracture mechanisms of the SnBi/Cu–X solder joints were discussed qualitatively. The current findings may pave the new way for the Sn–Bi solder widely used in the electronic interconnection in the future.

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39

MEI, YU, S. M. GREEN, C. JIANG, H. L. LUO, and C. POLITIS. "EFFECT OF SUBSTITUTION OF Na, Cd, Bi for Ca in Bi-Sr-Ca-Cu OXIDE SUPERCONDUCTORS." Modern Physics Letters B 03, no. 12 (August 1989): 939–44. http://dx.doi.org/10.1142/s0217984989001448.

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Samples with compositions Bi 1.8 Pb 0.2 Sr 2( Ca 2−x Na x) Cu 3 O y, BiSr(Ca 1−x Cd x) Cu 2 O y and BiSr ( Ca 1−x Bi x) Cu 2 O y were prepared through solid state reaction. The X-ray diffraction results were analyzed and their resistivity behavior was studied. In general, all such substitution adversely affected their superconductive properties. All samples are of multiphase. The normal state resistivity behaves quite differently with the substitution of electropositive Na as compared with the replacement of electronegative Bi.

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40

Zang, Likun, Zhangfu Yuan, Hongxin Zhao, and Xiaorui Zhang. "Wettability of molten Sn–Bi–Cu solder on Cu substrate." Materials Letters 63, no. 23 (September 2009): 2067–69. http://dx.doi.org/10.1016/j.matlet.2009.06.052.

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41

Gu, X., and Y. C. Chan. "Electromigration in Line-Type Cu/Sn-Bi/Cu Solder Joints." Journal of Electronic Materials 37, no. 11 (August 22, 2008): 1721–26. http://dx.doi.org/10.1007/s11664-008-0539-8.

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42

LIU, H. B., Z. Q. MAO, L. ZHOU, W. J. ZHANG, J. LU, B. Y. LI, Z. J. CHEN, et al. "ZERO RESISTANCE AT 113 K IN THE (Bi1.9−xPbxSb0.1)Sr2Ca2Cu3Oy SYSTEM (x=0.1, 0.2, 0.3, 0.4)." Modern Physics Letters B 03, no. 07 (May 10, 1989): 581–84. http://dx.doi.org/10.1142/s0217984989000911.

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The 110 K superconducting transition in Bi-Pb-Sr-Ca-Cu-O system has been observed by S.M. Green et al.1 However, T c, zero was 107 K. We have achieved zero resistance at temperature 113 K in Bi-Pb-Sb-Sr-Ca-Cu-O system, higher than that of Bi-Pb-Sr-Ca-Cu-O by more than 6 K. At room temperature, this high temperature phase is steady. After several heating-cooling circle, T c, zero decreases slowly.

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43

Ervina, Efzan M. N., and S. Y. Tan. "Wettability of Molten Sn-Zn-Bi Solder on Cu Substrate Ervina Efzan." Applied Mechanics and Materials 315 (April 2013): 675–80. http://dx.doi.org/10.4028/www.scientific.net/amm.315.675.

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This work presents the studies of wettability Sn-6Zn-4Bi lead-free solder alloy in electronic applications. A reference solder Sn-3.1Ag-0.9 Cu lead-free solder alloy is used to compare the properties of both solders. Differential Scanning Calorimeter (DSC) profile, wettability and the microstructure of the solder were investigated. The melting temperature of Sn-Zn-Bi (Tm=194.97°C) is lower than Sn-Ag-Cu (Tm=220.40°C). Further, the wettability between molten solder and copper substrate was measured at different reflow temperature. The contact angle for Sn-Ag-Cu was decreasing from 28.23º to 24.97º and for Sn-Zn-Bi solder alloys were decreasing from 48.92º to 29.78º as the temperature increased from 230°C to 250°C. A significant increment of contact angle for Sn-Zn-Bi at 270°C and the contact angle did not change at 270°C for Sn-Ag-Cu. The result of spreading area is inversed with the contact angle. The layers of intermetallic compound were examined by energy-dispersive X-ray. The Sn-Zn-Bi solder exhibits a mixture of Cu-Sn+Cu-Zn phase and ϒ-Cu5Zn8phase. The Sn-Ag-Cu solder exhibits Cu6Sn5 (η-phase) and Cu3Sn (ε-phase). As a conclusion, Sn-Zn-Bi is a potential lead-free solder to develop based on its wettability properties than previous available solder materials.

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44

Yin, Yan Guo, Yun Yun Li, Guo Tao Zhang, Li Guang Yin, and Xiang Nan Jiao. "Study on Mechanical Properties of Cu-Bi Bearing Materials." Advanced Materials Research 756-759 (September 2013): 89–92. http://dx.doi.org/10.4028/www.scientific.net/amr.756-759.89.

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Cu-matrix bearing materials were prepared by powder metallurgy method and their mechanical properties were studied in present work. The continuity of copper alloy matrix was destroyed with the increase of Bi element. Because Bi is brittle phase and distributed in the copper alloy matrix grain boundaries as thin ribbon network. The hardness, crushing strength and impact toughness of copper-bearing materials were reduced with increase of the content of Bi. The mainly of Copper-bearing materials containing bismuth fracture are brittle intergranular fracture. When the Bi content is over 4wt%, the Bi has a relatively full distribution in the rich Bi phase of copper alloy matrix grain boundary like a chip mesh belt. As the further increase of Bi, the reduced trends of the mechanical properties of Cu-matrix bearing materials containing bismuth are slow down. because the role of fragmented Copper alloy matrix will not significantly increase with further increase of Bi.

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45

WANG, R. K., Q. HE, D. A. YU, X. X. DI, and Y. H. LI. "STRUCTURE OF Bi-Pb-Sr-Ca-Cu-O SUPERCONDUCTOR WITH Tc OF 108 K." Modern Physics Letters B 03, no. 04 (March 20, 1989): 341–47. http://dx.doi.org/10.1142/s0217984989000558.

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Five different phases have been observed in the Bi-Pb-Sr-Ca-Cu-O superconducting compound with T c of 108 K. The high-T c and low-T c superconducting phases with their compositions near ( Bi 0.82 Pb 0.18)4 Sr 4 Ca 3 Cu 6 O y and ( Bi 0.82 Pb 0.18)4 Sr 4 Ca 2 Cu 4 O y respectively have face-centered orthorhombic structure with a=0.540 nm , b=0.545 nm , c=3.669 nm and a=0.540 nm , b=0.546 nm , c=3.077 nm , respectively, and the former has the super-structure of 3.24 nm, the latter has the super-structure of 2.7 nm and is incommensurate in the b-direction. In addition, two kinds of minor phases with their compositions near ( Sr 0.6 Ca 0.4) Cu 1.75 O y and ( Bi 0.86 Pb 0.14)3 Sr 1 Ca 4 Cu 1 O y as well as CuO have also been observed.

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46

KAO, Y. H., Y. D. YAO, and L. W. SONG. "EFFECTS OF CHEMICAL DOPING AND STOICHIOMETRIC VARIATION IN HIGH-Tc SUPERCONDUCTORS." International Journal of Modern Physics B 03, no. 04 (April 1989): 573–94. http://dx.doi.org/10.1142/s0217979289000427.

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Superconducting properties of various chemically-doped high-T c materials are investigated. By using the results obtained with Cu- and Bi-deficient Y-Ba-Cu-O and Bi-Sr-Ca-Cu-O systems as basis, variations of the transition temperature T c , critical current density J c , room temperature resistivity ρ, and oxygen content are compared for different dopant contents. In several cases, J c and ρ are found to be correlated as both quantities show an exponential dependence on the dopant concentration. Most dopants result in a monotonic decrease of T c and J c , except for Ag, F, and Cl. Substitution of Ag and Pb for Cu and Bi in Bi-Sr-Ca-Cu-O indicates a condition for compatibility between the impurity atom and the local structure in the host matrix. Results suggest that the predominant mechanism for high-T c superconductivity is most likely associated with short-range-order structure in the material.

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47

Hara, Shigeta, Masashi Hanao, and Kazumi Ogino. "Interfacial Tension between Solid Cu and Liquid Cu-Bi and Cu-Pb Alloys." Journal of the Japan Institute of Metals 57, no. 2 (1993): 164–69. http://dx.doi.org/10.2320/jinstmet1952.57.2_164.

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48

Kang, Tian You, Yu Yan Xiu, Bo Xu, Chun Zhong Liu, and Wei Ping Tong. "Effect of Ni Addition on the Formation and Growth of Intermetallic Compound at Eutectic SnBi/Cu Interface." Advanced Materials Research 160-162 (November 2010): 709–14. http://dx.doi.org/10.4028/www.scientific.net/amr.160-162.709.

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The reactions between Cu and the eutectic SnBi (Sn58wt.%Bi) solder alloy with and without 1wt.%Ni addition were investigated in this paper. After as-reflowed process, the IMCs formed in the Sn58wt.%Bi/Cu and Sn58wt.%Bi1wt.%Ni/Cu joints were Cu6Sn5 and (CuNi)6Sn5, respectively. During aging process, the thickness of the IMC layers formed at each solder/Cu joint increased, and a new layer Cu3Sn formed adjacent to the Cu substrate. It was found that 1wt.%Ni addition in Sn58wt.%Bi solder alloy could slightly enhance the growth rate of the total IMC layer, but effectively reduce the growth rate of Cu3Sn layer during aging process. The growth behavior of IMC layer for each joint followed the diffusion-controlled mechanism during aging.

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49

Sajuri, Zainuddin, Amirhossein Baghdadi, Muhammad Faisal Mahmod, and Junaidi Syarif. "Fatigue and Mechanical Properties of Aluminium-Copper Bi-Metal Tubes." Advanced Materials Research 896 (February 2014): 626–29. http://dx.doi.org/10.4028/www.scientific.net/amr.896.626.

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Metallurgical bonded aluminium-copper bi-metal tube has a future prospect as an alternative material to copper in the heat, ventilation and air-conditioning (HVAC) industries. The application of aluminum-copper bi-metallic material is seems practical in maintaining the quality of existing products. However, the mechanical strength and fatigue properties of the bi-metal tubes are unknown. In this study, metallurgical, mechanical and fatigue properties of the copper phosphorous alloy and aluminium-copper bi-metal tubes were characterized through metallographic analysis, tensile, bending and fatigue tests. The results show that there observed a weak and brittle Al-Cu intermetallic compound at the interlayer between Al and Cu. Tensile fracture surface observation revealed that separation of Cu from Al occurred at the interlayer. The bending properties of the tubes were influenced by the amount of volume fraction of Cu in the materials. Three point bending fatigue test results showed that a critical buckling stress is presents for tubes with diameter less than 12.7mm. The aluminium-copper bi-metal tubes show degradation of fatigue strength almost 55% as compared to that of Cu alloy tube.

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50

Urdaneta, E. C., C. J. McMahon, and D. E. Luzzi. "TEM study of grain boundary phase transformations in Cu-12 at PPM Bi polycrystals." Proceedings, annual meeting, Electron Microscopy Society of America 50, no. 1 (August 1992): 210–11. http://dx.doi.org/10.1017/s0424820100121454.

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Grain boundary segregation-induced faceting is being studied in Cu-12 at ppm Bi polycrystals as a model two-component alloy for grain boundary transformations. It has been demonstrated that Bi segregation is responsible for grain boundary faceting in copper and that this transformation is reversible. Previous Auger electron spectroscopy fracture surface analysis in Bi-doped Cu have shown that grain boundary faceting only occurs after the segregated Bi reaches a saturation concentration of about 1 monolayer.

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