Relevant bibliographies by topics / Bi/Cu

Academic literature on the topic 'Bi/Cu'

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Published: 9 March 2023
Last updated: 10 March 2023

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Journal articles on the topic "Bi/Cu"

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Schilling, A., J. D. Guo, M. Cantoni, F. Hulliger, B. Xue, and H. R. Ott. "New cuprates with (Bi, Cu)-O monolayers: (Bi,Cu)Sr2LnCeCu2O9−δ." Materials Letters 15, no. 3 (November 1992): 141–45. http://dx.doi.org/10.1016/0167-577x(92)90133-5.

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Odahara, Hirotaka, Osamu Yamashita, Kouji Satou, Shoichi Tomiyoshi, Jun-ichi Tani, and Hiroyasu Kido. "Increase of the thermoelectric power factor in Cu∕Bi∕Cu,Ni∕Bi∕Ni, and Cu∕Bi∕Ni composite materials." Journal of Applied Physics 97, no. 10 (May 15, 2005): 103722. http://dx.doi.org/10.1063/1.1895468.

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Kambe, Shiro, Yasuhiro Murakoshi, Rika Sekine, Maki Kawai, Kohki Yamada, Shigetoshi Ohshima, and Katsuro Okuyama. "Bi and Cu valences of Bi-based superconductors." Physica C: Superconductivity 190, no. 1-2 (December 1991): 139–40. http://dx.doi.org/10.1016/s0921-4534(05)80228-x.

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Kong, Xiangxia, F. Sun, Miaosen Yang, and Yang Liu. "High temperature creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints by nanoindentation method." Soldering & Surface Mount Technology 28, no. 3 (June 6, 2016): 167–74. http://dx.doi.org/10.1108/ssmt-01-2016-0001.

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Purpose This paper aims to investigate the creep properties of the bulks of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints from 298 to 358 K. The creep constitutive modelling was developed. Meanwhile, the creep mechanism of the bulks of Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints was discussed. Design/methodology/approach The creep properties of the bulks of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints from 298 to 358 K were investigated using the nanoindentation method. Findings The results of the experiments showed that the indentation depth and area increased with increasing temperatures. At the test temperature of 298-358 K, the creep strain rate of the bulks of the micro solder joints increases with the rising of the tested temperature. The values of creep stress exponent and activation energy calculated for the bulks of Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints were reasonably close to the published data. At the tested temperatures, dislocation climb took place and the dislocation climb motion was controlled by the dislocation pipe mechanism, and the second-phase particles enhancement mechanism played a very important role. Originality/value This study provides the creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints at different temperatures. The creep constitutive modelling has been developed for low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints.
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Kovensky, I. M., and V. V. Povetkin. "Annealing of electrolytic Cu-Bi, Ni-Bi, and Co-Bi alloys." Journal of Electronic Materials 22, no. 6 (June 1993): 659–60. http://dx.doi.org/10.1007/bf02666413.

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Chikova, O. A., V. S. Tsepelev, and V. V. V’yukhin. "VISCOSITY OF HIGH-ENTROPY MELTS IN CU–SN–PB–BI–GA, CU–SN, CU–PB, CU–GA, AND CU–BI EQUIATOMIC COMPOSITIONS." Izvestiya Vuzov. Tsvetnaya Metallurgiya (Proceedings of Higher Schools. Nonferrous Metallurgy) 1, no. 2 (April 28, 2015): 9. http://dx.doi.org/10.17073/0021-3438-2015-2-9-13.

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Yamauchi, Akira, Kenta Ida, Masahito Fukuda, and Takuma Yamaguchi. "Tensile Properties of Sn-Bi Lead-Free Solder Alloys." Solid State Phenomena 273 (April 2018): 72–76. http://dx.doi.org/10.4028/www.scientific.net/ssp.273.72.

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The Influence of alloy composition on tensile properties of Sn-Bi, Sn-Bi-Cu and Sn-Bi-Ni lead-free solder alloys were investigated. It is found that the elongation of Sn-Bi alloys depend on Bi content, and Sn-40wt% Bi alloy has the highest elongation. The addition of Cu and Ni improves the ductility of Sn 35-45wt% Bi alloys. The fine microstructure of Sn-Bi-Cu or Ni alloys have an effect on the ductility of Sn-Bi based alloys. The elongation increases with decreasing strain rate and increasing temperature. Cu and Ni added to Sn-Bi alloy showed the super plasticity behavior at low strain rate and high temperature (more than 333 K). Moreover, strain rate sensitivity ‘m’ increases with temperature.
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Wade, Charles Austin, Mark J. McLean, Richard P. Vinci, and Masashi Watanabe. "Aberration-Corrected Scanning Transmission Electron Microscope (STEM) Through-Focus Imaging for Three-Dimensional Atomic Analysis of Bismuth Segregation on Copper [001]/33° Twist Bicrystal Grain Boundaries." Microscopy and Microanalysis 22, no. 3 (May 5, 2016): 679–89. http://dx.doi.org/10.1017/s1431927616000696.

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AbstractScanning transmission electron microscope (STEM) through-focus imaging (TFI) has been used to determine the three-dimensional atomic structure of Bi segregation-induced brittle Cu grain boundaries (GBs). With TFI, it is possible to observe single Bi atom distributions along Cu [001] twist GBs using an aberration-corrected STEM operating at 200 kV. The depth resolution is ~5 nm. Specimens with GBs intentionally inclined with respect to the microscope’s optic axis were used to investigate Bi segregant atom distributions along and through the Cu GB. It was found that Bi atoms exist at most once per Cu unit cell along the GB, meaning that no continuous GB film is present. Therefore, the reduced fracture toughness of this particular Bi-doped Cu boundary would not be caused by fracture of Bi–Bi bonds.
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Kattner, U. R., and B. P. Burton. "The Al-Bi-Cu system." Journal of Phase Equilibria 13, no. 6 (December 1992): 629–35. http://dx.doi.org/10.1007/bf02667213.

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Wnuk, G. "Experimental Study on Thermodynamics of the Cu-Ni-Sn-Bi Liquid Alloys." Archives of Metallurgy and Materials 56, no. 2 (June 1, 2011): 305–10. http://dx.doi.org/10.2478/v10172-011-0034-8.

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Experimental Study on Thermodynamics of the Cu-Ni-Sn-Bi Liquid AlloysThe activity of Bi in dilute Cu-Ni-Sn-Bi alloys has been determined by the method of equilibrium saturation with metal vapour at T= 1398, 1448 and 1473 K. As the method of equilibrium saturation is a comparative one, it is necessary to have an appropriate reference mixture. The Cu-Bi alloy was accepted as the reference mixture. The interaction parameters εBi/Bi, εBi/Bi and εBi/Bi were determined by the least squares method.
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Dissertations / Theses on the topic "Bi/Cu"

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Nomssi, Nzali Jacques Hubert Christian. "Nahordnung und mittelreichweitige Ordnung in den binären Legierungsschmelzen: Ag-Bi, Bi-Cu, Cu-Pb, Ga-Tl." Doctoral thesis, Universitätsbibliothek Chemnitz, 2000. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-200000845.

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Die Arbeit befaßt sich mit binären Legierungssystemen, die eine geringe Mischbarkeit der Komponenten im festen Zustand und eine Entmischungstendenz in der Schmelze aufweisen. Die Nahordnung in den binären Legierungsschmelzen Ag-Bi, Bi-Cu und Cu-Pb wird über einen großen Konzentrationsbereich mit Röntgenbeugung untersucht, die Nahordnung und die mittelreichweitige Ordnung in der Ga-Tl-Schmelze hingegen im kritischen Bereich mit Neutronenweitwinkel- und Kleinwinkelbeugung. Ag-Bi und Bi-Cu sind eutektische Systeme mit einem Wendepunkt in der Liquiduslinie, während die Systeme Cu-Pb und Ga-Tl monotektisch sind und eine Mischungslücke im flüssigen Bereich aufweisen. Die Arbeit stellt die verwendeten Beugungsmethoden vor und beschreibt die Röntgendiffraktometrie besonders ausführlich. Die erhaltenen Strukturfaktoren und Paarverteilungsfunktionen werden dargestellt und mit anderen Untersuchungen verglichen. Durch Modellierung werden charakteristische Eigenheiten der Entmischungssysteme wie die Aufspaltung des ersten Maximums, die negativen Faber-Ziman-Strukturfaktoren bei kleinen Q-Werten und die schwache Struktur bei großen Q-Werten qualitativ wiedergegeben. Im Fall der Bi-Cu Schmelze wird durch Kombination von Daten aus Röntgen- und Neutronenbeugung mit Reverse Monte Carlo Simulation ein neuer Satz von partiellen Strukturfaktoren ermittelt, bei dem die partiellen Strukturfaktoren S_{BiCu}(Q) für die Bi-Cu-Wechselwirkung über den gesamten Konzentrationsbereich zuverlässiger sind als zuvor. Mit der Kleinwinkelstreuung werden die Konzentrationsfluktuationen im kristischen Bereich der Ga-Tl-Legierungsschmelze quantitativ beschrieben
(Short- and medium-range order in the binary liquid alloys : Ag-Bi, Bi-Cu, Cu-Pb, Ga-Tl) The short-range order (SRO) and the medium-range order (MRO) are investigated in binary alloys with a negligible solubility of the components in the solid state and a demixing tendency in the liquid state. Ag-Bi and Bi-Cu are eutectic systems with an inflexion point in the liquidus line; Cu-Pb and Ga-Tl are monotectic with a miscibility gap in the liquid state. The SRO in the Ag-Bi, Bi-Cu and Cu-Pb melts is studied by means of X-ray diffraction over a large concentration range, whereas wide-angle and small-angle neutron scattering are used for investigation of the SRO and MRO of the Ga-Tl melt near the critical concentration. The diffraction methods used in the work are presented. The treatment of the X-ray scattering data is discussed in detail. The obtained Faber-Ziman total structure factors S(Q) and pair correlation functions g(r) are plotted and compared with results from the literature. The peculiarities of S(Q) such as the splitting of the first maximum, the negative Faber-Ziman structure factors in the Q-range near 1 Å^-1, the vanishing structure oscillations for Q-values beyond the first maximum are described qualitatively with a simple demixing model. In the case of the Bi-Cu melt, the contrast between X-Ray and neutron diffraction is used to assess the partial structure factors with Reverse Monte Carlo simulation. It is shown that the MRO of the Ga-Tl melt at the critical concentration is well described with a correlation length in the Ornstein-Zernike theory
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Eddike, Driss. "Contribution à l'étude des systèmes Ag-Cu-Tl-Te et Cu-Bi-Se caractérisation thermoélectriques des matériaux /." Grenoble 2 : ANRT, 1987. http://catalogue.bnf.fr/ark:/12148/cb37604801w.

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Ковалюк, З. Д., І. В. Мінтянський, and П. І. Савицький. "Спектри електрохімічного імпедансу системи Li/Cu[4]Bi[6]S[11]." Thesis, Сумський державний університет, 2015. http://essuir.sumdu.edu.ua/handle/123456789/40974.

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У роботі представлені результати досліджень гальванічної пари Li/Cu4Bi6S11, а також електронних та іонних властивостей системи методом імпедансної спектроскопії. Досліди виконані для елементів типорозміру „2325”.
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Silva, Bismarck Luiz. "Correlações entre parâmetros microestruturais, parâmetros térmicos e resistência mecânica de ligas Sn- Bi e Sn-Bi-(Cu,Ag)." Universidade Federal de São Carlos, 2016. https://repositorio.ufscar.br/handle/ufscar/8263.

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Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
The present research aims to develop a theoretical/experimental analysis of the combined effects of solidification thermal parameters, Bi content and addition of ternary elements (Cu, Ag) on the final microstructure aspects and on the final mechanical resistances of directionally solidified Sn-Bi, Sn-Bi-Ag and Sn-Bi-Cu solder alloys under transient heat flow conditions. Hence, experimental interrelations between microstructure and thermal parameters and between mechanical properties and microstructure could be established. The microstructures regarding the Sn-34wt.%Bi and Sn-52wt.%Bi alloys show the presence of β-Sn dendrites with Bi precipitates on their own, being enveloped by a lamellar binary Sn-Bi eutectic. The Sn-58wt.%Bi eutectic alloy show a variety of microstructures along the length of the directionally solidified casting, which includes binary eutectic, Bi plates, Bi trifoils and fishbone eutectic. In the case of the ternary Sn-Bi-Ag and Sn-Bi-Cu chemistries, microstructures are constituted by β-Sn dendrites decorated with Bi particles, Bi-Sn eutectic and Cu6Sn5 and Ag3Sn intermetallic particles for the Cu and the Ag bearing alloys, respectively. Experimental growth laws have been derived for both dendritic (λ1, λ2, λ3) and eutectic (λfine, λcoarse) arrangements considering the following alloys: binary Sn-34wt.%Bi, Sn-52wt.%Bi e Sn-58wt.%Bi alloys and ternary Sn- 34wt.%Bi-0.1wt.%Cu, Sn-34wt.%Bi-0.7wt.%Cu e Sn-33wt.%Bi-2wt.%Ag. Considering the binary Sn-Bi, it has been observed that increasing Bi content (34wt.%-->52wt.%-->58wt.%Bi), may cause a decrease on both strength and ductility, except for the sample at P=6mm of the Sn-52wt%Bi alloy. Hall-Petch type functional correlations have been able to represent the evolution of the tensile mechanical properties for the examined Sn-Bi and Sn-Bi-X alloys.
A presente proposta objetiva desenvolver uma análise teórico/experimental sobre os efeitos combinados dos parâmetros térmicos de solidificação (velocidade de solidificação VL e taxa de resfriamento, ṪL), do teor de Bi e das adições de terceiros elementos (Cu, Ag) na microestrutura e na resistência mecânica de ligas Sn-Bi, Sn-Bi-Ag e Sn-Bi-Cu solidificadas unidirecionalmente, estabelecendo correlações experimentais do tipo microestrutura/parâmetros térmicos e microestrutura/propriedades mecânicas. As microestruturas para as ligas binárias Sn-34%Bi e Sn-52%Bi são constituídas de dendritas de Sn com precipitados de Bi em seu interior, circundadas por um eutético lamelar binário, Sn-Bi. A liga eutética Sn-58%Bi mostrou uma ampla gama de microestruturas ao longo de todo o lingote, englobando o eutético binário Sn-Bi, placas e trifoils de Bi e eutético fishbone. Quanto às ligas ternárias Sn-Bi-Cu e Sn-Bi-Ag observa-se que as microestruturas são constituídas de dendritas β-Sn “decoradas” com partículas de Bi em seu interior, circundadas por uma mistura eutética irregular (Bi+Sn) e seus respectivos compostos intermetálicos primários Cu6Sn5 e Ag3Sn, respectivamente. As leis de crescimento experimentais dendrítico (λ1, λ2, λ3) e eutético (λfino, λgrosseiro) para as ligas binárias Sn-34%Bi, Sn-52%Bi e Sn-58%Bi e para as ligas ternárias Sn-34%Bi- 0,1%Cu, Sn-34%Bi-0,7%Cu e Sn-33%Bi-2%Ag em função de V e Ṫ foram caracterizadas por equações na forma de potência com aplicação de expoentes típicos. No caso das ligas binárias Sn-Bi, foi observado que com o aumento do teor de Bi (34%-->52%-->58%Bi), tanto o limite de resistência à tração (σt) quanto o alongamento específico diminuem, com exceção dos resultados para a amostra P=6mm da liga Sn-52%Bi. Relações funcionais do tipo Hall-Petch foram capazes de descrever a variação das propriedades mecânicas de tração de ligas Sn-Bi e Sn-Bi-X.
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PAN, GUOQIANG. "Etude structurale des materiaux supraconducteurs de la famille bi-sr-cu-o." Paris 11, 1992. http://www.theses.fr/1992PA112407.

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Cette these presente l'etude structurale, par diffusion des rayons x, du materiau supraconducteur bi#2sr#2cuo#6+, ainsi que des composes substitues au plomb sur le site du bismuth, et au lanthane (ou praseodyme) sur le site du strontium, a pression normale et a temperature ambiante. Dans sa premiere partie, elle decrit et analyse les phases modulees incommensurables presentes dans ces materiaux en fonction des differentes substitutions, notamment le sens de variation de la composante selon -b#*- du ou des vecteurs de modulation: pour les composes (bi#2#-#xpb#x)sr#2cuo#6#-#, la composante q#b decroit avec -x-; pour les composes bi#2(sr#2#-#xm#x)cuo#6#+# (m=la, pr), ou pour ceux d'exces de bismuth, la composante q#b croit avec -x-. Dans sa deuxieme partie, cette these presente une analyse de symetrie des modes normaux de vibration. En comparant les resultats experimentaux aux calculs, les valeurs de l'amplitude de deplacement pour les atomes lourds (bi, sr) dans les composes (bi#2#-#xpb#x)sr#2cuo#6#-# (x=0,1) et bi#2(sr#2#-#xbi#x)cuo#6#+# (x=0,4) ont ete estimes. Dans sa derniere partie, cette these discute la liaison entre le taux de transfert de charges, entre les plans cu-o#2 et bi-o, et la periode de modulation de distorsion du reseau correspondante et propose qu'une onde de densite de charge puisse etre l'origine possible de la modulation dans ces materiaux dont le vecteur d'onde est lie a un vecteur d'onde de fermi par la relation q#b=4k#f
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McLean, Mark J. "Small-scale fracture toughness studies of grain boundary embrittlement in Cu-Bi alloys." Thesis, Lehigh University, 2013. http://pqdtopen.proquest.com/#viewpdf?dispub=3589920.

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Grain boundary embrittlement in the Cu-Bi alloy system was investigated using small-scale fracture toughness tests that were based on commonly used bulk-scale tests. Tests were conducted on pure and Bi-doped <001> twist Cu bicrystals with misorientation angles of 6, 13, and 33° in order to determine the effect of misorientation angle on the degree of embrittlement. The results of these tests showed that the 6° grain boundary was nearly immune to embrittlement, showing little to no differences in fracture toughness values and failure mechanisms between the pure and doped specimens. However, the 33° boundary exhibited a significant amount of embrittlement, with a nearly 40% decrease in fracture toughness in the doped specimens compared to the pure and a distinct shift in the failure mechanism from transgranular shear to intergranular fracture. The 13° boundary exhibited an intermediate amount of embrittlement with a measurable drop in toughness, but not a clear shift in the failure mechanism. These results are consistent with previously published results from tests on bulk-scale bicrystals.

Furthermore, a single-crystal plasticity model was incorporated into a commercial finite element software package (ABAQUS) in order to investigate the development of the plastic zone in front of the notches created in the test specimen. It was found that the size of this zone was likely constrained by the specimen dimensions, which had a significant impact on the measured fracture toughness values.

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Potter, Charles D. "Search for evidence of fermi surface nesting in Bi₂Sr₂Ca₁Cu₂O₈." Diss., Virginia Tech, 1992. http://hdl.handle.net/10919/40088.

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Ковалюк, З. Д., І. В. Мінтянський, and П. І. Савицький. "Розрядні параметри та імпеданс джерел струму Li/Cu[4]Bi[5]S[10]." Thesis, Сумський державний університет, 2013. http://essuir.sumdu.edu.ua/handle/123456789/44111.

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Хоча літієві джерела струму мають високу ємність у порівнянні із традиційними електрохімічними системами, їх значним недоліком є низькі допустимі струмові навантаження, тому пошук нових високопровідних катодних матеріалів залишається актуальним. Відомо, що перспективними в цьому плані є багатокомпонентні сполуки на основі халькогенідів вісмуту, наприклад CuBiSe[2] та CuBiSeS.
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Fischer, David S. Ph D. Massachusetts Institute of Technology. "Novel approaches to low temperature transient liquid phase bonding in the In-Sn/Cu and In-Sn-Bi/Cu systems." Thesis, Massachusetts Institute of Technology, 2008. http://hdl.handle.net/1721.1/44424.

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Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2008.
Vita.
Includes bibliographical references (leaves 112-113).
A fluxless low temperature transient liquid phase (LTTLP) bonding process was studied as a method of producing Cu/Cu joints below 125°C and 75°C using interlayer alloys from the In-Sn and In-Sn-Bi systems. Using thermodynamic models, three different compositions (wt. %) of base alloys were chosen to accomplish this task: 50In-43.6Sn-6.4Bi (Tm = 110°C) and eutectic 50.9In-49.1Sn (Tm = 120°C) alloys were used for bonding at 125°C and a eutectic 48.3In-15.6Sn-36.1Bi (Tm = 60°C) alloy was used for bonding at 75°C. In addition, novel approaches to TLP bonding, including the addition of base material to the interlayer alloy and application of an electroless Ni diffusion barrier layer, were employed in an attempt to optimize this joining method. The LTTLP processes were assessed based on their abilities to produce joints with minimal thickness, high reflow temperatures, and good mechanical properties at room/elevated temperatures. It was found that interlayer alloys containing higher Bi contents produced the thinnest joints, with the 48.3In-15.6Sn-36.1Bi alloy producing joints on the order of 10 gm. Increases in nominal Cu composition of the interlayer alloy tended to form larger joints. Application of the Ni layer was observed to decrease the growth rate of the eutectic In-Sn joints made with 5 wt % Cu additions. Shear tests were performed on the joints at room (25°C) and operating (service) temperatures (100°C). Most of the TLP joints had room temperature shear strengths around 13,000 - 17,000 psi (= 90 - 120 MPa), although increases in strength were observed for eutectic In-Sn joints with 2.5 and 5 wt% Cu additions. At operating temperature, TLP joints made within the In-Sn-Cu system were found to have strengths an order of magnitude higher than those made in the In-Sn-Bi-Cu system.
(cont.) Poor mechanical response of the Bicontaining joints was due to the presence of low melting In-Bi IPs present in the reaction zone. Eutectic In-Sn TLP joints made with 2.5 and 5 wt% Cu additions were found to have operational temperature shear strengths of 6,000 - 7,500 psi ( 40 - 50 MPa) and 7,500 - 9,500 psi (= 50 65 MPa), respectively.
by David S. Fischer.
S.M.
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Caillard, Renaud. "Synthèse, propriétés supraconductrices et thermomécaniques de céramiques texturées des systèmes Y-Ba-Cu-O et Bi-Pb-Sr-Ca-Cu-O." Caen, 2002. http://www.theses.fr/2002CAEN2016.

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Au cours de leur cycle d'utilisation, les céramiques supraconductrices sont soumises à des contraintes mécaniques et / ou thermiques qui peuvent entraîner une dégradation rédhibitoire des performànces électriques, voire la destruction des dispositifs. Dans ce travail, nous avons élaboré puis évalué les caractéristiques thermomécaniques de céramiques texturées des systèmes Y-Ba-Cu-O et Bi-Pb-Sr-Ca-Cu-O. Pour assurer une stoechiométrie et une homogénéité constantes et maîtrisées des matières de départ, nous avons synthétisé les poudres précurseurs par voie sol-gel pour Bi2223 et par voie solide pour Y123. Les conditions optimales de formation (température et durée de frittage sous air) de la phase Bi2223 ont été déterminéess et les produits finaux caractérisés par diffraction RX, granulométrie et par des observations au MEB. L'influence des paramètres majeurs de frittage-forgeage (cycles thermiques et de pressage, durée de maintien sous charge) a été étudié et un cycle optimisé sous air a ainsi été défini par une température de 845° C et une contrainte de 23,6 MPa appliquée pendant 20 heures. La texturation du système Y-Ba-Cu-O a été effectuée par la méthode de Top Seeding Melt Texture growth (TSMTG) [etc]
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Books on the topic "Bi/Cu"

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Yoshihiro, Abe, ed. Superconducting glass-ceramics in Bi-Sr-Ca-Cu-O: Fabrication and its application. Singapore: World Scientific, 1997.

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United States. National Aeronautics and Space Administration., ed. Glass formability of high Tc BI-SR-CA-CU-O superconductors: Final report. [Washington, DC: National Aeronautics and Space Administration, 1992.

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Bansal, Narottam P. Preparation of 110K (Bi, Pb)-Sr-Ca-Cu-O superconductor from glass precursor. [Cleveland, Ohio: National Aeronautics and Space Administration, 1990.

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Atwood, Robert Carl. The growth of single crystals of Bi-Sr-Ca-Cu-O superconducting ceramic material. Ottawa: National Library of Canada = Bibliothèque nationale du Canada, 1992.

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Bhakta, Jayesh Ramesh. Electro-thermal and phase development studies on Bi(Pb)-Sr-Ca-Cu-O glass-ceramics during direct zoning. Birmingham: University of Birmingham, 1998.

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Hooker, Matthew W. Preparation and properties of high-Tc Bi-Pb-Sr-Ca-Cu-O thick film superconductors on YSZ substrates. Hampton, Va: National Aeronautics and Space Administration, Langley Research Center, 1996.

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Hodges, Richard G. L. The growth of fibres in the Bi-Sr-Ca-Cu-O system using the laser heated pedestal growth (LPHG) process. Birmingham: University of Birmingham, 1996.

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An, Jin. Zhongguo jiu ye cu jin: Zheng ce yu ji zhi yan jiu : yi Hubei Sheng gao xiao bi ye sheng wei li. Beijing Shi: Jing ji ke xue chu ban she, 2013.

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author, Guo Shuhua, and Huang Hejian author, eds. Zhongguo huo bi zheng ce de qu yu fen pei xing xiao ying yan jiu: Cu jin qu yu xie tiao fa zhan de huo bi jin rong zheng ce fen xi. Kunming Shi: Yunnan da xue chu ban she, 2012.

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Jiang, Jianyi. Fabrication and characterisaton of superconducting (Bi,Pb)[inferior two]Sr[inferior two]Ca[inferior two]Cu[inferior three]O[inferior x]/Ag tapes. Birmingham: University of Birmingham, 1998.

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Book chapters on the topic "Bi/Cu"

1

Predel, B. "Bi - Cu (Bismuth - Copper)." In B - Ba … Cu - Zr, 101–2. Berlin, Heidelberg: Springer Berlin Heidelberg, 2012. http://dx.doi.org/10.1007/978-3-540-44756-6_61.

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Michel, C., M. Hervieu, M. M. Borel, A. Grandin, F. Deslandes, J. Provost, and B. Raveau. "Superconductivity in the Bi — Sr — Cu — O System." In Ten Years of Superconductivity: 1980–1990, 300–302. Dordrecht: Springer Netherlands, 1987. http://dx.doi.org/10.1007/978-94-011-1622-0_41.

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Polonka, J., Ming Xu, J. E. Ostenson, A. I. Goldman, and D. K. Finnemore. "Growth of Cu-Free Phases in Bi(2212)." In Advances in Cryogenic Engineering Materials, 41–43. Boston, MA: Springer US, 1994. http://dx.doi.org/10.1007/978-1-4757-9053-5_6.

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Yamada, Yutaka, Satoru Murase, Misao Koizumi, Minoru Tanaka, Daisuke Ito, Shirou Takeno, Isao Suzuki, and Shin-Ichi Nakamura. "Pb Substituted Bi-Sr-Ca-Cu-O Superconductor." In Advances in Superconductivity, 845–50. Tokyo: Springer Japan, 1989. http://dx.doi.org/10.1007/978-4-431-68084-0_142.

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Zettl, A., A. Behrooz, G. Briceno, W. N. Creager, M. F. Crommie, S. Hoen, and P. Pinsukanjana. "Anisotropic Transport in Y-Ba-Cu-O and Bi-Sr-Ca-Cu-O." In Mechanisms of High Temperature Superconductivity, 249–62. Berlin, Heidelberg: Springer Berlin Heidelberg, 1989. http://dx.doi.org/10.1007/978-3-642-74407-5_26.

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Hoshino, K., H. Takahara, and M. Fukutomi. "Preparation of Superconducting Printed Thick Films of Bi-Sr-Ca-Cu-O and Bi-Pb-Sr-Ca-Cu-O Systems." In Advances in Superconductivity, 325–30. Tokyo: Springer Japan, 1989. http://dx.doi.org/10.1007/978-4-431-68084-0_54.

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Waryoba, Daudi R., and Linsea Paradis. "Diffusion Bonding of AgC–Cu Bi-layered Electrical Contacts." In TMS 2020 149th Annual Meeting & Exhibition Supplemental Proceedings, 2067–75. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-36296-6_189.

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Kimura, T., M. Ihara, H. Yamawaki, K. Ikeda, and M. Ozeki. "CVD of Bi-Sr-Ca-Cu-O Thin Films." In Advances in Superconductivity, 495–98. Tokyo: Springer Japan, 1989. http://dx.doi.org/10.1007/978-4-431-68084-0_83.

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Ohya, Seishiro, Shiro Karasawa, Naomi Hidaka, Yukio Kurihara, and Hanns-Ulrich Habermeier. "Photoresponse of Bi-Sr-Ca-Cu-O Thin Films." In Advances in Superconductivity III, 1215–18. Tokyo: Springer Japan, 1991. http://dx.doi.org/10.1007/978-4-431-68141-0_275.

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Michishita, Kazuo, Yumiko Ikuhara, Yukio Kubo, Akira Saji, and Toshio Inoue. "Textured Bulk Sample of Bi-Sr-Ca-Cu-O." In Advances in Superconductivity IV, 497–500. Tokyo: Springer Japan, 1992. http://dx.doi.org/10.1007/978-4-431-68195-3_105.

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Conference papers on the topic "Bi/Cu"

1

Setsune, Kentaro, Akihiro Odagawa, Toshifumi Satoh, Hideaki Adachi, and Kiyotaka Wasa. "Microstructure and superconductivity of Bi-Sr-Ca-Cu-O/Bi-Sr-Cu-O multilayer thin films." In OE/LASE '94, edited by Ivan Bozovic. SPIE, 1994. http://dx.doi.org/10.1117/12.179145.

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Xu-jun, Hu-qiang, He hui-jun, Zhang fu-wen, and Zhao zhao-hui. "Study of Sn-Bi-Cu Lead-free Solder." In 2008 10th Electronics Packaging Technology Conference (EPTC). IEEE, 2008. http://dx.doi.org/10.1109/eptc.2008.4763623.

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Liang, Shui-Bao, Chang-Bo Ke, Wen-Jing Ma, Min-Bo Zhou, and Xin-Ping Zhang. "Phase Field Simulation of Segregation of the Bi-Riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing." In 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). IEEE, 2016. http://dx.doi.org/10.1109/ectc.2016.398.

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Yu, Qiang, Doseop Kim, Jaechul Jin, Yasuhiro Takahashi, and Masaki Shiratori. "Fatigue Strength Evaluation for Sn-Zn-Bi Lead-Free Solder Joints." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39686.

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In this paper, the authors have investigated mechanical fatigue strength of Sn-Zn-Bi lead-free solder joints. The use of Sn-Zn-Bi solder is increasing for the advantage of low cost and low melting point. Therefore, it becomes important to ensure the fatigue strength of Sn-Zn-Bi solder joint. However, when the Sn-Zn-Bi solder was used as a solder material, there is serious problem that the fatigue crack is easy to generate at the interface between intermetallic compound layer and the solder matrix, and it makes the fatigue life of solder joint lower. Because the yield strength of Sn-Zn-Bi solder is high, and the difficulty of deformation causes high stress level concentrating at the corner of the interface between solder joint and substrate/package. It seems that the crack become easy to generate at the interface between intermetallic compound layer and solder matrix by this high stress concentration. The authors have found if Sn-Zn-Bi is used with another Pb-free solder material, a kind of composite structure can be built during the reflowing processes. In this study, the mechanical fatigue strength of this kind of Sn-Zn-Bi solder joint was studied. Based upon the results of mechanical shear fatigue test and FEM (Finite Element Method) analysis, it was found that if SnZn-Bi was used as reflow solder with Sn-Ag-Cu ball, the CSP solder joints are as reliable as thc pure Sn-Ag-Cu CSP. This is because Sn-Zn-Bi solder paste and Sn-Ag-Cu solder ball did not melt together completely and formed two-layer structure, and this two-layer structure reduces the stress concentration at the joint corners, and prevents successfully the occurrence of the interface cracks. As a result the fatigue life of Sn-Zn-Bi/Sn-Ag-Cu CSP is equivalent to that of Sn-Ag-Cu joints.
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Belyakov, S. A., T. Nishimura, T. Akaiwa, K. Sweatman, and C. M. Gourlay. "Role of Bi in microstructure formation of Sn-Cu-Ni based BGAs on Cu metallizations." In 2017 International Conference on Electronics Packaging (ICEP). IEEE, 2017. http://dx.doi.org/10.23919/icep.2017.7939364.

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Shukla, Vishnu, Nicholas Ayers, Andrea Moreno, Natalie Crutchfield, Devin Lyons, Omar Ahmed, Peng Su, Bernard Glasauer, and Tengfei Jiang. "The Effects of Bi Doping and Aging on Viscoplasticity of Sn-Ag-Cu-Bi alloys." In 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). IEEE, 2022. http://dx.doi.org/10.1109/ectc51906.2022.00266.

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Hirata, Akihiro, Ikuo Shohji, Tetsuyuki Tsuchida, and Toshikazu Ookubo. "Effect of Electrode Material on Joint Strength of Soldered Joints With Sn-Bi and Sn-Bi-Sb Lead-Free Solder Balls." In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/ipack2013-73171.

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The aim of this study is to investigate the joint properties of Sn-58mass%Bi and Sn-57mass%Bi-0.5mass%Sb low-melting lead-free solder balls on the electroless Ni/Au and Ni/Pd/Au plated Cu electrodes fabricated with a lead-free plating solution. Compared with the conventional Ni plating solution containing lead, the soldered joints with Ni/Au and Ni/Pd/Au electrodes fabricated with the lead-free plating solution showed comparable joint properties. In the joints with Ni/Pd/Au electrodes, ball shear force increased when the Pd layer is dissolved into solder by multi reflows. In both joints with Ni/Au and Ni/Pd/Au electrodes, a part of the Ni layer was dissolved into solder and thus the (Ni,Cu)3Sn4 intermetallic compound layer formed at the joint interface. Ball shear force decreased upon aging due to the growth of the (Ni,Cu)3Sn4 layer at the joint interface.
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Liu, Yang, Fenglian Sun, and Pengfei Zou. "Shear strength and interfacial microstructures of low-Ag SAC/Cu and SAC-Bi-Ni/Cu solder joints." In 2011 International Symposium on Advanced Packaging Materials (APM). IEEE, 2011. http://dx.doi.org/10.1109/isapm.2011.6105696.

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Zhong, Liyun. "Reflection-absorption spectra in Bi(Pb)-Sr-Ca-Cu-O superconductor." In 15th International Conference on Infrared and Millimeter Waves. SPIE, 1990. http://dx.doi.org/10.1117/12.2301417.

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Kumari, Sapna, Amit Kumar, and V. Kumar. "Thermal and structural characterization of Bi and Cu Co-doped BCZT." In DAE SOLID STATE PHYSICS SYMPOSIUM 2019. AIP Publishing, 2020. http://dx.doi.org/10.1063/5.0017695.

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Reports on the topic "Bi/Cu"

1

Goad, R. NICO Au-Co-Bi-Cu deposit, an update. Natural Resources Canada/CMSS/Information Management, 2021. http://dx.doi.org/10.4095/329101.

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dos Santos, D., U. Balachandran, M. Lanagan, D. Shi, M. Pate, and R. Poeppel. Synthesis of Bi-Sr-Ca-Cu oxide superconductor by solution technique. Office of Scientific and Technical Information (OSTI), January 1990. http://dx.doi.org/10.2172/7246993.

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Salem-Sugui, S. Jr, Donglu Shi, and S. E. McFarland. Enhanced irreversibility by crystal defects in the Bi-Sr-Ca-Cu-O system. Office of Scientific and Technical Information (OSTI), April 1991. http://dx.doi.org/10.2172/10144499.

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Margulies, Lawrence. High temperature phase equilibria studies in the Bi-Sr-Ca-Cu-O-Ag system. Office of Scientific and Technical Information (OSTI), November 1999. http://dx.doi.org/10.2172/754841.

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Skirrow, R. G., A. J. Cross, C. W. Magee, A. Lecomte, and j. Mercadier. Identification of a new ca. 1660 Ma Au-Cu-Bi metallogenic event at Tennant Creek. Geoscience Australia, 2020. http://dx.doi.org/10.11636/133170.

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Thomas, H., O. T. Inal, and U. Balachandran. Explosive consolidation of (Bi,Pb)-Sr-Ca-Cu-O superconductor powders during powder-in-tube processing. Office of Scientific and Technical Information (OSTI), August 1995. http://dx.doi.org/10.2172/195646.

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Neyedley, K., J. J. Hanley, P. Mercier-Langevin, and M. Fayek. Ore mineralogy, pyrite chemistry, and S isotope systematics of magmatic-hydrothermal Au mineralization associated with the Mooshla Intrusive Complex (MIC), Doyon-Bousquet-LaRonde mining camp, Abitibi greenstone belt, Québec. Natural Resources Canada/CMSS/Information Management, 2021. http://dx.doi.org/10.4095/328985.

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The Mooshla Intrusive Complex (MIC) is an Archean polyphase magmatic body located in the Doyon-Bousquet-LaRonde (DBL) mining camp of the Abitibi greenstone belt, Québec. The MIC is spatially associated with numerous gold (Au)-rich VMS, epizonal 'intrusion-related' Au-Cu vein systems, and shear zone-hosted (orogenic?) Au deposits. To elucidate genetic links between deposits and the MIC, mineralized samples from two of the epizonal 'intrusion-related' Au-Cu vein systems (Doyon and Grand Duc Au-Cu) have been characterized using a variety of analytical techniques. Preliminary results indicate gold (as electrum) from both deposits occurs relatively late in the systems as it is primarily observed along fractures in pyrite and gangue minerals. At Grand Duc gold appears to have formed syn- to post-crystallization relative to base metal sulphides (e.g. chalcopyrite, sphalerite, pyrrhotite), whereas base metal sulphides at Doyon are relatively rare. The accessory ore mineral assemblage at Doyon is relatively simple compared to Grand Duc, consisting of petzite (Ag3AuTe2), calaverite (AuTe2), and hessite (Ag2Te), while accessory ore minerals at Grand Duc are comprised of tellurobismuthite (Bi2Te3), volynskite (AgBiTe2), native Te, tsumoite (BiTe) or tetradymite (Bi2Te2S), altaite (PbTe), petzite, calaverite, and hessite. Pyrite trace element distribution maps from representative pyrite grains from Doyon and Grand Duc were collected and confirm petrographic observations that Au occurs relatively late. Pyrite from Doyon appears to have been initially trace-element poor, then became enriched in As, followed by the ore metal stage consisting of Au-Ag-Te-Bi-Pb-Cu enrichment and lastly a Co-Ni-Se(?) stage enrichment. Grand Duc pyrite is more complex with initial enrichments in Co-Se-As (Stage 1) followed by an increase in As-Co(?) concentrations (Stage 2). The ore metal stage (Stage 3) is indicated by another increase in As coupled with Au-Ag-Bi-Te-Sb-Pb-Ni-Cu-Zn-Sn-Cd-In enrichment. The final stage of pyrite growth (Stage 4) is represented by the same element assemblage as Stage 3 but at lower concentrations. Preliminary sulphur isotope data from Grand Duc indicates pyrite, pyrrhotite, and chalcopyrite all have similar delta-34S values (~1.5 � 1 permille) with no core-to-rim variations. Pyrite from Doyon has slightly higher delta-34S values (~2.5 � 1 permille) compared to Grand Duc but similarly does not show much core-to-rim variation. At Grand Duc, the occurrence of Au concentrating along the rim of pyrite grains and associated with an enrichment in As and other metals (Sb-Ag-Bi-Te) shares similarities with porphyry and epithermal deposits, and the overall metal association of Au with Te and Bi is a hallmark of other intrusion-related gold systems. The occurrence of the ore metal-rich rims on pyrite from Grand Duc could be related to fluid boiling which results in the destabilization of gold-bearing aqueous complexes. Pyrite from Doyon does not show this inferred boiling texture but shares characteristics of dissolution-reprecipitation processes, where metals in the pyrite lattice are dissolved and then reconcentrated into discrete mineral phases that commonly precipitate in voids and fractures created during pyrite dissolution.
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Kouzoudis, D., M. Xu, D. K. Finnemore, and U. Balachandran. Crystal growth at a Bi{sub 2}Sr{sub 2}Ca{sub 1}Cu{sub 2}O{sub 8}/Ag interface. Office of Scientific and Technical Information (OSTI), March 1996. http://dx.doi.org/10.2172/226041.

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Duan, Qing. The Effects of Rapid Heating and Cooling on the Composition, Structure, and Superconducting Properties of Bi-Sr-Ca-Cu-O Compounds. Portland State University Library, January 2000. http://dx.doi.org/10.15760/etd.1321.

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Leybourne, M. I., J. M. Peter, M A Schmidt, D. Layton-Matthews, A. Voinot, and L. Mathieu. Geochemical evidence for a magmatic contribution to the metal budget of the Windy Craggy Cu-Co(±Zn) volcanogenic massive-sulfide deposit, northwestern British Columbia. Natural Resources Canada/CMSS/Information Management, 2022. http://dx.doi.org/10.4095/328018.

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Volcanogenic massive-sulfide (VMS) deposits may have had metal contributions from magmatic degassing and leaching of footwall rocks. The Windy Craggy Cu-Co-Zn VMS deposit in northwestern British Columbia may include magmatic contributions, based on laser-ablation inductively coupled plasma mass spectrometry (LA-ICP-MS) of fluid inclusions (enriched in Sb, Sn, and Bi) and lithogeochemistry. Sulfide-mineral trace-element abundances in the massive-sulfide orebody, underlying stockwork zone, gold zone, and altered and unaltered mafic rock and argillite were analyzed by LA-ICP-MS. Elevated Au, W, As, Bi, Sb, Se, Te, Tl, Ag, Co, and Mo contents occur within the gold and/or stockwork zones. Increasing 'magmatic metals' with increasing Co/Ni values suggest direct magmatic contribution to the deposit. Covariation of Co with these so-called 'magmatic elements' indicates that it, too, may be of magmatic origin, sourced via fluids exsolved from a crystallizing magma; however, evidence from the composition of rocks and sulfide minerals from Windy Craggy and other VMS deposits suggests that there is probably no meaningful distinction between hydrothermal leaching and direct magmatic contributions and that most - if not all - fluids that form VMS deposits should be termed 'magmatic-hydrothermal'.
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