Academic literature on the topic 'Barrie Levad'
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Journal articles on the topic "Barrie Levad"
Encina-Tutuy, AJ, SE Martínez, CE Barrios, MS Dho, MA Romero, and CNH Zini-Carbone. "Oral health promotion at Esperanza neighborhood, Corrientes." Revista de la Facultad de Odontología 31, no. 3 (December 15, 2021): 35–39. http://dx.doi.org/10.25014/revfacodont271.2020.31.3.35.
Full textHertz, Marianne M., Tom G. Bolwig, Philippe Grandjean, and Erik Westergaard. "Lead poisoning and the blood-brain barrier." Acta Neurologica Scandinavica 63, no. 5 (January 29, 2009): 286–96. http://dx.doi.org/10.1111/j.1600-0404.1981.tb00782.x.
Full textFrisk, Philip. ""Barbie Doll"." Radical Teacher 113 (February 14, 2019): 31–32. http://dx.doi.org/10.5195/rt.2019.579.
Full textPfeffer, P., W. Zawadzki, and K. Dybko. "Controlled electron transmission by lead chalcogenide barrier potential." Semiconductor Science and Technology 36, no. 4 (March 18, 2021): 045023. http://dx.doi.org/10.1088/1361-6641/abeb4f.
Full textBlaydon, Diana C., and David P. Kelsell. "Defective channels lead to an impaired skin barrier." Journal of Cell Science 127, no. 20 (September 1, 2014): 4343–50. http://dx.doi.org/10.1242/jcs.154633.
Full textShafai, T. S. "Schottky barrier characterization of lead phthalocyanine/aluminium interfaces." Thin Solid Films 517, no. 3 (December 2008): 1200–1203. http://dx.doi.org/10.1016/j.tsf.2008.06.009.
Full textShi, Lewis Zhichang, and Wei Zheng. "Early lead exposure increases the leakage of the blood-cerebrospinal fluid barrier, in vitro." Human & Experimental Toxicology 26, no. 3 (March 2007): 159–67. http://dx.doi.org/10.1177/0960327107070560.
Full textYin, Bo, John Cavin, Dong Wang, Daniel Khan, Meikun Shen, Craig Laing, Rohan Mishra, and Bryce Sadtler. "Fluorescence microscopy of single lead bromide nanocrystals reveals sharp transitions during their transformation to methylammonium lead bromide." Journal of Materials Chemistry C 7, no. 12 (2019): 3486–95. http://dx.doi.org/10.1039/c8tc06470a.
Full textBaggerman, A. F. J., and F. J. H. Kessels. "Cracking Behaviour during Au‐Au TAB Inner Lead Bonding." Microelectronics International 10, no. 2 (February 1, 1993): 15–19. http://dx.doi.org/10.1108/eb044496.
Full textBonnici, Maximilian, Henry Greene, and Isabelle Bonnici. "Barriers for Clean Energy Projects." Journal of Clean Energy Technologies 9, no. 2 (April 2021): 24–27. http://dx.doi.org/10.18178/jocet.2021.9.2.256.
Full textDissertations / Theses on the topic "Barrie Levad"
Balbuena, Pergentino. "Neurotoxic effects of malathion and lead acetate on the blood-brain barrier: Disruptive effects caused by different mechanisms examined with an in vitro blood-brain barrier system." Diss., Virginia Tech, 2010. http://hdl.handle.net/10919/77115.
Full textPh. D.
Liu, Li. "Deposition and application of electroless Ni-W-P under bump metallisation for high temperature lead-free solder interconnects." Thesis, Loughborough University, 2016. https://dspace.lboro.ac.uk/2134/23260.
Full textFRIMAIO, AUDREW. "Desenvolvimento de um material cerâmico para utilização em proteção radiológica diagnóstica." reponame:Repositório Institucional do IPEN, 2006. http://repositorio.ipen.br:8080/xmlui/handle/123456789/11414.
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Dissertacao (Mestrado)
IPEN/D
Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP
Militon, Christian. "La metallogenie polyphasee a zn-pb-ba-f et mg-fe de la region de gedre-gavarnie-barroude (hautes-pyrenees)." Orléans, 1987. https://tel.archives-ouvertes.fr/tel-00798146.
Full textYeh, Chao-Kai, and 葉韶凱. "Mechanical Properties and Microstructure Evolution of Lead Free Solder on Ni-based Barrier Coatings." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/qpwnu9.
Full text國立臺北科技大學
材料科學與工程研究所
97
This work studied the reliability variation and the microstructure evolution of the interfacial intermetallic compounds (IMCs) layer formed between different Ni-based barrier coatings, electroplating Ni, sputtering Ni-V and electroless Ni-P, solder with Sn-3.0 wt% Ag-0.5 wt% Cu during 150 ℃ aging. The interfacial morphologies for the joints were investigated by using the field emission scanning electron microscope with EDS, and their reliability was analysis by shear strength test. It is the same that β-Sn matrix precipitate with Cu6Sn5 and Ag3Sn phases were formed at solder side after SAC305 solder paste reacted with these Ni coatings, but different IMC layers were formed at interface: (Cu,Ni)6Sn5, (Ni,Cu)3Sn4 and Ni3P for Ni-P system; (Cu,Ni)6Sn5 and Ni-Sn-Cu-V for Ni-V system; (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 for electroplating Ni system. Those IMC layers also transform to different phases during aging. After 96 hours aging, electroplating Ni coating could not lessen the high-speed diffusion between Sn and Cu atoms due to it consumed to grow the IMC layer. The most effective barrier layer of the three is Ni-V coating. It is because there is up-hill diffusion at 150 ℃ between Ni-Sn-Cu-V and (Cu,Ni)6Sn5 phase cause the IMCs hard to grow up. The normal shear fracture mode after soldering should be break at solder bulk, like the cases in Ni-P and electroplating Ni systems in the study. The shear strength of Ni-V system is lower than others due to the bonding strength between Ni-V coating and copper substrate is not enough. The fracture mode transfer from ductile bulk-fracture to brittle interface-fracture. Ni-P system turns to break between solder and (Cu,Ni)6Sn5 after 240 hours, (Ni,Cu)3Sn4 and P-rich layer after 480 hours. Rapture was found between (Cu,Ni)6Sn5 and Ni-Sn-Cu-V after 480 hours for Ni-V system. The electroplating Ni fractured between solder and (Cu,Ni)6Sn5 before 480 hours, fractured between (Cu,Ni)6Sn5 and Cu3Sn after then. Overall, Ni-P system performs the best reliability after 720 hours aging.
Chun-Chieh, Wen, and 溫俊傑. "A Study on Electromigration in Lead-free Solder Joints-using Electroless Nickel and Electroless Cobalt as Diffusion Barrier." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/70849361453131724165.
Full text國立中正大學
化學工程研究所
101
Electromigration has become a serious reliability issue in flip chip packaging. Therefore, electromigration on interfacial reactions between electroless Ni-P or electroless Co-P and Sn-based solders was studied in this study. The reaction couples are prepared for Sn-based solders/Ni-P or Co-P/Cu/Ni-P or Co-P/Sn-based solders, which have two advantages better than real flip chip solder joints. The first is that the current distribution in the structure is uniform; the second is that the nonsymmetrical Joule heating effect can be avoided. Using Ni-P alloy as barrier layer in electric current test (current density is set at 5000A/cm2 under 180oC), the result shows that layered structure IMCs is always formed at the cathode interface (electron current flows from solder layer to Ni-P). In the contrast, massive amount of IMC spall into the solder at the anode interface (electron current flows from Ni-P to solder), and two stage phase transformation is observed for Ni-P layer. It is first transformed into P-rich nickel layer due to the diffusion of nickel atoms, and then the P-rich nickel layer reacts with Sn-based solder to form Ni2SnP. TEM image shows that the layers in P-rich nickel are composed of different Ni-P IMCs, and the difference of electric current direction cause the formation of different phase. When increasing the amount of P in deposition layer, P-rich nickel layer is formed rapidly and causes the failing of diffusion barrier. On the other hand, using Co-P (4.5wt%P) alloy as barrier layer in Sn solder and conduct electric current test. The result shows that CoSn4 metastable phase is formed at the interface of both electrodes; CoSn4 is then transforms into CoSn3 when the barrier layer is completely comsumed. The rapid growth of CoSn4 is also observed under high current density. Sn-Ag-Cu alloy solder is used to react with Co-P alloy, the formation of (Cu,Co)6Sn5 phase is observed at the interface, the result shows that this phase can reduce the consuming speed of Co-P alloy in electric current test.
LIN, CHE-YANG, and 林哲揚. "A study on interfacial reactions in lead-free solder joints-using co-deposited Co(P) and Co(Zn) as diffusion barrier." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/58371526988694472883.
Full text國立中正大學
化學工程研究所
105
Co system is the most promising diffusion barrier on the electronic package, but the interfacial reaction between Co and Sn was extremely fast, which led to the massive Sn-Co IMC growth, so that the reliability of the solder joint is reduced. In our past studies, we prepared Co-0.7wt.%P diffusion barrier by electroless plating, that showed great inhibition of Sn-Co IMC growth. Besides, Sn solder with minor Zn addition also had very good inhibition between Sn/Co interfacial reactions. But electroless plating method had higher processing temperature (90oC) and slow deposition rate, that make it difficult to be applied to electronic packaging process. However, the electroplating process had lower processing temperature(55oC) and the deposition rate was relatively fast, that make it suitable for electronic packaging. In this study, we used a simple and convenient electroplating method to deposit Co(P) or Co(Zn) diffusion barrier, by adding NaH2PO2∙H2O or ZnSO4∙7H2O into commercial Co plating bath. The P or Zn element was then co-deposited with the Co on the substrate during plating process. This study investigate whether the P or Zn element had great inhibition on the Sn-Co interfacial reaction, and compared the results with Sn/Co/Cu system. The Co(P) and Co(Zn) exhibited columnar structures was observed in FIB cross-sections. In Co(P) system, the prefer orientation of Co showed Co(0 0 2) in XRD, and Co(1 0 0) in GIXRD. In Co(Zn) system, with the increase of Zn from 0.56wt.% to 8.78wt.%, the prefer orientation in XRD changed from Co(1 1 0) to Co(0 0 2). However, in GIXRD, the prefer orientation were Co(0 0 2), indicating that with the addition of P and Zn would affect the crystal growth of Co. In the results of Co(Zn) heat treatment, several fine grains were observed in FIB cross-sections, and a broad peak appeared in XRD analysis showed the existence of 1-CoZn7 phase. The formed IMC in Sn/Co(P)/Cu system and Sn/Co(Zn)/Cu system were analyzed by EPMA and XRD. Both CoSn3 and CoSn4 were identified, and ternary Co-Sn-P phase were formed in Sn/Co-2.5wt.%P/Cu and Sn/Co-3.0wt.%P/Cu system. The growth of the IMCs showed great inhibition from Co-0.5wt.%P to Co-2.0wt.%P, it retarded about 88%、93.7% and 94% of IMC growth. For Co-2.55wt.%Zn and Co-6.77wt.%Zn system, it retarded about 88% and 98% of IMC growth. To discuss the inhibition behavior of the IMC growth, in the results of EPMA analysis, the existence of P and Zn in Sn-Co IMC in Sn/Co(P)/Cu and Sn/Co(Zn)/Cu system were identified. It is inferred that the P element doped into the lattice of the Sn-Co IMC, so it was hard for Sn atoms to diffuse, cause the inhibition of IMC growth. In the Co (Zn) system, the 1-CoZn7 phase precipitated in Co(Zn) during reaction, and a sufficient amount of Zn element can doped into the lattice of Sn-Co IMC, so that the growth of IMC were inhibited.
Books on the topic "Barrie Levad"
Shaw, Michael. The lead, copper & barytes mines of Shropshire. Almeley: Logaston, 2009.
Find full textShaw, Michael. The lead, copper & barytes mines of Shropshire. Almeley: Logaston, 2009.
Find full textMyth of the 200 Barrier: How to Lead Through Transitional Growth. Abingdon Press, 2005.
Find full textSerrano, Víctor, and Javier Monclús, eds. Regeneración urbana (VI). Propuesta para el barrio de Torrero - La Paz, Zaragoza. Prensas Universitarias de Zaragoza, 2020. http://dx.doi.org/10.26754/uz.978-84-1340-048-8.
Full textPaganoni, Sabrina, and Nazem Atassi. Upper Motor Neuron Disorders Hereditary Spastic Paraplegia and Primary Lateral Sclerosis. Oxford University Press, 2017. http://dx.doi.org/10.1093/med/9780199937837.003.0032.
Full textHarrois, Anatole, and Jacques Duranteau. Pathophysiology of severe capillary leak. Oxford University Press, 2016. http://dx.doi.org/10.1093/med/9780199600830.003.0164.
Full textCohen, Jeffrey A., Justin J. Mowchun, Victoria H. Lawson, and Nathaniel M. Robbins. A 45-Year-Old Male with Toxin Exposure. Oxford University Press, 2016. http://dx.doi.org/10.1093/med/9780190491901.003.0004.
Full textSen, Kunal, and Matthew Tyce. The Politics of Structural (De)Transformation. Oxford University Press, 2017. http://dx.doi.org/10.1093/oso/9780198801641.003.0010.
Full textWinchester, Robert, Darren D. O’Rielly, and Proton Rahman. Genetics of psoriatic arthritis. Oxford University Press, 2018. http://dx.doi.org/10.1093/med/9780198737582.003.0006.
Full textPeterson, Susan, and Staci Reintjes. Otitis Externa, Otitis Media, and Mastoiditis. Oxford University Press, 2016. http://dx.doi.org/10.1093/med/9780199976805.003.0011.
Full textBook chapters on the topic "Barrie Levad"
Pelling, D., R. J. Hargreaves, and S. R. Moorhouse. "Studies on Lead and Blood—Brain Barrier Function in the Developing Rat." In Lead Exposure and Child Development, 453–65. Dordrecht: Springer Netherlands, 1989. http://dx.doi.org/10.1007/978-94-009-0847-5_30.
Full textDomer, Floyd R. "Effects of Phenylephrine and Dopamine on Locomotor Activity and Permeability of the Blood-Brain Barrier of Mice Exposed to Lead from Birth." In Barriers and Fluids of the Eye and Brain, 72–81. London: Macmillan Education UK, 1992. http://dx.doi.org/10.1007/978-1-349-12306-3_8.
Full textHadj Mohamed, Nacera, Abdelhak Boutaleb, Maria Boni, and Djamel Eddine Aissa. "Mineralogical and Sulfur Isotopes in Ghar Roubane Barite Lead–Zinc Deposit, (Western Algeria)." In Petrogenesis and Exploration of the Earth’s Interior, 277–79. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-01575-6_67.
Full textMcCabe, Michael, and Steven Gale. "Generation 2030: The Strategic Imperative of Youth Civic and Political Engagement." In Sustainable Development Goals Series, 359–63. Cham: Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-031-05182-1_32.
Full textHunt, Xanthe, Leslie Swartz, Stine Hellum Braathen, and Poul Rohleder. "Sexual and Reproductive Health: Layers of (in)Access." In Physical Disability and Sexuality, 115–30. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-55567-2_8.
Full textBatista de Lima, Maria Eduarda, and Stefano Eleuteri. "Increasing Patient Motivation and Adherence to Nutritional Care: The Importance to Overcome Psychological Barriers." In Perspectives in Nursing Management and Care for Older Adults, 135–46. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-63892-4_10.
Full textWahl, Carl. "Lessons learnt from concern worldwide's conservation agriculture interventions in Malawi and Zambia, 2010-2018." In Conservation agriculture in Africa: climate smart agricultural development, 361–70. Wallingford: CABI, 2022. http://dx.doi.org/10.1079/9781789245745.0022.
Full textFibbi, Rosita, Arnfinn H. Midtbøen, and Patrick Simon. "Consequences of and Responses to Discrimination." In IMISCOE Research Series, 65–78. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-67281-2_6.
Full textPeters, Margaret E. "Immigration Policy and Two Eras of Globalization." In Trading Barriers. Princeton University Press, 2017. http://dx.doi.org/10.23943/princeton/9780691174488.003.0003.
Full textMazzola, Joseph J. "Barriers to Healthy Nutrition and Exercise Behaviors Among Healthcare Workers." In Advances in Psychology, Mental Health, and Behavioral Studies, 82–104. IGI Global, 2022. http://dx.doi.org/10.4018/978-1-7998-8813-0.ch005.
Full textConference papers on the topic "Barrie Levad"
Davidson, Michelle, Upul S. Fernando, John Hall, Brendon O’Donnell, James Latto, and George Karabelas. "Assessment of the Integrity of the PVDF Barrier in Unbonded Flexible Pipes." In ASME 2014 33rd International Conference on Ocean, Offshore and Arctic Engineering. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/omae2014-23573.
Full textBalestra, Lorenzo, Ruochen Yang, Ingrid Schjølberg, Ingrid B. Utne, and Øystein Ulleberg. "Towards Safety Barrier Analysis of Hydrogen Powered Maritime Vessels." In ASME 2021 40th International Conference on Ocean, Offshore and Arctic Engineering. American Society of Mechanical Engineers, 2021. http://dx.doi.org/10.1115/omae2021-60451.
Full textMcGehee, Clark C., Zach C. Ballard, and Brian P. Mann. "Potential Well Shaping Through the Use of Impact Barriers for Broadband Electroelastic Energy Harvesting." In ASME 2011 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/smasis2011-4972.
Full textYang, Peng, Sang Soo Lee, Jacquelyn Bracco, Paul Fenter, and Andrew G. Stack. "Synergistic Incorporation of Lead and Selenate into Barite." In Goldschmidt2020. Geochemical Society, 2020. http://dx.doi.org/10.46427/gold2020.2998.
Full textHiguchi, Tsukimitsu, Yoshiaki Sato, Tatsuo Yamada, and Kouki Ozaki. "A Study of Three Layer Copper-Lead Bearings Without Nickel Barrier." In SAE International Congress and Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1997. http://dx.doi.org/10.4271/970214.
Full textAllapitchai, M. Shahril Majid, Ahmad Luqman Johan, El Khalil Mohamed M’Bareck Heboul, Sattiyaraju Sellapan, William Sin Yoong Liew, Ahmad Hafizi Ahmad Zaini, Mohd Hairi Abdul Razak, and M. Yuzmanizeil Yaakub. "Annulus Perforate, Wash and Cement : Establishing Barrier Verification Process for Deepwater Subsea Wells Abandonment and Its Lessons Learnt." In SPE Symposium: Decommissioning and Abandonment. SPE, 2021. http://dx.doi.org/10.2118/208492-ms.
Full textRaja Ismail, Raja Muhammad Hafizi, Faieqah Zainal Abidin, Myat Thuzar, M. Faisal Rameli, Avinash Kishore Kumar, M. Wahidullah Moh Wahi, and Yap Yun Thiam. "Concerted Approach for Annular Pressure Build-Up APB Mitigations to Safeguard Well Integrity of Subsea, High Temperature Carbonate Exploration Well." In Offshore Technology Conference Asia. OTC, 2022. http://dx.doi.org/10.4043/31689-ms.
Full textDorfman, Amanda, Sang Soo Lee, Paul Fenter, and Jacquelyn Bracco. "LEAD SORPTION AT THE BARITE (001) AND (210)-WATER INTERFACES." In GSA 2020 Connects Online. Geological Society of America, 2020. http://dx.doi.org/10.1130/abs/2020am-354596.
Full textYang, Peng, Nikhil Rampal, Juliane Weber, Jacquelyn Bracco, Paul Fenter, Andrew G. Stack, and Sang Soo Lee. "SYNERGISTIC ENHANCEMENT OF LEAD AND SELENATE UPTAKE BY BARITE†." In GSA Connects 2022 meeting in Denver, Colorado. Geological Society of America, 2022. http://dx.doi.org/10.1130/abs/2022am-381940.
Full textChew, C. S., A. S. M. A. Haseeb, and M. R. Johan. "Wetting behaviour of lead free solder on electroplated Ni and Ni-W alloy barrier film." In High Density Packaging (ICEPT-HDP). IEEE, 2009. http://dx.doi.org/10.1109/icept.2009.5270639.
Full textReports on the topic "Barrie Levad"
Paradis, S., and G. J. Simandl. Are there genetic links between carbonate-hosted barite-zinc-lead sulphide deposits and magnesite mineralization in southeast British Columbia? Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 2018. http://dx.doi.org/10.4095/306478.
Full textRavenhurst, C. E., P. H. Reynolds, M. Zentilli, H. W. Krueger, and J. Blenkinsop. Strontium Isotopic Geochemistry of Lead - Zinc / Barite Deposits and Host Rocks of the Carboniferous Minas Sub - Basin, Nova Scotia. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1990. http://dx.doi.org/10.4095/129041.
Full textMobley, Erin M., Diana J. Moke, Joel Milam, Carol Y. Ochoa, Julia Stal, Nosa Osazuwa, Maria Bolshakova, et al. Disparities and Barriers to Pediatric Cancer Survivorship Care. Agency for Healthcare Research and Quality (AHRQ), March 2021. http://dx.doi.org/10.23970/ahrqepctb39.
Full textColeman, RL. Supplemental Release Limits for the Directed Reuse of Steel in Road Barriers and Lead in Shielding Products by the Department of Energy. Office of Scientific and Technical Information (OSTI), April 2006. http://dx.doi.org/10.2172/886001.
Full textColeman, R. L., and J. S. Bogard. Supplemental Release Limits for the Directed Reuse of Steel in Road Barriers and Lead in Shielding Products by the Department of Energy. Office of Scientific and Technical Information (OSTI), April 2006. http://dx.doi.org/10.2172/921771.
Full textColeman, Robert L., and James S. Bogard. Supplemental Release Limits for the Directed Reuse of Steel in Road Barriers and Lead in Shielding Products by the Department of Energy. Office of Scientific and Technical Information (OSTI), April 2006. http://dx.doi.org/10.2172/974609.
Full textZilberman, David, and Eithan Hochman. Price Evaluation and Allocation of Water under Alternative Water Rights Systems. United States Department of Agriculture, July 1992. http://dx.doi.org/10.32747/1992.7561062.bard.
Full textPiercy, Candice, Safra Altman, Todd Swannack, Carra Carrillo, Emily Russ, and John Winkelman. Expert elicitation workshop for planning wetland and reef natural and nature-based features (NNBF) futures. Engineer Research and Development Center (U.S.), August 2021. http://dx.doi.org/10.21079/11681/41665.
Full textTull, Kerina. Social Inclusion and Immunisation. Institute of Development Studies (IDS), February 2021. http://dx.doi.org/10.19088/k4d.2021.025.
Full textFernandez-Stark, Karina, Penny Bamber, and Vivian Couto. Analysis of the Textile and Clothing Industry Global Value Chains. Inter-American Development Bank, December 2022. http://dx.doi.org/10.18235/0004638.
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