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Journal articles on the topic 'Ag-Sn-Sb alloy'

Author: Grafiati

Published: 28 June 2021

Last updated: 18 February 2022

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1

Chen, Fang, Yun Fei Du, Rong Chang Zeng, Gui Sheng Gan, and Chang Hua Du. "Thermodynamics of Oxidation on Pb-Free Solders at Elevated Temperature." Materials Science Forum 610-613 (January 2009): 526–30. http://dx.doi.org/10.4028/www.scientific.net/msf.610-613.526.

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Based on the available thermodynamic and phase equilibria data, the thermodynamic criteria for oxidation in tin-based lead-free solders under soldering condition was deduced. The dependence of Gibbs free energy on temperature in Pb-free solder oxidation reaction was calculated by applying MATLAB program. The characteristics of oxidation reaction of a varity of solder alloy systems such as Sn-Ag, Sn-Cu, Sn-Sb, Sn-Zn, Sn-Ag-Cu and Sn-Pb eutectic alloys at elevated temperature were analyzed. The results suggested that zinc preferentially oxidized in Sn-Zn solder alloys in the elevated temperature state, while tin preferentially oxidized in the other alloys. The oxidation potential of the Sn-Zn eutectic alloys was higher than that of the pure tin at elevated temperature, whereas the oxidation potentials of Sn-Ag, Sn-Cu, Sn-Sb and Sn-Ag-Cu eutectic alloys were approxiately equal to that of the pure tin. All tin-based Pb-free solder alloys more easily oxidized than the Sn-Pb solder alloys. Oxidizability of these alloys followed in a decreasing order: Sn-Zn＞Sn-Sb＞Sn-Cu＞Sn-Ag＞Sn-Ag-Cu＞Sn-Pb.

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2

Wu, C. P., D. Q. Yi, S. Goto, C. H. Xu, W. Weng, J. M. Zhou, and G. F. Xu. "Oxidation of Ag-Sn-Sb alloy powders." Materials and Corrosion 65, no. 5 (July 11, 2012): 522–30. http://dx.doi.org/10.1002/maco.201206542.

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3

Dahshan, Alaa, Horesh Kumar, and Neeraj Mehta. "Role of some modifiers on the thermo-mechanical properties of Se90In10 chalcogenide glass (ChGs)." European Physical Journal Applied Physics 94, no. 3 (June 2021): 31101. http://dx.doi.org/10.1051/epjap/2021210044.

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The studies on the micro-hardness of ChGs provide useful information regarding their straightforward involvement in the fabrication of sensors, fibers, and other optical elements for direct use in infrared optics. This work deals with the mechanical response of the glassy Se90In10 alloy under the influence of additives (Sn, Ag, Sb, and Ge). For this, we have determined the micro-hardness of all glassy alloys. Using the values of Vickers hardness (Hv), glass transition temperature (Tg), and present glasses, we have calculated the other significant thermo-mechanical parameters. The effect of Sn, Ag, Sb, and Ge additives on the micro-hardness of glassy Se90In10 alloy is also discussed.

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4

Li, Chaojun, Yanfu Yan, Tingting Gao, and Guodong Xu. "The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder." Materials 13, no. 19 (October 7, 2020): 4443. http://dx.doi.org/10.3390/ma13194443.

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To obtain Sn-3.0Ag-0.5Cu-xSb (x = 0, 25, 28, and 31) high-temperature lead-free solder antimony was added to Sn-3.0Ag-0.5Cu solder. The microstructure, thermal properties, and mechanical behavior of the solder alloy prepared were studied by using JSM-5610LV scanning electron microscope, Germany STA409PC differential scanning calorimeter, AG-I250KN universal tensile testing machine, and other methods. The SEM-EDS results showed that after adding Sb, SnSb phase was formed in the β-Sn matrix phase. The newly formed SnSb phase and the existing Sb in the solder alloy can inhibit the generation of IMC and refine the IMC layer. The addition of Sb significantly increased the melting temperature of the solder alloy. Among them, the thermal performance of Sn-3.0Ag-0.5Cu-25Sb is the best. The melting temperature of Sn-3.0Ag-0.5Cu-25Sb is 332.91 °C and the solid–liquid line range of Sn-3.0Ag-0.5Cu-25Sb solder alloy is 313.28–342.02 °C. Its pasty range is 28.74 °C, lower than 30 °C, which is beneficial for soldering. The test results of the mechanical behavior of Sn-3.0Ag-0.5Cu-xSb solder alloy show that with the increase of Sb addition, the ultimate tensile strength of the solder alloy also increases. However, the change of the elongation of the solder alloy is the opposite. The ultimate tensile strength of the solder alloy increased from 29.45 MPa of Sn-3.0Ag-0.5Cu solder to 70.81 MPa of Sn-3.0Ag-0.5Cu-31Sb solder. The reason for the increase in the strength of the solder alloy is the reduction of the thickness of IMC and the solid solution hardening effect of Sb.

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5

Wang, Fu Li, Jing Chao Chen, and Jie Yu. "First-Principles Calculations for Electrical Proterties of the Lead Anode Plate." Advanced Materials Research 634-638 (January 2013): 1817–20. http://dx.doi.org/10.4028/www.scientific.net/amr.634-638.1817.

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Four kinds of fermi energy of lead anode plate were calculated by using first-principles. Different metals and different alloy elements of the fermi energy level were compared, the minimum electrode potential lead base alloy anode materials is known. The results calculations show that the adding alloy elements can reduce the electrode potential of the lead anode plate, four kinds of alloy systems Pb-Ag, Pb-Sb, Pb-Sr, Pb-Sn were calculated, the highest of fermi energy was Pb-Sb alloy. So the Pb-Sb alloy is expected to become the electrode potential minimum lead base alloy anode materials.

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6

Liu, G. X., Z. M. Guan, D. B. Williams, and M. R. Notis. "A Study of DIGM in Ag/Cu system by AEM." Proceedings, annual meeting, Electron Microscopy Society of America 48, no. 2 (August 12, 1990): 416–17. http://dx.doi.org/10.1017/s042482010013568x.

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DIGM phenomenon is very similar to the diffusion process and the coupled migration of the reaction front occured in discontinuous precipitation. It is likely to postulate that DIGM may occur in the system where discontinuous precipitation appears. W. Kim and co-author have Investigated DIGM In six copper alloy systems (Ag/Cu, Mg/Cu, Sb/Cu, In/Cu, Cd/Cu and Sn/Cu) in which discontinuous precipitation has been found. In Kim s experiment, the diffusion treatments were conducted at 400 °C and 450 °C for 4 days, Kim found DIGM occurred in 4 systems, i. e. Sb/Cu, In/Cu, Cd/Cu and Sn/Cu, but in Ag/Cu and Mg/Cu systems no DIGM was found.In order to test whether there is DIGM or not in Ag/Cu system, we reexamlned the DIGM phenomenon in Ag/Cu under 400 °C and 480 °C for 5 days diffusion, finally DIGM was found in this system. In different segments of a same boundary the bulging directions and the migration distances may be different as indicated in Fig. 1.

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7

Nur, Monika, Naoya Yamaguchi, and Fumiyuki Ishii. "Simple Model for Corrugation in Surface Alloys Based on First-Principles Calculations." Materials 13, no. 19 (October 7, 2020): 4444. http://dx.doi.org/10.3390/ma13194444.

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The structural stability of M/Ag(111)–3×3R30° surface alloys is systematically investigated by using first-principles calculations, where M is a member of group III (B, Al, Ga, In, Tl), IV (C, Si, Ge, Sn, Pb), and V (N, P, As, Sb, Bi) elements. We focus on the corrugation parameter d which is determined by the height of the M atom from the Ag atom in the plane of the top-most atom, and the relation between atomic radii and corrugations in M/Ag(111) is obtained. The tendencies of the corrugation parameter d can be understood by using a simple hard spherical atomic model. We introduce a new type of atomic radii determined by the corrugation in surface alloys, surface alloy atomic radii, which can be useful for rapid predictions of the structures of surface alloys, not only for M/Ag (111)–3×3R30° systems but also for other surface alloys.

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8

Chen, Zhiwen, Kun Ma, Li Liu, Ning-Cheng Lee, Guoyou Liu, Jiasheng Yan, Hui Li, et al. "Mechanical Performance and Reliability of a Sn–Ag–Cu–Sb Alloy at Elevated Temperatures." IEEE Transactions on Components, Packaging and Manufacturing Technology 11, no. 7 (July 2021): 1081–87. http://dx.doi.org/10.1109/tcpmt.2021.3093562.

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9

Musa, Sayyidah Amnah, Mohd Arif Anuar Mohd Salleh, and Saud Norainiza. "Zn-Sn Based High Temperature Solder - A Short Review." Advanced Materials Research 795 (September 2013): 518–21. http://dx.doi.org/10.4028/www.scientific.net/amr.795.518.

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The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high temperature solders. The lead and lead-based compound are highly toxic which is dangerous to human health and environment. The highly suitable lead-free solder candidates for replacing high Pb high temperature solder are Au-Sn, Al-Zn, Zn-Sn, Sn-Sb, and Bi-Ag solders. However, Zn-Sn based solder has highly recommended as the best candidates in replacing high lead high temperature solder. This paper provides a short review of recent research on Zn-Sn based lead free high temperature solders with different additional alloying elements. The new novel alloy of Zn-Sn based for high temperature solder applications will be proposed in this paper.

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10

Wang, Yufei, Min Li, Haiyan Gao, Jun Wang, and Baode Sun. "First-Principles Study on the Cu/Fe Interface Properties of Ternary Cu-Fe-X Alloys." Materials 13, no. 14 (July 13, 2020): 3112. http://dx.doi.org/10.3390/ma13143112.

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The supersaturated Fe in Cu is known to reduce the electrical conductivity of Cu severely. However, the precipitation kinetics of Fe from Cu are sluggish. Alloying is one of the effective ways to accelerate the aging precipitation of Cu-Fe alloys. Nucleation plays an important role in the early stage of aging. The interface property of Cu/γ–Fe is a key parameter in understanding the nucleation mechanism of γ-Fe, which can be obviously affected with the addition of alloying elements. In this paper, first principles calculations were carried out to investigate the influence of alloying elements on the interface properties, including the geometric optimizations, interfacial energy, work of adhesion and electronic structure. Based on the previous research, 14 elements including B, Si, P, Al, Ge, S, Mg, Ag, Cd, Sn, In, Sb, Zr and Bi were selected for investigation. Results showed that all these alloying elements tend to concentrate in the Cu matrix with the specific substitution position of the atoms determined by the binding energy between Fe and alloy element (X). The bonding strength of the Cu/γ-Fe interface will decrease obviously after adding Ag, Mg and Cd, while a drop in interfacial energy of Cu/γ–Fe will happen when alloyed with Al, B, S, P, Si, Ge, Sn, Zr, Bi, Sb and In. Further study of the electronic structure found that Al and Zr were not effective alloying elements.

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11

CRISTEA-STAN, DANIELA, BOGDAN CONSTANINESCU, DANIELE CECCATO, CLAIRE PACHECO, LAURENT PICHON, and CATALIN LUCULESCU. "MICRO-PIXE STUDIES ON NATIVE TRANSYLVANIAN GOLD FOR ARCHAEOLOGICAL ARTIFACTS AUTHENTICATION." International Journal of Modern Physics: Conference Series 27 (January 2014): 1460133. http://dx.doi.org/10.1142/s2010194514601331.

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Determination of the geological provenance of gold is a powerful argument in the authentication of ancient gold artifacts. Small samples (hundreds of microns) of native gold from Transylvanian deposits were scanned by micro-PIXE to obtain information on the natural Au – Ag alloy composition and on the presence of trace elements such as Sn , Sb , and Cu . The experiments were performed at the AGLAE Louvre and LNL AN2000 accelerators. Mineral identification was confirmed by a micro-mineralogical study using the INFLPR-Magurele Scanning Electron Microscope associated with an Energy-dispersive X-ray spectroscopy (EDAX) facility.

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12

Mladenovic, Srba, Desimir Markovic, Ljubica Ivanic, Svetlana Ivanov, and Zagorka Acimovic-Pavlovic. "The microstructure and properties of as-cast Sn-Zn-Bi solder alloys." Chemical Industry 66, no. 4 (2012): 595–600. http://dx.doi.org/10.2298/hemind111219015m.

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Research on the lead-free solders has attracted wide attention, mostly as the result of the implementation of the Directive on the Restriction of the Use of Hazardous Substances in Electrical and Electronic Equipment. The Sn-Zn solder alloys have been considered to be one of the most attractive lead-free solders due to its ability to easily replace Sn-Pb eutectic alloy without increasing the soldering temperature. Furthermore, the mechanical properties are comparable or even superior to those of Sn-Pb solder. However, other problems still persist. The solution to overcoming these drawbacks is to add a small amount of alloying elements (Bi, Ag, Cr, Cu, and Sb) to the Sn-Zn alloys. Microstructure, tensile strength, and hardness of the selected Sn-Zn-Bi ternary alloys have been investigated in this study. The SEM-EDS was used for the identification of co-existing phases in the samples. The specimens? microstructures are composed of three phases: Sn-rich solid solution as the matrix, Bi-phase and Zn-rich phase. The Bi precipitates are formed around the Sn-dendrit grains as well as around the Zn-rich phase. The amount of Bi segregation increases with the increase of Bi content. The Sn-Zn-Bi alloys exhibit the high tensile strength and hardness, but the values of these mechanical properties decrease with the increase of Bi content, as well as the reduction of Zn content. The results presented in this paper may offer further knowledge of the effects various parameters have on the properties of lead-free Sn-Zn-Bi solders.

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13

Ueda, Shigeru, Ryo Katsube, and Katsunori Yamaguchi. "Distributions of Sn, Sb, and Bi between Ag-Pb Alloy and PbO Based Melt at 1273 K." MATERIALS TRANSACTIONS 50, no. 7 (2009): 1820–23. http://dx.doi.org/10.2320/matertrans.m2009117.

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14

Keheyan, Yeghis, and Giancarlo Lanterna. "Micro-Stratigraphical Investigation on Corrosion Layers in Ancient Bronze Artefacts of Urartian Period by Scanning Electron Microscopy, Energy-Dispersive Spectrometry, and Optical Microscopy." Heritage 4, no. 3 (September 19, 2021): 2526–43. http://dx.doi.org/10.3390/heritage4030143.

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The results of the analysis on some fragments of bronze belts and a bowl discovered from southwestern Armenia at the Yegheghnadzor archaeological site are discussed. The samples are dated to the 7–6th millennium BCE from the Urartian period. The artefacts were corroded, and a multilayer structure was formed. To study the stratigraphy of layers and their composition, the samples have been analyzed using SEM-EDS (Scanning Electron Microscopy, Energy-Dispersive Spectrometry) and OM (Optical Microscopy) techniques. The bronze finds appear with the typical incrustations rich in alloy alteration compounds. Concentrations of copper and tin in the alloys were quantified by SEM-EDS: the pattern and the percentage of the alloy are the same for the belts. Regarding the bowl sample, it is constituted by two foils perfectly in contact but different in color, thickness, and composition. The results evidenced that only two elements participate in forming the alloy composition in the samples: Cu and Sn. The tin content is variable from 7.75% to 13.56%. Other elements such as Ag, As, Fe, Ni, P, Pb, Sb, and Zn make up less than 1% and can be considered as impurities.

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15

Li, Yue Hong, and Huai Bao Yuan. "Development and Application of Series Re-Calibration Samples of Copper and Copper Alloy." Advanced Materials Research 503-504 (April 2012): 511–15. http://dx.doi.org/10.4028/www.scientific.net/amr.503-504.511.

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In accordance with the requirements of the reference materials technical specifications, refer to some countries’ existing standards of chemical composition of copper and copper products, design the chemical composition of each re-calibration samples. Using proper methods of batching, smelting technique and extrusion processes etc., developed a set of re-calibration samples of copper and copper alloy. These samples are mainly used for standardization of photoelectric direct reading spectrometer instrument, to meet the re-calibration of various elements of Cu, Pb, Fe, Ni, Bi, Sb, P, As, Al, Zn, Mn, Si, Sn, Cr, Cd, Zr, Mg, S, C, Ag, Co, Se, Te in the copper, brass, bronze, copper-nickel and other copper alloy. Determine the content of the various elements using a variety of methods, these samples can also act as control samples for the control analysis of the relevant elements separately. In comparison with existing international re-calibration samples, the series of samples have advantages of small quantity, wide coverage, more reasonable distribution of elements.

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16

Mitovski, Aleksandra, Dragana Zivkovic, Ljubisa Balanovic, Nada Strbac, and Zivan Zivkovic. "Life cycle assessment (LCA) of lead-free solders from the environmental protection aspect." Chemical Industry 63, no. 3 (2009): 163–69. http://dx.doi.org/10.2298/hemind0903163m.

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Life-cycle assessment (LCA) presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equivalent basis, which, in this case, was 1000 cubic centimeters of an alloy. Two of the LCA phases, life-cycle inventory (LCA) and life-cycle impact assessment (LCIA), are needed to calculate the environmental impacts. Methodology of LCIA applied in this analysis aligns every input and output influence into 16 different categories, divided in two subcategories. The life-cycle assessment reaserch review of the leadfree solders Sn-Cu, SAC (Sn-Ag-Cu), BSA (Bi-Sb-Ag) and SABC (Sn-Ag-Bi-Cu) respectively, is given in this paper, from the environmental protection aspect starting from production, through application process and finally, reclamation at the end-of-life, i.e. recycling. There are several opportunities for reducing the overall environmental and human health impacts of solder used in electronics manufacturing based on the results of the LCA, such as: using secondary metals reclaimed through post-industrial recycling; power consumption reducing by replacing older, less efficient reflow assembly equipment, or by optimizing the current equipment to perform at the elevated temperatures required for lead-free soldering, etc. The LCA analysis was done comparatively in relation to widely used Sn-Pb solder material. Additionally, the impact factors of material consumption, energy use, water and air reserves, human health and ecotoxicity have been ALSO considered including the potentials for dissolution and recycling processes.

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17

Xu, Canhui, Danqing Yi, Chunping Wu, Huiqun Liu, and Weizhou Li. "Microstructures and properties of silver-based contact material fabricated by hot extrusion of internal oxidized Ag–Sn–Sb alloy powders." Materials Science and Engineering: A 538 (March 2012): 202–9. http://dx.doi.org/10.1016/j.msea.2012.01.031.

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18

Kasem, Md Riad, Kazuhisa Hoshi, Rajveer Jha, Masayoshi Katsuno, Aichi Yamashita, Yosuke Goto, Tatsuma D. Matsuda, Yuji Aoki, and Yoshikazu Mizuguchi. "Superconducting properties of high-entropy-alloy tellurides M-Te (M: Ag, In, Cd, Sn, Sb, Pb, Bi) with a NaCl-type structure." Applied Physics Express 13, no. 3 (February 20, 2020): 033001. http://dx.doi.org/10.35848/1882-0786/ab7482.

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19

MITSUI, Kohei, Ikuo SHOHJI, Tatsuya KOBAYASHI, and Hirohiko WATANABE. "Effect of Addition of Trace Ni and Ge into Sn-Sb-Ag High Temperature Lead-free Solder Alloy on its Mechanical Properties." Journal of Smart Processing 9, no. 3 (2019): 133–39. http://dx.doi.org/10.7791/jspmee.9.133.

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20

Sobhy, M., A. M. El-Refai, and A. Fawzy. "Effect of Graphene Oxide Nano-Sheets (GONSs) on thermal, microstructure and stress–strain characteristics of Sn-5 wt% Sb-1 wt% Ag solder alloy." Journal of Materials Science: Materials in Electronics 27, no. 3 (November 18, 2015): 2349–59. http://dx.doi.org/10.1007/s10854-015-4032-x.

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21

El-Taher, A. M., S. E. Abd El Azeem, and A. A. Ibrahiem. "Influence of permanent magnet stirring on dendrite morphological and elastic properties of a novel Sn–Ag–Cu–Sb–Al solder alloy by ultrasonic pulse echo method." Journal of Materials Science: Materials in Electronics 31, no. 12 (May 3, 2020): 9630–40. http://dx.doi.org/10.1007/s10854-020-03506-4.

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22

Griesche, Axel, Bo Zhang, Jürgen Horbach, and Andreas Meyer. "Interdiffusion and Thermodynamic Forces in Binary Liquid Alloys." Materials Science Forum 649 (May 2010): 481–86. http://dx.doi.org/10.4028/www.scientific.net/msf.649.481.

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A novel X-ray radiography method is used to measure chemical diffusion in a long-capillary in liquid Al95Ni5 at.-%. Molecular dynamics simulations provide interdiffusion coefficients and thermodynamic factors for the whole composition range in Al-Ni. The data are compared to literature data in Sb-Sn and Ag-Sn. The relation between interdiffusion coefficient and thermodynamic forces is discussed in the context of the Darken equation. In systems with common ordering tendency (Al-Ni, Sb-Sn) the thermodynamic factor is larger than one and enhances interdiffusion. In systems with common demixing tendency (Ag-Sn) the thermodynamic factor is smaller than one and reduces interdiffusion.

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23

Gather, Bernd, Peter Schröter, and Roger Blachnik. "Mischungsenthalpien der ternären Systeme Ag-In-Sn, Ag-Sn-Sb, Ag-In-Sb und In-Pb-Sb." International Journal of Materials Research 78, no. 4 (April 1, 1987): 280–85. http://dx.doi.org/10.1515/ijmr-1987-780407.

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24

Moser, Z., W. Gąsior, J. Pstruś, I. Ohnuma, and K. Ishida. "Influence of Sb additions on surface tension and density of Sn–Sb, Sn–Ag–Sb andSn–Ag–Cu–Sb alloys: Experiment vs. modeling." Zeitschrift für Metallkunde 97, no. 4 (April 2006): 365–70. http://dx.doi.org/10.3139/146.101225.

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25

Shohji, Ikuo, and Yuichiro Toyama. "Effect of Strain Rate on Tensile Properties of Miniature Size Specimens of Several Lead-Free Alloys." Materials Science Forum 783-786 (May 2014): 2810–15. http://dx.doi.org/10.4028/www.scientific.net/msf.783-786.2810.

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The effect of strain rate on tensile properties of several lead-free solder was investigated using miniature size specimens. High-temperature lead-free solder which are Sn-Cu and Sn-Sb alloys were prepared. Moreover, low-Ag lead-free solder which are Sn-1Ag-0.7Cu (SAC107, mass%) based alloys were prepared. Sn-3Ag-0.5Cu (SAC305) was also prepared for comparison. Tensile strength is proportion to the logarithm of strain rate in all solder investigated. Although 0.1% proof stress decreases at high strain rate in high-temperature solder, it scarcely changes in low-Ag solder. Elongation somewhat increases with increasing strain rate in high-temperature solder. It increases with increasing strain rate in low-Ag solder although it is lower than that of SAC305. Chisel point fracture mainly occurred except Sn-13Sb. In Sn-13Sb, brittle fracture occurred and thus elongation was lower than those of other solder. Sn-8.5Sb and Sn-1Ag-0.7Cu-1Bi-0.2In show mechanical properties similar to SAC305.

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26

Shalaby, Rizk Mostafa. "Effect of rapid solidification on microstructure, creep resistance and thermal properties of Sn-10 wt.% Sb- 3 wt.% X ( X= In, Ag, Bi and Zn) lead-free solder alloys." JOURNAL OF ADVANCES IN PHYSICS 9, no. 1 (June 4, 2015): 2287–98. http://dx.doi.org/10.24297/jap.v9i1.1469.

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AbstractThe harmful effects of lead on the environment and human health, coupled with the threat of legislation, have prompted a serious search for lead-free solders for electronic packaging applications. The melt-spinning processes of ternary Sn-10 wt.%Sb-3 wt.%X (X=In, Ag, Bi and Zn) were analyzed using x-ray diffractometer (XRD), scanning electron microscopy (SEM), differential scanning calorimetry (DSC) and Vickers hardness tester (HV). The investigation showed that, the addition of a small amount of the third element enhances the ductility of the Snâ€“10 wt.% Sb lead-free solder due to the formation of a fine, homogeneous ternary microstructure.. It is concluded that, the addition of 3.0 wt% Ag improves the grain size of the ternary microstructure. Moreover, SnSb intermetallic compound, precipitated finely from the solid tin solution near the grain boundaries with antimony. This fine precipitated intermetallic compound suppresses the coarsening of the ternary structure and thus enhances solder ductility. Structural and microstructural analysis revealed that the origin of change in mechanical behaviors was due to refined beta-Sn grains and formation of intermetallic compounds (IMCs) SnSb, InSn19, Î²-In3Sn and Ag3Sn. The results indicated that the melting point of Sn-10Sb-3 wt.% Ag and Sn-10 wt.%Sb- 3 wt.% Zn alloys reduced toÂ 230 and 240 ËšC respectively.Â In particular, the zinc addition at 3 wt.%Â is the most effective in improving solder ductility. The good creep resistance of Sn-10 wt.% Sb-3 wt.% Zn lead-free solder correlated to a large Î²-Sn grain size and complete soluble of SnSb IMC particles in the Î²-Sn matrix.

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27

Koncz-Horváth, Dániel, and Zoltán Gácsi. "Analysis of Lead in SnAg Based Solders Using X-Ray Fluorescence." Materials Science Forum 752 (March 2013): 37–41. http://dx.doi.org/10.4028/www.scientific.net/msf.752.37.

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This paper reports the results of ED-XRF method for the determination of low-level contaminated solders. The method was calibrated for the analysis of part-per-million (ppm) levels of Pb and major levels of other elements. In this work, two types of Sn-Ag based solder alloys are used; the ternary Sn-3.0wt%Ag-0.5wt%Cu (SAC305) and the 6-part Sn-3.5wt%Ag-3.2wt%Bi-1.6wt%Sb-0.5wt%Cu-0.15wt%Ni were examined. Empirical calibration and fundamental parameter calibration were used to analyze samples. The results of this study demonstrate the differences between the applied calibration methods for detection of Pb. Screening analysis of bulk samples from variant production lines were also discussed.

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28

Weltsch, Zoltán, and Antal Lovas. "The Relation between the Surface Tension and the Bulk Properties of Diluted Silver Based Melts." Materials Science Forum 729 (November 2012): 19–24. http://dx.doi.org/10.4028/www.scientific.net/msf.729.19.

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The wettability of graphite by the Ag-M based (M: Cd, In Sn, Sb) liquid alloys was measured using the sessile drop method at a temperature interval of 1273 1473 K. Except the Ag-Cd alloys, the investigated systems exhibit worse wettability than that of Ag (host metal) melt, within the investigated temperature range. The compositional and concentration dependence of contact angle (Θ) exhibits similar trends, than the residual resistivity change measured in the same alloys in solid state. Nevertheless, the measured segregation effects during the solidification are not significant.

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29

Moser, Zbigniew, Wladyslaw Gasior, Janusz Pstrus, Satoru Ishihara, Xing Jun Liu, Ikuo Ohnuma, Ryosuke Kainuma, and Kiyohito Ishida. "Surface Tension and Density Measurements of Sn-Ag-Sb Liquid Alloys and Phase Diagram Calculations of the Sn-Ag-Sb ternary system." MATERIALS TRANSACTIONS 45, no. 3 (2004): 652–60. http://dx.doi.org/10.2320/matertrans.45.652.

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30

Sklyarchuk, V., Yu Plevachuka, I. Kaban, and R. Novakovic. "Surface properties and wetting behavior of liquid Ag-Sb-Sn alloys." Journal of Mining and Metallurgy, Section B: Metallurgy 48, no. 3 (2012): 443–48. http://dx.doi.org/10.2298/jmmb120719055s.

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Surface tension and density measurements of liquid Ag-Sb-Sn alloys were carried out over a wide temperature range by using the sessile drop method. The surface tension experimental data were analyzed by the Butler thermodynamic model in the regular solution approximation. The wetting characteristics of these alloys on Cu and Ni substrates have been also determined. The new experimental results were compared with the calculated values as well as with data available in the literature.

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31

Masson, D. Bruce, and Brian K. Kirkpatrick. "Equilibrium solidification of Sn-Ag-Sb thermal fatigue-resistant solder alloys." Journal of Electronic Materials 15, no. 6 (November 1986): 349–53. http://dx.doi.org/10.1007/bf02661884.

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32

Lee, Chiapyng, Chung-Yung Lin, and Yee-Wen Yen. "The 260°C phase equilibria of the Sn–Sb–Ag ternary system and interfacial reactions at the Sn–Sb/Ag joints." Journal of Alloys and Compounds 458, no. 1-2 (June 2008): 436–45. http://dx.doi.org/10.1016/j.jallcom.2007.04.002.

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33

Yang, Fan, Liang Zhang, Zhi-quan Liu, Su-juan Zhong, Jia Ma, and Li Bao. "Properties and Microstructures of Sn-Bi-X Lead-Free Solders." Advances in Materials Science and Engineering 2016 (2016): 1–15. http://dx.doi.org/10.1155/2016/9265195.

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The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C) and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth) and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

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34

Gierlotka, Wojcieh, Yu-Chih Huang, and Sinn-Wen Chen. "Phase Equilibria of Sn-Sb-Ag Ternary System (II): Calculation." Metallurgical and Materials Transactions A 39, no. 13 (October 28, 2008): 3199–209. http://dx.doi.org/10.1007/s11661-008-9671-6.

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35

Lin, Chung-Yung, Chiapyng Lee, Xingjun Liu, and Yee-Wen Yen. "Phase equilibria of the Sn–Sb–Ag ternary system and interfacial reactions at the Sn–Sb/Ag joints at 400°C and 150°C." Intermetallics 16, no. 2 (February 2008): 230–38. http://dx.doi.org/10.1016/j.intermet.2007.10.002.

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36

Yao, Shinya, Yoichi Kaku, and Zensaku Kozuka. "The Activity Coefficients of Oxygen in Liquid Ag–In, Ag–Sn, Ag–Sb and Ag–Ge Alloys." Transactions of the Japan Institute of Metals 27, no. 8 (1986): 616–22. http://dx.doi.org/10.2320/matertrans1960.27.616.

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37

Chen, Sinn-Wen, Po-Yin Chen, Chen-Nan Chiu, Yu-Chih Huang, and Chao-Hong Wang. "Phase Equilibria of the Sn-Sb-Ag Ternary System (I): Experimental." Metallurgical and Materials Transactions A 39, no. 13 (October 30, 2008): 3191–98. http://dx.doi.org/10.1007/s11661-008-9673-4.

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38

Li, D., S. Delsante, A. Watson, and G. Borzone. "The Effect of Sb Addition on Sn-Based Alloys for High-Temperature Lead-Free Solders: an Investigation of the Ag-Sb-Sn System." Journal of Electronic Materials 41, no. 1 (October 20, 2011): 67–85. http://dx.doi.org/10.1007/s11664-011-1752-4.

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39

Weltsch, Z., and A. Lovas. "Alloying Effects on Wetting Ability of Diluted Ag-Based Melts on Ceramic Substrates." Materials Science Forum 659 (September 2010): 109–13. http://dx.doi.org/10.4028/www.scientific.net/msf.659.109.

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The wetting angles (Θ) of Ag-M based melts (M: Cd, Sn, Sb) on graphite and Al2O3 substrates are compared. Despite of the inert chemical character and the similar surface roughness of substrate materials, the wetting angle is smaller on the Al2O3. The compositional and concentration dependence of Θ exhibits similar trends, than that, observed in the bulk transport properties such as the specific electrical resistance or the thermopower obtained on the same alloys in solid state. No segregation effects can be detected on the solidified metal drops.

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40

KOHNO, Masuchika, Koji YOSHIDA, Kimikazu MORITANI, Osamu TAKAHASHI, Kazuyuki ENAMI, Toshihide UCHIDA, and Fumitaka NISHIYAMA. "Continuous Background Originated From Neutrons By 65Cu(p,n)65Zn Under 4 MeV Protons — A problem on detecting trace elements in old copper alloys by PIXE." International Journal of PIXE 08, no. 02n03 (January 1998): 175–83. http://dx.doi.org/10.1142/s0129083598000212.

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EDS-PIXE is a very useful and easy method for detecting trace elements in ancient materials. However, relatively high continuous background is observed, when old copper alloys are measured under 4 MeV protons. The background makes the detection limits of trace metallic elements such as Au , Ag , As , Sn , Sb and Pb in these alloys worse. The cause of the high background was investigated using a Si ( Li ) detector, a pure- Ge detector and a 3 He neutron counter, and it was found that the continuous background level is correlated with the amount of neutron released from 65 Cu ( p , n )65 Zn reaction.

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41

Kobayashi, Tatsuya, Masaki Yokoi, Kyosuke Kobayashi, Kohei Mitsui, and Ikuo Shohji. "Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens." Solid State Phenomena 273 (April 2018): 83–90. http://dx.doi.org/10.4028/www.scientific.net/ssp.273.83.

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Tensile properties of Sn-5Sb (mass%) and Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge (mass%) were investigated using miniature size specimens and obtained results were compared. Tensile strength of both alloys increase with increasing the strain rate and decrease with increasing the temperature. Although similar dependency to the temperature is observed in 0.1% proof stress, the effect of the strain rate on it is obscure. The tensile strength and the 0.1% proof stress of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge are higher than those of Sn-5Sb. The elongation of Sn-5Sb is relatively stable at the range from 0.4 to 0.6. The elongation of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge which is approximately 0.3, is inferior to that of Sn-5Sb. On the basis of investigation of stress exponent, n, it was clarified that dispersion strengthening by Ag3Sn particulates in Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge is effective to prevent the degradation of creep resistance compared with Sn-5Sb that is strengthened by solid-solution of Sb in β-Sn phases and dispersion of SbSn compounds.

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42

Łapsa, Joanna, and Bogusław Onderka. "DTA Determination of Phase Equilibria in the Ternary Ag-Sb-Sn System." Journal of Phase Equilibria and Diffusion 40, no. 1 (November 21, 2018): 53–63. http://dx.doi.org/10.1007/s11669-018-0698-0.

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43

Kroupa, A., A. Dinsdale, A. Watson, J. Vrestal, A. Zemanova, and P. Broz. "The thermodynamic database COST MP0602 for materials for high-temperature lead-free soldering." Journal of Mining and Metallurgy, Section B: Metallurgy 48, no. 3 (2012): 339–46. http://dx.doi.org/10.2298/jmmb120711043k.

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The current state of thermodynamic modelling in the field of high-temperature lead-free soldering is presented. A consistent thermodynamic database, containing 18 elements (Ag, Al, Au, Bi, Co, Cu, Ga, Ge, Mg, Ni, P, Pb, Pd, Sb, Sn, Ti and Zn) has been created. The thermodynamic data for the most of the important binary and selected ternary systems were checked and included into the database. The database was tested using major commercial software packages. Such reliable and sophisticated software coupled to reliable thermodynamic databases are necessary prerequisites for application of thermodynamics in advanced alloys design.

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44

Moser, Z., W. Gasior, K. Bukat, J. Pstruś, R. Kisiel, J. Sitek, K. Ishida, and I. Ohnuma. "Pb-Free Solders: Part III. Wettability Testing of Sn-Ag-Cu-Bi Alloys with Sb Additions." Journal of Phase Equilibria and Diffusion 28, no. 5 (August 15, 2007): 433–38. http://dx.doi.org/10.1007/s11669-007-9156-0.

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45

Liu, Jianping, Weikang Chen, and Qingquan Liu. "Sb-Bi Alloys and Ag-Cu-Pb-Sb-Bi Sulphosalts in the Jialong Cu-Sn Deposit in North Guangxi, South China." Minerals 8, no. 1 (January 16, 2018): 26. http://dx.doi.org/10.3390/min8010026.

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46

Jang, Jai-young, Su-jin Chun, Nam-suk Kim, Jeung-won Cho, Jae-hyun Kim, Jong-taek Yeom, Jae-il Kim, and Tae-hyun Nam. "Martensitic transformation behavior in Ti–Ni–X (Ag, In, Sn, Sb, Te, Tl, Pb, Bi) ternary alloys." Materials Research Bulletin 48, no. 12 (December 2013): 5064–69. http://dx.doi.org/10.1016/j.materresbull.2013.05.004.

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47

Wu, Jin, Junyou Yang, Hui Zhang, Jiansheng Zhang, Shuanglong Feng, Ming Liu, Jiangying Peng, Wen zhu, and Tao Zou. "Fabrication of Ag–Sn–Sb–Te based thermoelectric materials by MA-PAS and their properties." Journal of Alloys and Compounds 507, no. 1 (September 2010): 167–71. http://dx.doi.org/10.1016/j.jallcom.2010.07.146.

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48

Xu, Huixia, Lijun Zhang, Kaiming Cheng, Weimin Chen, and Yong Du. "Reassessment of Atomic Mobilities in fcc Cu-Ag-Sn System Aiming at Establishment of an Atomic Mobility Database in Sn-Ag-Cu-In-Sb-Bi-Pb Solder Alloys." Journal of Electronic Materials 46, no. 4 (November 29, 2016): 2119–29. http://dx.doi.org/10.1007/s11664-016-5145-6.

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49

Wang, Kaipeng, Fengjiang Wang, Ying Huang, and Kai Qi. "Comprehensive Properties of a Novel Quaternary Sn-Bi-Sb-Ag Solder: Wettability, Interfacial Structure and Mechanical Properties." Metals 9, no. 7 (July 17, 2019): 791. http://dx.doi.org/10.3390/met9070791.

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Sn-58Bi eutectic solder is the most recommended low temperature Pb-free solder but is also limited from the interfacial embrittlement of Bi segregation. Since the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides a similar melting point as Sn-58Bi eutectic, this paper systematically investigated the properties of this solder from wettability, bulk tensile properties, interfacial microstructure in solder joints with a Cu substrate, interfacial evolution in joints during isothermal aging and the shear strength on ball solder joints with effect of aging conditions. The results were also compared with Sn-58Bi solder. The wettability of solder alloys was evaluated with wetting balance testing, and the quaternary Sn-38Bi-1.5Sb-0.7Ag solder had a better wettability than Sn-58Bi solder on the wetting time. Tensile tests on bulk solder alloys indicated that the quaternary Sn-38Bi-1.5Sb-0.7Ag solder had a higher tensile strength and similar elongation compared with Sn-58Bi solder due to the finely distributed SnSb and Ag3Sn intermetallics in the solder matrix. The tensile strength of solder decreased with a decrease in the strain rate and with an increase in temperature, while the elongation of solder was independent of the temperature and strain rate. When soldering with a Cu substrate, a thin Cu6Sn5 intermetallic compound (IMC) is produced at the interface in the solder joint. Measurement on IMC thickness showed that the quaternary Sn-38Bi-1.5Sb-0.7Ag had a lower IMC growth rate during the following isothermal aging. Ball shear test on solder joints illustrated that the quaternary Sn-38Bi-1.5Sb-0.7Ag solder joints had higher shear strength than Sn-58Bi solder joints. Compared with the serious deterioration on shear strength of Sn-58Bi joints from isothermal aging, the quaternary Sn-38Bi-1.5Sb-0.7Ag solder joints presented a superior high temperature stability. Therefore, the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides better performances and the possibility to replace Sn-58Bi solder to realize low temperature soldering.

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50

Alarashi, R., A. M. Shaban, and M. Kamal. "Evaluation of electronic transport and premature failure in the melt-spun Pb-Sn-Sb-Ag rapidly solidified alloys." Materials Letters 31, no. 1-2 (May 1997): 61–65. http://dx.doi.org/10.1016/s0167-577x(96)00234-0.

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