Relevant bibliographies by topics / Ag-Sn-Sb alloy

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Book chapters
  4. Conference papers

Academic literature on the topic 'Ag-Sn-Sb alloy'

Author: Grafiati
Published: 28 June 2021
Last updated: 29 July 2025

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Journal articles on the topic "Ag-Sn-Sb alloy"

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Chen, Fang, Yun Fei Du, Rong Chang Zeng, Gui Sheng Gan, and Chang Hua Du. "Thermodynamics of Oxidation on Pb-Free Solders at Elevated Temperature." Materials Science Forum 610-613 (January 2009): 526–30. http://dx.doi.org/10.4028/www.scientific.net/msf.610-613.526.

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Based on the available thermodynamic and phase equilibria data, the thermodynamic criteria for oxidation in tin-based lead-free solders under soldering condition was deduced. The dependence of Gibbs free energy on temperature in Pb-free solder oxidation reaction was calculated by applying MATLAB program. The characteristics of oxidation reaction of a varity of solder alloy systems such as Sn-Ag, Sn-Cu, Sn-Sb, Sn-Zn, Sn-Ag-Cu and Sn-Pb eutectic alloys at elevated temperature were analyzed. The results suggested that zinc preferentially oxidized in Sn-Zn solder alloys in the elevated temperature
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Wu, C. P., D. Q. Yi, S. Goto, et al. "Oxidation of Ag-Sn-Sb alloy powders." Materials and Corrosion 65, no. 5 (2012): 522–30. http://dx.doi.org/10.1002/maco.201206542.

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Dahshan, Alaa, Horesh Kumar, and Neeraj Mehta. "Role of some modifiers on the thermo-mechanical properties of Se90In10 chalcogenide glass (ChGs)." European Physical Journal Applied Physics 94, no. 3 (2021): 31101. http://dx.doi.org/10.1051/epjap/2021210044.

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The studies on the micro-hardness of ChGs provide useful information regarding their straightforward involvement in the fabrication of sensors, fibers, and other optical elements for direct use in infrared optics. This work deals with the mechanical response of the glassy Se90In10 alloy under the influence of additives (Sn, Ag, Sb, and Ge). For this, we have determined the micro-hardness of all glassy alloys. Using the values of Vickers hardness (Hv), glass transition temperature (Tg), and present glasses, we have calculated the other significant thermo-mechanical parameters. The effect of Sn,
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Park, Won-Bum, Yong-Woo Kim, Sun-Joong Kim, and Youn-Bae Kang. "Development of Wet Chemical Analysis Technique for Tramp Elements (M = As, Pb, Sb, and Sn) in Silver-M Alloys." Korean Journal of Metals and Materials 61, no. 9 (2023): 694–703. http://dx.doi.org/10.3365/kjmm.2023.61.9.694.

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Wet chemical analysis techniques for four elements (M = As, Pb, Sb, and Sn) in Ag – M binary alloys were investigated with emphasis on the choice of solvent acid and the characteristic wavelength used in the ICP-AES (Inductively-Coupled Plasma Atomic Emission Spectrometer) analysis. The elements are representative tramp elements in ferrous scrap. The activity of these elements needs to be increased to remove them efficiently during the molten scrap refining process. The activity of these elements in the molten scrap (molten iron alloy) is usually measured by a chemical equilibration technique
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Li, Chaojun, Yanfu Yan, Tingting Gao, and Guodong Xu. "The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder." Materials 13, no. 19 (2020): 4443. http://dx.doi.org/10.3390/ma13194443.

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To obtain Sn-3.0Ag-0.5Cu-xSb (x = 0, 25, 28, and 31) high-temperature lead-free solder antimony was added to Sn-3.0Ag-0.5Cu solder. The microstructure, thermal properties, and mechanical behavior of the solder alloy prepared were studied by using JSM-5610LV scanning electron microscope, Germany STA409PC differential scanning calorimeter, AG-I250KN universal tensile testing machine, and other methods. The SEM-EDS results showed that after adding Sb, SnSb phase was formed in the β-Sn matrix phase. The newly formed SnSb phase and the existing Sb in the solder alloy can inhibit the generation of I
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Wang, Fu Li, Jing Chao Chen, and Jie Yu. "First-Principles Calculations for Electrical Proterties of the Lead Anode Plate." Advanced Materials Research 634-638 (January 2013): 1817–20. http://dx.doi.org/10.4028/www.scientific.net/amr.634-638.1817.

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Four kinds of fermi energy of lead anode plate were calculated by using first-principles. Different metals and different alloy elements of the fermi energy level were compared, the minimum electrode potential lead base alloy anode materials is known. The results calculations show that the adding alloy elements can reduce the electrode potential of the lead anode plate, four kinds of alloy systems Pb-Ag, Pb-Sb, Pb-Sr, Pb-Sn were calculated, the highest of fermi energy was Pb-Sb alloy. So the Pb-Sb alloy is expected to become the electrode potential minimum lead base alloy anode materials.
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Liu, G. X., Z. M. Guan, D. B. Williams, and M. R. Notis. "A Study of DIGM in Ag/Cu system by AEM." Proceedings, annual meeting, Electron Microscopy Society of America 48, no. 2 (1990): 416–17. http://dx.doi.org/10.1017/s042482010013568x.

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DIGM phenomenon is very similar to the diffusion process and the coupled migration of the reaction front occured in discontinuous precipitation. It is likely to postulate that DIGM may occur in the system where discontinuous precipitation appears. W. Kim and co-author have Investigated DIGM In six copper alloy systems (Ag/Cu, Mg/Cu, Sb/Cu, In/Cu, Cd/Cu and Sn/Cu) in which discontinuous precipitation has been found. In Kim s experiment, the diffusion treatments were conducted at 400 °C and 450 °C for 4 days, Kim found DIGM occurred in 4 systems, i. e. Sb/Cu, In/Cu, Cd/Cu and Sn/Cu, but in Ag/Cu
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Nur, Monika, Naoya Yamaguchi, and Fumiyuki Ishii. "Simple Model for Corrugation in Surface Alloys Based on First-Principles Calculations." Materials 13, no. 19 (2020): 4444. http://dx.doi.org/10.3390/ma13194444.

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The structural stability of M/Ag(111)–3×3R30° surface alloys is systematically investigated by using first-principles calculations, where M is a member of group III (B, Al, Ga, In, Tl), IV (C, Si, Ge, Sn, Pb), and V (N, P, As, Sb, Bi) elements. We focus on the corrugation parameter d which is determined by the height of the M atom from the Ag atom in the plane of the top-most atom, and the relation between atomic radii and corrugations in M/Ag(111) is obtained. The tendencies of the corrugation parameter d can be understood by using a simple hard spherical atomic model. We introduce a new type
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Musa, Sayyidah Amnah, Mohd Arif Anuar Mohd Salleh, and Saud Norainiza. "Zn-Sn Based High Temperature Solder - A Short Review." Advanced Materials Research 795 (September 2013): 518–21. http://dx.doi.org/10.4028/www.scientific.net/amr.795.518.

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The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high temperature solders. The lead and lead-based compound are highly toxic which is dangerous to human health and environment. The highly suitable lead-free solder candidates for replacing high Pb high temperature solder are Au-Sn, Al-Zn, Zn-Sn, Sn-Sb, and Bi-Ag solders. However, Zn-Sn based solder has highly recommended as the best candidates in replacing high lead high temperatur
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Chen, Zhiwen, Kun Ma, Li Liu, et al. "Mechanical Performance and Reliability of a Sn–Ag–Cu–Sb Alloy at Elevated Temperatures." IEEE Transactions on Components, Packaging and Manufacturing Technology 11, no. 7 (2021): 1081–87. http://dx.doi.org/10.1109/tcpmt.2021.3093562.

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Dissertations / Theses on the topic "Ag-Sn-Sb alloy"

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Klepárníková, Eliška. "Interakce poloroztavené slitiny s pevným materiálem při vzájemném pohybu." Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2019. http://www.nusl.cz/ntk/nusl-442481.

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This thesis is deals with the suitability of Ag-Sn-Sb alloy for extrusion and selection of suitable materiál for the extruder nozzle. The theoretical part of this thesis deals with the general possibilities of 3D metal printing, especially the metal printing in the semi-solid phase and with it‘s problems. The experimental part describes the development of semi-solid alloys testing device and the research od the alloy and its interactions with solid materials in mutual motion. Analyzis of mechanical and chemical influence between alloy and solid material were performed by visual investigation a
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Stang, Eric Thomas. "Constitutive Modeling of Creep in Leaded and Lead-Free Solder Alloys Using Constant Strain Rate Tensile Testing." Wright State University / OhioLINK, 2018. http://rave.ohiolink.edu/etdc/view?acc_num=wright1548338008633472.

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Book chapters on the topic "Ag-Sn-Sb alloy"

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Ramli, Mohd Izrul Izwan, Mohd Suhami A’isyah, Azliza Azani, and Nur Syahirah Mohamad Zaimi. "Effect of Sb Addition to the Solidification and Microstructure of Sn–Ag–Cu Alloys." In Springer Proceedings in Physics. Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-19-9267-4_3.

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Conference papers on the topic "Ag-Sn-Sb alloy"

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Lall, Pradeep, Geeta Limaye, Sandeep Shantaram, and Jeff Suhling. "Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot." In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/ipack2013-73246.

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Industry migration to lead-free solders has resulted in a proliferation of a wide variety of solder alloy compositions. The most popular amongst these are the Tin-Silver-Copper (Sn-Ag-Cu or SAC) family of alloys like SAC105, SAC305 etc. Recent studies have highlighted the detrimental effects of isothermal aging on the material properties of these alloys. SAC alloys have shown up to 50% reduction in their initial elastic modulus and ultimate tensile strength within a few months of elevated temperature aging. This phenomenon has posed a severe design challenge across the industry and remains a r
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Abdeyazdan, H., M. Shevchenko, J. Grogan, D. Graf, and E. Jak. "Experimental study and thermodynamic modelling of phase equilibria in the FeO-FeO1.5-SbO1.5-SiO2 system in equilibrium with metal." In 12th International Conference of Molten Slags, Fluxes and Salts (MOLTEN 2024) Proceedings. Australasian Institute of Mining and Metallurgy (AusIMM), 2024. http://dx.doi.org/10.62053/gsgh9425.

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An integrated experimental and thermodynamic modelling study of the phase equilibria in the FeO-FeO1.5-SbO1.5-SiO2 system in equilibrium with liquid Sb and Sb-Ag metal has been undertaken to develop thermodynamic model of the Na-Si-Fe-O slag system with S-Sn-Sb-Pb-As minor elements based on the experimental investigation of the selected sub-systems. New experimental phase equilibria data at 575–1600°C were obtained for this system using high-temperature equilibration of synthetic mixtures with predetermined compositions in sealed silica ampoules, Fe3O4 basket in sealed silica ampoule, or Re fo
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Fowler, Hannah. "Effects of Sb and Ag Addition on the Mechanical Behavior of Near-eutectic Sn-Bi Solder Alloys." In TMS 2024 - Orlando, Florida, United States of America - March - 2024. US DOE, 2024. https://doi.org/10.2172/2540414.

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