Academic literature on the topic '3d multilayer structures'
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Journal articles on the topic "3d multilayer structures"
Mensing, Glennys, Thomas Pearce, and David J. Beebe. "An Ultrarapid Method of Creating 3D Channels and Microstructures." JALA: Journal of the Association for Laboratory Automation 10, no. 1 (February 2005): 24–28. http://dx.doi.org/10.1016/j.jala.2004.11.006.
Full textWang, Zhipeng, Guoli Zhang, Youxin Zhu, Liqing Zhang, Xiaoping Shi, and Weiwei Wang. "Theoretical analysis of braiding strand trajectories and simulation of three-dimensional parametric geometrical models for multilayer interlock three-dimensional tubular braided preforms." Textile Research Journal 89, no. 19-20 (February 13, 2019): 4306–22. http://dx.doi.org/10.1177/0040517519826888.
Full textRecio-Sánchez, G., V. Torres-Costa, M. Manso-Silván, and R. J. Martín-Palma. "Nanostructured Porous Silicon Photonic Crystal for Applications in the Infrared." Journal of Nanotechnology 2012 (2012): 1–6. http://dx.doi.org/10.1155/2012/106170.
Full textBRISCHETTO, SALVATORE. "AN EXACT 3D SOLUTION FOR FREE VIBRATIONS OF MULTILAYERED CROSS-PLY COMPOSITE AND SANDWICH PLATES AND SHELLS." International Journal of Applied Mechanics 06, no. 06 (December 2014): 1450076. http://dx.doi.org/10.1142/s1758825114500768.
Full textPartsch, Uwe, Adrian Goldberg, Martin Ihle, Gunter Hagen, and D. Arndt. "Novel Technology Options for Multilayer-Based Ceramic Microsystems." Journal of Microelectronics and Electronic Packaging 8, no. 3 (July 1, 2011): 95–101. http://dx.doi.org/10.4071/imaps.292.
Full textWu, Guanzhao, Yangxue Liu, Zhen Yang, Nandakumar Katakam, Hossein Rouh, Sultan Ahmed, Daniel Unruh, Kazimierz Surowiec, and Guigen Li. "Multilayer 3D Chirality and Its Synthetic Assembly." Research 2019 (June 27, 2019): 1–11. http://dx.doi.org/10.34133/2019/6717104.
Full textCharfeddine, Mohamed Ali, Jean-Francis Bloch, and Patrice Mangin. "Mercury porosimetry and x-ray microtomography for 3-dimensional characterization of multilayered paper: Nanofibrillated cellulose, thermomechanical pulp, and a layered structure involving both." BioResources 14, no. 2 (February 13, 2019): 2642–50. http://dx.doi.org/10.15376/biores.14.2.2642-2650.
Full textCheng, Hao, Taeuk Lim, Hyunjoon Yoo, Jie Hu, Seonwoo Kang, Sunghoon Kim, and Wonsuk Jung. "Fabrication of Three-Dimensional Multilayer Structures of Single-Walled Carbon Nanotubes Based on the Plasmonic Carbonization." Nanomaterials 11, no. 9 (August 27, 2021): 2213. http://dx.doi.org/10.3390/nano11092213.
Full textLeclercq, J. L., P. Rojo-Romeo, C. Seassal, J. Mouette, X. Letartre, and P. Viktorovitch. "3D structuring of multilayer suspended membranes including 2D photonic crystal structures." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 21, no. 6 (2003): 2903. http://dx.doi.org/10.1116/1.1627796.
Full textDeffenbaugh, Paul I., Mike Newton, and Kenneth H. Church. "Digital Manufacturing for Electrically Functional Satlet Structures." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000210–15. http://dx.doi.org/10.4071/isom-2015-wa15.
Full textDissertations / Theses on the topic "3d multilayer structures"
Lalehparvar, Laleh. "Novel 3D multilayer rectangular waveguide structures for filter applications." Thesis, University of Westminster, 2004. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.433716.
Full textWaterton, Taylor Lindsey. "Design and manufacture of 3D nodal structures for advanced textile composites." Thesis, University of Manchester, 2007. http://www.manchester.ac.uk/escholar/uk-ac-man-scw:151244.
Full textGarst, Sebastian, and n/a. "Design and production of polymer based miniaturised bio-analytical devices." Swinburne University of Technology, 2007. http://adt.lib.swin.edu.au./public/adt-VSWT20071003.082618.
Full textKoaik, Alaa. "Comportement mécanique instantané des structures hybrides GFRP-béton." Thesis, Lyon, 2017. http://www.theses.fr/2017LYSE1145/document.
Full textAdvanced composites are increasingly used in construction thanks to their indisputable advantages such as high strength to weight ratio and ease of implementation. However, their growth is hindered by a main weak point: low stiffness. Advanced composites risk instabilities under high loads which make it not possible to exploit their full potential. Considering flexural elements, one of the solutions proposed consists in associating the composite profiles with a reinforced concrete slab. The connection of both materials is either established by bolting, bonding or a combination of both techniques.In this study, 3 different connection modes were tested on structural elements with different spans. Previously, to characterize the mechanical behavior of the interface, 35 push out specimens having bolted or bonded connections were prepared and tested. In addition, all materials used were characterized.A composite beam (Pu1) and 8 hybrid beams (PB1-PB8) were tested under 3 points bending up to failure. The results are exploited to construct and test a hybrid footbridge. 7 push out series were tested and digital image correlation was used to analyze the behavior at the interface and measure the displacement fields to determine the slip. Concrete, GFRP, bolts, the adhesive and the concrete reinforcing steel bars were all characterized.The experimental data obtained from the tests is compared to calculation results obtained by a multi-layer beam model within service limit states and at ultimate ones. Besides, a 3D finite element model was developed to provide more accurate results.The results allow distinguishing 3 behavior modes relative to the 3 connection types: the connection by mechanical studs proves to be the most efficient so far. The measurements are also compared to the results obtained by a multi-layer beam model. The differences are acceptable except in the vicinity of the interface where the deformations can be affected by the cracking of the concrete which remains difficult to predict precisely. The 3D simulations present with an excellent agreement the experiments and explain some observations obtained
Park, Hyunsoo. "ADVANCED NANOIMPRINT TECHNIQUE FOR MULTILAYER STRUCTURES AND FUNCTIONAL POLYMER APPLICATIONS." 2009. http://hdl.handle.net/1969.1/ETD-TAMU-2009-05-466.
Full textHuang, Pin-Ju, and 黃品儒. "Interfacial Reactions in the Cu/Sn/In/Ni/Cu Multilayers Structure in 3D IC Packaging." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/19362648957929850039.
Full text國立臺灣科技大學
材料科學與工程系
100
With the development of technology, the 3-D IC packaging tends to replace the traditional 2-D packaging technology in the future. Flip chip (FC) technique is one of the methods in 3-D IC packaging. Recently, the copper pillar bump was used to replace tin-lead bumps for the reason that it could provide fine pitch without bump bridging and smaller amount of solder is needed. In this study, the Cu pillar/Sn and In/Ni/Cu multilayer structure were fabricated by the electroplating method. In the solid-liquid inter-diffusion (SLID) bonding process, Sn-In was used as a bonding layer to effectively reduce the soldering temperature. We hope this Cu pillar/Sn/In/Ni/Cu multilayer structure could act as the solder to replace conventional lead-free solder and be applied in 3-D IC packaging. The results indicate (Cu,Ni)6(Sn,In)5 phase were formed on the Cu pillar side in different temperature systems and the rough layer, which can be found in the middle, was ? phase. When the reflowing temperature was 180 oC, the intermetallic compounds (IMCs) formed from Cu pillar side to Ni side were Cu pillar/(Cu,Ni)6(Sn,In)5 /?? Ni. After aging for 10 h, the (Cu,Ni)6(Sn,In)5 and (Cu,Ni)(In,Sn)2 phases were formed at interface close to the Ni side. In addition, the IMCs didn’t change and the area of ? phase was reduced when we increase aging time. In the other system, couple was reflowed at 200oC, the IMCs formed from Cu pillar side to Ni side were Cu pillar/(Cu,Ni)6(Sn,In)5/??}(Cu,Ni)6(Sn,In)5/Ni. The (Cu,Ni)6(Sn,In)5 phase was formed more rapidly than 180 oC system on the Ni side. With longer aging time, the (Cu,Ni)(In,Sn)2 was formed at the interface close to the Ni side and the ??nphase was consumed completely. When aging for 300 h, the IMCs formed from Cu pillar side to Ni side were Cu pillar/ (Cu,Ni)6(Sn,In)5/ (Cu,Ni)(In,Sn)2/Ni, which was significantly different compared to the as-reflowed.
Kulik, Victor. "Structure of Bovine Liver Catalase Solved by Electron Diffraction on Multilayered Crystals." Doctoral thesis, 2005. https://repositorium.ub.uni-osnabrueck.de/handle/urn:nbn:de:gbv:700-2005071317.
Full textBook chapters on the topic "3d multilayer structures"
Husna Khouser, G., and Yogesh Kumar Choukiker. "3D Metamaterial Multilayer Structures." In Materials Horizons: From Nature to Nanomaterials, 81–98. Singapore: Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-2267-3_5.
Full textGlukhova, Olga E., Vladislav V. Shunaev, and Michael M. Slepchenkov. "Structural and Electronic Properties of a New Multilayer Graphene/Graphane Material." In 2D and 3D Graphene Nanocomposites, 203–14. Jenny Stanford Publishing, 2019. http://dx.doi.org/10.1201/9780429201509-8.
Full textConference papers on the topic "3d multilayer structures"
Lee, Sang Hoon, Jeff Blackwood, Stacey Stone, Michael Schmidt, Mark Williamson, Woo Jun Kwon, and Sung Jae Lee. "Automated Diagonal Slice and View Solution for 3D Device Structure Analysis." In ISTFA 2018. ASM International, 2018. http://dx.doi.org/10.31399/asm.cp.istfa2018p0224.
Full textWu, Jui-Yang, C. Robert Kao, and Jenn-Ming Yang. "Mechanical Reliability Assessment of Cu_6Sn_5 Intermetallic Compound and Multilayer Structures in Cu/Sn Interconnects for 3D IC Applications." In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE, 2019. http://dx.doi.org/10.1109/ectc.2019.000-8.
Full textVertyanov, Denis V., Sergey P. Timoshenkov, Vitaly N. Sidorenko, Anton V. Pogudkin, and Igor A. Belyakov. "Effects of Multilayer Structures Made of Epoxy Compounds with Different Filler Contents on Thermo-Mechanical Stresses in 3D packages." In 2021 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (ElConRus). IEEE, 2021. http://dx.doi.org/10.1109/elconrus51938.2021.9396288.
Full textKang, Qinghua, and Altan M. Ferendeci. "Characterization of Vertical Interconnects in 3-D System in a Package." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35247.
Full textLin, Tong-Hong, Spyridon N. Daskalakis, Apostolos Georgiadis, and Manos M. Tentzeris. "Achieving Fully Autonomous System-on-Package Designs: An Embedded-on-Package 5G Energy Harvester within 3D Printed Multilayer Flexible Packaging Structures." In 2019 IEEE/MTT-S International Microwave Symposium - IMS 2019. IEEE, 2019. http://dx.doi.org/10.1109/mwsym.2019.8700931.
Full textLee, Hyun-Taek, Chung-Soo Kim, Hae-Sung Yoon, Ki-Hwan Jang, Jung-Oh Choi, and Sung-hoon Ahn. "In-Situ Characterization of Nano-Structures Fabricated by Focused Ion Beam (FIB) and Nano Particle Deposition System (NPDS)." In ASME 2014 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/detc2014-34258.
Full textHopkins, Patrick E., Justin R. Serrano, Leslie M. Phinney, Sean P. Kearney, Thomas W. Grasser, and C. Thomas Harris. "Dimensionality Analysis of Thermal Transport in Multilayer Thin Film Systems." In ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-12238.
Full textYang, Chulho, Hitesh D. Vora, and Young B. Chang. "Application of Auxetic Polymeric Structures for Body Protection." In ASME 2016 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. American Society of Mechanical Engineers, 2016. http://dx.doi.org/10.1115/smasis2016-9208.
Full textYang, Chulho, Hitesh D. Vora, and Young Bae Chang. "Evaluation of Auxetic Polymeric Structures for Use in Protective Pads." In ASME 2016 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2016. http://dx.doi.org/10.1115/imece2016-67588.
Full textTentzeris, M., and J. Laskar. "RF System-on-Package (SOP) Development for Compact Low Cost Wireless Front-End Systems." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35360.
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