Academic literature on the topic '3d multilayer structures'

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Journal articles on the topic "3d multilayer structures"

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Mensing, Glennys, Thomas Pearce, and David J. Beebe. "An Ultrarapid Method of Creating 3D Channels and Microstructures." JALA: Journal of the Association for Laboratory Automation 10, no. 1 (February 2005): 24–28. http://dx.doi.org/10.1016/j.jala.2004.11.006.

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We present a method of creating three dimensional microfluidic channel networks and freestanding microstructures using liquid phase photopolymerization techniques. The use of liquid phase microfabrication facilitates the creation of microstructured devices using low-cost materials and equipment. The ability to add multiple layers allows for complex geometries and increases the functional density of channeled devices. The multilayer technique provides a method of interconnecting layers or combining separate layers to form a truly integrated multilayered microfluidic device, as well as a means of forming multilayered freestanding structures. Because this method is based on the fundamentals of microfluidic tectonics (μFT), all components (valves, mixers, filters) compatible with μFT can be integrated into the multilayer channel networks.
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Wang, Zhipeng, Guoli Zhang, Youxin Zhu, Liqing Zhang, Xiaoping Shi, and Weiwei Wang. "Theoretical analysis of braiding strand trajectories and simulation of three-dimensional parametric geometrical models for multilayer interlock three-dimensional tubular braided preforms." Textile Research Journal 89, no. 19-20 (February 13, 2019): 4306–22. http://dx.doi.org/10.1177/0040517519826888.

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Multilayer interlock three-dimensional (3D) tubular braided composites have been widely used in propeller blades, high pressure pipelines, rocket nose cones and engine nozzles owing to prominent interlaminar shear properties, reliable damage tolerance and outstanding torsion performance. The prediction of the mechanical properties and the design of the fabric structures for the 3D braided composites are dependent on the trajectory distribution of strands and the geometrical model of the braided structure. This paper aims to build theoretical models for the braiding strand trajectories and presents a creative method to establish the parametric geometrical models for the multilayer interlock 3D tubular braided structures. Firstly, mathematical models of braiding strand trajectories are derived based on the analysis for the characteristics of carrier paths, the interlacing and interlocking of braided structures and the motion of braiding strands. The mathematical models are then developed to establish parametric expressions for multilayer interlock 3D tubular braided structures by the advanced development of UG NX®. In addition, the models of corresponding braiding strand trajectories and braiding structures can be obtained automatically in the simulation environment with the modification of design parameters. Finally, the established models are compared with the carbon fiber braided specimen. The results show that the innovative parametric geometric models of the multilayer interlock 3D tubular braided structures accurately describe the key characteristics of the preform.
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Recio-Sánchez, G., V. Torres-Costa, M. Manso-Silván, and R. J. Martín-Palma. "Nanostructured Porous Silicon Photonic Crystal for Applications in the Infrared." Journal of Nanotechnology 2012 (2012): 1–6. http://dx.doi.org/10.1155/2012/106170.

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In the last decades great interest has been devoted to photonic crystals aiming at the creation of novel devices which can control light propagation. In the present work, two-dimensional (2D) and three-dimensional (3D) devices based on nanostructured porous silicon have been fabricated. 2D devices consist of a square mesh of 2 μm wide porous silicon veins, leaving5×5 μm square air holes. 3D structures share the same design although multilayer porous silicon veins are used instead, providing an additional degree of modulation. These devices are fabricated from porous silicon single layers (for 2D structures) or multilayers (for 3D structures), opening air holes in them by means of 1 KeV argon ion bombardment through the appropriate copper grids. For 2D structures, a complete photonic band gap for TE polarization is found in the thermal infrared range. For 3D structures, there are no complete band gaps, although several new partial gaps do exist in different high-symmetry directions. The simulation results suggest that these structures are very promising candidates for the development of low-cost photonic devices for their use in the thermal infrared range.
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BRISCHETTO, SALVATORE. "AN EXACT 3D SOLUTION FOR FREE VIBRATIONS OF MULTILAYERED CROSS-PLY COMPOSITE AND SANDWICH PLATES AND SHELLS." International Journal of Applied Mechanics 06, no. 06 (December 2014): 1450076. http://dx.doi.org/10.1142/s1758825114500768.

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A 3D free vibration analysis of multilayered structures is proposed. An exact solution is developed for the differential equations of equilibrium written in general orthogonal curvilinear coordinates. The equations consider a geometry for shells without simplifications and allow the analysis of spherical shell panels, cylindrical shell panels, cylindrical closed shells and plates. The method is based on a layer-wise approach, the continuity of displacements and transverse shear/normal stresses is imposed at the interfaces between the layers of the structures. Results are given for multilayered composite and sandwich plates and shells. A free vibration analysis is proposed for a number of vibration modes, thickness ratios, imposed wave numbers, geometries and multilayer configurations embedding isotropic and orthotropic composite materials. These results can also be used as reference solutions for plate and shell 2D models developed for the analysis of multilayered structures.
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Partsch, Uwe, Adrian Goldberg, Martin Ihle, Gunter Hagen, and D. Arndt. "Novel Technology Options for Multilayer-Based Ceramic Microsystems." Journal of Microelectronics and Electronic Packaging 8, no. 3 (July 1, 2011): 95–101. http://dx.doi.org/10.4071/imaps.292.

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Ceramic multilayer technologies such as LTCC (low temperature cofired ceramics) or HTCC (high temperature cofired ceramics) are applied for the fabrication of highly integrated ceramic microelectronic packages. Furthermore, ceramic multilayer technologies offer the possibility of additionally integrating 3D structures for multilayer-based microsystems. This paper presents a new machine for tape/multilayer structuring that combines micro punching tools and micro UV-laser ablation/cutting. The application for the production of different multilayer-based components is described (e.g., LTCC-based PEM fuel cell system, LTCC-based pressure sensors). Aerosol jet printing is a new technology, for example, for rapid prototyping for LTCC multilayer and 3D deposition of functional layers on LTCC. Advantages and limitations of the technology are discussed.
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Wu, Guanzhao, Yangxue Liu, Zhen Yang, Nandakumar Katakam, Hossein Rouh, Sultan Ahmed, Daniel Unruh, Kazimierz Surowiec, and Guigen Li. "Multilayer 3D Chirality and Its Synthetic Assembly." Research 2019 (June 27, 2019): 1–11. http://dx.doi.org/10.34133/2019/6717104.

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3D chirality of sandwich type of organic molecules has been discovered. The key element of this chirality is characterized by three layers of structures that are arranged nearly in parallel fashion with one on top and one down from the center plane. Individual enantiomers of these molecules have been fully characterized by spectroscopies with their enantiomeric purity measured by chiral HPLC. The absolute configuration was unambiguously assigned by X-ray diffraction analysis. This is the first multilayer 3D chirality reported and is anticipated to lead to a new research area of asymmetric synthesis and catalysis and to have a broad impact on chemical, medicinal, and material sciences in future.
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Charfeddine, Mohamed Ali, Jean-Francis Bloch, and Patrice Mangin. "Mercury porosimetry and x-ray microtomography for 3-dimensional characterization of multilayered paper: Nanofibrillated cellulose, thermomechanical pulp, and a layered structure involving both." BioResources 14, no. 2 (February 13, 2019): 2642–50. http://dx.doi.org/10.15376/biores.14.2.2642-2650.

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Mercury intrusion porosimetry (MIP) is an inexpensive and common technique to characterize porous structures like paper. One major limitation of MIP is the lack of information about the arrangement of pores in the structure, information that is particularly relevant for multilayer structures such as thickness-structured paper. In this article, results from Synchrotron X-ray 3D microtomography are combined with MIP data to provide in-depth and improved information about the structures.
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Cheng, Hao, Taeuk Lim, Hyunjoon Yoo, Jie Hu, Seonwoo Kang, Sunghoon Kim, and Wonsuk Jung. "Fabrication of Three-Dimensional Multilayer Structures of Single-Walled Carbon Nanotubes Based on the Plasmonic Carbonization." Nanomaterials 11, no. 9 (August 27, 2021): 2213. http://dx.doi.org/10.3390/nano11092213.

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We developed a complex three-dimensional (3D) multilayer deposition method for the fabrication of single-walled carbon nanotubes (SWCNTs) using vacuum filtration and plasmonic carbonization without lithography and etching processes. Using this fabrication method, SWCNTs can be stacked to form complex 3D structures that have a large surface area relative to the unit volume compared to the single-plane structure of conventional SWCNTs. We characterized 3D multilayer SWCNT patterns using a surface optical profiler, Raman spectroscopy, sheet resistance, scanning electron microscopy, and contact angle measurements. Additionally, these carbon nanotube (CNT) patterns showed excellent mechanical stability even after elastic bending tests more than 1000 times at a radius of 2 mm.
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Leclercq, J. L., P. Rojo-Romeo, C. Seassal, J. Mouette, X. Letartre, and P. Viktorovitch. "3D structuring of multilayer suspended membranes including 2D photonic crystal structures." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 21, no. 6 (2003): 2903. http://dx.doi.org/10.1116/1.1627796.

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Deffenbaugh, Paul I., Mike Newton, and Kenneth H. Church. "Digital Manufacturing for Electrically Functional Satlet Structures." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000210–15. http://dx.doi.org/10.4071/isom-2015-wa15.

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3D printing structures is natural for the layer by layer approach. Using a single type of material and building complex structures is not optimized but it is mature. This digital approach to manufacturing has the advantages of lighter structures that maintain strength and can also address the emerging custom market. While these are important contributions, adding electrically functional characteristics to the structures will open new opportunities for next generation products. In the case of the presented materials, the target application is small satellite or Satlets. Adding electronics to 3D structures is not optimized or mature and therefore studying this will be important to understand the potential and the obstacles that must be addressed. Utilizing the combination of 3D printing and printed electronics, we printed a number of device demonstrations the show it is feasible to make diverse shapes with functional electronics. Demonstrations included 3D printed multilayer ceramic Ethernet harness, 3D printed plastic RF controlled impedance interconnect and USB harness and finally 3D printed connectors. Data will be presented on mechanical integrity of printed structures and electrical performance.
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Dissertations / Theses on the topic "3d multilayer structures"

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Lalehparvar, Laleh. "Novel 3D multilayer rectangular waveguide structures for filter applications." Thesis, University of Westminster, 2004. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.433716.

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Waterton, Taylor Lindsey. "Design and manufacture of 3D nodal structures for advanced textile composites." Thesis, University of Manchester, 2007. http://www.manchester.ac.uk/escholar/uk-ac-man-scw:151244.

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Traditional weaving technologies have been utilised over the past twenty-to-thirty years in producing woven textile components that meet engineering requirements through the interlacement of high performance yarns such as carbon, glass and Kevlar. The end performance properties and lightweight characteristics of these fabrics have been adapted within the development of both flat multilevel and shaped configurations for the composites industry. The purpose of the present research required the employment of conventional weaving technologies with limited modifications for the production of 3D woven textile preforms in a variety of truss like configurations; therefore, generating a generic procedure for all yarn combinations and strut and node dimensions for production on dissimilar jacquard looms. The ultimate driving force behind the research was to produce a truss like configuration for the aerospace industry incorporating the design criterion of solid and hollow woven counterparts. This would enable the end truss configuration to have two functions; the first being a lightweight structure by the elimination of bonding applications, through the utilisation of a fully integrated fabrication process; secondly to incorporate hollow struts for a novel storage solution.
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Garst, Sebastian, and n/a. "Design and production of polymer based miniaturised bio-analytical devices." Swinburne University of Technology, 2007. http://adt.lib.swin.edu.au./public/adt-VSWT20071003.082618.

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The aim to provide preventive healthcare and high quality medical diagnostics and treatment to an increasingly ageing population caused a rapidly increasing demand for point-of-care diagnostic devices. Disposables have an advantage over re-usable units as cross-contamination is avoided, no cleaning and sterilising of equipment is required and devices can be used out of centralised laboratories. To remain cost-effective, costs for disposables should be kept low. This makes polymer materials an obvious choice. One method for the realisation of fluidic micro devices is the stacking of several layers of microstructured polymer films. Reel-to-reel manufacturing is a promising technique for high-volume manufacturing of disposable polymer bio-analytical devices. Polyethylene terephthalate (PET) and cycloolefin copolymer (COC) were selected as suitable polymer substrate materials and polydimethyl siloxane (PDMS) as membrane layer. Bonding of polymer films with the help of adhesives carries the risk of channel blocking. Despite this drawback, no other method of bonding PDMS to a structural layer could be identified. Bonding with solvents avoids channel blocking issues, but adversely affects biocompatibility. Thermal diffusion processes enable bonding of COC and PET without the use of any auxiliary material. The extensive process times requires for thermal diffusion bonding can be considerably shortened by pre-treating the material with plasma or UV exposure. Welding with the use of a laser energy absorbing dye was demonstrated to be particularly suitable for selective bonding around channels and reservoirs. None of the assessed bonding methods provide a generic solution to all bonding applications. Instead, the selection of an appropriate technique depends on the intended application and the required level of biocompatibility. Since this selection has implications on the feasibility and reliability of microfluidic structures on the device, design rules which ensure design for production have to be established and followed.
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Koaik, Alaa. "Comportement mécanique instantané des structures hybrides GFRP-béton." Thesis, Lyon, 2017. http://www.theses.fr/2017LYSE1145/document.

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L'utilisation des composites dans la construction des bâtiments ou des ouvrages d'art est de plus en plus importante car ces matériaux présentent des atouts indiscutables comme un très bon rapport performance / poids ou une facilité de mise en oeuvre. Cependant, leur essor est ralenti par certaines faiblesses dont l'une des plus importantes est leur souplesse qui induit des déplacements élevés et des risques d'instabilités importants qui ne permettent pas d'exploiter tout le potentiel de ces matériaux. Dans le cas d'éléments de structure fléchis, une des solutions consiste à associer les profilés composites à une dalle en béton armé. La connexion est établie par des butées mécaniques, par collage, ou l'association des deux. L'objectif général de ce travail est d'étudier le comportement des structures mixtes GFRP-Béton fléchies sous chargement statique instantané : Cette étude comporte un volet expérimental lourd et un volet de modélisation numérique. Elle a été abordée à 3 échelles : matériaux, interface, et structure. Trois modes de connexion ont été exploités. Sur le plan expérimental, nous avons d'abord caractérisé tous les matériaux utilisés : composite, béton, adhésif, acier des armatures et des connecteurs. Puis, la caractérisation à l'échelle de l'interface a été effectuée par l'essai push-out dans différentes configurations (7 séries d'essais au total). Enfin, le comportement à l'échelle d'éléments de structure a été étudié sur des mono-poutres pour des portées allant de 2 m à 4.8 m, sur des poutres composites seules ou sur des poutres mixtes (10 poutres au total). Une passerelle bi-poutre de 4.8 m de portée a également été testée dans la même configuration et jusqu'à la ruine. La modélisation du comportement de ces poutres hybrides a été effectuée selon 2 cas théoriques. Elles ont d'abord été modélisées dans le cadre de la théorie des poutres multicouches, dans le domaine élastique et à l'approche de la ruine. Selon le mode de connexion, le glissement à l'interface est pris en compte ou négligé. Ces poutres ont également été modélisées par la MEF en utilisant des éléments volumiques et en considérant une connexion parfaite. Les résultats d'essais montrent le comportement correspondant à chaque mode de connexion : la connexion par butées mécaniques simples est à ce jour celle qui s'avère la plus efficace. Les écarts modèle / calculs restent acceptables sauf à proximité de l'interface où les déformations peuvent être affectées par la fissuration du béton qui reste difficile à prédire de façon précise. La simulation numérique donne des valeurs très proches de la réalité et répond aux questions posées lors de l'expérience
Advanced composites are increasingly used in construction thanks to their indisputable advantages such as high strength to weight ratio and ease of implementation. However, their growth is hindered by a main weak point: low stiffness. Advanced composites risk instabilities under high loads which make it not possible to exploit their full potential. Considering flexural elements, one of the solutions proposed consists in associating the composite profiles with a reinforced concrete slab. The connection of both materials is either established by bolting, bonding or a combination of both techniques.In this study, 3 different connection modes were tested on structural elements with different spans. Previously, to characterize the mechanical behavior of the interface, 35 push out specimens having bolted or bonded connections were prepared and tested. In addition, all materials used were characterized.A composite beam (Pu1) and 8 hybrid beams (PB1-PB8) were tested under 3 points bending up to failure. The results are exploited to construct and test a hybrid footbridge. 7 push out series were tested and digital image correlation was used to analyze the behavior at the interface and measure the displacement fields to determine the slip. Concrete, GFRP, bolts, the adhesive and the concrete reinforcing steel bars were all characterized.The experimental data obtained from the tests is compared to calculation results obtained by a multi-layer beam model within service limit states and at ultimate ones. Besides, a 3D finite element model was developed to provide more accurate results.The results allow distinguishing 3 behavior modes relative to the 3 connection types: the connection by mechanical studs proves to be the most efficient so far. The measurements are also compared to the results obtained by a multi-layer beam model. The differences are acceptable except in the vicinity of the interface where the deformations can be affected by the cracking of the concrete which remains difficult to predict precisely. The 3D simulations present with an excellent agreement the experiments and explain some observations obtained
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Park, Hyunsoo. "ADVANCED NANOIMPRINT TECHNIQUE FOR MULTILAYER STRUCTURES AND FUNCTIONAL POLYMER APPLICATIONS." 2009. http://hdl.handle.net/1969.1/ETD-TAMU-2009-05-466.

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Three-dimensional (3D) polymer structures are very attractive because the extra structural dimension can provide denser integration and superior performance to accomplish complex tasks. Successful fabrication of 3D multilayer microstructures in thermoplastic polymers using optimized nanoimprint lithography techniques such as layer-transfer and transfer-bonding methods are developed in this dissertation work. The capability and flexibility of the techniques developed here are expected to have deep impact on the applications of soft materials such as polymers including functional polymers in micro- and nanofabricated devices and systems. Although NIL technique is developing rapidly in recent years, there are still issues that need to be addressed for broader adoption of the nanoimprint technique. One of the problems is the residual layer that remains in the polymer pattern after nanoimprint. The conventional approach, oxygen reactive-ion-etching (RIE) process, to remove the residual layers, increases the cost and lowers the overall throughput of the nanoimprint process. More severely, it can degrade or even damage the functional polymers. In order to overcome these problems, new residual layer removal techniques need to be developed. In this dissertation, two methods are newly developed, which do not negatively affect the chemistry of the polymer materials. The techniques are suitable for all thermoplastic polymers, particularly functional polymers. Another advantage of nanoimprint is its ability to directly create functional polymers structures. This is because thermal nanoimprint only needs temperature and pressure for pattern replication, which both are benign to functional polymers. This feature combined with newly developed techniques such as transfer-bonding and residue removal techniques opens up the possibilities in nondestructive functional polymers patterning at the micro- and nanoscale for novel applications in electronics, optoelectronics, photonics and bioengineering. Finally, several applications of 3D multilayer structures fabricated by the techniques developed in this dissertation are demonstrated. The first application is a multilayer metal-dielectric-metal structure with embedded microfluidic channels. This structure can be used as an on-chip tunable filter for integrated microfluidic applications. The second application is a multilayer microfluidic channels in which each layer has a different channel size. This device can be used for particle separation and filtration based on lateral fluid flow.
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Huang, Pin-Ju, and 黃品儒. "Interfacial Reactions in the Cu/Sn/In/Ni/Cu Multilayers Structure in 3D IC Packaging." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/19362648957929850039.

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碩士
國立臺灣科技大學
材料科學與工程系
100
With the development of technology, the 3-D IC packaging tends to replace the traditional 2-D packaging technology in the future. Flip chip (FC) technique is one of the methods in 3-D IC packaging. Recently, the copper pillar bump was used to replace tin-lead bumps for the reason that it could provide fine pitch without bump bridging and smaller amount of solder is needed. In this study, the Cu pillar/Sn and In/Ni/Cu multilayer structure were fabricated by the electroplating method. In the solid-liquid inter-diffusion (SLID) bonding process, Sn-In was used as a bonding layer to effectively reduce the soldering temperature. We hope this Cu pillar/Sn/In/Ni/Cu multilayer structure could act as the solder to replace conventional lead-free solder and be applied in 3-D IC packaging. The results indicate (Cu,Ni)6(Sn,In)5 phase were formed on the Cu pillar side in different temperature systems and the rough layer, which can be found in the middle, was ? phase. When the reflowing temperature was 180 oC, the intermetallic compounds (IMCs) formed from Cu pillar side to Ni side were Cu pillar/(Cu,Ni)6(Sn,In)5 /?? Ni. After aging for 10 h, the (Cu,Ni)6(Sn,In)5 and (Cu,Ni)(In,Sn)2 phases were formed at interface close to the Ni side. In addition, the IMCs didn’t change and the area of ? phase was reduced when we increase aging time. In the other system, couple was reflowed at 200oC, the IMCs formed from Cu pillar side to Ni side were Cu pillar/(Cu,Ni)6(Sn,In)5/??}(Cu,Ni)6(Sn,In)5/Ni. The (Cu,Ni)6(Sn,In)5 phase was formed more rapidly than 180 oC system on the Ni side. With longer aging time, the (Cu,Ni)(In,Sn)2 was formed at the interface close to the Ni side and the ??nphase was consumed completely. When aging for 300 h, the IMCs formed from Cu pillar side to Ni side were Cu pillar/ (Cu,Ni)6(Sn,In)5/ (Cu,Ni)(In,Sn)2/Ni, which was significantly different compared to the as-reflowed.
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Kulik, Victor. "Structure of Bovine Liver Catalase Solved by Electron Diffraction on Multilayered Crystals." Doctoral thesis, 2005. https://repositorium.ub.uni-osnabrueck.de/handle/urn:nbn:de:gbv:700-2005071317.

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The high resolution structure of protein molecules and protein-protein complexes is important to investigate their functions. Today, large 3D or 2D crystals are required to obtain protein structures by X-ray crystallography or conventional Electron Microscopy, respectively. However, production of such crystals of good quality is a solely empirical procedure, which relies on screening numerous crystallization conditions. At the same time, multilayered protein crystals are often a by-product of attempts to grow 3D or 2D crystals and could be obtained more easily. So far, multilayered protein crystals have not been used in electron microscopy for structure determination, as the interpretation of an electron diffraction pattern is rather complicated. In this thesis we present the first protein structure bovine liver catalase at 4 Å resolution solved using electron diffraction data from multilayered crystals. 55 diffraction patterns (17 tilt series) were recorded and used for the reconstruction. The tilt geometry of each individual diffraction pattern was determined by a least-squares algorithm or Laue zone analysis to perform spot indexing. The phase problem was solved by molecular replacement. The influence of the missing data cone on the self-rotation function and interpretation of reconstructed map is discussed.
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Book chapters on the topic "3d multilayer structures"

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Husna Khouser, G., and Yogesh Kumar Choukiker. "3D Metamaterial Multilayer Structures." In Materials Horizons: From Nature to Nanomaterials, 81–98. Singapore: Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-2267-3_5.

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Glukhova, Olga E., Vladislav V. Shunaev, and Michael M. Slepchenkov. "Structural and Electronic Properties of a New Multilayer Graphene/Graphane Material." In 2D and 3D Graphene Nanocomposites, 203–14. Jenny Stanford Publishing, 2019. http://dx.doi.org/10.1201/9780429201509-8.

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Conference papers on the topic "3d multilayer structures"

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Lee, Sang Hoon, Jeff Blackwood, Stacey Stone, Michael Schmidt, Mark Williamson, Woo Jun Kwon, and Sung Jae Lee. "Automated Diagonal Slice and View Solution for 3D Device Structure Analysis." In ISTFA 2018. ASM International, 2018. http://dx.doi.org/10.31399/asm.cp.istfa2018p0224.

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Abstract The cross-sectional and planar analysis of current generation 3D device structures can be analyzed using a single Focused Ion Beam (FIB) mill. This is achieved using a diagonal milling technique that exposes a multilayer planar surface as well as the cross-section. this provides image data allowing for an efficient method to monitor the fabrication process and find device design errors. This process saves tremendous sample-to-data time, decreasing it from days to hours while still providing precise defect and structure data.
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Wu, Jui-Yang, C. Robert Kao, and Jenn-Ming Yang. "Mechanical Reliability Assessment of Cu_6Sn_5 Intermetallic Compound and Multilayer Structures in Cu/Sn Interconnects for 3D IC Applications." In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE, 2019. http://dx.doi.org/10.1109/ectc.2019.000-8.

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Vertyanov, Denis V., Sergey P. Timoshenkov, Vitaly N. Sidorenko, Anton V. Pogudkin, and Igor A. Belyakov. "Effects of Multilayer Structures Made of Epoxy Compounds with Different Filler Contents on Thermo-Mechanical Stresses in 3D packages." In 2021 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (ElConRus). IEEE, 2021. http://dx.doi.org/10.1109/elconrus51938.2021.9396288.

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Kang, Qinghua, and Altan M. Ferendeci. "Characterization of Vertical Interconnects in 3-D System in a Package." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35247.

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A novel RF MEMS integration technology was developed to achieve the three-dimensional integration of microwave and millimeter-wave components and sub-circuits with improved performance using multilayer vertical interconnects. This technology, which allows planar circuits to be monolithically stacked vertically in three dimensions (3D), provides one of the major initial steps in the realization of a “system in a package.” To process high-aspect-ratio via interconnects in 3D MMIC multilayer circuitry, combination of unique microelectronic and traditional MEMS microfabrication technologies were used. Based on these techniques, a set of test structures were successfully fabricated to facilitate the vertical interconnect characterization. Experimental results revealed that at microwave frequencies, e.g. X band (8–12 GHz), the vertical interconnect discontinuities contributed significantly to the insertion loss and the phase change. With the available advanced conductor loss models, lumped-element equivalent circuit models were derived from the via module measurements. Using quarter wavelength T-junction resonator structures, polyimide was also characterized for its microwave properties over a wide frequency range. Multilayer vertically interconnected transmission line circuits were monolithically processed and used to verify the derived electrical models.
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Lin, Tong-Hong, Spyridon N. Daskalakis, Apostolos Georgiadis, and Manos M. Tentzeris. "Achieving Fully Autonomous System-on-Package Designs: An Embedded-on-Package 5G Energy Harvester within 3D Printed Multilayer Flexible Packaging Structures." In 2019 IEEE/MTT-S International Microwave Symposium - IMS 2019. IEEE, 2019. http://dx.doi.org/10.1109/mwsym.2019.8700931.

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Lee, Hyun-Taek, Chung-Soo Kim, Hae-Sung Yoon, Ki-Hwan Jang, Jung-Oh Choi, and Sung-hoon Ahn. "In-Situ Characterization of Nano-Structures Fabricated by Focused Ion Beam (FIB) and Nano Particle Deposition System (NPDS)." In ASME 2014 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/detc2014-34258.

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Nano particle deposition system (NPDS) had been developed for the creation of micro/nano structures with multimaterials in order to develop the micro/nano devices on the basis of specific localized surface on the multilayer. However, micro structures fabricated by NPDS show different mechanical properties when it compared to bulk material because of its porous and uneven deposition structure. To achieve reasonable mechanical properties of the structure fabricated by nanoscale 3D printing system, it requires in-situ mechanical property test method. Herein, a new approach for in-situ nanomechanical characterization system using microforce sensor and nanomanipulator installed in focused ion beam system. In this research, experimental setup for mechanical characterization was developed and mechanical property test was done in Focused Ion Beam (FIB) system. The specimen was fabricated by FIB milling process, then manipulation and compression processes are operated by this characterization system with real time imaging. The test was done for silver microstructures fabricated by NPDS and results show weaker hardness and smaller young’s modulus than bulk material.
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7

Hopkins, Patrick E., Justin R. Serrano, Leslie M. Phinney, Sean P. Kearney, Thomas W. Grasser, and C. Thomas Harris. "Dimensionality Analysis of Thermal Transport in Multilayer Thin Film Systems." In ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-12238.

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Pump-probe transient thermoreflectance (TTR) techniques are powerful tools for measuring thermophysical properties of thin films, such as thermal conductivity, Λ, or thermal boundary conductance, G. This paper examines the assumption of one-dimensional heating on Λ and G determination in nanostructures using a pump-probe transient thermoreflectance technique. The traditionally used one dimensional and radial (3D) models are reviewed. To test the assumptions of the thermal models, experimental data from Al films on bulk substrates (Si and glass) are taken with the TTR technique. This analysis is extended to thin film multilayer structures. Results show that at 11 MHz modulation frequency, thermal transport is indeed one dimensional. Error among the various models arises due to pulse accumulation and not accounting for residual heating.
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8

Yang, Chulho, Hitesh D. Vora, and Young B. Chang. "Application of Auxetic Polymeric Structures for Body Protection." In ASME 2016 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. American Society of Mechanical Engineers, 2016. http://dx.doi.org/10.1115/smasis2016-9208.

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Negative Poisson’s ratio (NPR) materials, also known as auxetic materials, have many promising application areas. In recent years, various auxetic material structures have been designed and fabricated for diverse applications that utilized normal materials which follow Hooke’s law but still show the properties of negative Poisson’s ratios. In light of this, efforts are made to apply auxetic material structures to body protection pads that are comfortable to wear and effective in protecting body parts by reducing impact force and preventing injuries in high-risk individuals such as elderly people, industry workers, law enforcement and military personnel, and sport players. For those people, blunt impacts such as falls, bullets, and blast wave may reduce quality of life, increase the possibility of early death and generate an extremely high medical costs. Therefore, it is important to develop new body protectors that best combine each individual’s requirements of wearing comfort (flexible, light weight), ease of fitting (customized), ensured protection, and cost-effectiveness. The developed protection pad would be made from multilayer materials with an adaptive structure to achieve a unique multifunctional properties such as high hardness, impact toughness, light weight, excellent shock absorption, self-assembly suitable for the needs. Particularly, an integrated computational (finite element analysis) approach is used to investigate the effect of three material structures (honeycomb or flexin structure, re-entrant hexagonal cells or reflexin structure, and arrowhead structure) in combination with three polymeric materials (Polylactic acid (PLA) and two thermoplastic polyurethane (TPU) materials). Efforts are made to relate the individual and/or combined effect of auxetic structure and materials to the overall stiffness and shock-absorption performance of the body protection pads. Initially, parametric 3D CAD models of auxetic polymeric structures are developed. Later, key structural characteristics of protectors are evaluated through static analyses of FEA models. Impact/shock analyses are conducted to validate the results obtained from the static analyses. The mechanism for ideal input force distribution or shunting is suggested for designing protectors using various shapes, thicknesses, and materials of auxetic materials to reduce the risk of injury. The results show that the auxetic material can be considered as an effective material structure for body protection pads.
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Yang, Chulho, Hitesh D. Vora, and Young Bae Chang. "Evaluation of Auxetic Polymeric Structures for Use in Protective Pads." In ASME 2016 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2016. http://dx.doi.org/10.1115/imece2016-67588.

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Auxetic materials, known as materials with negative Poisson’s ratio (NPR), have many promising application areas. However, there are only few natural and man-made materials such as certain living bone tissues, certain rocks and minerals, polymeric honeycombs, microporous polytetrafluoroethylene (PTFE), foams, and carbon-fiber-reinforced epoxy composite laminate panels that possess this property. In recent years, various auxetic material structures have been designed and fabricated for diverse applications that utilized normal materials which follow Hooke’s law but still show the NPR properties. One of the applications is body protection pads that are comfortable to wear and effective in protecting body parts by reducing impact force and preventing injuries in high-risk individuals such as elderly people, industry workers, law enforcement and military personnel, and sports players. It is important to develop new body protectors that best combine each individual’s requirements for wearing comfort (flexible, light-weight), ease of fitting (customized), ensured protection, and cost-effectiveness. The protection pad would be made from multilayer materials and adaptive structures to achieve unique multifunctional properties such as high hardness, impact toughness, light weight, and excellent shock absorption suitable for the needs. This paper reports an integrated theoretical, computational (finite element analysis), and experimental investigation conducted for typical auxetic polymeric materials that exhibit negative Poisson’s ratio (NPR) effect. Parametric 3D CAD models of auxetic polymeric structures such as re-entrant hexagonal cells and arrowhead were developed. Then, key structural characteristics of protectors were evaluated through static analyses of FEA models. In addition, impact/shock analyses were conducted through dynamic analyses of FEA models to validate the results obtained from the static analyses. Particularly, an advanced additive manufacturing (3D printing) technique was used to build prototypes of the auxetic polymeric structures. Specifically, three different materials typically used for FDM (Fused Deposition Modeling) technology such as Polylactic acid (PLA) and thermoplastic polyurethane (TPU) material (NinjaFlex® and SemiFlex®) were used for different stiffness and shock-absorption performances. The 3D printed prototypes were then tested and the results were compared with the computational prediction. The results showed that the auxetic material can be effective for body protection pads. Each structure and material had unique structural properties such as stiffness, Poisson’s ratio, and efficiency in shock absorption. Particularly, auxtetic structures showed better shock absorption performance than non-auxetic ones. The mechanism for ideal input force distribution or shunting could be suggested for designing protectors using various shapes, thicknesses, and materials of auxetic materials to reduce the risk of injury.
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Tentzeris, M., and J. Laskar. "RF System-on-Package (SOP) Development for Compact Low Cost Wireless Front-End Systems." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35360.

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This paper presents the development of RF System-on-Package (SOP) architectures for compact and low cost wireless radio front-end systems. A novel 3D integration approach for SOP-based solutions for wireless communication applications is proposed and utilized for the implementation of a C band Wireless LAN (WLAN) RF front-end module by means of stacking LTCC substrates using μBGA technology. LTCC designs of high-performance multilayer embedded bandpass filters and novel stacked cavity-backed patch antennas are also reported. In addition, the fabrication of very high Q-factor inductors and embedded filter in organic substrates demonstrate the satisfactory performance of multilayer organic packages. The well known full-wave numerical techniques of FDTD and MRTD are used for the modeling of adjacent lines crosstalk, of the Q-factor of embedded passives and for the accurate simulation of MEMS structures.
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