Books on the topic '3D device'
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(Firm), Fred'k Leadbeater, ed. Leadbeater's improved furnace or air-feeding device: Patented in U.S. July 17th, 1888, in Canada October 3d, 1888 ... [S.l: s.n., 1986.
Find full textLyang, Viktor. CAD programming: Spatial modeling of the air cooling device in the Autodesk Inventor environment. ru: INFRA-M Academic Publishing LLC., 2022. http://dx.doi.org/10.12737/991757.
Full textZatt, Bruno, Muhammad Shafique, Sergio Bampi, and Jörg Henkel. 3D Video Coding for Embedded Devices. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-6759-5.
Full textFranke, Jörg, ed. Three-Dimensional Molded Interconnect Devices (3D-MID). München: Carl Hanser Verlag GmbH & Co. KG, 2014. http://dx.doi.org/10.3139/9781569905524.
Full textWu, Yung-Chun, and Yi-Ruei Jhan. 3D TCAD Simulation for CMOS Nanoeletronic Devices. Singapore: Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-3066-6.
Full textLi, Simon, and Yue Fu. 3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-0481-1.
Full textauthor, Samuel Kumudini, Suriya Women's Development Centre (Batticaloa, Sri Lanka), and International Centre for Ethnic Studies, eds. 3D things: Devices, technologies, and women's organising in Sri Lanka. Batticaloa, Sri Lanka: Suriya Women's Development Centre & International Centre for Ethnic Studies, 2015.
Find full textZatt, Bruno. 3D Video Coding for Embedded Devices: Energy Efficient Algorithms and Architectures. New York, NY: Springer New York, 2013.
Find full textElectrical modeling and design for 3D integration: 3D integrated circuits and packaging signal integrity, power integrity, and EMC. Hoboken, N.J: Wiley-IEEE Press, 2011.
Find full textSusanna, Orlic, Meerholz Klaus, and SPIE (Society), eds. Organic 3D photonics materials and devices: 28 August, 2007, San Diego, California, USA. Bellingham, Wash: SPIE, 2007.
Find full textOrlic, Susanna. Organic 3D photonics materials and devices II: 12 August 2008, San Diego, California, USA. Edited by SPIE (Society). Bellingham, Wash: SPIE, 2008.
Find full textAndrew, Odewahn, and Jepson Brian 1967-, eds. Making things see: 3D vision with Kinect, Processing, Arduino, and MakerBot. Sebastopol, CA: O'Reilly, 2012.
Find full textAvram, Nicolae M. Optical Properties of 3d-Ions in Crystals: Spectroscopy and Crystal Field Analysis. Berlin, Heidelberg: Springer Berlin Heidelberg, 2013.
Find full textThree-dimensional molded interconnect devices (3D-MID): Materials, manufacturing, assembly, and applications for injection molded circuit carriers. Munich: Hanser Publishers, 2014.
Find full textBrowning, Dan. Cube: Detailed Design Spec for a 3D Volumetric Solid State Display Device. Clockwork Press/Vesta Imprints, 2021.
Find full textLindlein, Norbert, Karlheinz Bock, Jörg Franke, Ludger Overmeyer, and Stefan Kaierle. Optical Polymer Waveguides: From the Design to the Final 3D-Opto Mechatronic Integrated Device. Springer International Publishing AG, 2022.
Find full textGarreton, Gilda. A hybrid approach to 2D and 3D mesh generation for semiconductor device simulation (Series in Microelectronics). Hartung-Gorre Verlag, 1999.
Find full text3D Printed Microfluidic Devices. MDPI, 2018. http://dx.doi.org/10.3390/books978-3-03897-468-0.
Full textXiao, Hong. 3D IC Devices, Technologies, and Manufacturing. SPIE, 2016. http://dx.doi.org/10.1117/3.2234473.
Full textXiao, Hong. 3D IC Devices, Technologies, and Manufacturing. SPIE, 2016.
Find full textWu, Yung-Chun, and Yi-Ruei Jhan. 3D TCAD Simulation for CMOS Nanoeletronic Devices. Springer, 2017.
Find full textWu, Yung-Chun, and Yi-Ruei Jhan. 3D TCAD Simulation for CMOS Nanoeletronic Devices. Springer, 2018.
Find full textWu, Yung-Chun, and Yi-Ruei Jhan. 3D TCAD Simulation for CMOS Nanoeletronic Devices. Springer Singapore Pte. Limited, 2017.
Find full textNarayan, Roger J., ed. Additive Manufacturing in Biomedical Applications. ASM International, 2022. http://dx.doi.org/10.31399/asm.hb.v23a.9781627083928.
Full textLi, Er-Ping. Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC. Wiley & Sons, Incorporated, John, 2012.
Find full textLi, Er-Ping. Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC. Wiley & Sons, Incorporated, John, 2012.
Find full textLi, Er-Ping. Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC. Wiley & Sons, Incorporated, John, 2012.
Find full textLi, Er-Ping. Electrical Modeling and Design for 3D System Integration. Wiley & Sons, Incorporated, John, 2012.
Find full text3D Printing of Pharmaceuticals and Drug Delivery Devices. MDPI, 2020. http://dx.doi.org/10.3390/books978-3-03936-424-4.
Full textVertical 3D Memory Technologies. John Wiley & Sons Inc, 2014.
Find full textPrince, Betty. Vertical 3D Memory Technologies. Wiley & Sons, Incorporated, John, 2014.
Find full textPrince, Betty. Vertical 3D Memory Technologies. Wiley & Sons, Incorporated, John, 2014.
Find full textPrince, Betty. Vertical 3D Memory Technologies. Wiley & Sons, Incorporated, John, 2014.
Find full textPrince, Betty. Vertical 3D Memory Technologies. Wiley & Sons, Limited, John, 2014.
Find full textGOEL. 3D Printed Smart Sensors Energy Harveshb: 3D Printed Smart Sensors and Energy Harvesting Devices. Institute of Physics Publishing, 2024.
Find full textGlukhova, Olga E. 2D and 3D Graphene Nanocomposites: Fundamentals, Design, and Devices. Jenny Stanford Publishing, 2019.
Find full textLi, Simon, and Suihua Li. 3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics. Springer, 2011.
Find full textGlukhova, Olga E. 2D and 3D Graphene Nanocomposites: Fundamentals, Design, and Devices. Jenny Stanford Publishing, 2019.
Find full textLi, Simon, and Suihua Li. 3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics. Springer, 2016.
Find full textGlukhova, Olga E. 2D and 3D Graphene Nanocomposites: Fundamentals, Design, and Devices. Taylor & Francis Group, 2019.
Find full text2D and 3D Graphene Nanocomposites: Fundamentals, Design, and Devices. Jenny Stanford Publishing, 2019.
Find full textLi, Simon, and Yue Fu. 3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics. Springer, 2011.
Find full text3d Tcad Simulation For Semiconductor Processes Devices And Optoelectronics. Springer, 2011.
Find full textKong, X. Y., Y. C. Wang, X. F. Fan, G. F. Guo, and L. M. Tong. Free-standing grid-like nanostructures assembled into 3D open architectures for photovoltaic devices. Edited by A. V. Narlikar and Y. Y. Fu. Oxford University Press, 2017. http://dx.doi.org/10.1093/oxfordhb/9780199533060.013.22.
Full textShafique, Muhammad, Bruno Zatt, Jörg Henkel, and Sergio Bampi. 3D Video Coding for Embedded Devices: Energy Efficient Algorithms and Architectures. Springer, 2016.
Find full text3d Video Coding For Embedded Devices Energy Efficient Algorithms And Architectures. Springer-Verlag New York Inc., 2013.
Find full textChen, Michael *. A system for direct manipulation of 3D objects using 2D input devices. 1988.
Find full textLamprou, Dimitrios A., Sheng Qi, and Dennis Douroumis. 3D Printing of Pharmaceutical and Drug Delivery Devices: Progress from Bench to Bedside. Wiley & Sons, Incorporated, John, 2023.
Find full textLamprou, Dimitrios A., Sheng Qi, and Dennis Douroumis. 3D Printing of Pharmaceutical and Drug Delivery Devices: Progress from Bench to Bedside. Wiley & Sons, Incorporated, John, 2023.
Find full textBarthès, Julien Georges Didier, Christophe A. Marquette, and Luciano Vidal, eds. 3D Printing for Implantable Medical Devices: From Surgical Reconstruction to Tissue/Organ Regeneration. Frontiers Media SA, 2021. http://dx.doi.org/10.3389/978-2-88966-509-9.
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