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Auswahl der wissenschaftlichen Literatur zum Thema „Zn and Sn based promoters“
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Zeitschriftenartikel zum Thema "Zn and Sn based promoters"
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Yang, Chenjun, Mengwei Chen, Jiaqi Wang und Haifei Lu. „Zn-Doped SnO2 Compact Layer for Enhancing Performance of Perovskite Solar Cells“. International Journal of Photoenergy 2021 (22.06.2021): 1–10. http://dx.doi.org/10.1155/2021/9920442.
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Perovskite solar cells (PSCs) have been developing rapidly since they were discovered, and their excellent photoelectric properties have attracted wide attention from researchers. The compact layer is an important part of PSCs, which can transport electrons and block holes. SnO2 is an excellent and commonly used electron transport layer (ETL) material, and doping modification is an effective way to improve performance. Here, Zn with a similar radius to Sn has been introduced to the doping of the SnO2 compact layer to achieve the purposes of conductivity enhancement of the compact layer and followed photoelectric performance improvement of the device. Zn-SnO2 compact layers with different doping concentrations were prepared and applied to mesoporous architecture PSCs. When the doping content was 5%, the power conversion efficiency (PCE) of the device based on the Zn-SnO2 compact layer has increased from 9.08% to 10.21%, with an increase of 12.44%. The doping of SnO2 promotes its application in low-cost PSCs.
2
Ali, Arshid M., Abdulrahim A. Zahrani, Muhammad A. Daous, Seetharamulu Podila, Majid Khalid Alshehri, Sami-ullah Rather und Usman Saeed. „Sequential and/or Simultaneous Wet-Impregnation Impact on the Mesoporous Pt/Sn/Zn/γ-Al2O3 Catalysts for the Direct Ethane Dehydrogenation“. Journal of Nanomaterials 2022 (23.02.2022): 1–17. http://dx.doi.org/10.1155/2022/8739993.
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This study is aimed at investigating the impact of catalyst preparation’s approach (either sequential and/or simultaneous wet impregnation) to a mesoporous series of Pt/A, Sn/A, PtSn/A, SnPt/A, (PtSn)/A, (PtSn)Zn/A, and (PtSnZn)/A catalysts for direct ethane dehydrogenation. The (PtSn)/A and (PtSnZn)/A had shown both higher initial specific activity (s-1) and reaction rate constant K d (h-1) (13063.86 (s-1) and 12489.69 (s-1) and 0.09 (h-1) and 0.06 (h-1)), respectively. The catalyst preparation approach had direct impact to the availability and dispersion of mesoporous particles of either active metal and/or promoter that influences either to hinder the C-C cleavage and/or to promote C-H bond cleavage in the dehydrogenation of ethane to ethene. The active metal component was present in the form of Pt, Pt+2, Al+3, Sn+4, and Zn+2 states. The enhanced catalytic activity is attributed to the Pt4Sn and PtZn formed phases in addition to highly dispersed mesoporous Pt particles. Based on the obtained results, the catalysts prepared by using simultaneous wet impregnation had shown higher catalytic activity and catalyst stability as to that of sequential wet impregnation.
3
Shi, Qi, Yongjun Ji, Wenxin Chen, Yongxia Zhu, Jing Li, Hezhi Liu, Zhi Li et al. „Single-atom Sn-Zn pairs in CuO catalyst promote dimethyldichlorosilane synthesis“. National Science Review 7, Nr. 3 (28.11.2019): 600–608. http://dx.doi.org/10.1093/nsr/nwz196.
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Abstract Single-atom catalysts are of great interest because they can maximize the atom-utilization efficiency and generate unique catalytic properties; however, much attention has been paid to single-site active components, rarely to catalyst promoters. Promoters can significantly affect the activity and selectivity of a catalyst, even at their low concentrations in catalysts. In this work, we designed and synthesized CuO catalysts with atomically dispersed co-promoters of Sn and Zn. When used as the catalyst in the Rochow reaction for the synthesis of dimethyldichlorosilane, this catalyst exhibited much-enhanced activity, selectivity and stability compared with the conventional CuO catalysts with promoters in the form of nanoparticles. Density functional theory calculations demonstrate that single-atomic Sn substitution in the CuO surface can enrich surface Cu vacancies and promote dispersion of Zn to its atomic levels. Sn and Zn single sites as the co-promoters cooperatively generate electronic interaction with the CuO support, which further facilitates the adsorption of the reactant molecules on the surface, thereby leading to the superior catalytic performance.
4
Gong, Nengfeng, Gaolei Qin, Pengfei Li, Xiangjie Zhang, Yan Chen, Yong Yang und Peng He. „Enhanced Stability and Selectivity in Pt@MFI Catalysts for n-Butane Dehydrogenation: The Crucial Role of Sn Promoter“. Catalysts 14, Nr. 11 (29.10.2024): 760. http://dx.doi.org/10.3390/catal14110760.
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The dehydrogenation of n-butane to butenes is a crucial process for producing valuable petrochemical intermediates. This study explores the role of oxyphilic metal promoters (Sn, Zn, and Ga) in enhancing the performance and stability of Pt@MFI catalysts for n-butane dehydrogenation. The presence of Sn in the catalyst inhibits the agglomeration of Pt clusters, maintaining their subnanometric particle size. PtSn@MFI exhibits superior stability and selectivity for butenes while suppressing cracking reactions, with selectivity for C1–C3 products as low as 2.1% at 550 °C compared to over 30.5% for Pt@MFI. Using a combination of high-angle annular dark-field scanning transmission electron microscopy, X-ray photoelectron spectroscopy, thermogravimetric analysis, and Raman spectroscopy, we examined the structural and electronic properties of the catalysts. Our findings reveal that Zn tends to consume hydroxyl groups and substitute framework sites, and Ga induces more defective sites in the zeolite structure. In contrast, the interaction between SnOx and the zeolite framework does not depend on reactions with hydroxyl groups. The incorporation of Sn significantly prevents Pt particle agglomeration, maintaining smaller Pt particle sizes and reducing coke formation compared to Zn and Ga promoters. Theoretical calculations showed that Sn increases the positive charge on Pt clusters, enhancing their interaction with the zeolite framework and reducing sintering, albeit with a slight increase in the energy barrier for C-H activation. These results underscore the dual benefits of Sn as a promoter, offering enhanced structural stability and reduced coke formation, thus paving the way for the rational design of more effective and durable catalysts for alkane dehydrogenation and other high-value chemical processes.
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Musa, Sayyidah Amnah, Mohd Arif Anuar Mohd Salleh und Saud Norainiza. „Zn-Sn Based High Temperature Solder - A Short Review“. Advanced Materials Research 795 (September 2013): 518–21. http://dx.doi.org/10.4028/www.scientific.net/amr.795.518.
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The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high temperature solders. The lead and lead-based compound are highly toxic which is dangerous to human health and environment. The highly suitable lead-free solder candidates for replacing high Pb high temperature solder are Au-Sn, Al-Zn, Zn-Sn, Sn-Sb, and Bi-Ag solders. However, Zn-Sn based solder has highly recommended as the best candidates in replacing high lead high temperature solder. This paper provides a short review of recent research on Zn-Sn based lead free high temperature solders with different additional alloying elements. The new novel alloy of Zn-Sn based for high temperature solder applications will be proposed in this paper.
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Zheng, Xiali, Wei Luo, Yun Yu, Zebin Xue, Yifan Zheng und Zongjian Liu. „Metal Emulsion-Based Synthesis, Characterization, and Properties of Sn-Based Microsphere Phase Change Materials“. Molecules 26, Nr. 24 (09.12.2021): 7449. http://dx.doi.org/10.3390/molecules26247449.
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A comparative study of the metal emulsion-based synthesis of Sn-based materials in two different types of molten salts (namely LiCl–KCl–CsCl and LiNO3-NaNO3-KNO3 eutectics) is presented, and the properties of Sn, Sn-Cu and Sn-Cu-Zn microsphere phase change materials prepared in chloride salts are evaluated by differential scanning calorimetry (DSC) to understand the effect of element doping. Despite a high ultrasonic power (e.g., 600 W or above) being required for dispersing liquid Sn in the chloride system, well-shaped Sn microspheres with a relatively narrow size range, e.g., about 1 to 15 µm or several micrometers to around 30 µm, can be prepared by adjusting the ultrasonic power (840–1080 W), sonication time (5–10 min) and the volume ratio of salts to metal (25:1–200:1). Such a method can be extended to the synthesis of Sn-based alloy microspheres, e.g., Sn-Cu and Sn-Cu-Zn microspheres. In the nitrate system, however, a very low ultrasonic power (e.g., 12 W) can be used to disperse liquid Sn, and the particles obtained are much smaller. At low ultrasonic power (e.g., 12 W), the particle size is generally less than 10 or 4 µm when the sonication time reaches 2 or 5 min, and at high ultrasonic power, it is typically in the range of hundreds of nanometers to 2 µm, regardless of the change in ultrasonic power (480–1080 W), irradiation time (5–10 min), or volume ratio of salts to metal (25:1–1000:1). In addition, the appearance of a SnO phase in the products prepared under different conditions hints at the occurrence of a reaction between Sn droplets and O2 in situ generated by the ultrasound-induced decomposition of nitrates, and such an interfacial reaction is believed to be responsible for these differences observed in two different molten salt systems. A DSC study of Sn, Sn-Cu, and Sn-Cu-Zn microspheres encapsulated in SiO2 reveals that Cu (0.3–0.9 wt.%) or Cu-Zn (0.9 wt.% Cu and 0.6% Zn) doping can raise the onset freezing temperature and thus suppress the undercooling of Sn, but a broad freezing peak observed in these doped microspheres, along with a still much higher undercooling compared to those of reported Sn-Cu or Sn-Cu-Zn solders, suggests the existence of a size effect, and that a low temperature is still needed for totally releasing latent heat. Since the chloride salts can be recycled by means of the evaporation of water and are stable at high temperature, our results indicate that the LiCl–KCl–CsCl salt-based metal emulsion method might also serve as an environmentally friendly method for the synthesis of other metals and their alloy microspheres.
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Chen, Kang I., Shou Chang Cheng und Chin Hsiang Cheng. „The Effects of Small Additions Ga and Al on the Microstructure and Tensile Properties of Sn-Zn Based Lead-Free Solders“. Advanced Materials Research 800 (September 2013): 265–70. http://dx.doi.org/10.4028/www.scientific.net/amr.800.265.
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The melting temperature, microstructures, and mechanical properties of the Sn-Zn-0.5Ag-0.5Ga, Sn-Zn-0.5Ag-0.45Al and Sn-Zn-0.5Ga-0.45Al lead-free solders were investigated. The results indicate that the addition of 0.5 wt% Ag to the Sn-Zn based alloys destroy the eutectic structure and results in the formation of Ag-Zn compound and hypoeutectic structure. The variation in the microstructure lowers the UTS. By the addition of Al the UTS and elongation of the 0.5Ag-0.45Al alloy can be decreased due to the Al diffused to the interface of the Ag-Zn compound/Sn-Zn eutectic structure to form Al-Zn compound. The 0.5Ga-0.45Al alloy shows a typical eutectic structure with the light contract β-Sn and the darker needle-like phase, as well as a small amount of Al-Zn phase with a near diamond shape. Gallium uniformly distributes in the Sn matrix and Zn rich phases. The 0.5Ga-0.45Al solder had the highest UTS and elongation, while 0.5Ag-0.45Al had the lowest UTS and elongation. The results indicate that Ga and Al exhibits prominent influence on the microstructure as well as the mechanical properties of the solders.
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Yang, S. C., C. E. Ho, C. W. Chang und C. R. Kao. „Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu“. Journal of Materials Research 21, Nr. 10 (Oktober 2006): 2436–39. http://dx.doi.org/10.1557/jmr.2006.0320.
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The acute Zn concentration sensitivity of the reaction between Sn-based solders and Cu substrate is reported and explained in this article. Three Sn-xZn solders (x = 0.5, 0.7, and 2 wt%) were reacted with Cu substrates at 250 °C for 2–10 min. A slight variation in the Zn concentration changed the reaction product formed at the interface. When the Zn concentration was low (x = 0.5 wt%), the reaction product was Cu6Sn5. When the Zn concentration was slightly increased to 2 wt%, the reaction product became Cu5Zn8. When Zn concentration was in-between (x = 0.7 wt%), Cu6Sn5 and CuZn co-existed. The above findings are explained using the Cu–Sn–Zn phase diagram. The implication is that the type of compound forms at the interface can be controlled by adjusting the Zn concentration of the Sn-based solders.
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Yang, Ling Mei, Peng Mei Lv, Zhen Hong Yuan, Wen Luo, Zhong Ming Wang und Hui Wen Li. „Promoting Effect of Metal Promoters on Fe(II)-Zn-Based Double Metal Cyanide Complex Catalysts for Biodiesel Synthesis“. Advanced Materials Research 236-238 (Mai 2011): 3041–45. http://dx.doi.org/10.4028/www.scientific.net/amr.236-238.3041.
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Fe(II)-Zn-based double metal cyanide complex catalysts modified with rare earth metal or transition metal promoters(lanthanum, cerium, zirconium, manganese) for the production of biodiesel were prepared, and the effect of the addition of different metal promoters on the characteristics of the catalyst was studied by using X-ray diffraction (XRD), BET, ICP and Infrared techniques .The experiment results show that the Fe(II)-Zn-based catalyst promoted with 1 wt.% of La(NO3)3·nH2O exhibits the highest catalytic activity for the reaction, being as high as 99.3% of the yield of fatty acid methyl esters (FAME). Fe(II)-Zn-based catalysts have a tentative molecular formula: K2Zn3[Fe(CN)6]2·xH2O· (t-BuOH), where x=3-9 determined by using elemental analysis and ICP. It has been shown that the molecular formula of Fe(II)-Zn-based double metal cyanide complex catalysts did not change by adding 1 wt.% of rare earth metal or transition metal promoters. X-ray diffraction and BET results showed that Fe(II)-Zn-based catalysts with 1 wt.% of metal promoters salts exhibit smaller particle size, higher surface area than the Fe(II)-Zn catalyst ,which may be related to the higher activity of the catalysts.
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Yamauchi, Akira, und Masashi Kurose. „Effect of Sb and Zn Addition on the Microstructures and Tensile Properties of Sn–Bi-Based Alloys“. Materials 15, Nr. 3 (24.01.2022): 884. http://dx.doi.org/10.3390/ma15030884.
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The tensile behavior of Sn–Bi–Cu and Sn–Bi–Ni alloys has been widely investigated. Reportedly, the addition of small amounts of a third element can refine the microstructures of the eutectic Sn-58mass% Bi solder and improve its ductility. However, the superplasticity mechanism of Sn-based alloys has not been clearly established. Therefore, in this study, the effects of Sb and Zn addition on the microstructures and tensile properties of Sn–Bi-based alloys were investigated. The alloys were subjected to tensile tests under various strain rates and temperatures. We found that Zn- and Sb-added Sn–Bi-based alloys demonstrated superplastic deformation at high temperatures and low strain rates. Sb addition significantly affected the elongation of the Sn–Bi–Sb alloys because the metal dissolves in both the primary Sn phase and the eutectic Sn–Bi matrix. The segregation of Zn and formation of needle-like Zn particles at the eutectic Sn–Bi phase boundary affected the superplastic deformation of the alloys. The deformation of the Sn–40Bi-based alloys at high temperatures and low strain rates led to dynamic recovery, dynamic recrystallization, and/or grain boundary slip because of the accumulation of voids.
Dissertationen zum Thema "Zn and Sn based promoters"
1
Riviere, Lucie. „Methyl chloride cracking and formation of coke during the methylchlorosilanes synthesis“. Electronic Thesis or Diss., Lyon 1, 2024. http://www.theses.fr/2024LYO10189.
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Pendant la synthèse de Müller-Rochow, le silicium (Si) et le chlorure de méthyle (CH3Cl) réagissent pour former des méthylchlorosilanes (MCS) en présence d'un précurseur de cuivre et de promoteurs Zn et Sn. Le CH3Cl peut subir des réactions de craquage qui entraînent la formation de composés carbonés (coke) perturbant le fonctionnement des réacteurs industriels, ce qui entraîne une perte de production. L'objectif de cette thèse était d'étudier le craquage du CH3Cl et la formation de coke pendant l'étape d'activation de la synthèse des MCS et de trouver des solutions industrielles pour prévenir la formation de coke. Le chlorure de cuivre, généralement utilisé comme précurseur, peut soit former Cu3Si, actif pour la synthèse des MCS, soit être réduit en Cu, qui s'est révélé inactif pour la synthèse des MCS mais actif pour le craquage du CH3Cl. Dans ce travail, cette réaction secondaire est corrélée avec la formation de Cu(0), qui se produit dès le début de la synthèse des MCS et est favorisée par les promoteurs Zn et Sn. Cependant, il a été démontré que la cinétique de formation de Cu(0) est plus rapide que celle de Cu3Si, même en l'absence de promoteurs. Par conséquent, il est impossible d'éviter la formation de Cu(0) qui pourrait contribuer au craquage du CH3Cl. Une approche pour réduire la formation de coke a été de diminuer l'acidité en ajoutant des métaux alcalins : KCl et CsCl. Cela a donné des résultats favorables : il a été possible de réduire le taux de production de coke en diminuant la quantité de phase cristalline Cu(0) formée. Certaines explications ont été proposéesDuring the Müller-Rochow synthesis, Si and CH3Cl reacts to form methylchlorosilanes (MCS) in presence of a copper precursor, Zn and Sn promoters. CH3Cl can suffer from cracking reactions which results in the formation of carbonaceous compounds (coke) that disturbs the operation of industrial reactors, leading to a production loss. The purpose of this thesis was to study the CH3Cl cracking and the formation of coke during the activation step of the MCS synthesis and to find industrial solutions to prevent coke formation. Copper chloride which is generally used as precursor can either form Cu3Si, active for the MCS synthesis or be reduced into Cu(0) that was found to be inactive for the MCS synthesis but active for the CH3Cl cracking. In this work, this side reaction is correlated with Cu(0) formation which occurs from the beginning of the MCS synthesis and is enhanced by Zn and Sn promoters. However, Cu(0) formation kinetic was shown to be faster than Cu3Si even in the absence of promoters. Therefore, it is impossible to avoid Cu(0) formation which could contribute to CH3Cl cracking. An approach to reduce coke formation was to lower the acidity by adding alkali metals: KCl and CsCl. This provided favorable outcomes: it was possible to lower the coke production rate due to the reduction of the amount of Cu(0) crystalline phase formation. Some explanations were proposed
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Guo, Yanzhi. „Synthesis, characterization and catalytic application of Ru/Sn-and Cu/Zn-based nanocomposites“. [S.l.] : [s.n.], 2006. http://deposit.d-nb.de/cgi-bin/dokserv?idn=98188833X.
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Duren, Stephan van [Verfasser], Aleksander [Akademischer Betreuer] Gurlo, Aleksander [Gutachter] Gurlo, Walter [Gutachter] Reimers und Thomas [Gutachter] Unold. „Development of in situ methods for process monitoring and control and characterization of Cu-Zn-Sn-S based thin films / Stephan van Duren ; Gutachter: Aleksander Gurlo, Walter Reimers, Thomas Unold ; Betreuer: Aleksander Gurlo“. Berlin : Universitätsverlag der TU Berlin, 2019. http://d-nb.info/1187949019/34.
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Huang, Chia-Wei, und 黃家緯. „Evaluation of Lead-free Sn-Zn Based Solders (Sn-Zn-Al-Ag Solder)“. Thesis, 2005. http://ndltd.ncl.edu.tw/handle/13319573590244426749.
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博士國立成功大學
材料科學及工程學系碩博士班
93
Abstract The development of lead-free solders has become an important issue in the electronics packaging industry because of environmental and health concerns. Recently, Sn-Zn based solders have been considered to be a potential candidate for lead-free solder because its melting temperature is relatively close to that of eutectic Sn-Pb solder. Sn-Zn solders also have lower cost than other lead-free solders. However, Sn-Zn solders exhibit unsatisfactory oxidation resistance and poor wettability on commonly used substrates. The purpose of this research is to investigate the incorporation of Al and Ag in Sn-Zn solder in order to enhance its wettability and oxidation resistance. The microstructure, mechanical property, wettability, oxidation behavior, interfacial reaction and reliability of the Sn-8.55Zn-0.45Al-(0~3wt%)Ag solders were investigated in this study. The microstructure of Sn-Zn based solders shows that the AgZn3 and Ag5Zn8 compounds are formed at the addition of (0.5wt%~3wt%)Ag to Sn-8.55Zn-0.45Al solders. The formation of Ag-Zn compounds (AgZn3 and Ag5Zn8) results in the variation of matrix from eutectic to hypoeutectic structure. The results of DSC (Differential Scanning Calorimetry) reveal that the Sn-8.55Zn-0.45Al solder has eutectic temperature at 197°C, but Ag-Zn compounds (AgZn3 and Ag5Zn8) melt above 300°C as Ag is added to the Sn-8.55Zn-0.45Al solder. An increase in Ag content results in little change in UTS (Ultimate Tensile Stress) and microhardness, but the elongation is prominently decreased. The elongation of the solders drops from 47.1% to 20% when Ag content increases from 0 to 3%. The results of TGA (Thermal Gravimetric Analysis) show that the weight gains at 250°C under O2 atmosphere descend in the order of Sn-9Zn>Sn-8.55Zn-0.45Al-(0.5wt%~3wt%)Ag>Sn-8.55Zn-0.45Al. This means that the incorporation of 0.45wt%Al enhances the oxidation resistance of Sn-Zn solder, while the weight gains of the Sn-8.55Zn-0.45Al-XAg solders increase as Ag was added into the Sn-8.55Zn-0.45Al solder. Auger depth profile shows that Zn and Al form an oxide film on the surface of Sn-9Zn and the Al-containing solders. The wetting results indicate that the wettability of Sn-8.55Zn-0.45Al-XAg solders decreases with increasing Ag content of solders. The Sn-Zn-Al-XAg solders containing low Ag content (0.5wt%) exhibit better wettability than the eutectic Sn-9Zn solder. Furthermore, it was also found that the wettability of Sn-Zn based solders on Cu substrate is better than that on Cu/Ni-P/Au substrate. The results of interfacial reaction indicate that Cu substrate forms Cu5Zn8 and CuZn5 with Sn-9Zn solder, and Al4.2Cu3.2Zn0.7 compound with Al-containing solders. However, it was detected that Cu6Sn5 forms at the Sn-9Zn/Cu interface and Cu5Zn8 forms at the Al-containing solders/Cu interface after aging for 1000 hours. In contacting with the Cu/Ni-P/Au substrate, Sn-9Zn solder forms AuZn3 compound, and the Al-containing solders forms Al2(Au,Zn) compound at the interface. After long time aging, the intermetallic compounds existing between solders and the Cu/Ni-P/Au metallization layers almost do not grow. It was found that the inter-diffusion between solders and Cu/Ni-P/Au is slower than that with Cu under aging. Furthermore, the additions of Ag to Sn-8.55Zn-0.45Al solder result in the formation of AgZn3 particles at the interface. This present work also investigated the reliability of the Sn-8.55Zn- 0.45Al-XAg solders under multiple reflow and thermal aging test. The results show that Sn-Zn based solder balls on Cu and Cu/Ni-P/Au substrates retain the shear strength under multiple reflow. Under thermal aging test, it was found that the shear strength of Sn-Zn based solder balls on Cu substrate decreases with increasing of aging time. However, the shear strength of Sn-Zn based solder balls on Cu/Ni-P/Au almost dose not change under thermal aging test. Thus, it was known that the Sn-Zn based solder balls on Cu/Ni-P/Au substrate exhibit better reliability than that on Cu substrate.
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Wan-YiLin und 林宛儀. „Development and properties of Zn-Sn based Pb-free solder alloys(Zn-Sn-Ga-Al)for high temperature application“. Thesis, 2011. http://ndltd.ncl.edu.tw/handle/35590247550966214167.
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Mishra, Manas Kumar. „A Study of Intermetallics in Cu-Sn system and Development of Sn-Zn Based Lead Free Solders“. Thesis, 2013. http://ethesis.nitrkl.ac.in/4630/1/211MM1201.pdf.
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In the electronic industry Pb-Sn solder is a very important material but Pb is toxic and has adverse effects on the environment and human beings. Due to the harmful effects of the Pb the use of the Pb-Sn solder alloys are being avoided and new Pb-free solder alloys are being used for electronic applications. This study is mainly based on the intermetallics that are formed in the Cu-Sn system and development of Sn-Zn based lead free solders. The aim was to understand the solidification of Cu-Sn alloys, the various intermetallics formed and their morphology. Thermal analysis of Sn-Zn based lead free alloys and their wetting characteristics has been analysed. The Pb-Sn solders are being replaced by the Sn-Cu, Sn-Ag, Sn-Ag-Cu, Sn-Zn and Sn-Zn-Bi alloys. Here the intermetallics formed between Cu-Sn during solidification of the molten solder on the Cu electrical contacts are also studied. The intermetallics are brittle in nature and this leads to fracture of the solder. In order to understand the Sn-Cu or Sn-Zn based lead free solder alloys it is essential to is understand the solidification of the molten alloys. This is why a few compositions of Cu-Sn alloy are selected and the various intermetallics formed during the solidification of the molten Cu-Sn alloys are analyzed. At high temperatures diffusion of Cu and Sn increases and as a result intermetallics of Cu-Sn are formed. The common intermetallics formed are Cu3Sn and Cu6Sn5. Sn-8.8Zn and Sn-8Zn-3Bi solder alloys has been developed. DSC analysis of these alloys has carried out to determine their melting points. It has been also observed that the addition of Bi increases the wettability and decreases the melting point of these alloys.
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Lima, Diogo Luís Araújo de. „Sputtered Zn-Sn-O based thin-film transistors: Optimization and circuit simulation“. Master's thesis, 2016. http://hdl.handle.net/10362/74922.
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The development of amorphous oxide semiconductors (AOS) has been accelerated with their application in thin-film transistors (TFTs) for transparent and flexible displays. Among the many AOS available, zinc tin oxide (ZTO) represents a promising material due to its enhanced chemical and physical properties and the abundance of its elements in nature results in low price, compared to IGZO, and favours its widespread use in mass technology production. In this work, ZTO thin films deposited by sputtering under different oxygen, hydrogen and RF power conditions were investigated. The study focus on their morphology, structure and optical behaviour and on their implementation as active channel layers in TFTs. Great device performance was obtained when deposited at a power of 160 W, in a 10% of oxygen partial pressure and 1% of hydrogen, at a 2.3 mTorr pressure. After an annealing temperature of 180 oC, mobility of 9.1 cm2 V-1s-1, subthreshold slope of 0.29 Vdec-1 and turn-on voltage of -2.0 V were achieved, using a sputtered multilayer dielectric based on Ta2O5-SiO2.
The measured output and transfer a-ZTO TFT characteristics were modeled in an artificial neural network (ANNs) empirical model with very good accuracy. The model was used in the Cadence Spectre to simulate three logic gates at DC and transient analysis: inverter, NAND and NOR, with logic levels preserved up to 10 kHz.
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Guo, Siao-wei, und 郭筱薇. „Developement of High-temperature Lead-free solders: Zn-Sn-Al-Cu Based Alloy“. Thesis, 2011. http://ndltd.ncl.edu.tw/handle/d63szw.
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碩士國立臺灣科技大學
材料科學與工程系
99
Despite numerous studies on the research and development for high-temperature lead free solders, high-lead solder are still in used because high-temperature lead free solders also has been facing several serious problems during these years. Establishing high-temperature lead-free solder is an urgent priority. This study investigates the development of high-temperature lead-free solders and their properties by improve its wettability and oxidation resitivity after addition of Ni and Ge in Zn-Sn-Al-Cu based alloy. The solders are examined for microstructure, thermal properties, mechanical properties and investigate the interfacial reaction between Zn-Sn-Al-Cu based alloy with Cu and Ni/Cu at 300 and 350oC for 1, 2 and 4 hours. The experimental results indicate that the liquilidus temperature of Zn-Sn-Al-Cu based alloys is between 275oC to 375oC with Zn content. As Zn contents increase the (Zn) and CuZn5 increase, therefore resulting in the increase of micro-hardness and ultimate tensile strength and the addition of Al improve mechanical properties. Three or four intermetallic compounds (IMCs) are formed at the interface in the Cu/alloy diffusion couple. The reaction phases are identified as CuZn5, Al4Cu3Zn, ??nphase and CuZn is formed facing to the Cu substrate. The ??nphase is formed or not that is related to Al/Zn ratio. The IMCs are indentified as CuZn5, Al4Cu3Zn, (Zn), (Al) and?n??Sn phase in the alloys near the Ni/Cu substrate after reflow.
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Hung, Hui-Tzu, und 洪慧慈. „Adhesive Behavior and Interfacial Reaction between Sn-Zn Based Solders and Metallized Cu Substrates“. Thesis, 2004. http://ndltd.ncl.edu.tw/handle/66259602083583707244.
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碩士國立成功大學
材料科學及工程學系碩博士班
92
This research is investigated the interfacial reaction and adhesive behavior between Sn-Zn based solders and metallized Cu substrates. The microstructure and thermal property of Sn-Zn based solders were also studied. The wettability between Sn-Zn based solders and different substrates were investigated with the wetting balance. The adhesive strength between Pb-free solder balls and BGA substrate after reflow process was measured by shear test. The interfacial reaction behavior after dipping and reflow process was investigated by SEM and EPMA. The microstructure of Sn-9Zn alloy consists of ß-Sn matrix and Zn-rich phase. As for Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga alloy, besides the coexistence of ß-Sn matrix and Zn-rich phase, Ag-Zn compound precipitates within the solder matrix. The melting point of Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga alloy was found to be 196.4 ℃. The result of solderability test reveals that the deposition of Sn-Zn based solder on metallized Cu substrate was rough and dull in luster. Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga solder exhibits adequate wettability with the Cu/Ni-P/Au specimen above 250℃. The wetting time is more than 1 sec. Accordingly, the solderability between Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga solder and Au deposited layer needs to be further improved. AuZn3 and Al2Au intermetallic compound(IMC) formed at the interface of Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga solder and Cu/Ni-P/Au after dipping process. After thermal aging, the AuZnx, Al2Au and (Ag.Au)Zn3 formed at the interface. The Ni-P layer does notreact with other element to form IMC. According to the interfacial analysis on the interface between Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga solder and Cu/Au substrate, Al-Au-Zn IMC layer and Cu5Zn8 compound formed at the interface. The shear test data reveals that the adhesive strength of Sn-9Zn solder is higher than that of Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga solder after reflow and longtime thermal aging. The shear strength decreased with increasing aging time. The fracture occurred within the solder balls. In the reflow process, Ag-Zn and Au-Zn compound formed at the interface between Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga solder and BGA substrate. After aged at 150℃ for 1000 hours, Ag-Al-Au and Au-Zn compound formed within solder matrix while Au-Zn and Ni-Zn formed at the substrate side. Al does not react with other element to form IMC.
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Guo, Yanzhi [Verfasser]. „Synthesis, characterization and catalytic application of Ru/Sn-and Cu/Zn-based nanocomposites / vorgelegt von Yanzhi Guo“. 2006. http://d-nb.info/98188833X/34.
Der volle Inhalt der QuelleBuchteile zum Thema "Zn and Sn based promoters"
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Murashov, Vladimir, Boris Straumal und Pavel Protsenko. „Grain Boundary Wetting in Zn Bicrystals by a Sn-Based Melt“. In Defect and Diffusion Forum, 235–38. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/3-908451-17-5.235.
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Okumura, Taiga, Noriko Yamaguchi und Toshihiro Kogure. „Structure, Composition, and Physicochemical Properties of Radiocesium-Bearing Microparticles Emitted by the Fukushima Daiichi Nuclear Power Plant Accident“. In Agricultural Implications of Fukushima Nuclear Accident (IV), 63–78. Singapore: Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-19-9361-9_8.
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AbstractDuring the accident at TEPCO’s Fukushima Daiichi Nuclear Power Plant, radiocesium-bearing microparticles (CsMPs) were released from damaged reactors into the environment. These micron-sized spherical particles with high specific radioactivity have not been reported in previous nuclear accidents. Herein, the current understanding of the structure, composition, and physicochemical properties of CsMPs is summarized. Electron microscopy revealed that the CsMP matrix is composed of silicate glass containing Na, Cl, K, Fe, Zn, Rb, Sn, and Cs as major constituents. These elements are often inhomogeneously distributed, depending on the particle radius, and Cs was concentrated around the outer side of the particles. In addition, nanocrystals including Cr-rich oxides and chalcogenides were frequently found inside CsMPs. The average valence state of Fe in the CsMP glass matrix was almost Fe2+, indicating formation under a reducing atmosphere through condensation from the gas phase. Radiocesium diffused away from the CsMPs when heated to >600 °C. Accordingly, CsMPs may lose their high specific radioactivity when related radiation-contaminated waste is incinerated at sufficiently high temperatures. Although CsMP solubility is low, they cannot be regarded as “insoluble” materials owing to their small size. CsMP dissolution rates depend on the pH and dissolved species in the solution, and their dissolution behavior is comparable to that of silica-rich glass. Based on these dissolution properties, a method for estimating CsMP abundance and spatial distribution in the environment was proposed. The findings detailed herein contribute to the comprehensive elucidation of CsMP environmental dynamics.
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Kang, Sung. „Bi-Sn, Sn-Sb, Sn-Cu, Sn-Zn, and Sn-In Solder-Based Systems and Their Properties“. In Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. CRC Press, 2004. http://dx.doi.org/10.1201/9780203021484.ch9.
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„Bi-Sn, Sn-Sb, Sn-Cu, Sn-Zn, and Sn-In Solder-Based Systems and Their Properties“. In Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, 298–317. CRC Press, 2004. http://dx.doi.org/10.1201/9780203021484-14.
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Manilevich, F., Yu Pirskyy, A. Kutsyi, V. Berezovets und V. Yartys. „Activated aluminum for hydrogen generation from water“. In HYDROGEN BASED ENERGY STORAGE: STATUS AND RECENT DEVELOPMENTS, 81–93. Institute for Problems in Materials Science, 2021. http://dx.doi.org/10.15407/materials2021.081.
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Al-based alloys and mechanochemically activated aluminum powders were prepared in this study, and the regularities of their hydrolysis reaction with water were studied. Aluminum alloys were prepared by melting aluminum with additions of Ga–In–Sn eutectic (5 wt.%), bismuth (3 wt.%), antimony (3 wt.%), or zinc (3 wt.%). The temperature-dependent kinetics of their hydrolysis in a temperature range 25–70 °C was studied by using a volumetric technique. The most efficient activation of the hydrolysis process was achieved for the Al–Ga– In–Sn-Zn alloy, particularly at low temperatures (5 and 25° C). The addition of bismuth to the Al–Ga–In–Sn alloy significantly decreases the hydrolysis rate, whereas the addition of antimony has only a weak effect on the process, despite the fact that the standard electrode potentials of bismuth and antimony have rather close values. Commercially available aluminum PA-4 and ASD-1 powders were mechanochemically activated by Ga–In–Sn or Ga–In–Sn–Zn eutectic alloys (5 wt.%) and graphite (1–3 wt.%) in a mixer type ball mill. Subsequently, they were pressed (P = 4 MPa) into the pellets, which were used to generate hydrogen from water via the hydrolysis process. X-ray diffraction study of the milled PA-4 powder revealed the presence of four phases, including aluminum, graphite, and two In–Sn intermetallic compounds (In3Sn and In1–xSnx, were x ≈ 0.04). The quantitative analysis by EDX showed a uniform distribution of the activating additives over the pellet surface, while the graphite was partly aggregated. Studies on the hydrolysis kinetics when utilizing Al-based pellets demonstrated that the process readily proceeds at temperatures ≥ 5° C. At the same time, the efficiency of hydrogen generation depends on the amount of the added graphite, particle size of aluminum powders, duration and medium of their mechanochemical treatment, and the hydrolysis temperature.
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Chang, Zhaoshan, Qihai Shu und Lawrence D. Meinert. „Chapter 6 Skarn Deposits of China“. In Mineral Deposits of China, 189–234. Society of Economic Geologists, 2019. http://dx.doi.org/10.5382/sp.22.06.
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Abstract Skarn deposits are one of the most common deposit types in China. The 386 skarns summarized in this review contain ~8.9 million tonnes (Mt) Sn (87% of China’s Sn resources), 6.6 Mt W (71%), 42 Mt Cu (32%), 81 Mt Zn-Pb (25%), 5.4 Mt Mo (17%), 1,871 tonnes (t) Au (11%), 42,212 t Ag (10%), and ~8,500 Mt Fe ore (~9%; major source of high-grade Fe ore). Some of the largest Sn, W, Mo, and Zn-Pb skarns are world-class. The abundance of skarns in China is related to a unique tectonic evolution that resulted in extensive hydrous magmas and widespread belts of carbonate country rocks. The landmass of China is composed of multiple blocks, some with Archean basements, and oceanic terranes that have amalgamated and rifted apart several times. Subduction and collisional events generated abundant hydrous fertile magmas. The events include subduction along the Rodinian margins, closures of the Proto-Tethys, Paleo-Asian, Paleo-Tethys, and Neo-Tethys Oceans, and subduction of the Paleo-Pacific plate. Extensive carbonate platforms developed on the passive margins of the cratonic blocks during multiple periods from Neoarchean to Holocene also facilitated skarn formation. There are 231 Ca skarns replacing limestone, 15 Ca skarns replacing igneous rocks, siliciclastic sedimentary rocks, or metamorphic silicate rocks, 113 Ca-Mg skarns replacing dolomitic limestone or interlayered dolomite and limestone, and 28 Mg skarns replacing dolomite in China. The Ca and Ca-Mg skarns host all types of metals, as do Mg skarns, except for major Cu and W mineralization. Boron mineralization only occurs in Mg skarns. The skarns typically include a high-temperature prograde stage, iron oxide-rich higher-temperature retrograde stage, sulfide-rich lower-temperature retrograde stage, and a latest barren carbonate stage. The zoning of garnet/pyroxene ratios depends on the redox state of both the causative magma and the wall rocks. In an oxidized magma-reduced wall-rock skarn system, such as is typical of Cu skarns in China, the garnet/pyroxene ratio decreases, and garnet color becomes lighter away from the intrusion. In a reduced intrusion-reduced wall-rock skarn system, such as a cassiterite- and sulfide-rich Sn skarn, the skarn is dominated by pyroxene with minor to no garnet. Manganese-rich skarn minerals may be abundant in distal skarns. Metal associations and endowment are largely controlled by the magma redox state and degree of fractionation and, in general, can be grouped into four categories. Within each category there is spatial zonation. The first category of deposits is associated with reduced and highly fractionated magma. They comprise (1) greisen with Sn ± W in intrusions, grading outward to (2) Sn ± Cu ± Fe at the contact zone, and farther out to (3) Sn (distal) and Zn-Pb (more distal) in veins, mantos, and chimneys. The second category is associated with oxidized and poorly to moderately fractionated magma. Ores include minor porphyry-style Mo and/or porphyry-style Cu mineralization ± Cu skarns replacing xenoliths or roof pendants inside intrusions, zoned outward to major zones of Cu and/or Fe ± Au ± Mo mineralization at the contact with and in adjacent country rocks, and farther out to local Cu (distal) + Zn-Pb (more distal) in veins, mantos, and chimneys. Oxidized and highly fractionated magma is associated with porphyry Mo or greisen W inside an intrusion, outward to Mo and/or W ± Fe ± Cu skarns at the contact zone, and farther to Mo or W ± Cu in distal veins, mantos, and chimneys. The final category is associated with reduced and poorly to moderately fractionated magma. No major skarns of this type have been recognized in China, but outside China there are many examples of such intrusions related to Au-only skarns at the contact zone. Reduced Zn-Au skarns in China are inferred to be distal parts of such systems. Tungsten and Sn do not occur together as commonly as was previously thought. The distal part of a skarn ore system may transition to carbonate replacement deposits. Distal stratabound mantos and crosscutting veins/chimneys may contain not only Zn-Pb but also major Sn, W, Cu, Mo, and Au mineralization. The Zn-Pb mineralization may be part of either an oxidized system (e.g., Cu, Mo, Fe) or a reduced system (e.g., Sn). In China, distal Zn-Pb is more commonly related to reduced magmas. Gold and W may also be related to both oxidized and reduced magmas, although in China they are more typically related to oxidized magma. There are numerous examples of distal mantos/chimneys that continuously transition to proximal skarns at intrusion-wall-rock contact zones, and this relationship strongly supports the magmatic affiliation of such deposits and suggests that distal skarns/carbonate replacement deposits systems should be explored to find more proximal mineralization. Carbonate xenoliths or roof pendants may host the majority of mineralization in some deposits. In contact zones, skarns are better developed where the intrusion shape is complicated. The above two skarn positions imply that there may be multiple skarn bodies below drill interceptions of intrusive rocks. Many of the largest skarns for all commodities in China are related to small or subsurface intrusions (except for Sn skarns), have multiple mineralization centers, are young (<~160 Ma), and have the full system from causative intrusion(s) to distal skarns or carbonate replacement extensions discovered. Chinese skarn deposits fall in several age groups: ~830, ~480 to 420, ~383 to 371, ~324 to 314, ~263 to 210, ~200 to 83, ~80 to 72, and ~65 to 15 Ma. They are typically associated with convergent plate boundaries, mostly in subduction settings but also in collisional settings. Seven major skarn metallogenic belts are recognized based on skarn geographic location and geodynamic background. In subduction settings, skarns may form in a belt up to 4,000 km long and 1,000 km inland, with skarns continuously forming for up to 120 m.y., e.g., the eastern China belt. In most other belts, skarns form in 5- to 20-m.y. episodes similar to the situation in South America. In collisional settings, skarns may form up to 50 m.y. after an ocean closure, and the distance to the collisional/accretionary boundary may extend to ~150 km inland. The size of collision-related skarns may be as large as the largest skarns related to oceanic crust subduction. Older suture zones may be favorable sites for younger mineralization, for example, the Triassic Paleo-Tethys suture between the North and South China blocks for the younger and largest skarn cluster of the Middle-Lower Yangtze belt in the eastern China belt, and the Triassic sutures in southwestern China for Cretaceous to Tertiary mineralization.
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Biborski, Marcin, Mateusz Biborski und Janusz Stępiński. „Badania technologiczno-chemiczne oraz metaloznawcze wybranych zabytków metalowych / Technological, chemical, and metallurgical examination of selected metal artefacts“. In Castrum Lubenov. Tragiczne dzieje średniowiecznej wieży w Lubrzy / Castrum Lubenov. The tragic history of the medieval tower in Lubrza, 253–84. Wydawnictwo Profil-Archeo; Muzeum Archeologiczne Środkowego Nadodrza, 2022. http://dx.doi.org/10.33547/lubenov2022.13.
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The article discusses the metallurgical analysis of 15 artefacts from the destroyed motte-and-bailey castle in Lubrza, including five copper alloy objects and ten iron items. The objective of this study was the determination of the chemical composition of the alloys and the identification of the technology for their forming. In terms of material, the analyzed copper alloy items are mostly made of brass (4). Three of them are made of multicomponent alloys (Cu-Zn-Sn), one of two components (Cu-Zn), and one of copper with a small deliberate addition of lead (Cu-Pb). The iron objects from Lubrza were made of metal obtained during the smelting process, from bog ores containing a substantial admixture of phosphorus, as evidenced by the high content of this element in the iron and steel items found at the site. In the composition of the metal, this is manifested by the presence of ghost structure, etching recesses, deformation twins, and a considerable hardness of ferrite. Three of the examined items show the high artistry of blacksmithing, both in terms of material selection and techniques of production. Based on the metallurgical research carried out, it can be generally stated that the products from Lubrza were most likely made locally, in a fairly specialized workshop, as for those times, which demonstrates considerable knowledge and good skills of local blacksmiths.
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Forbes, Ian, und Laurence M. Peter. „Materials for Photovoltaics“. In Materials for a Sustainable Future, 558–91. The Royal Society of Chemistry, 2012. http://dx.doi.org/10.1039/bk9781849734073-00558.
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This chapter outlines the potential for photovoltaics (PV) to make a substantial contribution to the requirement for low carbon energy. Current and developing technologies are reviewed and assessed in terms of their energy payback times and carbon dioxide footprints. The constraints on the large scale deployment of existing non-silicon thin film PV technologies imposed by the availability and production levels of materials such as tellurium, indium and selenium are considered quantitatively using data from the UK and US geological surveys. The potential for thin film PV based on earth-abundant elements (e.g. Cu, Zn, Sn, S) is also examined. A simple logistic growth model is used to illustrate the likely impact in terms of resource demands of ramping up the installed PV capacity to reach 2 TW (peak) by 2050. The discussion highlights the need to consider possible bottlenecks now in order to develop the necessary capacity to meet the projections for PV made by a number of international organisations.
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Deng, Jun, Yusheng Zhai, Xuanxue Mo und Qingfei Wang. „Chapter 4 Temporal-Spatial Distribution of Metallic Ore Deposits in China and Their Geodynamic Settings“. In Mineral Deposits of China, 103–32. Society of Economic Geologists, 2019. http://dx.doi.org/10.5382/sp.22.04.
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Abstract The temporal-spatial distribution of metallic ore deposits in China, including magmatic Ni-Cu ± platinum group elements (PGE), porphyry, skarn, volcanogenic massive sulfide (VMS), epithermal, sedimentary rock-hosted Pb-Zn, Carlin-like Au, and orogenic Au deposits, reflects a diversity of tectonic settings. The ore deposits belong to 14 metallogenic provinces, contained within six age groups, which are classified based on geodynamic setting. Three of the provinces developed in the Precambrian (group I), nine developed in the Paleozoic and Mesozoic (groups II, III, IV, and V), and two developed in the Cenozoic (group VI). Except for the group I provinces, each of the other provinces is characterized by a major metallogenic age peak corresponding to a series of interrelated tectonic events or mantle plume activity. The Precambrian group can be subdivided into a Neoarchean metallogenic province in the North China craton that hosts several VMS deposits; a Proterozoic metallogenic province in the North China craton that hosts the 1505 Ma Bayan Obo carbonatite-related rare earth element (REE)-Nb-Fe deposit and the 832 Ma Jinchuan magmatic Ni-Cu-(PGE) deposit, and a Proterozoic metallogenic province in the South China block that hosts several iron oxide copper-gold deposits. Many of the deposits in these metallogenic provinces are related to continental rifting. The second group of metallogenic provinces occurs in the Chinese part of the Central Asian orogenic belt. It includes a Cambrian-Ordovician metallogenic province that developed during subduction of the Paleo-Asian oceanic plate, a Carboniferous-Triassic metallogenic province (Tianshan-Altay) that developed during final closure of the ocean, and a Permian-Triassic metallogenic province (NE China) that developed after arc-continent collision. Important ore deposits in these metallogenic provinces are, respectively, the 485 Ma Duobaoshan porphyry Cu-Mo deposit the 445 Ma Bainaimiao porphyry Cu-Mo-Au deposit; the 363 Ma Axi epithermal Au deposit, the 322 Ma Tuwu-Yangdong porphyry Cu deposit, the 284 Ma Huangshanxi magmatic Ni-Cu deposit; the 245 Ma Chehugou porphyry Mo-Cu deposit, the 223 Ma Jinchangyu orogenic Au deposit, and 220 Ma Hongqiling magmatic Ni-Cu deposit. The third group of metallogenic provinces occurs in the Tethyan metallogenic domain and can be further divided into a Cambrian-Ordovician Qilian-Kunlun-Sanjiang province that developed during subduction and closure of the Proto-Tethyan Ocean; a Carboniferous-Triassic province that developed during birth, subduction, and consumption of the Paleo-Tethyan Ocean; and a Jurassic-Cretaceous Tethys province that developed during subduction of the Meso-Tethys oceanic plate. Important ore deposits in these provinces include the 411 Ma Baiganhu W-Sn skarn deposit and the 412 Ma Xiarihamu magmatic Ni-Cu deposit that formed in a continental-arc setting; the Laochang Pb-Zn VMS deposit associated with ocean island basalt-like volcanism, the 220 Ma Pulang porphyry Cu deposit that formed in a continental-arc setting, and the 230 to 210 Ma Carlin-like Au deposits formed in a postcollisional environment in the western Qinling and the Youjiang basin; and the 119 Ma Tieyaoshan Sn skarn-greisen deposit, the 88 Ma Tongchanggou porphyry Mo deposit, and the 83 Ma Gejiu Sn skarn deposits. The fourth group of metallogenic provinces developed during subduction of the Pacific oceanic plate beneath southeastern China and comprises a Jurassic and a Cretaceous province. The former is represented by a cluster of ~160 Ma W-Sn skarn deposits in the Nanling region; the latter is known for many ~135 Ma skarn and porphyry Cu-Au deposits in the Tongling region and numerous ~125 Ma unusual orogenic Au deposits in the Jiaodong and Xiaoqinling regions. The fifth group is the Emeishan metallogenic province that is related to Permian mantle plume activity in southwestern China. Several world-class magmatic Fe-Ti-V oxide deposits, a few small magmatic Ni-Cu deposits, and a couple of small magmatic Pt-Pd deposits associated with mafic-ultramafic intrusions are present in this province. The sixth group of metallogenic provinces developed in the Cenozoic during continental collision in the Tibet and Sanjiang region. This group can be further divided into the Sanjiang province that is related to oblique collision, and the Tibet province that is related to orthogonal collision. Important ore deposits in these provinces are the ~41 Ma Yulong porphyry Cu-(Mo) deposit, the 37 Ma Beiya Au-Cu skarn deposit, the ~26 Ma Jinding sedimentary rock-hosted Zn-Pb deposit, the ~30 Ma Zhenyuan orogenic Au deposit, and the ~15 Ma Qulong and Jiama porphyry Cu deposits. The youngest metallogenic province in China occurs on the Taiwan Island. This province developed during the subduction of the Philippine Sea oceanic plate beneath the island in the Pliocene and the accretion of the Luzon volcanic arc to the island in the Pleistocene. This province contains numerous Pliocene orogenic gold deposits as well as the Pleistocene Chinkuashih epithermal gold deposit in northern Taiwan.
Konferenzberichte zum Thema "Zn and Sn based promoters"
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Liu, Jian-Chun, Long Xiao, Zhi-Jun Yue und Gong Zhang. „Atomic diffusion of Zn in Sn-Zn based solder joints subjected to high temperature aging“. In 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS). IEEE, 2017. http://dx.doi.org/10.1109/edaps.2017.8277008.
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Sun, Peng, Cristina Andersson, Zhaonian Cheng, Zonghe Lai, Dongkai Shangguan und Johan Liu. „Coffin-Manson Equation determination for Sn-Zn Based Lead-Free Solder Joints“. In 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. IEEE, 2005. http://dx.doi.org/10.1109/hdp.2005.251421.
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Yu, Qiang, Doseop Kim, Jaechul Jin, Yasuhiro Takahashi und Masaki Shiratori. „Fatigue Strength Evaluation for Sn-Zn-Bi Lead-Free Solder Joints“. In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39686.
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In this paper, the authors have investigated mechanical fatigue strength of Sn-Zn-Bi lead-free solder joints. The use of Sn-Zn-Bi solder is increasing for the advantage of low cost and low melting point. Therefore, it becomes important to ensure the fatigue strength of Sn-Zn-Bi solder joint. However, when the Sn-Zn-Bi solder was used as a solder material, there is serious problem that the fatigue crack is easy to generate at the interface between intermetallic compound layer and the solder matrix, and it makes the fatigue life of solder joint lower. Because the yield strength of Sn-Zn-Bi solder is high, and the difficulty of deformation causes high stress level concentrating at the corner of the interface between solder joint and substrate/package. It seems that the crack become easy to generate at the interface between intermetallic compound layer and solder matrix by this high stress concentration. The authors have found if Sn-Zn-Bi is used with another Pb-free solder material, a kind of composite structure can be built during the reflowing processes. In this study, the mechanical fatigue strength of this kind of Sn-Zn-Bi solder joint was studied. Based upon the results of mechanical shear fatigue test and FEM (Finite Element Method) analysis, it was found that if SnZn-Bi was used as reflow solder with Sn-Ag-Cu ball, the CSP solder joints are as reliable as thc pure Sn-Ag-Cu CSP. This is because Sn-Zn-Bi solder paste and Sn-Ag-Cu solder ball did not melt together completely and formed two-layer structure, and this two-layer structure reduces the stress concentration at the joint corners, and prevents successfully the occurrence of the interface cracks. As a result the fatigue life of Sn-Zn-Bi/Sn-Ag-Cu CSP is equivalent to that of Sn-Ag-Cu joints.
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Maltsev, Dmitry S., Vladimir A. Volkovich, Leonid F. Yamshchikov und Andrey V. Chukin. „Thermodynamic properties of gadolinium in Ga–Sn and Ga–Zn eutectic based alloys“. In PHYSICS, TECHNOLOGIES AND INNOVATION (PTI-2016): Proceedings of the III International Young Researchers’ Conference. Author(s), 2016. http://dx.doi.org/10.1063/1.4962596.
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Yang-Shun Fan, Wei-Liang Chan, Chih-Hsiang Chang, Guang-Ting Zheng, Che-Chia Chang und Po-Tsun Liu. „Performance and reliability of non-linear Al-Zn-Sn-O based resistive random access memory“. In 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). IEEE, 2015. http://dx.doi.org/10.1109/ipfa.2015.7224421.
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Sun, Peng, Cristina Andersson, Xicheng Wei, Zhaonian Cheng, Dongkai Shangguan und Johan Liu. „Microstructural evolution of Sn-Zn based lead free solders after temperature and humid atmosphere exposure“. In 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. IEEE, 2005. http://dx.doi.org/10.1109/hdp.2005.251397.
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Kang, Ning, Mingliang Huang, Qiang Zhou und Haitao Ma. „Mechanical properties and electrochemical corrosion behavior of Al-Cu solder joint with Sn-Zn based solder“. In High Density Packaging (ICEPT-HDP). IEEE, 2011. http://dx.doi.org/10.1109/icept.2011.6066846.
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Huang, Jia-Qiang, Min-Bo Zhou, Chang-Zheng Li, Xiao Ma und Xin-Ping Zhang. „Processing performance and microstructure of Sn-Zn based solders modified by Bi and mixed rare earth elements“. In 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP). IEEE, 2012. http://dx.doi.org/10.1109/icept-hdp.2012.6474632.
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Che, Hanqing, Stephen Yue, Phuong Vo, Amir Nobari und Ana Da Silva Marques. „Metallization of Polymers by Cold Spraying with Low Melting Point Powders“. In ITSC2019, herausgegeben von F. Azarmi, K. Balani, H. Koivuluoto, Y. Lau, H. Li, K. Shinoda, F. Toma, J. Veilleux und C. Widener. ASM International, 2019. http://dx.doi.org/10.31399/asm.cp.itsc2019p0586.
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Abstract Tin coatings have been successfully applied to polymeric substrates by means of cold spraying. In this work, three low melting point powders, including Sn, Sn-Zn, and Sn-Bi, are cold sprayed onto various polymeric substrates and different combinations of gas temperature and pressure are assessed. Based on the results, the effect of melting points on the cold sprayability of feedstock powders is discussed.
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Zhang, T., E. Padyyodi, R. N. Raoelison und J. C. Sagot. „Sublayer-Assisted Cold Spray Metallization of Carbon Fiber Reinforced Composites“. In ITSC2022. DVS Media GmbH, 2022. http://dx.doi.org/10.31399/asm.cp.itsc2022p0314.
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Abstract In order to investigate the potentials to improve the deposition efficiency and to functionalize the polymer-based substrates, six configurations of microparticles Sn, Zn, Al, Sn+Al2O3, Al+Al2O3, Cu+Al2O3 were cold sprayed on the substrate of Carbon Fiber Reinforced Polymer (CFRP) composites equipped with Cu-based sublayer or Al-based sublayer. The process conditions were kept unchanged. Microanalysis of sublayers and coatings was performed via a Scanning Electronic Microscope (SEM), the deposition mechanisms of different powders couplings on CFRP substrate were then discussed. The results indicated that although the deposition efficiencies were negative, the systems of Zn, Al and Al+Al2O3 perform better among all the configurations. It was found that the addition of alumina led to a lower deposition efficiency (DE), compared to the corresponding pure coatings. For single-component Sn, Zn and Al powders, they all showed an increasing trend of DE when changing the substrate from Cu-based systems to Al-based systems. The aim of this present work is to elaborate the intrinsic causes of erosion issues and to provide a reference value for picking spraying materials and preparing functionalized CFRP substrates. According to the SEM analysis, the insufficient deformation and escape behaviours of spherical copper powders explained for the difficulty of coating formation. It was noticeable that the surfaces of Al-based systems were more uniform than those of Cu-based ones, due to their desirable deformation abilities. Besides, the significant flattened particles, material mixing and melting phenomenon were observed in Al-involved systems, which would definitely contribute to the adhesive bonding between coating and substrate.
Berichte der Organisationen zum Thema "Zn and Sn based promoters"
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Leybourne, M. I., J. M. Peter, M A Schmidt, D. Layton-Matthews, A. Voinot und L. Mathieu. Geochemical evidence for a magmatic contribution to the metal budget of the Windy Craggy Cu-Co(±Zn) volcanogenic massive-sulfide deposit, northwestern British Columbia. Natural Resources Canada/CMSS/Information Management, 2022. http://dx.doi.org/10.4095/328018.
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Volcanogenic massive-sulfide (VMS) deposits may have had metal contributions from magmatic degassing and leaching of footwall rocks. The Windy Craggy Cu-Co-Zn VMS deposit in northwestern British Columbia may include magmatic contributions, based on laser-ablation inductively coupled plasma mass spectrometry (LA-ICP-MS) of fluid inclusions (enriched in Sb, Sn, and Bi) and lithogeochemistry. Sulfide-mineral trace-element abundances in the massive-sulfide orebody, underlying stockwork zone, gold zone, and altered and unaltered mafic rock and argillite were analyzed by LA-ICP-MS. Elevated Au, W, As, Bi, Sb, Se, Te, Tl, Ag, Co, and Mo contents occur within the gold and/or stockwork zones. Increasing 'magmatic metals' with increasing Co/Ni values suggest direct magmatic contribution to the deposit. Covariation of Co with these so-called 'magmatic elements' indicates that it, too, may be of magmatic origin, sourced via fluids exsolved from a crystallizing magma; however, evidence from the composition of rocks and sulfide minerals from Windy Craggy and other VMS deposits suggests that there is probably no meaningful distinction between hydrothermal leaching and direct magmatic contributions and that most - if not all - fluids that form VMS deposits should be termed 'magmatic-hydrothermal'.