Auswahl der wissenschaftlichen Literatur zum Thema „Wafer-Scale mapping“
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Zeitschriftenartikel zum Thema "Wafer-Scale mapping":
Tajima, Michio, E. Higashi, Toshihiko Hayashi, Hiroyuki Kinoshita und Hiromu Shiomi. „Characterization of SiC Wafers by Photoluminescence Mapping“. Materials Science Forum 527-529 (Oktober 2006): 711–16. http://dx.doi.org/10.4028/www.scientific.net/msf.527-529.711.
Mackenzie, David M. A., Kristoffer G. Kalhauge, Patrick R. Whelan, Frederik W. Østergaard, Iwona Pasternak, Wlodek Strupinski, Peter Bøggild, Peter U. Jepsen und Dirch H. Petersen. „Wafer-scale graphene quality assessment using micro four-point probe mapping“. Nanotechnology 31, Nr. 22 (13.03.2020): 225709. http://dx.doi.org/10.1088/1361-6528/ab7677.
Miner, C. J. „Wafer-scale temperature mapping for molecular beam epitaxy and chemical beam epitaxy“. Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 11, Nr. 3 (Mai 1993): 998. http://dx.doi.org/10.1116/1.586910.
Buron, Jonas D., David M. A. Mackenzie, Dirch H. Petersen, Amaia Pesquera, Alba Centeno, Peter Bøggild, Amaia Zurutuza und Peter U. Jepsen. „Terahertz wafer-scale mobility mapping of graphene on insulating substrates without a gate“. Optics Express 23, Nr. 24 (16.11.2015): 30721. http://dx.doi.org/10.1364/oe.23.030721.
Crovetto, Andrea, Patrick Rebsdorf Whelan, Ruizhi Wang, Miriam Galbiati, Stephan Hofmann und Luca Camilli. „Nondestructive Thickness Mapping of Wafer-Scale Hexagonal Boron Nitride Down to a Monolayer“. ACS Applied Materials & Interfaces 10, Nr. 30 (06.07.2018): 25804–10. http://dx.doi.org/10.1021/acsami.8b08609.
Meshot, Eric R., Sei Jin Park, Steven F. Buchsbaum, Melinda L. Jue, Tevye R. Kuykendall, Eric Schaible, Leonardus Bimo Bayu Aji, Sergei O. Kucheyev, Kuang Jen J. Wu und Francesco Fornasiero. „High-yield growth kinetics and spatial mapping of single-walled carbon nanotube forests at wafer scale“. Carbon 159 (April 2020): 236–46. http://dx.doi.org/10.1016/j.carbon.2019.12.023.
Tian, Mengchuan, Ben Hu, Haifang Yang, Chengchun Tang, Mengfei Wang, Qingguo Gao, Xiong Xiong et al. „Wafer Scale Mapping and Statistical Analysis of Radio Frequency Characteristics in Highly Uniform CVD Graphene Transistors“. Advanced Electronic Materials 5, Nr. 4 (13.02.2019): 1800711. http://dx.doi.org/10.1002/aelm.201800711.
Yao, Yong Zhao, Yukari Ishikawa, Koji Sato, Yoshihiro Sugawara, Katsunori Danno, Hiroshi Suzuki und Takeshi Bessho. „Large-Area Mapping of Dislocations in 4H-SiC from Carbon-Face (000-1) by Using Vaporized KOH Etching near 1000 °C“. Materials Science Forum 740-742 (Januar 2013): 829–32. http://dx.doi.org/10.4028/www.scientific.net/msf.740-742.829.
Shih, Po-Chou, Chun-Chin Hsu und Fang-Chih Tien. „Automatic Reclaimed Wafer Classification Using Deep Learning Neural Networks“. Symmetry 12, Nr. 5 (02.05.2020): 705. http://dx.doi.org/10.3390/sym12050705.
Lang, Simon, Alexandra Schewski, Ignaz Eisele, Christoph Kutter und Wilfried Lerch. „(Best Paper Award) Aluminum Josephson Junction Formation on 200mm Wafers Using Different Oxidation Techniques“. ECS Meeting Abstracts MA2023-01, Nr. 29 (28.08.2023): 1791. http://dx.doi.org/10.1149/ma2023-01291791mtgabs.
Dissertationen zum Thema "Wafer-Scale mapping":
Jrondi, Aiman. „Optimisation de couches minces de nitrures de métaux de transition pour application micro-supercondensateurs“. Electronic Thesis or Diss., Université de Lille (2022-....), 2023. https://pepite-depot.univ-lille.fr/ToutIDP/EDSMRE/2023/2023ULILR074.pdf.
Responding to the growing demand for compact energy solutions in the Internet of Things, our research has optimized micro-supercapacitors using vanadium nitride (VN) and molybdenum nitride (Mo2Ny), developed through magnetron sputtering in a reactive atmosphere, focusing on the crucial role of nitrogen concentration in the plasma. For VN, thanks to the optimization of deposition parameters, we achieve an exceptional surface capacity of approximately 1.4 F.cm⁻² (for a 32 µm thick film) and unprecedented cycling stability, resisting performance degradation even after 150,000 high-rate charging cycles, with a 25% capacity difference between scanning speeds of 0.2 and 1.6 V.s−1. This enduring performance extended over 13 months of storage in air, with an impressive capacity retention of 85% after 50,000 cycles, indicating very low aging of the optimized VN electrodes.In contrast, for Mo2Ny, optimizing deposition conditions led to a porous film, with a specific capacity equal to VN in 1M KOH electrolyte and superior in 0.5M H2SO4, positioning it as a potential positive micro-electrode for asymmetric micro-supercapacitors. Furthermore, our research also underscores the critical importance of homogeneity mapping to ensure reproducibility and large-scale efficiency, enhancing the Technology Readiness Level (TRL) in microelectronics processes, and paving the way for a successful transition of MSC technology from the laboratory to industry
Konferenzberichte zum Thema "Wafer-Scale mapping":
Lin, Yishuang, Rongjian Liang, Yaguang Li, Hailiang Hu und Jiang Hu. „Mapping Large Scale Finite Element Computing on to Wafer-Scale Engines“. In 2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC). IEEE, 2022. http://dx.doi.org/10.1109/asp-dac52403.2022.9712538.
Rahman, Anis. „T-ray Profile Mapping for Wafer-scale Die Sorting and Yield Improvement“. In 3D Image Acquisition and Display: Technology, Perception and Applications. Washington, D.C.: Optica Publishing Group, 2023. http://dx.doi.org/10.1364/3d.2023.dm4a.3.
Wu, Zon-Ru, Tzu-Chieh Kao, Chia-Wei Kao, Ping-Chien Chang, Wei Lin und Yung-Jr Hung. „Wafer-scale grating mapping system for rapid pitch and diffraction efficiency measurement“. In 2019 24th OptoElectronics and Communications Conference (OECC) and 2019 International Conference on Photonics in Switching and Computing (PSC). IEEE, 2019. http://dx.doi.org/10.23919/ps.2019.8817627.
„A Software Framework for Mapping Neural Networks to a Wafer-scale Neuromorphic Hardware System“. In 6th International Workshop on Artificial Neural Networks and Intelligent Information Processing. SciTePress - Science and and Technology Publications, 2010. http://dx.doi.org/10.5220/0003024200430052.
James, Michael, Marvin Tom, Patrick Groeneveld und Vladimir Kibardin. „ISPD 2020 Physical Mapping of Neural Networks on a Wafer-Scale Deep Learning Accelerator“. In ISPD '20: International Symposium on Physical Design. New York, NY, USA: ACM, 2020. http://dx.doi.org/10.1145/3372780.3380846.
Warn, Colin, Andriy Sherehiy, Moath Alqatamin, Brooke Ritz, Ruoshi Zhang, Sri S. Chowdhury, Danming Wei und Dan O. Popa. „Machine Vision Tracking and Automation of a Microrobot (sAFAM)“. In ASME 2022 17th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2022. http://dx.doi.org/10.1115/msec2022-85424.