Dissertationen zum Thema „Thermal and optical stress“
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Kylner, Carina. „Light scattering for analysis of thermal stress induced deformation in thin metal films“. Doctoral thesis, KTH, Fysik, 1997. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-2547.
Der volle Inhalt der QuelleNR 20140805
Amazirh, Abdelhakim. „Monitoring crops water needs at high spatio-temporal resolution by synergy of optical/thermal and radar observations“. Thesis, Toulouse 3, 2019. http://www.theses.fr/2019TOU30101.
Der volle Inhalt der QuelleOptimizing water management in agriculture is essential over semi-arid areas in order to preserve water resources which are already low and erratic due to human actions and climate change. This thesis aims to use the synergy of multispectral remote sensing observations (radar, optical and thermal data) for high spatio-temporal resolution monitoring of crops water needs. In this context, different approaches using various sensors (Landsat-7/8, Sentinel-1 and MODIS) have been developed to provide information on the crop Soil Moisture (SM) and water stress at a spatio-temporal scale relevant to irrigation management. This work fits well the REC "Root zone soil moisture Estimates at the daily and agricultural parcel scales for Crop irrigation management and water use impact: a multi-sensor remote sensing approach" (http://rec.isardsat.com/) project objectives, which aim to estimate the Root Zone Soil Moisture (RZSM) for optimizing the management of irrigation water. Innovative and promising approaches are set up to estimate evapotranspiration (ET), RZSM, land surface temperature (LST) and vegetation water stress through SM indices derived from multispectral observations with high spatio-temporal resolution. The proposed methodologies rely on image-based methods, radiative transfer modelling and water and energy balance modelling and are applied in a semi-arid climate region (central Morocco). In the frame of my PhD thesis, three axes have been investigated. In the first axis, a Landsat LST-derived RZSM index is used to estimate the ET over wheat parcels and bare soil. The ET modelling estimation is explored using a modified Penman-Monteith equation obtained by introducing a simple empirical relationship between surface resistance (rc) and a RZSM index. The later is estimated from Landsat-derived land surface temperature (LST) combined with the LST endmembers (in wet and dry conditions) simulated by a surface energy balance model driven by meteorological forcing and Landsat-derived fractional vegetation cover. The investigated method is calibrated and validated over two wheat parcels located in the same area near Marrakech City in Morocco. In the next axis, a method to retrieve near surface (0-5 cm) SM at high spatial and temporal resolution is developed from a synergy between radar (Sentinel-1) and thermal (Landsat) data and by using a soil energy balance model. The developed approach is validated over bare soil agricultural fields and gives an accurate estimates of near surface SM with a root mean square difference compared to in situ SM equal to 0.03 m3 m-3. In the final axis a new method is developed to disaggregate the 1 km resolution MODIS LST at 100 m resolution by integrating the near surface SM derived from Sentinel-1 radar data and the optical-vegetation index derived from Landsat observations. The new algorithm including the S-1 backscatter as input to the disaggregation, produces more stable and robust results during the selected year. Where, 3.35 °C and 0.75 were the lowest RMSE and the highest correlation coefficient assessed using the new algorithm
Schulze, Christopher A. [Verfasser]. „Minimizing Thermal Stress in Glass Production Processes : Model Reduction and Optimal Control / Christopher A Schulze“. Aachen : Shaker, 2007. http://d-nb.info/1166509206/34.
Der volle Inhalt der QuelleÅberg, Jonas. „On the Experimental Determination of Damping of Metals and Calculation of Thermal Stresses in Solidifying Shells“. Doctoral thesis, KTH, Materialvetenskap, 2006. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-4038.
Der volle Inhalt der QuelleQC 20100929
Lankford, Maggie E. „Measurement of Thermo-Mechanical Properties of Co-Sputtered SiO2-Ta2O5 Thin Films“. University of Dayton / OhioLINK, 2021. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1627653071556618.
Der volle Inhalt der QuelleKravchenko, Grygoriy A. „Crack patterns in thin films and X-ray optics thermal deformations“. [Tampa, Fla] : University of South Florida, 2008. http://purl.fcla.edu/usf/dc/et/SFE0002770.
Der volle Inhalt der QuelleYi, Duo. „Intégration de capteurs à fibre optique par projection thermique pour des applications de contrôle de structures intelligentes“. Thesis, Belfort-Montbéliard, 2016. http://www.theses.fr/2016BELF0285/document.
Der volle Inhalt der QuelleThis paper presents the modeling, simulation, experimentation and design of a smart composite structrure for high temperature measurements (up to 300 °C). In order to achieve this goal, a high temperature resistant metal coated optical fiber was considered and integrated into alumina coating. The smart composite structure consists of a substrate, a coating and an intensity modulated optical fiber temperature sensor. Firstly, an estimation of heat flux based on a experimental thermogram was firstly carried out in order to feed a numerical modeling. Then, different modelings were built to evaluate the surface temperature levels as well as the composite stress levels. The simulation showed that the composite (substrate and coating) could be considered as a thermally thin medium, the heat propagation within the composite was fast and could be estimated at a scale of millisecond. The stresses remained relatively uniform during the heating process but intensified during the cooling process. The modeling also showed that the stresses are not symmetrical in the fiber and depend on the position of the fiber relative to the substrate. After a modeling evaluation of the thermal levels as well as the stresses that may be achieved in the composite, an experimental step integrating a optical fiber into a thermal coating was carried out. Microscopic observation of surface and cross section were conducted in order to analyze the characteristics of the integrated fiber. The mechanical strength of the integrated fiber was then measured and the optical attenuation during the integration process as well as the thermal behavior of the integrated fiber during the thermal cycling were evaluated. Finally, an intensity modulated optical fiber temperature sensor was designed and integrated into ceramic coating by thermal spraying. A temperature measuring system was designed and the first tests of the thermal response as well as thermal cycling of temperature sensor were carried out. This study demonstrates the feasibility of designing a high temperature resistant smart composite structure by integrating an intensity modulated optical fiber temperature sensor in a ceramic coating elaborated by thermal spraying
Zhang, Bufa. „Optical methods of thermal diffusivity measurement“. Thesis, London South Bank University, 1996. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.336374.
Der volle Inhalt der QuelleVuppala, Archana. „Thermal and thermal stress analyses of the state-changing tooling“. abstract and full text PDF (free order & download UNR users only), 2008. http://0-gateway.proquest.com.innopac.library.unr.edu/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:1460787.
Der volle Inhalt der QuelleSun, Mengyue SUN. „Optical sensor for normal stress distribution“. University of Akron / OhioLINK, 2018. http://rave.ohiolink.edu/etdc/view?acc_num=akron1525432600494617.
Der volle Inhalt der QuelleKoetniyon, Saiprasit. „Thermal stress analysis of automotive disc brakes“. Thesis, University of Leeds, 2000. http://etheses.whiterose.ac.uk/2938/.
Der volle Inhalt der QuelleHu, Yajie. „Thermal Barrier Coating Modeling for Stress Analysis“. Thesis, Université d'Ottawa / University of Ottawa, 2021. http://hdl.handle.net/10393/42668.
Der volle Inhalt der QuelleHosie, Andrew. „Differentiating thermal from non-thermal eccrine sweating during exercise and heat stress“. Access electronically, 2002. http://www.library.uow.edu.au/adt-NWU/public/adt-NWU20041105.114628/index.html.
Der volle Inhalt der QuelleLiang, L. H., und Y. G. Wei. „Ultralow Thermal Conductivity and Thermal Stress of Ceramics with Surface Nanowire-structures“. Thesis, Sumy State University, 2012. http://essuir.sumdu.edu.ua/handle/123456789/34880.
Der volle Inhalt der QuelleMoon, Il Kweon. „Optical performance of bimetallic mirrors in thermal environments“. Diss., The University of Arizona, 2001. http://hdl.handle.net/10150/279805.
Der volle Inhalt der QuelleRoshan, Fekr Masoud. „Stress analysis of an optical ground wire“. Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1999. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape4/PQDD_0034/NQ64657.pdf.
Der volle Inhalt der QuellePandhari, Abhijit. „Modeling of thermal stress cycling in refractory materials“. Thesis, University of British Columbia, 2017. http://hdl.handle.net/2429/62359.
Der volle Inhalt der QuelleApplied Science, Faculty of
Materials Engineering, Department of
Graduate
Abedian, Ali. „Thermal stress analysis of unidirectional fiber reinforced composites“. Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1998. http://www.collectionscanada.ca/obj/s4/f2/dsk2/tape17/PQDD_0026/NQ32776.pdf.
Der volle Inhalt der QuelleRao, Hejamadi Dhananjay. „Thermal stress in concrete slabs under different constraints“. Morgantown, W. Va. : [West Virginia University Libraries], 2006. https://eidr.wvu.edu/etd/documentdata.eTD?documentid=4752.
Der volle Inhalt der QuelleTitle from document title page. Document formatted into pages; contains viii, 127 p. : ill. (some col.). Includes abstract. Includes bibliographical references (p. 123-126).
Walker, Breanna E. „The Effects of Thermal Stress on Balanus glandula“. Scholarship @ Claremont, 2013. http://scholarship.claremont.edu/scripps_theses/189.
Der volle Inhalt der QuelleBRAGA, LEDA MARIA PASSOS FARIA. „STRESS ANALYSIS OF THERMAL NATURE UNDER VISCOELATIC BEHAVIOR“. PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIRO, 1988. http://www.maxwell.vrac.puc-rio.br/Busca_etds.php?strSecao=resultado&nrSeq=19060@1.
Der volle Inhalt der QuelleEste trabalho apresenta a modelagem teórica e correspondentes soluções numéricas, associadas ao problema de tensões e deformações num cilindro longo de material viscoelástico, submetido a resfriamento em meio homogêneo. Apresentam-se as hipóteses adotadas na caracterização térmica e mecânica do material, bem como procedimentos e resultados experimentais obtidos na aplicação destas suposições e técnicas para a resina poliéster.
The problem of computing stress and strain histories under viscoelastic behaviour in a long cylinder subjected to rapid cooling is considered. The theoretical formulation is presented together with the assumptions made in both thermal and mechanical material characterization. Experimental techniques and results obtained to polyester resin are also presented.
URURAHY, MARCELO FERREIRA PINTO. „THEORETICAL-EXPERIMENTAL THERMAL STRESS ANALYSIS IN VISCOELASTIC CYLINDERS“. PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIRO, 1991. http://www.maxwell.vrac.puc-rio.br/Busca_etds.php?strSecao=resultado&nrSeq=19375@1.
Der volle Inhalt der QuelleApresenta-se neste trabalho o desenvolvimento de um modelo teórico-numérico baseado na Teoria da Viscoelasticidade Linear capaz de prever as distribuições transientes e residuais das componentes de tensão e de deformação de um cilindro polimérico longo submetido a resfriamento brusco. Descrevem-se, ainda, os procedimentos experimentais adotados como intuito de se determinarem algumas propriedades térmicas e mecânicas do sistema epóxi DER331/XG0103/XB81215. Finalmente, comparam-se os resultados fornecidos pelo modelo teórico-numérico com resultados experimentais obtidos através da utilização de uma técnica extensométrica conhecida como Método de Sachs.
This work presents the development of a theoretical and numerical model based on the Linear Viscoelastic Theory able to predict the transient and residual stress and deformation distributions in a long polymeric cylinder subject to a rapid cooling. The work describes the experimental procedures adopted aiming to determine some thermal and mechanical properties of the epoxy system DER331/XG0103/XB81215. Finally, the results from the theoretical numerical model are compared to the ones obtained experimentally by na extensometric technique known as Sachs’ Method.
Ntsoane, T. P. „Residual stress in Pt coatings under thermal influence“. Master's thesis, University of Cape Town, 2001. http://hdl.handle.net/11427/8778.
Der volle Inhalt der QuelleResistance thermometers are commonly employed when accurate temperature measurements are required. The detection part consists of a thin metallic film deposited on a ceramic substrate. In this work, commercially manufactured Pt-Al₂O₃ composites annealed at 0°C, 300°C, 600°C and 1170°C above room temperature were investigated for residual stress using the non-destructive X-ray diffraction technique. The apparatus used for the investigation was a Ψ-goniometer with a scintillation detector. The measured data were analysed with "sin²Ψ"-method. The total stress yielded was found to be a superposition of both the thermal and intrinsic stress in the layer. Analytical model, following the method of Tsui and Clyne, was used to resolve the two stress contributions. With the thermal component being constant, the variation of the observed total stress was attributed to the relaxing intrinsic components. Further investigations of the samples included the microstructure studies using Scanning Electron Microscopy (SEM).
Morris, Nathan Bradley. „Physical and physiological considerations for mitigating thermal stress“. Thesis, The University of Sydney, 2018. http://hdl.handle.net/2123/17916.
Der volle Inhalt der QuelleRadhakrishnan, Sadhana. „Stress Analysis of Embedded Devices Under Thermal Cycling“. PDXScholar, 2018. https://pdxscholar.library.pdx.edu/open_access_etds/4075.
Der volle Inhalt der QuelleDaniel, Gwenaelle Monique. „Optical and thermal transport modelling of laser-tissue interaction“. Thesis, University of the West of England, Bristol, 2002. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.392811.
Der volle Inhalt der QuelleWolters, Stephen D. „Thermal infrared and optical observations of near-Earth asteroids“. Thesis, Open University, 2005. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.437781.
Der volle Inhalt der QuelleJohnson, Jeremy A. (Jeremy Andrew). „Optical characterization of complex mechanical and thermal transport properties“. Thesis, Massachusetts Institute of Technology, 2011. http://hdl.handle.net/1721.1/68543.
Der volle Inhalt der QuellePage 176 blank. Cataloged from PDF version of thesis.
Includes bibliographical references (p. 163-175).
Time-resolved impulsive stimulated light scattering (ISS), also known as transient grating spectroscopy, was used to investigate phonon mediated thermal transport in semiconductors and mechanical degrees of freedom linked to structural relaxation in supercooled liquids. In ISS measurements, short optical pulses are crossed to produce a periodic excitation profile in or at the surface of the sample. Light from a probe beam that diffracts off the periodic material response is monitored to observe the dynamics of interest. A number of improvements were put into practice including the ability to separate so-called amplitude and phase grating signal contributions using heterodyne detection. This allowed the measurement of thermal transport in lead telluride and gallium arsenide-aluminum arsenide superlattices, and also provided the first direct observation of the initial crossover from diffusive to ballistic thermal transport in single crystal silicon and gallium arsenide at room temperature. Recent first-principles calculations of the thermal conductivity accumulation as a function of phonon mean free path allowed direct comparison to our measured results. In an effort to test theoretical predictions of the prevailing first principles theory of the glass transition, the mode coupling theory (MCT), photoacoustic measurements throughout much of the MHz acoustic frequency range were conducted in supercooled liquids. Longitudinal and shear acoustic waves were generated and monitored in supercooled liquid triphenyl phosphite in order to compare the dynamics. An additional interferometric technique analogous to ISS was developed to probe longitudinal acoustic waves at lower frequencies than was typically accessible with ISS. Lower frequency acoustic data were collected in supercooled tetramethyl tetraphenyl trisiloxane in conjunction with piezotransducer, ISS, and picosecond ultrasonics measurements to produce the first truly broadband mechanical spectra of a viscoelastic material covering frequencies continuously from mHz to hundreds of GHz. This allowed direct testing of the MCT predicted connection between fast and slow relaxation in supercooled liquids. Measurements of the quasi-longitudinal speed of sound in the energetic material cyclotrimethylene trinitramine (RDX) were also performed with ISS and picosecond ultrasonics from 0.5 to 15 GHz in order to resolve discrepancies in published low and high frequency elastic constants.
by Jeremy A. Johnson.
Ph.D.
Magnabosco, Marina. „Self localization and mapping using optical and thermal imagery“. Thesis, Cranfield University, 2011. http://dspace.lib.cranfield.ac.uk/handle/1826/6704.
Der volle Inhalt der QuelleEvans, Craig A. „The optical and thermal properties of quantum cascade lasers“. Thesis, University of Leeds, 2008. http://etheses.whiterose.ac.uk/5079/.
Der volle Inhalt der QuelleŠumić, Mersiha. „Thermal Performance of a Solarus CPC-Thermal Collector“. Thesis, Högskolan Dalarna, Energi och miljöteknik, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:du-14526.
Der volle Inhalt der QuelleBoussoufi, Félix. „Nanocristaux semi-conducteurs colloïdaux pour dispositifs opto-électroniques : synthèse et stabilité sous contraintes thermiques et optiques“. Electronic Thesis or Diss., Sorbonne université, 2021. http://www.theses.fr/2021SORUS231.
Der volle Inhalt der QuelleColloidal semiconductor nanocrystals have become during the last thirty years a class of materials that can address new technological solutions for many applications, such as light emitting diodes, solar cells, infrared photodetectors, medical imaging systems, etc. Nevertheless, these nanocrystals suffer from poor stability against external stress (heat, light, humidity, oxygen), limiting their use in many applications. Today, it is therefore necessary to study the physicochemical phenomena at the origin of their degradation and to propose new solutions to improve their stability. The main objective of this thesis was to develop an ink of lead sulfide quantum dots (PbS QDs) for a near-infrared photodetector, with stable optoelectronic properties under thermal stress (150 °C for 3 h). The manuscript first presents a study of nanocrystals films made of PbS QDs capped with halide ligands, NH4I and PbX2 (X = I, Br). The optical and photoconductive properties degrade rapidly under the effect of heat, mainly because of the formation of a Pb5S2I6 parasitic phase and of the coalescence of the nanocrystals. An ink of PbS QDs stabilized by CsPbI3 perovskite precursors was subsequently developed. This formulation provides more thermally stable nanocrystal films with better preserved optical, structural and photoconductive properties. These PbS-CsPbI3 QDs films were integrated into a near-infrared (940 nm) photodiode-type photodetector, demonstrating an external quantum efficiency of nearly 49% and a dark current of 10-5 A/cm2, after undergoing the thermal treatment of 150 °C for 3 h. Finally, a spray-drying polymer encapsulation method for CsPbBr3 perovskite nanocrystals is presented. The composite beads, made of acrylate-based polymers, possess a photoluminescence quantum yield of 35% with a fluorescence peak at 518 nm and a half-value width of 22 nm. The encapsulation of the nanocrystals allows an improvement of their photostability, with a stable green emission after 200 h under continuous illumination in an LED/nanocrystal downconverter device
Lu, Kaichang. „Design problems in infra-red optical systems“. Thesis, University of Reading, 1996. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.339522.
Der volle Inhalt der QuelleMallick, Vishal. „Stress analysis of metal/CFRP adhesive joints subjected to the effects of thermal stress“. Thesis, University of Bristol, 1989. http://hdl.handle.net/1983/4b861d50-c290-4ea9-a3ac-94d9b39dfaa6.
Der volle Inhalt der QuelleCockcroft, Steven Lee. „Thermal stress analysis of fused-cast Monofrax-S refractories“. Thesis, University of British Columbia, 1990. http://hdl.handle.net/2429/30991.
Der volle Inhalt der QuelleApplied Science, Faculty of
Materials Engineering, Department of
Graduate
Bosomworth, P. A. „Thermal stress damage resistance of gel-bonded magnesia refractories“. Thesis, University of Leeds, 1986. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.371841.
Der volle Inhalt der QuelleSoomro, A. B. „The generation of thermal stress and strain during quenching“. Thesis, Sheffield Hallam University, 1986. http://shura.shu.ac.uk/20385/.
Der volle Inhalt der QuelleChen, Chung-Yu, und 陳忠佑. „Thermal Stress Analysis for Multi-Channel MT Ferrule and Optical Design for Optical Fiber Package“. Thesis, 2004. http://ndltd.ncl.edu.tw/handle/80989919504515166430.
Der volle Inhalt der Quelle國立臺灣科技大學
機械工程系
92
In recent years, the global communication and internet have been more and more popular. In order to support high fiber count and dense optical connection demand for high-power optical fiber delivery system, multi-fiber with SFF (Small Form Factor) will for sure be the optical fiber connectors in the future and the development of MT connectors will especially become the main trend. The end face cracking of multimode optical fiber will likely be created in epoxy-curing, cleaving and polishing during the assembly process of connector and there will be problems of optical coupling and loss. The aim of this research is focused on the optical fiber in epoxy-cured ferrule module of MT connectors, which has been rarely discussed so far. This study applies FEA to investigate optical fiber stress in epoxy-curing ferrule module. In addition, the Taguchi Method can help in understanding the effects of design factors in the process and finding the optimal factor combinations to reduce the rate of defected connector. The optimal results will be verified by the connector assembly experiment. It is found that the thermal stress of optical fiber is in direct proportion to the heating temperature. It is better to keep the heating temperature under 120℃. Residual stress of optical fiber stays constant after cooling for a certain time. The larger size of ferrule or the less optical fiber count in the same size of ferrule, the bigger stress optical fiber will produce. In addition, the Taguchi Method provides a optimal epoxy-curing process parameter to successfully reduce the stress of optical fiber and decrease the time of fabrication. The stress of optical fiber is influenced by a collocation of optical fiber diameter, heating temperature, and cooling time.
張振裕. „The thermal stress analysis of the forming mold of glass optical elments“. Thesis, 1993. http://ndltd.ncl.edu.tw/handle/23338637118457629891.
Der volle Inhalt der QuelleLin, Chi-Chau, und 林啟超. „The Study on the Stress and Fatigue Life in Ferrule-Epoxy-Fiber Module of Optical Fiber Connector under Thermal Cycling“. Thesis, 2003. http://ndltd.ncl.edu.tw/handle/17859809882357740553.
Der volle Inhalt der Quelle國立中山大學
機械與機電工程學系研究所
91
The effects of different ferrule length and epoxy layer thickness of the module of optical fiber connector under thermal cycling are investigated in this thesis. The finite element method package, MSC. MARC, is used in this study and the coupled thermal-elastic-plastic model is employed in the analysis. The mechanical behavior and life prediction with different length of ferrule and thickness of epoxy layer are considered. It is shown that the thickness of epoxy layer has the major effect on the life of the module. The stress and strain in the fiber and epoxy layer are decreasing with increasing of ferrule length, and the life of the module is increasing with increasing of thickness of epoxy layer. Finally, we recommend the ferrule length can be designed between 7.89mm ~10.5mm.
Mow-Lowry, Conor Malcolm. „Thermal noise and optical cooling“. Phd thesis, 2011. http://hdl.handle.net/1885/150253.
Der volle Inhalt der Quelle„Stress-engineered optical elements“. UNIVERSITY OF ROCHESTER, 2008. http://pqdtopen.proquest.com/#viewpdf?dispub=3300620.
Der volle Inhalt der QuelleHong, C. C., und 洪志強. „INTERLAMINAR STRESS AND THERMAL STRESS ANALYSES OF LAMINATED PLATES“. Thesis, 1999. http://ndltd.ncl.edu.tw/handle/18164329162890659488.
Der volle Inhalt der Quelle國立中興大學
應用數學系
87
In the part of the interlaminar stresses analyses, a stress-function-based variational approach is used to determine the interlaminar stresses in a multilayered strip of laminate subject to arbitrary combinations of axial extension, bending, the steady and the unsteady aerodynamic loading of fluid flow over the upper surface of laminated composite plate. The finite difference method for determining the interlaminar stresses in a laminated strip is used. Symmetric four-layer, cross-ply and angle-ply laminates are considered in detail. Some numerical solutions by using a personal computer are obtained. The present results for four-layer laminates show that the aerodynamic loading has significant effects on the interlaminar stresses near the free-edge regions. In the part of thermal stress analyses, a GDQ (Generalized Differential Quadrature) method is presented for the thermal bending of numerical interlaminar stress and displacement in eight-layer of orthotropic plate with unidirectional, cross-ply and angle-ply laminate under thermally expansion load and uniform transverse load. When the moderately thick of orthotropic, anisotropic, laminated plate is considered, the transverse shear deformation in thermal stress and deflection of bending analysis should be involved.
Wen-TungYang und 楊文通. „Analogies between optical and thermal propagation“. Thesis, 2017. http://ndltd.ncl.edu.tw/handle/rjwt9f.
Der volle Inhalt der Quelle國立成功大學
光電科學與工程學系
105
A analogy between optical and thermal propagation in heterogeneous anisotropic media had been proposed recently. All thermal parameters are related to optical ones in artificial metallic media, thus making possible to use numerical codes developed for optics. Our develops and analyzes a metamaterial for heat dissipation. Similar photonic crystal, some frequency of photonic can penetrate, another frequency of photonic can’t penetrate. Electromagnetic and heat diffusion simulations based on the finite element method (FEM) are accomplished to verify that the design of the proposed film. A decrease of frequency can be achieved high penetration rate.
Wang, Jenq-Chyi, und 汪正祺. „Thermal stress analysis of semiconductor wafers in rapid thermal processing“. Thesis, 1998. http://ndltd.ncl.edu.tw/handle/88438136622610522548.
Der volle Inhalt der Quelle國立成功大學
機械工程學系
86
Thermal stresses are an important consideration in production processes involving large temperature changes. Recently, Thermal stresses have also become significant in semiconductors related to wafers. To calculate the thermal stresses, we analysis four kinds of boundary conditions. This article investigates the thermal stress in a 8 inch wafer with its surfaces subjected to heat radiation. In order to obtain the solution of the governing equation, which is a partial differential equation, the following procedures of analysis are used. 1. Normalize the governing partial differential equation of temperature subject to appropriate initial and boundary conditions. Use finite-difference method to transform the governing equation, initial and boundary conditions. 2. Normalize the governing partial differential equation of stress subject to appropriate initial and boundary conditions. 3. Substitute the temperature distribution into the governing equation of thermal stresses. Then use Simpson, s method to obtain the thermal stress distribution as a function of time and position of the wafer.
Abdo, Amr Yehia. „Modeling of the thermal response and the thermal distortion of optical mask during optical lithography exposure process“. 1999. http://catalog.hathitrust.org/api/volumes/oclc/44731843.html.
Der volle Inhalt der QuelleHuang, Chih-Hung, und 黃志宏. „Thermal Stress Analysis of Electronic Packages“. Thesis, 2000. http://ndltd.ncl.edu.tw/handle/83014860367136633742.
Der volle Inhalt der Quelle國立交通大學
機械工程系
88
The aim of this study is to investigate the failure behavior induced by thermal cyclic loading of the Thermal -Enhanced PBGA. In this study, thermal stress analyses of Au wire, interfaces of different materials and solder balls are carried out by using ANSYS finite element simulation code. In addition, local heat transfer coefficients distribution is used to simulate conjugate heat transfer problem on the package surfaces. Results show that there are defects happed in some positions contacted with heat spreader. Cracks in the chip corner points and fatigue failure in the edge balls are also predicted by increasing thermal cyclic loading times.
Chen, Yao-Shing, und 陳耀星. „Thermal Stress Measurements in Electronics Packages by Piezoresistive Stress Sensor“. Thesis, 1999. http://ndltd.ncl.edu.tw/handle/76763367609882783074.
Der volle Inhalt der Quelle中正理工學院
電機工程研究所
87
ABSTRACT The purpose of this article is quantitatively extracting the stress distribution in microelectronics packages through in-situ and non-destructive measurements. To this end, the P-type and N-type piezoresistive stress sensors were first designed and manufactured by conventional IC process. Secondly, the stress sensors were packaged and the resistance variations of the sensors were measured at different temperature so that the relationship between stress distribution and temperature were extracted according to the piezoresistive theorem. The experiment results showed that the resistance of the sensors increased with temperature in the range of 30~130℃. For N-type sensors, linear relationships were derived between stress and temperature. However, since unreasonable results were derived from P-type sensors, further study on P-type sensors will be needed. Experiments on power dissipation from the test chips in package were finally performed, and linear curves were derived between stress and the distance from heater to the sensors. It is concluded that N-type piezoresistive stress sensors are able to extract stress in microelectronics packages with good accuracy.
Liu, Kun-I., und 劉坤一. „Transient Thermal Stress and Residual Stress analysis in Plate Welding“. Thesis, 1993. http://ndltd.ncl.edu.tw/handle/18338594692718581054.
Der volle Inhalt der QuelleLiu, Kun-Yi, und 劉坤一. „ransient thermal stress and residual stress analysis in plate welding“. Thesis, 1993. http://ndltd.ncl.edu.tw/handle/03654790707247342621.
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