Inhaltsverzeichnis
Auswahl der wissenschaftlichen Literatur zum Thema „Substrate interface“
Geben Sie eine Quelle nach APA, MLA, Chicago, Harvard und anderen Zitierweisen an
Machen Sie sich mit den Listen der aktuellen Artikel, Bücher, Dissertationen, Berichten und anderer wissenschaftlichen Quellen zum Thema "Substrate interface" bekannt.
Neben jedem Werk im Literaturverzeichnis ist die Option "Zur Bibliographie hinzufügen" verfügbar. Nutzen Sie sie, wird Ihre bibliographische Angabe des gewählten Werkes nach der nötigen Zitierweise (APA, MLA, Harvard, Chicago, Vancouver usw.) automatisch gestaltet.
Sie können auch den vollen Text der wissenschaftlichen Publikation im PDF-Format herunterladen und eine Online-Annotation der Arbeit lesen, wenn die relevanten Parameter in den Metadaten verfügbar sind.
Zeitschriftenartikel zum Thema "Substrate interface"
1
Abualigaledari, Sahar, Mehdi Salimi Jazi und Fardad Azarmi. „Investigation on Fracture Toughness of Coating/Substrate Interface - Case Study: Thermally Sprayed Nickel Based Superalloy on Variety of Substrates“. Materials Science Forum 900 (Juli 2017): 133–36. http://dx.doi.org/10.4028/www.scientific.net/msf.900.133.
Der volle Inhalt der QuelleAnnotation:
Nickel based superalloy materials have being extensively used in aerospace and other high tech industries. In the present work, the effect of different substrates on the mechanical properties of the coating-substrate interface has been studied. To this end, alloy 718, commercially known as Inconel 718, was deposited on alloy 718 and low carbon steel substrates using High Velocity Oxygen Fuel (HVOF) technique at the same condition. The bonding strength of the interfaces evaluated using Vickers indentation test on the coating-substrate interface. Hardness results were subjected to a valid empirical method to estimate the fracture toughness. Results illustrated that using the same material as coating and the substrate led to stronger interface bonding strength due to higher hardness, fracture toughness, and less crack propagation.
2
Pal, Sunil K., Youngsuk Son, Theodorian Borca-Tasciuc, Diana-Andra Borca-Tasciuc, Swastik Kar, Robert Vajtai und Pulickel M. Ajayan. „Thermal and electrical transport along MWCNT arrays grown on Inconel substrates“. Journal of Materials Research 23, Nr. 8 (August 2008): 2099–105. http://dx.doi.org/10.1557/jmr.2008.0256.
Der volle Inhalt der QuelleAnnotation:
This work reports on thermal and electrical conductivities and interface resistances for transport along aligned multiwalled carbon nanotubes (CNT) films grown on a nickel superalloy (Inconel) substrate. The measured specific thermal resistance of the combined Inconel–CNT and indium–CNT interfaces is of the same order as reported for CNT and silicon or SiO2 interfaces but much higher than theoretical predictions considering perfect contact between the tubes and substrate. Imperfect mechanical contact with the substrate and a large contribution caused by indium–CNT interface are thought to be mainly responsible for the high interface resistances and the low effective values of thermal and electrical conductivities. However, reported results represent an incentive for further research on CNT synthesis on metallic substrates for thermal management applications and pave the way for much easier integration of carbon nanotubes in electronic applications.
3
An, Bingbing. „Delamination of Stiff Films on Pressure Sensitive Ductile Substrates“. International Journal of Applied Mechanics 11, Nr. 02 (März 2019): 1950014. http://dx.doi.org/10.1142/s1758825119500145.
Der volle Inhalt der QuelleAnnotation:
Stiff thin films supported by pressure sensitive ductile solids are an ubiquitous architecture appearing in a wide range of applications. The film rupture and delamination of films are important reliability issues of such an architecture. In this study, we investigate the synergistic effects of plastic deformation of substrates and fracture properties of film/substrate interface on the delamination of films. The focus of this study is on the interplay between the debonding of the interface and the plastic deformation of substrates. Finite deformation analyses are carried out for a stiff film deposited on a soft substrate with the substrate subjected to stretching. The fracture process of film/substrate interface is represented by a cohesive zone model, and the substrate is modeled as an elastic–plastic solid with pressure sensitive and plastically dilatant plastic flow. It is found that increasing the degree of pressure sensitivity of substrate can generate large plastic deformation, promoting crack tip blunting and thereby retarding delamination of film/substrate interface. Whereas, the increase in the degree of plastic dilatancy of substrate gives rise to the limited plastic deformation and leads to poor resistance to interface delamination. The strain hardening of substrate also affects the film/substrate debonding; the substrate with weakly post-yield strain hardening behavior contributes to enhanced resistance to interface delamination. It is further identified that the fracture properties of interface play an important role in activating plastic deformation of substrates. The film/substrate interface with high stiffness, large cohesive strength and high toughness enables the substrate to undergo significant plastic deformation, which suppresses the film/substrate delamination.
4
Wang, Yun, Shihao Wang, Zhongping Que, Changming Fang, Teruo Hashimoto, Xiaorong Zhou, Quentin M. Ramasse und Zhongyun Fan. „Manipulating Nucleation Potency of Substrates by Interfacial Segregation: An Overview“. Metals 12, Nr. 10 (29.09.2022): 1636. http://dx.doi.org/10.3390/met12101636.
Der volle Inhalt der QuelleAnnotation:
During solidification of metallic materials, heterogeneous nucleation occurs on substrates, either endogenous or exogenous. The potency of the substrates for nucleation is mainly dependent upon the atomic arrangements on the substrate surface, which are affected by the lattice misfit between the substrate and the nucleated solid, the surface roughness at atomic scale, and the chemical interaction between the substrates and the melt. Extensive examinations on metal/substrate (M/S) interfaces at atomic scale by the state-of-the-art aberration (Cs) corrected STEM and associated EDS and EELS have shown that alloying elements in liquid melts tend to segregate at the interfaces, leading to the formation of various 2-dimensional compounds (2DCs) or 2-dimensional solutions (2DSs), depending upon segregation behavior of the elements. For instance, Al3Ti 2DC and Ti2Zr 2DC at the Al/TiB2 interface, Y2O3 2DC at the Mg/MgO interface, and a Si-rich 2DS layer at Al-Si/TiB2 interface have been identified. Such interfacial segregations significantly affect nucleation potency of the substrates, resulting in either promoting or impeding the heterogeneous nucleation process during solidification. In this paper, we present an overview of the current studies of interfacial segregation behavior, the structure and chemistry of interfaces, and their impacts on the subsequent heterogeneous nucleation and grain initiation processes. Our focus is on the advances made in the understanding of the mechanisms for nucleation and grain refinement. It is demonstrated that it is feasible to manipulate heterogeneous nucleation by modifying nucleation potency of a substrate through deliberate interfacial segregation of desirable elements, achieving effective control of the grain structure of cast metallic materials.
5
Li, Hui Qing, Cheng Ming Li, Guang Chao Chen, Fan Xiu Lu und Yu Mei Tong. „Analysis of Interface between Free-Standing Diamond Films and Mo Substrates“. Materials Science Forum 475-479 (Januar 2005): 3615–18. http://dx.doi.org/10.4028/www.scientific.net/msf.475-479.3615.
Der volle Inhalt der QuelleAnnotation:
Interfaces between Mo substrate and free-standing diamond films prepared by DC arc plasma jet operated at gas recycling mode were investigated, including for the first time used and multi-time used substrate. The morphology, phase composition and bonding state of elements in the interface between substrates and diamond films were examined by optical microscopy, XRD and XPS. The profiles of carbon concentration of Mo substrates were measured by GDOES. It showed that Mo2C and MoC were formed on the first time used Mo substrate, and MoC was found on diamond films nucleation side after detachment. It suggested that MoC was peeled off from Mo substrate. The stable Mo2C on Mo substrate was formed after multi-time use of Mo substrate. However, MoC has not been found on it. The thickness of carburizing layer on the first time used Mo substrate is up to 30µm, and the carburizing layer on the multi-time used substrate is much thicker than that on the first used. The amorphous carbon in the surface of the substrate and nucleation side of diamond films was found by XPS, including for the first time used and multi-time used substrate.
6
Prasad, Beesabathina D., L. Salamanca-Riba, S. N. Mao, X. X. Xi, T. Venkatesan und X. D. Wu. „Effect of substrate materials on laser deposited Nd1.85Ce0.15CuO4−y films“. Journal of Materials Research 9, Nr. 6 (Juni 1994): 1376–83. http://dx.doi.org/10.1557/jmr.1994.1376.
Der volle Inhalt der QuelleAnnotation:
The growth morphology and interface structure of Nd1.85Ce0.15CuO4−y (NCCO) films grown by pulsed laser deposition on two different types of substrates, “perovskite” LaAlO3 (LAO) and SrTiO3 (STO) and “fluorite” Y2O3-stabilized ZrO2 (YSZ), were studied using cross-sectional electron microscopy. Structurally, the NCCO films are different when grown on the two types of substrates in three aspects: (i) epitaxy, (ii) substrate-film intermixing, and (iii) substrate-film interface roughness. In general, films deposited on “fluorite” substrates showed better superconducting properties than the films grown on “perovskite” substrates, especially for thinner films. Lattice mismatch considerations are not sufficient to explain the observed differences since films grown on the YSZ substrate showed sharp substrate-film interface in spite of their large lattice misfit. The atomic arrangements at the interface were analyzed in terms of electrostatic energy (charge balance) and matching of the oxygen sublattices in order to account for the experimental results.
7
Kis-Varga, Miklos, G. A. Langer, A. Csik, Z. Erdélyi und Dezső L. Beke. „Effect of Substrate Temperature on the Different Diffuseness of Subsequent Interfaces in Binary Multilayers“. Defect and Diffusion Forum 277 (April 2008): 27–31. http://dx.doi.org/10.4028/www.scientific.net/ddf.277.27.
Der volle Inhalt der QuelleAnnotation:
Epitaxial, coherent Mo/V multilayers were deposited by magnetron sputtering on (001) oriented MgO substrates at 873K (sample MoV-T), 923K (sample MoV-U) and 973K (sample MoV-V), respectively. In order to estimate the concentration profiles in our multilayers, a superlattice refinement modelling procedure has been used on high-angle XRD symmetric scans. The Mo/V interfaces were always sharper than V/Mo ones (in this notation the order of element reflects the sequence of deposition: e.g. the Mo/V interface was formed by the deposition of the V on the Mo surface). Furthermore the interface diffuseness was only slightly different at the lowest substrate temperature, but the difference increased with increasing temperature and an abrupt concentration jump could be observed at the Mo/V interface in the sample, sputtered at the 973 K. This indicates that during deposition the interfacial mixing by impact exchange events is important and thermally activated processes (surface diffusion and/or jumps driven by segregation) are less effective. With increasing substrate temperature the thickness of the V/Mo interfaces were unchanged while the Mo/V interface became shaper and sharper i.e. thermally activated jumps were more active during deposition of V atoms. Thus in forming Mo/V interfaces the segregation tendency of V to the Mo surface results in enhanced exchanges between V atoms (buried in the near surface layers of the Mo substrate) and surface Mo atoms, leading to more sharper interface with increasing temperature. On the other hand during the formation of the V/Mo interfaces the chemical thickness of the interface, provided again by impact exchanges, was practically unchanged.
8
ZHAO, HONG-PING, YECHENG WANG, BING-WEI LI und XI-QIAO FENG. „IMPROVEMENT OF THE PEELING STRENGTH OF THIN FILMS BY A BIOINSPIRED HIERARCHICAL INTERFACE“. International Journal of Applied Mechanics 05, Nr. 02 (Juni 2013): 1350012. http://dx.doi.org/10.1142/s1758825113500129.
Der volle Inhalt der QuelleAnnotation:
The peeling behavior of a thin film bonded to a substrate is investigated by using the cohesive interface model. We compare the peeling processes of film/substrate interfaces with three different geometric shapes, including a flat interface, a curved interface of sinusoidal shape, and a wavy interface with two-level sinusoidal hierarchy. The effect of the peeling angle on the maximal peeling strength is also examined. It is demonstrated that the peeling strength can be significantly improved by introducing a hierarchical wavy morphology at the film/substrate interface. This study may be helpful for the design of film/substrate systems with enhanced mechanical properties.
9
Song, Zhuguo, und Hui Li. „Plasma Spraying with Wire Feeding: A Facile Route to Enhance the Coating/Substrate Interfacial Metallurgical Bonding“. Coatings 12, Nr. 5 (30.04.2022): 615. http://dx.doi.org/10.3390/coatings12050615.
Der volle Inhalt der QuelleAnnotation:
Thermal spray coatings are widely used in many applications, and the adhesion effect at the coating/substrate interface plays an important role during the service life. The thermal spraying coating and substrate is primarily combined by a mechanical seizure effect. In this work, a strategy to generate interfacial metallurgical bonding is proposed. Plasma spraying with wire feeding was adopted to increase the size of sprayed particles, and metallurgical bonding was clearly formed between deposited particles and the substrate (304 stainless-steel and 7075 aluminum alloy). Interface reaction can be found at both NiAl/7075 and NiAl/304 interfaces. Typical Al-Al3Ni eutectic phase with higher microhardness was formed at NiAl/7075 interface. The adhesive strength of the coatings was significantly improved to 82.67 ± 3.96 MPa and 64.45 ± 2.84 MPa, respectively, for NiAl coating on 304 and 7075 substrates through tensile adhesion tests (TAT) without surface roughening pretreatment. This technique shows a promising aspect of the application of thermal spray coatings.
10
Yamagiwa, K., K. Matsumoto und I. Hirabayashi. „Solid-phase epitaxial growth of oxide buffer materials for Rba2Cu3O7−y(R: rare earth and Y) superconductor“. Journal of Materials Research 15, Nr. 11 (November 2000): 2547–57. http://dx.doi.org/10.1557/jmr.2000.0365.
Der volle Inhalt der QuelleAnnotation:
We prepared various oxide buffer films on single-crystalline oxide substrates using chemical solution deposition to investigate general interfacial problems of buffer layers for coated conductors, such as epitaxial relationships between buffer material and the substrate. We found that (i) interfaces between the films and the substrates having the same crystal structure were compatible, even in a range of misfit value up to 7%, showing in-plane alignment; however (ii) interfaces between the films and substrates of other combinations of interface structures, with and without occupying tetragonal sites, narrow the range of the epitaxial growth. The former results (i) can be explained by the arrangement of oxygen ions, but for the latter cases (ii), cation arrangement is also important in forming a compatible interface as well as an anion arrangement. The general tendency is largely explained by the ionic arrangement at the interface. The interface structure becomes unstable by the electrostatic repulsive force since the distance between cations at the interface becomes shorter than that in each original crystal structure.
Dissertationen zum Thema "Substrate interface"
1
Rogers, Daniel J. „Molecular dynamics simulation of the carbon nanotube - substrate thermal interface resistance“. Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/31765.
Der volle Inhalt der QuelleAnnotation:
Thesis (M. S.)--Mechanical Engineering, Georgia Institute of Technology, 2010.Committee Chair: Dr. Jianmin Qu; Committee Member: Dr. CP Wong; Committee Member: Dr. Yogendra Joshi. Part of the SMARTech Electronic Thesis and Dissertation Collection.
2
WIRASATE, SUPA. „SCRATCH BEHAVIOR OF POLY(carbonate) FILM/SUBSTRATE SYSTEMS“. University of Cincinnati / OhioLINK, 2005. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1131995339.
Der volle Inhalt der Quelle
3
Chalasani, Praveen K. „Nanoindentation of Layered Materials with a Nonhomogeneous Interface“. Scholar Commons, 2006. http://scholarcommons.usf.edu/etd/3902.
Der volle Inhalt der QuelleAnnotation:
Indentation is used as a technique for mechanical characterization of materials for a long time. In the last few decades, new techniques of mechanical characterization at micro and nano level using indentation have been developed. Mechanical character-ization of thin films has become an important area of research because of their crucial role in modern technological applications. Theoretical and computational models of indentation are less time consuming,cost effective, and flexible. Many researchers have investigated mechanical properties of thin films using theoretical and computational models. In this study, an indentation model for a thin layer-substrate geometry with the possibility of nonhomogeneous or homogeneous interface of finite thickness between layer and substrate has been developed. The layer and substrate can be nonhomogeneous or homogeneous. Three types of indenters are modeled: 1) Uniform pressure indenter 2) Flat indenter 3) Smooth indenter. Contact depth, maximum interfacial normal stress and maximum interfacial shear stress play an important role in design and mechanical characterization of thin films using indentation and the effect of modeling the interface as homogeneous and nonhomogeneous on these parameters is studied. A sensitivity analysis is also conducted to find the effect of indentation area, substrate to layer Young's modulus ratio, layer to interface thickness ratio on contact depth and critical interfacial stresses.
4
Augustine, Anusree. „Swelling induced debonding of thin hydrogel films grafted on silicon substrate : the role of interface physical-chemistry“. Electronic Thesis or Diss., Université Paris sciences et lettres, 2022. http://www.theses.fr/2022UPSLS040.
Der volle Inhalt der QuelleAnnotation:
Les revêtements d'hydrogel sont des réseaux de polymères transparents et hydrophiles capables d’abosrber plusieurs fois leur épaisseur en eau. Cependant, les contraintes induites par le gonflement du film peuvent entraîner un décollement préjudiciable de l'hydrogel ce qui peut limiter l’utilisation pratique des ces revêtements. Dans cette étude, nous proposons de décrire les mécanismes de décollement de films minces d’hydrogel en fonction de leur densité de greffage à l'interface film/substrat. Le but est de pouvoir contrôler et prédire la dégradation des revêtements hydrogel pendant le gonflement ou sous des contraintes de contact. Dans ce but, nous avons développé une méthodologie permettant de mesurer l'initiation et la propagation de la délamination induite par le gonflement de films minces d’hydrogel à partir de défauts d'interface préexistants bien contrôlés.Des films minces d'hydrogel de poly(diméthylacrylamide) (PDMA) attachés à la surface sont préparés sur des plaquettes de silicium à partir de la réticulation et du greffage simultanés (CLAG) de chaînes polymères fonctionnalisées par la chimie click thiol-ène. Cette stratégie permet de faire varier l'épaisseur du film (0.1 - 2 µm) et de contrôler le taux de gonflement du réseau, ici fixé à 2, tout en assurant une densité de réticulation homogène. Afin de faire varier la résistance de l'interface film/substrat, le substrat en silicium est greffé avec des mélanges de mercaptosilane (réactif) et de propylsilane (inerte) dans différentes proportions avant le dépôt du film mince. Alors que le mercaptosilane est capable de former des liaisons covalentes avec le réseau PDMA, le propylsilane ne réagit pas, ce qui permet de contrôler le taux de greffage du film mince d’hydrogel sur le substrat. Nous caractérisons la fraction de surface de mercaptosilane ainsi obtenue par des analyses XPS et TOF-SIMS. Par ailleurs, toujours à l’interface subtrat/film, des défauts linéaires bien contrôlés ayant une faible adhérence (largeur entre 10 et 100 µm) sont créés sur le substrat en passivant de façon localisée les groupes thiol réactifs par microlithographie. Ces défauts nucléent le décollement des films de façon bien localisée, ce qui permet ensuite de suivre la propagation de la décohésion à partir de ces défauts.Le décollement du film induit par le gonflement est réalisé sous un flux de vapeur constant assurant la saturation du film en eau. En observant le décollement progressif du film à partir des défauts linéaires préexistants, nous retrouvons un motif d’instabilité classique dit de fil de téléphone et nous montrons que le décollement résulte de contraintes de gonflement localisées proche de la ligne de décollement. Nous mesurons la vitesse de propagation du décollement dans la zone où le film est greffé sur le substrat et nous observons qu’elle augmente de deux ordres de grandeur lorsque la quantité de propylsilane dans le mélange de silanes réactifs passe de 0 à 90 %, c’est-à-dire lorsque le taux de greffage du film décroit. Un seuil d'épaisseur pour le décollement est également observé, les films pouvant se décoller étant d’autant plus minces que le taux de greffage du film ets faible. Les mesures de ce seuil sont discutées à partir d'un argument simple de mécanique de la rupture qui permet de rendre compte semi quantitativement de nos mesuresHydrogel coatings are transparent and hydrophilic polymer networks that absorb a lot of water and can be suitable candidates for anti-mist coatings. However, swelling-induced stresses within the film can result in detrimental debonding of hydrogel and may fail. In this study, these debonding processes are investigated in the relation to the grafting density at the film/substrate interface, so as to control and predict the failure of the coatings during swelling or under contact stresses. For that purpose, we have developed a methodology consisting in monitoring the initiation and the propagation of swelling-induced delamination from well-controlled preexisting interface defects.Surface-attached poly(dimethylacrylamide) (PDMA) hydrogel thin films are prepared on silicon wafers from the simultaneous Cross-Linking And Grafting (CLAG) of functionalized polymer chains by thiol-ene click chemistry. This strategy allows to tune the film thickness (0.1-2 µm) while ensuring a homogeneous crosslinking density. In order to vary the strength of the film/substrate interface, the silicon wafer is grafted by mixing reactive mercaptosilane and unreactive propylsilane in various proportions prior to the formation of the hydrogel film. We characterize the mercaptosilane surface fraction thus obtained by XPS and TOF-SIMS analyses. Well-controlled line defects (width between 2 and 100 µm) are also created to nucleate delamination of the hydrogel from the substrate.Swelling-induced debonding of the film is achieved under a constant vapor flow ensuring water saturation. Optical observations show the progressive debonding of the film from the pre-existing line defects under the action of localized swelling stresses. We obtain a delamination pattern of typical so-called telephone cord instability. We measure the debonding propagation velocity where the hydrogel is grafted to the substrate. The debonding rate is found to decrease over two orders of magnitude when the amount of mercaptosilane in the reactive silane mixture is increased from 10% to 100% while increasing the covalent bonds between hydrogel and substrate. A threshold thickness for debonding is also observed. This threshold thickness increases with the amount of mercaptosilane used to graft the substrate. We derived quantitative values of the interface fracture energy from the measured thickness threshold with a simple fracture mechanics model
5
Mokarem, David W. „Environmental Influence on the Bond Between a Polymer Concrete Overlay and an Aluminum Substrate“. Thesis, Virginia Tech, 1999. http://hdl.handle.net/10919/31700.
Der volle Inhalt der QuelleAnnotation:
Chloride ion induced corrosion of reinforcing steel in concrete bridge decks has become a major problem in the United States. Latex modified concrete (LMC), low slump dense concrete (LSDC) and hot-mix asphalt membranes (HMAM) overlays are currently some of the most used rehabilitation methods. Epoxy coated reinforcing steel (ECR) was developed and promoted as a long term corrosion protection method by the Federal Highway Administration (FHWA). However, recent evidence has suggested that ECR will not provide adequate long term corrosion protection. The Reynolds Metals Company has developed an aluminum bridge deck system as a proposed alternative to conventional reinforced steel bridge deck systems. The deck consists of a polymer concrete overlay and an aluminum substrate. The purpose of this investigation is to evaluate the bond durability between the overlay and the aluminum substrate after conditioning specimens in various temperature and humidity conditions. The average critical strain energy release rate, Gcr, for each specimen was measured using a modified mixed mode flexure (MMF) test. In this investigation the strain energy release rate is a measure of the fracture toughness of the interface between the polymer concrete overlay and the aluminum substrate. The different environmental conditionings all had a significant effect on the bond durability. Specimens conditioned at 30 degrees C [86 degrees F], 45 degrees C [113 degrees F] and 60 degrees C [140 degrees F] at 98 % relative humidity all showed a decrease in interfacial bond strength after conditioning. A decrease in the interfacial bond strength was also observed for the specimens conditioned in freezing and thawing cycles as well as specimens conditioned in a salt water soak. Of the exposure conditions used in this investigation, the only one that showed an increase in the bond strength was drying the specimens continuously in an oven at 60 degrees C [140 degrees F].Master of Science
6
Carvalho, Denizard Paulo. „ESTUDO DA INTERFACE ENTRE BLOCOS CERÂMICOS E ARGAMASSAS DE CHAP ISCO“. Universidade Federal de Santa Maria, 2016. http://repositorio.ufsm.br/handle/1/7935.
Der volle Inhalt der QuelleAnnotation:
The analysis of adhesion mechanisms between mortar lining and porous substrates has been the target of
innumerous researchers due to its importance in ensuring system performance. Based on the theoretical reference
of the topic, this work of experimental nature aimed to analyze the influence of the superficial topography of
ceramic blocks in bonding slurry mortars and their relationship with the set of characteristics of fine aggregates
that make up slurry mortars. Initially, the substrates and component materials of the mortars were characterized
according to the Brazilian Association of Technical Standards; afterwards, characterization tests of fresh and
hardened mortars were carried out. In the testing phase, the blocks received the slurry mortars. The experimental
variables studied were: three types of ceramic blocks (ceramic sealing block with smooth surfaces, ceramic
sealing block with horizontal grooved surfaces, and ceramic sealing block with vertical grooved surfaces); and
two types of slurry mortars (one was prepared with coarse sand and the other with medium sand). Thus, six
interfaces were evaluated through aspects of bonding strength and permeability and absorption by the pipe
method. In order to observe the extent of adhesion and involvement of the grains of sand through the paste of
the slurry mortars, interface analyses were conducted through observation by magnifying glass and petrographic
microscope. The characteristics of the sands that influence the performance of fresh and hardened slurry mortars
were analyzed, with emphasis on the textural parameters of the sands, which were evaluated with the aid of
petrographic analysis. Results showed that there is direct correlation between the extent of adhesion provided by
the grooves of the blocks, and bond tensile strength, made possible by the fluid nature of the slurry mortar.
Therefore, this indicates the strong influence of the type of ceramic block on results of bond strength. On the
other hand, the study of the characteristics of the sands, represented mainly by the granulometric composition,
density, unitary mass, void content, degrees of roundness and sphericity, and mineralogy, proved to be useful in
order to understand the role of the fine aggregates in the performance of the slurry mortar. Additionally, we
observed that the tensile bonding strength was higher for the slurry mortars with coarse sand than with medium
sand, when comparing the same type of block, although the tests have pointed to non-significant differences.
This fact can be explained by the small difference between some of the characteristics of the sand used; however,
the coarse sand studied seems to provide greater integration of the grains involved by the mortar paste, which
was indicated by the degree of roundness. Moreover, it was also possible to observe direct relations in achieving
results when comparing the permeability and absorption by the pipe method with the initial rate of absorption
test (IRA) and extended IRA test. The final observation is that the basic treatment using slurry mortar can provide
several benefits: increased roughness of the base, increased tensile bonding strength, adjustment of the suction
capacity. This way, it was possible to homogenize the absorption of water by the substrate, thus avoiding
different screeding times and performance for the lining layer. Thus, the treatment of the base with the use of
slurry mortar can increase the performance and durability of the mortar lining.A análise dos mecanismos de aderência entre argamassas de revestimento e substratos porosos tem sido alvo de muitos pesquisadores, devido à importância que tem para garantir o desempenho do sistema. Com base no referencial teórico sobre o tema, este trabalho de natureza experimental teve como objetivo principal analisar a influência da topografia superficial de blocos cerâmicos na aderência de argamassas de chapisco e a sua relação, ainda, com o conjunto de características dos agregados miúdos que compõem as argamassas de chapisco. Inicialmente, os substratos e os materiais componentes das argamassas foram caracterizados através do grupo de normas da Associação Brasileira de Normas Técnicas; na sequência, foram realizados ensaios de caracterização das argamassas nos estados fresco e endurecido. Na fase de testes, os blocos receberam as argamassas de chapisco. As variáveis experimentais estudadas foram: três tipos de blocos cerâmicos (bloco cerâmico de vedação com faces lisas, bloco cerâmico de vedação com faces ranhuradas horizontais, e bloco cerâmico de vedação com faces ranhuradas verticais); e dois tipos de argamassas de chapisco (uma elaborada com areia grossa e outra com areia média). Dessa forma, surgiram seis interfaces que foram avaliadas através de aspectos relacionados à resistência de aderência à tração e à permeabilidade e absorção pelo método do cachimbo. Na intenção de observar a extensão de aderência e o envolvimento dos grãos de areia pela pasta das argamassas de chapisco, foram feitas análises da interface através da observação por lupa estereoscópica e microscópio petrográfico. Foram pesquisadas as características das areias que influem no desempenho das argamassas de chapisco em seu estado fresco e endurecido, com ênfase nos parâmetros texturais das areias, avaliados com auxílio da análise petrográfica. Os resultados mostraram que há correlação direta entre a extensão de aderência, proporcionada pelas ranhuras dos blocos cerâmicos e a resistência de aderência à tração, possibilitada pela natureza fluida da argamassa de chapisco, indicando, assim, a forte influência do tipo de bloco cerâmico nos resultados de aderência à tração. De outro lado, o estudo das características das areias, representadas, principalmente, pela composição granulométrica, massa específica, massa unitária, índice de vazios, graus de arredondamento e esfericidade e mineralogia revelou-se útil no sentido de compreender o papel dos agregados miúdos perante o desempenho das argamassas de chapisco. Notou-se que a resistência de aderência à tração foi maior para as argamassas de chapisco com areia grossa do que com areia média, quando se compara um mesmo tipo de bloco, embora os testes tenham apontado diferenças não significativas. Esse fato pode ser explicado pela pouca diferença entre algumas das características das areias utilizadas; porém, a areia grossa estudada parece proporcionar um maior entrosamento dos grãos envolvidos pela pasta da argamassa, indicado pelo grau de arredondamento. Foram observadas, ainda, relações diretas na obtenção de resultados quando se compara a permeabilidade e absorção pelo método do cachimbo com o ensaio do índice de absorção inicial de água (AAI) e AAI estendido. A constatação final é de que o tratamento de base através do emprego de chapisco pode proporcionar vários benefícios: aumento da rugosidade da base, aumento da resistência de aderência à tração e regulagem da capacidade de sucção. Possibilitando, com isso, homogeneizar a absorção de água por parte do substrato, evitando diferentes tempos de sarrafeamento e desempeno para a camada de revestimento. Assim, o tratamento da base com uso do chapisco pode aumentar o desempenho e a durabilidade dos revestimentos de argamassa.
7
Phimphivong, Samrane. „Applications of Total Internal Reflection Fluorescence Microscopy for Studies of Chemical Phenomena at the Substrate-Liquid Interface“. Diss., The University of Arizona, 2008. http://hdl.handle.net/10150/194335.
Der volle Inhalt der QuelleAnnotation:
Applications of TIRFM for quantitative measurements of cells are limited due to high background fluorescence which can result in a low S/N ratio and therefore contribute to inaccuracy of measurements. Time-resolved total internal reflection fluorescence microscopy (TR-TIRFM) was developed by temporally gating a CCD camera using a liquid crystal shutter to optically filtering the short-live fluorescence and recording only the long-live emission. This technique was then applied to examine the extent of cell-substrate contacts. Tb+3 chelates such as DTPA-PhenylAS-Tb+3 was synthesized and applied as a membrane staining agent but was observed to internalized into the cell nucleus. A modified chelate molecule was therefore synthesized using DOPE as a carrier molecule. DOPE-DTPA-pAS-Tb+3 has a similar emission lifetime (1.5 msec) and appeared to stain only the cell membrane. TR-TIRF was applied to examine adherent cells on polystyrene-coated substrate. TR-TIRF images showed cellular autofluorescence and polystyrene emissions were optically filtered out, while the long-lived emission intensity of Tb+3 chelate was recorded. These results conclude that TR-TIRFM, with the use of long-live emission label (Tb+3 and Eu+3 chelates), is suitable as an analytical tool for probing a large number of cellular and molecular events occurring in the cell membrane and on the cell surface where background fluorescence would usually be problematic. Detection of K+ transported across a cell membrane is a prerequisite in the development of devices for screening drugs targeting K+ ion channels. K+ sensing film was fabricated by encapsulating a squaraine dye (aza-crown-SQR) in a sol-gel matrix for detection of K+. Sol-gel films were prepared by the hydrolysis and condensation reactions of TEOS or TMOS, APTS and GOPS mixtures. Formation of a DPhPC bilayer on sol-gel films was achieved by the vesicle fusion method and had diffusion coefficients of 2.3 and 2.1x10-8 cm2s-1 as measured by FRAP on TEOS-APTS-GOPS and TMOS-APTS-GOPS film, respectively. The time-based fluorescence intensity data from the H+ blocking experiments showed the sol-gel-supported DPhPC bilayers are impermeable to H+, and the K+ blocking experiments showed K+ was passively transported across a DPhPC bilayer by valinomycin.
8
Kreysing, Eva [Verfasser], Andreas [Akademischer Betreuer] Offenhäusser und Jörg Ludwig [Akademischer Betreuer] Fitter. „Characterization of the cell-substrate interface using surface plasmon resonance microscopy / Eva Kreysing ; Andreas Offenhäusser, Jörg Ludwig Fitter“. Aachen : Universitätsbibliothek der RWTH Aachen, 2018. http://d-nb.info/1187251445/34.
Der volle Inhalt der Quelle
9
Castagnola, Valentina. „Implantable microelectrodes on soft substrate with nanostructured active surface for stimulation and recording of brain activities“. Toulouse 3, 2014. http://thesesups.ups-tlse.fr/2646/.
Der volle Inhalt der QuelleAnnotation:
Les prothèses neuronales implantables offrent de nos jours une réelle opportunité pour restaurer des fonctions perdues par des patients atteints de lésions cérébrales ou de la moelle épinière, en associant un canal non-musculaire au cerveau ce qui permet la connexion de machines au système nerveux. La fiabilité sur le long terme de ces dispositifs, se présentant sous la forme d'électrodes implantables, est un facteur crucial pour envisager des applications dans le domaine des interfaces cerveau-machine. Cependant, les électrodes actuelles pour l'enregistrement et la stimulation se détériorent en quelques mois voire quelques semaines. Ce défaut de fiabilité sur le long terme, principalement lié à une réaction chronique contre un corps étranger, est induit au départ par le traumatisme consécutif à l'insertion du dispositif et s'aggrave ensuite, durant les mouvements du cerveau, à cause des propriétés mécaniques inadaptées de l'électrode par rapport à celles du tissu. Au cours du temps, l'ensemble de ces facteurs inflammatoires conduit à l'encapsulation de l'électrode par une couche isolante de cellules réactives détériorant ainsi la qualité de l'interface entre le dispositif implanté et le tissu cérébral. Pour s'affranchir de ce phénomène, la biocompatibilité des matériaux et des procédés, ainsi que les propriétés mécaniques de l'électrode doivent être pris en considération. Durant cette thèse, nous avons abordé la question en développant un procédé de fabrication simple pour réaliser des dispositifs implantables souples en parylène. Les électrodes flexibles ainsi obtenues sont totalement biocompatibles et leur compliance est adaptée à celle du tissu cérébral ce qui limite fortement la réaction inflammatoire occasionnée par les mouvements du cerveau. Après avoir optimisé le procédé de fabrication, nous avons focalisé notre étude sur les performances du dispositif et sa stabilité. L'utilisation d'une grande densité d'électrodes micrométriques, avec un diamètre de 10 à 50 µm, permet de localiser les zones d'enregistrement en rendant possible, par exemple, la conversion d'un ensemble de signaux électrophysiologiques en une commande de mouvement. En contrepartie, la réduction de la taille des électrodes conduit à une augmentation de l'impédance ce qui dégrade la qualité d'enregistrement des signaux. Ici, un polymère conducteur organique, le poly(3,4-ethylenedioxythiophene), PEDOT, a été utilisé pour améliorer les caractéristiques électriques d'enregistrement d'électrodes de petites dimensions. Le PEDOT a été déposé sur la surface des électrodes par électrochimie avec une grande reproductibilité. Des dépôts homogènes avec des conductivités électriques très élevées ont été obtenus en utilisant différents procédés électrochimiques. Grâce à l'augmentation du rapport surface/volume induit par la présence de la couche de PEDOT, une diminution significative de l'impédance de l'électrode (jusqu'à 3 ordres de grandeur) a été obtenue sur une large plage de fréquences. De tests de vieillissement thermique accéléré ont également été effectués sans influence notable sur les propriétés électriques démontrant ainsi la stabilité de la couche de PEDOT durant plusieurs mois. Les dispositifs ainsi obtenus, fabriqués en parylène avec un dépôt de PEDOT sur la surface active des électrodes, ont été testés in vitro et in vivo sur des cerveaux de souris. Un meilleur rapport signal sur bruit a été mesuré durant des enregistrements neuronaux en comparaison avec des résultats obtenus avec des électrodes commerciales. En conclusion, la technologie décrite ici, associant stabilité sur le long terme et faible impédance, a permis d'obtenir des électrodes implantables parfaitement adaptées pour le développement d'interfaces neuronales chroniquesImplantable neural prosthetics devices offer, nowadays, a promising opportunity for the restoration of lost functions in patients affected by brain or spinal cord injury, by providing the brain with a non-muscular channel able to link machines to the nervous system. The long term reliability of these devices constituted by implantable electrodes has emerged as a crucial factor in view of the application in the "brain-machine interface" domain. However, current electrodes for recording or stimulation still fail within months or even weeks. This lack of long-term reliability, mainly related to the chronic foreign body reaction, is induced, at the beginning, by insertion trauma, and then exacerbated as a result of mechanical mismatch between the electrode and the tissue during brain motion. All these inflammatory factors lead, over the time, to the encapsulation of the electrode by an insulating layer of reactive cells thus impacting the quality of the interface between the implanted device and the brain tissue. To overcome this phenomenon, both the biocompatibility of materials and processes, and the mechanical properties of the electrodes have to be considered. During this PhD, we have addressed both issues by developing a simple process to fabricate soft implantable devices fully made of parylene. The resulting flexible electrodes are fully biocompatible and more compliant with the brain tissue thus limiting the inflammatory reaction during brain motions. Once the fabrication process has been completed, our study has been focused on the device performances and stability. The use of high density micrometer electrodes with a diameter ranging from 10 to 50 µm, on one hand, provides more localized recordings and allows converting a series of electrophysiological signals into, for instance, a movement command. On the other hand, as the electrode dimensions decrease, the impedance increases affecting the quality of signal recordings. Here, an organic conductive polymer, the poly(3,4-ethylenedioxythiophene), PEDOT, has been used to improve the recording characteristics of small electrodes. PEDOT was deposited on electrode surfaces by electrochemical deposition with a high reproducibility. Homogeneous coatings with a high electrical conductivity were obtained using various electrochemical routes. Thanks to the increase of the surface to volume ratio provided by the PEDOT coating, a significant lowering of the electrode impedance (up to 3 orders of magnitude) has been obtained over a wide range of frequencies. Thermal accelerated ageing tests were also performed without any significant impact on the electrical properties demonstrating the stability of the PEDOT coatings over several months. The resulting devices, made of parylene with a PEDOT coating on the active surface of electrodes, have been tested in vitro and in vivo in mice brain. An improved signal to noise ratio during neural recording has been measured in comparison to results obtained with commercially available electrodes. In conclusion, the technology described here, combining long-term stability and low impedance, make these implantable electrodes suitable candidates for the development of chronic neural interfaces
10
Billaud, Mathilde. „Intégration de semi-conducteurs III-V sur substrat Silicium pour les transistors n-MOSFET à haute mobilité“. Thesis, Université Grenoble Alpes (ComUE), 2017. http://www.theses.fr/2017GREAT010/document.
Der volle Inhalt der QuelleAnnotation:
La substitution du canal de silicium par un semi-conducteur III-V est une des voies envisagées pour accroitre la mobilité des électrons dans les transistors n-MOSFET et ainsi réduire la consommation des circuits. Afin de réduire les coûts et de profiter des plateformes industrielles de la microélectronique, les transistors III-V doivent être réalisés sur des substrats de silicium. Cependant, la différence de paramètre de maille entre le Si et les couches III-V induit de nombreux défauts cristallins dans le canal du transistor, diminuant la mobilité des porteurs. L’objectif de cette thèse est la réalisation de transistors à canal III-V sur substrat de silicium au sein de la plateforme microélectronique du CEA Leti. Dans le cadre de ces travaux, deux filières technologiques d’intégration ont été développées pour la réalisation de transistors tri-gate à base d’In0,53Ga0,47As sur substrat de silicium : par un collage moléculaire d’une couche d’InGaAs sur InP et par une épitaxie directe de la couche d’InGaAs sur substrat Si. Les différentes étapes technologiques spécifiques à l’InGaAs ont été mises au point au cours de ces travaux, en prenant en compte les contraintes de contamination des équipements. Le traitement de surface de l’InGaAs et le dépôt du diélectrique de grille à haute permittivité (type high-k) par ALD ont été particulièrement étudiés afin de réduire la quantité d’états d’interface (Dit) et d’optimiser l’EOT. Pour cela, des analyses XPS et des mesures électriques C(V) de capacités MOS ont été réalisées à l’échelle d’un substrat de 300mm de diamètreThe replacement of the silicon channel by III-V materials is investigated to increase the electron mobility in the channel and reduce the power consumption. In order to decrease the cost and to take advantage of the microelectronic silicon platform, III-V transistors must be built on Silicon substrates. However, the lattice parameter mismatch between Silicon and the III-V layers leads to a high defects density in the channel and reduces the carrier mobility. This thesis aims to realize III-V transistors on silicon substrate in the CEA-Leti microelectronic clean room. In the frame of this PhD, two integration process are elaborated to realize In0,53Ga0,47As tri-gate transistors on silicon: the molecular bonding of an InGaAs layer grown on a InP substrate, and the direct epitaxy of InGaAs on a silicon substrate. The fabrication steps for InGaAs transistors were developed, taking into account the clean room contamination restriction. InGaAs surface treatment and high-permittivity dielectric deposition by ALD are studied in order to reduce the density of interface states (Dit) and to optimize the EOT. XPS analysis and C(V) measurement are performed at the scale of a 300mm Silicon substrate
Bücher zum Thema "Substrate interface"
1
Gariglio, S., M. S. Scheurer, J. Schmalian, A. M. R. V. L. Monteiro, S. Goswami und A. D. Caviglia. Surface and Interface Superconductivity. Herausgegeben von A. V. Narlikar. Oxford University Press, 2017. http://dx.doi.org/10.1093/oxfordhb/9780198738169.013.7.
Der volle Inhalt der QuelleAnnotation:
This article focuses on surface and interface superconductivity, a pivotal area of mesoscopic superconductivity. It discusses theoretical ideas regarding superconductivity in the 2D limit; pairing symmetry in systems with broken inversion symmetry and in the presence of Rashba spin–orbit interaction; and coupling of substrate phonon modes to layer electronic states to induce or enhance the superconducting condensate. It also reviews the experimental ongoing efforts to fabricate, characterize, and measure these systems, with particular emphasis on oxide materials. Superconductivity in two dimensions, in ultra-thin metals on Si(111), and at the LaAlO3/SrTiO3 interface is examined. The article concludes with an analysis of theoretical propositions aimed at realizing and testing novel superconducting states occurring at the surfaces and interfaces.
2
Lin, Nian, und Sebastian Stepanow. Designing low-dimensional nanostructures at surfaces by supramolecular chemistry. Herausgegeben von A. V. Narlikar und Y. Y. Fu. Oxford University Press, 2017. http://dx.doi.org/10.1093/oxfordhb/9780199533046.013.10.
Der volle Inhalt der QuelleAnnotation:
This article describes the use of supramolecular chemistry to design low-dimensional nanostructures at surfaces. In particular, it discusses the design strategies of two types of low-dimensional supramolecular nanostructures: structures stabilized by hydrogen bonds and structures stabilized by metal-ligand co-ordination interactions. After providing an overview of hydrogen-bond systems such as 0D discrete clusters, 1D chains, and 2D open networks and close-packed arrays, the article considers metal-co-ordination systems. It also presents experimental results showing that both hydrogen bonds and metal co-ordination offer protocols to achieve unique nanostructured systems on 2D surfaces or interfaces. Noting that the conventional 3D supramolecular self-assembly has generated a vast number of nanostructures revealing high complexity and functionality, the article suggests that 2D approaches can be applied to substrates with different symmetries as well as physical and chemical properties.
Buchteile zum Thema "Substrate interface"
1
Haindl, Silvia. „The Film/Substrate Interface“. In Iron-Based Superconducting Thin Films, 189–233. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-75132-6_4.
Der volle Inhalt der Quelle
2
Qi, Dong-Chen, Wei Chen und Andrew T. S. Wee. „NEXAFS Studies of Molecular Orientations at Molecule-Substrate Interfaces“. In The Molecule-Metal Interface, 119–51. Weinheim, Germany: Wiley-VCH Verlag GmbH & Co. KGaA, 2013. http://dx.doi.org/10.1002/9783527653171.ch5.
Der volle Inhalt der Quelle
3
Uzer, T., und J. T. Muckerman. „Vibrational Dynamics at the Adsorbate-Substrate Interface“. In Frontiers of Chemical Dynamics, 267–90. Dordrecht: Springer Netherlands, 1995. http://dx.doi.org/10.1007/978-94-011-0345-9_12.
Der volle Inhalt der Quelle
4
Sergeev, A. V., E. E. Aksaev, I. G. Gogidze, G. N. Gol’tsman, A. D. Semenov und E. M. Gershenzon. „Thermal Boundary Resistance at YBaCuO Film-Substrate Interface“. In Springer Series in Solid-State Sciences, 405–6. Berlin, Heidelberg: Springer Berlin Heidelberg, 1993. http://dx.doi.org/10.1007/978-3-642-84888-9_157.
Der volle Inhalt der Quelle
5
Jiang, Y. F., H. Y. Li, J. Chen, X. Q. Shi und Y. X. Zhu. „Study on Composition Design of Enamel Coating and Its Resistance to Active Metal Vapor Corrosion“. In Springer Proceedings in Physics, 412–23. Singapore: Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-99-1023-6_36.
Der volle Inhalt der QuelleAnnotation:
AbstractAfter evaporation of cerium metal (simulated radioactive substance) in a stainless steel plate in a production process, Ce and Fe elements are interdiffused at the bonding interface and Ce-Fe solid solution is formed. There are problems such as incomplete recovery of attached materials and increased surface roughness at the interface, which cannot be reused. In order to reduce radioactive iste generation, metallic enamel coating is prepared on stainless steel substrate with SiO2, Al2O3, Na2O, K2O, CaF2 and CoO and its resistance to active metal vapor corrosion at high temperature is studied. The results show that the enamel coating is closely bonded to the substrate, forming a chemical bond of Fe-Co rich phase. The enamel coating can stably form a film with cerium metal atoms, and the evaporation coating does not fall off. The microstructure results show that cerium oxide is formed at the bonding interface between the enamel coating and cerium metal, forming a stable chemical bond. Compared with stainless steel substrate, there is no interfacial corrosion caused by mutual diffusion between enamel coating and cerium metal at the bonding interface, so it can only desorb cerium metal without damaging the coating and realize multiple reuse.
6
Işiksaçan, Özge, Alper Yeşilçubuk und Onuralp Yücel. „Substrate - Enamel Interface Relation and Impact on Quality of Enamel“. In TMS2015 Supplemental Proceedings, 1523–30. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2015. http://dx.doi.org/10.1002/9781119093466.ch181.
Der volle Inhalt der Quelle
7
Qian, J., J. Wang und H. Gao. „Tension-Induced Growth of Focal Adhesions at Cell–Substrate Interface“. In IUTAM Symposium on Cellular, Molecular and Tissue Mechanics, 193–201. Dordrecht: Springer Netherlands, 2009. http://dx.doi.org/10.1007/978-90-481-3348-2_16.
Der volle Inhalt der Quelle
8
Işiksaçan, Özge, Alper Yeşilçubuk und Onuralp Yücel. „Substrate-Enamel Interface Relation and Impact on Quality of Enamel“. In TMS 2015 144th Annual Meeting & Exhibition, 1523–30. Cham: Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-48127-2_181.
Der volle Inhalt der Quelle
9
Chefi, C., F. Hila und M. Gillet. „Stresses induced in the deposit substrate interface during particles growth“. In Small Particles and Inorganic Clusters, 153–56. Berlin, Heidelberg: Springer Berlin Heidelberg, 1989. http://dx.doi.org/10.1007/978-3-642-74913-1_35.
Der volle Inhalt der Quelle
10
Benson, Sven, und Jürgen Pleiss. „Computational Modeling of a Biocatalyst at a Hydrophobic Substrate Interface“. In High Performance Computing in Science and Engineering ´15, 241–53. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-24633-8_16.
Der volle Inhalt der QuelleKonferenzberichte zum Thema "Substrate interface"
1
Fukumoto, M., K. Hamada und M. Shiiba. „Dependence of Thermal Sprayed Particle/Substrate Interface Microstructure on Substrate Temperature“. In ITSC2003, herausgegeben von Basil R. Marple und Christian Moreau. ASM International, 2003. http://dx.doi.org/10.31399/asm.cp.itsc2003p1047.
Der volle Inhalt der QuelleAnnotation:
Abstract Ni, Ni-Al and Ni-Cr powder particles were plasma sprayed onto the mirror polished metallic substrate surface and the effect of substrate temperature on the particle/substrate interface microstructure was investigated. Sprayed particles were fully melted, sphere in a shape and oxidized on their surfaces during spraying in an air atmosphere. The surface oxide layers were detected as Al or Cr rich thin layer, respectively by electron probe micro analysis (EPMA). After spraying of the particles onto the substrate, cross section microstructures at particle/substrate interfaces were investigated. As a result, almost no oxide layer was detected at the particle/substrate interface when the substrate was kept at room temperature. On the other hand, the oxide layer was apparently recognized at the interface when the substrate was kept at a certain elevated temperature, such as at 673K. The difference in the existence of the oxide layer at interface seems to relate the wettability of the substrate by the liquid particles. The transition temperature, Tt, for each powder material was measured. The meaning of elemental addition to the base metal was considered from the changing tendency in Tt value of each powder material. Through the investigation results obtained, dominating factor on the flattening of the thermal sprayed particles onto the flat substrate surface was estimated.
2
Wu, J., P. R. Munroe, B. Withy und M. M. Hyland. „Study of the Splat-Substrate Interface for a PEEK Coating Plasma-Sprayed onto Aluminum Substrates“. In ITSC2009, herausgegeben von B. R. Marple, M. M. Hyland, Y. C. Lau, C. J. Li, R. S. Lima und G. Montavon. ASM International, 2009. http://dx.doi.org/10.31399/asm.cp.itsc2009p0793.
Der volle Inhalt der QuelleAnnotation:
Abstract In this study, single splats of polyether ether ketone were plasma sprayed onto aluminum substrates that had been boiled, etched, or polished and then thermally treated, except for one etched substrate, to remove water from the surface. Splat morphology was viewed in a scanning electron microscope and splat-substrate interfaces were examined using TEM and focused ion beam imaging. The results show that PEEK splats have a poor level of contact on aluminum substrates that were boiled and those that were etched but not thermally treated. In contrast, specimens that had undergone thermal treatment to minimize the presence of water on the substrate surface exhibited high levels of contact at the splat-substrate interface with significantly less porosity.
3
Písacka, J., D. Laub und F. Buffat. „Plasma Sprayed Coating – Substrate Interface Study“. In ITSC 1999, herausgegeben von E. Lugscheider und P. A. Kammer. Verlag für Schweißen und verwandte Verfahren DVS-Verlag GmbH, 1999. http://dx.doi.org/10.31399/asm.cp.itsc1999p0641.
Der volle Inhalt der QuelleAnnotation:
Abstract This paper examines an aluminum oxide coating plasma-sprayed onto a substrate made of high-quality stainless steel by means of light microscopy, X-ray diffractometry, and scanning and transmission electron microscopy (TEM). The aim is to determine the phases that form preferentially at the transition. It is observed that high amount of corundum phase was found in a plasma sprayed white alumina coating. XRD phase analysis of the coating indicated that all three major alumina phases were present: alpha-, gamma-, and delta-aluminum oxide. Further development in the field of TEM sample preparation is required in order to obtain larger electron-permeable surfaces, since it is not clear whether the alpha-aluminum oxide found at the transition is in the form of a spatter or a grain introduced by sandblasting. Paper includes a German-language abstract.
4
Ducos, M., B. Bossuat, H. Walaszek, S. Barradas und M. Jeandin. „Ultrasonic Testing of the Splat-Substrate Interface“. In ITSC2006, herausgegeben von B. R. Marple, M. M. Hyland, Y. C. Lau, R. S. Lima und J. Voyer. ASM International, 2006. http://dx.doi.org/10.31399/asm.cp.itsc2006p1039.
Der volle Inhalt der QuelleAnnotation:
Abstract The studying of splats in thermal spray is prominent to improve coating properties due to better understanding of coating build-up mechanisms. Most of studies, however, devoted to splats rest on physical aspects of the build-up, which feature the behaviour of a single particle impinging on a substrate. These studies involve the nature, velocity and intrinsic characteristics of the particle. The present work deals with the study of the splat-substrate interface using an ultra-sonic (U.S.) technique. This technique is based on the determining of splat-substrate adhesion (for an elementary splat or a group of splats) to help in the optimising of spraying conditions. APS copper splats were studied for Al-based substrates. This U.S. technique was already tested successfully for adhesion control of thermally-sprayed coatings in Basel, Switzerland. Further development then related to the specific experimental set-up for splat analysis using several transducers. This involved the use of various frequencies, various sizes for the focal spot and various scan velocities. In this study, results from this U.S. technique were discussed in the light of the observation of cross-sections of U.S.- controlled splats. U.S. C-Scan images were shown to fit well with cross-sectional images. In a general conclusion, the work showed the feasibility and efficiency of advanced U.S. control of splats to promote thermally-sprayed coatings whatever the process, i.e. plasma spray, flame spray, HVOF or cold spray.
5
Misra, Durga. „Interface engineering of high-K and high-mobility substrate interface“. In 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT). IEEE, 2012. http://dx.doi.org/10.1109/icsict.2012.6467943.
Der volle Inhalt der Quelle
6
Yao, Hai-Long, Guan-Jun Yang, Xue-Long He, Cheng-Xin Li und Chang-Jiu Li. „TEM Characterization of the Coating-Substrate Interface in Vacuum Cold-Sprayed Nano-TiO2 Coating“. In ITSC2013, herausgegeben von R. S. Lima, A. Agarwal, M. M. Hyland, Y. C. Lau, G. Mauer, A. McDonald und F. L. Toma. ASM International, 2013. http://dx.doi.org/10.31399/asm.cp.itsc2013p0412.
Der volle Inhalt der QuelleAnnotation:
Abstract This study investigates the microstructure of coating-substrate interfaces formed by vacuum cold spraying. Commercially available TiO2 nanopowder was deposited on SnO2-glass substrates using a lab-developed vacuum cold spray system. For comparison, TiO2 coatings were also prepared by screen printing followed by mechanical pressing. Coating surfaces and interfaces were evaluated by means of TEM and SEM imaging and XRD analysis. SEM images show that screen-printed coatings have a crack-rich morphology, while mechanical pressed and vacuum cold sprayed coatings have no obvious cracks. TEM images, on the other hand, show the extent of bonding between TiO2 nanoparticles and the glass substrate. Very little interface bonding was observed in screen-printed coatings in contrast to their vacuum cold sprayed and mechanical pressed counterparts. The difference is attributed to the higher pressures achieved by mechanical pressing and the high-velocity impact of vacuum cold spraying.
7
Tsuruta, Hirofumi, Yoshihisa Fujii, Masao Doi, Hiroshi Morita und Keiji Tanaka. „Relaxation of polystyrene at interface with solid substrate“. In 4TH INTERNATIONAL SYMPOSIUM ON SLOW DYNAMICS IN COMPLEX SYSTEMS: Keep Going Tohoku. American Institute of Physics, 2013. http://dx.doi.org/10.1063/1.4794617.
Der volle Inhalt der Quelle
8
Fukumoto, M., E. Nishioka und T. Matsubara. „Effect of Interface Wetting on Flattening of Freely Fallen Metal Droplet Onto Flat Substrate Surface“. In ITSC 2000, herausgegeben von Christopher C. Berndt. ASM International, 2000. http://dx.doi.org/10.31399/asm.cp.itsc2000p0797.
Der volle Inhalt der QuelleAnnotation:
Abstract A free falling experiment was conducted as a simulation of a thermal spray process. A flattening behavior of the freely fallen metal droplet impinged onto a flat substrate surface was fundamentally investigated. The substrates were kept at various designated temperatures, and the substrates coated with gold by PVD were also prepared in order to investigate the effect of a wetting at the splat/substrate interface on the flattening behavior of the droplet. A falling atmosphere was atmospheric pressure nitrogen to prevent the oxidation of the melted droplet, and the experiments under low-pressure condition were also conducted. A transition of the splat morphology was recognized in atmospheric pressure nitrogen experiments, that is, the splat morphology on a room temperature substrate was a splash type, whereas that on a high temperature substrate was a disk type. The cross-section microstructure of the splat obtained on the room temperature substrate was an isotropic coarse grain, whereas that on the high temperature substrate was a fine columnar. The grain size changed transitionally with increasing the substrate temperature. Transition temperature on the gold-coated substrate was higher than that on the substrate without coating. The cross-section microstructure of the splat obtained under low-pressure was a fine columnar even on the room temperature substrate. The results indicate that the metal droplet wets better under low-pressure condition than in atmospheric pressure nitrogen condition, and the wetting has a significant role in the flattening of the droplet.
9
Mazumder, Monalisa, und Theodorian Borca-Tasciuc. „Thermal Transport Measurements of Nanowire-Substrate Interfaces“. In ASME 2008 Heat Transfer Summer Conference collocated with the Fluids Engineering, Energy Sustainability, and 3rd Energy Nanotechnology Conferences. ASMEDC, 2008. http://dx.doi.org/10.1115/ht2008-56328.
Der volle Inhalt der QuelleAnnotation:
An AFM based method for characterization of thermal transport properties of electrically conductive individual nanowires and nanowire-substrate interfaces has been developed. Nanostructures are located by topographic imaging in regular tapping mode and are then subsequently probed by an AFM cantilever tip, with a conductive coating thus establishing electrical contact at different positions on the nanowire followed by current-voltage data acquisition. This experimental approach can be implemented for a system with nanostructures in contact with the surface and, in the other case, suspended between electrodes. These configurations allow for characterization of both thermal conductivity and nano-interface thermal resistance. This work presents the technique along with the subsequent measurements of nano-interface thermal resistance of nanowire-substrate junction using the aforesaid technique.
10
Wang, J., und C. J. Li. „The Influence of Deposition Temperature and Thermal Conductivity of the Substrate on Splat Formation“. In ITSC2017, herausgegeben von A. Agarwal, G. Bolelli, A. Concustell, Y. C. Lau, A. McDonald, F. L. Toma, E. Turunen und C. A. Widener. DVS Media GmbH, 2017. http://dx.doi.org/10.31399/asm.cp.itsc2017p0956.
Der volle Inhalt der QuelleAnnotation:
Abstract Ni20Cr splats were sprayed onto polished substrates at different preheating temperatures in an argon atmosphere by Low Pressure Plasma Spray to reveal the dominating factor on the effective interface bonding formation. The splat morphology, microstructure and splat-substrate interface bonding were characterized by SEM and EBSD. The interface for examination of typical splats was prepared by FIB. Disk splats were obtained on AISI 304 stainless steel substrates preheated to temperatures of 100 °C (cooling from 350 °C), 350 and 550 °C. Moreover, typical distinct two-zone microstructure feature was observed on the splat surface by SEM and EBSD, including central coarse grain and marginal fine grain. When the preheating temperature was higher than 350 °C, effective bonding formed only in the entire central coarse zone, whereas no effective bonding was observed in the fine grain zone. By using glass, copper, nickel and 304 SS as substrates, it was found that increasing thermal conductivity of metallic substrates has little effect on splat diameter and morphology and however decreased the area fraction of central coarse grain zone. It was revealed that the melt/substrate interface temperature plays a crucial role on the interface bonding formation.
Berichte der Organisationen zum Thema "Substrate interface"
1
Shechtman, Dan. Transmission Electron Microscopy of the CVD Diamond Film/Substrate Interface. Fort Belvoir, VA: Defense Technical Information Center, März 1991. http://dx.doi.org/10.21236/ada234767.
Der volle Inhalt der Quelle
2
Shechtman, Dan. Transmission Electron Microscopy of the CVD Diamond Film/Substrate Interface. Fort Belvoir, VA: Defense Technical Information Center, März 1991. http://dx.doi.org/10.21236/ada234790.
Der volle Inhalt der Quelle
3
Leidheiser, Jr, Granata Henry und Richard D. Corrosion Control through a Better Understanding of the Metallic Substrate/Organic Coating/Interface. Fort Belvoir, VA: Defense Technical Information Center, Februar 1989. http://dx.doi.org/10.21236/ada205278.
Der volle Inhalt der Quelle
4
Leidheiser, Henry, Granata Jr. und Richard D. Corrosion Control through a Better Understanding of the Metallic Substrate/Organic Coating Interface. Fort Belvoir, VA: Defense Technical Information Center, März 1990. http://dx.doi.org/10.21236/ada220432.
Der volle Inhalt der Quelle
5
Minor, Andrew M. Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging. Office of Scientific and Technical Information (OSTI), Dezember 1999. http://dx.doi.org/10.2172/753105.
Der volle Inhalt der Quelle
6
Lever, James, Emily Asenath-Smith, Susan Taylor und Austin Lines. Assessing the mechanisms thought to govern ice and snow friction and their interplay with substrate brittle behavior. Engineer Research and Development Center (U.S.), Dezember 2021. http://dx.doi.org/10.21079/1168142742.
Der volle Inhalt der QuelleAnnotation:
Sliding friction on ice and snow is characteristically low at temperatures common on Earth’s surface. This slipperiness underlies efficient sleds, winter sports, and the need for specialized tires. Friction can also play micro-mechanical role affecting ice compressive and crushing strengths. Researchers have proposed several mechanisms thought to govern ice and snow friction, but directly validating the underlying mechanics has been difficult. This may be changing, as instruments capable of micro-scale measurements and imaging are now being brought to bear on friction studies. Nevertheless, given the broad regimes of practical interest (interaction length, temperature, speed, pressure, slider properties, etc.), it may be unrealistic to expect that a single mechanism accounts for why ice and snow are slippery. Because bulk ice, and the ice grains that constitute snow, are solids near their melting point at terrestrial temperatures, most research has focused on whether a lubricating water film forms at the interface with a slider. However, ice is extremely brittle, and dry-contact abrasion and wear at the front of sliders could prevent or delay a transition to lubricated contact. Also, water is a poor lubricant, and lubricating films thick enough to separate surface asperities may not form for many systems of interest. This article aims to assess our knowledge of the mechanics underlying ice and snow friction.
7
Lee, Wall und Burch. L52333 NDE and Inspection Techniques Applied to Composite Wrap Repairs. Chantilly, Virginia: Pipeline Research Council International, Inc. (PRCI), Juni 2012. http://dx.doi.org/10.55274/r0010468.
Der volle Inhalt der QuelleAnnotation:
The objective includes: Assess commercially available inspection methods to validate integrity of composite repair systems. Identify applicability to inspect composite overwrap and parent metal for both onshore and sub-sea pipelines (where information is available). Identify sources of data to include other users of composite materials(aerospace/aircraft, naval/ship repairs). Identify procedures and technologies to assess inspection effectiveness and provide a gap analysis. Interface with other PRCI projects on long-term testing of composite repairs and other joint industry projects on composite repairs to improve our understanding of long term durability of repairs. Identify global experience with composite repairs; not just North America. For general wall loss, radiography or electromagnetic techniques appear to be the best candidates. Standard radiography techniques can detect changes in wall thickness over a large area. Saturated low frequency systems, e.g. SLOFEC are good for a quick rapid scan of the area of interest. Pulsed eddy current, e.g. PEC, is also available for a general survey of the underlying substrate. For pinhole leaks, the electromagnetic techniques do not have sufficient resolution to detect defects of order 20 mm (0.8 in.) diameter and less. Standard radiography techniques can detect pinhole leaks down to diameters of 3 mm (0.12 in.) or less. Tangential radiography techniques are generally good for defect sizing but there are practical limitations with chord length (i.e. beam path through the pipe wall). Ultrasonic techniques could offer a potential solution but is currently limited due to the high attenuation of the composite repair material where through the repair inspection could only detect large diameter defects greater than 25 mm (1 in.) diameter on thin repairs less than 5 mm (0.2 in.). Detecting pin hole defects by applying the ultrasound along the axial direction of the substrate, effectively skipping the ultrasound under the repair, showed more promise. For delamination or debonding of the interface between the composite laminate and the steel substrate, laser shearography and microwave inspection appear to offer the best solution. Currently there is no single inspection technique that can be applied with confidence to the inspection of interfacial delaminations. Further developments are on-going to provide a solution to this challenging inspection problem. Acoustic emission is able to give an overall picture of the damage within the composite under live loads. It can be used as a QA tool to test the integrity of the repair. However, it is difficult to interpret the signals to gain any quantitative information about a particular defect.
8
Wieder, H. H. Synthesis of Mismatched Heterojunction/Substrate Interfaces. Fort Belvoir, VA: Defense Technical Information Center, Oktober 1991. http://dx.doi.org/10.21236/ada241845.
Der volle Inhalt der Quelle
9
Wieder, Harry H. Synthesis and Properties of Mismatched Heterojunction/Substrate Interfaces. Fort Belvoir, VA: Defense Technical Information Center, August 1992. http://dx.doi.org/10.21236/ada254577.
Der volle Inhalt der Quelle
10
Tidd, Alexander N., Richard A. Ayers, Grant P. Course und Guy R. Pasco. Scottish Inshore Fisheries Integrated Data System (SIFIDS): work package 6 final report development of a pilot relational data resource for the collation and interpretation of inshore fisheries data. Herausgegeben von Mark James und Hannah Ladd-Jones. Marine Alliance for Science and Technology for Scotland (MASTS), 2019. http://dx.doi.org/10.15664/10023.23452.
Der volle Inhalt der QuelleAnnotation:
[Extract from Executive Summary] The competition for space from competing sectors in the coastal waters of Scotland has never been greater and thus there is a growing a need for interactive seascape planning tools that encompass all marine activities. Similarly, the need to gather data to inform decision makers, especially in the fishing industry, has become essential to provide advice on the economic impact on fishing fleets both in terms of alternative conservation measures (e.g. effort limitations, temporal and spatial closures) as well as the overlap with other activities, thereby allowing stakeholders to derive a preferred option. The SIFIDS project was conceived to allow the different relevant data sources to be identified and to allow these data to be collated in one place, rather than as isolated data sets with multiple data owners. The online interactive tool developed as part of the project (Work Package 6) brought together relevant data sets and developed data storage facilities and a user interface to allow various types of user to view and interrogate the data. Some of these data sets were obtained as static layers which could sit as background data e.g. substrate type, UK fishing limits; whilst other data came directly from electronic monitoring systems developed as part of the SIFIDS project. The main non-static data source was Work Package 2, which was collecting data from a sample of volunteer inshore fishing vessels (<12m). This included data on location; time; vessel speed; count, time and position of deployment of strings of creels (or as fleets and pots as they are also known respectively); and a count of how many creels were hauled on these strings. The interactive online tool allowed all the above data to be collated in a specially designed database and displayed in near real time on the web-based application.