Thematische Bibliographien / Stencil mask

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Auswahl der wissenschaftlichen Literatur zum Thema „Stencil mask“

Autor: Grafiati

Veröffentlicht am 28. Juni 2021

Zuletzt aktualisiert am 5. Februar 2022

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Zeitschriftenartikel zum Thema "Stencil mask"

Lee, Yong‐Won, Keun‐Soo Kim und Katsuaki Suganuma. „The behaviour of solder pastes in stencil printing with electropolishing process“. Soldering & Surface Mount Technology 25, Nr. 3 (21.06.2013): 164–74. http://dx.doi.org/10.1108/ssmt-12-2012-0027.

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PurposeThe purpose of this paper is to study the effect of the electropolishing time of stencil manufacturing parameters and solder‐mask definition methods of PCB pad design parameters on the performance of solder paste stencil printing process for the assembly of 01005 chip components.Design/methodology/approachDuring the study, two types of stencils were manufactured for the evaluations: electroformed stencils and electropolished laser‐cut stencils. The electroformed stencils were manufactured using the standard electroforming process and their use in the paste printing process was compared against the use of an electropolished laser‐cut stencil. The electropolishing performance of the laser‐cut stencil was evaluated twice at the following intervals: 100 s and 200 s. The performance of the laser‐cut stencil was also evaluated without electropolishing. An optimized process was established after the polished stencil apertures of the laser‐cut stencil were inspected. The performance evaluations were made by visually inspecting the quality of the post‐surface finishing for the aperture wall and the quality of that post‐surface finishing was further checked using a scanning electron microscope. A test board was used in a series of designed experiments to evaluate the solder paste printing process.FindingsThe results demonstrated that the length of the electropolishing time had a significant effect on the small stencil's aperture quality and the solder paste's stencil printing performance. In this study, the most effective electropolishing time was 100 s for a stencil thickness of 0.08 mm. The deposited solder paste thickness was significantly better for the enhanced laser‐cut stencil with electropolishing compared to the conventional electroformed stencils. In this printing‐focused work, print paste thickness measurements were also found to vary across different solder‐mask definition methods of printed circuit board pad designs with no change in the size of the stencil aperture. The highest paste value transfer consistently occurred with solder‐mask‐defined pads, when an electropolished laser‐cut stencil was used.Originality/valueDue to important improvements in the quality of the electropolished laser‐cut stencil, and based on the results of this experiment, the electropolished laser‐cut stencil is strongly recommended for the solder paste printing of fine‐pitch and miniature components, especially in comparison to the typical laser‐cut stencil. The advantages of implementing a 01005 chip component mass production assembly process include excellent solder paste release, increased solder volume, good manufacture‐ability, fast turnaround time, and greater cost saving opportunities.

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Shibata, T., K. Suguro, K. Sugihara, T. Nishihashi, J. Fujiyama und Y. Sakurada. „Stencil mask ion implantation technology“. IEEE Transactions on Semiconductor Manufacturing 15, Nr. 2 (Mai 2002): 183–88. http://dx.doi.org/10.1109/66.999589.

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Deshmukh, Mandar M., D. C. Ralph, M. Thomas und J. Silcox. „Nanofabrication using a stencil mask“. Applied Physics Letters 75, Nr. 11 (13.09.1999): 1631–33. http://dx.doi.org/10.1063/1.124777.

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Takenaka, H., H. Yamashita, Y. Tomo, Y. Kojima, M. Watanabe, T. Iwasaki und M. Yamabe. „Dynamic analysis of a stencil mask“. Microelectronic Engineering 61-62 (Juli 2002): 227–32. http://dx.doi.org/10.1016/s0167-9317(02)00543-9.

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SATO, Keiichi, Kazuhiro YOSHIDA und Joon-wan KIM. „Development of magnetic material stencil mask“. Proceedings of Yamanashi District Conference 2017 (2017): 205. http://dx.doi.org/10.1299/jsmeyamanashi.2017.205.

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Nishihashi, T., K. Kashimoto, J. Fujiyama, Y. Sakurada, T. Shibata, K. Suguro, K. Sugihara et al. „Ion-graphy implanter with stencil mask“. Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 20, Nr. 3 (2002): 914. http://dx.doi.org/10.1116/1.1475982.

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Yamashita, Hiroshi, Kunio Takeuchi und Hideki Masaoka. „Mask split algorithm for stencil mask in electron projection lithography“. Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 19, Nr. 6 (2001): 2478. http://dx.doi.org/10.1116/1.1412897.

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Reu, P., R. Engelstad, E. Lovell, C. Magg und M. Lercel. „Modeling mask fabrication and pattern transfer distortions for EPL stencil masks“. Microelectronic Engineering 57-58 (September 2001): 467–73. http://dx.doi.org/10.1016/s0167-9317(01)00470-1.

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Sprague, M., W. Semke, R. Engelstad, E. Lovell, A. Chalupka, H. Löschner und G. Stengl. „Stencil mask distortion control using nonsymmetric perforation rings“. Microelectronic Engineering 41-42 (März 1998): 225–28. http://dx.doi.org/10.1016/s0167-9317(98)00051-3.

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Butschke, J., A. Ehrmann, B. Höfflinger, M. Irmscher, R. Käsmaier, F. Letzkus, H. Löschner et al. „SOI wafer flow process for stencil mask fabrication“. Microelectronic Engineering 46, Nr. 1-4 (Mai 1999): 473–76. http://dx.doi.org/10.1016/s0167-9317(99)00043-x.

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Dissertationen zum Thema "Stencil mask"

Bobuľa, Matej. „Neeuklidovské vykreslování ve VR“. Master's thesis, Vysoké učení technické v Brně. Fakulta informačních technologií, 2021. http://www.nusl.cz/ntk/nusl-445563.

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The main goal of this master's thesis is to research different approaches of rendering geometries and spaces in virtual reality. Learn more about the terms, non-Euclidean geometry and non-Euclidean spaces, their origin and different principles used in video game industry to simulate such geometries or spaces. Based on the research, a selection of an optimal API is needed for the implementation of such application. Application is designed to run on desktop computers with Microsoft Windows operating system. Application, in it's core, is a video game and the main goal of the player is to successfully complete each and every level of the game. These levels are designed in a specific way so that they each individually represent some form of non-Euclidean geometry or space.

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Bertin, Hervé. „Etude de matrices de filtres Fabry Pérot accordables en technologie MOEMS intégré 3D : Application à l’imagerie multispectrale“. Thesis, Paris 11, 2013. http://www.theses.fr/2013PA112132/document.

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L’imagerie multispectrale permet d’améliorer la détection et la reconnaissance de cibles dans les applications de surveillance. Elle consiste à analyser des images de la même scène acquises simultanément dans plusieurs bandes spectrales grâce à un filtrage. Cette thèse étudie la possibilité de réaliser une matrice de 4 filtres Fabry Pérot (FP) intégrés 3D et ajustables par actionnement électrostatique dans le domaine visible-proche infrarouge. Les miroirs fixes des filtres FP sont des multicouches ZnS/YF₃ déposés sur un wafer de borosilicate, et les miroirs mobiles sont des membranes multicouches PECVD SiNH/SiOH encastrées sur une structure mobile très compacte micro-usinée dans un wafer en silicium. Les performances optiques des filtres FP ont été optimisées en prenant en compte la dissymétrie et le déphasage à la réflexion des miroirs. La structure mobile a été modélisée par éléments finis pour minimiser ses déformations lors de l’actionnement. Les étapes critiques des procédés de fabrication des miroirs mobiles en technologie Si ou SOI ont été mises au point : i) la fabrication et la libération par gravures profondes DRIE et XeF₂ des membranes multicouches avec une contrainte résiduelle ajustée par recuit et une réflectance voisine de 50% dans une large gamme spectrale, ii) le contrôle des vitesse de la gravure DRIE avec des motifs temporaires permettant la gravure simultanée de motifs de largeur et de profondeur variables, et iii) la délimitation de motifs sur surfaces fortement structurées à l’aide de pochoirs alignés mécaniquement ou de films secs photosensibles. Ces travaux ouvrent la voie vers une réalisation complète d’une matrice de filtres FP intégrés 3D
Multispectral imaging is used to improve target detection and identification in monitoring applications. It consists in analyzing images of the same scene simultaneously recorded in several spectral bands owing to a filtering. This thesis investigates the possibility to realize, an array of four 3D integrated Fabry-Perot (FP) filters that are tunable in the visible-near infrared range by electrostatic actuation. The fixed mirrors of the FP filters are ZnS/YF₃ multilayers deposited on a borosilicate wafer, and the movable mirrors are PECVD SiNH/SiOH multilayer membranes clamped in a very compact movable structure micromachined in a Si wafer. A 3rd glass wafer is used for filters packaging. Optical performances of the FP filters have been optimized by taking into account the asymmetry and the reflection phase shift of the mirrors and the mobile structure has been modeled by finite elements analysis notably to minimize its deformation during actuation. The critical steps of the movable mirrors fabrication process in Si or SOI technology have been developed : i) the fabrication and the release by DRIE and XeF₂ etching of 8 or 12 layers membranes with a residual stress tunable by annealing and a reflectance close to 50% in broad wavelength range (570-900nm), ii) the control with temporary patterns of the simultaneous deep etching of patterns with different widths and depths, and iv) various patterning techniques on highly structured surfaces based on shadow masks (with mechanical alignment) or laminated photosensitive dry films. These results open the way towards the full realization of an array of 3D integrated FP filters

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Ahnlén, Fredrik. „Automatic Detection of Low Passability Terrain Features in the Scandinavian Mountains“. Thesis, KTH, Geodesi och satellitpositionering, 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-254709.

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During recent years, much focus have been put on replacing time consuming manual mappingand classification tasks with automatic methods, having minimal human interaction. Now it ispossible to quickly classify land cover and terrain features covering large areas to a digital formatand with a high accuracy. This can be achieved using nothing but remote sensing techniques,which provide a far more sustainable process and product. Still, some terrain features do not havean established methodology for high quality automatic mapping.The Scandinavian Mountains contain several terrain features with low passability, such asmires, shrub and stony ground. It would be of interest to anyone passing the land to avoid theseareas. However, they are not sufficiently mapped in current map products.The aim of this thesis was to find a methodology to classify and map these terrain featuresin the Scandinavian Mountains with high accuracy and minimal human interaction, using remotesensing techniques. The study area chosen for the analysis is a large valley and mountain sidesouth-east of the small town Abisko in northern Sweden, which contain clearly visible samplesof the targeted terrain features. The methodology was based on training a Fuzzy Logic classifierusing labeled training samples and descriptors derived from ortophotos, LiDAR data and currentmap products, chosen to separate the classes from each other by their characteristics. Firstly,a set of candidate descriptors were chosen, from which the final descriptors were obtained byimplementing a Fisher score filter. Secondly a Fuzzy Inference System was constructed usinglabeled training data from the descriptors, created by the user. Finally the entire study area wasclassified pixel-by-pixel by using the trained classifier and a majority filter was used to cluster theoutputs. The result was validated by visual inspection, comparison to the current map productsand by constructing Confusion Matrices, both for the training data and validation samples as wellas for the clustered- and non-clustered results.The results showed that
De senaste åren har mycket fokus lagts på att ersätta tidskrävande manuella karterings- och klassificeringsmetodermed automatiserade lösningar med minimal mänsklig inverkan. Det är numeramöjligt att digitalt klassificera marktäcket och terrängföremål över stora områden, snabbt och medhög noggrannhet. Detta med hjälp av enbart fjärranalys, vilket medför en betydligt mer hållbarprocess och slutprodukt. Trots det finns det fortfarande terrängföremål som inte har en etableradmetod för noggrann automatisk kartering.Den skandinaviska fjällkedjan består till stor del av svårpasserade terrängföremål som sankmarker,videsnår och stenig mark. Alla som tar sig fram i terrängen obanat skulle ha nytta av attkunna undvika dessa områden men de är i nuläget inte karterade med önskvärd noggrannhet.Målet med denna analys var att utforma en metod för att klassificera och kartera dessa terrängföremåli Skanderna, med hög noggrannhet och minimal mänsklig inverkan med hjälp avfjärranalys. Valet av testområde för analysen är en större dal och bergssida sydost om Abisko inorra Sverige som innehåller tydliga exemplar av alla berörda terrängföremål. Metoden baseradespå att träna en Fuzzy Logic classifier med manuellt utvald träningsdata och deskriptorer,valda för att bäst separera klasserna utifrån deras karaktärsdrag. Inledningsvis valdes en uppsättningav kandidatdeskriptorer som sedan filtrerades till den slutgiltiga uppsättningen med hjälp avett Fisher score filter. Ett Fuzzy Inference System byggdes och tränades med träningsdata fråndeskriptorerna vilket slutligen användes för att klassificera hela testområdet pixelvis. Det klassificeraderesultatet klustrades därefter med hjälp av ett majoritetsfilter. Resultatet validerades genomvisuell inspektion, jämförelse med befintliga kartprodukter och genom confusion matriser, vilkaberäknades både för träningsdata och valideringsdata samt för det klustrade och icke-klustraderesultatet.Resultatet visade att de svårpasserade terrängföremålen sankmark, videsnår och stenig markkan karteras med hög noggrannhet med hjälp denna metod och att resultaten generellt är tydligtbättre än nuvarande kartprodukter. Däremot kan metoden finjusteras på flera plan för att optimeras.Bland annat genom att implementera deskriptorer för markvattenrörelser och användandeav LiDAR med högre spatial upplösning, samt med ett mer fulltäckande och spritt val av klasser.

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To, Nelson. „The Study of Metal Diffusion on Si(001) using a Nanostencil Shadow Mask“. Thesis, 2011. http://hdl.handle.net/1807/29634.

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A self-aligning nanostencil mask is used to fabricate circular features of tin, indium and silver on an atomically clean Si(001) substrate. The shadow mask limits deposited material to areas under openings in the mask, leaving adjacent clean areas for material to diffuse. STM, SEM and AFM have been used to study the surface diffusion of these metals in UHV. The diffusion of tin is relatively limited in comparison to the other metals. Indium forms metal islands that dissolve over time and contribute to the spreading of a surrounding single layer film. Lastly, silver forms a film that spreads even in the absence of metal islands.

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Zoltán, Rácz. „Piezoflexure-enabled nanofabrication using translated stencil masks“. 2007. http://etd.nd.edu/ETD-db/theses/available/etd-04202007-200219/.

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Thesis (Ph. D.)--University of Notre Dame, 2007.
Thesis directed by Alan C. Seabaugh for the Department of Electrical Engineering. "April 2007." Includes bibliographical references (leaves 145-154).

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Bücher zum Thema "Stencil mask"

Roth, Ed. Stencil 101: Make your mark with 25 reusable stencils and step-by-step instructions. San Francisco: Chronicle Books, 2008.

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Roth, Ed. Stencil 101: Make your mark with 25 reusable stencils and step-by-step instructions. San Francisco: Chronicle Books, 2008.

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Roth, Ed. Stencil 101: Make your mark with 25 reusable stencils and step-by-step instructions. San Francisco: Chronicle Books, 2008.

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Stencils and masks. London: Macdonald / Orbis, 1988.

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Mark Stencil Maths Attainment. Nfer Nelson, 1994.

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Martin, Judy. Using Stencils and Masks. F & W Publications, 1988.

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Noble, Marty. Fun with Native American Masks Stencils. Dover Publications, 2003.

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Vedrenne, Penny. Scary Halloween Masks: A Book of Stencils. Lulu.com, 2007.

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Konferenzberichte zum Thema "Stencil mask"

Ehrmann, Albrecht, Sabine Huber, Rainer Kaesmaier, Andreas B. Oelmann, Thomas Struck, Reinhard Springer, Joerg Butschke et al. „Stencil mask technology for ion beam lithography“. In 18th Annual BACUS Symposium on Photomask Technology and Management, herausgegeben von Brian J. Grenon und Frank E. Abboud. SPIE, 1998. http://dx.doi.org/10.1117/12.332827.

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Ehrmann, Albrecht, Annika Elsner, Roman Liebe, Thomas Struck, Joerg Butschke, Florian Letzkus, Mathias Irmscher, Reinhard Springer, Ernst Haugeneder und Hans Loeschner. „Stencil mask key parameter measurement and control“. In Microlithography 2000, herausgegeben von Elizabeth A. Dobisz. SPIE, 2000. http://dx.doi.org/10.1117/12.390074.

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Takenaka, Hiroshi, Hiroshi Yamashita, Kaoru Koike und Masaki Yamabe. „Subfield distortion of an EPL stencil mask“. In Microlithography 2003, herausgegeben von Roxann L. Engelstad. SPIE, 2003. http://dx.doi.org/10.1117/12.484980.

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Haugeneder, Ernst, A. Chalupka, T. Lammer, Hans Loeschner, Frank-Michael Kamm, Thomas Struck, Albrecht Ehrmann et al. „Measures to achieve 20nm IPL stencil mask distortion“. In 18th European Mask Conference on Mask Technology for Integrated Circuits and Micro-Components. SPIE, 2002. http://dx.doi.org/10.1117/12.479353.

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Sugimura, Hiroshi, Tsukasa Yamazaki, Takashi Susa, Yoshiyuki Negishi, Takashi Yoshii, Hideyuki Eguchi und Akira Tamura. „Stencil pattern accuracy of EPL masks“. In Photomask and Next Generation Lithography Mask Technology XII, herausgegeben von Masanori Komuro. SPIE, 2005. http://dx.doi.org/10.1117/12.617279.

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Kurihara, Kenji, H. Iriguchi, A. Motoyoshi, T. Tabata, S. Takahashi, K. Iwamoto, Ikuo Okada, Hideo Yoshihara und Hitoshi Noguchi. „Stencil masks for electron-beam projection lithography“. In Photomask and Next Generation Lithography Mask Technology VIII, herausgegeben von Hiroichi Kawahira. SPIE, 2001. http://dx.doi.org/10.1117/12.438383.

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Takenaka, Hiroshi, Hiroshi Yamashita, Kimitoshi Takahashi, Yoichi Tomo, Manabu Watanabe, Teruo Iwasaki, J. Yamamoto und Masaki Yamabe. „Dynamic image placement accuracy of a stencil mask“. In SPIE's 27th Annual International Symposium on Microlithography, herausgegeben von Roxann L. Engelstad. SPIE, 2002. http://dx.doi.org/10.1117/12.472269.

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Maruyama, Satoru, Nakahiro Harada, Jiro Yamamoto und Naoyuki Nakamura. „Stencil mask defect inspection system and advanced application“. In Photomask and Next Generation Lithography Mask Technology XI, herausgegeben von Hiroyoshi Tanabe. SPIE, 2004. http://dx.doi.org/10.1117/12.557819.

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Ehrmann, Albrecht, Thomas Struck, Ernst Haugeneder, Hans Loeschner, Joerg Butschke, Florian Letzkus, Mathias Irmscher und Reinhard Springer. „IPL stencil mask distortions: experimental and theoretical analysis“. In Microlithography 2000, herausgegeben von Elizabeth A. Dobisz. SPIE, 2000. http://dx.doi.org/10.1117/12.390075.

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Fujita, Hiroshi, Tadahiko Takigawa, Mikio Ishikawa, Yu-ki Aritsuka, Satoshi Yusa, Morihisa Hoga und Hisatake Sano. „200-mm EPL stencil mask fabrication and metrology“. In Photomask Technology, herausgegeben von Kurt R. Kimmel und Wolfgang Staud. SPIE, 2003. http://dx.doi.org/10.1117/12.518034.

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Berichte der Organisationen zum Thema "Stencil mask"

Shade, Paul A., Michael D. Uchic, Sang-Lan Kim und Robert Wheeler. Stencil Mask Methodology for the Parallelized Production of Microscale Mechanical Test Samples (Preprint). Fort Belvoir, VA: Defense Technical Information Center, August 2012. http://dx.doi.org/10.21236/ada566048.

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