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1
Kim, Hee Y., Seung Soo Han, Sung Bok Hong und Sang Jeen Hong. „Statistical Process Monitoring System for SMT Industry Using Automatic Optical Inspection System“. Materials Science Forum 580-582 (Juni 2008): 561–64. http://dx.doi.org/10.4028/www.scientific.net/msf.580-582.561.
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As the demand of higher throughput in high volume surface mounting technology (SMT) industry, inspection and testing have been notably emphasized. To alleviate concerns associated with board level soldering inspection, automatic optical inspection (AOI) has been actively used in SMT industry [1]. In this paper, statistical quality control method has been applied for board level inspection to maximize the performance of a commercially available AOI system. Considering its complication of SMT assembled board, implementing the quality control scheme for the measured variable data is fairly expensive. However, the proposed system efficiently utilizes both attribute and variable data collected for the daily/weekly based production yield reports, and further utilize as a method for in-line diagnostics in SMT manufacturing process.
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Mandal, Nirupama, Bikas Mondal und Rajan Sarkar. „Design of an optical temperature transmitter for inflammable industry“. IET Science, Measurement & Technology 13, Nr. 5 (01.07.2019): 671–77. http://dx.doi.org/10.1049/iet-smt.2018.5100.
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3
Walker, Jessica. „The performer-creator as collaborator in the music theatre industry: Creative agency versus professional agency“. Studies in Musical Theatre 11, Nr. 2 (01.06.2017): 179–96. http://dx.doi.org/10.1386/smt.11.2.179_1.
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Neophytou, R. I., und A. C. Metaxas. „Characterisation of radio frequency heating systems in industry using a network analyser“. IEE Proceedings - Science, Measurement and Technology 144, Nr. 5 (01.09.1997): 215–22. http://dx.doi.org/10.1049/ip-smt:19971351.
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5
Chen, Gary Yu-Hsin, Hui-Ming Wee und Chun Yao Lee. „Supplier Selection and Competitiveness — A Case Study on the Surface Mount Industry“. Journal of Advanced Manufacturing Systems 13, Nr. 03 (13.08.2014): 155–79. http://dx.doi.org/10.1142/s0219686714500103.
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This research investigates the supplier selection criteria in the surface mount technology (SMT) industry by conducting in-depth interviews with experts to design the questionnaire for collecting data. Questionnaires are then sent to a selected list of SMT companies in Taiwan. The data are then analyzed through statistical methods. Additionally, the factor analysis is used to extract major components and construct the evaluation criteria, which includes five main categories and 41 evaluation indicators. The Strengths, Weakness, Opportunities, and Threats (SWOT) analysis is also used to consider factors that affect strengths, weaknesses, opportunities, and threats of logistics in a firm. Those factors include competitions between the existing competitors, threats from potential entrants, and threats from the alternatives. The five forces analysis is conducted to survey the bargaining power of the buyers. The study compiles views and recommendations from supplier management professionals in SMT industry, as well as their work experiences, enterprises' existing mode of operation and other relevant information. The compiled recommendations and statistical results may provide guidelines for suppliers' selection in the SMT industry.
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Forcada, Mikel L. „Making sense of neural machine translation“. Translation Spaces 6, Nr. 2 (04.12.2017): 291–309. http://dx.doi.org/10.1075/ts.6.2.06for.
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Abstract The last few years have witnessed a surge in the interest of a new machine translation paradigm: neural machine translation (NMT). Neural machine translation is starting to displace its corpus-based predecessor, statistical machine translation (SMT). In this paper, I introduce NMT, and explain in detail, without the mathematical complexity, how neural machine translation systems work, how they are trained, and their main differences with SMT systems. The paper will try to decipher NMT jargon such as “distributed representations”, “deep learning”, “word embeddings”, “vectors”, “layers”, “weights”, “encoder”, “decoder”, and “attention”, and build upon these concepts, so that individual translators and professionals working for the translation industry as well as students and academics in translation studies can make sense of this new technology and know what to expect from it. Aspects such as how NMT output differs from SMT, and the hardware and software requirements of NMT, both at training time and at run time, on the translation industry, will be discussed.
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Williamson, Jaimal, Kurt Wachtler, David Chin und Mike Pierce. „PoP Technology for the Automotive Industry“. International Symposium on Microelectronics 2014, Nr. 1 (01.10.2014): 000081–85. http://dx.doi.org/10.4071/isom-ta33.
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Package-on-Package (PoP) technology has been in production for commercial and portable electronic applications for many years. The key challenge for PoP in automotive applications is meeting the aggressive defect level requirements. The need for PoP has historically been driven by mobile and tablet applications and an increased demand for more processor and memory performance within smaller spaces. With the maturity and excellent historical performance of PoP technology used with TI OMAPTM processor products, PoP can now be introduced as a reliable packaging technology in the automotive industry. This paper will describe the work involved in the enablement of commercial PoP technology into the automotive industry. The challenges and requirements regarding package design, warpage performance, surface mount (SMT) characterization, and board-level reliability (BLR) performance will all be explained.
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Briggs, Ed. „Optimal SMT Electronics Assembly Guidelines for Stencil Printing“. International Symposium on Microelectronics 2015, Nr. 1 (01.10.2015): 000126–34. http://dx.doi.org/10.4071/isom-2015-tp46.
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The continuing miniaturization of personal electronics devices, such as mobile phones, personal music devices, and personal computing devices has driven the need for increasingly smaller active and passive electrical components. Not too long ago, 0402 (40 × 20mils) passives were seen as the ultimate in miniaturization, but recently 0201 and now 01005 passives have arrived, with predictions of even smaller sizes to come. For active components, the 30mil CSP (a chip-scale package with the solder balls on 30mil/0.75mm centers) has virtually become a requirement for enabling the many features required in modern portable electronics devices. This miniaturization trend, occurring simultaneously with the conversion to RoHS-compliant lead-free assembly, has put a considerable strain on the electronics assembly industry. This paper will discuss guidelines to optimize the electronics assembly process focusing primarily on stencil printing. With a smaller process window, each variable in the process contributes to the overall success of the assembly. Simple contributions such as storage and handling of solder paste can make or break a printing process. Many solder defects (some say 60–70%) can be attributed to the printing process. Therefore, stencil printing set-up is discussed, as well as solder paste measurement metrics, to determine the potential for success and assure a reliable solder joint.
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Zhang, Huiyan, Hao Sun und Peng Shi. „Chip Appearance Inspection Method for High-Precision SMT Equipment“. Machines 9, Nr. 2 (07.02.2021): 34. http://dx.doi.org/10.3390/machines9020034.
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In order to meet the defect-detection requirements of chips in high-precision surface mount technology (SMT) equipment widely used in the electronic industry, a chip appearance defect-detection method based on multi-order fractional discrete wavelet packet decomposition (DWPD) is proposed in this paper. First, lead and body regions were extracted from chip images using the image segmentation algorithm with asymmetric Laplace mixture model and connected-component labelling algorithm; then, the texture feature of the region to be inspected was extracted with the multi-order fractional DWPD algorithm and the geometric and gradient features were combined to form image features of the region to be inspected before the subset of features was selected from image features with the feature selection algorithm based on the variational Bayesian Gaussian mixture model; and finally, the support vector machine was used to determine whether the region to be inspected was defective. An experiment was conducted on a data set captured in high-precision SMT equipment. The accuracy of the proposed chip appearance defect-detection method is about 93%, which is more accurate than existing ones.
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Bhartia, Prakash, Jim Angeloni und Will Bolinger. „Flexible Hand-Free Microelectronics assembly Line for the Chip and Wire industry“. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (01.01.2015): 000790–826. http://dx.doi.org/10.4071/2015dpc-tp35.
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This paper presents Natel's effort in pioneering the design and development of the first Touch-Free Microelectronics assembly Line for the Chip and Wire industry. When the Surface Mount Technology (SMT) industry first started, it began as a series of discrete pieces of equipment that performed the functions required to populate Circuit Cards. Over the years, the technology has evolved as has the industry such that fully integrated, automated lines are available where the circuit cards are installed at one end of the line, reels or tubes of components, such as packaged resistors, inductors, capacitors and semiconductors etc., loaded, the machine programmed and assembled circuit cards are available at the other end. However, no such line has been developed for the Chip and Wire industry, with most assembly houses still using individual stand alone die attach, bonders, plasma clean machines to populate substrates. Natel has developed the first of its kind integrated Auto line for the Chip and Wire industry, which conceptually replicates a SMT line. This Auto Line is touch–free and incorporates die attach ( including eutectic), ball and ribbon bonding , plasma clean and in line testing. The line is ideal for high volume production of Hybrid and Microwave Integrated Circuits. The obvious advantages of this approach are the “ hands-free” continuous flow aspect with significant reduction in product defects, increase in efficiency and cost reduction thereby increasing competitiveness against low labor rate overseas operations. This paper will provide details of the line, and discuss what additional capabilities can be added and hopefully promote the future development of the Chip and Wire industry built on this pioneering development.
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Luo, Jie Si, Ying Jie Zhang, Zi Lian Liu, Hui Xiao, Xiao Tong Guo und Huan Xiang Xu. „Failure Analysis and Evaluation of Material Compatibility of Solder Paste“. Materials Science Forum 1033 (Juni 2021): 109–15. http://dx.doi.org/10.4028/www.scientific.net/msf.1033.109.
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Solder paste is mainly used for welding of resistance, capacitance, integrated circuit (IC) and other electronic components in surface mounted technology (SMT) industry, and the performance of solder paste has a significant impact on the reliability of electronic components. In this paper, processing defects, failure cases and mechanism of electronic components caused by solder paste are analyzed systematically. Improper application of solder paste during welding can lead to numerous processing defects including poor wetting, tombstoning, bridging, solder joint crack, solder ball spattering, corrosion and so on. Finally, an evaluation method of material compatibility is described in this paper, which provides a reference for ensuring the quality of electronic process material and improving the reliability of SMT products.
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Fillion, Ray. „Embedded Actives and Its Industry Effects“. International Symposium on Microelectronics 2011, Nr. 1 (01.01.2011): 000382–87. http://dx.doi.org/10.4071/isom-2011-tp5-paper5.
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Over the 60 plus year history of microelectronics packaging, electronic devices have been mounted onto an interconnect structure to form a microelectronics circuit. The devices could be bare chips, CSPs or packaged components such as SMT or thru-hole carriers. The interconnect structures could be circuit boards, ceramic substrates or flex circuits. This methodology has enabled a clear divide between the fabrication, assembly and test of the semiconductor device, the fabrication and test of the interconnect structure and the assembly and test of the component/substrate assembly. Over the past decade a new packaging methodology, embedded actives (chips), has been developed that changes all of these industry norms. In an embedded actives packaging approach, one or more bare or chip scale semiconductor devices are embedded within the interconnect structure. Although these approaches have significant electrical performance, size and cost benefits, the normal barriers between chip packaging, substrate fabrication and component assembly are removed. The interconnect structure is not completed prior to component embedding and the embedded component cannot be tested at packaged part level without the interconnect structure. This complicates electrical testing and makes it virtually impossible to differentiate between a defective component, a defective interconnect or a defective component to substrate contact. This paper will look at the history of embedded active developments and go into the various processes and structures being used. It will cover their electrical, reliability and size advantages and will address the revolutionary changes that the microelectronics industry must make to effectively utilize these technologies.
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Boenke, A. „The Standards, Measurements and Testing Programme (SMT)—The European Support to Standardisation, Measurements and Testing Projects and its Proposed Activities in the 5th Framework Programme“. Journal of Near Infrared Spectroscopy 6, A (Januar 1998): A1—A6. http://dx.doi.org/10.1255/jnirs.159.
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The objectives of the EC, SMT-Programme include the provision of research and technical support to standardisation and health of the society when it is required to improve the competitive position of European industry, and for the development or implementation of Community policy.1 These objectives led to the EC, SMT-workprogramme, which is divided in the following three THEMES: THEME I: Measurements for Quality European Products Including Written Standards for Industry, THEME II: Measurements Related to Written Standards and Technical Support to Trade, THEME III: Measurements Related to the Needs of Society. These themes were accessible through participation in different calls for proposals. The European Commission's proposal for the 5th Framework Programme explains that harmonised and validated methods, as well as instrumentation in Europe, together with the establishment of international traceability of measurements, are needed to ensure quality and sustainability of industrial products, services, to remove barriers to trade, to promote mutual recognition agreements and to combat fraud. Consequently, the following objectives of Measurements and Testing as a generic activity within the 3rd Thematic Programme, Promoting Competitive and Sustainable Growth, were proposed: (a) pre-normative research and technical support to standardisation, (b) the fight against fraud, (c) improvement of quality of products and services. These objectives include instrumentation (e.g. Sensors, etc.), reference methods and certified Reference Materials (CRM) as important measurement and testing tools.
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Guo, Yaping, Shaogui Yang, Xuefei Zhou, Chunmian Lin, Yajun Wang und Weifeng Zhang. „Enhanced Photocatalytic Activity for Degradation of Methyl Orange over Silica-Titania“. Journal of Nanomaterials 2011 (2011): 1–9. http://dx.doi.org/10.1155/2011/296953.
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Silica-modified titania (SMT) powders with different atomic ratios of silica to titanium (Rx) were successfully synthesized by a simple ultrasonic irradiation technique. The prepared samples were characterized by X-ray diffraction (XRD), FT-IR spectroscopy, transmission electron microscopy (TEM), X-ray photoelectron spectroscopy (XPS), and ultraviolet visible spectroscopy. The specific surface area was measured according to BET theory. Results indicate that the addition of silica to titania can suppress the crystalline size growth and the transformation of anatase phase to rutile phase of titania, enlarge specific surface area of the titania particles, and result in a blue shift of absorption edge compared to pure titania. The photocatalytic activity of the SMT samples was evaluated by decolorizing methyl orange aqueous solutions under UV-visible light irradiation. It was found in our study that this activity was affected by silica content, calcination temperature, H2SO4, and oxidants such as KIO4, (NH4)2S2O8and H2O2. The results reveal that the photocatalytic activity of 0.1-SMT catalyst is the best among all samples calcined at550°C for 1 h and it is 1.56 times higher than that of Degussa P-25 titania, which is a widely used commercial TiO2made by Germany Degussa company and has been most widely used in industry as photocatalyst, antiultraviolet product, and thermal stabilizer. The optimal calcination temperature for preparation was550°C. The photocatalytic activity of SMT samples is significantly enhanced by H2SO4solution treatment and oxidants.
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Bielick, Jim, Mitchell G. Ferrill, Eddie Kobeda und Theron Lewis. „Very High Lead Count SMT Backplane Connector Rework Process: Recognizing the Challenges“. International Symposium on Microelectronics 2011, Nr. 1 (01.01.2011): 000302–10. http://dx.doi.org/10.4071/isom-2011-tp3-paper4.
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The ever growing demand for improved bandwidth, signal speeds, and performance in enterprise servers continues to drive increased circuit density and complex board designs. Single ended mode signaling is one design approach to address these challenges. A tightly integrated design team must carefully control the interfaces and trade-off complexity of chip and package designs to maintain power budgets at target performances. This single ended design approach has necessitated the use of very large (5040 contacts) surface mount connectors. These connectors are assembled to thick, densely wired, high copper content printed circuit boards which press the limits of conventional assembly and rework processes and tooling. Classical automated hot gas rework techniques, even with the best controls and practices in place, may not be capable of providing consistent, reliable connector rework. Extensive tooling modifications may also prove to be inadequate. Given these complex issues, in conjunction with shortening product development cycles, it is critical to define and investigate multiple rework approaches concurrently, so the probability of finding a manufacturable solution is greatly increased. This paper will discuss 1) the thermo-mechanical challenges encountered when trying to perform rework of this high lead count connector, 2) the tooling and process modifications attempted with respect to classical hot gas rework, and 3) the implemented solution which was full connector rework using a local vapor phase process. The local vapor phase process offers many advantages as the industry prepares for the transition to lead free when the RoHS server exemption expires. These advantages will also be discussed.
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Chen, Fen, und Ning-Cheng Lee. „High Reliability No-Clean Solder Paste for Designs where Flux Cannot be Dried“. International Symposium on Microelectronics 2015, Nr. 1 (01.10.2015): 000434–42. http://dx.doi.org/10.4071/isom-2015-wp41.
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The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. Paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosion with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
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Hubble, Neil. „Improvements in Decision Making Criteria for Thermal Warpage“. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, DPC (01.01.2016): 001455–97. http://dx.doi.org/10.4071/2016dpc-wp26.
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Surface mount components are commonly evaluated for out-of-plane warpage levels across reflow temperatures. Decision making for acceptable warpage levels is primarily made based on signed warpage levels of a single component surface, per industry standards. This paper discusses how a single signed warpage value is an oversimplified and incomplete way to describe a surface mount attachment between two mating surfaces that change in shape over temperature. Specific examples are shown where current industry standard gauges for thermal warpage are misleading. Issues include current industry standard equations for calculation of signed warpage. Optimal understanding of effects of warpage on surface mount attachment includes analysis of both mating surfaces under the same thermal and test conditions. Examples are shown of dual surface analysis, where gap between mating surfaces becomes the critical value in place of signed warpage. Evaluating both sides of two attaching surfaces is the optimal way to understand surface mount defects related to thermal warpage. However, many companies dealing with SMT will not have reasonable access to the surfaces to which their products will be attached. The paper goes on to discuss different approaches to more effectively quantify a single surface over temperature. This includes, but is not limited to, adding equations for signal strength values to currently established signed warpage standards.
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Bertoldi, Nicola. „Dynamic Models in Moses for Online Adaptation“. Prague Bulletin of Mathematical Linguistics 101, Nr. 1 (01.04.2014): 7–28. http://dx.doi.org/10.2478/pralin-2014-0001.
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Abstract A very hot issue for research and industry is how to effectively integrate machine translation (MT) within computer assisted translation (CAT) software. This paper focuses on this issue, and more generally how to dynamically adapt phrase-based statistical machine translation (SMT) by exploiting external knowledge, like the post-editions from professional translators. We present an enhancement of the Moses SMT toolkit dynamically adaptable to external information, which becomes available during the translation process, and which can depend on the previously translated text. We have equipped Moses with two new elements: a new phrase table implementation and a new LM-like feature. Both the phrase table and the LM-like feature can be dynamically modified by adding and removing entries and re-scoring them according to a time-decaying scoring function. The final goal of these two dynamically adaptable features is twofold: to create additional translation alternatives and to reward those which are composed of entries previously inserted therein. The implemented dynamic system is highly configurable, flexible and applicable to many tasks, like for instance online MT adaptation, interactive MT, and context-aware MT. When exploited in a real-world CAT scenario where online adaptation is applied to repetitive texts, it has proven itself very effective in improving translation quality and reducing post-editing effort.
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Board, Editorial. „International Conference on Sustainable Development in Design & Manufacturing“. Global Journal of Enterprise Information System 8, Nr. 1 (09.08.2016): 75. http://dx.doi.org/10.18311/gjeis/2016/7528.
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Saraswati College of Engineering is a leading Engineering Institute, established in the year 2004 by Hon. Prithviraj Deshmukh and Smt. Vrushali Deshmukh. The college is approved by AICTE, New Delhi and affiliated to University of Mumbai, India. The college campus is beautifully landscaped in a lush green stretch of land spread across Kharghar Hills, SCOE offers UG Engineering Courses in Civil, Mechanical, Electronics & Telecommunication, Computer, Automobile and Information Technology. SCOE also offers PG courses in Civil, Mechanical, Electronics & Telecommunication and Computer Engineering. SCOE is established with a purpose of imparting state of art technical education to aspiring engineers of 21st Century. Efforts are taken by enhancing the employability & skills of students to bridge gap between Industry & Institute.
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Gupte, Omkar, Vanessa Smet, Gregorio Murtagian und Rao Tummala. „Solder paste wicking in socketable BGAs“. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, DPC (01.01.2019): 000429–52. http://dx.doi.org/10.4071/2380-4491-2019-dpc-presentation_tp2_024.
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The trend of the electronics industry to miniaturize package design has caused the need to adopt BGA packages for a variety of applications. OEM microprocessors have conventionally used LGA designs press fitted into sockets for ease of reworkability. However, BGA packages, which have been widely used for surface mount (SMT) applications, face challenges when they are used in sockets. One of the major challenges faced is the formation of intermetallics between the bare solder ball and the gold paddle of the socket. To address these challenges, Georgia Tech is developing a universal solution for socketing and SMT applications by surface modification of solder spheres. In this new approach, the solder spheres have an outermost noble metal layer which prevents any damage to the BGA and doesn't react with the gold paddle, when placed in a socket. The surface coating would also collapse with the solder ball under specific conditions during reflow when used in SMT applications. This paper focuses on the process of attaching these modified solder spheres on the package and subsequent assembly of the package on the board. We evaluated high and low melting solder pastes to attach the coated spheres to the package. A major challenge observed was the wicking of the solder paste to the entire surface of the solder sphere during reflow. This was addressed by studying the wetting characteristics of the solder paste on different metal surfaces and controlling the volume of solder paste required. Optimization of solder paste volume was done to control wicking and at the same time, achieve a strong and stable joint. Microstructure of the solder joint was analyzed to determine its effect on the joint stability. It was found that the amount of wicking is a strong function of the composition of the solder paste, the reflow time, and the material in surface with which the solder paste is in contact with. This work advances the assembly requirements of socketable BGAs.
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Xiong, Xuan, Ze Kun Feng, Xian Wang und Zhong Yan Chen. „Effect of Dopants on the Microwave Magnetic Characteristics of FeCoBM-Al2O3 Soft Magnetic Thin Films“. Advanced Materials Research 560-561 (August 2012): 797–802. http://dx.doi.org/10.4028/www.scientific.net/amr.560-561.797.
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A series of FeCoBM (M=Nb, Zr, Hf, Mo ,Ta, Ti)–Al2O3 films were prepared on glass and polymer substrates by means of RF magnetron co-sputtering. Effect of dopants on the soft magnetic properties and microwave magnetic characteristics of FeCoBM-Al2O3 Thin Films were studied. To further tailor the magnetic characteristics of the films, the (Fe40Co40B20)94.5Hf2.5–(Al2O3)3 film was annealed at 200 to 400°C for 60 min. As a consequence, the (Fe40Co40B20)94.5Hf2.5–(Al2O3)3 film annealed at 350°C exhibit excellent properties with high saturation magnetization of 1197 kA/m, high resonant frequency of 1.76 GHz, and the real part of permeability is about 600, which is maintained up to 1.5GHz. These results show that the presented films possesses potential in designing micro-magnetic devices for Monolithic Microwave Integrated Circuit (MMIC) and surface mount technology (SMT)industry.
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Basaran, Cemal, und Yujun Wen. „Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation“. Journal of Electronic Packaging 125, Nr. 3 (01.09.2003): 426–30. http://dx.doi.org/10.1115/1.1602707.
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The reliability of solder joints in electronic packaging is becoming more important as the ball grid array (BGA) develops rapidly into the most popular packaging technology. Thermal fatigue of solder joints has been a reliability concern in the electronic packaging industry since the introduction of surface mount technology (SMT). Microstructural coarsening (phase growth) is considered to be closely related to thermomechanical fatigue failure. Many researchers proposed coarsening models for bulk scale metals. But these models have never been verified for micron-scale actual BGA solder balls. In the present study, three different phase growth models are investigated experimentally on BGA solder balls in a real-life electronic package. Model simulations obtained from three models were compared against test data. The best performing model was chosen for finite element fatigue reliability studies based on continuum damage mechanics.
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Ren, Guang, und Maurice N. Collins. „Improved Reliability and Mechanical Performance of Ag Microalloyed Sn58Bi Solder Alloys“. Metals 9, Nr. 4 (20.04.2019): 462. http://dx.doi.org/10.3390/met9040462.
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Ag microalloyed Sn58Bi has been investigated in this study as a Pb-free solder candidate to be used in modern electronics industry in order to cope with the increasing demands for low temperature soldering. Microstructural and mechanical properties of the eutectic Sn58Bi and microalloyed Sn57.6Bi0.4Ag solder alloys were compared. With the addition of Ag microalloy, the tensile strength was improved, and this was attributed to a combination of microstructure refinement and an Ag3Sn precipitation hardening mechanism. However, ductility was slightly deteriorated due to the brittle nature of the Ag3Sn intermetallic compounds (IMCs). Additionally, a board level reliability study of Ag microalloyed Sn58Bi solder joints produced utilizing a surface-mount technology (SMT) process, were assessed under accelerated temperature cycling (ATC) conditions. Results revealed that microalloyed Sn57.6Bi0.4Ag had a higher characteristic lifetime with a narrower failure distribution. This enhanced reliability corresponds with improved bulk mechanical properties. It is postulated that Ag3Sn IMCs are located at the Sn–Bi phase boundaries and suppress the solder microstructure from coarsening during the temperature cycling, hereby extending the time to failure.
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Renaud-Bezot, Nick, und Mark Beesley. „Making New With Old“. International Symposium on Microelectronics 2012, Nr. 1 (01.01.2012): 000687–93. http://dx.doi.org/10.4071/isom-2012-wa53.
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In the past few years, embedding has emerged as a valid contender to traditional packaging technologies for specific applications. It uses PCB (Printed-Circuit Board) processes for 3D integration of active and passive elements to create SiPs (System in Package). Just like MEMS (Micro Electro-Mechanical System) and IPD (Integrated Passive Device) emerged from standard semiconductor processes, and then were adapted to match the specific requirements, so does embedding build on decades-old techniques to create this new class of packages. Inherent advantages include:- Compatibility with traditional SMT processes, in particular with regards to pitch,- Production batch size,- Historical reliability and process data,- Thermal management,- Possibility to integrate EMI shielding,- CTE matching. This paper will present the challenges and opportunities of this packaging technology in terms of processes, performance and reliability. It will focus on the solution developed by AT&S called ECP® (Embedded- Component Packaging). Whereas competition is integrating PCB processes to their semiconductor-packaging operations, AT&S is the only vendor building on its PCB tradition to enter the packaging industry, thereby presenting an alternative view of the subject.
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Lee, Youngtak, und Doug Link. „Comparative Modeling and Analysis of Lead-Free Solder Extrusion for the Design of Reliability“. International Symposium on Microelectronics 2016, Nr. 1 (01.10.2016): 000111–16. http://dx.doi.org/10.4071/isom-2016-tp53.
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Abstract Due to rapid growth of the microelectronics industry, packaged devices with small form factors, low costs, high power performance, and increased efficiency have become of high demand in the market. To realize the current market development trend, flip chip interconnection and System-in-Package (SiP) are some of the promising packaging solutions developed. However, a surprising amount of surface mount technology (SMT) defects are associated with the use of lead-free solder paste and methods by which the paste is applied. Two such defects are solder extrusion and tombstoning. Through the use of design of experiments (DOE), lead-free solder defect causes can be better understood and subsequently reduced or eliminated. This paper will examine the failure modes of solder extrusion and tombstoning that occurred when two different types of lead-free solders, Sn-Ag-Cu (SAC) and BiAgX were used within a SiP for attachment of surface mount devices (SMD) chip components. The systematic investigation will include the comprehensive failure analysis of the SMD components and compare the modeling and analysis of the two different solder types utilizing the design of experiments methods.
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Ramkumar, S. Manian, und Krishnaswami Srihari. „A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging“. Journal of Electronic Packaging 129, Nr. 2 (14.08.2006): 149–56. http://dx.doi.org/10.1115/1.2721086.
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The electronics industry, in recent years, has been focusing primarily on product miniaturization and lead-free assembly. The need for product miniaturization is due to the continuous demand for portable electronic products that are multifunctional, yet smaller, faster, cheaper, and lighter. This is forcing the industry to design and assemble products with miniature passive and active devices. These devices typically have fine pitch footprints that provide a very small surface area for attachment. The solder attach technique relies primarily on the formation of intermetallics between the mating metallic surfaces. With a reduction in the surface area of the pads, the ratio of intermetallic to solder is very high once the solder joint is formed. This could result in unreliable solder joints, due to the brittle nature of intermetallics. In addition, the need to eliminate lead-based materials as a means of interconnection has renewed the industry’s interest in exploring other means of assembling surface mount devices reliably. The use of a novel anisotropic conductive adhesive (ACA) as a means for assembling surface mount devices, the ACA’s performance characteristics, and preliminary research findings are discussed in this paper. Typically, ACAs require the application of pressure during the curing process to establish the electrical connection. The novel ACA uses a magnetic field to align the particles in the Z-axis direction and eliminates the need for pressure during curing. The formation of conductive columns within the polymer matrix provides a very high insulation resistance between adjacent conductors. The novel ACA also enables mass curing of the adhesive, eliminating the need for sequential assembly. The novel ACA was found to be very effective in providing the interconnection for surface mount technology (SMT) passives and leaded, bumped, or bumpless integrated circuit packages. The requirement for precise stencil printing was eliminated, as the application of magnetic field aligned the conductive columns in the Z-axis direction eliminating any lateral conductivity. The ability to mass cure the adhesive while applying the magnetic field reduced the assembly time considerably. Placement accuracy was still found to be very critical. Shear testing of adhesive joints after thermal aging showed significance past 500 h and after temperature–humidity aging showed significance within the first 100 h. I–V characteristics of the daisy chained ball grid array devices assembled with and without bumps revealed considerable difference in the breakdown current. The correlation between initial contact resistance of the daisy chain and the final breakdown current was also determined. Preliminary experiments and findings, discussed in this paper, show the viability of the ACA for mixed SMT assembly. Further experimentations will include in situ contact resistance measurements during thermal aging, temperature–humidity aging, drop testing and thermal shock.
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Lee, Youngtak, und Doug Link. „Practical Application and Analysis of Lead-Free Solder on Chip-On-Flip-Chip SiP for Hearing Aids“. International Symposium on Microelectronics 2017, Nr. 1 (01.10.2017): 000201–7. http://dx.doi.org/10.4071/isom-2017-wa24_104.
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Abstract Due to rapid growth of the microelectronics industry, packaged devices with small form factors, low costs, high power performance, and increased efficiency have become of high demand in the market. To realize the current market development trend, flip chip interconnection and System-in-Package (SiP) are some of the promising packaging solutions developed. However, a surprising amount of surface mount technology (SMT) defects are associated with the use of lead-free solder paste and methods by which the paste is applied. Two such defects are solder extrusion and tombstoning. Considerable amount of defects associated with solder overflow are found on chip-on-flip-chip (COFC) SiP in hearing aids. Through the use of design of experiments (DOE), lead-free solder defect causes on hearing aids application can be better understood and subsequently reduced or eliminated. This paper will examine the failure modes of solder extrusion and tombstoning that occurred when two different types of lead-free solders, Sn-Ag-Cu (SAC) and BiAgX were used within a SiP for attachment of surface mount devices (SMD) chip components for hearing aid applications. The practical application and analysis of lead-free solder for hearing aids will include the comprehensive failure analysis of the SMD components and compare the modeling and analysis of the two different solder types through the DOE process.
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Yoon, Seung Wook, Yaojian Lin, Yonggang Jin, Jerome Teysseyre, Xavier Baraton und Pandi C. Marimuthu. „Next Generation eWLB (Embedded Wafer Level BGA): Advanced 3D SiP Packaging Solution“. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (01.01.2012): 001507–26. http://dx.doi.org/10.4071/2012dpc-wa22.
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Current and future demands of mobile/portable electronic systems in terms of performance, power consumption, reliable system at a reasonable price are met by developing advanced/appropriate silicon process technology, innovative packaging solutions with use of chip-package-system co-design, low cost materials, advanced assembly and reliable interconnect technologies. In this article packaging evolution for hand held application is discussed with special focus on next generation chip embedding technology called eWLB in detail. To meet the above said challenges eWLB was developed which offers additional space for routing higher I/O chips on top of Silicon chip area which is not possible in conventional WLP or WLB. It also offers comparatively better electrical, thermal and reliability performance at reduced cost with possibility to address more Moore [decreasing technology nodes with low-k dielectrics in SoC] and more than Moore [heterogeneous integration of chips with different wafer technology as SiP solution in multi die or 3D eWLB approaches]. Currently 1st generation eWLB technology is available in the industry with 200mm and 300mm carrier size. This paper will highlight some of the recent advancements in progress development and mechnical characterization in component level and board level reliaiblity of next generation eWLB technologies of double-side 3D eWLB. Standard JEDEC tests were carried out to investigate component level reliability and both destructive/non-destructive analysis was performed to investigate potential structural defects. Daisychain Test vehicles were prepared and also tested for drop and TcoB (Temperature on Board) reliaiblity in industry standard test conditions. There was significant improvement of characteristic lifetime with thined eWLB in TcoB performance because of its enhanced flexibility of package. And there was study of board level reliabiilty with underfill in SMT for large size eWLB packages. This paper will also present study of package warpage behavior with temperature profile as well as failure analysis with microsturctural observation for comprehensive understanding of mechanical behavior of next generation eWLBs.
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Renaud-Bezot, Nick, Christian Galler und Christian Vockenberger. „Smart PCBs for Smart Appliances - Embedding as IoT Enabler“. International Symposium on Microelectronics 2015, Nr. 1 (01.10.2015): 000025–30. http://dx.doi.org/10.4071/isom-2015-tp15.
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Be it the trillion-dollar economy dreamed up by Cisco Systems at one extreme, or the multitude of small crowdsourced projects at the other, there is no denying that IoT is capturing minds and making the news. Each company is vying for a piece of the pie, with semiconductor suppliers scrambling to call the latest releases “IoT-ready”. Not wanting to feel left out, the PCB industry is of course finding ways to support this nascent economy. As main concerns are small sizes, low energy consumption and short cycle times, one solution is embedding. By placing active and passive components within the PCB itself, the system can:- be more integrated, as components disappear from the surface, making space for additional functionality, larger battery or simply fit in a smaller housing,- have lower losses, as stacking SMT components on top of the embedded allows for short connections, thus lowering resistance and inductance,- be created faster, to enable dimensional and functional integration without relying on complex and costly SoC design. Starting with a backgrounder on common embedding technologies currently available from leading suppliers, the paper will present recent advances from AT&S's ECP® (Embedded-Component Packaging), including reliability data. Expanding from that field, the document will explore its future and extreme applications, such as high-power (multi-kW) and fine-pitch fields for industrial and automotive devices, showing the scalability of the technology and the evolutions supported by the EU-funded EmPower and UNSETH projects.
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Shen, Zhenzhen, Aleksey Reiderman und Casey Anude. „Pressure-less AgNP Sintering for High-power MCM Assembly for Extreme Environment Applications“. International Symposium on Microelectronics 2015, Nr. 1 (01.10.2015): 000342–48. http://dx.doi.org/10.4071/isom-2015-wp14.
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Silver nano-particle (AgNP) sintering has been a promising bonding material for high-temperature applications. There is an increasing demand for designs implemented as multi-chip module (MCM) in the high-temperature markets, like the oil and gas industry, primarily because of MCM's smaller size, higher-performance capability, and higher overall reliability when compared to traditional high Tg printed circuit boards. In this work, pressure-less AgNP sintering paste was used in the assembly of multi-chip modules. The assemblies included die-mounted on aluminum nitride and alumina substrates that were metallized with various thin and thick films. Sintered silver nano-particle attachments were also attempted for surface-mounted technology (SMT) chip components. Different assembly parameters such as bonding line thickness and sintering profiles were evaluated to discover the optimal assembly process window that would yield acceptable reliability for 250°C and higher ambient temperature applications. The assemblies were subjected to various tests including thermal cycling, high-ramp rate thermal shocks, and high-temperature storage tests. Shear strength measurements and analysis of the cross sections and fracture surfaces were performed to understand failure mechanisms. One of the findings was a certain and unique failure mode associated with bonding of thin-film gold metallized surfaces using pressure-less silver nano-particles sintering. That failure mode begins after a short exposure to temperatures of 200°C and higher. However, silver nano-particle sintering on substrates metallized with thin-film silver and some thick-film formulations yields dramatically better results.
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Renaud-Bezot, Nick. „Size Matters – Embedding as an Enabler of Next-Generation SiPs“. International Symposium on Microelectronics 2013, Nr. 1 (01.01.2013): 000740–44. http://dx.doi.org/10.4071/isom-2013-wp53.
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Embedding is a relatively new packaging technology involving the use of (for example) laminates to encapsulate the active and/or passive component, as well as PCB and/or SMT processes for electrical connections. The embedded system can be used in that condition, or further processed to create a System-in-Package (or System-in-Board in case of larger assemblies). In that last case, the SiP (respectively SiB) is treated like any other substrate (respectively PCB). In the search for higher integration, embedding is gaining traction as an alternative 3D-packaging solution, due to its multiple advantages: high integration, large production format, intrinsic matching to PCB in terms of pitch and CTE characteristics, mechanical stability and possibility to adapt substrate properties based on specific requirements (Dk, thermal conductivity…). The various players in the field are raking in new design-ins, and production volumes are rapidly increasing. Those characteristics mean that embedded packages are directly competing with several other packaging architectures routinely used in smartphone applications:- Almost as small as WL-CSPs while being more robust and offering better thermal behavior,- Smaller than QFNs with similar thermal properties,- Thinner than PoPs while allowing easier 3D integration,- SiP architecture to decrease PCB-level cost-of-ownership. Smartphone manufacturers are constantly demanding increased reliability and performance, while requesting from packages to enable higher functionalities in smaller form factors. This document compares multiple architectures meeting the tight height requirements from the smartphone industry, and proves that embedding is a valid enabler in the quest for higher integration. It also shows the latest developments in terms
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Haryanto, Hanny, Indra Gamayanto, Sendi Novianto und Ahmad Zainul Fanani. „Penyuluhan Peluang Industri Kreatif di bidang Game Digital bagi Generasi Muda untuk Siswa SMA Negeri 3 Semarang“. ABDIMASKU : JURNAL PENGABDIAN MASYARAKAT 4, Nr. 1 (26.01.2021): 36. http://dx.doi.org/10.33633/ja.v4i1.152.
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AbstrakSalah satu contoh industri kreatif yang berkembang pesat di Indonesia adalah game digital. Jumlah transaksi yang dihasilkan dari industri ini juga sangat besar, namun 90% lebih pendapatannya masuk ke asing. Hal ini disebabkan belum banyak generasi muda yang tahu dan berminat untuk bergerak di industri tersebut. Dengan tersedianya fasilitas pengembangan dan distribusi serta konten lokal yang kaya di Indonesia, industri game digital ini berpeluang menjadi industri unggulan. Kegiatan ini dilaksanakan di SMA 3 sebagai salah satu sekolah favorit yang memiliki generasi muda yang potensial. Kegiatan penyuluhan ini bertujuan memberikan wawasan dan motivasi bagi generasi muda, yang adalah siswa SMA 3 Semarang, tentang peluang industri game digital di Indonesia sehingga diharapkan dapat berminat dan bergerak di bidang ini. Metode umum yang digunakan dalam penyuluhan adalah mengemukakan permasalahan nyata berkaitan dengan industri kreatif di Indonesia, memberikan langkah-langkah praktis untuk memulai dan memberikan contoh-contoh nyata tentang usaha yang telah dimulai dan dilakukan. Sedangkan metode penyampaian materi menggunakan appreciative inquiry dengan empat tahap, yaitu mancari hal yang positif, menemukan dan menentukan pilihan visi yang muncul dari hal-hal positif tersebut, melakukan usaha untuk merealisasikan visi yang telah ditentukan dan evaluasi hasil yang telah dicapai. Kegiatan ini akan bisa mencapai dua tahap awal, namun untuk dua tahap berikutnya akan diserahkan secara mandiri kepada peserta. Hasil dari pelatihan dan pengabdian masyarakat ini adalah siswa akan mampu memahami perkembangan game saat ini, hal-hal apa saja yang dapat dilakukan untuk mengembangkan industri game. Kata kunci: Industri kreatif, game, generasi muda, konten lokal, unggulan. AbstractOne example of a creative industry that is growing rapidly in Indonesia is digital games. The number of transactions generated from this industry is also very large, however, more than 90% of its income goes to foreigners. This is because not many young people know and are interested in moving into the industry. With the availability of development and distribution facilities as well as rich local content in Indonesia, this digital game industry has the opportunity to become a leading industry. This activity is carried out in SMA 3 as one of the favorite schools that has a potential young generation. This outreach activity aims to provide insight and motivation for the younger generation, who are SMA 3 Semarang students, about the opportunities for the digital game industry in Indonesia so that it is hoped that they will be interested and engaged in this field. The general method used in extension is to bring up real problems related to the creative industry in Indonesia, provide practical steps to start and provide real examples of businesses that have been started and carried out. While the method of delivering material uses appreciative inquiry with four stages, namely looking for positive things, finding and determining the choice of the vision that arises from these positive things, making efforts to realize the predetermined vision and evaluating the results that have been achieved. This activity will be able to reach the initial two stages, but for the next two stages will be independently submitted to the participants. The result of this training and community service is that students will be able to understand the current game development, what things can be done to develop the game industry. Keywords: Creative industry, Game, young generation, local content, flagship
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Miles, Grant, Charles C. Snow und Mark P. Sharfman. „Industry variety and performance“. Strategic Management Journal 14, Nr. 3 (März 1993): 163–77. http://dx.doi.org/10.1002/smj.4250140302.
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Karniouchina, Ekaterina V., Stephen J. Carson, Jeremy C. Short und David J. Ketchen. „Extending the firm vs. industry debate: Does industry life cycle stage matter?“ Strategic Management Journal 34, Nr. 8 (12.02.2013): 1010–18. http://dx.doi.org/10.1002/smj.2042.
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Johnson, Gerry, und Howard Thomas. „The industry context of strategy, structure and performance: The U.K. brewing industry“. Strategic Management Journal 8, Nr. 4 (Juli 1987): 343–61. http://dx.doi.org/10.1002/smj.4250080405.
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Chen, Ching Chia, Yu-Po Wang, Jensen Tsai und Hsin Long Chen. „Advanced Die Saw Technology for WLCSP Reliability Enhancement“. International Symposium on Microelectronics 2019, Nr. 1 (01.10.2019): 000323–26. http://dx.doi.org/10.4071/2380-4505-2019.1.000323.
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Abstract As consumer and portable devices get thinner and more functionality. Chips which are made by less than 28 nm node wafer with extreme Low-k (ELK) inter metal dielectric material is a trend in order to contain more transistors and to lower power consumption. However, side wall crack (SWC) for WLCSP is one of the major challenges since ELK layer getting brittle. Laser grooving is applied to remove metal before blade saw, but the high temperature during laser grooving usually easily generates HAZ (heat-affected zone) which can induce stress concentration and lower chip strength. The laser ablation also leaves metal-silicon residue (or recast) from the re-deposition of silicon to the groove and surrounding areas. Therefore, SWC (sidewall crack) is a huge potential risk waiting to happen after pick and place, during shipment and during SMT process. In the industry, HAZ size and SWC rate could be reduced by adjusting process parameters, or by exploring new alternatives to eliminate HAZ and silicon recast is one of driving factors of this paper. In this study, plasma etching was applied as surface treatment on the scribe line after laser grooving process with ELK wafer. Plasma could etch HAZ and recast area and expected to increase chip strength and reduce SWC rate. Plasma applied with various process time and power, and different types of mask coating materials were studied. Different plasma gases and effectiveness will be discussed. Conventional blade dicing process will be compared to different plasma etching conditions for mechanical properties of die using 3-point bending test to check die strength, and SEM and OM to verify quality of sidewall of the die. Finally drop test was performed to confirm the reliability enhancement.
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KWIOTKOWSKA, Anna. „The success of science-industry R&D cooperation. A fuzzy-set approach“. Scientific Papers of Silesian University of Technology. Organization and Management Series 2020, Nr. 146 (2020): 219–32. http://dx.doi.org/10.29119/1641-3466.2020.146.17.
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Purpose: This study focuses on the causal mechanisms by which a series of organizational factors like commitment, communication, experience, dependence and trust collectively affect on the success of science-industry R&D cooperation. The purpose of this paper is to identify multiple paths of complex causal recipes that can lead to success of science-industry R&D cooperation. Design/methodology/approach: The study uses fuzzy-set qualitative comparative analysis (fsQCA), a technique that provides a holistic view of the examined interrelationships, compared to traditional net effect approaches that assume symmetric and linear relationships among variables. Findings: Results indicate that different causal paths, exactly five configurations, explain success R&D contracts. Particularly, the findings reveal that the availability of commitment and communication are important, sufficient conditions because they appear in at least three of the five configurations that result from the analysis. In this way, a series of conclusions and implications have been obtained that can be very useful, both in the academic world and when trying to lead and manage cooperation agreements. Research implications: A comprehensive theoretical model was developed and tested that identifies the organizational factors of the success of science-industry R&D cooperation. The presented model and comprehensive research using fs/QCA allows to overcome the fragmentation of this specialized literature. Practical implications: The results contain a number of practical recommendations that can be useful in the conduct and management of cooperation agreements. During the establishing and developing contract stages, it is recommended to design managerial and organizational mechanisms that ensure a high degree of commitment and communication in combination with experience (configuration number 1) and/or with dependences (configuration number 4). Originality/value: Vital value of this paper is the use of fs/QCA, a technique that is an important novelty, at least in the field of R&D cooperation relationships between companies and research organizations. This method allows testing the configuration of conditions in relation to a specific outcome (e.g. success of science-industry R&D cooperation) in a way that is not possible using a linear additive approach.
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Gavrysh, Oleg, und Valeriia Melnykova. „Project risk management of the construction industry enterprises based on fuzzy set theory“. Problems and Perspectives in Management 17, Nr. 4 (11.12.2019): 203–13. http://dx.doi.org/10.21511/ppm.17(4).2019.17.
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The construction industry is a crucially important element of the Ukrainian economy, since its development and performance affect other industries. The economic recession consequences and the unforeseen recent events, caused by different types of risks, have adversely affected the construction industry development and necessitated the search for modern methods of risk management. The study is based on a sample of five projects from five construction industry enterprises and covered the period of 2010–2018. A set of project risks, investigated by the group of experts, was analyzed based on fuzzy set theory, and included seven phases of the fuzzy set model construction to assess project risks of construction industry enterprises. Based on the identified elements of a fuzzy set model and a set of significant project risks, a value classifier of significant project risks for construction industry enterprises was developed. This allowed to estimate the current values of project risk indicators and to identify them by levels of their fuzzy subset membership. Besides, a classifier for the quantitative assessment of the total project risks level for investment projects was developed, which allowed estimating the value of the aggregate indicator. In order to improve the existed methodology, the study suggested introducing probabilistic values for the risk of project failure depending on the significance of the overall project risks. Accordingly, the paper identifies the probability of significant project risks simultaneous occurring during the project implementation. However, the higher the likelihood of risk, the higher the probability of investment project failure.
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Lecocq, Xavier, und Benoît Demil. „Strategizing industry structure: the case of open systems in a low-tech industry“. Strategic Management Journal 27, Nr. 9 (2006): 891–98. http://dx.doi.org/10.1002/smj.544.
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Chang, Sea-Jin, und Brian Wu. „Institutional barriers and industry dynamics“. Strategic Management Journal 35, Nr. 8 (02.08.2013): 1103–23. http://dx.doi.org/10.1002/smj.2152.
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Rumelt, Richard P. „How much does industry matter?“ Strategic Management Journal 12, Nr. 3 (März 1991): 167–85. http://dx.doi.org/10.1002/smj.4250120302.
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Willard, Gary E., und Arnold C. Cooper. „Survivors of industry shake-outs: The case of the U.S. color television set industry“. Strategic Management Journal 6, Nr. 4 (Oktober 1985): 299–318. http://dx.doi.org/10.1002/smj.4250060402.
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Furr, Nathan, und Rahul Kapoor. „Capabilities, technologies, and firm exit during industry shakeout: Evidence from the global solar photovoltaic industry“. Strategic Management Journal 39, Nr. 1 (08.11.2017): 33–61. http://dx.doi.org/10.1002/smj.2709.
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Starr, Evan, Martin Ganco und Benjamin A. Campbell. „Strategic human capital management in the context of cross‐industry and within‐industry mobility frictions“. Strategic Management Journal 39, Nr. 8 (17.07.2018): 2226–54. http://dx.doi.org/10.1002/smj.2906.
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Hernández León, Rubén. „La industria de la migración en el sistema migratorio México-Estados Unidos“. Revista Trace, Nr. 61 (13.07.2018): 41. http://dx.doi.org/10.22134/trace.61.2012.436.
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En este artículo se propone la conceptuación de la industria de la migración. La industria de la migración es el conjunto de empresarios, negocios e infraestructuras que, motivados por la búsqueda de ganancias económicas, prestan servicios que facilitan y sostienen la migración internacional. Aunque la industria de la migración ha estado presente y entretejida en la literatura sobre la movilidad humana internacional desde hace mucho tiempo, las teorías de la migración la han tratado como un objeto de estudio marginal y la han reducido a sus dimensiones de ilegalidad e informalidad. En este artículo se argumenta en favor de una conceptuación exhaustiva de dicha industria, en la que se incluyen las actividades legales, ilegales, formales e informales y la interacción y articulación de la industria de la migración con los actores clave del proceso social de la migración internacional: gobiernos, empleadores, migrantes y sus redes y organizaciones defensoras de migrantes.Abstract: This article proposes the conceptualization of the term migration industry. Migration industry is the set of entrepreneurs, businesses and infrastructures that, driven by financial gain, offer services which facilitates and support international migration. Even though the concept of migration industry has long been present and intertwined with the literature on international human mobility, migration theories have always treated it as a marginal object of study and have reduced it to its illegal and informal dimensions. This article gives arguments in favor of an exhaustive conceptualization of this industry, which includes legal, illegal, formal and informal activities, and the interaction and articulation of the migration industry with the key actors of the social process of international migration: governments, employers, migrants and their networks, as well as organizations that advocate the defense of migrants.Résumé : Cet article propose la conceptualisation du terme industrie de la migration. L’industrie de la migration est l’ensemble des entrepreneurs, des affaires et des infrastructures qui, motivés par l’obtention de profits économiques, offrent des services qui facilitent et soutiennent la migration internationale. Même s’il y a longtemps que le concept d’industrie de la migration est présent et entremêlé à la littérature sur la mobilité humaine internationale, les théories de migration l’ont toujours traité comme un objet d’étude marginal en le réduisant à l’illégalité et aux affaires informelles. Dans cet article on donne des arguments à faveur d’une conceptualisation exhaustive de cette industrie qui inclut les activités légales, illégales, formelles et informelles. On traite aussi de l’interaction et de l’articulation de l’industrie de la migration avec les acteurs clé du processus social de la migration internationale : les gouvernements, les employeurs, les migrants et leurs réseaux, et les organisations de défense des migrants.
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Mordal, Karine, Nicolas Anquetil, Jannik Laval, Alexander Serebrenik, Bogdan Vasilescu und Stéphane Ducasse. „Software quality metrics aggregation in industry“. Journal of Software: Evolution and Process 25, Nr. 10 (13.08.2012): 1117–35. http://dx.doi.org/10.1002/smr.1558.
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Zahavi, Talli, und Dovev Lavie. „Intra-industry diversification and firm performance“. Strategic Management Journal 34, Nr. 8 (21.03.2013): 978–98. http://dx.doi.org/10.1002/smj.2057.
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Nohria, Nitin, und Carlos Garcia-Pont. „Global strategic linkages and industry structure“. Strategic Management Journal 12, S1 (1991): 105–24. http://dx.doi.org/10.1002/smj.4250120909.
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Wu, Brian. „Opportunity costs, industry dynamics, and corporate diversification: Evidence from the cardiovascular medical device industry, 1976-2004“. Strategic Management Journal 34, Nr. 11 (02.04.2013): 1265–87. http://dx.doi.org/10.1002/smj.2069.
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Eggers, J. P. „Competing technologies and industry evolution: The benefits of making mistakes in the flat panel display industry“. Strategic Management Journal 35, Nr. 2 (19.04.2013): 159–78. http://dx.doi.org/10.1002/smj.2129.
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