Thematische Bibliographien / Polymeric heat sinks

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Auswahl der wissenschaftlichen Literatur zum Thema „Polymeric heat sinks“

Autor: Grafiati

Veröffentlicht am 28. Juni 2021

Zuletzt aktualisiert am 1. Februar 2022

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Zeitschriftenartikel zum Thema "Polymeric heat sinks"

Marchetto, Daniel Borba, und Gherhardt Ribatski. „An experimental study on flow boiling heat transfer of HFO1336mzz(Z) in microchannels-based polymeric heat sinks“. Applied Thermal Engineering 180 (November 2020): 115815. http://dx.doi.org/10.1016/j.applthermaleng.2020.115815.

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Guzej, Michal, Martin Zachar, Jan Kominek, Petr Kotrbacek und Robert Brachna. „Importance of Melt Flow Direction during Injection Molding on Polymer Heat Sinks’ Cooling Efficiency“. Polymers 13, Nr. 8 (07.04.2021): 1186. http://dx.doi.org/10.3390/polym13081186.

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Polymers with highly conductive fillers could possibly replace standardly used materials, such as aluminum and copper alloys, for passive cooling purposes. The main problem of the composite polymer-based heat sinks is that their high thermal conductivity is uneven. The orientation of this anisotropy is set according to the position of the highly thermally conductive filler. Its orientation is influenced by the melt flow during the polymer heat sink molding process. This article shows that change of the melt flow inside the mold cavity can improve the overall cooling efficiency of a polymer heat sink, which leads to lower temperatures on the heat source used. Two polymer heat sinks of identical geometries were produced. Their high thermal conductivity was given by the use of graphite flakes as the filler. The only difference between the heat sinks was in the position of the fan gate during their production. Different temperatures of the heat source between the two heat sinks were observed for the same measurement conditions. The measurements were conducted at Heatlab, BUT.

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Kominek, Jan, Martin Zachar, Michal Guzej, Erik Bartuli und Petr Kotrbacek. „Influence of Ambient Temperature on Radiative and Convective Heat Dissipation Ratio in Polymer Heat Sinks“. Polymers 13, Nr. 14 (12.07.2021): 2286. http://dx.doi.org/10.3390/polym13142286.

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Miniaturization of electronic devices leads to new heat dissipation challenges and traditional cooling methods need to be replaced by new better ones. Polymer heat sinks may, thanks to their unique properties, replace standardly used heat sink materials in certain applications, especially in applications with high ambient temperature. Polymers natively dispose of high surface emissivity in comparison with glossy metals. This high emissivity allows a larger amount of heat to be dissipated to the ambient with the fourth power of its absolute surface temperature. This paper shows the change in radiative and convective heat transfer from polymer heat sinks used in different ambient temperatures. Furthermore, the observed polymer heat sinks have differently oriented graphite filler caused by their molding process differences, therefore their thermal conductivity anisotropies and overall cooling efficiencies also differ. Furthermore, it is also shown that a high radiative heat transfer leads to minimizing these cooling efficiency differences between these polymer heat sinks of the same geometry. The measurements were conducted at HEATLAB, Brno University of Technology.

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Barba, Alessandro, Barbara Musi und Marco Spiga. „Performance of a polymeric heat sink with circular microchannels“. Applied Thermal Engineering 26, Nr. 8-9 (Juni 2006): 787–94. http://dx.doi.org/10.1016/j.applthermaleng.2005.10.015.

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Liang, C., J. R. Arias und A. Velazquez. „Tip Clearance Effects on Microchannel-Based Heat Sink with Polymeric Fluid“. Journal of Thermophysics and Heat Transfer 30, Nr. 2 (April 2016): 350–58. http://dx.doi.org/10.2514/1.t4592.

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Arayanarakool, Rerngchai, Hian See, Samuel Marshall, Niven Virik, Heng Wang, Poh Lee und Peter Chen. „Rapid Prototyping of Polymer-Based Rolled-Up Microfluidic Devices“. Micromachines 9, Nr. 10 (13.10.2018): 516. http://dx.doi.org/10.3390/mi9100516.

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This work presents the simple and rapid fabrication of a polymer-based microfluidic prototype manufactured by rolling up thin films of polymer. The thin films were fabricated via a casting method and rolled up around a center core with the aid of plasma activation to create a three-dimensional (3D) spiral microchannel, hence reducing the time and cost of manufacture. In this work, rolled-up devices with single or dual fluidic networks fabricated from a single or two films were demonstrated for heat sink or heat exchanger applications, respectively. The experimental results show good heat transfer in the rolled-up system at various flow rates for both heat sink and heat exchanger devices, without any leakages. The rolled-up microfluidic system creates multiple curved channels, allowing for the generation of Dean vortices, which in turn lead to an enhancement of heat and mass transfer and prevention of fouling formation. These benefits enable the devices to be employed for many diverse applications, such as heat-transfer devices, micromixers, and sorters. To our knowledge, this work would be the first report on a microfluidic prototype of 3D spiral microchannel made from rolled-up polymeric thin film. This novel fabrication approach may represent the first step towards the development of a pioneering prototype for roll-to-roll processing, permitting the mass production of polymer-based microchannels from single or multiple thin films.

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Bég, O. Anwar, Atul Kumar Ray, Rama S. R. Gorla, Henry J. Leonard, Ali Kadir, T. A. Bég und B. Vasu. „Homotopy Simulation of Dissipative Micropolar Flow and Heat Transfer from a Two-Dimensional Body with Heat Sink Effect“. Chemical & biochemical engineering quarterly 34, Nr. 4 (2021): 257–75. http://dx.doi.org/10.15255/cabeq.2020.1849.

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Non-Newtonian flow from a wedge constitutes a fundamental problem in chemical engineering systems and is relevant to processing of polymers, coating systems, etc. Motivated by such applications, the homotopy analysis method (HAM) was employed to obtain semi-analytical solutions for thermal convection boundary layer flow of incompressible micropolar fluid from a two-dimensional body (wedge). Viscous dissipation and heat sink effects were included. The non-dimensional boundary value problem emerges as a system of nonlinear coupled ordinary differential equations, by virtue of suitable coordinate transformations. The so-called Falkner-Skan flow cases are elaborated. Validation of the HAM solutions was achieved with earlier simpler models, as well as with a Nakamura finite difference method for the general model. The micropolar model employed simulates certain polymeric solutions quite accurately, and features rotary motions of micro-elements. Primary and secondary shear stress, wall couple stress, Nusselt number, microrotation velocity, and temperature were computed for the effect of vortex viscosity parameter (micropolar rheological), Eckert number (viscous dissipation), Falkner-Skan (pressure gradient) parameter, micro-inertia density, and heat sink parameter. The special cases of Blasius and stagnation flow were also addressed. It was observed from the study that the temperature and thermal boundary layer thickness are both suppressed with increasing wedge parameter and wall heat sink effect, which is beneficial to temperature regulation in polymer coating dynamics. Further, strong reverse spin was generated in the microrotation with increasing vortex viscosity, which resulted in increase in angular momentum boundary layer thickness. Also, both primary and secondary skin friction components were reduced with increasing wedge parameter. Nusselt number was also enhanced substantially with greater wedge parameter.

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Awais, Muhammad, Saeed Awan, A. Aqsa, Nimra Muqaddass, Saeed Rehman und Muhammad Raja. „Numerical and analytical approach for Sakiadis rheology of generalized polymeric material with magnetic field and heat source/sink“. Thermal Science 24, Nr. 2 Part B (2020): 1183–94. http://dx.doi.org/10.2298/tsci180426284a.

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In this analysis, Sakiadis rheology of the generalized polymeric material has been presented with magnetic field and heat source/sink. Convective heating process with thermal radiations have been incorporated. Mathematical modeling has been performed for the conversion of physical problem into set of non-linear equations. Suitable transformations have been employed in order to convert the derived PDE into set of non-linear ODE. Analytical as well as finite difference method based numerical solutions for the velocity and temperature profiles are computed. Graphical and numerical illustrations have been presented in order to analyze the behavior of involved physical quantities. Error analysis for the non-linear system has been presented in order to show the validity of the obtained results. Bar charts have been plotted to present the heat flux analysis. Tabular values of local Nusselt number are computed for the involved key parameters. Heat transfer rates against magnetic and porosity effects found to be decreased since magnetic field and porosity retard the molecular movement of the fluid particles. This controlling property of magnetic field and porosity effects have application in MHD power generation, electromagnetic casting of metals, MHD ion propulsion, etc. Moreover internal heat generation and absorption effects have opposite effects on the fluid temperature.

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Prasher, Ravi S. „Surface Chemistry and Characteristics Based Model for the Thermal Contact Resistance of Fluidic Interstitial Thermal Interface Materials“. Journal of Heat Transfer 123, Nr. 5 (27.02.2001): 969–75. http://dx.doi.org/10.1115/1.1388301.

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Microprocessor powers are increasing at a phenomenal rate, which requires very small thermal resistance between the die (chip) and the ambient, if the current economical methods of conduction and convection cooling are to be utilized. A typical thermal solution in flip chip technology utilizes two levels of thermal interface materials: between the die and the heat spreader, and between the heat spreader and the heat sink. Phase change materials and thermal greases are among the most prominent interstitial thermal interface materials (TIM) used in electronic packaging. These TIMs are typically polymeric matrix loaded with highly conducting filler particles. The dwindling thermal budget has necessitated a better understanding of the thermal resistance of each component of the thermal solution. Thermal conductivity of these particle-laden materials is better understood than their contact resistance. A careful review of the literature reveals the lack of analytical models for the prediction of contact resistance of these types of interstitial materials, which possess fluidic properties. This paper introduces an analytical model for the thermal contact resistance of these types of interstitial materials. This model is compared with the experimental data obtained on the contact resistance of these TIMs. The model, which depends on parameters such as, surface tension, contact angle, thermal conductivity, roughness and pressure matches very well with the experimental data at low pressures and is still within the error bars at higher pressures.

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Tang, L. Q., K. Pochiraju, C. Chassapis und S. Manoochehri. „A Computer-Aided Optimization Approach for the Design of Injection Mold Cooling Systems“. Journal of Mechanical Design 120, Nr. 2 (01.06.1998): 165–74. http://dx.doi.org/10.1115/1.2826955.

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A methodology is presented for the design of optimal cooling systems for injection mold tooling which models the mold cooling as a nonlinear constrained optimization problem. The design constraints and objective function are evaluated using Finite Element Analysis (FEA). The objective function for the constrained optimization problem is stated as minimization of both a function related to part average temperature and temperature gradients throughout the polymeric part. The goal of this minimization problem is to achieve reduction of undesired defects as sink marks, differential shrinkage, thermal residual stress built-up, and part warpage primarily due to non-uniform temperature distribution in the part. The cooling channel size, locations, and coolant flow rate are chosen as the design variables. The constrained optimal design problem is solved using Powell’s conjugate direction method using penalty function. The cooling cycle time and temperature gradients are evaluated using transient heat conduction simulation. A matrix-free algorithm of the Galerkin Finite Element Method (FEM) with the Jacobi Conjugate Gradient (JCG) scheme is utilized to perform the cooling simulation. The optimal design methodology is illustrated using a case study.

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Dissertationen zum Thema "Polymeric heat sinks"

Brachna, Róbert. „Stanovení anizotropie tepelné vodivosti polymerních chladičů pro chlazení elektroniky“. Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2021. http://www.nusl.cz/ntk/nusl-445460.

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The master's thesis focuses on creating a numerical model of a polymeric heat sink with emphasis on its significant thermal conductivity anisotropy. This anisotropy is caused by highly thermally conductive graphite filler. Its final orientation is given by the melt flow inside the mould cavity during injection molding. The numerical model is created on the basis of a heat sink prototype subjected to experimental measurements, whose physical conditions are reliably replicated by the model. The determination of anisotropy is divided into two parts. The qualitative part is based on the fracture analysis of the heat sink prototype and determines the principal directions of the conductivity tensor in individual sections of the geometry. The computation of principal conductivities falls into the quantitative part, in which this task is formulated as an inverse heat conduction problem. The input data for the proposed task are experimentally obtained temperatures at different places of the geometry. The values of principal conductivities are optimized to minimize the difference between the measured and simulated temperatures.

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„Thermal and Vibration Characterization of Flexible Heat Sinks“. Master's thesis, 2019. http://hdl.handle.net/2286/R.I.54915.

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abstract: In nature, it is commonly observed that animals and birds perform movement-based thermoregulation activities to regulate their body temperatures. For example, flapping of elephant ears or plumage fluffing in birds. Taking inspiration from nature and to explore the possibilities of such heat transfer enhancements, augmentation of heat transfer rates induced by the vibration of solid and well as novel flexible pinned heatsinks were studied in this research project. Enhancement of natural convection has always been very important in improving the performance of the cooling mechanisms. In this research, flexible heatsinks were developed and they were characterized based on natural convection cooling with moderately vibrating conditions. The vibration of heated surfaces such as motor surfaces, condenser surfaces, robotic arms and exoskeletons led to the motivation of the development of heat sinks having flexible fins with an improved heat transfer capacity. The performance of an inflexible, solid copper pin fin heat sink was considered as the baseline, current industry standard for the thermal performance. It is expected to obtain maximum convective heat transfer at the resonance frequency of the flexible pin fins. Current experimental results with fixed input frequency and varying amplitudes indicate that the vibration provides a moderate improvement in convective heat transfer, however, the flexibility of fins had negligible effects.
Dissertation/Thesis
Masters Thesis Mechanical Engineering 2019

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Khan, Muhammad Omer. „Thermally Conductive Polymer Composites for Electronic Packaging Applications“. Thesis, 2012. http://hdl.handle.net/1807/32473.

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Advancements in the semiconductor industry have lead to the miniaturization of components and increased power densities, resulting in thermal management issues. In response to this shift, finding multifunctional materials with excellent thermal conductivity and tailored electrical properties are becoming increasingly important. For this research thesis, three different studies were conducted to develop and characterize thermally conductive polymer composites. In the first study, a PPS matrix was combined with different types of carbon-based fillers to determine the effects of filler’s size, shape, and orientation on thermal conductivity. In the second study, effects of adding ceramic- and carbon- based fillers on the tailored thermal and electrical properties of composites were investigated. Lastly, the possibility of improving the thermal conductivity by introducing and aligning polymer fibers in the composites was investigated. The composites were characterized with respect to their physical, thermal, and electrical properties to propose possibilities of application in the electronic packaging industries.

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Buchteile zum Thema "Polymeric heat sinks"

Gooch, Jan W. „Heat Sink“. In Encyclopedic Dictionary of Polymers, 361. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_5859.

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Rastogi, Prasansha, Neha Katiyar, Swaroop Gharde und Balasubramanian Kandasubramanian. „Nano-functionalized Polycarbonate Coatings for Heat Sink Applications“. In Handbook of Polymer and Ceramic Nanotechnology, 1–35. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-10614-0_17-1.

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Rastogi, Prasansha, Neha Katiyar, Swaroop Gharde und Balasubramanian Kandasubramanian. „Nano-functionalized Polycarbonate Coatings for Heat Sink Applications“. In Handbook of Polymer and Ceramic Nanotechnology, 345–79. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-40513-7_17.

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„Heat sink“. In Encyclopedic Dictionary of Polymers, 487. New York, NY: Springer New York, 2007. http://dx.doi.org/10.1007/978-0-387-30160-0_5767.

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Konferenzberichte zum Thema "Polymeric heat sinks"

Duong, Hai M., Dimitrios V. Papavassiliou, Namiko Yamamoto und Brian L. Wardle. „Off-Lattice Monte Carlo Simulation of the Thermal Conductivity of Single-Walled Carbon Nanotube-Polymer Composites With Inter-Carbon Nanotube Contact“. In ASME 2008 International Mechanical Engineering Congress and Exposition. ASMEDC, 2008. http://dx.doi.org/10.1115/imece2008-66336.

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A computational model is developed to study the thermal conductivity of single-walled carbon nanotube (SWNT)–polymer composites. An off-lattice Monte Carlo simulation was used to model the effects of interfacial resistance at the SWNT-polymer interface and at the SWNT-SWNT contact on the heat flow for different orientations of SWNTs dispersed in the polymers. A primary focus is the non-isotropic heat conduction in aligned-SWNT polymeric composites that are of interest for various heat conduction applications such as microelectronic heat sinks, and also because this geometry constitutes a representative volume element (RVE) of CNT-reinforced polymer matrices in hybrid advanced composites under development. The simulation is an extension of a previous model for heat transfer in nanocomposites in that it now considers SWNT-SWNT contact. The simulation results of the developed model are compared with those of the previous model. The effects of SWNT orientation, SWNT-SWNT contact, weight fraction and thermal boundary resistance on the effective conductivity of composites are quantified. The present model is a useful tool for the prediction of the thermal conductivity within a wide range of volume fractions of the SWNTs, including the case when SWNTs are in contact with each other.

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Ansari, Ajmal. „A Study on Polymer Pin Fin Based Heat Sinks“. In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33968.

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Recent developments in polymer additives and formulations have made available resins that have thermal conductivity that is one to two orders of magnitude higher than that of typical engineering polymers. Such polymers can be potentially used for designing heat sinks. There are two primary advantages of polymer heat sinks: ability to form shapes that may not be feasible with metal and flexibility that allows the heat sink to be bent in various shapes. This paper presents results from a study that was conducted to determine the suitability of commercially available Flexible Heat Sink Material for use in cooling high power LED’s.

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Lu, Lu, Shan Hu und Yayue Pan. „3D Printed Particle-Polymer Composites With Acoustically Localized Particle Distribution for Thermal Management Applications“. In ASME 2018 13th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/msec2018-6643.

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The particle-polymer composite can perform multiple functionalities according to particle property, local particle distribution, and alignment. This paper shows thermal management applications of in situ manipulations of particle dispersion patterns within a 3D printed polymeric composite architecture. A 3D printed particle-polymer composite with enhanced thermal conductive properties was developed. Composite structures containing 30-micron-sized aluminum particles embedded in the acrylate polymer were produced using a novel acoustic field assisted projection based Stereolithography process. Thermal properties of the pure polymer and prepared uniform composite with 2.75 wt% particle were characterized by using the transient hot bridge technique. To investigate the effect of material composition and particle distribution pattern on composite thermal behavior, heat sinks were designed and fabricated with the pure polymer, homogeneous composite with particles uniformly distributed in the polymer matrix, and composite with patterned particles for comparison. Infrared thermal imaging was performed on the 3D printed objects. The homogeneous composites displayed slight enhancement in thermal conductivity. A significant improvement of heat dissipation speed was observed for the patterned composite, due to a densely interconnected aluminum aggregate network. To further improve the thermal property of the patterned composite, varying layer thicknesses were tested. The developed patterned composites with superior performance compared to the inherent polymer material and homogeneous composites can be used for fabricating thermal management applications in electronic and fluidic devices.

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Koyuncuog˘lu, Aziz, Tuba Okutucu und Haluk Ku¨lah. „A CMOS Compatible Metal-Polymer Microchannel Heat Sink for Monolithic Chip Cooling Applications“. In 2010 14th International Heat Transfer Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/ihtc14-23212.

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A novel complementary metal oxide semiconductor (CMOS) compatible microchannel heat sink is designed and fabricated for monolithic liquid cooling of electronic circuits. The microchannels are fabricated with full metal walls between adjacent channels with a polymer top layer for easy sealing and optical visibility of the channels. The use of polymer also provides flexibility in adjusting the width of the channels allowing better management of the pressure drop. The proposed microchannel heat sink requires no design change of the electronic circuitry underneath, hence, can be produced by adding a few more steps to the standard CMOS fabrication flow. The microchannel heat sinks were tested successfully under various heat flux and coolant flow rate conditions. The preliminary cooling tests indicate that the proposed design is promising as a monolithic liquid cooling solution for CMOS circuits.

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Pashah, Sulaman, und Abul Fazal M. Arif. „Thermo-Mechanical Fatigue Life Prediction of Orthotropic Composite Pin Fin Heat Sinks for Electronic Packaging“. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52181.

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Heat sinks are used in modern electronic packaging system to enhance and sustain system thermal performance by dissipating heat away from IC components. Pin fins are commonly used in heat sink applications. Conventional metallic pins fins are efficient in low Biot number range whereas high thermal performance can be achieved in high Biot number regions with orthotropic composite pin fins due to their adjustable thermal properties. However, several challenges related to performance as well as manufacturing need to be addressed before they can be successfully implemented in a heat sink design. A heat sink assembly with metallic base plate and polymer composite pin fins is a solution to address manufacturing constraints. During the service life of an electronic packaging, the heat sink assembly is subjected to power cycles. Cyclic thermal stresses will be important at the pin-fin and base-plate interface due to thermal mismatch. The cyclic nature of stresses can lead to fatigue failure that will affect the reliability of the heat sink and electronic packaging. A finite element model of the heat sink is used to investigate the thermal stress cyclic effect on thermo-mechanical reliability performance. The aim is to assess the reliability performance of the epoxy bond at the polymer composite pin fins and metallic base plate interface in a heat-sink assembly.

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Borba Marchetto, Daniel, Debora Carneiro Moreira und Gherhardt Ribatski. „A REVIEW ON POLYMER HEAT SINKS FOR ELECTRONIC COOLING APPLICATIONS“. In Brazilian Congress of Thermal Sciences and Engineering. ABCM, 2018. http://dx.doi.org/10.26678/abcm.encit2018.cit18-0394.

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Leung, Siu N., Omer M. Khan, Hani E. Naguib, Francis Dawson und Vincent Adinkrah. „Applications of multifunctional polymer-matrix composites in hybrid heat sinks“. In SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, herausgegeben von Nakhiah C. Goulbourne und Zoubeida Ounaies. SPIE, 2012. http://dx.doi.org/10.1117/12.917242.

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Virik, Niven Singh, Samuel D. Marshall, Rerngchai Arayanarakool, Hian Hian See, Heng Wang, Poh Seng Lee und Peter Chen Chao Yu. „Evaluation of Heat Transfer Performance of a Spiral Microfluidic Heatsink and Heat Exchanger Device“. In ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/icnmm2018-7804.

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Developments in micro-technology have seen vast improvements in the design and the thermal performance of heat sinks and heat exchangers, particularly in the case of spiral microfluidic devices which deals with the flow of liquids inside curved micrometer-sized channels. The current research deals with a specially designed curved microfluidic channel used to employ the fluid mixing characteristics of Dean vortices and thus transfer heat more efficiently. This curved microfluidic channel is deployed as a spiral channel to create an effective heat sink and a heat exchanger. The novel micro heat exchanger is built by integrating two or more of the specially designed microfluidic heat sink layers. For the ease of fabricating the microchannels, these devices are polymer-based. In this paper, the thermal performance of the spiral microfluidic devices is analyzed numerically and experimentally using a range of flow rates where Thermal Performance Factor is used to find a balanced point between heat transfer and pressure drop. The spiral heat exchange device proves to be an effective thermal transport system with the introduction of curved channels in the devices where the presence of Dean vortices in the system is observed, especially at lower flow rates. It can be observed that by increasing the number of layers, the thermal performance is greatly improved. This is due to the higher surface area with increasing number of layers, as well as a parallel flow structure through the layers. These results serve as a design parameter for developing microchannel-based heat transfer devices that can achieve high efficiency of heat and mass transfer. Further heat sink and heat exchanger design improvements are discussed.

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Manjunath, H. N., K. S. Naveen, N. Ramesh Babu, Kiran Aithal und S. N. Veda. „Computational studies on laminar flow in micro-channel heat sinks for electronic cooling applications“. In PROCEEDINGS OF THE 35TH INTERNATIONAL CONFERENCE OF THE POLYMER PROCESSING SOCIETY (PPS-35). AIP Publishing, 2020. http://dx.doi.org/10.1063/1.5141588.

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Bower, C., A. Orgega, P. Skandakumaran, R. Vaidyanathan und T. Phillips. „Heat Transfer in Water-Cooled Silicon Carbide Milli-Channel Heat Sinks for High Power Electronic Applications“. In ASME 2003 International Mechanical Engineering Congress and Exposition. ASMEDC, 2003. http://dx.doi.org/10.1115/imece2003-43374.

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Heat transfer and fluid flow in a novel class of water-cooled milli-channel heat sinks are investigated. The heat sinks are manufactured using an extrusion freeform fabrication (EFF) rapid prototyping technology and a water-soluble polymer material. EFF permits the fabrication of geometrically complex, three-dimensional structures in non-traditional materials. Silicon carbide, SiC, is TEC-matched to silicon and is an ideal material for heat exchangers that will be mounted directly to heat dissipating electronic packages. This paper presents experimental results on the heat transfer and flow in small SiC heat exchangers with multiple rows of parallel channels oriented in the flow direction. Rectangular heat exchangers with 3.2 cm × 2.2 cm planform area and varying thickness, porosity, number of channels, and channel diameter were fabricated and tested. Overall heat transfer and pressure drop coefficients in single-phase flow regimes are presented and analyzed. The per channel Reynolds number places the friction coefficients in the developing to developed hydrodynamic regime, and showed excellent agreement with laminar theory. The overall heat transfer coefficients for a single row SiC heat exchanger compared favorably with a validation heat exchanger fabricated from copper, however the heat transfer coefficient in multiple row heat sinks did not agree well with the laminar theory.

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