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Auswahl der wissenschaftlichen Literatur zum Thema „Ohmic sintering“
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Zeitschriftenartikel zum Thema "Ohmic sintering"
Fan, Ji Wei, Xiao Peng Li, Zhen Guo Zhang, Zhi Qiang Jiao, Xiang Yang Liu, Wen Jing Zhang, Poonsuk Poosimma und Robert Freer. „The Effects of Cu Dopant on the Microstructure and Non-Ohmic Electrical Properties of ZnO Varistors“. Advanced Materials Research 343-344 (September 2011): 160–65. http://dx.doi.org/10.4028/www.scientific.net/amr.343-344.160.
Der volle Inhalt der QuelleZhou, Liqin, und Changkui Yu. „Sintering and properties of low-firing non-ohmic SrTiO3 ceramics“. Journal of Materials Science 29, Nr. 22 (November 1994): 6055–59. http://dx.doi.org/10.1007/bf00366893.
Der volle Inhalt der QuellePeng, Chengxin, Bingxiang Zhao, Xie Meng, Xiaofeng Ye, Ting Luo, Xianshuang Xin und Zhaoyin Wen. „Effect of NiO Addition on the Sintering and Electrochemical Properties of BaCe0.55Zr0.35Y0.1O3-δ Proton-Conducting Ceramic Electrolyte“. Membranes 14, Nr. 3 (27.02.2024): 61. http://dx.doi.org/10.3390/membranes14030061.
Der volle Inhalt der QuelleRamírez, M. A., P. R. Bueno, E. Longo und J. A. Varela. „Conventional and microwave sintering of CaCu3Ti4O12/CaTiO3ceramic composites: non-ohmic and dielectric properties“. Journal of Physics D: Applied Physics 41, Nr. 15 (03.07.2008): 152004. http://dx.doi.org/10.1088/0022-3727/41/15/152004.
Der volle Inhalt der QuelleNahm, Choon-W. „Sintering temperature dependence on microstructure and non-ohmic properties of ZVMND ceramic semiconductors“. Journal of Materials Science: Materials in Electronics 27, Nr. 9 (24.05.2016): 9520–25. http://dx.doi.org/10.1007/s10854-016-5003-6.
Der volle Inhalt der QuelleEl-Hofy, M. „Non-Ohmic Behavior of Some ZnO Ceramic Defective Ions with Different Valences“. Defect and Diffusion Forum 293 (August 2009): 91–97. http://dx.doi.org/10.4028/www.scientific.net/ddf.293.91.
Der volle Inhalt der QuelleGalizia, Pietro, und Carmen Galassi. „Electrophoretic Deposition of Bilayer Based on Sacrificial Titanium Dioxide and Lead Zirconate Titanate on Bare Silicon Wafer“. Key Engineering Materials 654 (Juli 2015): 132–35. http://dx.doi.org/10.4028/www.scientific.net/kem.654.132.
Der volle Inhalt der QuelleDubey, Pawan Kumar Kumar, Junsung Hong, Kevin X. Lee, Seraphim Belko, Ashish Aphale, Muhammad Anisur Rahman, Michael Reisert und Prabhakar Singh. „Electrical Conductivity and Electrochemical Performance of Pr Doped Ceria“. ECS Transactions 111, Nr. 6 (19.05.2023): 91–103. http://dx.doi.org/10.1149/11106.0091ecst.
Der volle Inhalt der QuelleLiu, Huan, Rong Zhu, Zhi Ping Zheng, Dong Xiang Zhou und Qiu Yun Fu. „Effect of Ni Electrode on the Characteristics of BaTiO3 Based PTCR Ceramics“. Advanced Materials Research 415-417 (Dezember 2011): 1000–1004. http://dx.doi.org/10.4028/www.scientific.net/amr.415-417.1000.
Der volle Inhalt der QuelleSu, Yan Kuin, Fuh Shyang Juang und Kuang Jou Gan. „Ohmic Contacts of AuGeNi and Ag/AuGeNi to n-GaSb with Various Sintering Temperatures“. Japanese Journal of Applied Physics 30, Part 1, No. 5 (15.05.1991): 914–16. http://dx.doi.org/10.1143/jjap.30.914.
Der volle Inhalt der QuelleDissertationen zum Thema "Ohmic sintering"
Djebbi, Roua. „Contribution à la réalisation par technologies additives hybrides de composants microondes 3D multi-matériaux“. Electronic Thesis or Diss., Limoges, 2024. http://www.theses.fr/2024LIMO0110.
Der volle Inhalt der QuelleThis thesis focuses on improving the performance of 3D multi-material microwave components produced through hybrid additive manufacturing technologies, utilizing sintering techniques to optimize the electrical conductivity of printed metallic tracks, and the study of various high-frequency (HF) characterization methods to assess these conductors. The bibliographic study led to the selection of direct printing technologies such as aerosol jet printing (AJP) and material micro-extrusion (nScrypt) for metallic layers, as well as 3D printing of PEKK polymer. One of the main contributions of this work lies in the integration of in situ sintering techniques, such as laser sintering, directly integrated into the nScrypt machine, allowing for the sintering of metallic deposits immediately after printing to maximize their conductive properties. Ohmic sintering was also explored as a complementary method, particularly for metal lines printed via micro-extrusion, with promising results for significantly improving conductivity. In parallel, innovative methods for HF conductivity characterization were developed. These approaches rely on specific probes enabling both contactless and direct contact characterizations, allowing for the measurement of HF conductivity over small areas and the mapping of the conductivity of printed metallic surfaces while accounting for surface roughness. This work is part of a broader goal to integrate these innovations into a hybrid additive manufacturing system, thereby optimizing the performance of 3D microwave components (transmission lines, resonators, etc.)
Konferenzberichte zum Thema "Ohmic sintering"
Song, Jung-Hoon, Young-Min Park, Hong-Youl Bae, Jinsoo Ahn, Byeong-Geun Seong, Do-Hyeong Kim und Joong-Hwan Jun. „Effect of Co-Doped GDC Buffer Layer on the Power Density of Solid Oxide Fuel Cell (SOFC)“. In ASME 2010 8th International Conference on Fuel Cell Science, Engineering and Technology. ASMEDC, 2010. http://dx.doi.org/10.1115/fuelcell2010-33252.
Der volle Inhalt der QuelleVinod, P. N. „Evaluation of the ohmic properties of the silver metal contacts of an improved sintering process on the multicrystalline silicon solar cells“. In 2007 International Workshop on Physics of Semiconductor Devices. IEEE, 2007. http://dx.doi.org/10.1109/iwpsd.2007.4472685.
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