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Zeitschriftenartikel zum Thema „Multilayers printed circuit board“

Autor: Grafiati

Veröffentlicht am 28. Juni 2021

Zuletzt aktualisiert am 2. Februar 2022

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1

Vorunichev, D. S., und K. Yu Vorunicheva. „Current capabilities of prototyping technologies for multilayer printed circuit boards on a 3D printer“. Russian Technological Journal 9, Nr. 4 (26.08.2021): 28–37. http://dx.doi.org/10.32362/2500-316x-2021-9-4-28-37.

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A new direction in 3D printing was investigated – prototyping of single-sided, double-sided and multilayer printed circuit boards. The current capabilities and limitations of 3D printed circuit board printing technology were identified. A comparative analysis of the characteristics of two desktop 3D printers presented in the industry for prototyping radio electronics, as well as the first professional machine DragonFly LDM 2020, which is a mini-factory for prototyping multilayer printed circuit boards, was carried out. The first practical experience of working and printing on DragonFly LDM 2020 supplied to the megalaboratory “3D prototyping and control of multilayer printed circuit boards” of the Institute of Radio Engineering and Telecommunication Systems MIREA – Russian Technological University is presented. The first samples of electronic boards printed on a 3D printer by the method of inkjet printing were obtained. An additive technology for the production of multilayer printed circuit boards is considered: printing with two printheads with conductive and dielectric nano-ink with two curing systems: an infrared sintering system for conductive ink and a UV curing system for dielectric ink. The LDM (Dragonfly Lights-out Digital Manufacturing) production method with the necessary maintenance is presented. The method allows the system to work roundthe-clock with minimal human intervention, significantly increasing the productivity of 3D printing and expanding the possibilities of prototyping. The materials used for 3D printing of multilayer printed circuit boards and their characteristics were investigated: dielectric acrylate nano-ink (Dielectric Ink 1092 – Dielectric UV Curable Acrylates Ink), conducting ink with silver nanoparticles (AgCite™ 90072 Silver Nanoparticle Conductive Ink). The research carried out allows us to compare the technological standards of printed electronics with traditional methods of manufacturing multilayer printed circuit boards for a number of parameters.

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G.W.A.D. „The multilayer printed circuit board handbook“. Microelectronics Reliability 25, Nr. 6 (Januar 1985): 1157. http://dx.doi.org/10.1016/0026-2714(85)90488-3.

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3

Sisoev, Oleg Yu, Sergey S. Sokolov und Victor A. Tupik. „CHOOSING RATIONAL TRACING PROCEDURE BY CONSTRUCTIVE CRITERION“. Journal of the Russian Universities. Radioelectronics, Nr. 6 (18.01.2019): 5–12. http://dx.doi.org/10.32603/1993-8985-2018-21-6-5-12.

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The analysis of autorouter efficiency in the known CAD systems under structural and technological constraints is carried out. The revealed significant constraints are related to the thermal strength of the wires and possible mutual influence through the electromagnetic field. When manually designing the designer guided by his own experience, can ignore these and other constraints. Unlike a person, the autorouter strictly fulfills all the specified constraints, which, given the topology of the printed circuit board, does not allow tracing to complete. On the other hand, giving greater freedom to the autorouter often makes it impossible to meet the production requirements on permissible parameters of the topological pat-tern, which is the width of the conductors and the gaps between them. The problem of tracing printed circuit boards, including multilayer ones, has become much more complicated with the introduction of integrated circuits in TSOP, MOFP and BGA type enclosures packages with fine-pitch pins, a number of which can reach several hundred. The article investigates the possibility of maximizing printed circuit board topological space with these and other types of enclosures. The necessity of introducing a buffer zone around the component to improve the routing efficiency is explained. It is shown, however, that the avail-ability of a buffer zone does not eliminate the appearance of vias in it, the number of which depends on the routing type. On the basis of the proposed criterion for the autorouter performance, i.e. the ratio of the total wire length to the number of vias, the efficiency of using the topological space of a printed circuit board by three autorouters is analyzed.The presented experimental results of competing routing systems TopoR and Specctra confirmed the possibility to enlarge the pattern area of the printed circuit board for its further use.

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4

Batutina, M. S., A. A. Kuzmin und A. N. Mikhailov. „TRANSREFLECTOR ANTENNA DESIGN BASED ON FLAT MULTILAYER TRANSREFLECTOR“. Issues of radio electronics, Nr. 2 (20.02.2019): 26–30. http://dx.doi.org/10.21778/2218-5453-2019-2-26-30.

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The paper considers an embodiment of the antenna design based on a flat non‑axis‑symmetrical transreflector made by using multilayer printed circuit board technology. The construction principle of a flat non‑axis‑symmetrical transreflector by cutting it from the flat polarizing structure is given. The form of the flat multi‑layer non‑axisymmetric transreflector board is determined by the projection of the non‑axisymmetric parabolic transflector onto a plane perpendicular to the focal axis. An electrodynamic model of the antenna with a flat non‑axis‑symmetrical reflector to study the radiation characteristics in the UHF range was constructed. A comparative analysis of the radiation characteristics of antennas on the basis of planar multilayer axisymmetric and flat multilayer non‑axis‑symmetrical transreflectors was performed. A number of technological advantages of the developed flat structure over a non‑axis‑symmetrical parabolic transreflector due to use of the known technology of multilayer printed circuit boards is also described.

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5

Kong, Fan, Weixing Sheng, Xiaofeng Ma und Yubing Han. „Circuit model and signal integrity analysis for multilayer printed circuit board interconnection“. International Journal of RF and Microwave Computer-Aided Engineering 24, Nr. 4 (29.10.2013): 478–89. http://dx.doi.org/10.1002/mmce.20789.

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6

Bachmann, Friedrich. „Excimer Laser Drill for Multilayer Printed Circuit Boards: From Advanced Development to Factory Floor“. MRS Bulletin 14, Nr. 12 (Dezember 1989): 49–53. http://dx.doi.org/10.1557/s088376940006098x.

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A novel excimer laser process has been developed for generating cylindrical via holes with an aspect ratio of about one. The fabrication process is being successfully run on a production line for a highly miniaturized printed circuit board used for the multichip module in the new Siemens 7500 H 90 mainframe computer. The process is outstanding in terms of reliability and reproducibility. To the best of our knowledge, this is the first that that excimer lasers have been put into large-scale use in an industrial environment.Since signal delay times for chips have decreased much more rapidly than delay times for packaging, the computing speed of high-speed computers is restricted by the packaging techniques used. Therefore, further development of packaging technology became a prime objective for those developing high-performance computers. Packaging delay times had to be reduced drastically to keep up with increasingly shorter chip delay times. This, in effect, meant that a greater packaging density had to be implemented.A novel planar packaging technique has lead to considerable progress in solving this problem. This technique has been described in detail elsewhere. A key component in this technology is a multichip module, which can take in each of 16 areas, either an LSI module with 320 leads or 9 MSI modules with 52 leads as “bare” ICs. This means that a micro-wiring printed circuit board of this kind can accomodate between 16 (LSI) and 144 (MSI) chips. This article describes how these printed circuit boards are manufactured.As the specifications (Table I) show, blind vias 80 μm in diameter at a pitch of 0.5 mm have to be made in a 16-layer printed circuit board. It is intended that these blind vias will provide the through-contact for neighboring layers. The excimer laser plays a major role in this process.

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7

Kuczynski, J. „Dynamic Mechanical Analysis of Printed Circuit Board Laminates“. International Symposium on Microelectronics 2010, Nr. 1 (01.01.2010): 000630–37. http://dx.doi.org/10.4071/isom-2010-wp3-paper4.

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Printed circuit boards must meet stringent requirements imposed by elevated temperature processes required for mixed-solder and/or Pb-free assembly. To meet these requirements, laminate manufacturers offer a variety of resin formulations, reactive additives, and glass styles designed to impart specific properties. Both the coefficient of thermal expansion (CTE) and the glass transition temperature (Tg) have received considerable attention with respect to design of high-temperature laminates. CTE mismatch between the copper and the laminate within a PCB results in stress upon the copper that may manifest itself as opens within vias, at the interfaces between internal lands and plated-through hole barrels, as well as open traces. Since the CTE of resin materials below the Tg is typically on the order of 5X lower than the CTE above Tg, a typical laminate design strategy is to produce a resin that exhibits a high Tg without adversely impacting other properties. Numerous factors affect the ultimate Tg of the resin, including the functionality of the monomer(s), crosslink density, the cure profile, and absorbed moisture. Within the electronics industry, Tg is determined via differential scanning calorimetry (DSC) as per IPC-TM-650. However, due to the multilayer construction of current circuit boards coupled with sample size limitations, DSC has been shown to be an inadequate technique for measurement of the glass transition temperature. The endotherm in the DSC is often ill defined, of marginal quality, and may be convoluted with stress relaxation and/or volatile outgassing at elevated temperature. Dynamic mechanical analysis (DMA) has been demonstrated to provide far greater information relative to not only the Tg, but also physical property depression due to moisture plasticization and incomplete resin conversion in various high-Tg laminate systems. Several case studies regarding phenolic-cured epoxy resins, cyanate ester/epoxy blends, and/or polyphenylene oxide/triallylisocyanurate blends will be discussed.

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8

Liu, Jingping, Cheng Yang, Haoyi Wu, Ziyin Lin, Zhexu Zhang, Ronghe Wang, Baohua Li, Feiyu Kang, Lei Shi und Ching Ping Wong. „Future paper based printed circuit boards for green electronics: fabrication and life cycle assessment“. Energy Environ. Sci. 7, Nr. 11 (2014): 3674–82. http://dx.doi.org/10.1039/c4ee01995d.

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A multilayer printed circuit board (PCB) can be fabricated using commercially available printing paper, which shows comparable functionalities with the conventional organic PCBs but 100 times lower environmental impact.

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Takahashi, A., N. Ooki, A. Nagai, H. Akahoshi, A. Mukoh und M. Wajima. „High density multilayer printed circuit board for HITAC M-880“. IEEE Transactions on Components, Hybrids, and Manufacturing Technology 15, Nr. 4 (1992): 418–25. http://dx.doi.org/10.1109/33.159868.

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10

Wang, Xiang, Wangping Wu, Dingkai Xie, Peng Jiang, Zhizhi Wang und Yi Zhang. „Failure Analysis of Leakage Current for Multilayer Printed Circuit Board“. Journal of Failure Analysis and Prevention 20, Nr. 5 (10.08.2020): 1621–27. http://dx.doi.org/10.1007/s11668-020-00971-1.

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11

Pillai, E., und W. Wiesbeck. „Derivation of equivalent circuits for multilayer printed circuit board discontinuities using full wave models“. IEEE Transactions on Microwave Theory and Techniques 42, Nr. 9 (1994): 1774–83. http://dx.doi.org/10.1109/22.310587.

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12

Latypov, Radic R., Alexandra O. Desyatova, Sergey V. Golybev, Larisa N. Maskaeva und Vyacheslav F. Markov. „Comparative assessment of the conditions of direct and electrochemical metallization of blind holes of multilayer printed circuit boards“. Butlerov Communications 58, Nr. 5 (31.05.2019): 98–104. http://dx.doi.org/10.37952/roi-jbc-01/19-58-5-98.

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The metal blind holes acting as interconnectors allow significantly reduce the number of layers, increase the efficiency of trace and decrease interference between the holes and signal conductors in the high frequency printed circuit boards. In this work, a comparative assessment of the conditions of direct and electrochemical metallization blind holes with diameters: 0,2; 0.25; 0.3; 0.4; 0.6; 0.8; 1.0 mm and a drilling depth of 0.5 mm located on experimental four-layer multilayer printed circuit boards, differing in the method of applying a conductive and copper coating was carried out. It has been established that in case non-fulfillment of mandatory conditions for the production of blind holes, in particular the aspect ratio is less than or equal to unity, incomplete metallization of the walls and especially the bottom of the holes is observed. The ways of combining the processes of direct and electrochemical metallization of holes, which provide the required thickness and quality of the copper coating at reduction of general duration of operations have been proposed based on the experimental data obtained during the work with multilayer printed boards. Also it has been established that the joint placement of blind holes with a smaller and larger diameter on one multilayer printed circuit board requires a more long direct metallization in combination with electrochemical at low values of current density. Copper films deposited on the walls of the holes and on the surface of the contact pads, regardless of the proposed way of metallization, have a highly dispersed structure. The composition of the palladium catalyst layers has been studied by energy dispersive analysis. The conductive coating on the blind hole’s walls contains between 1.55 and 6.77 at.% palladium.

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13

Pan, C. T., F. T. Hsu, C. C. Nien, Z. H. Liu, Y. J. Chen und P. H. Chen. „In-Plane Electromagnetic Generator Fabricated on Printed Circuit Board Technology“. Applied Mechanics and Materials 479-480 (Dezember 2013): 524–29. http://dx.doi.org/10.4028/www.scientific.net/amm.479-480.524.

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Small and efficient energy harvesters, as a renewable power supply, draw lots of attention in the last few years. This paper presents a planar rotary electromagnetic generator with copper coils fabricated by using printed circuit board (PCB) as inductance and Nd-Fe-B magnets as magnetic element. Coils are fabricated on PCB, which is presumably cost-effective and promising methods. 28-pole Nd-Fe-B magnets with outer diameter of 50 mm and thickness of 2 mm was sintered and magnetized, which can provide magnetic field of 1.44 Tesla. This harvester consists of planar multilayer with multi-pole coils and multi-pole permanent magnet, and the volume of this harvester is about 50x50x2.5 mm3. Finite element analysis is used to design energy harvesting system, and simulation model of the energy harvester is established. In order to verify the simulation, experiment data are compared with simulation result. The PCB energy harvester prototype can generate induced voltage 0.61 V and 13.29mW output power at rotary speed of 4,000 rpm.

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KANAYA, Yasuhiko, Kunio ARAI und Kiyoharu NAKAJIMA. „Development of small hole drilling machine for multilayer printed circuit board.“ Journal of the Japan Society for Precision Engineering 54, Nr. 12 (1988): 2261–65. http://dx.doi.org/10.2493/jjspe.54.2261.

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15

Georgieva, N., Zhizhang Chen und W. Oberhammer. „On resonant effects in multilayer RF/microwave printed circuit board applications“. IEEE Transactions on Advanced Packaging 22, Nr. 2 (Mai 1999): 200–206. http://dx.doi.org/10.1109/6040.763192.

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16

Snastin, Mikhail, und Elena Dobychina. „A wide bandwidth emitter for Ku band antenna array application“. ITM Web of Conferences 30 (2019): 05027. http://dx.doi.org/10.1051/itmconf/20193005027.

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The results of electrodynamic simulation of a wide bandwidth antenna emitter for Ku band are presented. The emitter in question has two orthogonal linear polarizations and is designed on multilayer printed circuit board. The simulation results of a four-element antenna array based on that antenna element are also presented.

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17

SHIGAKI, Yasunobu. „PWB Base Materials. (13). Materials of Multilayer Printed Circuit Board-Prepreg, Core.“ Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 10, Nr. 1 (1995): 61–67. http://dx.doi.org/10.5104/jiep1995.10.61.

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18

Wang, Gao. „New reconstruction method for x-ray testing of multilayer printed circuit board“. Optical Engineering 49, Nr. 5 (01.05.2010): 056501. http://dx.doi.org/10.1117/1.3430629.

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19

You, Hee-Wook, Se-Ho Kim und Jung-Hyuk Koh. „Simulation and Fabrication of Embedded Capacitors in the Multilayer Printed Circuit Board“. Japanese Journal of Applied Physics 47, Nr. 9 (19.09.2008): 7707–10. http://dx.doi.org/10.1143/jjap.47.7707.

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20

Jian Gong und Chang-Jin Kim. „Direct-Referencing Two-Dimensional-Array Digital Microfluidics Using Multilayer Printed Circuit Board“. Journal of Microelectromechanical Systems 17, Nr. 2 (April 2008): 257–64. http://dx.doi.org/10.1109/jmems.2007.912698.

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21

Hendrickx, Nina, JÜrgen Van Erps, Geert Van Steenberge, Hugo Thienpont und Peter Van Daele. „Tolerance Analysis for Multilayer Optical Interconnections Integrated on a Printed Circuit Board“. Journal of Lightwave Technology 25, Nr. 9 (September 2007): 2395–401. http://dx.doi.org/10.1109/jlt.2007.901377.

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22

Phung, Thanh Huy, Jaehyeong Jeong, Anton Nailevich Gafurov, Inyoung Kim, Sung Yong Kim, Hak-Jun Chung, Yoonkap Kim, Han-Jung Kim, Kyoung Min Kim und Taik-Min Lee. „Hybrid fabrication of LED matrix display on multilayer flexible printed circuit board“. Flexible and Printed Electronics 6, Nr. 2 (30.04.2021): 024001. http://dx.doi.org/10.1088/2058-8585/abf5c7.

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23

Frye, Robert, und Kai Liu. „Meander Delay Compensation in High-Speed Digital Multilayer Packages“. International Symposium on Microelectronics 2012, Nr. 1 (01.01.2012): 000334–39. http://dx.doi.org/10.4071/isom-2012-tp27.

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The routing of multi-trace digital signal buses in printed circuit boards often results in mismatches in the lengths of the lines. This results in mismatched propagation time, referred to as “timing skew” in a digital system. A common method that is used to compensate for this is to add meander sections of line to lengthen the signal path length. Many advanced circuit board design tools have the capability to perform this compensation automatically. Advanced Ball Grid Array (BGA) packages are fabricated using fine-line multilayer laminate substrates or they are built up using multilayer wafer-scale processes. The design tools for these types of packages have evolved from printed circuit board tools and typically use the same methods and principles. It is very common in BGA packages for high-speed digital applications to use meander trace patterns to match the trace lengths of high speed bus interconnections either from the chip to the solder balls or between chips in a multi-chip package. However, electromagnetic simulation of these packages shows that despite the use of these techniques to match the physical length of the traces, electrical lengths often vary by as much as a factor of two. Examples of such packages are presented and analyzed. The resulting timing skew is not a significant problem in most current applications, since the overall delay is small compared with the clock interval. But with emerging applications pushing well beyond 10Gb/s, timing skew in packages will be an important consideration. The reasons for the ineffectiveness of meander delay compensation are discussed, and are demonstrated by some simple simulations.

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MIKAMI, Takao, Masaki FUJIKAWA und Takaya KOBAYASHI. „1113 Viscoelastic Deflection Analysis of Printed Circuit Board using Multilayered Plate Theory“. Proceedings of the JSME annual meeting 2008.6 (2008): 241–42. http://dx.doi.org/10.1299/jsmemecjo.2008.6.0_241.

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25

Shringarpure, Ketan, Siming Pan, Jingook Kim, Jun Fan, Brice Achkir, Bruce Archambeault und James L. Drewniak. „Sensitivity Analysis of a Circuit Model for Power Distribution Network in a Multilayered Printed Circuit Board“. IEEE Transactions on Electromagnetic Compatibility 59, Nr. 6 (Dezember 2017): 1993–2001. http://dx.doi.org/10.1109/temc.2017.2673851.

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26

Zhang, Kai, Xing Jian Dai und Xiao Zhang Zhang. „Designs of Eddy Current Sensor Probes Based on Multilayer Printed Circuit Board Technology“. Applied Mechanics and Materials 190-191 (Juli 2012): 801–5. http://dx.doi.org/10.4028/www.scientific.net/amm.190-191.801.

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Probe characteristics are important for eddy current displacement sensors. Probes made by multilayer printed circuit board (PCB) are good at maintaining quality consistency and their axial length was short. As design principles for wired probes were not suitable for PCB probes, an analysis and design method for them was developed. In this paper, PCB probe characteristics were first analyzed with 3D eddy current field FEM software. The process was time-consuming. To increase analysis efficiency, a simplified 2D axial symmetry model was used to replace the 3D model. The analysis results were compared and their difference was small. The probe resister and inductance were compared with measurement result of a test PCB probe and they agreed well. Based on 2D model, a series of analysis was performed and basic design principles for PCB probes were obtained. Based on the principles, a new PCB probe with better performance was designed.

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Kim, Dongjoon, Wheejae Kim und Wan-Chin Kim. „Dynamic analysis of multilayer ceramic capacitor for vibration reduction of printed circuit board“. Journal of Mechanical Science and Technology 33, Nr. 4 (April 2019): 1595–601. http://dx.doi.org/10.1007/s12206-019-0311-4.

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28

Xie, Chuanning, Xiaoqi Tang, Jihong Chen, Bao Song, Jian Jin und Hangjun Zhang. „Humidity Threshold Model of Numerical Control Multilayer Printed Circuit Board for Electrochemical Migration“. Quality and Reliability Engineering International 31, Nr. 4 (12.03.2014): 567–78. http://dx.doi.org/10.1002/qre.1612.

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29

Maklashov, V. A., und M. N. Piganov. „Simulation of ultrawided and embedded multilayer RFfilters embedded in a printed circuit board“. Journal of Physics: Conference Series 1096 (Dezember 2018): 012182. http://dx.doi.org/10.1088/1742-6596/1096/1/012182.

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30

Chen, Qiang, Sumito Kato und Kunio Sawaya. „Estimation of Current Distribution on Multilayer Printed Circuit Board by Near-Field Measurement“. IEEE Transactions on Electromagnetic Compatibility 50, Nr. 2 (Mai 2008): 399–405. http://dx.doi.org/10.1109/temc.2008.921028.

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31

Filipp Fuchs, Peter, Klaus Fellner und Gerald Pinter. „Local damage simulations of printed circuit boards based on in‐plane cohesive zone parameters“. Circuit World 39, Nr. 2 (10.05.2013): 60–66. http://dx.doi.org/10.1108/03056121311315774.

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PurposeThe purpose of this paper is to analyse, in a finite element simulation, the failure of a multilayer printed circuit board (PCB), exposed to an impact load, to better evaluate the reliability and lifetime. Thereby the focus was set on failures in the outermost epoxy layer.Design/methodology/approachThe fracture behaviour of the affected material was characterized. The parameters of a cohesive zone law were determined by performing a double cantilever beam test and a corresponding simulation. The cohesive zone law was used in an enriched finite element local simulation model to predict the crack initiation and crack propagation. Using the determined location of the initial crack, the energy release rate at the crack tip was calculated, allowing an evaluation of the local loading situation.FindingsA good concurrence between the simulated and the experimentally observed failure pattern was observed. Calculating the energy release rate of two example PCBs, the significant influence of the chosen type on the local failure behaviour was proven.Originality/valueThe work presented in this paper allows for the simulation and evaluation of failure in the outermost epoxy layers of printed circuit boards due to impact loads.

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Riafinola, Hanifah, Shintiya Lifitri, Mcael Timanta Ginting und Budiana Budiana. „Kajian Efektivitas Larutan Etsa NH4OH, FeCl3, dan CuCl2 pada Multilayar Rigid Printed Circuit Board“. Journal of Applied Electrical Engineering 3, Nr. 1 (30.06.2019): 15–18. http://dx.doi.org/10.30871/jaee.v3i1.1395.

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Salah satu dari proses manufaktur Printed Circuit Board (PCB) adalah proses etsa yang menggunakan larutan kimia. Larutan kimia yang digunakan dalam penelitian ini adalah NH4OH, FeCl3 dan CuCl2. Metode penelitian yang digunakan dalam penelitian ini adalah menggunakan mesin etsa dengan menggunkan motor servo yang terbaca melalui encoder. Berdasarkan penelitian yang dilakukan diperoleh kesimpulan bahwa waktu yang dibutuhkan untuk melakukan proses etsa untuk seluruh PCB adalah 8 menit untuk FeCl3, 18 menit untuk CuCl2. Sedangkan untuk NH4OH baru terjadi etsa pada waktu 18 menit.

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Solberg, Vern. „Design and Process Implementation for Embedding Components“. International Symposium on Microelectronics 2011, Nr. 1 (01.01.2011): 000279–85. http://dx.doi.org/10.4071/isom-2011-tp3-paper1.

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Although the printed circuit has traditionally served as the platform for mounting and interconnecting active and passive components on the outer surfaces, companies attempting to improve product functionality and minimize space are now considering embedding a broad range of these components within the circuit structure. Both uncased active and passive component elements are candidates for embedding but the decision to embed components within the multilayer circuit structure must be made early in the design process. Some components are easy candidates for integrating into the substrate while other may involve more complex processes and will be difficult to rationalize. Although many of the discrete passive and active devices may remain mounted on the outer surfaces of the multilayer board, embedding passive components and one or more silicon based semiconductor elements within the inner layers of the subsrate will enable greater utilization of the circuit board structure. Benefits can include improved performance. For example, by embedding the uncased semiconductor element on an inner layer of the circuit vertically in-line with a related semiconductor package mounted on the outer surface, the conductor interface can be minimized. The close coupling of semiconductor elements will significantly reduces resistance, inductance and contributes to increasing signal speed. This paper includes design guidelines, material selection and the use of micro-via build-up termination methodology for embedding and interconnecting miniature passive components; resistor, capacitor, inductor, discrete transistor elements and thinned semiconductor elements. Detailed process information and examples will be included to enable the product designer and manufacturing specialist to have a clear understanding of the principles for embedding and interconnecting components in an organic multilayer circuit board structure

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Bergum, E. J. „Drum Side Treated Foil: Advanced Copper Foil Technology for Multilayer Printed Circuit Board Applications“. Circuit World 22, Nr. 1 (April 1996): 10–13. http://dx.doi.org/10.1108/03056129610799886.

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Ghassemi, Nasser, und Ke Wu. „Millimeter-Wave Integrated Pyramidal Horn Antenna Made of Multilayer Printed Circuit Board (PCB) Process“. IEEE Transactions on Antennas and Propagation 60, Nr. 9 (September 2012): 4432–35. http://dx.doi.org/10.1109/tap.2012.2207050.

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36

de la Broïse, Xavier, Alain Le Coguie, Jean-Luc Sauvageot, Claude Pigot, Xavier Coppolani, Vincent Moreau, Samuel d’Hollosy, Timur Knarosovski und Andreas Engel. „Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections“. Journal of Low Temperature Physics 193, Nr. 3-4 (04.05.2018): 578–84. http://dx.doi.org/10.1007/s10909-018-1930-3.

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37

Chan, Y. C., F. Yeung und T. S. Mok. „Failure analysis of miniaturized multilayer ceramic capacitors in surface mount printed circuit board assemblies“. Journal of Materials Science: Materials in Electronics 5, Nr. 1 (Februar 1994): 25–29. http://dx.doi.org/10.1007/bf00717879.

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38

Chen, Zhuo, Fan Yang und S. A. Meguid. „Multi-level modeling of woven glass/epoxy composite for multilayer printed circuit board applications“. International Journal of Solids and Structures 51, Nr. 21-22 (Oktober 2014): 3679–88. http://dx.doi.org/10.1016/j.ijsolstr.2014.06.030.

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39

NAKATANI, Seiichi. „Recent Trend on Microfabrication of Circuit Technology. Any Layer IVH Multilayered Printed Wiring Board.“ Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 10, Nr. 7 (1995): 447–52. http://dx.doi.org/10.5104/jiep1995.10.447.

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40

Engin, A. Ege, Krishna Bharath und Madhavan Swaminathan. „Multilayered Finite-Difference Method (MFDM) for Modeling of Package and Printed Circuit Board Planes“. IEEE Transactions on Electromagnetic Compatibility 49, Nr. 2 (Mai 2007): 441–47. http://dx.doi.org/10.1109/temc.2007.893331.

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41

Wang, Yongfei, Dongfang Zhou, Yi Zhang und Chaowen Chang. „Using Multilayered Substrate Integrated Waveguide to Design Microwave Gain Equalizer“. Advances in Materials Science and Engineering 2014 (2014): 1–6. http://dx.doi.org/10.1155/2014/109247.

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This paper presents the design and experiment of a novel microwave gain equalizer based on the substrate integrated waveguide (SIW) technique. The proposed equalizer is formed by an SIW loaded by SIW resonators, which has very compact structure and can compensate for gain slope of microwave systems. Equivalent circuit analysis is given about the proposed structure for a better insight into the structure’s response. A Ku-Band equalizer with four SIW resonators is simulated and fabricated with a multilayer printed circuit board process. The measured results show good performance and agreement with the simulated results; an attenuation slope of −4.5 dB over 12.5–13.5 GHz is reached with a size reduction of 76%.

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Khawary, Mohammad Reza, Vahid Nayyeri, Seyed Mohammad Hashemi und Mohammad Soleimani. „A New Ultracompact Narrow Bandpass Microstrip Filter Using Double-Negative Quasiplanar Cells“. International Journal of Antennas and Propagation 2020 (07.04.2020): 1–6. http://dx.doi.org/10.1155/2020/5654727.

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This paper presents a novel ultracompact narrow bandpass filter with high selectivity. The proposed filter is composed of cascading two basic cells. Each cell is basically a microstrip line loaded with a quasiplanar resonator and series gaps which can be fabricated using a standard multilayer printed circuit board technology. The structure is analyzed through an equivalent circuit and full-wave simulations. The simulation results are compared with experimental measurements demonstrating a good agreement between them. The measurement indicates that the realized bandpass filter at the center frequency of 1 GHz has a fractional bandwidth of 2.2%. Most importantly, in comparison with other similar recent works, it is shown that the proposed filter has the smallest size.

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Barbosa, Ademarlaudo França. „Use of a multilayer printed circuit board as the position sensing electrode in an MWPC“. Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 371, Nr. 3 (März 1996): 368–74. http://dx.doi.org/10.1016/0168-9002(95)01012-2.

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44

ITOH, Mikio, Toshiyuki OHTORI, Toshiroh TAKEDA und Hisashi ENOKI. „Development of Multilayer Printed Circuit Board Meterial for High Frequency Use Controlled Hydroxyl Group Concentration.“ Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 10, Nr. 3 (1995): 143–47. http://dx.doi.org/10.5104/jiep1995.10.143.

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45

Shuhua Wen, Jinling Zhang und Yinghua Lu. „Modeling and Quantification for Electromagnetic Radiation of Power-Bus Structure With Multilayer Printed Circuit Board“. IEEE Transactions on Components, Packaging and Manufacturing Technology 6, Nr. 1 (Januar 2016): 79–86. http://dx.doi.org/10.1109/tcpmt.2015.2506265.

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46

Marinho, P. R. B., A. F. Barbosa und G. P. Guedes. „Using a multilayer printed circuit board as position sensing electrode in a triple-GEM detector“. IEEE Transactions on Nuclear Science 52, Nr. 6 (Dezember 2005): 2917–22. http://dx.doi.org/10.1109/tns.2005.862800.

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47

Belousov, Anton O., Artem V. Medvedev, Evgeniya B. Chernikova, Talgat R. Gazizov und Alexander M. Zabolotsky. „Switching Order after Failures in Symmetric Protective Electrical Circuits with Triple Modal Reservation“. Symmetry 13, Nr. 6 (16.06.2021): 1074. http://dx.doi.org/10.3390/sym13061074.

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This work is devoted to the research of new asymmetry effects in symmetric protective structures with triple modal reservation. We analyzed the structures with different cross-sectional locations of the reference conductor: in the center (unshielded structure), around (shielded structure), at the top and bottom (multilayer printed circuit board), and in the form of side polygons (double-sided printed circuit board). First, a preliminary quasi-static simulation was performed in the range of parameters. It was revealed that in all structures, except for the shielded one (in the form of a cable), the deviations of the output voltage amplitude, bandwidth, and frequency of the first resonance were insignificant, whereas in the shielded structure there were significant deviations in the time and frequency responses. The attenuation of the output voltage in relation to the input for each structure was also estimated. In addition, we performed a parametric optimization of the structures under consideration using a heuristic search, which made it possible to improve their characteristics. Finally, the switching order between the conductors in these structures with the original and optimized parameter sets was investigated in detail. The optimal conductor switching order in the case of a component failure was determined, and the best (according to protective characteristics) parameter configuration for each structure was found.

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Gierczak, Miroslaw Gracjan, Jacek Wróblewski und Andrzej Dziedzic. „The design and fabrication of electromagnetic microgenerator with integrated rectifying circuits“. Microelectronics International 34, Nr. 3 (07.08.2017): 131–39. http://dx.doi.org/10.1108/mi-02-2017-0010.

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Purpose The paper focuses on design, fabrication and characterization of electromagnetic microgenerators with integrated rectifying circuits to convert AC output signal to DC one. The work includes research on simulation of voltage-rectifying circuits, including charge pump, realization of the experimental printed circuit board (PCB) with selected electronic circuits and the execution of the final structure with integrated rectifying circuit. Measurements were performed on these circuits. Design/methodology/approach Electromagnetic microgenerators include multipole permanent magnets secured on rotor three-phase brushless direct current (BLDC) motor and planar multilayer multiple coils. These were fabricated using low temperature co-fired ceramics (LTCC) technology. In our experiment, six rectifying circuits were simulated and tested with a structure consisting of eight layers of coils and with an outer diameter of 50 mm fabricated earlier. Findings The microgenerator with Graetz bridge generates higher output power than the modified charge pump at the same rotary speed. However, it is less stable for the distance change between the structure and the magnets than the modified charge pump, which has more constant output power in a wider range of load resistance. Originality/value The presented electronic rectifying circuits are novel for LTCC-based electromagnetic microgenerator application. The structure with integrated rectifying circuits allows generation of electrical output power larger than 100 mW at the rotor speed of about 8,000 rpm.

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Banks, ShermanM. „4771236 Multilayered printed circuit board type resistor isolated tray for stress testing integrated circuits and method of making same“. Microelectronics Reliability 29, Nr. 4 (Januar 1989): 667. http://dx.doi.org/10.1016/0026-2714(89)90539-8.

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50

Aguirre, Jerry, Marcos Vargas und Paul Garland. „Radiation Mechanisms and Electromagnetic Interference in Ceramic Electronic Packages“. International Symposium on Microelectronics 2012, Nr. 1 (01.01.2012): 000628–37. http://dx.doi.org/10.4071/isom-2012-wa36.

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A full-wave electromagnetic analysis for characterizing typical electromagnetic shielding practices in ceramic electronic packages is presented. Typically in printed circuit board emissions, the power plane emissions, and exposed surface nets are considered, however, the signal interconnect from the PCB to an electronic package can also be a significant source of radiation and hence an electromagnetic interference (EMI) issue. In this paper we describe electromagnetic radiation mechanisms resulting from high-frequency and high-speed applications in ceramic multilayer electronic packages and review the typical practice of implementing via fences to mitigate and reduce the EMI risk within a package substrate and also for the case when the package is part of a package/board configuration.

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