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1
Ambatipudi, Radhika. „Multilayered Coreless Printed Circuit Board (PCB) Step-down Transformers for High Frequency Switch Mode Power Supplies (SMPS)“. Licentiate thesis, Mittuniversitetet, Institutionen för informationsteknologi och medier, 2011. http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-13967.
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The Power Supply Unit (PSU) plays a vital role in almost all electronic equipment. The continuous efforts applied to the improvement of semiconductor devices such as MOSFETS, diodes, controllers and MOSFET drivers have led to the increased switching speeds of power supplies. By increasing the switching frequency of the converter, the size of passive elements such as inductors, transformers and capacitors can be reduced. Hence, the high frequency transformer has become the backbone in isolated AC/DC and DC/DC converters. The main features of transformers are to provide isolation for safety purpose, multiple outputs such as in telecom applications, to build step down/step up converters and so on. The core based transformers, when operated at higher frequencies, do have limitations such as core losses which are proportional to the operating frequency. Even though the core materials are available in a few MHz frequency regions, because of the copper losses in the windings of the transformers those which are commercially available were limited from a few hundred kHz to 1MHz. The skin and proximity effects because of induced eddy currents act as major drawbacks while operating these transformers at higher frequencies. Therefore, it is necessary to mitigate these core losses, skin and proximity effects while operating the transformers at very high frequencies. This can be achieved by eliminating the magnetic cores of transformers and by introducing a proper winding structure. A new multi-layered coreless printed circuit board (PCB) step down transformer for power transfer applications has been designed and this maintains the advantages offered by existing core based transformers such as, high voltage gain, high coupling coefficient, sufficient input impedance and high energy efficiency with the assistance of a resonant technique. In addition, different winding structures have been studied and analysed for higher step down ratios in order to reduce copper losses in the windings and to achieve a higher coupling coefficient. The advantage of increasing the layer for the given power transfer application in terms of the coupling coefficient, resistance and energy efficiency has been reported. The maximum energy efficiency of the designed three layered transformers was found to be within the range of 90%-97% for power transfer applications operated in a few MHz frequency regions. The designed multi-layered coreless PCB transformers for given power applications of 8, 15 and 30W show that the volume reduction of approximately 40-90% is possible when compared to its existing core based counterparts. The estimation of EMI emissions from the designed transformers proves that the amount of radiated EMI from a three layered transformer is less than that of the two layered transformer because of the decreased radius for the same amount of inductance. Multi-layered coreless PCB gate drive transformers were designed for signal transfer applications and have successfully driven the double ended topologies such as the half bridge, the two switch flyback converter and resonant converters with low gate drive power consumption of about half a watt. The performance characteristics of these transformers have also been evaluated using the high frequency magnetic material made up of NiZn and operated in the 2-4MHz frequency region. These multi-layered coreless PCB power and signal transformers together with the latest semiconductor switching devices such as SiC and GaN MOSFETs and the SiC schottky diode are an excellent choice for the next generation compact SMPS.
2
Galia, Jan. „Měnič s tranzistory GaN pro elektrický kompresor“. Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2021. http://www.nusl.cz/ntk/nusl-442787.
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This master’s thesis deals with the design and realization of a functional sample power inverter for an electric compressor, which is used in hybrid cars. The electric compressor powered by the inverter is E-compressor by Garrett Advancing Motion. An inverter will be using modern High Electron Mobility Transistors which are based on gallium nitride (GaN). The purpose of this thesis is to find if GaN transistors can be used in E-boosting application.
3
Tarvainen, T. (Timo). „Studies on via coupling on multilayer printed circuit boards“. Doctoral thesis, University of Oulu, 1999. http://urn.fi/urn:isbn:951425189X.
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Abstract
Design and manufacturing techniques of printed circuit boards
(PCB's) have advanced from early one or two-layer structures
to the multilayer boards where ten or more layers are no longer
uncommon. These give additional routing space, potential decrease
in device size and various design possibilities like solid ground
and power planes. Unfortunately multilayer boards are vulnerable
to high coupling between signal vias especially due to PCB resonances.
In this study via crosscoupling is investigated on multilayer
PCB's. Special attention is given to the coupling due
to resonances and vertically aligned blind vias. Problem is approached
from the electromagnetic compatibility (EMC) point of view and
high accuracy of measurements or models is not the objective. Instead
ways to increase isolation are considered important. EMC is considered
to include internal functionality of the device.
Analytical methods are used to calculate resonant frequencies,
fields and quality factors for simple rectangular structures. The
PCB cavity is reduced to two-dimensions for numerical calculation
of same quantities. Aplac finite-difference time-domain simulator
is used to model coupling due to PCB resonances. Isolation between
vertically aligned blind vias is estimated analytically. A quasi-static
numerical model is used to study a coaxial via structure. Multilayer
test boards are constructed for measurement purposes. Simplified
resonator structures on two-layer boards are used to test different
methods to increase isolation.
Measurements show that high coupling between vias may occur
due to PCB resonances. This leads to the situation, where previously
used isolation methods between vias are not necessarily effective
enough. Several means to reduce effects of PCB resonances are described
in this study. Measured and modelled results agree well from an
EMC point of view. Coupling due to vertically aligned blind vias
is also shown to be high. A simple capacitance model may be used
to approximate this up to frequencies where the dynamic wave nature
of the board starts to be important. From a PCB designer's
point of view these results mean that when the board size is not
small compared to the wavelength, there is a possibility of resonances
and reduction methods have to be taken into account. Also placement
of the vias have to be carefully selected especially if blind or
buried vias are used.
4
Xu, Zhifei. „Tensorial analysis of multilayer printed circuit boards : computations and basics for multiphysics analysis“. Thesis, Normandie, 2019. http://www.theses.fr/2019NORMR003.
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Les cartes électroniques modernes nécessitent des analyses avancées d’intégrité du signal (IS), d’intégrité de puissance (IP), et de compatibilité électromagnétique (CEM). Face aux complexités des circuits imprimés, les méthodes de calcul classiques ne permettent ni de poser le problème ni de l’analyser théoriquement. Cependant, l’analyse tensorielle des réseaux (ATR) basée sur la méthode de Kron complétée du modèle de Branin (KB) laisse entrevoir une capacité d’analyse plus avancée des PCB. L’ATR appliquée à l’espace des mailles conduit à une modélisation compacte et une expression lagrangienne directe des circuits imprimés. Cette thèse présente une approche sous l’ATR appliquée aux circuits imprimés d’IS, IP, CEM et multiphysique des circuits imprimés multicouches. Après la description de l’état de l’art, la méthodologie de base de l’approche par l’ATR est décrite à l’aide de la formulation des métriques tensorielles dans le domaine des fréquences. Après définition des éléments primitifs nécessaires pour les structures des circuits imprimés et l’introduction analytique de la méthode KB, le modèle sous l’ATR et des analyses de sensibilité sont comparées avec des simulations « 3D » en utilisant des outils commerciaux et des mesures expérimentales du régime continu jusqu’à des fréquences de quelques gigahertz. Ensuite, le modèle des circuits multicouches est originellement traduit totalement dans le domaine temporel (DT) en définissant les opérateurs temporels appropriés aux éléments dits « primitifs » sous l’ATR. La pertinence du modèle ATR en DT est vérifiée par des comparaisons avec des simulations é3D » et des mesures de circuits multicouches en prenant en compte des signaux de débits de l’ordre du gigabit par seconde. Dans la partie suivante, des modèles innovants élaborés via l’ATR pour la CEM en modes rayonnés des cartes multicouches sont étudiés en considérant des couplages entre champs électromagnétiques et cartes multicouches. La modèle élaboré sous l’ATR pour la CEM des modes rayonnés est validé avec un scénario composé de circuits imprimés multicouches avec une ligne d’interconnexion en forme de « Z » agressés par des rayonnements électromagnétiques émis dans différentes directions de propagation, et aussi avec un couplage rayonné entre un circuit microruban avec une ligne en forme de « I » et un circuit multicouche. Puis, une analyse multiphysique complètement originale d’un circuit multicouche sous agression de cycle thermique est développé toujours sous le formalisme de l’ATR en traitant des phénoménologies électromécaniques. Après avoir formulé l’expression des sous-systèmes monophysiques, la métrique multiphysique du circuit multicouche sous agression de cycle thermique est élaborée. La faisabilité de cette analyse multiphysique est vérifiée à l’aide d’une preuve de concept d’un circuit à quatre couches. La dernière partie de cette thèse est consacrée à la CEM en mode conduit d’un circuit imprimé composé d’interconnexions multicouches, de composants passifs et de circuits intégrés comme composants actifs. Il est démontré que l’approche par l’ATR permet d’hybrider des modèles analytiques, numériques, et les standards IC-EMC et IBIS afin de réaliser une analyse pertinente de la CEM des cartes multicouches. Ce modèle typiquement système permet de prédire des niveaux de bruits émis par des perturbations CEM liées aux courants de perturbation induits par des circuits intégrés, via une matrice impédance de transfert dans les domaines des fréquences et du tempsThe modern electronic printed circuit boards (PCBs) require challenging signal integrity (SI), power integrity (PI) and electromagnetic compatibility (EMC) analyses. The PCB analysis conventional computational methods do not allow to pose and to analyse theoretically most of problems. However, the Kron’s method completed by Branin’s one based tensorial analysis of networks (TAN) promises a complex PCB analyses possibility. The TAN formalism applied to mesh space allows the PCB compact modeling and direct Lagrangian expression. This thesis introduces multilayer PCBs SI, PI, EMC, and Multiphysic TAN approaches. After the state-of-the-art description, the TAN modelling basic methodology by the way of tensorial metric formulation applied to PCB analysis in the frequency domain is developed. After the definitions of primitive elements necessary to investigate the PCB structure and the KB method introduction, the TAN model is validated from DC to some gigahertz with commercial tool « 3D » EM full-wave simulations and experimental measurements added by sensitivity analyses. Then, the multilayer PCB TAN is originally translated into innovative direct time-domain (TD) model by defining the primitive element appropriate TD operators. The TD TAN model efficiency is verified with multilayer PCB 3D simulation and measuremet comparisons by considering multigigabits-per-second high-speed signals. In the next part, original multilayer PCB radiated EMC TAN models are investigated via EM field coupling onto the PCBs. The radiated EMC model is validated with a scenario consisted of « Z »-shape multilayer PCB aggressed by radiated EM plane waves in different propagation directions and radiated coupling between multilayer and « I »-shape line microstrip PCBs. Then, a completely original Multiphysics TAN of multilayer PCB under thermal cycle aggression is developed by dealing with electrothermomechanical phenomena. After formulating monophysics subsystem TAN expression, the Multiphysics metrics of multilayer PCB under thermal cycle aggression id elaborated. The TAN Multiphysics analysis feasibility is verified with a four-layer proof-of-concept. The last part of this thesis is devoted to conducted EMC TAN of PCB system comprised of multilayer interconnects, passive components and active integrated circuit (IC) elements. It is shown that the TAN approach enables to hybridize the analytical, numerical, IC-EMC and IBIS standard models to perform a multilayer PCB EMC relevant analysis. This system level model allows to compute the EMC noises induced by IC perturbation currents with an innovative transfer matrix impedance in both frequency and time domains
5
Hickam, James William III 1956. „Paperless planning in printed circuit board manufacturing“. Thesis, The University of Arizona, 1990. http://hdl.handle.net/10150/277250.
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One of the aspects of Computer Integrated Manufacturing is the ability to provide current work instructions to the operator at their workstation on a terminal or graphic monitor. The problem is, today, paperless planning is displayed to the operator one page at a time, making the operator report the completion or not completion of that task before showing the next page. This allows the operator no freedom of choice in how to do the job, which leads to reduced productivity and quality. A possible solution is presented by structuring the planning instructions and enhancing the workstation. The operator can be allowed to do the work the way he or she feels the most comfortable and yet, ensure the work is done according to design requirements.
6
Kubik, Jan [Verfasser]. „Printed Circuit Board Fluxgate Sensors / Jan Kubik“. Aachen : Shaker, 2009. http://d-nb.info/1161308342/34.
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7
Moorhouse, Colin. „Laser processing of printed circuit board materials“. Thesis, Heriot-Watt University, 2006. http://hdl.handle.net/10399/195.
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8
Lim, Geok H. „Vibration analysis of a printed circuit board“. Thesis, Aston University, 2000. http://publications.aston.ac.uk/15341/.
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The reliability of the printed circuit board assembly under dynamic environments, such as those found onboard airplanes, ships and land vehicles is receiving more attention. This research analyses the dynamic characteristics of the printed circuit board (PCB) supported by edge retainers and plug-in connectors. By modelling the wedge retainer and connector as providing simply supported boundary condition with appropriate rotational spring stiffnesses along their respective edges with the aid of finite element codes, accurate natural frequencies for the board against experimental natural frequencies are obtained. For a PCB supported by two opposite wedge retainers and a plug-in connector and with its remaining edge free of any restraint, it is found that these real supports behave somewhere between the simply supported and clamped boundary conditions and provide a percentage fixity of 39.5% more than the classical simply supported case. By using an eigensensitivity method, the rotational stiffnesses representing the boundary supports of the PCB can be updated effectively and is capable of representing the dynamics of the PCB accurately. The result shows that the percentage error in the fundamental frequency of the PCB finite element model is substantially reduced from 22.3% to 1.3%. The procedure demonstrated the effectiveness of using only the vibration test frequencies as reference data when the mode shapes of the original untuned model are almost identical to the referenced modes/experimental data. When using only modal frequencies in model improvement, the analysis is very much simplified. Furthermore, the time taken to obtain the experimental data will be substantially reduced as the experimental mode shapes are not required.In addition, this thesis advocates a relatively simple method in determining the support locations for maximising the fundamental frequency of vibrating structures. The technique is simple and does not require any optimisation or sequential search algorithm in the analysis. The key to the procedure is to position the necessary supports at positions so as to eliminate the lower modes from the original configuration. This is accomplished by introducing point supports along the nodal lines of the highest possible mode from the original configuration, so that all the other lower modes are eliminated by the introduction of the new or extra supports to the structure. It also proposes inspecting the average driving point residues along the nodal lines of vibrating plates to find the optimal locations of the supports. Numerical examples are provided to demonstrate its validity. By applying to the PCB supported on its three sides by two wedge retainers and a connector, it is found that a single point constraint that would yield maximum fundamental frequency is located at the mid-point of the nodal line, namely, node 39. This point support has the effect of increasing the structure's fundamental frequency from 68.4 Hz to 146.9 Hz, or 115% higher.
9
Li, Weiping. „Large-area, low-cost via formation and metallization in multilayer thin film interconnection on Printed Wiring Boards (PWB)“. Diss., Georgia Institute of Technology, 1999. http://hdl.handle.net/1853/19641.
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10
Cresci, David John. „On-wafer characterization of ground vias in multilayer FR-4 printed circuit boards at RF/microwave frequencies“. Thesis, Georgia Institute of Technology, 1998. http://hdl.handle.net/1853/15806.
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11
Lehmann, Peter W. „Printed circuit board manufacturing process improvement drill optimization“. Menomonie, WI : University of Wisconsin--Stout, 2005. http://www.uwstout.edu/lib/thesis/2005/2005lehmannp.pdf.
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12
Chan, Ching-Yuen. „Cell controller for printed circuit board assembly rework“. Thesis, University of Salford, 1994. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.386432.
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13
Wang, Lei. „Printed Circuit Board Design for Frequency Disturbance Recorder“. Thesis, Virginia Tech, 2005. http://hdl.handle.net/10919/30917.
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The FDR (Frequency Disturbance Recorder) is a data acquisition device for the power system. The device is portable and can be used with any residential wall outlet for frequency data collection. Furthermore, the FDR transmits calculated frequency data to the web for access by authorized users via Ethernet connection. As a result, Virginia Tech implemented Frequency Monitoring Network (FNET) with these FDR devices. FNET is a collection of identical FDRs placed in different measurement sites to allow for data integration and comparison. Frequency is an important factor for power system control and stabilization. With funding and support provided by ABB, TVA and NSF the FDRs are placed strategically all over the United States for frequency analysis, power system protection and monitoring.
The purpose of this study is to refine the current FDR hardware design and establish a new design that will physically fit all the components on one Printed Circuit Board (PCB). At the same time, the software that is to be implemented on the new board is to be kept similar if not the same as that of the current design. The current FDR uses the Axiom CME555 development board and it is interfaced to the external devices through its communication ports. Even through the CME555 board is able to meet the demands of the basic FDR operations, there are still several problems associated with this design. This paper will address some of those hardware problems, as well as propose a new board design that is specifically aimed for operations of FDR.
Master of Science
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Hardock, Andreas [Verfasser]. „Design of Passive Microwave Components on Multilayered Printed Circuit Boards Using Functional Vias / Andreas Hardock“. Aachen : Shaker, 2016. http://d-nb.info/1118259351/34.
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Lofgren, Christopher Bradley. „Machine configuration of flexible printed circuit board assembly systems“. Diss., Georgia Institute of Technology, 1986. http://hdl.handle.net/1853/24293.
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Altman, Elizabeth Jane. „Cost and quality drivers in printed circuit board assembly“. Thesis, Massachusetts Institute of Technology, 1992. http://hdl.handle.net/1721.1/12783.
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Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1992 and (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1992.Includes bibliographical references (leaves 55-56).
by Elizabeth Jane Altman.
M.S.
17
Alvi, Mohammed Imtiaz. „Dynamic job quoting system for printed circuit board fabrication“. FIU Digital Commons, 2000. http://digitalcommons.fiu.edu/etd/1274.
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This research deals with the development of a dynamic job quotation system for printed circuit board (PCB) fabrication, which can estimate the price and completion time of a job based on customer preference and current capacity of the shop floor. The primary purpose of building a dynamic quotation system is to maximize the company's profit by quoting optimum lead-time and competitive price for the day-to-day orders received from different customers and original equipment manufacturers.
The system was developed using MS-Access relational database. Evaluating the output of the system it was observed that the dynamic system provided more reliable estimation of the lead-time needed for fabricating new jobs. The overall price quoted by the system was competitive with higher profit margin when compared to traditional static systems.
This system would therefore provide a vital link between the job quoting and scheduling system of the firm enabling better utilization of the available resources.
18
Tucker, Joseph C. „Ultrasonic welding of copper to laminate circuit board“. Link to electronic thesis, 2002. http://www.wpi.edu/Pubs/ETD/Available/etd-0429102-124154.
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19
Rakkarn, Sakchai. „OPERATION ASSIGNMENT WITH BOARD SPLITTING AND MULTIPLE MACHINES IN PRINTED CIRCUIT BOARD ASSEMBLY“. Case Western Reserve University School of Graduate Studies / OhioLINK, 2008. http://rave.ohiolink.edu/etdc/view?acc_num=case1201021027.
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Cohn, Amy Mainville, Michael J. Magazine und George G. Polak. „An Optimal Algorithm for Integrating Printed Circuit Board Manufacturing Problems“. Massachusetts Institute of Technology, Operations Research Center, 2000. http://hdl.handle.net/1721.1/5209.
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Printed circuit boards appear in a wide array of products and thus their production is crucial to the contemporary electronics industry. A global approach to planning the complex and multi-stage production process is currently intractable. Nonetheless,significant improvements can be made by integrating closely related elements within the planning process. We focus here on the integration of two key problems -- product clustering and machine setup. In the product clustering problem, board types with similar component requirements are clustered together for assembly under a common configuration of the pick-and-place machine. In the machine setup problem, an optimal configuration of the pick-and-place machine is found for each of these clusters. In practice and in the literature, the product clustering and machine setup problems are typically solved sequentially. By instead solving the two problems simultaneously, we are able to find an optimal tradeoff between processing and setup times. We present the Integrated Clustering and Machine Setup model as a set partitioning problem. We describe a branch-and-price algorithm for solving this exponentially large problem. We introduce a rank-cluster-and-prune, a method for solving the imbedded pricing problems by combinatorial search, and conclude with computational results.
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Jadhav, Pradip Dinkarrao Smith Jeffrey S. „Simulation modeling and analysis of printed circuit board assembly lines“. Auburn, Ala., 2005. http://repo.lib.auburn.edu/2005%20Fall/Thesis/JADHAV_PRADIP_39.pdf.
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Nguyen, Minh Tam Tran. „Reliability Assessment of Ion Contamination Residues on Printed Circuit Board“. Scholar Commons, 2013. http://scholarcommons.usf.edu/etd/4551.
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Ion contaminants from Printed Circuit Board (PCB) assembly processes pose a high reliability risk because they result in damaged circuits. Therefore, it is essential to understand the level of ionic species on the electronic circuitry as well as the reliability risks caused by these contaminants. There are a number of approaches available in the industry to assess the reliability risks ; for example, the water drop test (WDT) is one of the techniques used to determine the propensity of an ionic contaminant to cause electrical short failures by dendrite formation. The objective of this research is to determine the time to cause the failures, known as electrochemical migration (ECM) failures. A test vehicle was developed for the WDT to obtain the time to cause ECM failure in presence of different anions. The time to form dendritic bridges that cause short circuits was determined as a function of the different anions and the spacings between PCB pads. The experimental method involved dispensing aqueous solutions containing common inorganic and organic acid anions onto test vehicles, applying electrical bias voltages and measuring the time to form dendrites. Specially designed test structures cells were created to contain the test solutions. At each of the test cells, a cavity held the solution and constant current was applied through different metal geometries. To be representative of popular board finishes, test vehicle boards incorporated both Sn-Pb Hot Air Soldering Level (HASL) and Pb free HASL surface finishes.
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Sarathy, Vasanth. „Physical modeling of electrical conduction in printed circuit board insulation“. Thesis, Massachusetts Institute of Technology, 2005. http://hdl.handle.net/1721.1/34357.
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Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005.Includes bibliographical references (p. 297-301).
This thesis is concerned with understanding the degradation of electrical and electronic components in automobiles due to environmental effects. A special emphasis is placed on understanding the physical processes underlying the degradation, so that accelerated reliability tests can be specified with increased confidence of their validity. As a first case,printed circuit board (PCB) insulation was selected as a target for investigation. With an increase in the electronics and circuit miniaturization coupled with an increase in voltage in 42 volt as well as hybrid vehicles, PCB reliability has become an important issue. We first provide a broad presentation of insulation degradation theory as well as electrical conduction theory according to existing literature and then narrow our focus towards printed circuit board insulation. We develop a novel first-order mathematical model to describe electrical currents in printed circuit board insulation as a function of temperature, relative humidity, absorbed moisture content, voltage and geometrical characteristics. This model was developed from a series of experiments that were carefully performed under controlled laboratory conditions. In addition to describing the experimental procedure and results, we also explain the details of the experimental setup and measurement instrumentation. Furthermore, we present an intuitive physical explanations for some observations and model responses.
by Vasanth Sarathy.
S.M.
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Foster, Andrew Wallace. „Predicting solder defects in printed circuit board assembly (PCBA) process“. Thesis, Massachusetts Institute of Technology, 2019. https://hdl.handle.net/1721.1/122584.
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Thesis: M.B.A., Massachusetts Institute of Technology, Sloan School of Management, 2019, In conjunction with the Leaders for Global Operations Program at MITThesis: S.M., Massachusetts Institute of Technology, Department of Civil and Environmental Engineering, 2019, In conjunction with the Leaders for Global Operations Program at MIT
Cataloged from PDF version of thesis.
Includes bibliographical references (pages 72-76).
Printed circuit boards (PCBs) are core components of virtually every modern electronic device, from smartphones to servers. Accordingly, printed circuit board assembly (PCBA) has become core to Flex, a leading electronics manufacturing services (EMS) company. As the EMS industry continues to automate the PCBA process, it captures more data and creates opportunities to leverage this data and to generate value through analytics. One such promising opportunity is using defect prediction to improve downstream yields. For instance, x-ray inspection, which mostly detects solder defects, has a yield of about 97% for one of Flex's automated PCBA lines, and an improvement even to just 98% would create significant cost savings. Given this opportunity, this project aims to use the new data captured by the first steps in the automated PCBA process to predict solder defects that are usually identified during inspection, several days after the board begins the PCBA process. Specifically, the proposed boosted trees model uses data on 20,000 solder pads to predict whether an entire board will fail a downstream x-ray test. Other, more granular models are also studied, as well as other predictive models such as logistic regression and convolutional neural network models. The model is able to identify defective PCBs with an AUC of 0.74 and improve x-ray inspection yields from 97% to 98%, using one PCBA line at Flex as a case study. A second additional use case would reduce the number of x-ray inspection machines needed. Furthermore, a pilot implementation demonstrated that the model works well enough to enable these savings to be realized in practice. At the site where this study was conducted, these two use cases are estimated to produce significant savings over the seven-year useful life of the PCBA machinery. Since Flex has over 1,500 PCBA sites, the results of this case study suggest that there is potential to scale these analytics and related savings across the company.
by Andrew Wallace Foster.
M.B.A.
S.M.
M.B.A. Massachusetts Institute of Technology, Sloan School of Management
S.M. Massachusetts Institute of Technology, Department of Civil and Environmental Engineering
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Norman, Susan K. „HEURISTIC APPROACHES TO BATCHING JOBS IN PRINTED CIRCUIT BOARD ASSEMBLY“. University of Cincinnati / OhioLINK, 2001. http://rave.ohiolink.edu/etdc/view?acc_num=ucin997881019.
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Lin, Wei-liang. „Planning under demand and capacity uncertainty in printed circuit board assembly /“. Digital version accessible at:, 1998. http://wwwlib.umi.com/cr/utexas/main.
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Genc, Cem. „Mechanical Fatigue And Life Estimation Analysis Of Printed Circuit Board Components“. Master's thesis, METU, 2006. http://etd.lib.metu.edu.tr/upload/3/12607473/index.pdf.
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In this thesis, vibration induced fatigue life analysis of axial leaded Tantalum &Aluminum capacitors, PDIP and SM capacitors mounted on the printed circuit boards are performed. This approach requires the finite element model, material properties and dynamic characteristics of the PCB. The young modulus of the PCB material is obtained from 3 point bending tests, resonance frequencies are obtained from modal tests and transmissibility&
#8217
s of the PCB are obtained from transmissibility tests which are used as fatigue analysis inputs. Step Stress Tests are performed to obtain failure times of the tested electronic components which are also used as the numerical fatigue analysis inputs. Consecutively, fatigue analysis of a sample PCB used in military systems is aimed since it is important to compare the calculated fatigue damage to estimated life limits in order to determine which component(s), if necessary, must be moved to positions of lower damage . For this purpose, power PCB of the power distribution unit used in Leopard 1 battle tank is examined. Numerical fatigue analysis coupled with accelerated life test whose profile is convenient to military platforms is performed. Furthermore, the effects of eccobond and silicone on the fatigue life of the components are also surveyed since these techniques are common in electronic packaging. In addition, mean-time-to-failure values are obtained for the tested components by using Weibull distribution. Finally, sensitivity analysis is performed to indicate the effect of certain parameters on the fatigue life of a sample axial leaded capacitor.
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Shina, Sammy G. „A design quality and cost model for printed circuit board assembly /“. Thesis, Connect to Dissertations & Theses @ Tufts University, 1998.
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Thesis (Ph.D.)--Tufts University, 1998.Adviser: Anil Saigal. Submitted to the Dept. of Mechanical Engineering. Includes bibliographical references. Access restricted to members of the Tufts University community. Also available via the World Wide Web;
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Kasturi, Vijay. „The influence of printed circuit board design on TEM cell measurements“. Diss., Rolla, Mo. : University of Missouri-Rolla, 2007. http://scholarsmine.mst.edu/thesis/pdf/Kasturi_09007dcc8048d628.pdf.
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Thesis (M.S.)--University of Missouri--Rolla, 2007.Vita. The entire thesis text is included in file. Title from title screen of thesis/dissertation PDF file (viewed March 24, 2008) Includes bibliographical references (p. 105-106).
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Lape, Jeffrey L. „A printed circuit board manufacturer's compliance with pretreatment requirements : case study /“. Master's thesis, This resource online, 1991. http://scholar.lib.vt.edu/theses/available/etd-01202010-020301/.
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ZHANG, SONG-NIAN, und 張松年. „The buying behavior of multilayer printed circuit board“. Thesis, 1990. http://ndltd.ncl.edu.tw/handle/48837554274012724414.
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Ho, Chin-Kai, und 何晉凱. „Research for Integrated Capacity Planning of Multilayer Printed Circuit Board“. Thesis, 2001. http://ndltd.ncl.edu.tw/handle/27704909940102021815.
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碩士元智大學
工業工程研究所
89
The feature of the PCB production is all depending on the customer’s request. Nevertheless the capacity requirement will be changed by the order as well. Due to the complexity of PCB manufacturing process, the procedure of production can be divided into approximate 40 process cells. And each process cell has it’s subsidiary. Therefore, how to optimize the efficiency of the production and outsourcing in manufacturing planning and allocating manpower under the limited resource and minimum cost is the most important concern. This research presents the capacity planning of the PCB factory and constructs 4 integrate capacity planning models of 2 levels. This planning model aims at minimum the integrated manufacturing cost. And the influence of the variable manufacturing costs which including subcontracts, delay, overtime, idle machine and idle manpower will be taken into account. The production order related information input under the limited resource, manpower and machine capacity will be considered as well. In level one, it will obtain the optimal amount allocation between the manufacturing or subcontract. It can also analyze the idle machine during in the production line and the product delay amount. In level two, it can obtain the optimal manpower distribution in check station and the optimal drill machine capacity time distribution in the drill station. The analysis of the overtime, idle time and idle machine will be provided. Finally, this research presents the optimal capacity planning method to adapt the details of the production planning and scheduling planning.
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Kao, Hung-Chang, und 高宏璋. „Computer Aided Routing Planning for Multilayer Printed Circuit Board Fabrication“. Thesis, 2001. http://ndltd.ncl.edu.tw/handle/06734085568879298934.
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碩士元智大學
工業工程研究所
89
The attribute of the Taiwan PCB industry is belong to the Original Equipment Manufacturing（OEM）, namely accept client refer to produce bare board. Therefore, it is important to fight for produce time and grasp of the cost, but the manufacturing routing planning of the current Taiwan PCB industry all proceed from the manual. To face the circuit board become fine thread、small eyelet and Multilayer, how aim at the discrepancy of the product individual to provide a efficiency、economically and flexibility manufacturing routing may become a cardinal lesson. Aim at this problem this research drawing out a systematicness manufacturing routing analysis method to find out every workable routing and studying each workable routing’s quality. This research is used as the basic frame that manufacture routing planning regarding the assemble structure of the product and use the distribute condition of buried and blind holes to decide the laminate sequence. According to this frame and sequence to harmony with various processing technique to find out each workable routing. Finally, use “Three Factor Weight Analysis Method” from quality、cost and process time three aspect to estimate the quality of each manufacture routing. By setting factor score and weight we can get a routing who fit production’s characteristic more flexibly and economically. This method can hold true of shortening designing cycle and bring down production cost. And under this premise to find out the manufacturing routing that match user''s expectation and product attribute most.
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Chan, Tung-Hsien, und 詹東賢. „The Application of Spread Spectrum in Multilayer Printed Circuit Board Design“. Thesis, 2011. http://ndltd.ncl.edu.tw/handle/03561805744938073978.
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碩士國立臺灣海洋大學
電機工程學系
99
The purpose of this study is to investigate the current in the industry common notebook computer, using spread spectrum (Spread Spectrum) technology will be the signal energy extended to a wider frequency range, and this method can effectively inhibit the clock system EMI. The reason why I study this subject as the direction and paper, real people in today's human body for electromagnetic waves formed by the impact and injury, there is increasing emphasis on the trend. In this paper, using the standard EMI / EMC laboratory and measurement equipment, high-speed clock for the suppression, validation parameters to adjust the various spread-spectrum EMI suppression after the impact, because each harmonic will be attenuated peaked, it can be effective The decrease system noise generated by electromagnetic interference. Hope from this study with the experimental results of the study, who wish to study and understand the other advanced industry who provided the insight of individuals.
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Chiang, Cheng-Yang, und 蔣承洋. „Material Planning to Integrate BOM and Routing of Multilayer Printed Circuit Board“. Thesis, 2001. http://ndltd.ncl.edu.tw/handle/10577309192347220231.
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碩士元智大學
工業工程研究所
89
The major type of Printed Circuit Board industry in Taiwan is Original Equipment Manufacturing (OEM), of which products are highly customerized, and belonging the BTO type. As for the specifications and types of products are accompanied with variable customer demands; thus, the differentials of applications on materials and procedures can be easily made. This thesis focuses on solving the material demands of multi-layer PCBs during the pre-schedule period. The main body is divided into three parts as following: 1. Under the circumstances that the order forms data and Routing are already known, combine the information of BOM and Routing. Therefore, evaluate the required material items and quantities of each flowing within the actual manufacturing procedure. 2. Develop an Integer-programming model to evaluate each item of materials based on purchasing rules, which include the demands during planning period or single demand order, to make the lowest stock cost. 3. Pinpoint the demands to use variable materials, so that a Dynamic Safety Stock model has been developed to calculate the adapted stock quantity, minimizing un-necessary stock. As the research results, the required items and quantities of materials are calculated based on each single order form. Also the types of purchasing each item of materials are determined to lower the cost. Then, concentrate on the items of materials, which require safety stock setup to search for the variable factor that influences demand. Finally, the setup value of safety stock can be fitted the real manufacturing demand.
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Bhat, Shriram N. „Studies In Micro Interconnections In Printed Wiring Board“. Thesis, 2008. http://hdl.handle.net/2005/846.
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Trend towards downsizing the product size and at the same time to bring more functionality in electronic products, demands electrically interconnecting several miniaturized electronic components with high counts of I\Os (Input/Out put) on smaller and smaller size printed wiring boards [PWB]. These miniature components occupy lower foot print area but require higher routing interconnection densities. However, the conventional multilayer board technologies exhibit limitations when there is need to connect very high I\O components such as ball grid arrays, which require blind and buried interconnections within the multilayer mono-block. This limitation has given raise to newer methods of multi layer construction.
Build–up multilayer PWB is now the technology of choice for enhanced routing capability including blind and buried interlayer connections. Build up methods are based on making very small vias within dielectric layers followed by metalisation. Typically blind and buried vias are very small, and hence called “micro vias” connecting the layers selectively within the multilayer mono-block. Buried vias make the interconnection between the consecutive layers, and blind vias connect the surface layers to any one of the interior layers in the build up multilayer board. If the blind vias are filled with a dielectric, the entire top and bottom surface area becomes available for high -density component mounting.
The crux in build up board technologies is the method of creating micro-holes; a micro hole is a hole, which is less than 150 micro meter in diameter. Efforts are made to replace existing metalising techniques with “paste filling” methodologies, which would result in “SOLID CONDUCTING VIAS” CALLED AS “MICRO -INTERCONNECTS” The work reported in this thesis aims at demonstrating one such innovative ‘solid conducting via’ formation without using any of the known micro-hole formation techniques. Based on the results obtained some useful conclusions have been drawn which will perhaps go a long way in the name of “PRINTED PILLAR TECHNOLOGY” a novel methodology for building multilayer suitable for very high I\O components such as “ball grid arrays.”
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Kuo, Jiann-Chang, und 郭建昌. „Evaluation and Analysis of Integrated Nesting and Manufacturing Cost of Multilayer Printed Circuit Board“. Thesis, 1999. http://ndltd.ncl.edu.tw/handle/24392436796564090564.
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碩士元智大學
工業工程研究所
87
Manufacturing process of Printed Circuit Board(PCB) is processed by panel on which can been put several pieces of boards simultaneously as a unit. But size of panel influenced by working machine and the number and the nesting way of boards will affect actual processing size of the panel. Different panel size has a relation to use of processing material and arranged quantities and nesting way of boards also has a great effect upon the length of processing time. All the above-mentioned factors effect upon how much the cost of producing one piece of board directly. So need to evaluate cost of the nesting way of boards on panel along with the cutting way to unprocessed panel to find out the way of the best cost to process before actual processing. In this research project propose regular-symmetry nesting method of board , cutting and arrangement method of panel and model of manufacturing cost evaluate which focus on boards nesting on panel and panels arrangement on laminate to do integrated evaluation for cost of manufacturing and material waste of different nesting and arrangement ways. To find out the best nesting way of boards on panel and arrangement way of panel on laminate to make a balance between waste cost of laminate and board’s manufacturing cost getting board’s nesting way on panel and panel’s arrangement way on laminate on processing providing reference for manufacturing process planning.
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Shih, Chih-Syuan, und 施智軒. „Design and Implementation of Miniaturized Bandpass Filters Using Integrated Passive Device and Multilayer Printed Circuit Board Process Technologies“. Thesis, 2011. http://ndltd.ncl.edu.tw/handle/79704059690019984049.
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碩士國立中山大學
電機工程學系研究所
99
This thesis realizes miniature bandpass filters using integrated passive device technology. The bandpass filters are designed based on coupled resonator method with single-band and dual-band responses, using a transformer structure with high-density winging pattern. In addition, the designs adopt the electric- and magnetic-field cancellation and the feedback mechanism to produce transmission zeros in the filter responses for enhancing selectivity and stopband rejection. In order to satisfy the specific requirements of commercial bandpass filter products, this thesis designed and implemented a trisection filter with cross coupling on a low-loss RT/Duroid substrate to generate a transmission zero very near the passband.
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Hsiao, Chen-Hsuan, und 蕭楨軒. „Design of the Transition from an End Launch Connector to a Microstrip Line on a Multilayer Printed Circuit Board“. Thesis, 2018. http://ndltd.ncl.edu.tw/handle/kc288b.
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碩士國立交通大學
電信工程研究所
107
This paper discusses the transition of an end launch connector to a microstrip line on a multilayer printed circuit board (PCB). By analyzing the current return path of the microstrip line, the segmentation method is proposed, and the electrical model is extracted. We found that the substrate integrated waveguide (SIW) must be considered as part of the transition structure to fully establish the electrical model of the transition.
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Chen, Po-Shen, und 陳柏升. „The Analysis of Ground Bounce Problem in Multilayer Printed Circuit Boards“. Thesis, 1999. http://ndltd.ncl.edu.tw/handle/70878981636946577299.
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Wu, Tsung-Ta, und 吳棕達. „Effects of DK and PIM by Printed Circuit Board Material Section on Printed Circuit Board Antenna“. Thesis, 2018. http://ndltd.ncl.edu.tw/handle/w4c45n.
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碩士國立中央大學
通訊工程學系在職專班
106
This paper investigates the material select for Printed Circuit Board and how do the Dielectric Constant and PIM influence on the antennas of Printed Circuit Board. There are four parts in this paper. First, we focus on the design, use, process architecture, stacking of Printed Circuit Board and the reliability testing and electronic testing of Printed Circuit Board. Second, we focus on Dielectric Constant, then provide high-frequency material suggestion base on Dielectric Constant value, Dielectric loss, thermal expansion coefficient and thermal conductivity. Third, selected based on passive intermodulation (PIM) as a reference for Printed Circuit Board antenna. Fourth, taking the Dielectric Constant layer corresponding to different antenna patch sizes as an experiment, Provides verification through passive intermodulation strategies and different materials subject to passive intermodulation interference, summarizes the reference for circuit board material manufacturing. The results show that the combination of thicker circuit materials and low Dielectric Constant is more advantageous for antenna radiation design, but it is more disadvantageous for feeders. Passive intermodulation interference might cause problems for printed circuit board antennas. It affects the distance and frequency of different antennas. Passive intermodulation requires only a very low level of energy to cause problems in these technologies. Passive intermodulation interference is mainly Sensitivity resulting in a passive intermodulation value of -150dBc is a good range of cognitive products
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Yi-Feng, Yang, und 楊宜豐. „Trial preparation of printed circuit board“. Thesis, 2003. http://ndltd.ncl.edu.tw/handle/63939685447882170605.
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碩士中國文化大學
材料科學與製造研究所
91
Printed circuit board (PCB) is a mainstay of electronic industry. It is often made of laminated sheets, mostly copper clad laminate (CCL) which is composed of base paper, resin and copper foils. Aramid fiber has excellent properties such as low density, high tensile strength, high tensile modulus, low moisture content and few impure ions that affect electrical properties, in addition, these recycled aramid fibers have negative thermal expansion coefficient (TEC). Four kinds of base paper were made under different formula conditions, and three different quantities contained dispersing agents were added into paper. By the comparison, such as tensile strength, bursting strength, porosity and paper smoothness, we try to find the ratio of dispersing agents suitable for Kevlar. Then, three kinds of base paper were made under different formula conditions by Vinylon and Kevlar. A series of studies of the physical properties of base sheets, such as tensile strength, bursting strength, porosity and paper smoothness, were experimentally tested and effect factor and performance of the assembled Printed circuit board were discussed. As the result, it was found that the pulp formula of Vinylon:Kevlar=95:5 and NBKP:Kevlar=30:70, 2.0%dispersing agents was added into paper, which have better physical properties than the others.
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Ke, Yen-Chi, und 柯彥圻. „Color Interpolation for Printed Circuit Board“. Thesis, 2013. http://ndltd.ncl.edu.tw/handle/26784205996587031000.
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碩士國立臺灣大學
資訊網路與多媒體研究所
101
There are three basic components on Printed Circuit Board (PCB): the board, the copper, and the solder. Automatic optical inspection aims to segment the solder area and the copper area quickly where the solder is not totally coated on the copper. Therefore, a complete imaging mechanism is very important in inspecting process, which includes image extraction, color interpolation, image enhancement, and image stitching. After these four steps, we will have a complete image for a printed circuit board and we can do further inspection by human or program. In this thesis, we propose a new color interpolation to remove false color and improve the quality of PCB images. Then we will enhance PCB images and stitch then into a full image for further inspection.
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彭志昇, Tz-Sheng Peng, und 彭志昇. „Color-Based Printed Circuit Board Segmentation“. Thesis, 2009. http://ndltd.ncl.edu.tw/handle/37702709893722723644.
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碩士國立臺灣大學
資訊工程學研究所
97
Our method can be briefly divided into three phases: training phases, thresholding phase, and refining phase. We only have to train once. We do not have to train again until we have different color PCB (Printed Circuit Board) images. Thresholding and refining phases are used to segment every image. The goal of training phase is to calculate the centroid of solder color. In thresholding phase, apply an automatic threshold finding algorithm to find the threshold recursively. After thresholding, we want to obtain better result. Consequently, we use connected component analysis to remove the component with too many or too few elements, because solder area is not too big or too small. Calculate the minimum color distance d from the centroid of solder color to connected component. Our method is effective for solder image segmentation. Experiment data show us this method has high-speed and high-precision.
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Pan, Meng-Wei, und 潘孟暐. „Microwave-Enhanced Pyrolysis ofWaste Printed Circuit Board“. Thesis, 2016. http://ndltd.ncl.edu.tw/handle/40845732899575044768.
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碩士國立臺灣大學
環境工程學研究所
104
The concentration of gold in waste printed circuit board （WPCB） used in this study can be up to 20 ppmw, whereas it is only 0.5 ppmw in the gold ore. Moreover, it also contains other precious metals such as silver, platinum, and palladium. Therefore, as one of the most important branches of the waste electrical and electronic equipment （WEEE） stream, if WPCBs can be recycled properly, the city will be an abundant vein of various metals. Besides, urban mining not only achieves materials recycling but also diminishes environmental impact from ore mining. The aim of this study is to provide a simple, high efficiency, and low environment impact technique to recover the metals in WPCBs. By microwave-enhanced pyrolysis （MEP）, the inner layers of WPCBs separated, and thus metal recovery efficiency was enhanced. The maximum weight loss in thermogravimetric analysis （TGA） occurred at 350 °C, which was also achieved by MEP at 300W. Afterwards, the pyrolyzed WPCB was treated by a three-step hydrometallurgical process to recover metals separately. The first two steps are sulfuric acid leaching to dissolve copper and tin. The final stage is the leaching of gold, palladium, and silver by using thiourea and ferric ion.
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蔡忠安. „Automatical Electrical Testing for Flexible Printed Circuit Board“. Thesis, 2012. http://ndltd.ncl.edu.tw/handle/76988149802126720997.
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碩士國立彰化師範大學
電機工程學系
100
Modern technological products are changing every day, and the multifunction characteristics are a basic requirement for the new generation consuming electronics. Therefore the demands of flexible printed circuit (FPC) board used for the product is getting more important as the products are getting lighter. Also, the width of wire width on the FPC is getting smaller. The accuracy and reliability of electrical inspection equipment is required to be better for the FPC fabrication. The objective of this research is to combine 3-axis image processing, angle tuning precision displacement technology for servo control, electrical test software, and precision test fixture automation equipment. An automatic-alignment electrical testing equipment for FPC testing process is developed. There are 2 different parts to be evaluated in this research. The throughputs are 48 and 47 panels by using traditional manual equipment. The throughputs are 101 and 96 panels by using automatic equipment developed in this research. According to experiments, the productivity are increased by 104% and 110% and manual operation costs are reduced.
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LO, WEN-TUNG, und 羅文東. „Electronic Printed Circuit Board PlantFire Prevention Engineering Research“. Thesis, 2005. http://ndltd.ncl.edu.tw/handle/95273266081622891716.
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碩士元智大學
機械工程學系
93
This thesis is to perform a fire safety analysis of a PCB manufacture factory premises which divided into many rooms by way of manufacture process on 6 floors（five floors are aboveground; the other one is the basement）. The zone model CFAST which developed by Building and Fire Research Laboratory of National Institute of Standards and Technology is used to construct a numerical simulation model to predict the upper layer temperature, layer height and CO concentration during postulated fires. A postulated fire was simulated at different rooms to see how different position of a fire can influence the fire condition. After observed these cases studies that described above, then fire prevention and control can put into practice in the similar industrial manufacture factory premises.
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何義才. „Using image analysis in printed circuit board inspection“. Thesis, 2001. http://ndltd.ncl.edu.tw/handle/97528438540373756042.
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碩士國立臺灣科技大學
電機工程系
89
Computer vision has been widely used in on-line inspection of electronic components. In this paper, we present a printed circuit board (PCB) inspection system based on computer vision using several methods, which provides us with an efficient solution for inspecting all kinds of mistakes of component. The PCB inspection system can be divided into two phases: (1) image segmentation and (2) image processing. In image segmentation, we locate the position of PCB by using sobel operator in intensity of image. Then we process our color image with bi-level quantization by using back-propagation neural network and fuzzy c-means clustering method in combination with the algorithm of compared with cluster centers. In part of image processing, we use run-length smoothing in noise cancellation and use run-length labeling to fix the position of component; furthermore we extract character of those components by left and right fallen-point feature extraction. Finally, we simulate the best parameters for all methods, and build the accurate, repeating, and flexible system to inspect components in PCB.
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Ching-Kuang, Peng, und 彭志光. „A Study of Printed Circuit Board Simulative Manufacturing“. Thesis, 1998. http://ndltd.ncl.edu.tw/handle/75452526243522185069.
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碩士中原大學
機械工程研究所
86
The purpose of this study is to create a numerical control machiningsimulation system which includes the function of control and monitoringinterface system, simulation in tool path, remote control and monitoringsystem. We can make up a function of simulative manufacturing, and carryout no-people-factory in software method. This product have been developedfor practical application, and has accomplished automatic assembly function. The design of control and monitoring interface is based on the objectivemethod, and we can build a effective communication with machine by the methodof objective simulation. In tool path simulation the simulation program can be studied from twotopics. The first topic is using this program to calculate the cutter pathof numerical machining, and displaying the graphics on the computer screen.It can verify the numerical control part program before actual cut. The second topic is to convert the cutter path program into NC code inabsolute coordinate form, and this program can be used in any kind of NC controller, and also can be converted into cutter path picture. In addition,we can carry out the mutual communication by the method of network card transmitting data in TCP/IP protocol. Therefore, we can build a simulative factory by the help of the above three functions.
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ZHOU, BING-NAN, und 周炳南. „Design of pattern routher for printed circuit board“. Thesis, 1987. http://ndltd.ncl.edu.tw/handle/29563425909322226738.
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