Thematische Bibliographien / Multilayers printed circuit board

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Auswahl der wissenschaftlichen Literatur zum Thema „Multilayers printed circuit board“

Autor: Grafiati

Veröffentlicht am 28. Juni 2021

Zuletzt aktualisiert am 2. Februar 2022

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Zeitschriftenartikel zum Thema "Multilayers printed circuit board"

Vorunichev, D. S., und K. Yu Vorunicheva. „Current capabilities of prototyping technologies for multilayer printed circuit boards on a 3D printer“. Russian Technological Journal 9, Nr. 4 (26.08.2021): 28–37. http://dx.doi.org/10.32362/2500-316x-2021-9-4-28-37.

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A new direction in 3D printing was investigated – prototyping of single-sided, double-sided and multilayer printed circuit boards. The current capabilities and limitations of 3D printed circuit board printing technology were identified. A comparative analysis of the characteristics of two desktop 3D printers presented in the industry for prototyping radio electronics, as well as the first professional machine DragonFly LDM 2020, which is a mini-factory for prototyping multilayer printed circuit boards, was carried out. The first practical experience of working and printing on DragonFly LDM 2020 supplied to the megalaboratory “3D prototyping and control of multilayer printed circuit boards” of the Institute of Radio Engineering and Telecommunication Systems MIREA – Russian Technological University is presented. The first samples of electronic boards printed on a 3D printer by the method of inkjet printing were obtained. An additive technology for the production of multilayer printed circuit boards is considered: printing with two printheads with conductive and dielectric nano-ink with two curing systems: an infrared sintering system for conductive ink and a UV curing system for dielectric ink. The LDM (Dragonfly Lights-out Digital Manufacturing) production method with the necessary maintenance is presented. The method allows the system to work roundthe-clock with minimal human intervention, significantly increasing the productivity of 3D printing and expanding the possibilities of prototyping. The materials used for 3D printing of multilayer printed circuit boards and their characteristics were investigated: dielectric acrylate nano-ink (Dielectric Ink 1092 – Dielectric UV Curable Acrylates Ink), conducting ink with silver nanoparticles (AgCite™ 90072 Silver Nanoparticle Conductive Ink). The research carried out allows us to compare the technological standards of printed electronics with traditional methods of manufacturing multilayer printed circuit boards for a number of parameters.

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G.W.A.D. „The multilayer printed circuit board handbook“. Microelectronics Reliability 25, Nr. 6 (Januar 1985): 1157. http://dx.doi.org/10.1016/0026-2714(85)90488-3.

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Sisoev, Oleg Yu, Sergey S. Sokolov und Victor A. Tupik. „CHOOSING RATIONAL TRACING PROCEDURE BY CONSTRUCTIVE CRITERION“. Journal of the Russian Universities. Radioelectronics, Nr. 6 (18.01.2019): 5–12. http://dx.doi.org/10.32603/1993-8985-2018-21-6-5-12.

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The analysis of autorouter efficiency in the known CAD systems under structural and technological constraints is carried out. The revealed significant constraints are related to the thermal strength of the wires and possible mutual influence through the electromagnetic field. When manually designing the designer guided by his own experience, can ignore these and other constraints. Unlike a person, the autorouter strictly fulfills all the specified constraints, which, given the topology of the printed circuit board, does not allow tracing to complete. On the other hand, giving greater freedom to the autorouter often makes it impossible to meet the production requirements on permissible parameters of the topological pat-tern, which is the width of the conductors and the gaps between them. The problem of tracing printed circuit boards, including multilayer ones, has become much more complicated with the introduction of integrated circuits in TSOP, MOFP and BGA type enclosures packages with fine-pitch pins, a number of which can reach several hundred. The article investigates the possibility of maximizing printed circuit board topological space with these and other types of enclosures. The necessity of introducing a buffer zone around the component to improve the routing efficiency is explained. It is shown, however, that the avail-ability of a buffer zone does not eliminate the appearance of vias in it, the number of which depends on the routing type. On the basis of the proposed criterion for the autorouter performance, i.e. the ratio of the total wire length to the number of vias, the efficiency of using the topological space of a printed circuit board by three autorouters is analyzed.The presented experimental results of competing routing systems TopoR and Specctra confirmed the possibility to enlarge the pattern area of the printed circuit board for its further use.

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Batutina, M. S., A. A. Kuzmin und A. N. Mikhailov. „TRANSREFLECTOR ANTENNA DESIGN BASED ON FLAT MULTILAYER TRANSREFLECTOR“. Issues of radio electronics, Nr. 2 (20.02.2019): 26–30. http://dx.doi.org/10.21778/2218-5453-2019-2-26-30.

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The paper considers an embodiment of the antenna design based on a flat non‑axis‑symmetrical transreflector made by using multilayer printed circuit board technology. The construction principle of a flat non‑axis‑symmetrical transreflector by cutting it from the flat polarizing structure is given. The form of the flat multi‑layer non‑axisymmetric transreflector board is determined by the projection of the non‑axisymmetric parabolic transflector onto a plane perpendicular to the focal axis. An electrodynamic model of the antenna with a flat non‑axis‑symmetrical reflector to study the radiation characteristics in the UHF range was constructed. A comparative analysis of the radiation characteristics of antennas on the basis of planar multilayer axisymmetric and flat multilayer non‑axis‑symmetrical transreflectors was performed. A number of technological advantages of the developed flat structure over a non‑axis‑symmetrical parabolic transreflector due to use of the known technology of multilayer printed circuit boards is also described.

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Kong, Fan, Weixing Sheng, Xiaofeng Ma und Yubing Han. „Circuit model and signal integrity analysis for multilayer printed circuit board interconnection“. International Journal of RF and Microwave Computer-Aided Engineering 24, Nr. 4 (29.10.2013): 478–89. http://dx.doi.org/10.1002/mmce.20789.

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Bachmann, Friedrich. „Excimer Laser Drill for Multilayer Printed Circuit Boards: From Advanced Development to Factory Floor“. MRS Bulletin 14, Nr. 12 (Dezember 1989): 49–53. http://dx.doi.org/10.1557/s088376940006098x.

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A novel excimer laser process has been developed for generating cylindrical via holes with an aspect ratio of about one. The fabrication process is being successfully run on a production line for a highly miniaturized printed circuit board used for the multichip module in the new Siemens 7500 H 90 mainframe computer. The process is outstanding in terms of reliability and reproducibility. To the best of our knowledge, this is the first that that excimer lasers have been put into large-scale use in an industrial environment.Since signal delay times for chips have decreased much more rapidly than delay times for packaging, the computing speed of high-speed computers is restricted by the packaging techniques used. Therefore, further development of packaging technology became a prime objective for those developing high-performance computers. Packaging delay times had to be reduced drastically to keep up with increasingly shorter chip delay times. This, in effect, meant that a greater packaging density had to be implemented.A novel planar packaging technique has lead to considerable progress in solving this problem. This technique has been described in detail elsewhere. A key component in this technology is a multichip module, which can take in each of 16 areas, either an LSI module with 320 leads or 9 MSI modules with 52 leads as “bare” ICs. This means that a micro-wiring printed circuit board of this kind can accomodate between 16 (LSI) and 144 (MSI) chips. This article describes how these printed circuit boards are manufactured.As the specifications (Table I) show, blind vias 80 μm in diameter at a pitch of 0.5 mm have to be made in a 16-layer printed circuit board. It is intended that these blind vias will provide the through-contact for neighboring layers. The excimer laser plays a major role in this process.

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Kuczynski, J. „Dynamic Mechanical Analysis of Printed Circuit Board Laminates“. International Symposium on Microelectronics 2010, Nr. 1 (01.01.2010): 000630–37. http://dx.doi.org/10.4071/isom-2010-wp3-paper4.

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Printed circuit boards must meet stringent requirements imposed by elevated temperature processes required for mixed-solder and/or Pb-free assembly. To meet these requirements, laminate manufacturers offer a variety of resin formulations, reactive additives, and glass styles designed to impart specific properties. Both the coefficient of thermal expansion (CTE) and the glass transition temperature (Tg) have received considerable attention with respect to design of high-temperature laminates. CTE mismatch between the copper and the laminate within a PCB results in stress upon the copper that may manifest itself as opens within vias, at the interfaces between internal lands and plated-through hole barrels, as well as open traces. Since the CTE of resin materials below the Tg is typically on the order of 5X lower than the CTE above Tg, a typical laminate design strategy is to produce a resin that exhibits a high Tg without adversely impacting other properties. Numerous factors affect the ultimate Tg of the resin, including the functionality of the monomer(s), crosslink density, the cure profile, and absorbed moisture. Within the electronics industry, Tg is determined via differential scanning calorimetry (DSC) as per IPC-TM-650. However, due to the multilayer construction of current circuit boards coupled with sample size limitations, DSC has been shown to be an inadequate technique for measurement of the glass transition temperature. The endotherm in the DSC is often ill defined, of marginal quality, and may be convoluted with stress relaxation and/or volatile outgassing at elevated temperature. Dynamic mechanical analysis (DMA) has been demonstrated to provide far greater information relative to not only the Tg, but also physical property depression due to moisture plasticization and incomplete resin conversion in various high-Tg laminate systems. Several case studies regarding phenolic-cured epoxy resins, cyanate ester/epoxy blends, and/or polyphenylene oxide/triallylisocyanurate blends will be discussed.

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Liu, Jingping, Cheng Yang, Haoyi Wu, Ziyin Lin, Zhexu Zhang, Ronghe Wang, Baohua Li, Feiyu Kang, Lei Shi und Ching Ping Wong. „Future paper based printed circuit boards for green electronics: fabrication and life cycle assessment“. Energy Environ. Sci. 7, Nr. 11 (2014): 3674–82. http://dx.doi.org/10.1039/c4ee01995d.

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A multilayer printed circuit board (PCB) can be fabricated using commercially available printing paper, which shows comparable functionalities with the conventional organic PCBs but 100 times lower environmental impact.

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Takahashi, A., N. Ooki, A. Nagai, H. Akahoshi, A. Mukoh und M. Wajima. „High density multilayer printed circuit board for HITAC M-880“. IEEE Transactions on Components, Hybrids, and Manufacturing Technology 15, Nr. 4 (1992): 418–25. http://dx.doi.org/10.1109/33.159868.

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Wang, Xiang, Wangping Wu, Dingkai Xie, Peng Jiang, Zhizhi Wang und Yi Zhang. „Failure Analysis of Leakage Current for Multilayer Printed Circuit Board“. Journal of Failure Analysis and Prevention 20, Nr. 5 (10.08.2020): 1621–27. http://dx.doi.org/10.1007/s11668-020-00971-1.

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Dissertationen zum Thema "Multilayers printed circuit board"

Ambatipudi, Radhika. „Multilayered Coreless Printed Circuit Board (PCB) Step-down Transformers for High Frequency Switch Mode Power Supplies (SMPS)“. Licentiate thesis, Mittuniversitetet, Institutionen för informationsteknologi och medier, 2011. http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-13967.

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The Power Supply Unit (PSU) plays a vital role in almost all electronic equipment. The continuous efforts applied to the improvement of semiconductor devices such as MOSFETS, diodes, controllers and MOSFET drivers have led to the increased switching speeds of power supplies. By increasing the switching frequency of the converter, the size of passive elements such as inductors, transformers and capacitors can be reduced. Hence, the high frequency transformer has become the backbone in isolated AC/DC and DC/DC converters. The main features of transformers are to provide isolation for safety purpose, multiple outputs such as in telecom applications, to build step down/step up converters and so on. The core based transformers, when operated at higher frequencies, do have limitations such as core losses which are proportional to the operating frequency. Even though the core materials are available in a few MHz frequency regions, because of the copper losses in the windings of the transformers those which are commercially available were limited from a few hundred kHz to 1MHz. The skin and proximity effects because of induced eddy currents act as major drawbacks while operating these transformers at higher frequencies. Therefore, it is necessary to mitigate these core losses, skin and proximity effects while operating the transformers at very high frequencies. This can be achieved by eliminating the magnetic cores of transformers and by introducing a proper winding structure. A new multi-layered coreless printed circuit board (PCB) step down transformer for power transfer applications has been designed and this maintains the advantages offered by existing core based transformers such as, high voltage gain, high coupling coefficient, sufficient input impedance and high energy efficiency with the assistance of a resonant technique. In addition, different winding structures have been studied and analysed for higher step down ratios in order to reduce copper losses in the windings and to achieve a higher coupling coefficient. The advantage of increasing the layer for the given power transfer application in terms of the coupling coefficient, resistance and energy efficiency has been reported. The maximum energy efficiency of the designed three layered transformers was found to be within the range of 90%-97% for power transfer applications operated in a few MHz frequency regions. The designed multi-layered coreless PCB transformers for given power applications of 8, 15 and 30W show that the volume reduction of approximately 40-90% is possible when compared to its existing core based counterparts. The estimation of EMI emissions from the designed transformers proves that the amount of radiated EMI from a three layered transformer is less than that of the two layered transformer because of the decreased radius for the same amount of inductance. Multi-layered coreless PCB gate drive transformers were designed for signal transfer applications and have successfully driven the double ended topologies such as the half bridge, the two switch flyback converter and resonant converters with low gate drive power consumption of about half a watt. The performance characteristics of these transformers have also been evaluated using the high frequency magnetic material made up of NiZn and operated in the 2-4MHz frequency region. These multi-layered coreless PCB power and signal transformers together with the latest semiconductor switching devices such as SiC and GaN MOSFETs and the SiC schottky diode are an excellent choice for the next generation compact SMPS.

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Galia, Jan. „Měnič s tranzistory GaN pro elektrický kompresor“. Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2021. http://www.nusl.cz/ntk/nusl-442787.

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This master’s thesis deals with the design and realization of a functional sample power inverter for an electric compressor, which is used in hybrid cars. The electric compressor powered by the inverter is E-compressor by Garrett Advancing Motion. An inverter will be using modern High Electron Mobility Transistors which are based on gallium nitride (GaN). The purpose of this thesis is to find if GaN transistors can be used in E-boosting application.

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Tarvainen, T. (Timo). „Studies on via coupling on multilayer printed circuit boards“. Doctoral thesis, University of Oulu, 1999. http://urn.fi/urn:isbn:951425189X.

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Abstract Design and manufacturing techniques of printed circuit boards (PCB's) have advanced from early one or two-layer structures to the multilayer boards where ten or more layers are no longer uncommon. These give additional routing space, potential decrease in device size and various design possibilities like solid ground and power planes. Unfortunately multilayer boards are vulnerable to high coupling between signal vias especially due to PCB resonances. In this study via crosscoupling is investigated on multilayer PCB's. Special attention is given to the coupling due to resonances and vertically aligned blind vias. Problem is approached from the electromagnetic compatibility (EMC) point of view and high accuracy of measurements or models is not the objective. Instead ways to increase isolation are considered important. EMC is considered to include internal functionality of the device. Analytical methods are used to calculate resonant frequencies, fields and quality factors for simple rectangular structures. The PCB cavity is reduced to two-dimensions for numerical calculation of same quantities. Aplac finite-difference time-domain simulator is used to model coupling due to PCB resonances. Isolation between vertically aligned blind vias is estimated analytically. A quasi-static numerical model is used to study a coaxial via structure. Multilayer test boards are constructed for measurement purposes. Simplified resonator structures on two-layer boards are used to test different methods to increase isolation. Measurements show that high coupling between vias may occur due to PCB resonances. This leads to the situation, where previously used isolation methods between vias are not necessarily effective enough. Several means to reduce effects of PCB resonances are described in this study. Measured and modelled results agree well from an EMC point of view. Coupling due to vertically aligned blind vias is also shown to be high. A simple capacitance model may be used to approximate this up to frequencies where the dynamic wave nature of the board starts to be important. From a PCB designer's point of view these results mean that when the board size is not small compared to the wavelength, there is a possibility of resonances and reduction methods have to be taken into account. Also placement of the vias have to be carefully selected especially if blind or buried vias are used.

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Xu, Zhifei. „Tensorial analysis of multilayer printed circuit boards : computations and basics for multiphysics analysis“. Thesis, Normandie, 2019. http://www.theses.fr/2019NORMR003.

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Les cartes électroniques modernes nécessitent des analyses avancées d’intégrité du signal (IS), d’intégrité de puissance (IP), et de compatibilité électromagnétique (CEM). Face aux complexités des circuits imprimés, les méthodes de calcul classiques ne permettent ni de poser le problème ni de l’analyser théoriquement. Cependant, l’analyse tensorielle des réseaux (ATR) basée sur la méthode de Kron complétée du modèle de Branin (KB) laisse entrevoir une capacité d’analyse plus avancée des PCB. L’ATR appliquée à l’espace des mailles conduit à une modélisation compacte et une expression lagrangienne directe des circuits imprimés. Cette thèse présente une approche sous l’ATR appliquée aux circuits imprimés d’IS, IP, CEM et multiphysique des circuits imprimés multicouches. Après la description de l’état de l’art, la méthodologie de base de l’approche par l’ATR est décrite à l’aide de la formulation des métriques tensorielles dans le domaine des fréquences. Après définition des éléments primitifs nécessaires pour les structures des circuits imprimés et l’introduction analytique de la méthode KB, le modèle sous l’ATR et des analyses de sensibilité sont comparées avec des simulations « 3D » en utilisant des outils commerciaux et des mesures expérimentales du régime continu jusqu’à des fréquences de quelques gigahertz. Ensuite, le modèle des circuits multicouches est originellement traduit totalement dans le domaine temporel (DT) en définissant les opérateurs temporels appropriés aux éléments dits « primitifs » sous l’ATR. La pertinence du modèle ATR en DT est vérifiée par des comparaisons avec des simulations é3D » et des mesures de circuits multicouches en prenant en compte des signaux de débits de l’ordre du gigabit par seconde. Dans la partie suivante, des modèles innovants élaborés via l’ATR pour la CEM en modes rayonnés des cartes multicouches sont étudiés en considérant des couplages entre champs électromagnétiques et cartes multicouches. La modèle élaboré sous l’ATR pour la CEM des modes rayonnés est validé avec un scénario composé de circuits imprimés multicouches avec une ligne d’interconnexion en forme de « Z » agressés par des rayonnements électromagnétiques émis dans différentes directions de propagation, et aussi avec un couplage rayonné entre un circuit microruban avec une ligne en forme de « I » et un circuit multicouche. Puis, une analyse multiphysique complètement originale d’un circuit multicouche sous agression de cycle thermique est développé toujours sous le formalisme de l’ATR en traitant des phénoménologies électromécaniques. Après avoir formulé l’expression des sous-systèmes monophysiques, la métrique multiphysique du circuit multicouche sous agression de cycle thermique est élaborée. La faisabilité de cette analyse multiphysique est vérifiée à l’aide d’une preuve de concept d’un circuit à quatre couches. La dernière partie de cette thèse est consacrée à la CEM en mode conduit d’un circuit imprimé composé d’interconnexions multicouches, de composants passifs et de circuits intégrés comme composants actifs. Il est démontré que l’approche par l’ATR permet d’hybrider des modèles analytiques, numériques, et les standards IC-EMC et IBIS afin de réaliser une analyse pertinente de la CEM des cartes multicouches. Ce modèle typiquement système permet de prédire des niveaux de bruits émis par des perturbations CEM liées aux courants de perturbation induits par des circuits intégrés, via une matrice impédance de transfert dans les domaines des fréquences et du temps
The modern electronic printed circuit boards (PCBs) require challenging signal integrity (SI), power integrity (PI) and electromagnetic compatibility (EMC) analyses. The PCB analysis conventional computational methods do not allow to pose and to analyse theoretically most of problems. However, the Kron’s method completed by Branin’s one based tensorial analysis of networks (TAN) promises a complex PCB analyses possibility. The TAN formalism applied to mesh space allows the PCB compact modeling and direct Lagrangian expression. This thesis introduces multilayer PCBs SI, PI, EMC, and Multiphysic TAN approaches. After the state-of-the-art description, the TAN modelling basic methodology by the way of tensorial metric formulation applied to PCB analysis in the frequency domain is developed. After the definitions of primitive elements necessary to investigate the PCB structure and the KB method introduction, the TAN model is validated from DC to some gigahertz with commercial tool « 3D » EM full-wave simulations and experimental measurements added by sensitivity analyses. Then, the multilayer PCB TAN is originally translated into innovative direct time-domain (TD) model by defining the primitive element appropriate TD operators. The TD TAN model efficiency is verified with multilayer PCB 3D simulation and measuremet comparisons by considering multigigabits-per-second high-speed signals. In the next part, original multilayer PCB radiated EMC TAN models are investigated via EM field coupling onto the PCBs. The radiated EMC model is validated with a scenario consisted of « Z »-shape multilayer PCB aggressed by radiated EM plane waves in different propagation directions and radiated coupling between multilayer and « I »-shape line microstrip PCBs. Then, a completely original Multiphysics TAN of multilayer PCB under thermal cycle aggression is developed by dealing with electrothermomechanical phenomena. After formulating monophysics subsystem TAN expression, the Multiphysics metrics of multilayer PCB under thermal cycle aggression id elaborated. The TAN Multiphysics analysis feasibility is verified with a four-layer proof-of-concept. The last part of this thesis is devoted to conducted EMC TAN of PCB system comprised of multilayer interconnects, passive components and active integrated circuit (IC) elements. It is shown that the TAN approach enables to hybridize the analytical, numerical, IC-EMC and IBIS standard models to perform a multilayer PCB EMC relevant analysis. This system level model allows to compute the EMC noises induced by IC perturbation currents with an innovative transfer matrix impedance in both frequency and time domains

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Hickam, James William III 1956. „Paperless planning in printed circuit board manufacturing“. Thesis, The University of Arizona, 1990. http://hdl.handle.net/10150/277250.

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One of the aspects of Computer Integrated Manufacturing is the ability to provide current work instructions to the operator at their workstation on a terminal or graphic monitor. The problem is, today, paperless planning is displayed to the operator one page at a time, making the operator report the completion or not completion of that task before showing the next page. This allows the operator no freedom of choice in how to do the job, which leads to reduced productivity and quality. A possible solution is presented by structuring the planning instructions and enhancing the workstation. The operator can be allowed to do the work the way he or she feels the most comfortable and yet, ensure the work is done according to design requirements.

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Kubik, Jan [Verfasser]. „Printed Circuit Board Fluxgate Sensors / Jan Kubik“. Aachen : Shaker, 2009. http://d-nb.info/1161308342/34.

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Moorhouse, Colin. „Laser processing of printed circuit board materials“. Thesis, Heriot-Watt University, 2006. http://hdl.handle.net/10399/195.

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Lim, Geok H. „Vibration analysis of a printed circuit board“. Thesis, Aston University, 2000. http://publications.aston.ac.uk/15341/.

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The reliability of the printed circuit board assembly under dynamic environments, such as those found onboard airplanes, ships and land vehicles is receiving more attention. This research analyses the dynamic characteristics of the printed circuit board (PCB) supported by edge retainers and plug-in connectors. By modelling the wedge retainer and connector as providing simply supported boundary condition with appropriate rotational spring stiffnesses along their respective edges with the aid of finite element codes, accurate natural frequencies for the board against experimental natural frequencies are obtained. For a PCB supported by two opposite wedge retainers and a plug-in connector and with its remaining edge free of any restraint, it is found that these real supports behave somewhere between the simply supported and clamped boundary conditions and provide a percentage fixity of 39.5% more than the classical simply supported case. By using an eigensensitivity method, the rotational stiffnesses representing the boundary supports of the PCB can be updated effectively and is capable of representing the dynamics of the PCB accurately. The result shows that the percentage error in the fundamental frequency of the PCB finite element model is substantially reduced from 22.3% to 1.3%. The procedure demonstrated the effectiveness of using only the vibration test frequencies as reference data when the mode shapes of the original untuned model are almost identical to the referenced modes/experimental data. When using only modal frequencies in model improvement, the analysis is very much simplified. Furthermore, the time taken to obtain the experimental data will be substantially reduced as the experimental mode shapes are not required.In addition, this thesis advocates a relatively simple method in determining the support locations for maximising the fundamental frequency of vibrating structures. The technique is simple and does not require any optimisation or sequential search algorithm in the analysis. The key to the procedure is to position the necessary supports at positions so as to eliminate the lower modes from the original configuration. This is accomplished by introducing point supports along the nodal lines of the highest possible mode from the original configuration, so that all the other lower modes are eliminated by the introduction of the new or extra supports to the structure. It also proposes inspecting the average driving point residues along the nodal lines of vibrating plates to find the optimal locations of the supports. Numerical examples are provided to demonstrate its validity. By applying to the PCB supported on its three sides by two wedge retainers and a connector, it is found that a single point constraint that would yield maximum fundamental frequency is located at the mid-point of the nodal line, namely, node 39. This point support has the effect of increasing the structure's fundamental frequency from 68.4 Hz to 146.9 Hz, or 115% higher.

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Li, Weiping. „Large-area, low-cost via formation and metallization in multilayer thin film interconnection on Printed Wiring Boards (PWB)“. Diss., Georgia Institute of Technology, 1999. http://hdl.handle.net/1853/19641.

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Cresci, David John. „On-wafer characterization of ground vias in multilayer FR-4 printed circuit boards at RF/microwave frequencies“. Thesis, Georgia Institute of Technology, 1998. http://hdl.handle.net/1853/15806.

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Bücher zum Thema "Multilayers printed circuit board"

Kirsch, F. William. Waste minimization assessment for multilayered printed circuit board manufacturing. Cincinnati, OH: U.S. Environmental Protection Agency, Risk Reduction Engineering Laboratory, 1991.

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Noble, P. J. W. Printed circuit board assembly. Boston, MA: Springer US, 1989. http://dx.doi.org/10.1007/978-1-4684-6234-0.

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Castrovilla, Joseph A. The printed circuit board industry. Stamford, Conn., U.S.A: Business Communications Co., 1985.

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Printed circuit board design with microcomputers. New York: Intertext Publications, 1991.

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Prochnow, Dave. 50 powerful printed circuit board projects. Blue Ridge Summit, PA: Tab Books, 1988.

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Printed circuit board designer's reference: Basics. Upper Saddle River, N.J: Prentice Hall Professional Technical Reference, 2004.

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Montrose, Mark I. EMC and the Printed Circuit Board. Hoboken, NJ, USA: John Wiley & Sons, Inc., 1998. http://dx.doi.org/10.1002/047172310x.

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Build your own printed circuit board. New York: McGraw-Hill, 2004.

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Schroeder, Chris. Printed circuit board design using AutoCAD. Boston: Newnes, 1998.

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Buchteile zum Thema "Multilayers printed circuit board"

Zhang, Zhaohang, Weisheng Yang, Jinfeng Liu, Xu Chen und Jianjun Zhu. „Advanced Manufacturing Technology of Microwave Multilayer Printed Circuit Board“. In Lecture Notes in Electrical Engineering, 155–62. Singapore: Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-32-9441-7_16.

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Weik, Martin H. „printed-circuit board“. In Computer Science and Communications Dictionary, 1329. Boston, MA: Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_14620.

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Chilton, Neil. „Printed Circuit Board Fabrication“. In Inkjet Technology for Digital Fabrication, 183–206. Chichester, UK: John Wiley & Sons, Ltd, 2014. http://dx.doi.org/10.1002/9781118452943.ch8.

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Foitzik, Andreas. „Printed Circuit Board Technologies“. In The Electronic Design Automation Handbook, 567–81. Boston, MA: Springer US, 2003. http://dx.doi.org/10.1007/978-0-387-73543-6_24.

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Kohlhammer, Bernd. „Printed Circuit Board Design“. In The Electronic Design Automation Handbook, 582–604. Boston, MA: Springer US, 2003. http://dx.doi.org/10.1007/978-0-387-73543-6_25.

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Archambeault, Bruce R. „Printed Circuit Board Layout“. In PCB Design for Real-World EMI Control, 187–97. Boston, MA: Springer US, 2002. http://dx.doi.org/10.1007/978-1-4757-3640-3_11.

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Seraphim, Donald P., Donald E. Barr, William T. Chen, George P. Schmitt und Rao R. Tummala. „Printed-Circuit Board Packaging“. In Microelectronics Packaging Handbook, 853–921. Boston, MA: Springer US, 1989. http://dx.doi.org/10.1007/978-1-4613-1069-3_12.

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Mardiguian, Michel. „Printed Circuit Board Design“. In Controlling Radiated Emissions by Design, 87–123. Boston, MA: Springer US, 1992. http://dx.doi.org/10.1007/978-1-4615-3102-9_6.

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Edwards, Phillip R. „Printed circuit board manufacture“. In Manufacturing Technology in the Electronics Industry, 130–58. Dordrecht: Springer Netherlands, 1991. http://dx.doi.org/10.1007/978-94-011-3130-8_5.

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Edwards, Phillip R. „Printed circuit board assembly“. In Manufacturing Technology in the Electronics Industry, 159–96. Dordrecht: Springer Netherlands, 1991. http://dx.doi.org/10.1007/978-94-011-3130-8_6.

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Konferenzberichte zum Thema "Multilayers printed circuit board"

Tomimura, Toshio, Yoshihiro Shiotsu, Yasushi Koito, Masaru Ishizuka und Tomoyuki Hatakeyama. „Evaluation of Effective Thermal Conductivity of Multilayer Printed Circuit Board“. In ASME/JSME 2011 8th Thermal Engineering Joint Conference. ASMEDC, 2011. http://dx.doi.org/10.1115/ajtec2011-44232.

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To perform a rational thermal design of a printed circuit board (PCB) with highly anisotropic heat transfer nature in its initial stage, effective thermal conductivities in thickness direction and in in-plane direction must be given depending on the electric circuit of the board. However, a simple evaluation method for the effective thermal conductivities of such PCB has not been developed yet. In this study, as the first step to propose a simple evaluation method, the heat transfer coefficient by natural convection around a horizontal disk, which is indispensable for measuring the effective thermal conductivity, has been evaluated. Furthermore, the thermal conductivity of the glass epoxy resin in in-plane direction has been evaluated by applying the evaluated heat transfer coefficient, and then, the validity of the proposed thermal conductivity measurements of the anisotropic PCB has been confirmed.

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Cocchini, Matteo, Wheling Cheng, Jianmin Zhang, John Fisher, Jun Fan, James L. Drewniak und Yaojiang Zhang. „Differential vias transition modeling in a multilayer printed circuit board“. In 2008 IEEE International Symposium on Electromagnetic Compatibility - EMC 2008. IEEE, 2008. http://dx.doi.org/10.1109/isemc.2008.4652164.

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Hardock, Andreas, Renato Rimolo-Donadio, Heinz-Dietrich Bruns und Christian Schuster. „Double stub matching in multilayered printed circuit board using vias“. In 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC). IEEE, 2012. http://dx.doi.org/10.1109/ectc.2012.6249124.

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Wits, Wessel, Rob Legtenberg, Jan Mannak und Bas van Zalk. „Thermal Management through In-Board Heat Pipes Manufactured using Printed Circuit Board Multilayer Technology“. In 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEEE, 2006. http://dx.doi.org/10.1109/iemt.2006.4456432.

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Borland, William, John J. Felten, Lynne E. Dellis, Saul Ferguson, Diptarka Majumdar, Alton B. Jones, Mark S. Lux, Richard R. Traylor und Marc Doyle. „Ceramic Resistors and Capacitors Embedded in Organic Printed Wiring Boards“. In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35090.

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Combining thick-film and printed wiring board processes allows thick-film ceramic resistors and capacitors to be embedded in printed wiring boards (PWB). The resistor materials are based on lanthanum boride and cover the range of 10 ohm/square to 10 Kohm/square resistivities. The capacitor material is based on doped barium titanate. Both systems are designed to be “thick-film” printed on copper foil in the locations desired in the circuit and the foil is then fired in nitrogen at 900°C to form the ceramic component on the copper foil. The foil is then laminated, component face down, to FR4 using standard prepreg. The inner layer is then etched to reveal the components in a FR4 matrix. The resistors can be trimmed to tight tolerance at this stage and the components tested. The inner layer can then be laminated into a multilayer PWB. The process is described and the influence of board design, PWB processing and materials are presented and discussed. Examples of circuits using embedded thick-film passives are shown and results of reliability studies are presented.

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Mikami, Takao, und Takaya Kobayashi. „Application of Thermo-Viscoelastic Laminated Plate Theory to Predict Warpage of Printed Circuit Boards“. In ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASMEDC, 2009. http://dx.doi.org/10.1115/interpack2009-89266.

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The rapid assembly of printed circuit boards to meet the desired goal of thinning the board creates more complexity in the reflow process, to control the occurrence of warpage in the board. Therefore, certain methods are preferred for simply yet accurately predicting the amount of warpage inevitable in the reflow process. Responding to such a need, the study was carried out aiming to provide a specific numerical method based on the multilayered plate theory, resulting in a simple procedure capable of supplying an accurate estimation of the warped deformation of the board. The estimation results derived from this method were compared with the FEM analysis results and confirmed to be in good agreement. Application of this method is designed for ease of use to estimate the warpage at any stage of planning and design.

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Huang, Qingchou, Shu Zhang und Wanshun Jiang. „A shielded microstrip-to-stripline vertical transition for multilayer printed circuit board“. In 2012 International Conference on Microwave and Millimeter Wave Technology (ICMMT). IEEE, 2012. http://dx.doi.org/10.1109/icmmt.2012.6230045.

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Ghosh, Avali, Sisir Kumar Das und Annapurna Das. „Analysis of radiation coupling from via in multilayer printed circuit board traces“. In 2016 International Conference on ElectroMagnetic Interference & Compatibility (INCEMIC). IEEE, 2016. http://dx.doi.org/10.1109/incemic.2016.7921461.

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You, Hee-Wook, und Jung-Hyuk Koh. „Simulation and fabrication of embedded capacitors in the multilayer printed circuit board“. In 2007 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2007. http://dx.doi.org/10.7567/ssdm.2007.p-2-10.

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Raj, L. David William, K. Roja, J. Sasi Theresa, M. Sathyavani und M. Sumithra. „Elegant Way of Designing Printed Circuit Board via Multilayer Technique Using Ultiboard 12.0“. In 2019 IEEE International Conference on System, Computation, Automation and Networking (ICSCAN). IEEE, 2019. http://dx.doi.org/10.1109/icscan.2019.8878826.

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Berichte der Organisationen zum Thema "Multilayers printed circuit board"

Anderson, J. T. Document Template for Printed Circuit Board Layout. Office of Scientific and Technical Information (OSTI), Januar 1998. http://dx.doi.org/10.2172/1032099.

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Holder, Darryl. Prototype and Short-Run Printed Circuit Board Creation. Fort Belvoir, VA: Defense Technical Information Center, März 1993. http://dx.doi.org/10.21236/ada263245.

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Edwards, H. W., M. F. Kostrzewa und G. P. Looby. Pollution prevention assessment for a printed circuit board plant. Office of Scientific and Technical Information (OSTI), September 1995. http://dx.doi.org/10.2172/125058.

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Booth, Janice C., Tracy Hudson, Brian A. English, Michael R. Whitley und Michael S. Kranz. Integrated Printed Circuit Board (PCB) Active Cooling With Piezoelectric Actuator. Fort Belvoir, VA: Defense Technical Information Center, September 2012. http://dx.doi.org/10.21236/ada567661.

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Bacon, L. D., und R. P. Toth. LineCAP (Line/Circuit Analysis Program): Cross-coupling on PC (printed circuit) board traces including discontinuities and circuit elements. Office of Scientific and Technical Information (OSTI), Juni 1989. http://dx.doi.org/10.2172/6038898.

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Neilsen, Michael K., Kevin N. Austin, Douglas Brian Adolf, Scott W. Spangler, Matthew Aaron Neidigk und Robert S. Chambers. Packaging strategies for printed circuit board components. Volume I, materials & thermal stresses. Office of Scientific and Technical Information (OSTI), September 2011. http://dx.doi.org/10.2172/1022184.

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HEWITT AND ASSOCIATES INC ALBUQUERQUE NM. EM Visualization of Printed Circuit Board Assemblies. A Phase 1 SBIR on behalf of USAF; SA-ALC/LDAE. Fort Belvoir, VA: Defense Technical Information Center, Juni 1994. http://dx.doi.org/10.21236/ada293355.

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Oxley, J. E., und R. J. Smialek. Electrolytic regeneration of acid cupric chloride printed circuit board etchant. Final report, August 1, 1995--October 31, 1996. Office of Scientific and Technical Information (OSTI), April 1997. http://dx.doi.org/10.2172/510548.

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Oxley, J. E., und R. J. Smialek. Electrolytic regeneration of acid cupric chloride printed circuit board etchant. Quarterly report No. 4, April 30, 1996--July 30, 1996. Office of Scientific and Technical Information (OSTI), August 1996. http://dx.doi.org/10.2172/378168.

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Oxley, J. E., und R. J. Smialek. Electrolytic regeneration of acid cupric chloride printed circuit board etchant. Quarterly report No. 3, February 1, 1996--April 30, 1996. Office of Scientific and Technical Information (OSTI), Mai 1996. http://dx.doi.org/10.2172/239340.

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