Bücher zum Thema „Mechanical grinding“
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Steigerwald, Joseph M. Chemical mechanical planarization of microelectronic materials. New York: J. Wiley, 1997.
Den vollen Inhalt der Quelle findenMilton C. Shaw Grinding Symposium (1985 Miami Beach, Fla.). Milton C. Shaw Grinding Symposium: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Miami Beach, Florida, November 17-22, 1985. New York, N.Y: American Society of Mechanical Engineers, 1985.
Den vollen Inhalt der Quelle findenDr, Juhász Z. Mechanical activation of minerals by grinding: Pulverizing and morphology of particles. Budapest: Akadémiai Kiadó, 1990.
Den vollen Inhalt der Quelle findenZ, Juhász. Mechanical activation of minerals by grinding: Pulverizing and morphology of particles. Chichester: Ellis Horwood, 1990.
Den vollen Inhalt der Quelle findenSamuels, Leonard Ernest. Metallographic polishing by mechanical methods. 4. Aufl. Materials Park, OH: ASM International, 2003.
Den vollen Inhalt der Quelle findenAmerican Society of Mechanical Engineers. Winter Meeting. Mechanics of deburring and surface finishing processes: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, San Francisco, California, December 10-15, 1989. New York, N.Y: American Society of Mechanical Engineers, 1989.
Den vollen Inhalt der Quelle finden1941-, Malkin S., Kovach Joseph A, American Society of Mechanical Engineers. Winter Meeting und American Society of Mechanical Engineers. Production Engineering Division., Hrsg. Grinding fundamentals and applications: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, San Francisco, California, December 10-15, 1989. New York, N.Y: The Society, 1989.
Den vollen Inhalt der Quelle findenOliver, Michael R. Chemical-Mechanical Planarization of Semiconductor Materials. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004.
Den vollen Inhalt der Quelle findenChemical-Mechanical, Polishing 2000 (2000 San Francisco Calif ). Chemical-Mechanical Polishing 2000: Fundamentals and materials issues : symposium held April 26-27, 2000, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, 2001.
Den vollen Inhalt der Quelle findenInternational, Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (5th 2002 Philadelphia Pa ). Chemical mechanical planarization V: Proceedings of the International Symposium. Pennington, NJ: Electrochemical Society, Inc., 2002.
Den vollen Inhalt der Quelle findenInternational Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (6th 2003 Orlando, Fla.). Chemical mechanical planarization VI: Proceedings of the international symposium. Herausgegeben von Seal S, Electrochemical Society Electronics Division und Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, 2003.
Den vollen Inhalt der Quelle findenInternational Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (4th 2000 Phoenix, Ariz.). Chemical mechanical planarization IV: Proceedings of the International Symposium. Herausgegeben von Opila R. L, Electrochemical Society. Dielectric Science and Technology Division., Electrochemical Society Electronics Division und Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, Inc., 2001.
Den vollen Inhalt der Quelle findenInternational Symposium on Chemical Mechanical Planarization (1st 1996 San Antonio, Tex.). Proceedings of the First International Symposium on Chemical Mechanical Planarization. Herausgegeben von Ali Iqbal, Raghavan S, Electrochemical Society Electronics Division, Electrochemical Society. Dielectric Science and Technology Division. und Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, 1997.
Den vollen Inhalt der Quelle findenV, Babu S., Hrsg. Chemical-mechanical polishing, fundamentals and challenges: Symposium held April 5-7, 1999, San Francisco, California, U.S.A. / c editors, S.V. Babu ... [et al.]. Warrendale, Pa: Materials Research Society, 1999.
Den vollen Inhalt der Quelle findenSeimitsu Kōgakkai. Puranarizēshon CMP to Sono Ōyō Gijutsu Senmon Iinkai., Hrsg. Handōtai CMP yōgo jiten. 8. Aufl. Tōkyō: Ōmusha, 2008.
Den vollen Inhalt der Quelle findenSeimitsu Kōgakkai. Puranarizēshon CMP to Sono Ōyō Gijutsu Senmon Iinkai., Hrsg. Handōtai CMP yōgo jiten. 8. Aufl. Tōkyō: Ōmusha, 2008.
Den vollen Inhalt der Quelle findenInternational Symposium on Chemical Mechanical Planarization (2nd 1998 San Diego, Calif.). Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing. Herausgegeben von Raghavan S, Opila Robert Leon 1953-, Zhang L, Electrochemical Society Electronics Division, Electrochemical Society. Dielectric Science and Technology Division. und Electrochemical Society Meeting. Pennington, New Jersey: Electrochemical Society, 1998.
Den vollen Inhalt der Quelle findenLiang, Hong. Tribology in chemical-mechanical planarization. Boca Raton, Fla: Taylor & Francis, 2005.
Den vollen Inhalt der Quelle findenJackson, Mark J. Machining with Abrasives. Boston, MA: Springer Science+Business Media, LLC, 2011.
Den vollen Inhalt der Quelle findenSymposium E, "Chemical Mechanical Planarization as a Semiconductor Technology Enabler," (2010 San Francisco, Calif.). Advanced interconnects and chemical mechanical planarization for micro- and nanoelectronics: Symposium held April 5-9, 2010, San Francisco, California. Herausgegeben von Bartha, Johann W. (Johann Wolfgang) und Materials Research Society Meeting. Warrendale, Pa: Materials Research Society, 2010.
Den vollen Inhalt der Quelle findenE, Materials Research Society Meeting Symposium. Science and technology of chemical mechanical planarization (CMP): Symposium held April 14-16, 2009, San Francisco, California, U.S.A. Warrendale, Penn: Materials Research Society, 2010.
Den vollen Inhalt der Quelle findenS, Boning Duane, Materials research Society Meeting und Symposium on Chemical-Mechanical Planarization (2003 : San Francisco, Calif.), Hrsg. Chemical-mechanical planarization: Symposium held April 22-24, 2003, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, 2003.
Den vollen Inhalt der Quelle findenSymposium, C. "Advances and Challenges in Chemical Mechanical Planarization" (2007 San Francisco Calif ). Advances and challenges in chemical mechanical planarization: Symposium held April 10-12, 2007, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, c2007., 2007.
Den vollen Inhalt der Quelle findenMarinescu, Ioan D., Toshiro K. Doi und Syuhei Kurokawa. Advances in CMP/polishing technologies for the manufacture of electronic devices. Oxford: Elsevier, 2012.
Den vollen Inhalt der Quelle findenBorst, Christopher L. Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses: Fundamental mechanisms and application to IC interconnect technology. Boston: Kluwer Academic Publishers, 2002.
Den vollen Inhalt der Quelle findenInstitution of Mechanical Engineers (Great Britain). Tribology Group, Hrsg. Tribology in metal cutting and grinding: Papers presented at the 6th joint IMechE/IOP meeting organized by the Tribology Group Committee of the Institution of Mechanical Engineers, co-sponsored by the Institution of Electrical Engineers and the Institute of Materials, and held at the Institution of Mechanical Engineers on 10 April 1992. London: Mechanical Engineering Publications for the Institution of Mechanical Engineers, 1992.
Den vollen Inhalt der Quelle findenBowman, Marcus. Tool and Cutter Grinding. The Crowood Press, 2021.
Den vollen Inhalt der Quelle findenWillardson, R. K., Eicke R. Weber, Miller Robert M und Shin M. Hwa Li. Chemical Mechanical Polishing in Silicon Processing. Elsevier Science & Technology Books, 1999.
Den vollen Inhalt der Quelle findenChemical mechanical polishing in silicon processing. San Diego, CA: Academic Press, 2000.
Den vollen Inhalt der Quelle findenKrishnan, M., S. V. Babu, S. Danyluk und M. Tsujimura. Chemical-Mechanical Polishing - Fundamentals and Challenges. University of Cambridge ESOL Examinations, 2014.
Den vollen Inhalt der Quelle findenVos, Ingrid, Duane S. Boning, Johann W. Bartha, Ara Philipossian und Greg Shinn. Advances in Chemical-Mechanical Polishing: Volume 816. University of Cambridge ESOL Examinations, 2014.
Den vollen Inhalt der Quelle findenPhilipossian, Ara, Gerfried Zwicker, Christopher Borst und Laertis Economikos. Advances and Challenges in Chemical Mechanical Planarization: Volume 991. University of Cambridge ESOL Examinations, 2014.
Den vollen Inhalt der Quelle findenKumar, Ashok, Chad S. Korach, Subramanian Balakumar und Higgs C. Fred III. Science and Technology of Chemical Mechanical Planarization: Volume 1157. University of Cambridge ESOL Examinations, 2014.
Den vollen Inhalt der Quelle findenMeuris, Marc, Rajiv K. Singh, Rajeev Bajaj und Mansour Moinpour. Chemical-Mechanical Polishing 2000: Fundamentals and Materials Issues. University of Cambridge ESOL Examinations, 2014.
Den vollen Inhalt der Quelle findenBabu, Suryadevara V., Kenneth C. Cadien und Hiroyuki Yano. Chemical-Mechanical Polishing 2001 - Advances and Future Challenges. University of Cambridge ESOL Examinations, 2014.
Den vollen Inhalt der Quelle findenShin M. Hwa Li (Editor), Robert M. Miller (Editor), Robert K. Willardson (Series Editor) und Eicke R. Weber (Series Editor), Hrsg. Chemical Mechanical Polishing in Silicon Processing, Volume 63 (Semiconductors and Semimetals). Academic Press, 1999.
Den vollen Inhalt der Quelle findenOliver, M. R. Chemical Mechanical Planarization of Semiconductor Materials. Springer, 2004.
Den vollen Inhalt der Quelle findenMurarka, Shyam P., Ronald J. Gutmann und Joseph M. Steigerwald. Chemical Mechanical Planarization of Microelectronic Materials. Wiley & Sons, Limited, John, 2007.
Den vollen Inhalt der Quelle findenMurarka, Shyam P., Ronald J. Gutmann und Joseph M. Steigerwald. Chemical Mechanical Planarization of Microelectronic Materials. Wiley & Sons, Incorporated, John, 2008.
Den vollen Inhalt der Quelle findenJuhasz, Z. Mechanical activation of minerals by grinding: Pulverizing and morphology of particles. Akademiai Kiado, 1990.
Den vollen Inhalt der Quelle findenKajornchaiyakul, Julathep. Abrasive machining of ceramics: Assessment of near-surface characteristics in high-speed grinding. 2000.
Den vollen Inhalt der Quelle findenCheng, Jie. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. Springer, 2019.
Den vollen Inhalt der Quelle findenCheng, Jie. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. Springer, 2017.
Den vollen Inhalt der Quelle findenLi, Yuzhuo. Microelectronic Applications of Chemical Mechanical Planarization. Wiley & Sons, Incorporated, John, 2007.
Den vollen Inhalt der Quelle findenLi, Yuzhuo. Microelectronic Applications of Chemical Mechanical Planarization. Wiley-Interscience, 2007.
Den vollen Inhalt der Quelle findenVos, Ingrid, Michael R. Oliver, Duane S. Boning, Katia Devriendt und David J. Stein. Chemical-Mechanical Planarization: Volume 767. University of Cambridge ESOL Examinations, 2014.
Den vollen Inhalt der Quelle findenBabu, Suryadevara. Advances in Chemical Mechanical Planarization (CMP). Elsevier Science & Technology, 2016.
Den vollen Inhalt der Quelle findenBabu, Suryadevara. Advances in Chemical Mechanical Planarization (CMP). Elsevier Science & Technology, 2016.
Den vollen Inhalt der Quelle findenOpila, R. L. Chemical Mechanical Planarization in Ic Device Manufacturing (Proceedings / Electrochemical Society). Electrochemical Society, 1998.
Den vollen Inhalt der Quelle finden(Editor), S. V. Babu, S. Danyluk (Editor), M. I. Krishnan (Editor) und M. Tsujimura (Editor), Hrsg. Chemical Mechanical Polishing /Fundamentals and Challenges: Symposium Held April 5-7, 1999, San Francisco, California, U.S.A (Materials Research Society Symposium Proceedings). Materials Research Society, 2000.
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