Auswahl der wissenschaftlichen Literatur zum Thema „Etching“
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Zeitschriftenartikel zum Thema "Etching":
Çakır, Orhan. „Study of Etch Rate and Surface Roughness in Chemical Etching of Stainless Steel“. Key Engineering Materials 364-366 (Dezember 2007): 837–42. http://dx.doi.org/10.4028/www.scientific.net/kem.364-366.837.
Chabanon, Angélique, Alexandre Michau, Michel Léon Schlegel, Deniz C. Gündüz, Beatriz Puga, Frédéric Miserque, Frédéric Schuster et al. „Surface Modification of 304L Stainless Steel and Interface Engineering by HiPIMS Pre-Treatment“. Coatings 12, Nr. 6 (25.05.2022): 727. http://dx.doi.org/10.3390/coatings12060727.
Hvozdiyevskyi, Ye Ye, R. O. Denysyuk, V. M. Tomashyk, G. P. Malanych, Z. F. Tomashyk Tomashyk und A. A. Korchovyi. „Chemical-mechanical polishing of CdTe and based on its solid solutions single crystals using HNO3 + НІ + ethylene glycol iodine-emerging solutions“. Chernivtsi University Scientific Herald. Chemistry, Nr. 819 (2019): 45–49. http://dx.doi.org/10.31861/chem-2019-819-07.
Li, Hao, Yong You Geng und Yi Qun Wu. „Selective Wet Etching Characteristics of Aginsbte Phase Change Film with Ammonium Sulfide Solution“. Advanced Materials Research 529 (Juni 2012): 388–93. http://dx.doi.org/10.4028/www.scientific.net/amr.529.388.
Pashchenko, G. A., M. J. Kravetsky und O. V. Fomin. „Singularities of Polishing Substrates GaAs by Chemo-Dynamical and Non-Contact Chemo-Mechanical Methods“. Фізика і хімія твердого тіла 16, Nr. 3 (15.09.2015): 560–64. http://dx.doi.org/10.15330/pcss.16.3.560-564.
Alias, Ezzah Azimah, Muhammad Esmed Alif Samsudin, Steven DenBaars, James Speck, Shuji Nakamura und Norzaini Zainal. „N-face GaN substrate roughening for improved performance GaN-on-GaN LED“. Microelectronics International 38, Nr. 3 (23.08.2021): 93–98. http://dx.doi.org/10.1108/mi-02-2021-0011.
Misal, Nitin D., und Mudigonda Sadaiah. „Investigation on Surface Roughness of Inconel 718 in Photochemical Machining“. Advances in Materials Science and Engineering 2017 (2017): 1–9. http://dx.doi.org/10.1155/2017/3247873.
Zunic, Zora, Predrag Ujic, Igor Celikovic und Kenzo Fujimoto. „ECE laboratory in the Vinca institute: Its basic characteristics and fundamentals of electrochemic etching on polycarbonate“. Nuclear Technology and Radiation Protection 18, Nr. 2 (2003): 57–60. http://dx.doi.org/10.2298/ntrp0302057z.
Tellier, C. R., T. G. Leblois und A. Charbonnieras. „Chemical Etching of {hk0} Silicon Plates in EDP Part I: Experiments and Comparison with TMAH“. Active and Passive Electronic Components 23, Nr. 1 (2000): 37–51. http://dx.doi.org/10.1155/apec.23.37.
Park, Tae Gun, Jong Won Han und Sang Woo Lim. „Selective Si<sub>3</sub>N<sub>4</sub> Etching for 3D NAND Integration by Using Low Concentration of H<sub>3</sub>PO<sub>4</sub>“. Solid State Phenomena 346 (14.08.2023): 137–42. http://dx.doi.org/10.4028/p-0pjfvo.
Dissertationen zum Thema "Etching":
Lochnan, Katharine Jordan. „Whistler's etchings and the sources of his etching style, 1855-1880“. New York : Garland Pub, 1988. http://catalog.hathitrust.org/api/volumes/oclc/17107762.html.
El, Otell Ziad. „Neutral beam etching“. Thesis, Open University, 2013. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.607461.
Parks, Joseph Worthy Jr. „Microscopic numerical analysis of semiconductor devices with application to avalnache photodiodes“. Diss., Georgia Institute of Technology, 1997. http://hdl.handle.net/1853/13539.
Baker, Michael Douglas. „In-situ monitoring of reactive ion etching“. Diss., Georgia Institute of Technology, 1996. http://hdl.handle.net/1853/15352.
Zachariasse, Jacobus Marinus Frans. „Nanostructure etching with plasmas“. Thesis, University of Cambridge, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.388386.
Bloomstein, Theodore Michael. „Laser microchemical etching of silicon“. Thesis, Massachusetts Institute of Technology, 1996. http://hdl.handle.net/1721.1/11269.
Includes bibliographical references (p. 195-205).
Theodore M. Bloomstein.
Sc.D.
Stoikou, Maria D. „Etching of CVD diamond surfaces“. Thesis, Heriot-Watt University, 2010. http://hdl.handle.net/10399/2441.
Hobbs, Neil Townsend. „Anisotropic etching for silicon micromachining“. Thesis, Virginia Tech, 1994. http://hdl.handle.net/10919/40632.
Silicon micromachining is the collective name for several processes by which three dimensional
structures may be constructed from or on silicon wafers. One of these
processes is anisotropic etching, which utilizes etchants such as KOH and ethylene
diamine pyrocatechol (EDP) to fabricate structures from the wafer bulk. This project is a
study of the use of KOH to anisotropically etch (lOO)-oriented silicon wafers. The thesis
provides a thorough review of the theory and principles of anisotropic etching as applied
to (100) wafers, followed by a few examples which serve to illustrate the theory. Next,
the thesis describes the development and experimental verification of a standardized
procedure by which anisotropic etching may be reliably performed in a typical research
laboratory environment. After the development of this procedure, several more etching
experiments were performed to compare the effects of various modifications of the etching
process. Multi-step etching processes were demonstrated, as well as simultaneous doublesided
etching using two different masks. The advantages and limitations of both methods
are addressed in this thesis. A comparison of experiments performed at different etchant
temperatures indicates that high temperatures (800 C) produces reasonably good results at
a very high etch rate, while lower temperatures (500 C) are more suited to high-precision
structures since they produce smoother, higher-quality surfaces.
Master of Science
Astell-Burt, P. J. „Studies on etching and polymer deposition in halocarbon plasmas“. Thesis, University of Oxford, 1987. http://ora.ox.ac.uk/objects/uuid:d8fd1069-a66b-4372-8ba0-b9ca5367445c.
Toogood, Matthew John. „Studies of the chemistry of plasmas used for semiconductor etching“. Thesis, University of Oxford, 1991. http://ora.ox.ac.uk/objects/uuid:e234bbaa-d6e6-4ac8-a3dd-aa9a2c1b1e39.
Bücher zum Thema "Etching":
McKeever, Ian. Colour etching. London: Alan Cristea Gallery, 1997.
Fredericksen, Andrea. The Etching Club of London: A taste for painters' etchings. Philadelphia, Pa: Philadelphia Museum of Art, 2002.
Edwards, J. A. Field assisted etching. London: Controller HMSO, 1986.
Reid, Mehry. Persian etching designs. Owings Mills, Md: Stemmer House, 1985.
Gravett, Terence. Etching: A handbook to be used with the video "Etching". Brighton: Brighton Polytechnic Media Services, 1991.
Lochnan, Katharine Jordan. Whistler's etchings and the sources of his etching style, 1855-1880. New York: Garland Pub., 1988.
Premio internazionale biennale d'incisione Città di Monsummano Terme (3rd 2003 Monsummano Terme, Italy). Georges Rouault, De Chirico Giorgio. Pisa: Comune di Monsummano Terme, 2003.
Lowe, Ian. The etchings of Wilfred Fairclough. Aldershot: Scolar, 1990.
Lowe, Ian. The etchings of Wilfred Fairclough. Aldershot, Hants: Ashgate Editions, 1990.
van Roosmalen, A. J., J. A. G. Baggerman und S. J. H. Brader. Dry Etching for VLSI. Boston, MA: Springer US, 1991. http://dx.doi.org/10.1007/978-1-4899-2566-4.
Buchteile zum Thema "Etching":
Allen, David. „Etching“. In CIRP Encyclopedia of Production Engineering, 1–6. Berlin, Heidelberg: Springer Berlin Heidelberg, 2018. http://dx.doi.org/10.1007/978-3-642-35950-7_6482-3.
Allen, David. „Etching“. In CIRP Encyclopedia of Production Engineering, 1–6. Berlin, Heidelberg: Springer Berlin Heidelberg, 2019. http://dx.doi.org/10.1007/978-3-642-35950-7_6482-4.
Anner, George E. „Etching“. In Planar Processing Primer, 401–38. Dordrecht: Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-009-0441-5_10.
Allen, David. „Etching“. In CIRP Encyclopedia of Production Engineering, 633–38. Berlin, Heidelberg: Springer Berlin Heidelberg, 2019. http://dx.doi.org/10.1007/978-3-662-53120-4_6482.
Allen, David. „Etching“. In CIRP Encyclopedia of Production Engineering, 483–88. Berlin, Heidelberg: Springer Berlin Heidelberg, 2014. http://dx.doi.org/10.1007/978-3-642-20617-7_6482.
Gooch, Jan W. „Etching“. In Encyclopedic Dictionary of Polymers, 275. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_4522.
Clark, Raymond H. „Etching“. In Handbook of Printed Circuit Manufacturing, 396–416. Dordrecht: Springer Netherlands, 1985. http://dx.doi.org/10.1007/978-94-011-7012-3_20.
Kondoh, Eiichi. „Etching“. In Micro- and Nanofabrication for Beginners, 159–87. Boca Raton: Jenny Stanford Publishing, 2022. http://dx.doi.org/10.1201/9781003119937-6.
Bährle-Rapp, Marina. „etching“. In Springer Lexikon Kosmetik und Körperpflege, 191. Berlin, Heidelberg: Springer Berlin Heidelberg, 2007. http://dx.doi.org/10.1007/978-3-540-71095-0_3685.
Cheng, Hua-Chi. „Wet Etching“. In Handbook of Visual Display Technology, 1331–41. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-14346-0_59.
Konferenzberichte zum Thema "Etching":
Nishida, Akio, Tomoko Sekiguchi, Toshiaki Yamanaka, Renichi Yamada, Kuniyasu Nakamura, Satoshi Tomimatsu, K. Umemura et al. „Visualization of Local Gate Depletion in PMOSFETs Using Unique Backside Etching and Selective Etching Technique“. In ISTFA 1999. ASM International, 1999. http://dx.doi.org/10.31399/asm.cp.istfa1999p0413.
„The effect of fluoride based salt etching in the synthesis of Mxene“. In Sustainable Processes and Clean Energy Transition. Materials Research Forum LLC, 2023. http://dx.doi.org/10.21741/9781644902516-8.
Demos, Alexandros T., H. S. Fogler, Stella W. Pang und Michael E. Elta. „Enhanced etching of InP by cycling with sputter etching and reactive ion etching“. In Santa Cl - DL tentative, herausgegeben von James A. Bondur und Terry R. Turner. SPIE, 1991. http://dx.doi.org/10.1117/12.48924.
Chu, Jack O., George W. Flynn, Peter D. Brewer und Richard M. Osgood. „Laser-Initiated Dry Etching of SiO2“. In Microphysics of Surfaces, Beams, and Adsorbates. Washington, D.C.: Optica Publishing Group, 1985. http://dx.doi.org/10.1364/msba.1985.tuc5.
Easter, Clayton, und Chad O’Neal. „XeF2 Etching of Silicon for the Release of Micro-Cantilever Based Sensors“. In ASME 2008 International Mechanical Engineering Congress and Exposition. ASMEDC, 2008. http://dx.doi.org/10.1115/imece2008-66520.
Wu, Xuming, Changhe Zhou, Peng Xi, Enwen Dai, Huayi Ru und Liren Liu. „Etching quartz with inductively coupled plasma etching equipment“. In Optical Science and Technology, SPIE's 48th Annual Meeting, herausgegeben von Ernst-Bernhard Kley und Hans Peter Herzig. SPIE, 2003. http://dx.doi.org/10.1117/12.504001.
Twyford, E. J., P. A. Kohl, N. M. Jokerst und N. F. Hartman. „Increased modulation depth of submicrometer gratings produced by photoelectrochemical etching of GaAs“. In OSA Annual Meeting. Washington, D.C.: Optica Publishing Group, 1992. http://dx.doi.org/10.1364/oam.1992.fk1.
Zhao, Yuanhe, und Yuanwei Lin. „Estimating the Etching Depth Limit in Deep Silicon Etching“. In 2019 China Semiconductor Technology International Conference (CSTIC). IEEE, 2019. http://dx.doi.org/10.1109/cstic.2019.8755766.
Abraham-Shrauner, B., und C. D. Wang. „Neutral etching and shadowing in trench etching of semiconductors“. In International Conference on Plasma Science (papers in summary form only received). IEEE, 1995. http://dx.doi.org/10.1109/plasma.1995.531627.
Winslow, Verity, Paul J. O’Dowd, Ian Chamberlain und Carinna Parraman. „Robotic Etching: The creation of digital etching using robotics“. In Proceedings of EVA London 2019. BCS Learning & Development, 2019. http://dx.doi.org/10.14236/ewic/eva2019.20.
Berichte der Organisationen zum Thema "Etching":
Novick-Cohen, A. Laser Photodeposition and Etching Study. Fort Belvoir, VA: Defense Technical Information Center, Juni 1987. http://dx.doi.org/10.21236/ada190535.
Kummel, Andrew C. Chemical Physics of Digital Etching. Fort Belvoir, VA: Defense Technical Information Center, August 1998. http://dx.doi.org/10.21236/ada353731.
Shier, Douglas R. Laser Photodeposition and Etching Study. Fort Belvoir, VA: Defense Technical Information Center, Juni 1985. http://dx.doi.org/10.21236/ada167179.
Shul, R. J., R. D. Briggs, S. J. Pearton, C. B. Vartuli, C. R. Abernathy, J. W. Lee, C. Constantine und C. Baratt. Chlorine-based plasma etching of GaN. Office of Scientific and Technical Information (OSTI), Februar 1997. http://dx.doi.org/10.2172/432987.
Fischer, Arthur J., Benjamin Leung und George T. Wang. Photoelectrochemical Etching of GaN Quantum Wires. Office of Scientific and Technical Information (OSTI), September 2015. http://dx.doi.org/10.2172/1221710.
Karmiol, Benjamin. Integrated Electrochemical Decontamination and Etching System. Office of Scientific and Technical Information (OSTI), Oktober 2020. http://dx.doi.org/10.2172/1673357.
Ross, F. M., und P. C. Searson. Dynamic observation of electrochemical etching in silicon. Office of Scientific and Technical Information (OSTI), März 1995. http://dx.doi.org/10.2172/71306.
Doyle, Kevin, und Sudhir Trivedi. Dislocation Etching Solutions for Mercury Cadmium Selenide. Fort Belvoir, VA: Defense Technical Information Center, September 2014. http://dx.doi.org/10.21236/ada609573.
Vartuli, C. B., J. W. Lee und J. D. MacKenzie. ICP dry etching of III-V nitrides. Office of Scientific and Technical Information (OSTI), Oktober 1997. http://dx.doi.org/10.2172/541909.
Greenberg, K. E., P. A. Miller, R. Patteson und B. K. Smith. Plasma-etching science meets technology in the MDL. Office of Scientific and Technical Information (OSTI), März 1993. http://dx.doi.org/10.2172/10147051.