Thematische Bibliographien / Encapsulation for electronic

Inhaltsverzeichnis

  1. Zeitschriftenartikel
  2. Dissertationen
  3. Bücher
  4. Buchteile
  5. Konferenzberichte
  6. Berichte der Organisationen

Auswahl der wissenschaftlichen Literatur zum Thema „Encapsulation for electronic“

Autor: Grafiati
Veröffentlicht am 28. Juni 2021
Zuletzt aktualisiert am 7. Februar 2022

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Zeitschriftenartikel zum Thema "Encapsulation for electronic"

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Winkler, Sebastian, Jan Edelmann, Christine Welsch und Roman Ruff. „Different encapsulation strategies for implanted electronics“. Current Directions in Biomedical Engineering 3, Nr. 2 (07.09.2017): 725–28. http://dx.doi.org/10.1515/cdbme-2017-0153.

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AbstractRecent advancements in implant technology include increasing application of electronic systems in the human body. Hermetic encapsulation of electronic components is necessary, specific implant functions and body environments must be considered. Additional functions such as wireless communication systems require specialized technical solutions for the encapsulation.In this paper 3 different implant strategies based on the material groups silicone, ceramics and titanium alloys are evaluated. With the background of a specific application the requirements for the encapsulation are defined and include the implementation of electrical feedthroughs, wireless communication and wireless energy transfer as well as biomedical specifications such as hermetic sealing, mechanical stability and biocompatibility. The encapsulations are manufactured and qualified experimentally.
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Kulkarni, Romit, Peter Wappler, Mahdi Soltani, Mehmet Haybat, Thomas Guenther, Tobias Groezinger und André Zimmermann. „An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages“. Journal of Manufacturing and Materials Processing 3, Nr. 1 (01.02.2019): 18. http://dx.doi.org/10.3390/jmmp3010018.

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An ever-growing market demand for board (second) level packages (e.g., embedded systems, system-on-a-chip, etc.) poses newer challenges for its manufacturing industry in terms of competitive pricing, higher reliability, and overall dimensions. Such packages are encapsulated for various reasons including thermal management, protection from environmental conditions and dust particles, and enhancing the mechanical stability. In the due course of reducing overall sizes and material saving, an encapsulation as thin as possible imposes its own significance. Such a thin-walled conformal encapsulation serves as an added advantage by reducing the thermo-mechanical stresses occurring due to thermal-cyclic loading, compared to block-sized or thicker encapsulations. This paper assesses the encapsulation process of a board-level package by means of thermoset injection molding. Various aspects reviewed in this paper include the conception of a demonstrator, investigation of the flow simulation of the injection molding process, execution of molding trials with different encapsulation thicknesses, and characterization of the packages. The process shows a high dependence on the substrate properties, injection molding process parameters, device mounting tolerances, and device geometry tolerances. Nevertheless, the thermoset injection molding process is suitable for the encapsulation of board-level packages limiting itself only with respect to the thickness of the encapsulation material, which depends on other external aforementioned factors.
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Kinkeldei, Thomas, Niko Munzenrieder, Christoph Zysset, Kunigunde Cherenack und Gerhard Tröster. „Encapsulation for Flexible Electronic Devices“. IEEE Electron Device Letters 32, Nr. 12 (Dezember 2011): 1743–45. http://dx.doi.org/10.1109/led.2011.2168378.

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Kaessner, S., M. G. Scheibel, S. Behrendt, B. Boettge und K. G. Nickel. „Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging“. International Symposium on Microelectronics 2018, Nr. 1 (01.10.2018): 000425–33. http://dx.doi.org/10.4071/2380-4505-2018.1.000425.

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Abstract Enhancements on power electronic systems with reduced chip area and miniaturized passive components are subject of several research activities in academics and industry. To realize such future electronic devices, it is necessary to incorporate wide bandgap semiconductor technology such as silicon carbide and gallium nitride operating at higher temperatures. Therefore, the development of novel materials with high thermal conductivities and stability, withstanding harsh environments up to 300°C is of major interest. Especially, polymeric encapsulation materials have to be improved because of common degradation effects above 175°C. Ceramic (nonpolymeric) materials with thermal conductivities above 5 W/(m·K) already illustrated promising results for the encapsulation of power electronics. The present work illustrates recent developments and improvements on novel ceramic encapsulation materials, which finally avoid critical interactions with the chip surface. Furthermore, advances in reliability will be discussed in terms of passed high-temperature reverse bias and humidity tests correlated with relevant material properties.
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Kaessner, Stefan, Markus G. Scheibel, Stefan Behrendt, Bianca Boettge, Christoph Berthold und Klaus G. Nickel. „Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging“. Journal of Microelectronics and Electronic Packaging 15, Nr. 3 (01.07.2018): 132–39. http://dx.doi.org/10.4071/imaps.661015.

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Abstract Enhancements on power electronic systems with reduced chip area and miniaturized passive components are subject of several research activities in academics and industry. To realize such future electronic devices, it is necessary to incorporate wide bandgap semiconductor technology such as silicon carbide and gallium nitride operating at higher temperatures. Therefore, the development of novel materials with high thermal conductivities and stability, withstanding harsh environments up to 300°C is of major interest. Especially, polymeric encapsulation materials have to be improved because of common degradation effects above 175°C. Ceramic (nonpolymeric) materials with thermal conductivities above 5 W/(m·K) already illustrated promising results for the encapsulation of power electronics. The present work illustrates recent developments and improvements on novel ceramic encapsulation materials, which finally avoid critical interactions with the chip surface. Furthermore, advances in reliability will be discussed in terms of passed high-temperature reverse bias and humidity tests correlated with relevant material properties.
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Guo, Jiahui, Yunru Yu, Dagan Zhang, Han Zhang und Yuanjin Zhao. „Morphological Hydrogel Microfibers with MXene Encapsulation for Electronic Skin“. Research 2021 (03.03.2021): 1–10. http://dx.doi.org/10.34133/2021/7065907.

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Electronic skins with distinctive features have attracted remarkable attention from researchers because of their promising applications in flexible electronics. Here, we present novel morphologically conductive hydrogel microfibers with MXene encapsulation by using a multi-injection coflow glass capillary microfluidic chip. The coaxial flows in microchannels together with fast gelation between alginate and calcium ions ensure the formation of hollow straight as well as helical microfibers and guarantee the in situ encapsulation of MXene. The resultant hollow straight and helical MXene hydrogel microfibers were with highly controllable morphologies and package features. Benefiting from the easy manipulation of the microfluidics, the structure compositions and the sizes of MXene hydrogel microfibers could be easily tailored by varying different flow rates. It was demonstrated that these morphologically conductive MXene hydrogel microfibers were with outstanding capabilities of sensitive responses to motion and photothermal stimulations, according to their corresponding resistance changes. Thus, we believe that our morphologically conductive MXene hydrogel microfibers with these excellent features will find important applications in smart flexible electronics especially electronic skins.
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Yu, Yong Peng. „Research Progress of Heat Hv Insulation Resistance of Macromolecular Composite Materials“. Advanced Materials Research 391-392 (Dezember 2011): 332–35. http://dx.doi.org/10.4028/www.scientific.net/amr.391-392.332.

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Epoxy resin (EP) with excellent performance was widely used as electronic encapsulation materials, but the traditional EP can not meet require of nowadays electronic encapsulation materials in wet-heat resistance, flame retardant, insulation and other performance. So the current research progress of EP with wet-heat resistance and high-performance was summarized in the field of electronic encapsulation.
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Wong, C. P. „An Overview of Integrated Circuit Device Encapsulants“. Journal of Electronic Packaging 111, Nr. 2 (01.06.1989): 97–107. http://dx.doi.org/10.1115/1.3226528.

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The rapid development of integrated circuit technology from small-scale integration (SSI) to very large scale integration (VLSI) has had great technological and economical impact on the electronics industry. The exponential growth of the number of components per IC chip, the exponential decrease of device dimensions, and the steady increase in IC chip size have imposed stringent requirements, not only on the IC physical design and fabrication, but also on IC encapsulants. This report addresses the purpose of encapsulation, encapsulation techniques, and a general overview of the application of inorganic and organic polymer materials as electronic device encapsulants.
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Ahn, Jeong und Kim. „Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices“. Micromachines 10, Nr. 8 (31.07.2019): 508. http://dx.doi.org/10.3390/mi10080508.

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The development of reliable long-term encapsulation technologies for implantable biomedical devices is of paramount importance for the safe and stable operation of implants in the body over a period of several decades. Conventional technologies based on titanium or ceramic packaging, however, are not suitable for encapsulating microfabricated devices due to their limited scalability, incompatibility with microfabrication processes, and difficulties with miniaturization. A variety of emerging materials have been proposed for encapsulation of microfabricated implants, including thin-film inorganic coatings of Al2O3, HfO2, SiO2, SiC, and diamond, as well as organic polymers of polyimide, parylene, liquid crystal polymer, silicone elastomer, SU-8, and cyclic olefin copolymer. While none of these materials have yet been proven to be as hermetic as conventional metal packages nor widely used in regulatory approved devices for chronic implantation, a number of studies have demonstrated promising outcomes on their long-term encapsulation performance through a multitude of fabrication and testing methodologies. The present review article aims to provide a comprehensive, up-to-date overview of the long-term encapsulation performance of these emerging materials with a specific focus on publications that have quantitatively estimated the lifetime of encapsulation technologies in aqueous environments.
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Elshabini, Aicha, Fred Barlow, Sharmin Islam und Pin-Jen Wang. „Advanced Devices and Electronic Packaging for Harsh Environment“. International Symposium on Microelectronics 2013, Nr. 1 (01.01.2013): 000937–50. http://dx.doi.org/10.4071/isom-2013-thp61.

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The paper addresses the challenges in electronic packaging for extreme environment based on experimental work of the researchers and conducted reliability testing to evaluate high speed devices suitable for these applications, substrates, die attach, wire bonding, and encapsulation and housing. In particular, the researcher's work has focused on SiC power devices with low loss high voltage Schottky diodes with significant applications, high temperature JFETs and SiC MOSFETs (double trench), and GaN microwave devices. The paper provides recommendations for selection of devices, substrates, die attach, and encapsulation and housing for these applications.
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Dissertationen zum Thema "Encapsulation for electronic"

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Kaabeche, Nessima. „Transparent high barrier coatings for electronic encapsulation“. Thesis, Manchester Metropolitan University, 2017. http://e-space.mmu.ac.uk/618981/.

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Barrier coatings are a category of functional films designed to enhance enduse properties to the underlying substrate. When used for electronic applications (such as flexible displays, digital paper, lighting, OLEDs and solar cells), the barrier characteristics are meant to protect the device from environmental influence, especially the permeation of oxygen and water vapour that can degrade and corrode the active layers of the devices (causing mal-functioning). In this project, silicon oxide barrier layers were deposited onto a non-treated BO-PET via plasma enhanced chemical vapour deposition, using a pilot scale roll-to-roll coater. The aim was to optimise the deposited coatings by understanding the effect of the deposition parameters on the barrier properties (oxygen and water vapour barrier) and the surface properties (i.e. topography, chemistry, structure, thickness, mechanical properties) of the coatings. For encapsulation in electronic devices such as OLEDS and photovoltaics cells, the barrier coatings must remain transparent and flexible, which is one of the challenges of this project. This project has demonstrated that the moisture barrier performance of silicon oxide coated BO-PET is dependent on film structure (i.e. porosity), which are linked to the plasma conditions of the deposited film. Lower WVTR could be reached (10-2×g/m2/day) for film produced at high input power (1.6kW), low webspeed (< 0.5m/min) and low ratio oxygen:monomer (between 2 and 3). In these conditions, the coating was rather stoichiometric and exhibited a relatively low carbon content (30% atomic) and similar contents in O and Si (about 30% each). The film type was found to have an influence on the final barrier level, as coatings on planarised and adhesion treated substrates showed better barrier performances than coatings on standard untreated PET. Despite all the development done, barrier levels did not match the requirements (10-5×g/m2day) for electronic encapsulation but showed some promising improvement. Thinner coatings were found to have better barrier against moisture permeation, although a threshold of 800nm was identified as critical thickness above which the WVTR dramatically increased. As far as changing the plasma composition via the addition of CO2 as a reactive gas, a slight decrease in WVTR (improvement in barrier) was observed at low CO2 flow rates (up to 200SCCM). WVTR doubled, however, when increasing the amount of CO2. This increase was associated with a decrease in hardness and increase of carbon content. Alternative power generation, using squared waves instead of sinusoidal, was not successful and deteriorated the barrier performances (higher WVTR). Finally, the route of topcoats to enhance the barrier by filling the pores showed promising results in the case of Al2O3 ALD topcoats but didn't show significant improvement in the case of acrylate topcoats, partly due to a lack of adhesion of the acrylate on the surface of the SiOₓ coating.
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Pascarella, Nathan William. „Advanced encapsulation processing for low cost electronics assembly“. Thesis, Georgia Institute of Technology, 1997. http://hdl.handle.net/1853/19031.

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Evans, Michael 1977. „Encapsulation of electronic components for a retinal prosthesis“. Thesis, Massachusetts Institute of Technology, 2000. http://hdl.handle.net/1721.1/9077.

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Thesis (S.B. and M.Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2000.
Includes bibliographical references (p. 65).
Long-term success of an implantable retinal prosthesis depends on the ability to hermetically seal sensitive electronics from a saline environment with an encapsulant material. Furthermore, the retinal implant project's proposed laser-driven prosthesis requires that the encapsulation material be transparent. The device itself has two components that must protrude out of the encapsulation material. The first is an electrode array on a polyimide strip. The second is a platinum return wire. Difficulty in finding encapsulation materials has arisen from saline leakage at the interface of the encapsulant and these two protruding components. This thesis addresses the pursuit of materials and bonding strategies suitable to protect the device in chronic submersion. An electrode array lying on a polyimide layer sits flat against the ganglion cells within the eye. Precise stimulation requires that current does not flow between the individual electrode contacts. The array must be tested under chronic saline submersion to ensure that each electrode remains electrically isolated by the polyimide. The electronics package will be supported in the eye by a modified intraocular platform, similar to a device typically used in human cataract surgery. The lens is created by photolithography, a rapid prototyping technique. This platform must conform to surgical needs and structural integrity required by the device. The primary goal of this thesis is to find a flexible transparent encapsulant material. This material must undergo long term leakage tests to ensure that it will be reliable in protecting the microelectronics mounted on the platform before being considered for use. The secondary goal of the thesis is testing of the polyimide electrode array itself to determine its ability to resist saline leaks.
by Michael Evans.
S.B.and M.Eng.
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Teh, Nee-Joo. „Direct polymeric encapsulation of electronic systems for automotive applications“. Thesis, Loughborough University, 2004. https://dspace.lboro.ac.uk/2134/33881.

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Over the past forty years, compelling demands for safer, cleaner and more efficient vehicles have given rise to a drastic increase in the replacement of many traditional mechanical and electrical mechanisms by more advanced electronic systems. Due to their harsh operating environments, automotive electronic systems are subject to failures from thermomechanical stresses and corrosive breakdown, adversely affecting their reliability and lifespan. Furthermore, the development of bus communication protocols for improved control capabilities has prompted wider systems distribution within the restricted space of a vehicle and inadvertently led to higher assembly complexity, increased vehicle weight and manufacturing costs. Despite advancements in the industry, no commercially viable process exists that is capable of providing electronic systems with sufficient robustness for their operating environments while also offering assembly consolidation to enable cost reduction. The primary focus of this thesis is the engineering of a low-cost, single-cycle process for the direct encapsulation of electronic systems within thermoplastic structures, leading to the production of robust, geometrically flexible and ready-to-assemble plastic automotive components with integrated electronics and requisite power distribution.
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Kim, Namsu. „Fabrication and characterization of thin-film encapsulation for organic electronics“. Diss., Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/31772.

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Thesis (Ph.D)--Mechanical Engineering, Georgia Institute of Technology, 2010.
Committee Chair: Samuel Graham; Committee Member: Bernard Kippelen; Committee Member: David McDowell; Committee Member: Sankar Nair; Committee Member: Suresh Sitaraman. Part of the SMARTech Electronic Thesis and Dissertation Collection.
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Zhang, Rong. „Wafer level LED packaging with integrated DRIE trenches for encapsulation /“. View abstract or full-text, 2008. http://library.ust.hk/cgi/db/thesis.pl?MECH%202008%20ZHANGR.

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Bowman, Amy Catherine. „A selective encapsulation solution for packaging an optical micro electro mechanical system“. Link to electronic thesis, 2002. http://www.wpi.edu/Pubs/ETD/Available/etd-0108102-140953.

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Thesis (M.S.)--Worcester Polytechnic Institute.
Keywords: packaging; micro electro mechanical systems; MEMS; electronics; die warpage; die bow; encapsulant; encapsulate; electrochemical migration; corrosion; wirebonds. Includes bibliographical references (p. 94-99).
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Visweswaran, Bhadri. „Encapsulation of organic light emitting diodes“. Thesis, Princeton University, 2014. http://pqdtopen.proquest.com/#viewpdf?dispub=3665325.

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Organic Light Emitting Diodes (OLEDs) are extremely attractive candidates for flexible display and lighting panels due to their high contrast ratio, light weight and flexible nature. However, the materials in an OLED get oxidized by extremely small quantities of atmospheric moisture and oxygen. To obtain a flexible OLED device, a flexible thin-film barrier encapsulation with low permeability for water is necessary.

Water permeates through a thin-film barrier by 4 modes: microcracks, contaminant particles, along interfaces, and through the bulk of the material. We have developed a flexible barrier film made by Plasma Enhanced Chemical Vapor Deposition (PECVD) that is devoid of any microcracks. In this work we have systematically reduced the permeation from the other three modes to come up with a barrier film design for an operating lifetime of over 10 years.

To provide quantitative feedback during barrier material development, techniques for measuring low diffusion coefficient and solubility of water in a barrier material have been developed. The mechanism of water diffusion in the barrier has been identified. From the measurements, we have created a model for predicting the operating lifetime from accelerated tests when the lifetime is limited by bulk diffusion.

To prevent the particle induced water permeation, we have encapsulated artificial particles and have studied their cross section. A three layer thin-film that can coat a particle at thicknesses smaller than the particle diameter is identified. It is demonstrated to protect a bottom emission OLED device that was contaminated with standard sized glass beads.

The photoresist and the organic layers below the barrier film causes sideways permeation that can reduce the lifetime set by permeation through the bulk of the barrier. To prevent the sideways permeation, an impermeable inorganic grid made of the same barrier material is designed. The reduction in sideways permeation due to the impermeable inorganic grid is demonstrated in an encapsulated OLED.

In this work, we have dealt with three permeation mechanisms and shown solution to each of them. These steps give us reliable flexible encapsulation that has a lifetime of greater than 10 years.

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Colin, Charlotte. „Synthèse et caractérisation de copolymères Silicone/Polyuréthane réticulés pour l'encapsulation de modules de puissance“. Thesis, Université Paris-Saclay (ComUE), 2017. http://www.theses.fr/2017SACLV028/document.

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L’électronique embarquée, notamment les modules de puissance, permet la gestion de l’énergie électrique et donc le développement de véhicules « décarbonés ». Toutefois, en vue d’être positionnés près du moteur thermique, ces composants électroniques devront résister à des environnements très divers et parfois à de sévères contraintes (humidité, agression chimique (huiles), vibrations…). Or, les matériaux d’encapsulation qui les protègent ne sont pas, aujourd’hui, assez performants pour répondre à ces nouvelles contraintes. Ainsi, le but de ces travaux de thèse est donc de développer de nouveaux polymères d’encapsulation. Pour cela, deux types de copolymères Silicone/Polyuréthane (Si/PU) réticulés ont été synthétisés, sans solvant, et avec des temps de polymérisation courts.Une première série de matériaux Si/PU contenant entre 55 et 76%m de motif silicone, a été synthétisée par polyaddition alcool-isocyanate à partir de précurseurs silicone, synthétisés ou commerciaux, et d’un pluriisocyanate, en présence d’un catalyseur. Une seconde série de copolymères Silicone/Polyhydroxyuréthane (Si/PHU) contenant 26 et 61%m de motif silicone a été obtenue sans isocyanate et sans catalyseur, à partir de poly(diméthylsiloxane) biscyclocarbonate et d’une triamine.Les propriétés mécaniques, thermiques et le caractère hydrophobe de tous ces matériaux ont été évalués. Dans le but d’améliorer les propriétés thermiques et de diminuer le coût de la résine d’encapsulation, des charges inorganiques ont été incorporées à certains polymères Si/PU.Les matériaux les plus intéressants ont été testés comme encapsulant dans des modules de puissance et les premières mesures électriques au cours de cyclages thermiques sont très prometteuses
Embedded electronics, particularly power modules, allows management of electric energy and therefore development of “carbon-free” vehicle. However, these electronic components, will shortly be located near heat engine automotive, and they must withstand various environments and sometimes, hard stresses (humidity, chemical aggression (oil), vibrations…). But actual encapsulation materials are not today efficient enough to match with these future imposed stresses. Thus, the aim of this work is to develop new encapsulation polymers. For this, two types of crosslinked Silicone/Polyurethane (Si/PU) copolymers were “solvent-free” synthesized and with short polymerization times.A first series of materials Si/PU containing between 55 and 76%wt silicone units were synthesized by alcool-iscyanate polyaddition from silicone precursor, synthesized or commercial, and a pluri-isocyanate, in the presence of catalyst. A second series of copolymers, Silicone/Polyhydroxyurethane (Si/PHU) containing 26 and 61%wt silicone units, was obtained without isocyanate or catalyst from poly(dimethylsiloxane) biscyclocarbonate and a triamine.Mechanical and thermal properties as well as hydrophobic character of all materials were evaluated. In order to improve thermal properties and decrease the cost of encapsulation resin, inorganic fillers were blended in some of Si/PU polymers.The most interesting materials were tested as encapsulant in power modules, and the first electrical measurements during thermal cyclings were very promising
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Rudy, Veronika. „Technologie zalévání LED pásků epoxidovými hmotami“. Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2021. http://www.nusl.cz/ntk/nusl-443229.

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The thesis deals with the pouring of epoxy materials over LED strips. The research part contains an introduction to photometry and summarizes the types of potting compounds along with their characteristics. The practical part delves into the effect different amount of pigment has on the photometric properties. This is assessed based on verified measurements performed with the help of a goniophotometer on samples with different amounts of pigment, which were created using an integration sphere. Furthermore, a brightness analysis and a long-term outdoor test were performed.
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Bücher zum Thema "Encapsulation for electronic"

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Ardebili, Haleh. Encapsulation technologies for electronic applications. Burlington, MA: William Andrew, 2009.

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Encapsulation of electronic devices and components. New York: M. Dekker, 1987.

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Encapsulation Technologies for Electronic Applications. Elsevier - Health Sciences Division, 2018.

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Encapsulation Technologies for Electronic Applications. Elsevier, 2019. http://dx.doi.org/10.1016/c2016-0-01829-6.

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Buchteile zum Thema "Encapsulation for electronic"

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Su, Wenming. „Encapsulation Technology for Organic Electronic Devices“. In Printed Electronics, 287–315. Singapore: John Wiley & Sons Singapore Pte. Ltd, 2016. http://dx.doi.org/10.1002/9781118920954.ch8.

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Jalar, Azman, Syed Mohamad Mardzukey Syed Mohamed Zain, Fakhrozi Che Ani, Mohamad Riduwan Ramli und Maria Abu Bakar. „Effect of Potting Encapsulation on Crack Formation and Propagation in Electronic Package“. In Advances in Robotics, Automation and Data Analytics, 351–57. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-70917-4_33.

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Pyun, Jeffrey, und Todd Emrick. „Polymer Encapsulation of Metallic and Semiconductor Nanoparticles: Multifunctional Materials with Novel Optical, Electronic and Magnetic Properties“. In Macromolecular Engineering, 2409–49. Weinheim, Germany: Wiley-VCH Verlag GmbH & Co. KGaA, 2011. http://dx.doi.org/10.1002/9783527631421.ch58.

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Hackett, Nigel. „Materials for Advanced Encapsulation“. In Plastics for Electronics, 171–99. Dordrecht: Springer Netherlands, 1999. http://dx.doi.org/10.1007/978-94-017-2700-6_6.

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Goosey, Martin T. „Plastic Encapsulation of Semiconductors by Transfer Moulding“. In Plastics for Electronics, 137–71. Dordrecht: Springer Netherlands, 1985. http://dx.doi.org/10.1007/978-94-009-4942-3_5.

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Câmara, João, und Helena Sarmento. „AutoCap: An Automatic Tool Encapsulator“. In Electronic Design Automation Frameworks, 35–44. Boston, MA: Springer US, 1995. http://dx.doi.org/10.1007/978-0-387-34880-3_4.

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Enzel, Patricia, und Thomas Bein. „Encapsulation of Conducting Polymers within Zeolites“. In Lower-Dimensional Systems and Molecular Electronics, 421–26. Boston, MA: Springer US, 1990. http://dx.doi.org/10.1007/978-1-4899-2088-1_49.

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Goosey, Martin, und Mike Plant. „Recent Developments in the Encapsulation of Semiconductors by Transfer Moulding“. In Plastics for Electronics, 131–69. Dordrecht: Springer Netherlands, 1999. http://dx.doi.org/10.1007/978-94-017-2700-6_5.

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Schmidt, Christian. „Direct Encapsulation of OLED on CMOS“. In Bio and Nano Packaging Techniques for Electron Devices, 581–99. Berlin, Heidelberg: Springer Berlin Heidelberg, 2012. http://dx.doi.org/10.1007/978-3-642-28522-6_29.

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Linz, Torsten, René Vieroth, Christian Dils, Mathias Koch, Tanja Braun, Karl Friedrich Becker, Christine Kallmayer und Soon Min Hong. „Embroidered Interconnections and Encapsulation for Electronics in Textiles for Wearable Electronics Applications“. In Smart Textiles, 85–94. Stafa: Trans Tech Publications Ltd., 2008. http://dx.doi.org/10.4028/3-908158-17-6.85.

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Konferenzberichte zum Thema "Encapsulation for electronic"

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Kaabeche, Nessima, P. J. Kelly und L. Harland. „Transparent High Barrier Coating for Electronic Encapsulation“. In Society of Vacuum Coaters Annual Technical Conference. Society of Vacuum Coaters, 2015. http://dx.doi.org/10.14332/svc15.proc.1959.

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Ding, Peng, Renhui Liu, Yu Chen, Guanqiang Song und Guanhua Li. „Study on encapsulation reliability“. In 2014 15th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2014. http://dx.doi.org/10.1109/icept.2014.6922768.

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Young, S. J., D. Janssen, E. A. Wenzel, B. M. Shadakofsky und F. A. Kulacki. „Electronics cooling with onboard conformal encapsulation“. In 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2016. http://dx.doi.org/10.1109/itherm.2016.7517557.

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Franck, Laurent, und Rosalba Suffritti. „Multiple Alert Message Encapsulation over Satellite“. In Electronic Systems Technology (Wireless VITAE). IEEE, 2009. http://dx.doi.org/10.1109/wirelessvitae.2009.5172503.

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5

Rayadhyaksha, Mangesh, und Gordon Sullivan. „The importance of adhesion for electronic module encapsulation“. In 2007 Electrical Insulation Conference and Electrical Manufacturing Expo (EIC/EME). IEEE, 2007. http://dx.doi.org/10.1109/eeic.2007.4562648.

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Park, Woo-Tae, Rob N. Candler, Huimou J. Li, Junghwa Cho, Holden Li, Thomas W. Kenny, Aaron Partridge, Gary Yama und Markus Lutz. „Wafer Scale Encapsulation of MEMS Devices“. In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35032.

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Annotation:
MEMS packaging has always been a field of great importance since it can dominate the cost and size of a final working device. Considering this, we have concentrated on developing a wafer-scale encapsulation scheme which uses a thick epi-poly (epitaxially deposited poly silicon) layer as the sealing layer. This approach allows the use of conventional post processing, such as dicing, wire bonding, and other standard handling and mounting techniques. We also can minimize the chip area used for packaging, in some cases reducing the chip size by ×5 from what was required for silicon fusion bonded covers. This packaging scheme can be used for various MEMS devices and can be integrated with other electronics. This paper will discuss the packaging process and show some preliminary results.
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Abbadi, Mohamed, Francesco Di Giacomo, Agostino Cortesi, Pieter Spronck, Costantini Giulia, Giuseppe Maggiore und Hogeschool Rotterdam. „High performance encapsulation in Casanova 2“. In 2015 7th Computer Science and Electronic Engineering (CEEC). IEEE, 2015. http://dx.doi.org/10.1109/ceec.2015.7332725.

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Lall, Pradeep, Padmanava Choudhury, Jinesh Narangaparambil und Scott Miller. „Flexible Encapsulation Process-Property Relationships for Flexible Hybrid Electronics“. In 2021 IEEE 71st Electronic Components and Technology Conference (ECTC). IEEE, 2021. http://dx.doi.org/10.1109/ectc32696.2021.00237.

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Boeser, Fabian, Juan S. Ordonez, Martin Schuettler, Thomas Stieglitz und Dennis T. T. Plachta. „Non-hermetic encapsulation for implantable electronic devices based on epoxy“. In 2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC). IEEE, 2015. http://dx.doi.org/10.1109/embc.2015.7318485.

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Braun, T., K. F. Becker, M. Koch, V. Bader, D. Manessis, A. Neumann, A. Ostmann, R. Aschenbrenner und H. Reichl. „Wafer level encapsulation for system in package generation“. In 26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials Production, 2003. IEEE, 2003. http://dx.doi.org/10.1109/isse.2003.1260582.

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Berichte der Organisationen zum Thema "Encapsulation for electronic"

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Rogers, John. Inorganic Substrates and Encapsulation Layers for Transient Electronics. Fort Belvoir, VA: Defense Technical Information Center, Juli 2014. http://dx.doi.org/10.21236/ada607424.

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