Thematische Bibliographien / Encapsulants

Inhaltsverzeichnis

  1. Zeitschriftenartikel
  2. Dissertationen
  3. Bücher
  4. Buchteile
  5. Konferenzberichte
  6. Berichte der Organisationen

Auswahl der wissenschaftlichen Literatur zum Thema „Encapsulants“

Autor: Grafiati
Veröffentlicht am 28. Juni 2021
Zuletzt aktualisiert am 6. Februar 2022

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Zeitschriftenartikel zum Thema "Encapsulants"

1

Liu, Mary, und Wusheng Yin. „A First Individual Solder Joint Encapsulant Adhesive“. International Symposium on Microelectronics 2010, Nr. 1 (01.01.2010): 000766–70. http://dx.doi.org/10.4071/isom-2010-wp6-posters-mliu.

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In order to meet the demand of fine pitch and 3D package, and eliminate complex underfilling process, a first solder joint encapsulant has been invented. Solder joint encapsulant adhesive is to encapsulate each individual solder joint using polymer to enhance solder joint, and leave empty space in-between solder joints to avoid thermal stress applied onto solder joints. Now two kinds of solder joint encapsulants are SMT256 and SMT266, which have been used in the customer field. Using solder joint encapsulants – SMT256 and SMT266, the pull strength of solder joint has been increased by about five times, resulting in significant increase in the reliability. In this paper more details have been investigated.
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2

Suhir, E., und J. M. Segelken. „Mechanical Behavior of Flip-Chip Encapsulants“. Journal of Electronic Packaging 112, Nr. 4 (01.12.1990): 327–32. http://dx.doi.org/10.1115/1.2904385.

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Requirements for the mechanical properties of the encapsulation material in a flip-chip design to prevent the solder and the encapsulation material itself from failure are presented on the basis of the developed analytical stress models, enabling one to predict the stresses caused by the expansion (contraction) mismatch of these materials. We evaluate and discuss the mechanical behavior of encapsulants for two encapsulation technologies: 1) encapsulant fills in the entire underchip space (silicone gels, epoxies); 2) encapsulant conformably coats the underchip surfaces (polyxylylene, polyimide). The calculations are carried out for an Advanced VLSI Package Design. The calculated data have indicated that low modulus silicone gel results in the lowest stresses. Polyxylylene should be considered as the second preference. Polyimide is also acceptable. Epoxies, however, could result in significant stresses in solder joints and therefore are less attractive. The final selection of the most feasible encapsulant should be done, of course, with consideration of all the electrical, chemical, and technological requirements.
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Winsley, R. J., N. R. Smart und C. Padovani. „Experimental study to evaluate the effect of polymeric encapsulants on the corrosion resistance of intermediate-level radioactive waste packages“. Mineralogical Magazine 76, Nr. 8 (Dezember 2012): 2957–67. http://dx.doi.org/10.1180/minmag.2012.076.8.11.

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AbstractIntermediate-level radioactive waste is normally encapsulated in cementitious grout. However, for some wastes, grout may not be suitable and polymeric encapsulants are being considered as an alternative. One concern with such encapsulants is their long-term chemical stability and the possibility that release of aggressive degradation products could cause corrosion.This paper evaluates the potential for three polymeric encapsulants: two epoxy resins (the APS polymer system, (APS) and Alchemix 4760 (ALC)) and a vinyl-ester styrene (VES); to cause internal corrosion of stainless steel waste containers. The corrosion behaviour of stainless steel 316L in contact with each encapsulant was studied in saturated Ca(OH)2 solutions and deionized (DI) water, at 80°C, under non-irradiated and γ-irradiated conditions.In aerated, alkaline conditions, 316L was resistant to corrosion in all the conditions tested. However, in DI water, the pH fell to values as low as three due to release of acidic species from the polymers. The two epoxy materials (particularly APS) also released significant levels of chloride; VES did not. Chloride release appeared to be increased by γ-irradiation. As a result of the low pH chloride-containing environment created by the APS encapsulant, 316L experienced localized corrosion, whereas coupons in Alchemix 4760 and VES did not. Weight loss measurements correlated with visual observations. γ-irradiation appeared to increase the degree of corrosion.
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Mead, Patricia F., Aravind Ramamoorthy, Shapna Pal, Z. Fathi und I. Ahmad. „Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications“. Journal of Electronic Packaging 125, Nr. 2 (01.06.2003): 302–7. http://dx.doi.org/10.1115/1.1571077.

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This paper discusses an innovative technique for rapid cure of polymeric encapsulants such as underfills used in direct chip attach devices using variable frequency microwaves (VFM). VFM processing reduces the cure time for underfill encapsulants to 10 min or less, as compared to 30 or more minutes when using convection oven methods. We report here the results of our investigations measuring key material attributes of VFM and conventionally cured underfill encapsulant samples, and we also have characterized voiding and delamination characteristics of flip-chip with underfill test structures. Finally, particle settling in the flip-chip with underfill test structures has been characterized. Our results show that the VFM technique produces underfill attributes that are comparable to conventionally cured samples.
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Pudziuvelyte, Lauryna, Mindaugas Marksa, Katarzyna Sosnowska, Katarzyna Winnicka, Ramune Morkuniene und Jurga Bernatoniene. „Freeze-Drying Technique for Microencapsulation of Elsholtzia ciliata Ethanolic Extract Using Different Coating Materials“. Molecules 25, Nr. 9 (09.05.2020): 2237. http://dx.doi.org/10.3390/molecules25092237.

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The present study reports on the encapsulation of Elsholtzia ciliata ethanolic extract by freeze-drying method using skim milk, sodium caseinate, gum Arabic, maltodextrin, beta-maltodextrin, and resistant-maltodextrin alone or in mixtures of two or four encapsulants. The encapsulation ability of the final mixtures was evaluated based on their microencapsulating efficiency (EE) of total phenolic compounds (TPC) and the physicochemical properties of freeze-dried powders. Results showed that the freeze-dried powders produced using two encapsulants have a lower moisture content, but higher solubility, Carr index, and Hausner ratio than freeze-dried powders produced using only one encapsulant in the formulation. The microencapsulating efficiency of TPC also varied depending on encapsulants used. The lowest EE% of TPC was determined with maltodextrin (21.17%), and the highest with sodium caseinate (83.02%). Scanning electron microscopy revealed that freeze-drying resulted in the formation of different size, irregular shape glassy particles. This study demonstrated good mucoadhesive properties of freeze-dried powders, which could be incorporated in buccal or oral delivery dosage forms. In conclusion, the microencapsulation of E. ciliata ethanolic extract by freeze-drying is an effective method to produce new value-added pharmaceutical or food formulations with polyphenols.
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Aditya, Samapta Manggala, Luh Putu Wrasiati und Sri Mulyani. „Karakteristrik Enkapsulat Pewarna dari Ekstrak Daun Pepaya (Carica papaya L.) pada Perlakuan Perbandingan Gelatin dan Maltodekstrin“. JURNAL REKAYASA DAN MANAJEMEN AGROINDUSTRI 9, Nr. 1 (26.03.2021): 42. http://dx.doi.org/10.24843/jrma.2021.v09.i01.p05.

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Papaya leaves can be used as a green dye because it contains chlorophyll. Chlorophyll compounds as a green coloring are obtained by extraction and stored in the form of encapsulation powder. This study has two purposes, (i) to know the effect of the gelatin and maltodextrin encapsulants ratio on the encapsulates characteristics of papaya leaf coloring extract, and (ii) to determine the encapsulates comparison treatment of the best gelatin and maltodextrin in producing the characteristic encapsulate extract of papaya leaf coloring. Experiments in this study were using a randomized block design with one treatment, namely the ratio of gelatin and maltodextrin consisting of 7 levels, namely, (1:0), (0:1) (1:1), (1:1.5), (1:2), (1:2.5), (1:3). The results showed that the ratio of gelatin-maltodextrin was highly significant (P<0.05) on yield, total chlorophyll content, solubility, brightness level, redness level (a*), yellowish level (b*) and no effect (P>0.05) on water content. The treatment of gelatin and maltodextrin (1:3) ratio was the best treatment to produce encapsulate sea lettuce extract with yield of 35.27 %, water content of 6.13%, total chlorophyll content of 1192.69 ppm, solubility of 79.12%, brightness level (L*) 39.39, redness level (a*) 16.95 and yellowish level (b*) 14.84. Keywords : papaya leaf extract, gelatin, maltodextrin, encapsulation
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M., J. M. „Globules rouges encapsulants contre cancers“. Revue Francophone des Laboratoires 2013, Nr. 455 (September 2013): 20. http://dx.doi.org/10.1016/s1773-035x(13)72169-5.

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BENG, GOH TEIK. „UV-curable Encapsulants for LED“. Oriental Journal Of Chemistry 28, Nr. 3 (18.09.2012): 1135–40. http://dx.doi.org/10.13005/ojc/280307.

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Rice, Matthew. „Plasticizer loading in acoustic encapsulants“. Journal of Thermal Analysis and Calorimetry 117, Nr. 2 (27.04.2014): 661–64. http://dx.doi.org/10.1007/s10973-014-3781-8.

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Baikerikar, K. K., und A. B. Scranton. „Photopolymerizable liquid encapsulants for microelectronic devices“. Polymer 42, Nr. 2 (Januar 2001): 431–41. http://dx.doi.org/10.1016/s0032-3861(00)00388-8.

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Dissertationen zum Thema "Encapsulants"

1

Burrows, Susan Elizabeth. „Silicone encapsulants for microelectronic devices“. Thesis, University of Warwick, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.319702.

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Gibbons, Gregory John. „Polyorganosiloxanes as electronic device encapsulants“. Thesis, University of Warwick, 1996. http://wrap.warwick.ac.uk/80316/.

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Heat curable polysiloxane inorganic - organic hybrid materials, prepared from the hydrolysis and condensation of chloro - or alkoxysilanes, have been investigated as possible electric device encapsulants. Preparation - structure - property relationships have been determined for a simple difunctional system prepared by the direct hydrolysis of chlorosilanes. The system cyclisation was found to be highly dependent upon the system concentration, and most sensitive at low dilution. Due to the dilution associated with the addition of an aqueous base, even a solventless preparation was found to result in a large cyclic content, a result independent of the organic nature of the precursor employed. The copolymerisation of inorganic monofunctional end - blocking units with difunctional species was found to be beneficial in reducing the level of cyclisation within the system. However, high levels of end blocker with unreactive organic functionalities are to be avoided as the resulting high levels of oligomeric species are deleterious to the material's thermal and dielectric properties. The introduction of thermally reactive organics at much higher levels are possible without property degradation although high levels of reactive groups such as vinyl (-CHCH2) or allyl (CH2CH=CH2) are deleterious to the hermetic properties of the material. Introduction of tri - and tetrafunctional inorganic units into the difunctional systems, to prepare inorganically cross - linked materials, was easily achievable by the cohydrolysis of the precursors. The inorganic cross - linking afforded control over the system viscosity which was found to be particularly sensitive to the distribution of the di - and trifunctional species throughout the network, which in turn was a function of both the preparation pH and temperature. Useable materials were obtained for T group levels of less than 20%. Levels up to 50% were possible for more homogeneous T group distributions. Interpenetrating networks employing short and long chain components were successfully prepared. Their mechanical properties were assessed and correlated to their composition and structure. The role of the inorganic cross - links was found to be a larger determinant of the mechanical properties than the inorganic network. Extreme values of Young's moduli of 288kPa and 16.6 MPa were obtained for low and high vinyl containing materials respectively. Their dielectric properties were comparable to conventional encapsulation materials, with E' and tanS being in the range 3.36±O.06 to 3.9±O.1 and O.OOl±O.OO5 to 0.0370±O.OOO2 respectively. A number of IPN materials exposed to environmental testing (85°C I 85% RH), all afforded protection over the entire l000hrs test period, with no failure resulting from sample limitations.
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Abid, Adil R. „Thin film encapsulants for gallium arsenide“. Thesis, University of Surrey, 1987. http://epubs.surrey.ac.uk/847124/.

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The problems associated with the use of ion implantation during the preparation of compound semiconductors have been examined. In particular, the use of an encapsulant as protection during annealing was considered and the properties and ease of preparation of the ideal encapsulant were studied. Among the experimental techniques used to study the surface of thin film coatings on the semiconductors materials, reflection high energy electron diffraction (RHEED) was extremely useful in allowing the study of thin layers. Other techniques used in the work included scanning electron microscopy (SEM), Rutherford backscattering (RBS), rapid thermal annealing using a graphite strip heater and thin film deposition by evaporation and sputtering. Among the encapsulants studied were aluminium nitride and the zirconium nitride the former being the most important. A study was also made of the chemical reactivity of aluminium nitride to oxidation and hydration. It was found that AlN was resistant to oxidation in air up to about 1000°C and in an inert atmosphere up to at least 1400°C. It was shown that aluminium nitride reacts readily with water to form AlOOH. The reproducibility of a good quality evaporated AlN film as an encapusulant was found to be difficult to control, but a combination of AlN and Si[3]N[4] in a "sandwich" proved to be more successful. Zirconium nitride was found to be useful as a passivation layer up to 700°C. Sputtered AlN coatings seemed to offer the best hope of success but further work is needed to improve the sputtering techniques so that free Al, or Al[2]O[3] is not present in the AlN layers.
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Barr, Logan. „Radiation resistance of novel polymeric encapsulants“. Thesis, University of Manchester, 2015. https://www.research.manchester.ac.uk/portal/en/theses/radiation-resistance-of-novel-polymeric-encapsulants(4a16b78f-f810-407d-815f-db63027aa014).html.

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The generation of nuclear energy leads to the generation of contaminated, radioactive wastes. The current strategy in the UK is to dispose of high and intermediate level wastes to a geological disposal facility with no possibility for retrieval. The waste is contained in an encapsulation matrix, which is usually cement, however cement is unsuitable for certain waste types, for which epoxy resins have been proposed as an alternative. The radiation resistance of two candidate epoxy/amine resin formulations under repository conditions were tested with regards to the degradation of the backbone structure and the release of potential organic ligands from the polymer. The difference in the polymers was the choice of amine curing agent. Analysis of the polymer by infra-red spectroscopy and nuclear magnetic resonance spectroscopy revealed that the carbon nitrogen bonds are the most susceptible to radiation damage, regardless of the atmospheric and aqueous environment. The presence of an aqueous phase greatly reduces the availability of oxygen and reduces the rate of degradation when irradiated under an atmosphere of air. The properties of the aqueous phase has little effect on the degradation of the polymer. Thermal analysis revealed that the effects of the environment are limited to a thin surface layer of the polymer. Leachate analysis revealed that both organic and nitrogen containing compounds are leached from the polymer when irradiated in pure water. Under repository conditions however very little carbon and nitrogen is observed, suggesting that the calcium hydroxide present in repositories is capable of removing the leached species from solution. The generation of nitrate ions from air radiolysis over water is suppressed in the presence of the polymers, suggesting that nitrate is removed from solution by leached species or reaction with the polymer.
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Bollampally, Raja Sheker. „Enhanced thermal conductivity of liquid encapsulants for electronic packaging“. Thesis, Georgia Institute of Technology, 1998. http://hdl.handle.net/1853/19974.

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Yao, Yiying. „Thermal Stability of Al₂O₃/Silicone Composites as High-Temperature Encapsulants“. Diss., Virginia Tech, 2014. http://hdl.handle.net/10919/50593.

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Conventional microelectronic and power electronic packages based on Si devices usually work below 150°C. The emergence of wide-bandgap devices, which potentially operate above a junction temperature of 250°C, results in growing research interest in high-density and high-temperature packaging. There are high-temperature materials such as encapsulants on the market that are claimed for capability of continuous operation at or above 250°C. With an objective of identifying encapsulants suitable for packaging wide-bandgap devices, some of commercial high-temperature encapsulants were obtained and evaluated at the beginning of this study. The evaluation revealed that silicone elastomers are processable for various types of package structure and exhibit excellent dielectric performance in a wide temperature range (25 - 250°C) but are insufficiently stable against long-term aging (used by some manufacturers, e.g., P²SI, to evaluate polymer stability) at 250°C. These materials cracked during aging, causing their dielectric strength to decrease quickly (as soon as 3 days) and significantly (60 - 70%) to approximately 5 kV/mm, which is below the value required by semiconductor packaging. The results of this evaluation clearly suggested that silicone needs higher thermal stability to reliably encapsulate wide-bandgap devices. Literature survey then investigated possible methods to improve silicone stability. Adding fillers is reported to be effective possibly due to the interaction between filler surface and polymer chains. However, the interaction mechanism is not clearly documented. In this study, the effect of Al₂O₃ filler on thermal stability was first investigated by comparing the performance of unfilled and Al₂O₃-filled silicones in weight-loss measurements and dielectric characterization. All test results on composites filed with Al₂O₃ micro-rods indicated that thermal stability increased with increasing filler loading. Thermogravimetric analysis (TGA) test demonstrated that the temperature of degradation onset increased from 330 to 379°C with a 30 wt% loading of Al₂O₃ rods. In isothermal soak test, unfilled and 30-wt%-filled silicones lost 10% of polymer weight in 700 and 1800 hours, respectively. The dielectric characterization found that both Weibull parameters, characteristic dielectric strength (E₀, representing the electric field at which 62.3% of samples are electrically broken down) and shape parameter (β, representing the spread of data. The larger the β, the narrower the distribution) can reflect the thermal stability of polymers. Both of them were influenced by microstructure evolution, to which β was found to be more sensitive than E₀. The characteristic dielectric strength of unfilled silicone decreased significantly after 240 hours of aging at 250°C, whereas that of Al₂O₃/silicone composites exhibited no significant change within 560 hours. The shape parameter of Al₂O₃-filled silicone decreased slower than that of unfilled silicone, also indicating the positive effect of Al₂O₃ micro-rods on thermal stability. Improved thermal stability can be explained by restrained chain mobility caused by interfacial hydrogen bonds, which are formed between hydroxyl groups on Al₂O₃ surface and silicone backbone. In this study, the effect of hydrogen bonds was investigated by dehydrating Al₂O₃ micro-rods at high temperature in N₂ to partially destroy the bonds. Removal of hydrogen bonds impaired thermal stability by increasing the initial weight-loss rate from 0.025 to 0.036 wt%/hour. The results explained the importance of interfacial hydrogen bond, which effectively reduced the average chain mobility, hindered the formation of degradation products, and led to higher thermal stability. The main discoveries of this study are listed below: 1. Al₂O₃ micro-rods were found to efficiently improve the thermal stability of silicone elastomer used for high-temperature encapsulation. 2. Characteristic dielectric strength and shape parameter obtained from Weibull distribution reflected the change of material microstructure caused by thermal aging. The shape parameter was found to be more sensitive to microscale defects, which were responsible for dielectric breakdown at low electric field. 3. Hydrogen bonds existing at filler/matrix interface were proven to be responsible for the improvement of thermal stability because they effectively restrained the average chain mobility of the silicone matrix.
Ph. D.
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Covill, Adrian. „Novel encapsulants for intermediate level waste in the UK nuclear industry“. Thesis, University of Sheffield, 2010. http://etheses.whiterose.ac.uk/1224/.

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Vincent, Michael Brien. „Enhancement of flow time and adhesion of high-performance underfill encapsulants for flip-chip applications“. Thesis, Georgia Institute of Technology, 1998. http://hdl.handle.net/1853/19966.

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NICOLAUD, ANNE-MARIE. „Contribution a l'etude de la peritonite encapsulante : illustree par une observation“. Lyon 1, 1988. http://www.theses.fr/1988LYO1M221.

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MARION, COFFY PASCALE. „La peritonite encapsulante : a propos d'une observation“. Saint-Etienne, 1988. http://www.theses.fr/1988STET6038.

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Bücher zum Thema "Encapsulants"

1

Gibbons, Gregory John. Polyorganosiloxanes as electronic device encapsulants. [s.l.]: typescript, 1996.

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2

Burrows, Susan Elizabeth. Silicone encapsulants for microelectronic devices. [s.l.]: typescript, 1995.

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3

Adhesives, Sealants and Encapsulants Conference (1985 Kensington Exhibition Centre). ASE 85: Adhesive, Sealants and Encapsulants Conference : conference proceedings : Kensington Exhibition Centre, London, U.K., 5-7 November 1985. Buckingham: Network Events, 1985.

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Adhesives, Sealants and Encapsulants Conference. (3rd 1988 Metropole Exhibition Centre.). ASE 88: The Third Adhesives, Surface Coatings & Encapsulants Exhibition & Conference : Conference proceedings : Metropole Exhibition Centre, Brighton, UK, 4,5,6, October 1988. Buckingham: Network Exhibitions & Conferences, 1988.

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Entine, Gerald. Soft x-ray window encapsulant for HgI detectors.: Final report. Watertown, MA: Radiation Monitoring Devices, Inc., 1987.

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Entine, Gerald. Soft x-ray window encapsulant for HgI detectors.: Final report. Watertown, MA: Radiation Monitoring Devices, Inc., 1987.

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Entine, G. Soft x-ray window encapsulant for HgI ́detectors.: Final report. Watertown, MA: Radiation Monitoring Devices, Inc., 1987.

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Davidson, Robert J. The use of high PFA content grouts to encapsulate intermediate level radwaste. Southall: Taywood Engineering, 1988.

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Agro, S. C. Development of new low-cost, high-performance, PV module encapsulant/packaging materials: Annual technical report, phase 1, 22 October 2002-30 September 2003. Golden, Colo: National Renewable Energy Laboratory, 2004.

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Agro, S. C. Development of new low-cost, high-performance, PV module encapsulant/packaging materials: Annual technical report, phase 1, 22 October 2002-30 September 2003. Golden, Colo: National Renewable Energy Laboratory, 2004.

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Buchteile zum Thema "Encapsulants"

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Costa, John V., Thomas Ramotowski, Steven Warner und Vijaya B. Chalivendra. „High Thermal Conductivity Polyurethane-Boron Nitride Nanocomposite Encapsulants“. In MEMS and Nanotechnology, Volume 2, 237–42. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-8825-6_34.

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Baikerikar, Kiran K., Vishal Sipani, Chris N. Coretsopoulos und Alec B. Scranton. „Photopolymerization of Silica-Filled Composites: Encapsulants for Microelectronic Devices“. In ACS Symposium Series, 389–99. Washington, DC: American Chemical Society, 2003. http://dx.doi.org/10.1021/bk-2003-0847.ch033.

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Pearce, K. L., E. M. Walker, J. Luo und R. A. Schultz. „Harsh Fluid Resistant Silicone Encapsulants for the Automotive Industry“. In Advanced Microsystems for Automotive Applications Yearbook 2002, 297–305. Berlin, Heidelberg: Springer Berlin Heidelberg, 2002. http://dx.doi.org/10.1007/978-3-642-18213-6_35.

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Fritz, D. B., und C. S. Wang. „Performance of Stable Brominated Epoxies in Encapsulants for Microelectronic Devices“. In ACS Symposium Series, 405–13. Washington, DC: American Chemical Society, 1989. http://dx.doi.org/10.1021/bk-1989-0407.ch033.

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Davis, J. H. „Silicone Protective Encapsulants and Coatings for Electronic Components and Circuits“. In Plastics for Electronics, 67–97. Dordrecht: Springer Netherlands, 1985. http://dx.doi.org/10.1007/978-94-009-4942-3_3.

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Goosey, M. T. „Permeability of Coatings and Encapsulants for Electronic and Optoelectronic Devices“. In Polymer Permeability, 309–39. Dordrecht: Springer Netherlands, 1985. http://dx.doi.org/10.1007/978-94-009-4858-7_8.

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Kempe, Michael. „Encapsulant Materials for PV Modules“. In Photovoltaic Solar Energy, 478–90. Chichester, UK: John Wiley & Sons, Ltd, 2017. http://dx.doi.org/10.1002/9781118927496.ch43.

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Zhang, Zhibing, Daniel Law und Guoping Lian. „Characterization Methods of Encapsulates“. In Encapsulation Technologies for Active Food Ingredients and Food Processing, 101–25. New York, NY: Springer New York, 2009. http://dx.doi.org/10.1007/978-1-4419-1008-0_4.

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Pike, Scott M., Srikanth Sastry und Jennifer L. Welch. „Failure Detectors Encapsulate Fairness“. In Lecture Notes in Computer Science, 173–88. Berlin, Heidelberg: Springer Berlin Heidelberg, 2010. http://dx.doi.org/10.1007/978-3-642-17653-1_15.

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Pike, Scott M., Srikanth Sastry und Jennifer L. Welch. „Brief Announcement: Failure Detectors Encapsulate Fairness“. In Lecture Notes in Computer Science, 389–91. Berlin, Heidelberg: Springer Berlin Heidelberg, 2010. http://dx.doi.org/10.1007/978-3-642-15763-9_35.

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Konferenzberichte zum Thema "Encapsulants"

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Wohlgemuth, John H., Michael D. Kempe und David C. Miller. „Discoloration of PV encapsulants“. In 2013 IEEE 39th Photovoltaic Specialists Conference (PVSC). IEEE, 2013. http://dx.doi.org/10.1109/pvsc.2013.6745147.

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2

Islam, M. Saiful, Jeffrey C. Suhling und Pradeep Lall. „Measurement of the Constitutive Behavior of Underfill Encapsulants“. In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35321.

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Reliable, consistent, and comprehensive material property data are needed for microelectronic encapsulants for the purpose of mechanical design, reliability assessment, and process optimization of electronic packages. In our research efforts, the mechanical responses of several different capillary flow snap cure underfill encapsulants are being characterized. A microscale tension-torsion testing machine has been used to evaluate the uniaxial tensile stress-strain behavior of underfill materials as a function of temperature, strain rate, specimen dimensions, humidity, thermal cycling exposure, etc. A critical step to achieving accurate experimental results has been the development of a sample preparation procedure that produces mechanical test specimens that reflect the properties of true underfill encapsulant layers. In the developed method, 75–125 μm (3–5 mil) thick underfill uniaxial tension specimens are dispensed and cured using production equipment and the same processing conditions as those used with actual flip chip assemblies. Although several underfills have been examined, this work features results for the mechanical response of a single typical capillary flow snap cure underfill. A three parameter hyperbolic tangent empirical model has been shown to provide accurate fits to the observed underfill nonlinear stress-strain behavior over a range of temperatures and strain rates. In addition, typical creep data are presented.
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Chhanda, Nusrat J., Jeffrey C. Suhling und Pradeep Lall. „Effects of Moisture Exposure on the Mechanical Behavior of Polymer Encapsulants in Microelectronic Packaging“. In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/ipack2013-73242.

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Polymer encapsulants exhibit evolving properties that change significantly with environmental exposures such as moisture uptake, isothermal aging and thermal cycling. In this study, the effects of moisture adsorption on the stress-strain behavior of a polymer encapsulant were evaluated experimentally. The uniaxial test specimens were exposed in an adjustable thermal and humidity chamber to combined hygrothermal exposures at 85 °C/85% RH for various durations. After moisture preconditioning, a microscale tension-torsion testing machine was used to evaluate the complete stress-strain behavior of the material at several temperatures. It was found that moisture exposure caused plasticization and strongly reduced the mechanical properties of the encapsulant including the initial elastic modulus and ultimate tensile stress. Reversibility tests were also conducted to evaluate whether the degradations in the mechanical properties were recoverable. Upon fully redrying, the polymer was found to recover most but not all of its original mechanical properties. As revealed by FTIR, some of the adsorbed water had been hydrolyzed in the organic structure of the epoxy-based adhesive, causing permanent changes to the mechanical behavior.
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Chih-Hau Lin, Hsun-Tien Li, Shu-Chen Huang, Chia-Wen Hsu, Kai-Chi Chen und Wen-Bin Chen. „Development of UV stable LED encapsulants“. In 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2009. http://dx.doi.org/10.1109/impact.2009.5382245.

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5

Rector, L., und D. Starkey. „Performance of epoxy encapsulants for optoelectronic packaging“. In 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. IEEE, 2004. http://dx.doi.org/10.1109/polytr.2004.1402763.

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6

Cai, Can, David C. Miller, Ian A. Tappan und Reinhold H. Dauskardt. „Degradation of silicone encapsulants in CPV optics“. In 2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC). IEEE, 2016. http://dx.doi.org/10.1109/pvsc.2016.7749577.

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7

Swonke, Thomas, und Richard Auer. „Impact of moisture on PV module encapsulants“. In SPIE Solar Energy + Technology, herausgegeben von Neelkanth G. Dhere, John H. Wohlgemuth und Dan T. Ton. SPIE, 2009. http://dx.doi.org/10.1117/12.825943.

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8

Edwards, Maury, und Yan Zhou. „Comparative properties of optically clear epoxy encapsulants“. In International Symposium on Optical Science and Technology, herausgegeben von Frank Wyrowski. SPIE, 2001. http://dx.doi.org/10.1117/12.451299.

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9

Chao, Jay, Rong Zhang, David Grimes, Kail Shim, Tu Do, Yijia Ma und Ramachandran K. Trichur. „Low -Warpage Encapsulants for Wafer Level Packaging“. In 2020 International Wafer Level Packaging Conference (IWLPC). IEEE, 2020. http://dx.doi.org/10.23919/iwlpc52010.2020.9375882.

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10

Braun, T., F. Hausel, J. Bauer, O. Wittler, R. Mrossko, M. Bouazza, K. F. Becker et al. „Nano-particle enhanced encapsulants for improved humidity resistance“. In 2008 58th Electronic Components and Technology Conference (ECTC 2008). IEEE, 2008. http://dx.doi.org/10.1109/ectc.2008.4549970.

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Berichte der Organisationen zum Thema "Encapsulants"

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Adolf, D., R. Strommen und H. Johnson. Viscosities of epoxy encapsulants. Office of Scientific and Technical Information (OSTI), November 1997. http://dx.doi.org/10.2172/560777.

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2

Adolf, D., C. Childress und D. Hannum. Bulk and shear moduli of epoxy encapsulants. Office of Scientific and Technical Information (OSTI), August 1989. http://dx.doi.org/10.2172/5524601.

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3

Linda Domeier und Marion Hunter. Epoxy Foam Encapsulants: Processing and Dielectric Characterization. Office of Scientific and Technical Information (OSTI), Januar 1999. http://dx.doi.org/10.2172/5988.

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4

Aubert, James Henry, Patricia Sue Sawyer und Sarah Kathryn Leming. Component compatibility of a removal process for removable encapsulants. Office of Scientific and Technical Information (OSTI), Dezember 2005. http://dx.doi.org/10.2172/883138.

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5

Race, Timothy D., und Ashok Kumar. Technology Assessment of Liquid Encapsulants for Lead-Based Paint Abatement. Fort Belvoir, VA: Defense Technical Information Center, Dezember 2003. http://dx.doi.org/10.21236/ada429604.

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6

Russick, Edward Mark. Electrical properties of REF308, REF320, EF-AR20, and RSF200 foam encapsulants. Office of Scientific and Technical Information (OSTI), Januar 2006. http://dx.doi.org/10.2172/883468.

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7

Kempe, M. D., M. Kilkenny, T. J. Moricone und J. Z. Zhang. High-Flux Stress Testing of Encapsulants for Medium-Concentration CPV Applications. Office of Scientific and Technical Information (OSTI), September 2009. http://dx.doi.org/10.2172/965121.

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8

Whinnery, Jr., LeRoy, April Nissen, Rachel Barth und Vipul Mystry. Arathane 5753 HVB: An Alternative to EN-7/EN-8 Encapsulants. Office of Scientific and Technical Information (OSTI), November 2020. http://dx.doi.org/10.2172/1718975.

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9

Galica, J. P. Development of flame retardant PV module encapsulants: Volume 1. Final report. Office of Scientific and Technical Information (OSTI), Juni 1998. http://dx.doi.org/10.2172/676950.

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10

Holley, W., S. Agro, J. Galica, L. Thoma, R. White und R. Yorgensen. Advanced development of PV encapsulants. Annual subcontract report, 30 December 1992--31 March 1994. Office of Scientific and Technical Information (OSTI), November 1994. http://dx.doi.org/10.2172/10194092.

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